Electronic component set, method for setting electronic components, and method for manufacturing electronic device

Abstract

The invention discloses an electronic component set, an electronic component gathering method and a manufacturing method of an electronic device, the electronic component set comprises a plurality of electronic components and at least one gasket, the gasket is arranged between two adjacent electronic components, the gasket comprises a body and at least one tangent line, the body is provided with a first surface and a second surface opposite to the first surface, the first surface is adjacent to one of the two adjacent electronic components, the second surface is adjacent to the other one of the two adjacent electronic components, and the tangent line is formed on the body and extends along a first direction parallel to the first surface; the tangent line extends from the first surface to the second surface along the second direction so as to penetrate through the body.

Description

Technical Field

[0001] The present disclosure relates to an electronic component of an electronic device, and more particularly to an electronic component assembly, an electronic component assembly method, and a method for manufacturing an electronic device. Background Art

[0002] With the development of digital technology, electronic devices with display panels have been widely used in all aspects of daily life, such as televisions, computers, mobile phones and other modern information products. Among the common display panels, liquid crystal display panels are one of the current mainstream products.

[0003] However, during the panel manufacturing process, when individual semi-finished panels are removed from the packaging for processing, the gaskets often stick to the semi-finished panels and cannot be removed smoothly. This hinders the subsequent automatic sheet removal (automated operation) and further processing, causing trouble for electronic device manufacturers.

[0004] Therefore, how to provide an electronic component assembly, an electronic component assembly method, and an electronic device manufacturing method that can avoid the moiré phenomenon and does not affect automated operations is indeed one of the important issues in the industry. Summary of the Invention

[0005] The present disclosure provides an electronic component assembly, an electronic component assembly method, and an electronic device manufacturing method, which can avoid the phenomenon of moiré on the electronic components while not affecting the automated operation of manufacturing the electronic device.

[0006] According to the present disclosure, an electronic component set includes multiple electronic components and at least one pad, wherein the pad is arranged between two adjacent electronic components; the pad includes a body and at least one tangent line, the body has a first surface and a second surface arranged relative to the first surface, the first surface is adjacent to one of the two adjacent electronic components, and the second surface is adjacent to the other of the two adjacent electronic components, the tangent line is formed in the body and extends along a first direction parallel to the first surface, and the tangent line extends from the first surface to the second surface along a second direction to pass through the body.

[0007] According to the present disclosure, a method for assembling electronic components includes the following steps: taking a first electronic component; taking a pad and setting the pad on the first electronic component; and taking a second electronic component and setting the second electronic component on the pad; wherein the pad includes a body and at least one tangent line, the body has a first surface and a second surface arranged relative to the first surface, the first surface is adjacent to the first electronic component, and the second surface is adjacent to the second electronic component, the tangent line is formed on the body and extends along a first direction parallel to the first surface, and the tangent line extends from the first surface to the second surface along a second direction to penetrate the body.

[0008] According to a method for manufacturing an electronic device disclosed herein, in conjunction with the aforementioned electronic component set, the method includes the following steps: removing a pad from the electronic component set; removing one of a plurality of electronic components from the electronic component set; and forming an electronic device using the removed electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 Schematic diagram of an electronic component assembly according to an embodiment of the present disclosure, wherein the electronic component assembly is in a state before being packed.

[0010] Figure 2 This is a top view of the gasket according to an embodiment of the present disclosure.

[0011] Figure 3 This is a top view of a gasket according to another embodiment of the present disclosure.

[0012] Figures 4 to 8 This is a top view of a gasket according to another embodiment of the present disclosure.

[0013] Figure 9 The figure is a flowchart of a method for assembling electronic components according to an embodiment of the present disclosure.

[0014] Figure 10 Flowchart of a method for manufacturing an electronic device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0015] The following will describe an electronic component assembly, an electronic component assembly method, and an electronic device manufacturing method according to a preferred embodiment of the present disclosure with reference to the relevant drawings, wherein the same components will be described with the same reference symbols. It should be understood that the following description provides many different embodiments for implementing different implementations of some embodiments of the present disclosure. The specific components and arrangements described below are only for a simple and clear description of some embodiments of the present disclosure. Of course, these embodiments are only for illustrative purposes and are not intended to limit the scope of the present disclosure. In addition, repeated numbers or marks may be used in different embodiments. These repetitions are only for the purpose of simply and clearly describing some embodiments of the present disclosure and do not represent any correlation between the different embodiments and / or structures discussed. Furthermore, when a component is said to be located on or above another component, it includes a situation where the component is in direct contact with the other component; alternatively, there may be a situation where there are one or more other components in between, in which case the component may not be in direct contact with the other component.

[0016] In addition, relative terms such as "lower" or "bottom" and "upper" or "top" may be used in the embodiments to describe the relative relationship of one component to another component in the drawings. It is understood that if the device in the drawings is turned upside down, the component described as being on the "lower" side will become the component on the "upper" side.

[0017] Here, the terms "about," "approximately," and "substantially" generally mean within 20%, preferably within 10%, and more preferably within 5%, or within 3%, or within 2%, or within 1%, or within 0.5% of a given value or range. The quantities given here are approximate quantities, that is, in the absence of specific description of "about," "approximately," or "substantially," the meaning of "about," "approximately," or "substantially" may still be implied.

[0018] It is understood that although the terms "first," "second," "third," etc. may be used herein to describe various components, constituents, regions, layers, and / or parts, these components, constituents, regions, layers, and / or parts should not be limited by these terms, and these terms are merely used to distinguish different components, constituents, regions, layers, and / or parts. Thus, a first component, component, region, layer, and / or part discussed below may be referred to as a second component, component, region, layer, and / or part without departing from the teachings of some embodiments of the present disclosure.

[0019] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meanings as commonly understood by those skilled in the art to which this disclosure belongs. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the context or context of the relevant art and this disclosure, and should not be interpreted in an idealized or overly formal manner unless otherwise defined in the embodiments of this disclosure.

[0020] Some embodiments of the present disclosure may be combined with the following Figure 1 It is understood that the drawings of the embodiments of the present disclosure are also considered part of the description of the embodiments of the present disclosure. It should be understood that the drawings of the embodiments of the present disclosure are not shown to scale with actual devices and components. The shapes and thicknesses of the embodiments may be exaggerated in the drawings to clearly illustrate the features of the embodiments of the present disclosure. In addition, the structures and devices in the drawings are shown in a schematic manner to clearly illustrate the features of the embodiments of the present disclosure.

[0021] In some embodiments of the present disclosure, relative terms such as "lower", "upper", "parallel", "vertical", "below", "above", "top", "bottom", etc. should be understood as the orientation shown in the paragraph and related drawings. Such relative terms are only for the convenience of description and do not mean that the device described needs to be manufactured or operated in a specific orientation. Terms related to joining and connection, such as "connected" and "connected", unless otherwise defined, may refer to two structures being in direct contact, or may also refer to two structures not being in direct contact, but having other structures disposed between the two structures. Furthermore, such terms related to joining and connection may also include situations where both structures are movable or both structures are fixed.

[0022] Please refer to Figure 1 As shown, Figure 1 FIG4 is a schematic diagram of an electronic component assembly 10 according to an embodiment of the present disclosure, wherein the electronic component assembly 10 is in a state before being loaded into a container 40. In the present disclosure, the electronic component assembly 10 includes a plurality of electronic components 20 and at least one gasket 30, each gasket 30 being disposed between two adjacent electronic components 20.

[0023] like Figure 1 As shown, the electronic component assembly 10 of this embodiment includes, for example, 12 electronic components 20 and 11 pads 30. These electronic components 20 and pads 30 are stacked in a staggered manner, that is, one pad 30 is disposed between two adjacent electronic components 20, and one electronic component 20 is located between two adjacent pads 30. It should be noted that the number of components described above is merely an example and the present disclosure is not limited thereto.

[0024] Furthermore, the electronic components 20 and the gaskets 30 are tightly stacked and housed in a corresponding container 40. The interior space of the container 40 conforms to the outer contours of the electronic components 20 and the gaskets 30 to accommodate the stacked electronic components 20 and the gaskets 30. Furthermore, after the electronic components 20 and the gaskets 30 are packed, a cover (not shown) can be provided on the upper side of the container 40. The cover can be made of the same material as the container 40, or a protective cushioning material, which is not limited in this disclosure. The gasket 30 can be made of, for example, a material with cushioning or spacing properties, such as plastic, polymer, metal, or ceramic, such as expanded polyethylene foam (EPF) or ethylene-vinyl acetate copolymer (EVA), but is not limited thereto.

[0025] In this embodiment, each electronic component 20 may be, for example, but not limited to, a semi-finished panel, and in particular, may be, for example, but not limited to, a semi-finished liquid crystal panel, a semi-finished organic light-emitting diode panel, a semi-finished electroluminescent panel, a semiconductor component, etc., but the present disclosure is not limited thereto. This embodiment uses the example of each electronic component 20 being a semi-finished liquid crystal panel.

[0026] For example, the electronic component 20 includes a first substrate, a second substrate, and a display medium layer (not shown). The first substrate and the second substrate are disposed opposite each other, and the display medium layer is sandwiched between the first and second substrates. The display medium layer is a liquid crystal layer, so that the electronic component 20 can be manufactured into a semi-finished liquid crystal panel. The first substrate or the second substrate can be made of a light-transmitting material, such as glass, quartz or the like, plastic, rubber, fiberglass, or other polymer materials; alternatively, the first substrate or the second substrate can be made of an opaque material, such as a metal-fiberglass composite board, a metal-ceramic composite board, a printed circuit board, or other materials.

[0027] In addition, the electronic component 20 may further include a light shielding layer, a light filter layer, and a protective layer (not shown). The light shielding layer and the light filter layer are disposed on the first substrate. In one embodiment, the light shielding layer and the light filter layer are included in a color filter array and disposed on the first substrate, so that the first substrate including the color filter array becomes a color filter substrate. In addition, a thin film transistor array may be disposed on the second substrate, so that the second substrate including the thin film transistor array becomes a thin film transistor substrate. However, in other embodiments, the light shielding layer and the light filter layer may also be disposed separately on the second substrate, so that it becomes a BOA (BM on array) substrate or a COA (color filter on array) substrate, but the present disclosure is not limited to this. In one embodiment, the light shielding layer has a plurality of openings, which are areas through which light can pass. The light shielding layer can be, for example, a black matrix and is made of an opaque material, such as metal or resin. The metal can be, for example, chromium, chromium oxide, or a chromium oxynitride compound. Because the light-shielding layer is made of an opaque material, it can form opaque areas on the first substrate, thereby defining light-transmitting areas. Furthermore, the filter layer of this embodiment may, for example but not limited to, comprise a repeating arrangement of three color blocks, such as, but not limited to, red (R), green (G), and blue (B), and its material may be a light-transmitting material, such as a pigment or dye.

[0028] In one embodiment, a protective layer (e.g., an over-coating) may cover the light shielding layer and the light filter layer. The protective layer may be made of a photoresist, a resin, or an inorganic material (e.g., SiOx / SiNx), etc., to protect the light shielding layer and the light filter layer from being damaged by subsequent processes. Furthermore, the display panel may further include a sealant (not shown), which is disposed between the first substrate and the second substrate and seals the periphery between the first substrate and the second substrate. The sealant may be a photocurable sealant (e.g., a UV sealant), and may be, for example, but not limited to, coated around the periphery of the first substrate and the second substrate in the atmosphere. Furthermore, the sealant and the first and second substrates may form a housing space (not shown), and the display medium layer may be disposed within the housing space. Here, for example, but not limited to, a drop-injection method (One Drop Filling, ODF) may be used to fill the liquid crystal molecules into the housing space enclosed by the sealant.

[0029] In one embodiment, the electronic component 20 may further include one or more optical film layers, which may be, for example but not limited to, polarizing layers (such as upper polarizing plates, lower polarizing plates), polarizers, anti-reflective films, explosion-proof films, etc. These film layers are well known to those skilled in the art, so they will not be described in detail here.

[0030] Please refer to Figure 2 As shown, each pad 30 includes a body 31 and at least one tangent line 32, wherein the body 31 has a first surface 311 and a second surface 312 disposed opposite to the first surface 311. The first surface 311 is disposed adjacent to one of the two adjacent electronic components 20, and the second surface is disposed adjacent to the other of the two adjacent electronic components 20. For details, please refer to Figure 1 and Figure 2 As shown, the first surface 311 can be, for example, the upper surface of the body 31, and the second surface 312 can be, for example, the lower surface of the body 31. The first surface 311 is disposed adjacent to an electronic component 20 located above the gasket 30, while the second surface 312 is disposed adjacent to another electronic component 20 located below the gasket 30. Furthermore, in this embodiment, the size and contour shape of the body 31 of each gasket 30 can roughly match the size and contour shape of each electronic component 20, for example, the size and contour shape of the display surface (e.g., a glass substrate, a polarizing plate, etc.) of each electronic component 20, thereby providing appropriate protection. Furthermore, the material of the body 31 of this embodiment can be, for example, but not limited to, a foam material, and this disclosure is not limiting.

[0031] Please refer to Figure 2As shown, the gasket 30 of this embodiment may, for example, but not limited to, include two tangent lines 32 formed on the body 31 and extending along a first direction X parallel to the first surface 311, wherein each tangent line 32 extends along a second direction from the first surface 311 to the second surface 312 to penetrate the body 31. In this embodiment, the first surface 311 and the second surface 312 of the gasket 30 generally have a rectangular shape. The first direction X may, for example, be a direction parallel to the long axis of the rectangle, and the second direction may, for example, be a direction perpendicular to the first surface 311 (or the second surface 312). Therefore, the second direction may also be understood as the normal direction of the first surface 311 or the second surface 312. In another embodiment, the second direction may, for example, form an angle with the first surface, but the present disclosure is not limited thereto.

[0032] In this embodiment, each tangent line 32 has a width in a third direction Y perpendicular to the first direction X and the second direction, and this width is between 0.1 mm and 1 mm (0.1 mm ≤ width of tangent line 32 ≤ 1 mm). It should be noted that the above width range is only an example and the present disclosure is not limited thereto.

[0033] In this embodiment, the body 31 defines a length C in the first direction X, and each tangent line 32 defines a length A in the first direction X, where the length A is 40% to 80% of the length C (40%*C≤A≤80%*C). Furthermore, in this embodiment, each tangent line 32 is spaced a first distance B from an edge of the body 31 in the first direction X, where the first distance B is 10% to 30% of the length C of the body 31 (10%*C≤B≤30%*C). Furthermore, in this embodiment, each tangent line 32 is spaced a second distance D from another edge of the body 31 in the third direction Y, where the second distance D is 10% to 30% of the length C of the body 31 (10%*C≤B≤30%*C). By adopting the aforementioned ranges of the first distance B and the second distance D, each tangent line 32 can be sufficiently long to provide a vacuum-breaking effect between two adjacent electronic components in the stacked assembly, thereby preventing the gasket 30 from adhering to the electronic component 20 (e.g., a semi-finished panel) and becoming difficult to remove. Furthermore, the structural strength of each gasket 30 can be ensured, and cracking along the tangent line 32 can be avoided. It should be noted that the aforementioned ranges of the first distance B and the second distance D are merely examples, and the present disclosure is not limited thereto.

[0034] Next, please refer to Figure 3As shown, in another implementation aspect of this embodiment, the gasket 30 may include, for example but not limited to, two tangent lines 32 formed on the body 31 and extending along a first direction X parallel to the first surface 311. Each tangent line 32 extends from the first surface 311 to the second surface 312 along a second direction perpendicular to the first surface 311 to penetrate the body 31. Each tangent line 32 includes at least two line segments 321 and at least one space 322 disposed between the at least two line segments 321. In this embodiment, each tangent line 32 includes three line segments 321 and two spaces 322 disposed between these line segments 321. Furthermore, in this embodiment, the ratio of the total length of all line segments 321 to the total length of all spaces 322 on the same tangent line 32 may be, for example but not limited to, 1 to 2, and preferably 1.5 to 2, but the present disclosure is not limited thereto.

[0035] It should be noted that the number of tangent lines and the design of their segments and spacings disclosed in the above embodiments are merely exemplary and are not intended to limit the scope of this disclosure. The number of tangent lines and the design of their segments and spacings can be adjusted based on actual needs. Several suitable designs are disclosed below with reference to the accompanying drawings.

[0036] In one embodiment, the pad 30 may include more than two tangent lines 32. For example, the pad 30 may include three tangent lines 32 (e.g., Figure 4 In another embodiment, the pad 30 may include three tangent lines 32, and each tangent line 32 may include more line segments 321 and a plurality of intervals 322 (such as Figure 5 In another embodiment, the liner 30 includes two tangent lines 32, and each tangent line 32 includes a plurality of line segments 321 and at least one spacer 322 disposed between any two line segments 321. However, the design and / or number of the line segments 321 and the spacers 322 of different tangent lines 32 may be different (e.g., Figure 6 In another embodiment, the liner 30 may include three tangent lines 32, and each tangent line 32 is formed on the body 31 and extends along the third direction Y (as shown). Figure 7 In another embodiment, the pad 30 may include three tangent lines 32, each tangent line 32 being formed on the body 31 and extending along the third direction Y, and each tangent line 32 including a plurality of line segments 321 and at least one interval 322 (e.g., Figure 8 shown).

[0037] In the aforementioned embodiments, each tangent 32 has a roughly linear design and is set parallel to the long side (first direction X) or short side (third direction Y) of the main body 31. However, the present disclosure is not limited to this. In other embodiments, each tangent may be set non-parallel to the long side (first direction X) or short side (third direction Y) of the main body 31. In other embodiments, each tangent may also be composed of a plurality of line segments, for example, each tangent is composed of two line segments connected to form an inverted V-shaped tangent. In addition, in one embodiment, each tangent is composed of two line segments interlaced to form a +-shaped tangent. In another embodiment, each tangent may also be composed of a plurality of nonlinear line segments, for example, each tangent is composed of two curved line segments to form an inverted U-shaped tangent. It should be noted that the features of the above embodiments can be arbitrarily mixed and matched for use as long as they do not violate the spirit of the invention or conflict with each other, and the present disclosure is not limited thereto. In summary, the electronic component assembly disclosed herein includes a plurality of electronic components and at least one pad, wherein the pad is disposed between two adjacent electronic components; the pad includes a body and at least one tangent line, the body having a first surface and a second surface disposed relative to the first surface, the first surface being adjacent to one of the two adjacent electronic components, and the second surface being adjacent to the other of the two adjacent electronic components; the tangent line is formed on the body and extends along a first direction parallel to the first surface, and the tangent line extends from the first surface to the second surface along a second direction perpendicular to the first surface to penetrate the body. By forming the tangent line on the pad, when the electronic component assembly disclosed herein is supplied to downstream manufacturers for subsequent electronic device manufacturing, the phenomenon of moiré patterns on the electronic components can be avoided without affecting the automated manufacturing process of the electronic devices.

[0038] In addition, please refer to Figure 9 As shown, Figure 9 The figure is a flowchart of a method for assembling electronic components according to an embodiment of the present disclosure.

[0039] like Figure 9As shown, the electronic component assembly method of the present disclosure includes the following steps: taking a first electronic component (step S01), wherein the first electronic component obtained can be, for example, but not limited to, the electronic component 20 described above; taking a pad and placing the pad on the first electronic component (step S02), wherein the pad obtained can be, for example, but not limited to, the pad 30 described above; and taking a second electronic component and placing the second electronic component on the pad (step S03), wherein the second electronic component obtained can be, for example, but not limited to, the electronic component 20 described above. In this embodiment, the pad includes a body and at least one tangent line, the body having a first surface and a second surface arranged relative to the first surface, the first surface being adjacent to the first electronic component, and the second surface being adjacent to the second electronic component, the tangent line being formed in the body and extending along a first direction parallel to the first surface, and the tangent line extending from the first surface to the second surface along a second direction perpendicular to the first surface to penetrate the body. It should be noted that the electronic components and pads described in this embodiment can refer to the description of the electronic component 20 and the pad 30 of the aforementioned embodiment, so they are not repeated here.

[0040] In addition, the electronic component assembly method disclosed herein may further include the following steps: repeating the above steps S02 and S03 to obtain an electronic component assembly 10, wherein the electronic component assembly 10 includes multiple electronic components 20 and multiple pads 30, and a pad 30 is respectively provided between two adjacent electronic components 20.

[0041] In addition, the electronic component assembly method of the present disclosure may further include the following steps: performing a packing step to pack the electronic component collection. It should be noted that in practice, a plurality of electronic components 20 and a plurality of pads 30 may be stacked alternately to form an electronic component collection 10, and then the entire electronic component collection may be moved into a container to perform this packing step; or a plurality of electronic components and a plurality of pads may be placed and stacked alternately in a container in sequence, and when the container is filled with electronic components and pads, this packing step is completed. Of course, this packing step may further include adding a cover to the container. It should be noted that the above packing steps are only examples, and the present disclosure is not limited thereto.

[0042] In summary, the electronic component assembly method disclosed herein includes the following steps: taking a first electronic component; taking a pad and placing the pad on the first electronic component; and taking a second electronic component and placing the second electronic component on the pad, wherein the pad includes a body and at least one tangent line, the body having a first surface and a second surface arranged relative to the first surface, the first surface being adjacent to the first electronic component, the second surface being adjacent to the second electronic component, the tangent line being formed on the body and extending along a first direction parallel to the first surface, and the tangent line extending from the first surface to the second surface along a second direction perpendicular to the first surface to penetrate the body. By forming a tangent line on the pad, after preparing an electronic component assembly using the electronic component assembly method disclosed herein, and supplying the electronic component assembly to downstream manufacturers for subsequent electronic device manufacturing, the phenomenon of moiré on the electronic components can be avoided without affecting the automated operation of manufacturing the electronic devices.

[0043] Please refer to Figure 10 As shown, Figure 10 Flowchart of a method for manufacturing an electronic device according to an embodiment of the present disclosure.

[0044] like Figure 10 As shown, the manufacturing method of the electronic device disclosed in the present invention includes the following steps: taking out a pad from an electronic component set (step S11), wherein the electronic component set can be, for example, but not limited to, the aforementioned electronic component set 10, and the pad can be, for example, but not limited to, the aforementioned pad 30; taking out one of a plurality of electronic components from the electronic component set (step S12), wherein the electronic component can be, for example, but not limited to, the aforementioned electronic component 20; and forming an electronic device using the taken out electronic component (step S13).

[0045] In this embodiment, the pad includes a body and at least one tangent line. The body has a first surface and a second surface disposed relative to the first surface. The first surface is adjacent to one of two adjacent electronic components, and the second surface is adjacent to the other of the two adjacent electronic components. The tangent line is formed in the body and extends along a first direction parallel to the first surface. The tangent line also extends from the first surface to the second surface along a second direction perpendicular to the first surface to penetrate the body. In this embodiment, since the pad has at least one tangent line, when performing step S11 to remove the pad, the pad can be removed smoothly and the pad can be prevented from sticking to the electronic component. It should be noted that the electronic component assembly, each electronic component, and each pad described in this embodiment can refer to the description of the electronic component assembly 10, electronic component 20, and pad 30 of the aforementioned embodiment, and therefore will not be repeated here.

[0046] Furthermore, in the electronic device manufacturing method of the present disclosure, the electronic device formed in step S13 may be, for example, but not limited to, a liquid crystal display device, and the electronic component may be, for example, but not limited to, a semi-finished liquid crystal panel. In this case, step S13 may include assembling the semi-finished liquid crystal panel (electronic component) and a backlight module in a housing or frame to form the liquid crystal display device (electronic device). It should be noted that the above description is merely an example and the present disclosure is not limited thereto.

[0047] In summary, the manufacturing method of the electronic device disclosed herein includes the following steps: removing a pad from an electronic component collection; removing one of a plurality of electronic components from the electronic component collection; and forming an electronic device using the removed electronic component; wherein the pad includes a body and at least one tangent line, the body having a first surface and a second surface disposed relative to the first surface, the first surface being adjacent to one of two adjacent electronic components, the second surface being adjacent to the other of the two adjacent electronic components, the tangent line being formed on the body and extending along a first direction parallel to the first surface, and the tangent line extending from the first surface to the second surface along a second direction perpendicular to the first surface to penetrate the body. By forming a tangent line on the pad, the phenomenon of moiré on the electronic component can be avoided during the process of preparing the electronic device using the manufacturing method of the electronic device disclosed herein, while at the same time not affecting the automated operation of manufacturing the electronic device.

[0048] The above description is for illustrative purposes only and is not intended to be limiting. Any equivalent modifications or variations that do not depart from the spirit and scope of the present invention should be included in the appended claims.

Claims

1. An electronic component set, characterized in that: Include: a plurality of electronic components; and At least one pad is disposed between two adjacent ones of the plurality of electronic components; Wherein, the at least one liner comprises: a body having a first surface and a second surface disposed opposite to the first surface, wherein the first surface is adjacent to one of the two adjacent electronic components, and the second surface is adjacent to the other of the two adjacent electronic components, and At least one tangent line is formed on the body and extends along a first direction parallel to the first surface, wherein the at least one tangent line extends from the first surface to the second surface along a second direction to penetrate the body.

2. The electronic component assembly according to claim 1, wherein: In a third direction perpendicular to the first direction and the second direction, a width of the at least one cut line is between 0.1 mm and 1 mm.

3. The electronic component assembly according to claim 1, wherein: In the first direction, the length of the at least one tangent line is 40-80% of the length of the body.

4. The electronic component assembly according to claim 1, wherein: In the first direction, the at least one tangent line has a first distance from an edge of the body, and the first distance is 10-30% of the length of the body.

5. The electronic component assembly according to claim 2, wherein: In the third direction, the at least one tangent line has a second distance from an edge of the body, and the second distance is 10-30% of the length of the body.

6. The electronic component assembly according to claim 1, wherein: The at least one tangent line includes at least two line segments and at least one interval disposed between the at least two line segments.

7. The electronic component assembly according to claim 6, wherein: The ratio of the total length of the plurality of line segments to the total length of the plurality of intervals is 1-2.

8. The electronic component assembly according to claim 1, wherein: The material of the body is foam material.

9. A method for assembling electronic components, characterized in that: Include: Taking a first electronic component; Taking a pad and placing the pad on the first electronic component; and Taking a second electronic component and placing the second electronic component on the pad; The liner comprises: a body having a first surface and a second surface disposed opposite to the first surface, wherein the first surface is adjacent to the first electronic component and the second surface is adjacent to the second electronic component, and At least one tangent line is formed on the body and extends along a first direction parallel to the first surface, wherein the at least one tangent line extends from the first surface to the second surface along a second direction to penetrate the body.

10. A method for manufacturing an electronic device, in conjunction with an electronic component assembly, characterized in that: The electronic component set includes: a plurality of electronic components; and At least one pad is disposed between two adjacent ones of the plurality of electronic components; Wherein, the at least one liner comprises: a body having a first surface and a second surface disposed opposite to the first surface, wherein the first surface is adjacent to one of the two adjacent electronic components, and the second surface is adjacent to the other of the two adjacent electronic components, and At least one tangent line formed on the body and extending along a first direction parallel to the first surface, wherein the at least one tangent line extends from the first surface to the second surface along a second direction to penetrate the body; The manufacturing method of the electronic device comprises: removing the pad from the electronic component assembly; Retrieving one of the plurality of electronic components from the electronic component set; and An electronic device is formed by utilizing the removed electronic component.

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