Automatic chip testing device

Abstract

The invention relates to the field of chip testing, in particular to an automatic chip testing device. The testing device comprises a testing seat for fixing a chip to be tested, and a bearing device for supporting and accommodating each functional module, the bearing device comprises a height-adjustable Foma wheel, a balancing weight capable of adjusting gravity center distribution, an electric execution device for providing pressure and displacement, an electric tray device for moving and bearing a chip, a detection circuit device for detecting the electrical performance of the chip, a control system, a laser position detection module, a pressure sensor and the like. The testing seat has a specific structure, each device also has a specific composition, and the testing seat is also provided with a grating protection module, a three-color warning lamp, a two-stage cooling framework and the like. The chip performance evaluation device achieves the technical effects that the pressure and the position in the chip testing process are accurately controlled, the testing stability and accuracy are guaranteed, good cooling and safety protection functions are achieved, and a chip performance evaluation report can be generated.

Description

Technical Field

[0001] The present application relates to the field of chip testing, and in particular to an automatic chip testing device. Background Art

[0002] With the rapid advancement of technology, chips are becoming increasingly important in electronic devices. As core components of electronic devices, their performance stability and lifespan directly impact the performance and service life of the entire device. Chip performance determines key indicators such as the operating speed and processing power of electronic devices, and is crucial for ensuring stable operation and extending the lifespan of the equipment. Chip application scenarios are constantly expanding, from consumer electronics to industrial control, aerospace, and other fields, all placing higher demands on chip performance. In this context, comprehensive and accurate chip performance testing has become essential to ensuring chip quality and promoting industrial development. Chip testing technology has also received widespread attention and continued development.

[0003] Before the emergence of this technical solution, the chip testing field usually adopted a variety of methods to conduct chip testing. Some testing methods will use relatively simple test fixtures to fix the chip to be tested, and apply a certain amount of pressure and displacement through manual operation or simple electric devices to perform basic electrical performance testing. Others use traditional mechanical structures to support test equipment and use ordinary sensors to obtain some parameter information of the chip. In addition, in the previous testing process, manual experience was mostly relied upon to adjust the status of the test equipment and determine the test process, and the collaborative work between various functional modules lacked systematicity and automation. These conventional methods mainly rely on relatively scattered independent equipment to complete different test links. The overall equipment structure is relatively loose and requires more manual intervention and operation.

[0004] However, existing chip testing equipment has significant drawbacks. They suffer from low test accuracy, low test efficiency, and complex equipment structures, making them difficult to meet the high standards required for chip testing. For example, insufficient test accuracy can lead to misjudgments of chip performance, impacting product quality; low test efficiency makes it unsuitable for large-scale production, increasing production costs; and complex equipment structures increase maintenance difficulties and manufacturing costs. Summary of the Invention

[0005] The purpose of this application is to overcome the above technical problems and provide an automatic chip testing device. An automatic chip testing device, comprising: Test socket, used to fix the chip to be tested; A carrying device is used to support and accommodate each functional module. The test socket is arranged in the carrying device. The carrying device includes: The Forma wheel is provided at the bottom of the test seat and is connected to the test base by a screw. Rotating the screw can adjust the height of the Forma wheel and change the position of the equipment support point; The counterweight block is connected to a counterweight fixing angle piece. The counterweight block is detachably connected to the bottom of the test seat through the counterweight fixing angle piece. The center of gravity distribution can be adjusted by increasing or decreasing the number and position of the counterweight blocks; An electric actuator, disposed on the bottom surface of the test seat, for providing the pressure and displacement required for the test; An electric tray device is provided on the bottom surface of the test seat and is used to move and carry the chip; a detection circuit device is provided above the electric tray device and is used to detect the electrical properties of the chip; a control system is connected to the electric actuator, the electric tray device and the detection circuit device at the same time; A laser position detection module is provided on the side and top of the test seat, and is used to detect the position and posture of the chip in real time. The laser position detection module is connected to the control system, and the control system adjusts the position of the electric tray according to the feedback of the laser position detection module; A pressure sensor is provided in the electric actuator to monitor the contact pressure during chip testing. The pressure sensor is connected to a control system, which dynamically adjusts the pressure parameters of the electric actuator based on feedback from the pressure sensor to control the pressure fluctuation range within ±0.5N.

[0006] By adopting the above technical solutions, the test seat can fix the chip to be tested, and the carrying device can support and accommodate various functional modules; the Formosa wheel can adjust the height and change the position of the equipment support point; the counterweight block can adjust the center of gravity distribution by increasing or decreasing the number and position; the electric actuator can provide the pressure and displacement required for the test; the electric tray device can move and carry the chip; the detection circuit device can detect the electrical properties of the chip; the control system can coordinate the operation of the electric actuator, electric tray device and detection circuit device; the laser position detection module can detect the chip position and posture in real time, so that the control system can adjust the position of the electric tray; the pressure sensor can monitor the contact pressure, so that the control system can dynamically adjust the pressure parameters of the electric actuator and control the pressure fluctuation range within ±0.5N, thereby improving the test accuracy and efficiency and simplifying the equipment structure.

[0007] Optionally, the test socket includes: The bottom plate is provided with a slide rail and a motor fixing seat; There are two side panels, one is a left panel and the other is a right panel, each side panel is connected to a positioning pin, each side panel can be connected to the bottom panel and the top panel through the positioning pin, and the diameter tolerance of each positioning pin is set to be no more than 0.01 mm; There are two motors, which are respectively arranged at the top and the bottom. The two motors are respectively fixed to the top plate and the motor fixing seat by screws. The output shafts of the two motors are connected to the lead screw, and the two motors jointly drive the lead screw to achieve precise movement of the Z axis and the X axis.

[0008] By adopting the above technical solution, the slide rails and motor fixing seat in the test seat provide an installation basis for subsequent components. The positioning pin diameter tolerance is set to no more than 0.01mm to ensure the assembly accuracy of the test seat. The two motors jointly drive the lead screw to achieve precise movement of the Z axis and X axis, thereby improving the overall test accuracy of the chip test structure, fixing the chip to be tested more accurately and stably, improving test accuracy and efficiency, and meeting the high standards of chip testing.

[0009] Optionally, the electric pallet device includes: The sliding base plate has a fixed slider and a nut fixing plate detachably connected to the bottom; the nut is detachably connected to the nut fixing plate, and the sliding base plate can move in a straight line through the cooperation of the screw rod; the fixed slider and the slide rail form a sliding pair, and the surface roughness of the slide rail is Ra ≤ 0.8μm. By adopting the above technical solution, the sliding base plate of the electric tray device can move in a straight line through the cooperation of the screw rod and the nut, which is convenient for moving and carrying chips; the fixed slider and the slide rail with a roughness of Ra ≤ 0.8μm form a sliding pair, which ensures the smoothness and accuracy of sliding, which is conducive to improving the accuracy of the chip position during chip testing, thereby improving the test accuracy and efficiency. Optionally, the electric actuator includes: The upper plate of the cold plate is connected with a positioning sleeve and a limit pin, the limit pin is connected to the nut fixing plate, and the limit pin passes through the upper plate of the cold plate; The cold plate is detachably connected to a cold plate connecting shaft, wherein the cold plate is connected to a cooling device via the cold plate connecting shaft, wherein a pipeline of the cooling device is in communication with the cold plate, and a coolant circulation pipeline is formed between the cooling device and the cold plate; A pressure sensor is provided between the upper plate of the cold plate and the nut fixing plate, and the pressure test range of the pressure sensor is set to 0-50N; A spring column is provided on the top of the upper plate of the cold plate, and the spring column can apply a force to the upper plate of the cold plate in a direction perpendicular to the surface of the chip to be tested; The guide post is slidably arranged on the upper surface of the cold plate. The guide post is used to limit the movement direction of the upper surface of the cold plate. The guide post makes the movement direction of the upper surface of the cold plate perpendicular to the surface of the chip to be tested.

[0010] By adopting the above technical solution, the positioning sleeve and limit pin can ensure the accurate relative position between the upper plate of the cold plate and the nut fixing plate; the coolant circulation pipeline can effectively cool the cold plate to prevent the chip from overheating and affecting the test results; the pressure sensor can accurately monitor the contact pressure during the chip test process, setting the pressure test range to 0-50N, so that the control system can dynamically adjust the pressure parameters of the electric actuator according to its feedback; the spring column applies a force perpendicular to the surface of the chip to be tested to ensure uniform force during chip testing; the guide column limits the movement direction of the upper plate of the cold plate, so that it moves in a direction perpendicular to the surface of the chip to be tested, ensuring accurate and stable test operations, and overall helping to improve the accuracy and reliability of chip testing.

[0011] Optionally, also include, A grating protection module is arranged at the front entrance of the carrying device, and the grating protection module is connected to the control system for detecting the intrusion of personnel and foreign objects; a three-color warning light is arranged on the top of the carrying device, and the three-color warning light is connected to the control system. When the equipment is operating normally, the control system controls the green light of the three-color warning light to light up. After the grating protection module detects foreign objects or human bodies, it sends an electrical signal to control the control system to light up the yellow light of the three-color warning light. When an error occurs during equipment operation, the control system controls the red light of the three-color warning light to light up and the equipment is shut down urgently.

[0012] By adopting the above technical solution, a grating protection module is set up to detect the intrusion of people and foreign objects, preventing external factors from interfering with the test or causing damage to the equipment; a three-color warning light is set up to intuitively display the operating status of the equipment. When a foreign object or human body is detected, the yellow light will light up as a reminder. When an error occurs in the equipment, the red light will light up and the equipment will be shut down immediately to ensure the safety of the equipment and operators.

[0013] Optionally, the cooling device is disposed outside the carrying device and adopts a two-stage cooling architecture, including: The primary cooling structure includes a cooling main unit, a main cooling circulation pipeline, and a cooling actuator. The cooling main unit is connected to the cold plate via a refrigerant pipeline to form a closed loop. The main cooling circulation pipeline is a metal bellows. A flow sensor and a pressure switch are provided in the main cooling circulation pipeline. Both the flow sensor and the pressure switch are connected to the control system to ensure the cooling efficiency of the primary cooling structure. The cooling actuator is integrated into the cold plate and adopts a microchannel fin structure. The secondary cooling structure includes a microchannel cooling plate, a secondary heat exchange module and a local flow guide module. The microchannel cooling plate is arranged at the bottom of the detection circuit device and the chip to be tested; the secondary heat exchange module is arranged between the primary cooling structure and the microchannel cooling plate, adopts a plate heat exchanger structure, and indirectly exchanges heat through a refrigerant; the local flow guide module is arranged around the chip to be tested, and includes spoiler fins and airflow guide grooves arranged around the chip to be tested to form an auxiliary air cooling channel.

[0014] By adopting the above technical solution, the cooling device adopts a two-stage cooling architecture and is arranged outside the carrying device. The cooling main unit of the primary cooling structure forms a closed loop with the cold plate. The flow sensor and pressure switch in the main cooling circulation pipeline of the metal bellows are connected to the control system to ensure cooling efficiency. The cooling actuator of the microchannel fin structure is integrated in the cold plate, which can effectively cool the device. The microchannel cooling plate of the secondary cooling structure is arranged at the bottom of the detection circuit device and the chip to be tested. The secondary heat exchange module adopts a plate heat exchanger structure to indirectly exchange heat through the refrigerant. The spoiler fins and airflow guide grooves of the local guide module form an auxiliary air cooling channel around the chip to be tested, further improving the cooling effect.

[0015] Optionally, deionized water circulates in the main cooling circulation pipeline; fluoride coolant is provided in the secondary heat exchange module as a refrigerant, and the secondary heat exchange module realizes indirect heat exchange through the refrigerant and deionized water.

[0016] By adopting the above technical solution, the circulation of deionized water in the main cooling circulation pipeline can avoid the influence of impurities on the operation of the cooling system and ensure the cooling efficiency of the primary cooling structure; fluoride coolant is set as the refrigerant in the secondary heat exchange module, and indirect heat exchange is achieved through the refrigerant and deionized water. The characteristics of the fluoride coolant can be used to further improve the heat exchange effect, enhance the cooling capacity of the entire cooling device, help the chip maintain a suitable temperature during the test, and improve the test accuracy and stability.

[0017] Optionally, the detection circuit device includes: A test circuit board is arranged above the electric tray device and is provided with test contacts for chip testing; A signal acquisition module, connected to the test circuit board, for collecting electrical performance parameters such as voltage, current, and frequency of the chip under test; The chip analysis module is connected to the control system and is used to analyze the electrical performance parameters of the chip acquired by the signal acquisition module and generate a performance evaluation report of the chip to be tested.

[0018] By adopting the above technical solution, the chip can be directly tested using the test contacts of the test circuit board. The signal acquisition module can collect the chip's electrical performance parameters. The chip analysis module analyzes the collected parameters and generates a performance evaluation report, thereby accurately obtaining the chip's electrical performance, which helps to improve the accuracy and efficiency of chip testing.

[0019] Optionally, the carrying device further includes: Profile embedded parts serve as frames for carrying and installing various functional components; A plurality of support steel plates are provided and connected to the profile embedded parts. Each of the support steel plates can contact the cold plate, and an auxiliary heat dissipation path can be formed between each support steel plate and the cold plate.

[0020] By adopting the above technical solution, the profile embedded parts can carry and install various functional components, support the steel plate against the cold plate to form an auxiliary heat dissipation path, improve the structural stability and heat dissipation effect of the chip test structure, and thus improve the test accuracy and efficiency.

[0021] In summary, this application includes at least one of the following beneficial technical effects: 1. A laser position detection module detects the chip's position and posture in real time. The control system adjusts the position of the electric pallet based on the feedback. A pressure sensor monitors the contact pressure during chip testing. The control system dynamically adjusts the pressure parameters of the electric actuator based on the feedback, keeping the pressure fluctuation range within ±0.5N, thereby improving chip testing accuracy. 2. The electric actuator provides the pressure and displacement required for testing, the electric tray moves and carries the chip, and the detection circuit detects the chip's electrical properties. All devices are controlled by a control system and work together to improve chip testing efficiency. 3. The test seat is set in the load-bearing device. The height of the Foma wheel can be adjusted to change the position of the equipment support point. The number and position of the counterweight blocks can be increased or decreased to adjust the center of gravity distribution. The modular design of the device is reasonable and simplifies the equipment structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 This is an isometric triaxial view of an embodiment of the present application; Figure 3 This is a schematic structural diagram of an electric pallet device according to an embodiment of the present application; Figure 4 is a schematic diagram of a cooling device according to an embodiment of the present application; Figure 5 is a cross-sectional view of an electric tray device according to an embodiment of the present application; Figure 6 This is a schematic diagram of the test socket structure of an embodiment of the present application; Figure 7 Schematic diagram of the structure of the electric actuator according to an embodiment of the present application; Figure 8 This is a schematic diagram of the upper structure of the cold plate in an embodiment of the present application; Figure 9 This is a schematic structural diagram of a nut fixing plate according to an embodiment of the present application; Figure 10 It is a schematic diagram of the structure of the carrying device of an embodiment of the present application.

[0023] Description of reference numerals: 1. Load-bearing device; 11. Forma wheel; 12. Screw; 13. Counterweight; 14. Counterweight fixing angle piece; 15. Profile embedded part; 16. Support steel plate; 2. Test seat; 21. Bottom plate; 22. Side plate; 23. Motor; 24. Slide rail; 25. Motor fixing seat; 26. Positioning pin; 3. Electric actuator; 31. Pressure sensor; 32. Cold plate upper plate; 33. Cold plate; 34. Spring column; 35. Guide column; 36. Positioning sleeve; 37. Limit pin; 38. Cold plate Connecting shaft; 39. Top motor; 4. Electric tray device; 41. Sliding bottom plate; 42. Nut; 43. Fixed slider; 44. Nut fixing plate; 5. Detection circuit device; 51. Test circuit board; 52. Signal acquisition module; 53. Chip analysis module; 6. Control system; 7. Three-color warning light; 8. Grating protection module; 81. Laser position detection module; 9. Cooling device; 91. Primary cooling structure; 911. Cooling host; 912. Main cooling circulation pipeline; 92. Secondary cooling structure; 921. Microchannel cooling plate; 922. Secondary heat exchange module; 923. Local guide module; 9231. Spoiler fin; 9232. Airflow guide groove. DETAILED DESCRIPTION

[0024] The following will be combined with the Figure 1-10 , further describing the technical solutions in the embodiments of the present invention in detail. The described embodiments are merely possible technical implementations of the present invention, but are not limited thereto. Those skilled in the art can fully combine the embodiments of the present invention, and other embodiments derived without inventive effort are also within the scope of protection of the present invention.

[0025] This application mainly adopts chip test structure design to achieve high-precision and efficient testing, thereby improving chip test accuracy and efficiency and simplifying equipment structure. The following is a further detailed description of this application.

[0026] Example 1 Reference Figure 1-Figure 3The chip test structure provided in the embodiment of the present application includes a test seat 2, a carrying device 1, an electric actuator 3, an electric tray device 4, a detection circuit device 5, a control system 6, a laser position detection module 81 and a pressure sensor 31, wherein the test seat 2 is used to fix the chip to be tested, the carrying device 1 is used to support and accommodate various functional modules, the test seat 2 is arranged in the carrying device 1, the electric actuator 3 is arranged on the bottom surface of the test seat 2, and is used to provide the pressure and displacement required for the test, the electric tray device 4 is arranged on the bottom surface of the test seat 2, and is used to move and carry the chip, the detection circuit device 5 is arranged above the electric tray device 4, and is used to detect the electrical properties of the chip, and the control system 6 is simultaneously with the electric actuator. The device 3, the electric tray device 4 and the detection circuit device 5 are connected. The laser position detection module 81 is arranged on the side and top of the test seat 2 for detecting the position and posture of the chip in real time. The laser position detection module 81 is connected to the control system 6. The control system 6 adjusts the position of the electric tray according to the feedback of the laser position detection module 81. The pressure sensor 31 is arranged on the electric actuator 3 for monitoring the contact pressure during the chip testing process. The pressure sensor 31 is connected to the control system 6. The control system 6 dynamically adjusts the pressure parameters of the electric actuator 3 according to the feedback of the pressure sensor 31, so that the pressure fluctuation range is controlled within ±0.5N, so that the chip test can be carried out more accurately and efficiently.

[0027] Reference Figure 3 、 Figure 5 and Figure 7, the test seat 2 includes a base plate 21, a side plate 22 and a motor 23. A slide rail 24 and a motor 23 fixing seat are provided at the bottom of the base plate 21. The base plate 21 plays a basic supporting role. The slide rail 24 provides a track for the sliding of subsequent components, and the motor 23 fixing seat is used to fix the motor 23. The material of the base plate 21 is set to a high-strength metal plate. In the embodiment of the present application, an aluminum alloy plate is taken as an example, which has the characteristics of light weight and high strength. There are two side plates 22, namely a left plate 22 and a right plate 22. Each side plate 22 is connected to a locating pin 26. Each side plate 22 can be connected to the base plate 21 and the top plate through the locating pin 26. The locating pin 26 can ensure the accuracy and stability of the installation of the side plate 22. The diameter tolerance of each locating pin 26 is set to within ±0.01mm to ensure the accuracy of assembly. The side plate 22 is made of a metal plate of the same material as the base plate 21. In the embodiment of the present application, an aluminum alloy plate is taken as an example, and the locating pin 26 is made of high-strength alloy steel. Two motors 23 are provided, one at the top and one at the bottom. They are fixed to the top plate and the motor 23 mounting base, respectively, via screws. The output shafts of both motors 23 are connected to a screw, which together drives the screw to achieve precise movement of the Z and X axes. Motor 23 can be configured as a stepper motor, which precisely controls the rotation angle and speed, or as a servo motor, which offers higher control accuracy and response speed. By driving the screw with motor 23, the test socket 2 can achieve precise positional movement, thereby better testing the chip.

[0028] Reference Figure 1 、 Figure 2 and Figure 10 The supporting device 1 includes a Forma wheel 11 and a counterweight 13. The Forma wheel 11 is arranged at the bottom of the test seat 2 and is connected to the test base by a screw 12. Rotating the screw 12 can adjust the height of the Forma wheel 11 and change the position of the equipment support point. The Forma wheel 11 can facilitate the movement and fixation of the equipment, and the levelness and stability of the equipment can be adjusted by adjusting its height. In the embodiment of the present application, the Forma wheel 11 is composed of a rubber wheel and a metal bracket, and the screw 12 adopts a trapezoidal screw 12 with high thread accuracy. The counterweight 13 is connected to a counterweight fixing angle piece 14. The counterweight 13 is detachably connected to the bottom of the test seat 2 through the counterweight fixing angle piece 14, and the center of gravity distribution is adjusted by increasing or decreasing the number and position of the counterweight 13. In the embodiment of the present application, the counterweight 13 is made of cast iron, which has a high density and can effectively change the center of gravity of the equipment. In the embodiment of the present application, the counterweight fixing angle piece 14 is made of angle steel and is connected to the counterweight 13 and the test seat 2 with bolts. Through the cooperation of the Forma wheel 11 and the counterweight block 13, the equipment can maintain stable support and reasonable center of gravity distribution under different working conditions.

[0029] Reference Figure 3 、 Figure 5 and Figure 6The electric tray device 4 includes a sliding base plate 4121 and a nut 42. The bottom of the sliding base plate 4121 is detachably connected to a fixed slider 43 and a nut fixing plate 44, and the sliding base plate 4121 can drive the chip to move. The fixed slider 43 and the slide rail 24 cooperate to form a sliding pair, and the surface roughness of the slide rail 24 is Ra≤0.8μm, which can reduce the friction during sliding and improve the smoothness of movement. The sliding base plate 4121 is made of a lightweight alloy material. In the embodiment of the present application, magnesium alloy is used as an example, so that it can ensure a certain strength and reduce weight. The nut 42 is detachably connected to the nut fixing plate 44, and the sliding base plate 4121 can move in a straight line through the screw rod. In the embodiment of the present application, the nut 42 is made of copper alloy, which has good wear resistance and transmission performance. Through the cooperation of the screw rod and the nut 42, the electric tray device 4 can achieve precise movement of the chip, which is convenient for testing operations.

[0030] Reference Figure 3 、 Figure 8 and Figure 9The electric actuator 3 includes a cold plate upper plate 32, a cold plate 33, a pressure sensor 31, a spring column 34 and a guide column 35. The cold plate upper plate 32 is connected to a positioning sleeve 36 and a limit pin 37. The limit pin 37 is connected to the nut fixing plate 44. The limit pin 37 is set through the cold plate upper plate 32. The limit pin 37 can limit the movement range of the cold plate upper plate 32. In the embodiment of the present application, the cold plate upper plate 32 is made of an aluminum plate with good thermal conductivity, and the positioning sleeve 36 and the limit pin 37 are made of stainless steel. The cold plate 33 is detachably connected to a cold plate connecting shaft 38. The cold plate 33 is connected to a cooling device 9 through the cold plate connecting shaft 38. The pipeline of the cooling device 9 is connected to the cold plate 33. A coolant circulation pipeline is formed between the cooling device 9 and the cold plate 33. The coolant can take away the heat absorbed by the cold plate 33 and reduce the temperature during chip testing. In the embodiment of the present application, the cold plate 33 is made of a copper plate with good thermal conductivity. The pressure sensor 31 is positioned between the cold plate upper plate 32 and the nut fixing plate 44. The pressure test range of the pressure sensor 31 is set to 0-50N. The pressure sensor 31 can monitor the contact pressure during chip testing in real time. The pressure sensor 31 can be a strain gauge pressure sensor 31, which offers high precision and reliability. A spring column 34 is positioned atop the cold plate upper plate 32. The spring column 34 applies a force perpendicular to the surface of the chip under test, ensuring the stability of the test pressure. In this embodiment, the spring column 34 is a cylindrical coil spring made of high-carbon steel. A guide column 35 is slidably mounted on the cold plate upper plate 32. The guide column 35 is used to limit the movement of the cold plate upper plate 32, ensuring that the cold plate upper plate 32 moves perpendicular to the surface of the chip under test. In this embodiment, the guide column 35 is made of chrome-plated round steel, resulting in a smooth surface that reduces friction with the cold plate upper plate 32. Through the coordinated operation of various components, the electric actuator 3 provides stable pressure and effective heat dissipation for chip testing.

[0031] Reference Figure 2 and Figure 3The detection circuit device 5 includes a test circuit board 51, a signal acquisition module 52 and a chip analysis module 53. The test circuit board 51 is arranged above the electric tray device 4, and is provided with test contacts for chip testing. The test circuit board 51 can contact the chip to perform electrical performance testing. The test circuit board 51 generally adopts a printed circuit board and has good electrical performance. The signal acquisition module 52 is connected to the test circuit board 51 and is used to collect electrical performance parameters such as voltage, current, and frequency of the chip to be tested. The signal acquisition module 52 can adopt a high-speed data acquisition card, which can quickly and accurately collect data. The chip analysis module 53 is connected to the control system 6 and is used to analyze the electrical performance parameters of the chip collected by the signal acquisition module 52 and generate a performance evaluation report of the chip to be tested. The chip analysis module 53 can be a computer with specific analysis software, which processes and analyzes the collected data through the software. The detection circuit device 5 can comprehensively and accurately detect the electrical performance of the chip through the coordinated work of various components.

[0032] Reference Figure 1 and Figure 2 The control system 6 adopts a programmable logic controller (PLC), which can accurately control the operation of the electric actuator 3, the electric tray device 4 and the detection circuit device 5 according to the feedback of the laser position detection module 81 and the pressure sensor 31, thereby realizing the automation and precision of chip testing.

[0033] Reference Figure 1-Figure 3 In the embodiment of the present application, the laser position detection module 81 adopts a laser displacement sensor and a laser angle sensor, which can detect the position and posture of the chip in real time and accurately, and provide accurate feedback information to the control system 6 so as to adjust the position of the electric tray in time.

[0034] The implementation principle of this embodiment is as follows: This chip testing structure solves the problems of low test accuracy, low test efficiency, and complex equipment structure of existing chip testing equipment through the reasonable layout and coordinated operation of various components. The test seat 2 can accurately fix and move the chip, the supporting device 1 can ensure the stability of the equipment and the reasonable center of gravity distribution, the electric actuator 3 can provide stable pressure and effective heat dissipation, the electric tray device 4 realizes the precise movement of the chip, the detection circuit device 5 comprehensively and accurately detects the electrical properties of the chip, the control system 6 accurately controls the operation of each device based on feedback information, the laser position detection module 81 monitors the chip position and posture in real time, and the pressure sensor 31 ensures the stability of the test pressure. The entire structure improves the accuracy and efficiency of chip testing, simplifies the equipment structure, reduces maintenance difficulty and manufacturing costs, and is highly practical and innovative.

[0035] Example 2 Reference Figure 10This embodiment differs in that the Forma wheel 11 in the support device 1 can be replaced with a universal caster. The universal caster is also located at the bottom of the test stand 2 and connected to the test base via a screw 12. Rotating the screw 12 adjusts the height of the universal caster, thereby changing the position of the device support point. Universal casters offer greater flexibility, allowing the device to be easily moved in all directions, making them suitable for scenarios where frequent movement is required.

[0036] The principle behind this embodiment is that universal casters replace the Formosa wheel 11, significantly improving the flexibility of device movement. In environments where frequent adjustments to the device's position are necessary, universal casters allow for quicker and more convenient movement, improving ease of use. While still allowing the position of the device's support point to be changed by adjusting the screw 12, ensuring stability during testing, this represents an optimization and improvement over existing chip testing structures.

[0037] Example 3 Reference Figure 2 and Figure 3 The difference of this embodiment is that the chip test structure also includes a grating protection module 8 and a three-color warning light 7. The grating protection module 8 is arranged at the front entrance position of the carrier device 1, and the grating protection module 8 is connected to the control system 6 for detecting the intrusion of personnel and foreign objects. The three-color warning light 7 is arranged on the top of the carrier device 1, and the three-color warning light 7 is connected to the control system 6. When the equipment is operating normally, the control system 6 controls the green light of the three-color warning light 7 to light up. After the grating protection module 8 detects foreign objects or human bodies, it sends an electrical signal to control the yellow light of the three-color warning light 7 by the control system 6. When the equipment fails to operate, the control system 6 controls the red light of the three-color warning light 7 to light up and the equipment is shut down urgently. The grating protection module 8 can adopt an infrared grating. The infrared grating has the characteristics of high sensitivity and fast response speed, and can detect the intrusion of personnel and foreign objects in time. The three-color warning light 7 adopts an LED lamp, which has the advantages of high brightness, low energy consumption and long life.

[0038] The operating principle of this embodiment is as follows: the addition of a light barrier protection module 8 and a three-color warning light 7 enhances the safety and reliability of the chip test structure. The light barrier protection module 8 monitors the equipment entrance in real time. Upon detecting any foreign object or human intrusion, it promptly issues a signal, which, through the control system 6, controls the three-color warning light 7 to display the corresponding status, alerting the operator to safety. If an error occurs during equipment operation, the red light of the three-color warning light 7 illuminates, triggering an emergency shutdown. This prevents potential danger and equipment damage, further improving equipment performance and user experience, and represents a significant improvement over existing chip test structures.

[0039] Example 4 Reference Figure 1 、 Figure 2 and Figure 4The difference of this embodiment is that the cooling device 9 is disposed outside the carrier device 1 and adopts a two-stage cooling architecture, including a primary cooling structure 91 and a secondary cooling structure 92. The primary cooling structure 91 includes a cooling main unit 911, a main cooling circulation pipeline 912, and a cooling actuator. The cooling main unit 911 is connected to the cold plate 33 via a refrigerant pipeline to form a closed loop. The main cooling circulation pipeline 912 is a metal bellows and is equipped with a flow sensor and a pressure switch. Both the flow sensor and the pressure switch are connected to the control system 6 to ensure the cooling efficiency of the primary cooling structure 91. The cooling actuator is integrated into the cold plate 33 and adopts a microchannel fin structure. The secondary cooling structure 92 includes a microchannel cooling plate 921, a secondary heat exchange module 922, and a local flow guide module 923. The microchannel cooling plate 921 is positioned between the detection circuit device 5 and the bottom of the chip under test. The secondary heat exchange module 922 is positioned between the primary cooling structure 91 and the microchannel cooling plate 921 and utilizes a plate heat exchanger structure for indirect heat exchange via a refrigerant. The local flow guide module 923 is positioned around the chip under test and includes spoiler fins 9231 and airflow guide grooves 9232, forming auxiliary air cooling channels. Deionized water circulates within the primary cooling circulation line 912. Deionized water has excellent electrical conductivity and heat dissipation properties, and does not corrode the piping. Fluoride coolant is used as the refrigerant within the secondary heat exchange module 922, enabling indirect heat exchange between the refrigerant and the deionized water.

[0040] The implementation principle of this embodiment is as follows: the cooling device 9 with a two-stage cooling structure can more effectively reduce the temperature during chip testing. The primary cooling structure 91 forms a closed loop with the cold plate 33 through the cooling host 911 and the refrigerant pipeline, and uses the cooling actuator with a microchannel fin structure to quickly remove the heat from the cold plate 33. At the same time, the cooling efficiency is guaranteed by the flow sensor and pressure switch. The secondary cooling structure 92 further reduces the temperature of the chip and the detection circuit device 5 through the microchannel cooling plate 921, the secondary heat exchange module 922 and the local diversion module 923, forming an auxiliary air cooling channel to enhance the heat dissipation effect. This two-stage cooling architecture design improves cooling efficiency, ensures the stability of the chip during high-load operation testing, and extends the service life of the chip and equipment. It is an optimization and upgrade of the existing chip test structure heat dissipation system.

[0041] Example 5 Reference Figure 10The difference between this embodiment and the above embodiment is that the supporting device 1 also includes a profile embedded part 15 and a support steel plate 16. The profile embedded part 15 serves as a frame for carrying and installing various functional components. The profile embedded part 15 is made of aluminum alloy profile, which has the characteristics of light weight, high strength and easy processing. There are multiple support steel plates 16 connected to the profile embedded part 15. Each support steel plate 16 can contact the cold plate 33, and an auxiliary heat dissipation path can be formed between each support steel plate 16 and the cold plate 33. The support steel plate 16 is generally made of carbon steel and has good thermal conductivity.

[0042] The operating principle of this embodiment is as follows: the addition of profile embedded parts 15 makes the structure of the support device 1 more stable, better able to support and install various functional components, and ensure the overall stability of the device. The auxiliary heat dissipation path formed by the support steel plate 16 and the cold plate 33 can dissipate heat absorbed by the cold plate 33 more quickly, further improving the device's heat dissipation performance, helping to reduce the temperature during chip testing, improving test accuracy and device reliability, and further optimizing the existing chip testing structure support device 1.

[0043] The above are all preferred embodiments of the present application, and are not intended to limit the scope of protection of the present application. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the scope of protection of the present application.

Claims

1. An automatic chip testing device, characterized in that: include: A test seat (2), used for fixing the chip to be tested; The carrier device (1) is used to support and accommodate various functional modules. The test seat (2) is arranged in the carrier device (1). The carrier device (1) includes: A Forma wheel (11) is provided at the bottom of the test seat (2) and is connected to the test base via a screw (12). The screw (12) is rotated to adjust the height of the Forma wheel (11) and change the position of the equipment support point. A counterweight block (13) is connected to a counterweight fixing angle piece (14), wherein the counterweight block (13) is detachably connected to the bottom of the test seat (2) via the counterweight fixing angle piece (14), and the center of gravity distribution is adjusted by increasing or decreasing the number and position of the counterweight blocks (13); An electric actuator (3) is arranged on the bottom surface of the test seat (2) and is used to provide the pressure and displacement required for the test; An electric tray device (4) is arranged on the bottom surface of the test seat (2) and is used for moving and carrying chips; A detection circuit device (5) is arranged above the electric tray device (4) and is used to detect the electrical properties of the chip; A control system (6), wherein the control system (6) is simultaneously connected to the electric actuator (3), the electric tray device (4) and the detection circuit device (5); A laser position detection module (81) is provided on the side and top of the test seat (2) and is used to detect the position and posture of the chip in real time. The laser position detection module (81) is connected to a control system (6). The control system (6) adjusts the position of the electric tray according to feedback from the laser position detection module (81); A pressure sensor (31) is provided on the electric actuator (3) and is used to monitor the contact pressure during the chip testing process. The pressure sensor (31) is connected to a control system (6). The control system (6) dynamically adjusts the pressure parameters of the electric actuator (3) based on feedback from the pressure sensor (31) so that the pressure fluctuation range is controlled within ±0.5N.

2. The automatic chip testing device according to claim 1, characterized in that: The test seat (2) comprises: A bottom plate (21) is provided with a slide rail (24) and a motor (23) fixing seat at the bottom; Two side plates (22) are provided, which are respectively provided as a left side plate (22) and a right side plate (22). Each side plate (22) is connected with a positioning pin (26). Each side plate (22) can be connected to the bottom plate (21) and the top plate through the positioning pin (26). The diameter tolerance of each positioning pin (26) is set to be no greater than 0.01 mm. Two motors (23) are provided. The two motors (23) are respectively provided at the top and the bottom. The two motors (23) are respectively fixed to the top plate and the motor (23) fixing seat by screws. The output shafts of the two motors (23) are connected to the screw rod. The two motors (23) jointly drive the screw rod to realize the precise movement of the Z axis and the X axis.

3. The automatic chip testing device according to claim 2, characterized in that: The electric tray device (4) comprises: A sliding base plate (41) is detachably connected to a fixed slider (43) and a nut fixing plate (44) at the bottom; a nut (42) is detachably connected to the nut fixing plate (44) and is adapted to move the sliding base plate (41) in a straight line by means of a screw rod; The fixed slider (43) and the slide rail (24) cooperate to form a sliding pair, and the surface roughness of the slide rail (24) is Ra≤0.8μm.

4. The automatic chip testing device according to claim 3, characterized in that: The electric actuator (3) comprises: The upper plate (32) of the cold plate is connected with a positioning sleeve (36) and a limiting pin (37), wherein the limiting pin (37) is connected to the nut fixing plate (44), and the limiting pin (37) is arranged through the upper plate (32) of the cold plate; The cold plate (33) is detachably connected to a cold plate connecting shaft (38), wherein the cold plate (33) is connected to a cooling device (9) via the cold plate connecting shaft (38), and a pipeline of the cooling device (9) is communicated with the cold plate (33), forming a coolant circulation pipeline between the cooling device (9) and the cold plate (33); A pressure sensor (31) is arranged between the upper plate (32) of the cold plate and the nut fixing plate (44), and the pressure test range of the pressure sensor (31) is set to 0-50N; A spring column (34) is arranged on the top of the cold plate upper plate (32), and the spring column (34) can apply a force to the cold plate upper plate (32) in a direction perpendicular to the surface of the chip to be tested; A guide post (35) is slidably mounted on the upper plate (32) of the cold plate. The guide post (35) is used to limit the movement direction of the upper plate (32) of the cold plate. The guide post (35) enables the movement direction of the upper plate (32) of the cold plate to be perpendicular to the surface of the chip to be tested.

5. The automatic chip testing device according to claim 4, characterized in that: It also includes a light barrier protection module (8) arranged at the front entrance of the carrying device (1), the light barrier protection module (8) being connected to the control system (6) and used for detecting the intrusion of people and foreign objects; A three-color warning light (7) is arranged on the top of the carrying device (1). The three-color warning light (7) is connected to the control system (6). When the equipment is operating normally, the control system (6) controls the green light of the three-color warning light (7) to light up. When the grating protection module (8) detects a foreign object or a human body, it sends an electrical signal to control the yellow light of the three-color warning light (7) by the control system (6). When an error occurs in the operation of the equipment, the control system (6) controls the red light of the three-color warning light (7) to light up and the equipment is shut down urgently.

6. The automatic chip testing device according to claim 5, characterized in that: The cooling device (9) is arranged outside the carrying device (1) and adopts a two-stage cooling structure, including: A primary cooling structure (91) includes a cooling main unit (911), a main cooling circulation pipeline (912), and a cooling execution device. The cooling main unit (911) is connected to the cold plate (33) via a refrigerant pipeline to form a closed cycle. The main cooling circulation pipeline (912) is a metal bellows. A flow sensor and a pressure switch are provided in the main cooling circulation pipeline (912). Both the flow sensor and the pressure switch are connected to the control system (6) to ensure the cooling efficiency of the primary cooling structure (91). The cooling execution device is integrated into the cold plate (33) and adopts a microchannel fin structure. A secondary cooling structure (92) includes a microchannel cooling plate (921), a secondary heat exchange module (922) and a local flow guide module (923). The microchannel cooling plate (921) is arranged at the bottom of the detection circuit device (5) and the chip to be tested; the secondary heat exchange module (922) is arranged between the primary cooling structure (91) and the microchannel cooling plate (921), adopts a plate heat exchanger structure, and indirectly exchanges heat through a refrigerant; the local flow guide module (923) is arranged around the chip to be tested, and includes spoiler fins (9231) and airflow guide grooves (9232) arranged around the chip to be tested, forming an auxiliary air cooling channel.

7. The automatic chip testing device according to claim 6, characterized in that: Deionized water circulates in the main cooling circulation pipeline (912); fluoride coolant is provided in the secondary heat exchange module (922) as a refrigerant, and the secondary heat exchange module (922) realizes indirect heat exchange with the deionized water through the refrigerant.

8. The automatic chip testing device according to claim 7, characterized in that: The detection circuit device (5) comprises: A test circuit board (51) is arranged above the electric tray device (4) and is provided with test contacts for chip testing; A signal acquisition module (52) is connected to the test circuit board (51) and is used to acquire electrical performance parameters such as voltage, current, and frequency of the chip to be tested; The chip analysis module (53) is connected to the control system (6) and is used to analyze the electrical performance parameters of the chip acquired by the signal acquisition module (52) and generate a performance evaluation report of the chip to be tested.

9. The automatic chip testing device according to claim 8, characterized in that: The carrying device (1) further includes a profile embedded part (15) serving as a frame for carrying and installing various functional components; a plurality of support steel plates (16) connected to the profile embedded part (15), each of the support steel plates (16) being capable of contacting the cold plate (33), and an auxiliary heat dissipation path being capable of being formed between each support steel plate (16) and the cold plate (33).

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