Electronic paste and preparation method and application thereof

Abstract

The invention belongs to the technical field of electronic materials, and provides electronic paste and a preparation method and application thereof. The preparation method comprises the following steps: mixing metal powder with an organic carrier and glass powder to form an electronic paste precursor; and decompressing and defoaming the electronic paste precursor. The invention also discloses the electronic paste prepared according to the method, and application of the electronic paste in circuit conduction, circuit connection and packaging. According to the invention, the glass powder is introduced as a binder, so that the adhesive force and sintering activity of the electronic paste are improved; meanwhile, the organic matter content is reduced, and the comprehensive performance of the electronic paste is improved. The preparation method is simple, convenient and suitable for large-scale production.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic materials, and in particular to an electronic paste and a preparation method and application thereof. Background Art

[0002] As a key material in electronic device manufacturing, electronic pastes are primarily used to achieve functions such as electrical conductivity, connection, and packaging in circuits. They are widely used in a wide range of fields, including photovoltaic cells, electronic components, display technology, and flexible electronics. To meet these functional requirements, electronic pastes must possess excellent fluidity to ensure uniform printing or coating. Furthermore, after calcination, they must form a dense structure and maintain firm adhesion to the substrate to prevent detachment.

[0003] However, the current electronic paste preparation process has problems such as complex sintering process, poor sintering activity of organic additives, excessive organic additives, incomplete debinding, etc., resulting in poor density and adhesion of the electronic paste, making it difficult to fully meet the performance requirements of the circuit in terms of conductivity, connection and packaging. Summary of the Invention

[0004] The present disclosure provides an electronic paste and a preparation method and application thereof, to at least solve the above technical problems existing in the prior art.

[0005] According to a first aspect of the present disclosure, a method for preparing an electronic paste is provided, comprising the following steps:

[0006] The metal powder is mixed with an organic carrier and glass powder to form an electronic paste precursor; the electronic paste precursor is decompressed and degassed to obtain the electronic paste.

[0007] In one embodiment, in the electronic paste, the content of the metal powder is 30-50 wt %, the content of the organic vehicle is 30-70 wt %, and the content of the glass powder is 5-20 wt %.

[0008] In one embodiment, the metal powder is selected from at least one of copper powder, silver powder, nickel powder, gold powder, platinum powder, and aluminum powder.

[0009] In one embodiment, the organic carrier is selected from at least one of methyl methacrylate, dibutyl phthalate, p-xylene, terpineol, diethylene glycol butyl ether, diethylene glycol ethyl ether acetate, lauryl ester, tributyl citrate, methacrylic acid, isopropyl alcohol, ethylene glycol, glycerol, n-butanol, ethyl cellulose, polyvinyl alcohol, and polyvinyl butyral.

[0010] In one embodiment, the glass powder is selected from at least one of SiO2, CaO, SrO, BaO, MgO, ZnO, Al2O3, Fe2O3, ZrO2, Mn3O4, Co3O4, Nb2O5, MoO3, Y2O3, and La2O3.

[0011] In one embodiment, the metal powder, the organic carrier, and the glass powder are placed in a homogenizer for mixing, and then placed in a three-roll mill for grinding and rolling to form the electronic paste precursor.

[0012] Specifically, the pressure of the homogenizer is 0.1-1 MPa, and the rotation speed is 1000-10000 r / min.

[0013] Specifically, the rotation speed of the three-roll mill is 10 to 200 r / min, and the rolling is performed 2 to 10 times.

[0014] According to a second aspect of the present disclosure, an electronic paste prepared according to the above preparation method is provided.

[0015] According to a third aspect of the present disclosure, there is provided application of the electronic paste in circuit conduction, circuit connection, and packaging.

[0016] According to an embodiment of the present disclosure, there are at least the following beneficial effects:

[0017] The present invention improves the adhesion and sintering activity of electronic paste by introducing glass powder as a binder, while reducing the organic matter content and improving the overall performance of electronic paste. The preparation method of the present invention is simple and suitable for large-scale production.

[0018] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present disclosure, nor are they intended to limit the scope of the present disclosure. Other features of the present disclosure will become readily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The above and other objects, features and advantages of the exemplary embodiments of the present disclosure will become readily understood by reading the detailed description below with reference to the accompanying drawings, in which several embodiments of the present disclosure are shown by way of example and not limitation, wherein:

[0020] In the drawings, the same or corresponding reference numerals denote the same or corresponding parts.

[0021] Figure 1 shows a surface scanning electron micrograph of a thin film made of the electronic paste in Example 1 of the present disclosure;

[0022] Figure 2shows a cross-sectional scanning electron micrograph of a thin film made of the electronic paste in Example 1 of the present disclosure;

[0023] Figure 3 shows a surface scanning electron micrograph of a thin film made from the electronic paste in Example 4 of the present disclosure;

[0024] Figure 4 A scanning electron micrograph of a cross section of a thin film made from the electronic paste in Example 4 of the present disclosure is shown. DETAILED DESCRIPTION

[0025] To make the purposes, features, and advantages of the present disclosure more apparent and understandable, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present disclosure, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present disclosure without creative work shall fall within the scope of protection of the present disclosure.

[0026] Example 1

[0027] This embodiment prepares an electronic paste, and the specific process is as follows:

[0028] (1) The metal powder is copper powder;

[0029] Organic vehicle: methyl methacrylate 65wt%, diethylene glycol ethyl ether acetate 30wt%, ethyl cellulose 5wt%;

[0030] Glass powder: 55wt% SrO, 40wt% SiO2, 5wt% Al2O3.

[0031] (2) The metal powder in step (1) is mixed with the organic carrier and the glass powder in a mass ratio of 30:60:10 in a homogenizer. The pressure during the homogenization process is 0.2 MPa and the rotation speed is 5000 r / min. The mixture is then ground in a three-roll mill at a rotation speed of 100 r / min and rolled 5 times to form an electronic paste precursor.

[0032] (3) After the electronic paste precursor is decompressed and degassed, the electronic paste is obtained.

[0033] Scanning electron micrographs of the surface and cross section of the film made of the above-mentioned electronic paste are shown in FIG. Figure 1 and Figure 2 As shown, it can be seen that the structure is relatively dense and the adhesion is firm, indicating that the electronic paste prepared by the method disclosed in the present invention has high sintering activity and adhesion.

[0034] Example 2

[0035] This embodiment prepares an electronic paste, and the specific process is as follows:

[0036] (1) The metal powder is copper powder;

[0037] Organic carrier: terpineol 70wt%, n-butanol 20wt%, polyvinyl butyral 10wt%;

[0038] Glass powder: 25wt% SrO, 25wt% CaO, 50wt% SiO2.

[0039] (2) The metal powder in step (1) is mixed with the organic carrier and the glass powder in a homogenizer at a mass ratio of 40:50:10. The pressure during the homogenization process is 0.1 MPa and the rotation speed is 2000 r / min. The metal powder is then placed in a three-roll mill for grinding at a rotation speed of 150 r / min and rolled twice to form an electronic paste precursor.

[0040] (3) After the electronic paste precursor is decompressed and degassed, the electronic paste is obtained.

[0041] Example 3

[0042] This embodiment prepares an electronic paste, and the specific process is as follows:

[0043] (1) The metal powder is silver powder;

[0044] Organic vehicle: methacrylic acid 35wt%, dibutyl phthalate 30wt%, isopropyl alcohol 20wt%, glycerol 10wt%, polyvinyl alcohol 5wt%;

[0045] Glass powder: 45wt% BaO, 35wt% SiO2, 5wt% ZnO, 10wt% Y2O3, 5wt% La2O3.

[0046] (2) The metal powder in step (1) is mixed with the organic carrier and the glass powder in a homogenizer at a mass ratio of 40:45:15. The pressure during the homogenization process is 0.5 MPa and the rotation speed is 1000 r / min. The metal powder is then placed in a three-roll mill for grinding at a rotation speed of 10 r / min and rolled 10 times to form an electronic paste precursor.

[0047] (3) After the electronic paste precursor is decompressed and degassed, the electronic paste is obtained.

[0048] Example 4

[0049] This embodiment prepares an electronic paste, and the specific process is as follows:

[0050] (1) The metal powder is nickel powder;

[0051] Organic carrier: 35wt% of diethylene glycol butyl ether, 25wt% of diethylene glycol ethyl ether acetate, 20wt% of n-butanol, 15wt% of dodecyl ester, and 5wt% of p-xylene;

[0052] Glass powder: 25wt% BaO, 10wt% CaO, 40wt% SiO2, 5wt% Fe2O3, 5wt% ZrO2, 5wt% Nb2O5, 10wt% MoO3.

[0053] (2) The metal powder in step (1) is mixed with the organic carrier and the glass powder in a homogenizer at a mass ratio of 35:55:10. The pressure during the homogenization process is 1 MPa and the rotation speed is 10,000 r / min. The mixture is then ground in a three-roll mill at a rotation speed of 200 r / min and rolled 10 times to form an electronic paste precursor.

[0054] (3) After the electronic paste precursor is decompressed and degassed, the electronic paste is obtained.

[0055] Scanning electron micrographs of the surface and cross section of the film made of the above-mentioned electronic paste are shown in FIG. Figure 3 and Figure 4 As shown, it can be seen that the structure is relatively dense and the adhesion is firm, indicating that the electronic paste prepared by the method disclosed in the present invention has high sintering activity and adhesion.

[0056] It should be understood that the various forms of processes shown above can be used to reorder, add, or delete steps. For example, the steps described in this disclosure can be performed in parallel, sequentially, or in a different order, as long as the desired results of the technical solutions of this disclosure can be achieved, and this document is not limited here.

[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0058] The above description is merely a specific embodiment of the present disclosure, but the scope of protection of the present disclosure is not limited thereto. Any changes or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in this disclosure should be included in the scope of protection of the present disclosure. Therefore, the scope of protection of the present disclosure should be based on the scope of protection of the claims.

Claims

1. A method for preparing an electronic paste, characterized in that: The following steps are involved: The metal powder is mixed with an organic carrier and glass powder to form an electronic paste precursor; the electronic paste precursor is decompressed and degassed to obtain the electronic paste.

2. The preparation method according to claim 1, characterized in that In the electronic paste, the content of the metal powder is 30-50 wt %, the content of the organic vehicle is 30-70 wt %, and the content of the glass powder is 5-20 wt %.

3. The preparation method according to claim 1, characterized in that The metal powder is selected from at least one of copper powder, silver powder, nickel powder, gold powder, platinum powder and aluminum powder.

4. The preparation method according to claim 1, characterized in that The organic carrier is selected from at least one of methyl methacrylate, dibutyl phthalate, p-xylene, terpineol, diethylene glycol butyl ether, diethylene glycol ethyl ether acetate, lauryl ester, tributyl citrate, methacrylic acid, isopropyl alcohol, ethylene glycol, glycerol, n-butanol, ethyl cellulose, polyvinyl alcohol, and polyvinyl butyral.

5. The preparation method according to claim 1, characterized in that The glass powder is selected from at least one of SiO2, CaO, SrO, BaO, MgO, ZnO, Al2O3, Fe2O3, ZrO2, Mn3O4, Co3O4, Nb2O5, MoO3, Y2O3, and La2O3.

6. The preparation method according to claim 1, characterized in that The metal powder, the organic carrier and the glass powder are placed in a homogenizer for mixing, and then placed in a three-roll mill for grinding and rolling to form the electronic paste precursor.

7. The preparation method according to claim 6, characterized in that The pressure of the homogenizer is 0.1-1 MPa, and the rotation speed is 1000-10000 r / min.

8. The preparation method according to claim 6, characterized in that The three-roll mill has a rotation speed of 10 to 200 r / min and performs rolling 2 to 10 times.

9. The electronic paste prepared according to any one of claims 1 to 8.

10. Use of the electronic paste according to claim 9 in circuit conduction, circuit connection and packaging.

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