Water cooling plate assembly

Abstract

The invention discloses a water cooling plate assembly which is used for being in thermal contact with a plurality of heat sources. The water cooling plate assembly comprises a first heat dissipation fin, a second heat dissipation fin and a separation sheet. The first heat dissipation fin comprises a first base part and a plurality of first fin parts. The first base part is provided with a first thermal contact surface and a first back surface; the first thermal contact surface is used for thermally contacting a heat source. The first back surface faces away from the first thermal contact surface. The plurality of first fin parts protrude out of the first back surface of the first base part. The second heat dissipation fin comprises a second base part and a plurality of second fin parts. The second base part is provided with a second thermal contact surface and a second back surface; the second thermal contact surface is used for thermally contacting another heat source. The second back face faces away from the second thermal contact face. The second back surface and the first back surface are disposed facing each other. The plurality of second fin parts protrude out of the second back surface of the second base part. The separator connects the sides of the plurality of first fin portions away from the first base portion and the sides of the plurality of second fin portions away from the second base portion.

Description

Technical Field

[0001] The present invention relates to a water cooling plate assembly, in particular to a water cooling plate assembly comprising a separator. Background Art

[0002] With the rapid development of technology, computers have become an indispensable necessity in people's lives. As the processing speed and performance of electronic devices such as graphics cards and processors in computers continue to increase, they generate a large amount of heat during operation. This can cause electronic devices to overheat, resulting in reduced performance and even damage due to the continued temperature increase.

[0003] To improve the heat dissipation of electronic devices, water cooling systems are commonly used to dissipate heat from electronic components. Existing water cooling systems primarily consist of a water-cooling block, a radiator, and a pump. The radiator contains fins. Changing the shape or increasing the size of these fins can increase the heat exchange surface area and improve the cooling efficiency of the water cooling system. However, larger fins are prone to deformation during manufacturing, resulting in weaker product structures or poorer performance. Therefore, improving the manufacturing yield of fins while maintaining good heat dissipation efficiency has become a challenge for researchers in this field. Summary of the Invention

[0004] The present invention provides a water cooling plate assembly to improve the manufacturing yield of heat dissipation fins while maintaining good heat dissipation efficiency.

[0005] A water-cooled plate assembly disclosed in one embodiment of the present invention is used for thermally contacting multiple heat sources. The water-cooled plate assembly includes a first heat dissipation fin, a second heat dissipation fin, and a separator. The first heat dissipation fin includes a first base and a plurality of first fin portions. The first base has a first thermal contact surface and a first back surface. The first thermal contact surface is used for thermally contacting one of the heat sources. The first back surface faces away from the first thermal contact surface. The plurality of first fin portions protrude from the first back surface of the first base. The second heat dissipation fin includes a second base and a plurality of second fin portions. The second base has a second thermal contact surface and a second back surface. The second thermal contact surface is used for thermally contacting another heat source. The second back surface faces away from the second thermal contact surface. The second back surface and the first back surface are arranged facing each other. The plurality of second fin portions protrude from the second back surface of the second base. The separator connects the side of the plurality of first fin portions away from the first base and the side of the plurality of second fin portions away from the second base.

[0006] The above-mentioned water-cooling plate assembly, wherein the first heat dissipating fin further includes two outer wall portions, which are located on opposite sides of the first base portion, protrude from the first back side of the first base portion, and are connected to the second back side of the second base portion of the second heat dissipating fin.

[0007] In the above-mentioned water-cooling plate assembly, the first fin portions are arranged parallel to the two outer wall portions and form a first cooling channel between any two first fin portions, the second fin portions are arranged parallel to the two outer wall portions and form a second cooling channel between any two second fin portions, and the first cooling channel and the second cooling channel are disconnected from each other by the separator.

[0008] In the above-mentioned water-cooling plate assembly, the first cooling channel and the second cooling channel are used for a cooling fluid to flow.

[0009] In the above-mentioned water-cooling plate assembly, the two opposite sides of the separator are respectively connected to the first fin portions and the second fin portions by welding.

[0010] In the above-mentioned water-cooling plate assembly, each first fin portion has a first bending portion, and each second fin portion has a second bending portion, and opposite sides of the separator are respectively connected to the first bending portions and the second bending portions by welding.

[0011] In the above-mentioned water-cooling plate assembly, the two outer wall portions of the first heat dissipating fins are joined to the second base portion of the second heat dissipating fins by welding.

[0012] In the above-mentioned water-cooling plate assembly, the first fin portions and the second fin portions are skived fins.

[0013] In the above-mentioned water-cooling plate assembly, the separator is made of copper.

[0014] In the above-mentioned water-cooling plate assembly, the first fin portions and the first base portion are integrally formed, and the second fin portions and the second base portion are integrally formed.

[0015] According to the above-described embodiment, the water-cooling plate assembly connects the multiple first fin sections and the multiple second fin sections, each of which is shorter, via a separator. This prevents deformation of the fins during manufacturing due to their larger size. Furthermore, the first and second thermal contact surfaces can be exposed to a heat source separately, allowing heat to be dissipated simultaneously on opposite sides of the water-cooling plate assembly, thereby enhancing the heat dissipation capacity of the water-cooling system.

[0016] The above description of the content of the present invention and the following description of the embodiments are used to demonstrate and explain the principles of the present invention, and to provide further explanation of the scope of the patent application of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 FIG. 4 is a perspective view of a water cooling plate assembly according to an embodiment of the present invention.

[0018] Figure 2 for Figure 1Exploded diagram of .

[0019] Figure 3 for Figure 1 Floor plan.

[0020] Figure 4 for Figure 1 sectional view.

[0021] Figure 5 FIG. 1 is a plan view of a water-cooling plate assembly according to an embodiment of the present invention.

[0022] Wherein, the reference numerals:

[0023] 10: Water cooling plate assembly

[0024] 100: First heat sink fin

[0025] 110: First base

[0026] 111: first thermal contact surface

[0027] 112: First back

[0028] 120: first fin portion

[0029] 121: first bending portion

[0030] 130:Exterior wall

[0031] 200: Second heat sink fin

[0032] 210: Second base

[0033] 211: Second thermal contact surface

[0034] 212: Second back

[0035] 220: Second fin portion

[0036] 221: Second bending portion

[0037] 300: Separator

[0038] D1, D2: direction

[0039] F: Cooling fluid

[0040] S1: first cooling channel

[0041] S2: Second cooling channel DETAILED DESCRIPTION

[0042] See also Figures 1 to 3 . Figure 1 FIG. 1 is a plan view of a water-cooling plate assembly 10 according to an embodiment of the present invention. Figure 2 for Figure 1 Stereoscopic image. Figure 3 for Figure 1 In this embodiment, the water-cooling plate assembly 10 is used to thermally contact multiple heat sources (not shown). The water-cooling plate assembly 10 includes a first heat dissipation fin 100, a second heat dissipation fin 200, and a separator 300.

[0043] In this embodiment, the first heat sink 100 includes a first base 110 and a plurality of first fin portions 120. The first base 110 has a first thermal contact surface 111 and a first back surface 112. The first thermal contact surface 111 is used for thermally contacting a heat source (not shown). The first back surface 112 faces away from the first thermal contact surface 111. The plurality of first fin portions 120 protrude from the first back surface 112 of the first base 110. The second heat sink 200 includes a second base 210 and a plurality of second fin portions 220. The second base has a second thermal contact surface 211 and a second back surface 212. The second thermal contact surface 211 is used for thermally contacting a heat source (not shown). The second back surface 212 faces away from the second thermal contact surface 211. The second back surface 212 and the first back surface 112 are arranged facing each other. The plurality of second fin portions 220 protrude from the second back surface 212 of the second base 210.

[0044] In this embodiment, the plurality of first fin portions 120 and the plurality of second fin portions 220 may be, for example, skived fins, i.e., the first fin portion 120 and the first base portion 110 are integrally formed, and the second fin portion 220 and the second base portion 210 are also integrally formed, but the present invention is not limited thereto. In other embodiments, the fin portions may also be bonded fins or aluminum extruded fins.

[0045] In this embodiment, one side of the separator 300 is welded to the side of the plurality of first fins 120 away from the first base 110, for example, and the other side of the separator 300 is welded to the side of the plurality of second fins 220 away from the second base 210, for example. This prevents the fins from being easily deformed during the manufacturing process due to being too large. The separator 300 is made of a metal such as copper, for example.

[0046] In this embodiment, the first heat dissipation fin 100 may further include two outer wall portions 130, which are located on opposite sides of the first base 110, protrude from the first back side 112 of the first base 110, and are joined to the second back side 212 of the second base 210, for example, by welding.

[0047] In this embodiment, the plurality of first fins 120 are arranged parallel to the two outer wall portions 130, and a first cooling channel S1 is formed between any two first fins 120. Similarly, the plurality of second fins 220 are arranged parallel to the two outer wall portions 130, and a second cooling channel S2 is formed between any two second fins 220.

[0048] In this embodiment, the first cooling channel S1 and the second cooling channel S2 are used to provide a cooling fluid F to flow, and the first cooling channel S1 and the second cooling channel S2 are disconnected from each other by the separator 300, so that the two heat sources (not drawn) in thermal contact with the first thermal contact surface 111 and the second thermal contact surface 211 can be cooled at the same time, thereby improving the heat dissipation capacity of the water-cooled plate assembly 10.

[0049] See also Figure 4 . Figure 4 for Figure 1 The cooling fluid F can flow into the first cooling channel S1 and the second cooling channel S2 simultaneously along directions D1 and D2, respectively, while dissipating heat from the heat source (not shown) in thermal contact with the first thermal contact surface 111 and the second thermal contact surface 211, thereby improving the heat dissipation capacity of the water-cooled plate assembly 10.

[0050] See also Figure 5 . Figure 5 Schematic diagram of a water-cooled plate assembly according to an embodiment of the present invention. In this embodiment, each first fin portion 120 has a first bending portion 121, and each second fin portion 220 has a second bending portion 221. The bending portion is located on the side of the fin portion away from the base. One side of the separator 300 is connected to the plurality of first bending portions 121, for example, by welding, and the other side of the separator 300 is connected to the plurality of second bending portions 221, for example, by welding. The contact area between the fin portion and the separator 300 is increased by the bending portion, and the welding strength between the fin and the separator 300 is improved, thereby avoiding deformation or cold welding of the fin during the manufacturing process, which may lead to a weak structure or poor performance.

[0051] The water-cooling plate assembly of the above embodiment connects the multiple first fin sections and the multiple second fin sections, each of which is shorter, via a separator. This prevents deformation of the fins during manufacturing due to oversizing. Furthermore, the first and second thermal contact surfaces can be exposed to a heat source separately, allowing heat to be dissipated simultaneously on opposite sides of the water-cooling plate assembly, thereby enhancing the heat dissipation capacity of the water-cooling system.

[0052] Although the present invention is disclosed above with reference to the aforementioned embodiments, they are not intended to limit the present invention. Any person skilled in the art may make slight changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be determined by the scope of protection of the appended claims.

Claims

1. A water-cooled plate assembly, characterized in that: For thermal contact with multiple heat sources, including: A first heat sink fin, comprising: a first base having a first thermal contact surface and a first back surface, wherein the first thermal contact surface is used for thermally contacting one of the heat sources, and the first back surface faces away from the first thermal contact surface; and a plurality of first fin portions, the first fin portions protruding from the first back surface of the first base; a second heat dissipation fin, comprising: a second base having a second thermal contact surface and a second back surface, wherein the second thermal contact surface is used for thermally contacting another heat source, the second back surface faces away from the second thermal contact surface, and the second back surface and the first back surface are disposed facing each other; and a plurality of second fin portions, the second fin portions protruding from the second back surface of the second base portion; and A separator connects a side of the first fin portions away from the first base portion and a side of the second fin portions away from the second base portion.

2. The water-cooling plate assembly according to claim 1, wherein: The first heat dissipation fin further includes two outer wall portions, which are located on opposite sides of the first base portion, protrude from the first back surface of the first base portion, and are connected to the second back surface of the second base portion of the second heat dissipation fin.

3. The water-cooling plate assembly according to claim 2, wherein: The first fin portions are arranged in parallel with the two outer wall portions and form a first cooling channel between any two first fin portions. The second fin portions are arranged in parallel with the two outer wall portions and form a second cooling channel between any two second fin portions. The first cooling channel and the second cooling channel are not connected to each other through the separator.

4. The water-cooling plate assembly according to claim 3, wherein: The first cooling channel and the second cooling channel are used for a cooling fluid to flow.

5. The water-cooling plate assembly according to claim 1, wherein: The opposite sides of the separator are respectively connected to the first fin parts and the second fin parts by welding.

6. The water-cooling plate assembly according to claim 1, wherein: Each first fin portion has a first bending portion, and each second fin portion has a second bending portion. The first bending portions and the second bending portions are respectively connected to each other at opposite sides of the separator by welding.

7. The water-cooling plate assembly according to claim 2, wherein: The two outer wall portions of the first heat dissipation fin are joined to the second base portion of the second heat dissipation fin by welding.

8. The water-cooling plate assembly according to claim 1, wherein: The first fin portions and the second fin portions are skived fins.

9. The water-cooling plate assembly according to claim 1, wherein: The separator is made of copper.

10. The water-cooling plate assembly according to claim 1, wherein: The first fin portions and the first base portion are integrally formed, and the second fin portions and the second base portion are integrally formed.

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