Packaging module

Abstract

The invention provides a packaging module. The packaging module comprises a substrate, an electronic component structure and a tube body, the substrate is provided with a first surface and a second surface which are opposite to each other, the substrate is provided with a through hole, and the through hole penetrates from the first surface to the second surface. The electronic component structure is arranged on the first surface of the substrate and is aligned with the through hole, and the electronic component structure comprises a carrier plate and an electronic component. The electronic component is connected to the carrier plate. The tube body is arranged on the second surface of the substrate and communicated with the through hole. The pipe body is provided with two wide pipe parts and a narrow pipe part, the narrow pipe part is located between the two wide pipe parts, and the through hole of the base plate is communicated with the narrow pipe part. Therefore, heat generated by the electronic component structure can be discharged through the pipe body, and a good heat dissipation effect is achieved.

Description

Technical Field

[0001] The present disclosure relates to a packaging module, and more particularly to a packaging module capable of improving heat dissipation effect. Background Art

[0002] Existing server equipment often uses a plug-in card structure, placing multiple computing modules side by side and using fans to achieve heat dissipation. The airflow generated by the fans flows through the gaps between the computing modules, dissipating the heat generated by the modules. However, due to the continuous increase in computing demand, the module density and power consumption within existing server equipment are also increasing, making the above-mentioned cooling methods gradually inadequate.

[0003] Please refer to Figure 10 , Figure 10 It is a partial cross-sectional diagram of an existing server device. The existing server device may include operation modules 900a and 900b. Taking the operation module 900a as an example, the operation module 900a may include a substrate 910, an electronic component structure 920 and a heat dissipation element 930. The substrate 910 has a heat conductive member 911, and the electronic component structure 920 includes a carrier 921 and an electronic component 922, and the electronic component 922 is connected to the carrier 921. The carrier 921 and the heat dissipation element 930 can be connected to the heat conductive member 911 by welding, respectively, so that the heat H generated by the electronic component 922 passes through the carrier 921 and along the heat conductive member 911 to the heat dissipation element 930, and is finally discharged through the airflow generated by the fan A. By Figure 10 It can be seen that the heat dissipation path of the existing server equipment is long, and if the arrangement density of the computing modules 900a and 900b is increased, it will make it difficult for airflow to pass through, thereby reducing the heat dissipation efficiency and affecting the computing performance.

[0004] In view of this, how to improve the heat dissipation effect inside server equipment has become the goal of relevant industry players. Summary of the Invention

[0005] One embodiment of the present disclosure provides a packaging module comprising a substrate, an electronic component structure, and a tube body. The substrate has a first surface and a second surface opposite to each other, and the substrate has a through hole, and the through hole extends from the first surface to the second surface. The electronic component structure is arranged on the first surface of the substrate and is opposite to the through hole, and the electronic component structure includes a carrier and an electronic component. The electronic component is connected to the carrier. The tube body is arranged on the second surface of the substrate and is connected to the through hole. The tube body has two wide tube portions and a narrow tube portion, the narrow tube portion is located between the two wide tube portions, and the through hole of the substrate is connected to the narrow tube portion.

[0006] Another embodiment of the present disclosure provides a packaging module comprising a substrate, an electronic component structure, a first tube body, and a second tube body. The substrate has a first surface and a second surface opposite to each other, and the substrate has a through hole, and the through hole extends from the first surface to the second surface. The electronic component structure is arranged on the first surface of the substrate and is aligned with the through hole, and the electronic component structure includes a carrier and an electronic component. The electronic component is connected to the carrier. The first tube body is arranged on the second surface of the substrate and has a necking portion. The second tube body is arranged on the second surface of the substrate, the second tube body is sleeved on the necking portion of the first tube body, and the second tube body is connected to the through hole.

[0007] Accordingly, the packaging module disclosed herein is provided with a tube body having a variable diameter. When the fluid passes through, a pressure difference is generated, thereby sucking the external gas and heat into the tube body, so that the heat is discharged along with the fluid, achieving a good heat dissipation effect, which is conducive to the application of the packaging module in server equipment with high computing requirements or high module density. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 is a cross-sectional schematic diagram of a packaging module according to the first embodiment of the present disclosure;

[0009] Figure 2 for Figure 1 A bottom view schematic diagram of a package module;

[0010] Figure 3 for Figure 1 A schematic side view of a packaging module;

[0011] Figure 4 is a cross-sectional schematic diagram of a packaging module according to a second embodiment of the present disclosure;

[0012] Figure 5 for Figure 4 A bottom view schematic diagram of a package module;

[0013] Figure 6 for Figure 4 A schematic side view of a packaging module;

[0014] Figure 7 is a cross-sectional schematic diagram of a packaging module according to a third embodiment of the present disclosure;

[0015] Figure 8 for Figure 7 A bottom view schematic diagram of a package module;

[0016] Figure 9 for Figure 7 A schematic side view of a package module; and

[0017] Figure 10 It is a partial cross-sectional schematic diagram of existing server equipment.

[0018] The description of the accompanying drawings is as follows:

[0019] 100, 200, 300: Encapsulated modules

[0020] 110,210,310,910: Substrate

[0021] 110a, 210a, 310a: first surface

[0022] 110b, 210b, 310b: second surface

[0023] 111, 211, 311: through holes

[0024] 120, 220, 320, 920: electronic component structure

[0025] 121,921: Carrier board

[0026] 122,922: Electronic components

[0027] 130,230: Tube body

[0028] 131,133,231,233: wide tube

[0029] 132,232: Narrow tube

[0030] 134,234,350: connecting pipe

[0031] 230a: fitting surface

[0032] 330: First tube body

[0033] 331: Neck section

[0034] 340: Second tube body

[0035] 900a, 900b: computing module

[0036] 911: Thermal Conductors

[0037] 930: cooling element

[0038] H: Heat

[0039] A: Fan

[0040] G: Gap distance

[0041] F: Fluid

[0042] D1: First diameter

[0043] D2: Second diameter

[0044] D3: third diameter

[0045] D4: fourth diameter DETAILED DESCRIPTION

[0046] Please refer to Figure 1 , Figure 1 FIG1 is a cross-sectional view of a packaging module 100 according to a first embodiment of the present disclosure. The packaging module 100 includes a substrate 110 , an electronic device structure 120 , and a tube 130 . The electronic device structure 120 and the tube 130 are disposed on the substrate 110 .

[0047] Specifically, the substrate 110 has a first surface 110a and a second surface 110b opposite each other. The substrate 110 has a through hole 111 extending from the first surface 110a to the second surface 110b. The first surface 110a of the substrate 110 is used for mounting electronic components, while the second surface 110b is used for mounting heat dissipation components. The provision of the through hole 111 facilitates the transfer of heat generated by the electronic components 122 on the first surface 110a of the substrate 110 during operation to the second surface 110b. Heat is then dissipated through the second surface 110b, thereby reducing heat accumulation on the first surface 110a of the substrate 110.

[0048] An electronic component structure 120 is disposed on the first surface 110a of the substrate 110 and aligned with the through-hole 111. The electronic component structure 120 includes a carrier 121 and an electronic component 122, and the electronic component 122 is connected to the carrier 121. For example, the electronic component 122 can be disposed on any surface of the carrier 121 using a ball grid array (BGA) package or a copper pillar array (CPA) package. The carrier 121 is soldered to the first surface 110a of the substrate 110 and aligned with the through-hole 111. A gap G is defined between the carrier 121 and the substrate 110, and the gap G can be in the range of 0.3 mm to 5.0 mm. This facilitates heat generated by the electronic component 122 to reach the through-hole 111 through the gap between the carrier 121 and the substrate 110, and then be transferred to the second surface 110b of the substrate 110 through the through-hole 111.

[0049] Please refer to Figure 2 and Figure 3 , Figure 2 for Figure 1 A bottom view of the packaging module 100 is shown. Figure 3 for Figure 1Schematic side view of the package module 100. The tube body 130 is disposed on the second surface 110b of the substrate 110 and is connected to the through-hole 111. The tube body 130 has two wide tube portions 131 and 133 and a narrow tube portion 132. The narrow tube portion 132 is located between the two wide tube portions 131 and 133, and is connected to the narrow tube portion 132 by the through-hole 111 of the substrate 110. The tube body 130 allows fluid F, such as liquid or gas, to pass through. When the fluid F flows through the narrow tube portion 132, the pressure inside the narrow tube portion 132 decreases due to the change in tube diameter, generating suction. The gas can be drawn into the tube body 130 through the through-hole 111 of the substrate 110. As a result, heat from the electronic component 122 is also drawn into the tube body 130 and discharged along with the fluid F, achieving a heat dissipation effect.

[0050] Furthermore, each wide tube portion 131 , 133 has a first diameter D1 , the narrow tube portion 132 has a second diameter D2 , and a ratio of the first diameter D1 to the second diameter D2 can be 2 to 4. This allows sufficient pressure variation to be generated inside the tube body 130 to achieve good heat dissipation.

[0051] The cross-section of the tube body 130 may be annular. The packaging module 100 may further include a connecting tube 134 disposed within the through-hole 111. The connecting tube 134 may connect to the narrow tube portion 132. Specifically, the wide tube portions 131, 133, and the narrow tube portion 132 of the tube body 130 may each be circular. A structure with a gradually decreasing or increasing diameter may be formed at the junction of the wide tube portions 131, 133 and the narrow tube portion 132, thereby facilitating smoother flow of the fluid F. Since the narrow tube portion 132 has a smaller diameter, a gap may exist between it and the substrate 110. Therefore, the connecting tube 134 may be provided to connect to the narrow tube portion 132, ensuring that airflow from the first surface 110a of the substrate 110 enters the tube body 130 via the connecting tube 134. It should be noted that when the cross-sectional shape of the tube body 130 is annular, the flow efficiency of the fluid F in the tube body 130 can be improved. In addition, the tube body 130 can also have other cross-sectional shapes, such as square or polygonal, to meet different usage conditions or installation environments while ensuring that the fluid F has sufficient flow efficiency. Therefore, the content of the present disclosure is not limited to the cross-sectional shape of the tube body 130.

[0052] Please refer to Figure 4 , Figure 4 FIG2 is a cross-sectional view of a packaging module 200 according to a second embodiment of the present disclosure. The packaging module 200 includes a substrate 210, an electronic component structure 220, and a tube 230. The substrate 210, electronic component structure 220, and tube 230 of the second embodiment are identical or similar to the substrate 110, electronic component structure 120, and tube 130 of the first embodiment, and the similarities are not further described here.

[0053] Please refer to Figure 5 and Figure 6 , Figure 5 for Figure 4 A bottom view of the packaging module 200 is shown. Figure 6 for Figure 4 Schematic side view of the packaging module 200. A cross-sectional shape of the tube body 230 of the second embodiment may be U-shaped, and the tube body 230 may have a bonding surface 230a connected to the second surface 210b of the substrate 210. Specifically, before being connected to the substrate 210, the tube body 230 may be a partially open U-shaped tube. The open side of the U-shaped tube is the bonding surface 230a, and the bonding surface 230a can be connected to the second surface 210b of the substrate 210 by welding. That is, the wide tube portions 231 and 233 and the narrow tube portion 232 of the tube body 230 can all be bonded to the second surface 210b of the substrate 210, so that the tube body 230 and the substrate 210 together form a complete channel.

[0054] Furthermore, the package module 200 may further include a connecting tube 234 disposed within the through-hole 211. The connecting tube 234 may connect to the narrow tube portion 232 to facilitate heat transfer from the first surface 210a of the substrate 210 into the tube body 230 and be discharged along with the fluid F. Alternatively, because the narrow tube portion 232 of the tube body 230 and the substrate 210 can be attached to each other without a gap, the through-hole 211 of the substrate 210 may directly connect to the narrow tube portion 232 to form a closed flow channel, thereby achieving a good heat dissipation effect without the connecting tube 234.

[0055] Please refer to Figure 7 , Figure 7 FIG3 is a cross-sectional schematic diagram of a packaging module 300 according to a third embodiment of the present disclosure. The packaging module 300 includes a substrate 310, an electronic component structure 320, a first tube 330, and a second tube 340. The substrate 310 and electronic component structure 320 of the third embodiment are identical or similar to the substrate 110 and electronic component structure 120 of the first embodiment, and the similarities are not further described here.

[0056] Please refer to Figure 8 and Figure 9 , Figure 8 for Figure 7 A bottom view of the packaging module 300 is shown. Figure 9 for Figure 7Schematic side view of the packaging module 300. The first tube 330 is disposed on the second surface 310b of the substrate 310 and has a constricted portion 331. The second tube 340 is disposed on the second surface 310b of the substrate 310. The second tube 340 is sleeved on the constricted portion 331 of the first tube 330, and the second tube 340 is connected to the through-hole 311. When the fluid F flows through the constricted portion 331 of the first tube 330, the pressure at the junction of the first tube 330 and the second tube 340 decreases due to the change in tube diameter, and suction is generated. Gas can be sucked into the second tube 340 through the through-hole 311 of the substrate 310, so heat is also sucked into the second tube 340 and discharged along with the fluid F to achieve a heat dissipation effect.

[0057] The constricted portion 331 may have a wide end (not numbered) and a narrow end (not numbered) opposite each other. The wide end has a third diameter D3, and the narrow end has a fourth diameter D4. The ratio of the third diameter D3 to the fourth diameter D4 may be 2 to 4. This allows sufficient pressure changes to be generated inside the first tube 330 and the second tube 340, thereby achieving good heat dissipation.

[0058] The tapered portion 331 of the first tube 330 can align with the through-hole 311. The package module 300 may further include a connecting tube 350 disposed within the through-hole 311. The connecting tube 350 can communicate with the second tube 340 to facilitate heat transfer from the first surface 310a of the substrate 310 to the second tube 340. Alternatively, because the diameter of the second tube 340 can remain consistent, the second tube 340 and the substrate 310 can be attached to each other without any gap. The through-hole 311 of the substrate 310 can directly communicate with the second tube 340, forming a closed flow channel. This can also achieve good heat dissipation without the connecting tube 350.

[0059] To sum up, the packaging module disclosed herein is provided with a tube body having a variable diameter. When the fluid passes through, a pressure difference is generated, thereby sucking the external gas and heat into the tube body, so that the heat is discharged along with the fluid, achieving a good heat dissipation effect, which is conducive to the application of the packaging module in server equipment with high computing requirements or high module density.

[0060] Although the present disclosure has been disclosed above in the form of embodiments, it is not intended to limit the present disclosure. Any person skilled in the art may make various changes and modifications without departing from the concept and scope of the present disclosure. Therefore, the scope of protection of the present disclosure shall be determined by the claims.

Claims

1. A packaging module, characterized in that: Include: A substrate having a first surface and a second surface opposite to each other, wherein the substrate has a through hole extending from the first surface to the second surface; An electronic component structure is disposed on the first surface of the substrate and aligned with the through hole, and the electronic component structure includes: a carrier board; and an electronic component connected to the carrier board; and a tube body, disposed on the second surface of the substrate and connected to the through hole; The tube body has two wide tube parts and a narrow tube part. The narrow tube part is located between the two wide tube parts, and the through hole of the substrate is connected to the narrow tube part.

2. The packaging module according to claim 1, wherein A cross-sectional shape of the tube body is annular.

3. The packaging module according to claim 2, wherein: The invention also comprises a communicating pipe which is arranged in the through hole and is connected with the narrow pipe portion.

4. The packaging module according to claim 1, wherein: A cross-section of the tube is U-shaped, and the tube has a fitting surface connected to the second surface of the substrate.

5. The packaging module according to claim 1, wherein: Each of the wide tube portions has a first diameter, the narrow tube portion has a second diameter, and a ratio of the first diameter to the second diameter is 2 to 4.

6. The packaging module according to claim 1, wherein: There is a spacing distance between the carrier and the substrate, and the spacing distance is 0.3 mm to 5.0 mm.

7. A packaging module, characterized in that: Include: A substrate having a first surface and a second surface opposite to each other, wherein the substrate has a through hole extending from the first surface to the second surface; An electronic component structure is disposed on the first surface of the substrate and aligned with the through hole, and the electronic component structure includes: a carrier board; and an electronic component connected to the carrier board; a first tube, disposed on the second surface of the substrate and having a necked portion; and A second tube body is arranged on the second surface of the substrate. The second tube body is sleeved on the neck portion of the first tube body and is communicated with the through hole.

8. The packaging module according to claim 7, wherein: The neck portion has a wide end and a narrow end opposite to each other, the wide end has a third diameter, the narrow end has a fourth diameter, and a ratio of the third diameter to the fourth diameter is 2 to 4.

9. The packaging module according to claim 7, wherein: The necked portion of the first tube body is aligned with the through hole.

10. The packaging module according to claim 7, wherein: There is a spacing distance between the carrier and the substrate, and the spacing distance is 0.3 mm to 5.0 mm.

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