Electronic tester

Abstract

Disclosed is a test device that contacts a terminal on a wafer to test the wafer. The dielectric gas is used to reduce arcing between the contacts. The fixed structure and the movable structure have complementary gas interfaces that engage when the movable structure is engaged with the fixed structure. The gas cartridge has a channel block connected to the dielectric gas pressure regulator and the nitrogen pressure regulator and to the gas supply channel to selectively provide nitrogen or dielectric gas to the gas supply channel. The tray has a conductive portion to contact the rear wafer terminal, and vacuum channels, each having an enlarged portion to reduce arc.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to U.S. Provisional Patent Application No. 63 / 477,916, filed on December 30, 2022, the entire contents of which are incorporated by reference into this application. Background Art 1) Technical field

[0003] The invention relates to a testing device for testing a microelectronic circuit.

[0004] 2) Related technical discussions

[0005] Microelectronic circuits are typically fabricated in and on semiconductor wafers. These wafers are then "segmented" or "diced" into individual die. These dies are typically mounted on a supporting substrate to provide rigidity and for electronic communication with the die's integrated circuits or microelectronic circuits. The final package may include packaging of the die, and the resulting package may then be shipped to the customer.

[0006] Dies or packages need to be tested before they are shipped to customers. Ideally, the die should be tested at an early stage to identify defects that occur during early manufacturing. Wafer-level testing can be achieved by providing a manipulator and a contactor with contacts and then using the manipulator to move the wafer so that the contacts on the wafer contact the contacts on the contactor. Power and electronic signals can then be supplied to and from the microelectronic circuits formed in the wafer via the contactors.

[0007] According to various embodiments, a wafer includes a substrate, such as a silicon substrate or a printed circuit board, and one or more devices fabricated in or mounted to the substrate.

[0008] Alternatively, the wafer may be located within a removable wafer test module having an electrical interface and a thermal chuck. While the temperature of the wafer is thermally controlled by heating or cooling the thermal chuck, power and signals may be supplied to and from the wafer through the electrical interface.

[0009] The individual dies may need to be tested again after the wafer is singulated, and the dies may need to be tested again after being mounted to a support substrate. Summary of the Invention

[0010] The present invention provides a testing device, comprising: a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a reduced pressure channel formed through one of the components, the reduced pressure channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a reduced pressure supply connected to the reduced pressure channel, the opening of the reduced pressure supply allowing gas to leave the closed cavity and the closing of the reduced pressure supply preventing gas from entering the closed cavity; and an electronic tester connected to the microelectronic circuit to test the microelectronic circuit.

[0011] The present invention also provides a testing device, comprising: a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a cavity seal between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a decompression channel formed through one of the components, the decompression channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; and a decompression supply. , the reduced pressure supply is connected to the reduced pressure channel, the opening of the reduced pressure supply allows gas to leave the closed cavity, and the closing of the reduced pressure supply prevents gas from entering the closed cavity; an electronic tester, the electronic tester is connected to the microelectronic circuit to test the microelectronic circuit; a gas supply channel, the gas supply channel is formed through one of the components, the gas supply channel has an inlet opening outside the closed cavity and an outlet opening at the closed cavity; and a gas supply inlet, the gas supply inlet is connected to the gas supply channel, the opening of the gas supply inlet allows gas to enter the closed cavity and enter the space between the contacts.

[0012] The present invention also provides a testing device, comprising: a movable support structure, the movable support structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a flat component with a flat surface; a plurality of contacts, the contacts being on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a decompression channel, the decompression channel being formed through one of the components, the decompression channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a decompression supply, the decompression supply being connected to the decompression channel, the opening of the decompression supply allowing gas to leave the closed cavity, and the closing of the decompression supply preventing gas from entering the closed cavity; a first electrical interface, the first electrical interface being on the movable support structure and connected to the contacts; a movable structure degassing interface, the movable structure degassing interface being at the on the movable structure; a fixed structure, the movable support structure can be received to be held by the fixed structure and can be removed from the fixed structure; a second electrical interface, the second electrical interface is on the fixed structure, when the movable structure is held by the fixed structure, the second electrical interface is connected to the first electrical interface, and when the movable support structure is removed from the fixed structure, the second electrical interface is disconnected from the first electrical interface, wherein an electronic tester is connected to the terminal via the second electrical interface, the first electrical interface and the contact; a hot chuck, the hot chuck is on the fixed structure, wherein the flat surface of the wafer chuck is movable toward the flat surface of the hot chuck; a degassing duct, the degassing duct forms part of the fixed structure; a fixed structure degassing interface, the fixed structure degassing interface forms part of the fixed structure, the movable structure degassing interface is shaped to cooperate with the fixed structure degassing interface when the wafer chuck moves toward the hot chuck to connect the outlet opening of the decompression channel to the degassing duct of the fixed structure; and an electronic tester, the electronic tester is connected to the microelectronic circuit to test the microelectronic circuit.

[0013] The present invention also provides a testing device comprising: a tray for releasably holding a wafer, wherein the tray has at least a portion that is conductive and has an exposed surface for contacting a rear wafer terminal on the rear side of the wafer; a contact plate; contact plate front contacts, the contact plate front contacts being mounted to the contact plate, each contact plate front contact having a surface positioned to contact a corresponding front wafer terminal on the front side of the wafer; an electronic tester connected to the contact plate front contacts so that, in use, current is conducted between the electronic tester and a circuit in the wafer through the front side wafer contacts and the contact plate front contacts to test the circuit; and an electrical conductor connecting the conductive portion so that, in use, the circuit is connected to the electronic tester through the rear wafer contacts, the exposed surface of the conductive portion and the conductive path.

[0014] The present invention also provides a testing device, comprising: a wafer chuck; a tray for releasably holding a wafer, the tray being releasably positioned on the wafer chuck, the wafer chuck having a vacuum channel therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting the back side of the wafer to the vacuum channel in the wafer chuck so that when vacuum is applied to the vacuum channel, the vacuum fixes the back side of the wafer to the tray; a contact plate; contact plate contacts mounted to the contact plate, each contact plate contact having a surface positioned to contact a corresponding front wafer terminal on the front side of the wafer; and an electronic tester connected to the contact plate contacts so that, in use, current is conducted between the electronic tester and the circuit in the wafer through the front side wafer contacts and the contact plate contacts to test the circuit.

[0015] The present invention also provides a testing device comprising: a vacuum duct defining a vacuum channel; a wafer holder for releasably holding a wafer, the wafer holder having a plurality of vacuum openings therethrough, each vacuum opening connecting the back side of the wafer to the vacuum channel so that when a vacuum is applied to the vacuum channel, the vacuum fixes the back side of the wafer to the wafer holder, wherein each vacuum opening has an inlet opening at the wafer, an outlet opening away from the wafer, and an enlarged portion between the inlet opening and the outlet opening to reduce arcing between the openings; a contact plate; contact plate contacts mounted to the contact plate, each contact plate contact having a surface positioned to contact a corresponding front wafer terminal on the front side of the wafer; and an electronic tester connected to the contact plate contacts so that, in use, current is conducted between the electronic tester and the circuit in the wafer through the front side wafer contacts and the contact plate contacts to test the circuit.

[0016] The present invention also provides a gas box, comprising: a vacuum regulator, which is capable of being connected to a reduced pressure channel to control the flow of gas through the reduced pressure channel; a dielectric gas pressure regulator, which is capable of being connected to the gas supply channel to control the flow of dielectric gas to the gas supply channel; a nitrogen pressure regulator, which controls the flow of nitrogen to the gas supply channel; and a channel block, which is connected to the dielectric gas pressure regulator and the nitrogen pressure regulator and is capable of being connected to the gas supply channel to selectively provide the nitrogen or the dielectric gas to the gas supply channel.

[0017] The present invention also provides a wafer testing module, comprising a movable support structure, the movable support structure including a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts, the contacts being on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with the surfaces of the first component and the second component; a reduced pressure channel, the reduced pressure channel being formed through one of the components, the reduced pressure channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a reduced pressure supply connected to the reduced pressure channel, the opening of the reduced pressure supply allowing gas to leave the closed cavity, and the closing of the reduced pressure supply preventing gas from entering the closed cavity; and a first electrical interface, the first electrical interface being on the movable support structure and connected to the contacts, for connecting to a second electrical interface on the fixed structure when the movable support structure is removably held by the fixed structure.

[0018] The present invention also provides a wafer testing module, comprising: a movable support structure, the movable support structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts, the contacts being on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a decompression channel formed through one of the components, the decompression channel having an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a decompression supplier, the decompression supplier connected to to the reduced-pressure passage, opening of the reduced-pressure supply allowing gas to leave the enclosed cavity and closing of the reduced-pressure supply preventing gas from entering the enclosed cavity; a first electrical interface on the movable support structure and connected to the contacts for connecting to a second electrical interface on the fixed structure when the movable support structure is removably held by the fixed structure; a gas supply passage formed through one of the components, the gas supply passage having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity; and a gas supply inlet connected to the gas supply passage, opening of the gas supply inlet allowing gas to enter the enclosed cavity and into the space between the contacts.

[0019] The present invention also provides a wafer testing module, comprising: a movable supporting structure, the movable supporting structure comprising a first component and a second component for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a flat member with a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure; a plurality of contacts, the contacts being on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a decompression channel, the decompression channel being formed through one of the components, the decompression channel The pressure channel has an inlet opening at the closed cavity and an outlet opening outside the closed cavity; a reduced pressure supply, which is connected to the reduced pressure channel, the opening of the reduced pressure supply allows gas to leave the closed cavity, and the closing of the reduced pressure supply prevents gas from entering the closed cavity; a first electrical interface, which is on the movable support structure and connected to the contact, for connecting to a second electrical interface on the fixed structure when the movable support structure is removably held by the fixed structure; and a movable structure degassing interface, which is shaped to cooperate with the fixed structure degassing interface when the wafer chuck moves toward the hot chuck to connect the outlet opening of the reduced pressure channel to the degassing duct of the fixed structure.

[0020] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising holding the substrate between a first component and a second component, the second component having contacts against terminals of the substrate, the terminals being connected to the microelectronic circuit; positioning a cavity seal between the first component and the second component to form a closed cavity through surfaces of the first component and the second component and the cavity seal; and transmitting signals between an electronic tester and the microelectronic circuit to test the microelectronic circuit.

[0021] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first component and a second component, the second component having contacts against terminals of the substrate, the terminals being connected to the microelectronic circuit; positioning a cavity seal between the first component and the second component to form a closed cavity through surfaces of the first component and the second component and the cavity seal; transmitting signals between an electronic tester and the microelectronic circuit to test the microelectronic circuit, and allowing a dielectric gas to enter the closed cavity into the space between the contacts.

[0022] The present invention also provides a method for testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first component and a second component, the second component having contacts against terminals of the substrate, the terminals being connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a flat component having a flat surface; positioning a cavity seal between the first component and the second component to form a closed cavity through the surfaces of the first component and the second component and the cavity seal; receiving the movable support structure through a fixed structure, wherein a first electrical interface on the movable support structure is connected to a second electrical interface on the fixed structure; moving the flat surface of the wafer chuck toward the flat surface of the hot chuck of the fixed structure to further mate the degassing interface of the movable structure with the degassing interface of the fixed structure, thereby connecting the outlet opening of the decompression channel to the degassing duct of the fixed structure; and transmitting a signal between an electronic tester and the microelectronic circuit to test the microelectronic circuit, wherein the signal is transmitted between the electronic tester and the microelectronic circuit through the terminals, contacts, and the first electrical interface and the second electrical interface to test the microelectronic circuit.

[0023] The present invention also provides a method for testing a wafer, comprising: holding a wafer in a tray, wherein the tray has at least a portion that is conductive and has an exposed surface to contact a rear wafer terminal on the rear side of the wafer; moving a contact plate and the tray relative to each other so that the surface of the contact plate contacts mounted to the contact plate contacts the corresponding front wafer contacts on the front side of the wafer; conducting current between an electronic tester and a circuit in the wafer through the front side wafer contacts and the contact plate contacts to test the circuit; the circuit is connected to the electronic tester through the rear wafer terminals, the exposed surface of the conductive portion and the conductive path; and removing the wafer from the tray.

[0024] The present invention also provides a method for testing a wafer, comprising: holding a wafer in a tray; positioning the tray on a chuck; applying vacuum to a vacuum channel through the wafer chuck, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting the back side of the wafer to the vacuum channel in the wafer chuck so that the vacuum fixes the back side of the wafer to the tray; moving a contact plate and the tray relative to each other so that the surfaces of the contact plate contacts mounted to the contact plate contact corresponding front wafer contacts on the front side of the wafer; conducting current between an electronic tester and a circuit in the wafer through the front side wafer contacts and the contact plate contacts to test the circuit; and removing the wafer from the tray.

[0025] The present invention also provides a method for testing a wafer, comprising: releasably holding a wafer in a wafer holder, the wafer holder having a plurality of vacuum openings therethrough, each vacuum opening connecting the back side of the wafer to a vacuum channel; applying a vacuum to the vacuum channel, the vacuum securing the back side of the wafer to the wafer holder; moving a contact plate and the tray relative to each other so that the surfaces of the contact plate contacts mounted to the contact plate contact corresponding front wafer contacts on the front side of the wafer; conducting current between an electronic tester and a circuit in the wafer through the front side wafer contacts and the contact plate contacts to test the circuit, wherein each vacuum opening has an inlet opening at the wafer, an outlet opening away from the wafer, and an enlarged portion between the inlet opening and the outlet opening to reduce arcing between the openings; and removing the wafer from the tray. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The present invention is further described by way of example with reference to the accompanying drawings, in which:

[0027] Figure 1 is a cross-sectional side view of a test device having a slot assembly according to one embodiment of the present invention;

[0028] Figure 2 It is along Figure 1 A cross-sectional side view of the test apparatus along line 2-2;

[0029] Figure 3 It is along Figure 1 A cross-sectional side view of the test device along line 3-3;

[0030] Figure 4 It is along Figure 2 and Figure 3 a cross-sectional side view of the test apparatus along line 4-4;

[0031] Figure 5A 、 5B and 5C is a perspective view of the test apparatus showing the movable wafer test module being inserted into or removed from an oven defined by a frame;

[0032] Figure 6 is a timing diagram showing how one wafer test module can be inserted and used to test the electronics of a wafer and then another wafer test module can be inserted;

[0033] Figure 7 is a perspective view of the test apparatus showing the insertion or removal of a slot assembly;

[0034] Figure 8A and 8B Is shown in about Figure 1-7A cross-sectional side view of a support used in the construction of a wafer test module is described;

[0035] Figure 9A 、 9B and 10 are side views showing an apparatus for inserting and removing a removable wafer test module into and from an oven;

[0036] Figure 11 is a perspective view of the first wafer test module as viewed from above;

[0037] Figure 12 is a perspective view viewed from below the first wafer test module;

[0038] Figure 13 is the first wafer test module along Figure 11 and 12 The cross-sectional view of 13-13;

[0039] Figure 14 Is the first wafer test module along Figure 13 The cross-sectional view of 14-14;

[0040] Figure 15 Is the first wafer test module along Figure 12 The cross-sectional view of 15-15;

[0041] Figure 16 It is along Figure 15 A view in the direction of arrow A in FIG. 1 with parts removed;

[0042] Figure 17 yes Figure 15 Sectional view of 17-17;

[0043] Figure 18A(i) and 18A(ii) yes Figure 15 A view in the direction of arrows A and B, wherein the latch mechanism is in the unlocked configuration;

[0044] Figure 18B(i) and 18B(ii) is with Figure 18A(i) and 18A(ii) a similar view with the latch mechanism in the locked position;

[0045] Figure 19 is a perspective view showing how shims are used to set the height of the tabs of the latch mechanism;

[0046] Figure 20 is a perspective view of components of a pressure monitoring system;

[0047] Figure 21 is a perspective view of other components of the pressure monitoring system;

[0048] Figure 22A and 22B are perspective and side views of components of a pressure monitoring system prior to being joined;

[0049] Figure 23A and 23B is with Figure 22A and 22B A similar view of the components of a pressure monitoring system after engagement;

[0050] Figure 24 is a block diagram showing components of a test apparatus for introducing a dielectric gas;

[0051] Figure 25 is a top view of the slot assembly;

[0052] Figure 26 yes Figure 25 A cross-sectional side view of 26A-26B in FIG;

[0053] Figure 27 yes Figure 25 A cross-sectional side view of 27A-27B in FIG;

[0054] Figure 28 yes Figure 26 Detailed view of the area marked “C” in the figure;

[0055] Figure 29 yes Figure 27 Detailed view of the area marked “D” in ;

[0056] Figure 30 is a perspective view of a slot assembly;

[0057] Figure 31 and 32 is a partially exploded perspective view of a gas cartridge for use in a slot assembly;

[0058] Figure 33 is a cross-sectional side view of a portion of a wafer test module and slot assembly;

[0059] Figure 34 yes Figure 33 A detailed view of the area marked "E" in FIG; and

[0060] Figure 35 and 36 yes Figure 33 Two perspective views of a wafer chuck and a tray of a wafer testing module are shown cut away at right angles to each other. DETAILED DESCRIPTION

[0061] In the attached figure Figure 1A test apparatus 10 according to an embodiment of the present invention is shown, comprising (i) a fixed structure including a tester 12, a frame 14, a power bus 16, first and second slot assemblies 18A and 18B, a tester cable 20, a power cable 22, a cold liquid supply line 24A, a cold liquid return line 24B, a control liquid supply line 24C, a control liquid return line 24D, and a vacuum line 24E, (ii) a movable device including first and second wafer test modules 28A and 28B, and (iii) first and second wafer test modules 30A and 30B. The first and second wafer test modules 28A and 28B are described herein as "wafer test modules" and their use is described as being used to test wafers. It should be understood that the first and second wafers 28A and 28B can generally be used to test microelectronic circuits and can be classified as "first and second microelectronic circuit test packages 28A and 28B."

[0062] The slot assembly 18A includes a slot assembly body 32, a thermal chuck 34, a temperature detector 36, a temperature changing device in the form of a heating resistor 38, a first slot assembly interface 40, and a plurality of second slot assembly interfaces, including a control interface 44, a power interface 46, a cold liquid supply interface 48A, a cold liquid return interface 48B, a control liquid supply interface 48C, a control liquid return interface 48D, and a vacuum interface 48E.

[0063] The first slot assembly interface 40 is located within and mounted to the slot assembly body 32. Mounted in the left wall of the slot assembly body 32 are a control interface 44, a power interface 46, and a second electrical interface in the form of interfaces 48A to 48E.

[0064] The slot assembly 18A can be inserted into the frame 14 from left to right and removed from the frame 14 from right to left. The tester cable 20, power cable 22, and conduits 24A to 24E are manually connected to the control interface 44, power interface 46, and interfaces 48A to 48E, respectively. Before removing the slot assembly 18A from the frame 14, the tester cable 20, power cable 22, and conduits 24A to 24E are first manually disconnected from the control interface 44, power interface 46, and interfaces 48A to 48E, respectively.

[0065] The slot assembly 18A includes a main board 60 with test electronics, a plurality of channel module boards 62 with test electronics, a flexible connector 64, and a connection board 66. The control interface 44 and the power interface 46 are connected to the main board 60, to which the thermal controller 50 is mounted. The channel module boards 62 are electrically connected to the main board 60. The flexible connector 64 connects the channel module boards 62 to the connection board 66. Control functions are provided via electrical conductors connecting the control interface 44 to the main board 60. Power is provided to the main board 60 via the power interface 46. Both power and control are provided from the main board 60 to the channel module boards 62 via conductors. The flexible connector 64 provides conductors connecting the channel module boards 62 to the connection board 66. The connection board 66 includes conductors connecting the flexible connector 64 to the first slot assembly interface 40. The first slot assembly interface 40 is thus connected to the control interface 44 and the power interface 46 via various conductors, allowing power and control to be provided to the first slot assembly interface 40 via the control interface 44 and the power interface 46.

[0066] The second slot assembly 18B includes similar components to the first slot assembly 18A, and like reference numerals denote like components. The second slot assembly 18B is inserted into the frame 14, and the control interface 44, power interface 46, and interfaces 48A to 48E of the second slot assembly 18B are each manually connected to a separate set of connection components, including a separate tester cable 20, a separate power cable 22, and separate conduits 24A to 24E.

[0067] Wafer test module 28A includes a wafer test module body formed by a wafer chuck 72 and a back plate 74. Wafer 30A has a plurality of microelectronic devices formed therein. Wafer 30A is inserted into the wafer test module body between wafer chuck 72 and back plate 74. Wafer test module contacts 76 contact corresponding contacts (not shown) on wafer 30A. Wafer test module 28A also includes a wafer test module interface 78 located on back plate 74. Conductors in back plate 74 connect wafer test module interface 78 to wafer test module contacts 76.

[0068] Wafer test module 28A has a lip seal 77 (also referred to herein as a "differential pressure chamber seal") connected between backing plate 74 and wafer chuck 72. A vacuum is applied to the area defined by lip seal 77, backing plate 74, and wafer chuck 72. The vacuum holds wafer test module 28A together and ensures proper contact between wafer test module contacts 76 and contacts on wafer 30A.

[0069] Temperature detector 36 is located in thermal chuck 34 and is therefore close enough to wafer 30A to detect the temperature of wafer 30A to within five degrees Celsius, and preferably within one or two degrees Celsius.

[0070] The slot assembly 18A also has a door 82 connected to the slot assembly body 32 by a hinge 84. When the door 82 is rotated to an open position, the wafer test module 28A can be inserted into the slot assembly body 32 through the door opening 86. The wafer test module 28A is then lowered onto the thermal chuck 34 and the door 82 is closed. The thermal chuck 34 is mounted to the slot assembly body 32. The thermal chuck 34 then essentially forms a fixed holder with a wafer test table.

[0071] Slot assembly 18A also includes a thermal interface chamber seal 88 positioned between thermal chuck 34 and wafer chuck 72. A vacuum is applied to the area defined by thermal interface chamber seal 88, thermal chuck 34, and wafer chuck 72 via vacuum port 48E and vacuum line 90. Thus, a good thermal connection is provided between thermal chuck 34 and wafer chuck 72. When heating resistor 38 generates heat, the heat is conducted through thermal chuck 34 and wafer chuck 72 to wafer 30A. When thermal chuck 34 is at a lower temperature than wafer 30A, heat is conducted in the opposite direction.

[0072] Wafer test module interface 78 interfaces with first slot assembly interface 40. Power and signals are provided to wafer 30A via first slot assembly interface 40, wafer test module interface 78, and wafer test module contacts 76. The performance of devices within wafer 30A is measured via wafer test module contacts 76, wafer test module interface 78, and first slot assembly interface 40.

[0073] The door 82 of the slot assembly 18B is shown in a closed position. A front seal 100 is mounted on the upper surface of the slot assembly 18A and seals with the lower surface of the slot assembly 18B. A front seal 102 is mounted on the upper surface of the slot assembly 18B and seals with the lower surface of the frame 14. A continuous sealed front wall 104 is provided by the doors 82 of the slot assemblies 18A and 18B and the front seals 100 and 102.

[0074] The slot assembly 18A also includes a thermal controller 50. The temperature detector 36 is connected to the thermal controller 50 via a temperature feedback line 52. Power is supplied to the heating resistor 38 via the power interface 46 and the power line 54, causing the heating resistor 38 to heat. The heating resistor 38 then heats the thermal chuck 34 and the wafer 30A on the thermal chuck 34. The heating resistor 38 is controlled by the thermal controller 50 based on the temperature detected by the temperature detector 36.

[0075] The thermal chuck 34 has a thermal fluid channel 224 formed therein. The thermal fluid channel 224 holds a thermal fluid. The thermal fluid is preferably a liquid rather than a gas because liquids are incompressible and heat convects more quickly to and from the liquid. Different thermal fluids are used for different applications, with oil being used for the highest temperature applications.

[0076] Controlled liquid supply and return lines 226 and 228 connect opposite ends of hot fluid channel 224 to cold liquid supply and return ports 48C and 48D, respectively. A heating resistor 38 acts as a heater, mounted at a location that heats thermal chuck 34, thereby heating the hot fluid. By recirculating the hot fluid through hot fluid channel 224, hot chuck 222 provides a more uniform heat distribution to thermal chuck 34 and, ultimately, to wafer 30A. The temperature of the fluid can also be controlled to heat or cool thermal chuck 34.

[0077] The test apparatus 10 also includes a cooling system 240, a temperature control system 242, and a vacuum pump 244. Two cold liquid supply lines 24A connected to the first and second slot assemblies 18A and 18B are also connected to the cooling system 240 through a manifold (not shown). An additional manifold connects a cold liquid return line 24B to the cooling system 240, a control liquid supply line 24C to the temperature control system 242, a control liquid return line 24D to the temperature control system 242, and a vacuum line 24E to the vacuum pump 244. Each slot assembly 18A or 18B has a respective cooling plate 246 with respective fluid channels 248. The cooling system 240 circulates fluid through the fluid channels 248 to cool the cooling plates 246. The cooling plates 246 then keep the channel module plates 62 cool. Temperature control system 242 circulates fluid through thermal fluid channels 224 to control the temperature of thermal chuck 34 and transfer heat to and from wafers 30A and 30B. Vacuum pump 244 provides air under vacuum pressure to vacuum line 90 .

[0078] The slot assembly 18A includes a separator seal 108 mounted to the upper surface of the slot assembly body 32 above its inner wall 106. The separator seal 108 seals with the lower surface of the slot assembly 18B. The slot assembly 18B has a separator seal 110 mounted to the upper surface of its slot assembly body 32. The separator seal 108 seals with the lower surface of the frame 14. A continuous sealing separator wall 112 is provided by the inner walls 106 of the slot assemblies 18A and 18B and the separator seals 108 and 110.

[0079] Figure 2 Shown Figure 1 2-2 of the test device 10. The frame 14 defines a first closed-loop air path 120. Air inlet and outlet openings (not shown) can be opened to change the first closed-loop air path 120 into an open air path, in which air at room temperature passes through the frame 14 without being recirculated. The closed-loop path is particularly useful in a clean room environment because it results in less particulate material being released into the air.

[0080] The testing apparatus 10 further includes a temperature changing device in the form of a first fan 122 , a first fan motor 124 , and a water cooler 126 .

[0081] A first fan 122 and a first fan motor 124 are mounted on an upper portion of the first closed-loop air path 120. A water cooler 126 is mounted to the frame 14 within the upper portion of the first closed-loop air path 120.

[0082] The wafer test modules 28A and 28B are positioned with the slot assemblies 18A and 18B and are located within the lower portion of the first closed-loop air path 120 .

[0083] In use, current is supplied to the first fan motor 124. The first fan motor 124 rotates the first fan 122. The first fan 122 circulates air through the first closed-loop air path 120 in a clockwise direction.

[0084] The water cooler 126 then cools the air in the first closed-loop air path 120. The air then flows through the slot assemblies 18A and 18B located above the wafer test module 28A or 28B. The air then cools the wafer test module 28A or 28B by convection.

[0085] Figure 3 Shown Figure 1 The test apparatus 10 shown in FIG3 - 3 is shown in FIG3 - 3 . The frame 14 defines a second closed-loop air path 150 . The test apparatus 10 also includes a second fan 152 , a second fan motor 154 , and a temperature changing device in the form of a water cooler 156 . Figure 2 No electric heater or damper is provided. The air inlet and outlet openings (not shown) can be opened to convert the second closed-loop air path 150 into an open air path where air at room temperature passes through the frame 14 without being recirculated.

[0086] The closed-loop path is particularly useful in a cleanroom environment because it results in less particulate material being released into the air. A second fan 152 and a second fan motor 154 are located in the upper portion of the second closed-loop air path 150. A water chiller 156 is located slightly downstream of the second fan 152 within the second closed-loop air path 150. The main plate 60 and channel module plate 62, which form part of the slot assemblies 18A and 18B, are located in the lower portion of the second closed-loop air path 150.

[0087] In use, current is supplied to the second fan motor 154, which rotates the second fan 152. The second fan 152 then recirculates air in a clockwise direction through the second closed-loop air path 150. The air is cooled by the water cooler 156. The cooled air then passes through the main board 60 and the channel module plate 62, so that heat is transferred from the main board 60 and the channel module plate 62 to the air by convection.

[0088] Figure 1 The continuous sealing separation wall 112 shown makes Figure 2 The air recirculated through the first closed-loop air path 120 is Figure 3 The air in the second closed-loop air path 150 remains isolated. Figure 1 The illustrated continuous sealed front wall 104 prevents air from escaping the first closed-loop air path 120 .

[0089] like Figure 2 and 3 As shown, Figure 1 The same cooling system 240 used in is also used to cool the water cooler 126. Figure 4 As shown, a plenum 160 separates the first closed-loop air path 120 from the second closed-loop air path 150 in all areas except those provided by the continuous sealing separation wall 112. The frame 14 has left and right walls 162, 164 that further define the closed-loop air paths 120 and 150.

[0090] Figure 5A 、 5B 5C show how wafer test modules 30C, 30D, and 30E may be inserted or removed at any time while all other wafer test modules are being used to test devices on the wafer and may be placed in various temperature ramp states. Figure 6 This concept is illustrated in more detail. At time T1, a first wafer test module is inserted into the frame 14, while a second wafer test module is located outside the frame 14. At time T1, heating of the first wafer test module begins. Between T1 and T2, the temperature of the first wafer test module increases from room temperature, approximately 22°C, to a test temperature that is 50°C to 150°C higher than room temperature at T2. At T2, power is applied to the first wafer test module, and the devices in the first wafer test module are tested. At T3, the second wafer test module is inserted into the frame 14, and heating of the second wafer test module begins. At T4, testing of the first wafer test module is terminated. At T4, cooling of the first wafer test module also begins. At T5, the second wafer test module reaches the test temperature, power is supplied to the second wafer test module, and the wafers in the second wafer test module are tested. At T6, the second wafer test module reaches a temperature close to room temperature and is removed from the frame 14. A third wafer test module can then be inserted in place of the first wafer test module. At T7 , the test of the second wafer test module is terminated and cooling thereof begins. At T8 , the second wafer test module has cooled to room temperature or close to room temperature and is removed from the frame 14 .

[0091] Different tests can be performed at different temperatures. For example, a wafer test module can be inserted and tested at room temperature. Another test can be performed during the temperature ramp-up. A further test can be performed at an elevated temperature. A further test can be performed during the temperature ramp-down. Two of these tests can be run as a single test from one temperature stage to the next.

[0092] like Figure 7 As shown, one slot assembly 18A can be removed or inserted into the frame 14. The slot assembly 18A can be inserted or removed while the other slot assemblies in the frame 14 are used to test devices on the wafer, as shown in FIG. Figure 6 As stated.

[0093] like Figure 8A As shown, a signal distribution board 500 , a contact board 502 , a plurality of wafer contacting probes 504 , a contact board pressure ring 506 , fasteners 508 , and posts 510 are also shown.

[0094] The signal distribution board 500 is primarily made of an insulating material and has circuits (not shown) formed therein. Contacts 512 are formed on an underside 514 of the signal distribution board 500. Threaded openings 516 are formed in the underside 514.

[0095] The contact plate 502 has a plurality of probe holes 518, post holes 520, and fastener holes 522 formed therethrough from an upper side 524 to a lower side 526. Each probe hole 518 has a first portion 528 and a second portion 530. When viewed in plan, the first and second portions 528 and 530 are both circular. The first portion 528 has a larger diameter than the second portion 530. When Figure 8A The larger diameter of the first portion 528 compared to the diameter of the second portion 530 causes the first portion 528 to be wider than the second portion 530 when viewed in a cross-sectional side view of .

[0096] The post hole 520 has a first portion 534 and a second portion 536. When viewed in plan, the first portion 534 and the second portion 536 are both circular. The diameter of the first portion 534 is larger than the diameter of the second portion 536. Because the diameter of the first portion 534 is larger than the diameter of the second portion 536, when Figure 8A When viewed in a cross-sectional side view, the first portion 534 is wider than the second portion 536. The first and second portions 534 and 536 have vertical sidewalls. A horizontal platform 538 connects the vertical sidewalls of the first and second portions 534 and 536.

[0097] Each probe 504 includes a conductive holder portion 542, a coil spring 544, and first and second end pieces 546 and 548. The first end piece 546 has a first interior portion 550 and a first end 552. The second end piece 548 has a second interior portion 554 and a second end 556. The coil spring 544 and the first and second interior portions 550 and 554 are held by the holder portion 542, with the coil spring 544 positioned between the first and second interior portions 550 and 554. The first and second ends 552 and 556 protrude from the upper and lower ends of the holder portion 542, respectively.

[0098] The upper surface of the first end 552 forms a terminal 560. The lower end of the second end 556 forms a contact plate front contact 562. The coil spring 544 and the first and second end pieces 546 and 548 are made of metal and are therefore made of a conductive material. The coil spring 544 and the first and second end pieces 546 and 548 form a conductor capable of conducting current between the terminal 560 and the contact plate front contact 562.

[0099] The corresponding probes are inserted into the corresponding probe holes 518 through the upper side 524. The second end 556 is slightly smaller than the second portion 530 so that it passes through the second portion 530 and protrudes from the lower side 526. The retainer portion 542 is slightly narrower than the first portion 528 but wider than the second portion 530 to prevent the probes 504 from falling out of the lower side 526. When the probes 504 are fully inserted into the probe holes 518, and before the contact board 502 is mounted on the signal distribution board 500, the first end 552 still protrudes above the upper side 524 of the contact board 502.

[0100] Post 510 has a seat 564, a force transfer portion 566, and a force transmitting portion 568. Post 510 is made from a single piece of metal or other material selected for its strength compared to the strength and brittleness of the ceramic material of contact plate 502.

[0101] Post 510 is inserted into post hole 520 through upper side 524. Support 564 and force transfer portion 566 are slightly narrower than second portion 536. Force transfer portion 568 is slightly narrower than first portion 534 but wider than second portion 536. Lower surface 570 of force transfer portion 568 abuts platform 538, thereby preventing post 510 from falling off lower side 526.

[0102] The column 510 has a surface 572. When the column 510 is as shown Figure 8A When fully inserted, as shown, surface 572 is in a plane that is parallel to and below the surface of underside 526. When post 510 is fully inserted, force transmitting portion 568 has a surface 574 that is in the same plane as upper side 524.

[0103] Signal distribution board 500 is positioned on top of contact board 502. Each contact 512 contacts a corresponding one of terminals 560. Because terminals 560 are located in a plane above the plane of upper side 524, lower side 514 is initially spaced apart from upper side 524.

[0104] Fastener 508 has a threaded shaft 578 and a head 580. Contact plate retaining ring 506 has an annular opening 582. Contact plate retaining ring 506 is positioned on the lower surface 584 of contact plate 502. Threaded shaft 578 is inserted from the bottom through annular opening 582 and then through fastener hole 522. Head 580 contacts the lower surface of contact plate retaining ring 506. Head 580 is then rotated, causing the threads on threaded shaft 578 to engage the threads on threaded opening 516. This threading action moves signal distribution board 500 closer to contact plate 502 and contact plate retaining ring 506. Lower side 514 eventually contacts upper side 524. Contact 512 moves first end piece 546 downward into probe hole 518 until terminal 560 is flush with upper side 524. Coil spring 544 compresses, and thus slightly deforms, allowing first end piece 546 to move relative to second end piece 548.

[0105] The underside 514 has a portion that rests against a surface 574 that forms part of the post 510. Because the post 510 abuts the signal distribution board 500, the post 510 is in a position to transfer force to the signal distribution board 500 through the surface 572.

[0106] The first wafer 32A has a plurality of electronic devices formed therein. Each electronic device has a plurality of terminals 588 on the upper surface 590 of the first wafer 32A. When the back plate 74 and the first wafer 32A are placed together, the first wafer 32A is aligned with the back plate 74 to ensure that each terminal 588 contacts a corresponding one of the contact plate front contacts 562.

[0107] A vacuum pressure is created in the area between the upper surface 590 and the underside 526, while the pressure below the lower surface 592 of the wafer chuck 72 and the upper surface 594 of the signal distribution plate 500 remains at atmospheric pressure. The pressure differential creates equal and opposite forces F1 and F2 on the signal distribution plate 500 and the wafer chuck 72.

[0108] like Figure 8BAs shown, forces F1 and F2 cause the backing plate 74 to move relative to the first wafer 32A and the wafer chuck 72. The coil springs 544 compress further to allow the second end piece 548 to move into the probe hole 518. Each coil spring 544 deforms against its spring force, for example, F3. However, force F1 is still greater than the sum of all forces F3 added together. The upper surface 590 eventually abuts against the surface 572 of the support 564. Because the post 510 is in close contact with the signal distribution board 500, the support 564 prevents the upper surface 590 from moving closer to and contacting the underside 526 of the contact plate 502. The first wafer 32A transfers force F4 to the support 564. The force transfer portion 566 transfers force F4 through the second portion 536 of the post hole 520. The force transmitting portion 568 receives force F4 from the force transfer portion 566 and transmits force F4 to the signal distribution board 500 via the surface 574.

[0109] Thus, it can be seen that force F4 is not carried by contact plate 502, thereby preventing stress that could damage the brittle ceramic material of contact plate 502. Instead, force F4 is transferred directly from electronic devices in the form of first wafer 32A through posts 510 to signal distribution board 500.

[0110] exist Figure 8A and 8B In the illustrated embodiment, a contact plate 502 serves as a support plate having post holes 520 extending therethrough. A signal distribution plate 500 serves as a backing structure on a first side of the support plate and includes at least a circuit board having contacts 512. A probe 504 serves as a conductor having contacts 562 at the front end of the contact plate to contact a terminal 588 on an electronic device located on a second side of the support plate, the second side being opposite to the first side of the support plate. A retainer portion 542 serves as a portion of the conductor held by the support plate. The conductor also has a terminal 560 connected to the contact 512 on the signal distribution plate 500. A spring in the form of a coil spring 544 is provided. The wafer chuck 72 serves as a force generating device on one side of the electronic device in the form of the first wafer 32A opposite the support plate. The force generating device and the support plate are movable relative to each other to move the electronic device closer to the support plate and deform the spring. The post 510 has a seat 564 having a surface 572 in a plane spaced apart from the plane of the surface of the support plate to prevent the electronic device from moving closer to the support plate; a force transfer portion 566 extending at least partially from the seat 564 through the post hole 520; and a force transfer portion 568 extending from the force transfer portion 566, the force transfer portion 568 being held by a backing structure.

[0111] Figure 9A A portion of the testing apparatus 10 is shown for inserting and removing wafer test modules into each slot assembly, such as slot assembly 18A. Figure 9AThe components of the testing apparatus 10 shown are components of a fixed structure, including a frame 300 , a portion of the first slot assembly 18A, the first slot assembly interface 40 , a retaining structure 302 , a horizontal transport 304 , a vertical transport 306 , a pusher blade 308 , and a locking mechanism 310 .

[0112] The frame 300 includes a first mounting member 312 and a second mounting member 314 spaced apart from each other. The horizontal conveyor 304 is a slide mounted between the first and second mounting members 312 and 314. The retaining structure 302 is mounted for sliding movement along the horizontal conveyor 304. Opposite ends of the pusher blade 308 are mounted to the first and second mounting members 312 and 314, respectively.

[0113] The locking mechanism 310 includes a connecting rod 316, a control rod 318, and a pressure rod 320. The control rod 318 is mounted to the first mounting member 312 on a pivot connection 322. The vertical transport device 306 is a rigid beam. The connecting member 324 connects the center points of the vertical transport device 306 and the pusher blade 308 to each other. The pressure rod 320 has a first connecting rod 326 rotatably connected to the control rod 318 and a second connecting rod 328 rotatably connected to one end of the vertical transport device 306. Figure 9A In the unlocked configuration shown, a line 330 connects the pivot connection 322 with the second link 328 , and the first link 326 is to the left of the line 330 .

[0114] In use, the first wafer test module 28A is positioned on the holding structure 302. The first wafer test module 28A is then moved from left to right into the first slot assembly 18A along with the holding structure 302. The placement and movement of the first wafer test module 28A may be performed manually or may be performed using a robot.

[0115] The holding structure 302 slides along the horizontal conveyor 304. A connecting rod 316 connects one end of a control rod 318 to the holding structure 302. When the holding structure 302 moves horizontally along the horizontal conveyor 304, the connecting rod 316 rotates the control rod 318 in a counterclockwise direction about the pivot connection 322.

[0116] The first link 326 rotates in a counterclockwise direction with the control rod 318. The pressure rod 320 converts the movement of the first link 326 into downward movement of the second link 328. Initially, the downward movement is minimal, but when the first wafer test module 28A is fully inserted into the first slot assembly 18A, the vertical movement becomes more significant and the vertical transport device 306 engages the first wafer test module 28A with the first slot assembly 18A. The horizontal transport device 304 is thus operable to horizontally move the first wafer test module 28A from a first position to a second position into the first slot assembly 18A, and the vertical transport device 306 is operable to move the first wafer test module 28A and the first slot assembly 18A relative to each other in a first vertical direction so that the slot assembly interface 40 engages the wafer test module interface on the first wafer test module 28A.

[0117] exist Figure 9A , the control lever 318 is shown in an unlocked position wherein the first link 326 is located on a first side of a line 330 connecting the pivot connection 322 and the second link 328. Figure 9A The unlocked position shown rotates through a compressed position in which the pusher blade 308 is deformed by the vertical conveyor 306 via the connection 324 by bending the pusher blade 308 against its spring force, and the first link 326 is aligned with the pivot connection 322 and the second link 328. The control lever 318 continues to rotate from the compressed position to the locked position, as shown. Figure 9B and 10 In the locked position, the first link 326 is to the right of the line 330 and, therefore, on a second side of the line 330 opposite the first side. Because the first link 326 has passed the line 330 and the pusher blade 308 has deformed against its spring force, the first wafer test module 28A is locked in position against the slot assembly interface 40.

[0118] The system can be unlocked by moving the retaining structure 302 from right to left. The control lever 318 is rotated in a clockwise direction, and the first link 326 is moved from right to left through the line 330. The vertical transport 306 is moved upward, i.e., in a second vertical direction opposite to the first vertical direction, to release the first wafer test module 28A from the slot assembly interface 40. Further movement of the retaining structure 302 along the horizontal transport 304 removes the first wafer test module.

[0119] Figure 11 and 12 Other components of the first wafer test module 28A are shown, including a pressure relief check valve 600, a vacuum relief check valve 602, components of a latch system including first, second, third and fourth latch assemblies 604A to 604D, and an electronic pressure sensor interface 606 forming part of a pressure monitoring system.

[0120] Figure 13 It is along Figure 11 and 12 13-13 in the cross-sectional view. A pressure relief passage 608 is formed in the back plate 74. The pressure relief passage 608 has an outlet opening 610 and an intermediate position 612 located in the same plane. The outlet opening 610 is connected to the pressure relief check valve 600. The intermediate position 612 is closer to the center point of the back plate 74 than the outlet opening 610. The pressure relief passage 608 is formed by first drilling four channels in the back plate 74 and then sealing one end of three of the channels, thereby completely isolating the formed pressure relief passage 608 from the atmospheric pressure outside the back plate 74.

[0121] Figure 14 yes Figure 13 14-14 in the cross-sectional view, the pressure relief passage 608 continues downward from the middle position 612 through the support plate 74 and the signal distribution plate 500. The pressure relief passage 608 has an inlet opening 624 that communicates with the pressure differential chamber 622. The lip seal 77 is located in a groove of the wafer chuck 72. The pressure differential chamber 622 is formed by the wafer chuck 72 forming the lower side of the pressure differential chamber 622, the contact plate 502, the contact plate pressure ring 506, the signal distribution plate 500 forming the upper side of the pressure differential chamber 622, and the lip seal 77 forming a connection between the upper and lower sides of the pressure differential chamber 622. The lip seal 77 is completely circular and completely surrounds the contact plate 502 and the wafer located between the contact plate 502 and the wafer chuck 72.

[0122] Figure 14 The components shown form a movable support structure 626. The movable support structure 626 has a first component 628 including the signal distribution plate 500 and the backing plate 74, and a second component 630 including the wafer chuck 72.

[0123] In use, the first component 628 is separated from the second component 630. The wafer is then placed on the wafer chuck 72. The first component 628 is then positioned on the second component 630. The upper peripheral edge of the lip seal 77 contacts the signal distribution board 500. The wafer is thus held in the movable support structure 626.

[0124] Now combine the reference Figure 13 and 14 , the pump is connected to the pressure reducing check valve 600. The pressure reducing check valve 600 is then opened. The pressure reducing passage 608 may initially be at atmospheric pressure, and the pump subsequently reduces the pressure within the pressure reducing passage 608. The pressure differential chamber 622 is exposed to a pressure lower than atmospheric pressure. The outer surface of the first wafer test module 28A is still exposed to atmospheric pressure. Because a pressure differential is generated between the pressure differential chamber 622 and the outer surface of the first wafer test module 28A, the spring within the contact plate 502 is compressed, as shown in FIG. Figure 8BAs described above, the lip seal 77 is made of a resilient elastomeric material that compresses the lip seal against its spring force. Because the lip seal 77 compresses against its spring force, an improved seal is created between the lip seal 77 and the signal distribution plate 500, thereby maintaining the pressure within the differential pressure chamber 622. The pressure-reducing check valve 600 is then closed, isolating the pressure-reducing passage 608 from the external atmospheric pressure. The pump can then be disconnected from the pressure-reducing check valve 600.

[0125] The first wafer test module 28A with the wafer loaded therein can now be moved around the manufacturing environment without being connected to a pump or tester. Figure 11 and 12 The vacuum relief check valve 602 shown applies positive pressure. The vacuum relief check valve 602 is spring-loaded and requires a predetermined amount of pressure to be applied before it opens. Air can then flow through the vacuum relief channel in the backing plate 74 to the differential pressure chamber 622, causing the differential pressure chamber 622 to reach atmospheric pressure. The first and second components 628 and 630 can then be separated from each other, and the wafer can be removed. When a new wafer is loaded into the first wafer test module 28A, and when it is necessary to reduce the pressure within the differential pressure chamber 622 using the pressure relief check valve 600, the vacuum relief check valve 602 is then closed.

[0126] Figure 15 yes Figure 12 The first latch assembly 604A includes a first portion 640 , a second portion 642 , a connecting portion 644 , an engagement mechanism 646 , a tuning block 648 , a locking nut 650 , a spacer 652A, a washer 652B, and a snap mechanism 654 .

[0127] First portion 640 and connecting portion 644 are machined as a single piece and are therefore fixed to each other. First portion 640 has a length 660 and a width 662. In cross-section, only half of width 662 is shown. Length 660 is greater than width 662. Length 660 is also greater than the diameter of connecting portion 644. First portion 640 has a tool probe aperture 664 formed therein.

[0128] The second portion 642 has a main body 666 and first and second fins 668A and 668B extending from the main body 666. The second portion 642 has a length 670 including the fins 668A and 668B and a width 672. Only half of the width 672 is shown in cross-section. Because the first and second fins 668A and 668B form part of the length 670 but not part of the width 672, the length 670 is much greater than the width 672. The main body 666 also has an opening 674 into which the connecting portion 644 can be inserted.

[0129] The connecting portion 644 includes a first portion 678 and a second portion 680. The second portion 680 has external threads formed thereon.

[0130] The engagement mechanism 646 is formed by opposing surfaces that define the width 662 of the first portion 640. The opposing surfaces forming the engagement mechanism 646 are parallel to one another to facilitate engagement of the parallel surfaces on the jaws of a tool that can subsequently rotate the first portion 640.

[0131] Tuning block 648 is mounted to spacer 652A in a fixed position. Wafer chuck 72 includes a metal portion 682 and a protective sheet 684. Protective sheet 684 forms a shoulder 686 on wafer chuck 72. Shims 652B are positioned between spacer 652A and signal distribution board 500. Only a single shim 652B is shown. Additional shims are typically inserted one on top of the other until leveling surface 690 of tuning block 648 is at the same vertical height as shoulder 686.

[0132] The snap mechanism 654 includes a retainer body 694, a spherical ball 696, and a spring 698. The body 666 of the second portion 642 forms a part of the snap mechanism 654 in that the body 666 has a first snap recess 700A formed therein.

[0133] The retainer body 694 has an outer surface with threads 702 thereon. The retainer body 694 also has an end with a slot 704 formed therein that is capable of receiving a tool, such as a screwdriver. A spring 698 is positioned within the retainer body 694. A spherical ball 696 is positioned within the mouth of the retainer body 694. The mouth of the retainer body 694 has a slightly reduced size to prevent the spherical ball 696 from falling out of the retainer body 694. The outer surface of the spherical ball 696 forms a snap-fit ​​surface 706. The threads 702 engage with complementary threads within the tuning block 648. A tool, such as a screwdriver, is inserted into the slot 704 and then rotated to adjust how far the snap-fit ​​surface 706 is spaced from the tuning block 648.

[0134] The intermediate protective member 708 is inserted into complementary grooves on the upper surface of the back plate 74. Openings 710, 712, and 714 are formed in the intermediate protective member 708, the back plate 74, and the signal distribution board 500, respectively. The second portion 680 of the connector 644 is inserted from above through the openings 710, 712, and 714. The length 660 of the first portion 640 is greater than the length of any of the openings 710, 712, and 714 in the same direction, which prevents the first portion 640 from entering the openings 710, 712, and 714. The lower surface of the first portion 640 rests on the upper surface formed in the intermediate protective member 708. The first portion 678 of the connector 644 is then positioned within the openings 710, 712, and 714, and the second portion 680 of the connector 644 is positioned below the openings 710, 712, and 714. The spring-loaded washer 720, the gasket 652B, and the spacer 652A are then positioned on the connector 644 from below. The second portion 642 is then positioned from below onto the connecting portion 644. The opening 674 forms a sliding fit with the outer diameter of the threads on the second portion 680 of the connecting portion 644.

[0135] As the second portion 642 slides upward over the connecting portion 644, the first snap recess 700A also contacts the snap surface 706. The spherical ball 696 moves slightly from right to left, overcoming the spring force of the spring 698. The locking nut 650 then engages the protruding end of the second portion 680. Rotating the locking nut 650 tightens the body 666 of the second portion 642 against the spring force of the washer 720. A feeler gauge or other instrument can be used to determine the gap between the second tab 668B and the leveling surface 690. The locking nut 650 can be rotated until an acceptable gap is formed between the second tab 668B and the leveling surface 690. This gap is typically the same as the desired gap between the first tab 668A and the shoulder 686.

[0136] When the locking nut 650 is rotated, the first snap recess 700A also moves upward. The first snap recess 700A is an elongated slot. When the second portion 642 continues to move upward as the locking nut 650 continues to rotate, the snap surface 706 and the first snap recess 700A can slide over each other.

[0137] As shown, when the first latch assembly 604A is assembled, the wafer chuck 72 is in place. Additionally, a negative pressure exists within the differential pressure chamber 622. By placing the first wafer test module 28A in a compressed state, it is possible to measure whether the first and second tabs 668A and 668B are equidistant from the shoulder 686 and the leveling surface 690. As long as the leveling surface 690 has been set to the correct height using one or more shims, such as shim 652B, the first latch assembly 604A can be assembled without the wafer chuck 72 by simply measuring the spacing between the second tab 668B and the leveling surface 690.

[0138] Figure 16 It is along Figure 15 6. A view in direction A in FIG. 3 , but only showing the connection portion 644 and the signal distribution board 500.

[0139] The opening 712 has a first dimension 724 on an axis 726 toward the center point of the signal distribution board 500 that is larger than a second dimension 728 transverse to the axis 726. The first portion 678 of the connector 644 is smaller than the first dimension 724 on the axis 726 to allow the signal distribution board 500 and the backplane 74 (see FIG. Figure 15 ) relative to each other. The first portion 678 is sized to slidably fit within the second dimension 728 to prevent the signal distribution board 500 from moving relative to the back plate 74 in a direction transverse to the axis 726.

[0140] Second portion 680 of connector 644 has a first thickness 730 and a second thickness 732. First thickness 730 allows it to fit through opening 712 in the direction of axis 726 and is larger than second dimension 728 of opening 712. Second thickness 732 is transverse to first thickness 730 and allows it to fit through second dimension 728 of opening 712. Because second dimension 728 is relatively large, threads can be formed thereon while remaining relatively strong. The entire second portion 680 is positioned below opening 712, allowing connector 644 to rotate about its longitudinal axis without becoming stuck in the relatively narrow opening 712. First portion 678 has a circular cross-section with a diameter no larger than second dimension 728, allowing first portion 678 to rotate freely within the relatively narrow second dimension 728 of opening 712.

[0141] An additional opening 734 is formed in the signal distribution board 500 for additional securing of the gasket. The opening 734 is similarly proportioned to the opening 712, with the longer dimension being along an axis 736 toward the center point of the signal distribution board 500. When used in a manufacturing environment, the anchor passing through the opening 734 does not have to be rotated, and the size of the opening 734 is only used to allow for thermal expansion of the signal distribution board 500 relative to the backplane 74.

[0142] Figure 17 for Figure 15 17-17, the cross-sectional view of the fixing device 740 is inserted through Figure 16 The opening 734 is used to secure the spacer 652A and the washer 652B to the back plate 74. The fastener 740 includes a bolt and a nut, wherein the head of the bolt is on one side and the nut is on the opposite side.

[0143] The body 666 has a circular outer surface 742 in which first, second, third, and fourth snap recesses 700A to 700D are formed. The snap surface 706 of the spherical ball 696 is located within the first snap recess 700A, which prevents the body 666 from rotating. The opening 674 in the body 666 is keyed to receive the shape of the second portion 680 so that the second portion 680 cannot rotate if the body 666 remains stationary.

[0144] A small amount of torque is required to rotate the main body 666 and force the spherical ball 696 out of the first snap recess 700A. If the main body 666 is rotated clockwise, the snap surface 706 rides on the circular outer surface 742 between the first snap recess 700A and the second snap recess 700B. As the main body 666 rotates, the second portion 680 rotates with the main body 666 by the same angle. When the main body 666 is rotated approximately 90 degrees, the snap surface 706 snaps into the second snap recess 700B. The second snap recess 700B then prevents rotation of the main body 666 and the second portion 680. The first to fourth snap recesses 700A to 700D gently lock the main body 666 at four different rotational angles: 0, 90, 180, and 270 degrees.

[0145] Figure 18A(i) and 18A(ii) It is along Figure 15 18A(ii), the first latch assembly 604A is shown unlocked. The shoulder 686 is not obstructed from below by either the first flap 668A or the second flap 668B. The flaps 668A and 668B are formed by Figure 15 and 17 The latch mechanism 654 is shown held in the position shown in FIG18A(i). The pressure within the first wafer test module 28A can be reduced and the wafer chuck 72 can be removed to insert or replace a wafer. After the wafer is replaced, the pressure within the first wafer test module 28A is reduced again to hold the first wafer test module 28A together.

[0146] When the first wafer test module 28A is fully assembled, it may be necessary to provide further fault protection so that electrical contact with the wafer can be maintained even if the negative pressure within the first wafer test module 28A cannot be maintained due to a system failure. The operator can use a tool (not shown) having jaws and a probe. The probe is inserted into the tool probe hole 664. The tool probe hole 664 is tapered so that the deeper the probe is inserted into the tool probe hole 664, the more aligned the tool becomes with the first part 640. The operator then engages the opposing parallel surfaces of the jaws of the tool with the opposing parallel surfaces formed by the engagement mechanism 646. Once the tool is engaged with the engagement mechanism 646, the operator rotates the tool, and the tool rotates the first part 640. The connecting portion 644 and the second portion 642 and their first and second wings 668A and 668B rotate together with the first portion 640. Reference Figure 17 , the snap-fit ​​surface 706 leaves the fourth snap-fit ​​recess 700D and slides on the circular outer surface 742. Then, the snap-fit ​​surface 706 snaps into the first snap-fit ​​recess 700A.

[0147] Figure 18B(i) and 18B(ii) The first latch assembly is shown after the first portion 640 and the second portion 642 have been rotated 90 degrees. An operator can see that the orientation of the first portion 640 matches the locked position indicated by reference numeral 750. The first tab 668A is now positioned above the shoulder 686, which prevents the wafer chuck 72 from moving vertically downward away from the rest of the wafer test module 28A. The second tab 668B is positioned on the tuning block 648. By rotating the first portion 640 90 degrees clockwise or counterclockwise, the first tab 668A can be disengaged from the shoulder 686. Either tab 668A or 668B can be used to lock the wafer chuck 72 in place.

[0148] Figure 19 The figure shows how one or more shims 652B to 652F can be used to adjust the height of the leveling surface 690 of the tuning block 648. Ideally, the tuning blocks 648 should be located at the same height as the shoulders 686. Because the tuning blocks 648 are mounted to the spacer 652A, as more shims 652B to 652F are inserted, the tuning blocks 648 move up and down with the spacer 652A. If the leveling surface 690 is below the shoulder 686, more shims can be inserted to raise the leveling surface 690, or if the leveling surface 690 is above the height of the shoulder 686, the shims can be removed.

[0149] The engagement mechanism 646 is conveniently located directly on the first portion 640. In another arrangement, the engagement mechanism may be formed directly on the second portion 642 or directly on the connecting portion 644.

[0150] In another embodiment, the engagement mechanism may be a mechanism separate from the first and second portions 640 and 642 and the connecting portion 644. For example, a worm gear may be formed on the connecting portion 644, and the engagement mechanism may be a separate rotatable mechanism that rotates the worm gear.

[0151] An engagement mechanism may also be located between the first portion 640 and the connecting portion 644. For example, the first flap 668A may be pivoted downwardly away from the shoulder 686 and rearwardly toward the shoulder 686 using a cam system located between the first portion 640 and the connecting portion 644. Such a cam system as an engagement mechanism may alternatively be located between the connecting portion 644 and the second portion 642. Alternatively, the connecting portion 644 may be formed in two pieces, and the engagement mechanism may connect the two pieces and adjust the spacing between the two pieces, and the spacing adjustment may pivot the flap.

[0152] The first latch assembly 604A primarily utilizes incompressible and non-flexible materials. In alternative embodiments, a belt or other flexible material may be used with the same or similar purposes in mind.

[0153] Instead of having the engagement mechanism 646 on an outer surface of the first portion 640, the engagement mechanism may instead be on an inner surface of any portion.

[0154] Reference again Figure 12 , the first, second, third, and fourth latch assemblies 604A to 604D are identical except for their respective positions and orientations. The first and third latch assemblies 604A and 604C are located on opposite sides of the wafer chuck 72, and the second and fourth latch assemblies 604B and 604D are located on opposite sides of the wafer chuck 72. Because the latch assemblies 604A to 604D are located on more than one side of the wafer chuck 72, i.e., they cover more than 180 degrees around the circumference of the wafer chuck 72, they can collectively hold all sides of the wafer chuck 72 in place around its entire circumference.

[0155] The latching system provided by the first, second, third, and fourth latch assemblies 604A to 604D facilitates easier movement of the first wafer test module 28A within a manufacturing environment without the need for human oversight. Without the latching system, human oversight would be required to determine when the negative pressure within the first wafer test module 28A fails and the wafer 28A is separated. The latching system provides a structural failsafe to prevent the first wafer test module 28A from separating, even if it draws in air from the outside.

[0156] Figure 20 、 21 , 22A and 22B show other components of the pressure monitoring system, including pressure sensing channel 760 ( Figure 21 )、pressure sensor 762( Figure 22A and 22B), reference Figure 11 The electronic pressure sensor interface 606 ( Figure 20 、 21 , 22A and 22B)), an electronic pressure connector interface 764, a mounting bracket 766, a ribbon cable 768 having first and second connectors 770 and 772 at opposite ends thereof ( Figure 20 、 22A and 22B), connector block 774 and reinforcing plate 776 ( Figure 20 ).

[0157] Pressure sensing channel 760 is similar to reference Figure 13 The pressure relief channel 608 is formed in the back plate 74. The pressure sensing channel 760 has Figure 14 The pressure sensing channel 760 has a first end within the differential pressure chamber 622 shown in FIG. The pressure sensing channel 760 has a second end opposite the first end near the outer edge of the back plate 74 .

[0158] The electronic pressure sensor interface 606 is in the form of a printed circuit board having a substrate 780 and a plurality of contacts, including first, second, and third contacts 782A, 782B, and 782C formed on the substrate 780 .

[0159] Pressure sensor 762 is mounted to substrate 780 on a side of substrate 780 opposite first, second, and third contacts 782A, 782B, and 782C. Pressure sensor 762 is electrically connected to first, second, and third contacts 782A, 782B, and 782C through substrate 780. Pressure sensor 762 is capable of sensing the pressure of a gas (in this case, air) and converting the pressure into an electrical signal, where the magnitude of the pressure is indicated by the magnitude of the signal or another variable. Pressure can be conveniently detected using a diaphragm that displaces a known distance as pressure increases or decreases. Other pressure sensors are also within the scope of the present invention, such as those using piezoelectric crystals or strain gauges. By moving the diaphragm, for example, by moving an inductive coil, the movement can be converted into a voltage, and the magnitude of the voltage then indicates displacement and, therefore, pressure. The pressure sensor may be, for example, the MLX90809 sold by Melexis (www.melexis.com). Electronic pressure sensor interface 606 is mounted to backplate 74 using fasteners 784. The diaphragm of the pressure sensor 762 is then exposed to air at the second end of the pressure sensing channel 760. The pressure sensor 762 can thus sense the pressure within the differential pressure chamber 622.

[0160] The electronic pressure connector interface 764 includes a plate 790 and a plurality of terminals, including first through sixth terminals 792A and 792F, secured to the plate 790. The plate 790 is mounted to a mounting bracket 766 via fasteners 794. A reinforcement plate 776 is secured between the two pusher blades 308. The mounting bracket 766 is secured to the reinforcement plate 776 via fasteners 796. The slot assembly body 32, along with the pusher blades 308 and reinforcement plate 776, forms part of a fixed structure, and the electronic pressure connector interface 764 is thus mounted to the fixed structure.

[0161] Connector block 774 is mounted to slot assembly body 32. Connectors 770 and 772 are connected to electronic pressure connector interface 764 and connector block 774, respectively. First through sixth terminals 792A through 792F are connected to the pressure sensing board of the electronic tester via first connector 770, ribbon cable 768, and second connector 772.

[0162] Figure 23A and 23B FIG20 illustrates the engagement of the electronic pressure sensor interface 606 with the electronic pressure connector interface 764 when the first wafer test module 28A is inserted into the slot assembly. The first, second, and third contacts 782A, 782B, and 782C initially contact the first, second, and third terminals 792A, 792B, and 792C, respectively. Further movement of the electronic pressure sensor interface 606 causes the first, second, and third contacts 782A, 782B, and 782C to engage the fourth, fifth, and sixth terminals 792D, 792E, and 792F, respectively. The first contact 782A thus contacts both the first terminal 792A and the fourth terminal 792D. Similarly, each of the contacts 782B and 782C contacts two of the terminals 792B, 792C, 792E, and 792F.

[0163] The terminals 792A-792F can be resiliently pressed against the plate 790 to ensure proper contact with the contacts 782A-782C. The ribbon cable 768 allows a small amount of movement of the reinforcement plate 776 relative to the slot assembly body 32 when the first wafer test module 28A is inserted.

[0164] While the wafer is under test, the pressure within the differential pressure chamber 622 can be monitored throughout the process. If a wafer fails a test, the tester can be programmed to determine whether the test may be the result of a failure of the negative pressure within the differential pressure chamber 622.

[0165] Figure 24 Further components of the testing apparatus 10 and slot assemblies 18A and 18B are shown. Figure 24Additional components found within a manufacturing environment are also shown, including a nitrogen tank 802, a dielectric gas tank 804, and a vacuum pump 806. The nitrogen tank 802 and vacuum pump 806 may be backup equipment for nitrogen and vacuum lines that may be found in a manufacturing environment.

[0166] The test apparatus 10 includes a first nitrogen pressure regulator 810 and three manifolds 812, 814, and 816. The slot assembly 18A has three couplers 820A, 822A, and 824A. Similarly, the slot assembly 18B has three couplers 820B, 822B, and 824B.

[0167] In use, when the slot assembly 18A is inserted into the test apparatus 10, the couplers 820A, 822A, and 824A connect to the manifolds 812, 814, and 816. When the slot assembly 18B is inserted into the test apparatus 10, the couplers 820B, 822B, and 824B simultaneously engage the manifolds 812, 814, and 816. The couplers 820A and 820B connect the slot assemblies 18A and 18B to the nitrogen pressure regulator 810 via the manifold 814. The first nitrogen pressure regulator 810 is connected to the nitrogen tank 802 via the nitrogen supply inlet. The couplers 822A and 822B connect the slot assemblies 18A and 18B via the manifold 814 and the dielectric gas supply inlet of the dielectric gas tank 804. Couplers 824A and 824B connect the slot assemblies 18A and 18B to the vacuum pump 806 through the manifold 816 , which provides a vacuum to the manifold 816 .

[0168] The slot assemblies 18A and 18B are similar. For the purposes of this discussion, only the other components of the slot assembly 18A will be discussed, but it should be understood that the slot assembly 18B has similar components.

[0169] The slot assembly 18A also includes a second nitrogen pressure regulator 830, a dielectric gas pressure regulator 834, an inlet port 838, an outlet port 840, a vacuum regulator 844, and a heating control plate 848. The second nitrogen pressure regulator 830 and the dielectric gas pressure regulator 834 are connected to the couplings 820A and 822A, respectively. The inlet port 838 is connected to the second nitrogen pressure regulator 830 and the dielectric gas pressure regulator 834.

[0170] The first wafer test module 28A has a gas supply valve 850 connected to the inlet port 838. The gas supply valve 850 is similar to the vacuum release check valve 602, except that it operates at a different pressure. The gas supply channel 852 has an inlet connected to the gas supply valve 850 and a Figure 14 The outlet of the differential pressure chamber 622 is shown.

[0171] The outlet port 840 is connected to the pressure reducing check valve 600. The outlet port 840 is connected to the coupling 824A through the vacuum regulator 844.

[0172] The heating control board 848 is connected to the electric pressure sensor interface 606 and to the second nitrogen pressure regulator 830, the dielectric gas pressure regulator 834, and the vacuum regulator 844. The heating control board 848 controls the second nitrogen pressure regulator 830, the dielectric gas pressure regulator 834, and the vacuum regulator 844 based on input from the electric pressure sensor interface 606.

[0173] In use, the heating control panel 848 opens the vacuum regulator 844. The vacuum generated by the vacuum pump 806 is then connected to the pressure reducing check valve 600 and opens the pressure reducing check valve 600. The heating control panel 848 holds the dielectric gas pressure regulator 834 closed. The heating control panel 848 opens the second nitrogen pressure regulator 830. Nitrogen then flows from the nitrogen tank 802 into the pressure differential chamber 622 through the nitrogen supply inlet, the nitrogen pressure regulator 810, the manifold 812, the connector 820A, the second nitrogen pressure regulator 830, the inlet port 838, the gas supply valve 850, and the gas supply passage 852. The nitrogen then fills the pressure differential chamber 622 and exhausts any air in the pressure differential chamber 622 through the pressure reducing check valve 600, the outlet port 840, the vacuum regulator 844, the connector 824A, and the vacuum pump 806. See also Figure 8B The space between the front contacts 562 of the contact plate is then filled with nitrogen.

[0174] Reference again Figure 24 , heating control plate 848 then closes second nitrogen pressure regulator 830 and opens dielectric gas pressure regulator 834. Dielectric gas then flows from dielectric gas tank 804 through dielectric gas supply inlet, manifold 814, coupler 822A, dielectric gas pressure regulator 834, inlet orifice 838, gas supply valve 850, gas supply passage 852, differential pressure chamber 622, pressure reducing check valve 600, outlet orifice 840, vacuum regulator 844, coupler 824A, and vacuum pump 806. Arrow 858 shows the direction of flow of dielectric gas through differential pressure chamber 622. The flow rate of the dielectric gas is controlled by the size of inlet orifice 838 and outlet orifice 840.

[0175] once Figure 8B As shown, the space between the front contacts 562 of the contact plate is filled with dielectric gas, and the heating control board 848 partially closes the dielectric gas pressure regulator 834 and the vacuum regulator 844 to reduce the flow rate of the dielectric gas. The flow rate of the dielectric gas is small, and only the leakage of the dielectric gas from the pressure differential chamber 622 needs to be compensated. During the entire process of introducing nitrogen and dielectric gas into the pressure differential chamber 622, the heating control board 848 controls the vacuum regulator 844 in a manner to maintain the compression pressure. Figure 8B The negative pressure is established by the coil spring 544 in the cylinder.

[0176] The dielectric gas is selected to reduce the Figure 8A The arc between the front contacts 562 of the contact plate in the embodiment of the present invention. The gas that can be used as the dielectric gas can be, for example, the gas sold by 3M. 4710 insulating gas, or octafluorocyclobutane which is commercially available. Both gases have a higher dielectric constant and dielectric strength than air to reduce arcing when compared to air. Figure 8B When the first wafer 32A is in the test chamber, more power can be provided through the contact plate front contacts 562. After the test is completed, the dielectric gas is replaced with nitrogen by the reverse process described above, which allows the first wafer test module 28A to be removed from the slot assembly 18A. Throughout the process, excess nitrogen and excess dielectric gas are removed from the first wafer test module 28A through the outlet port 840, vacuum regulator 844, connector 824A and vacuum pump 806. One manufacturing tool may have a scrubber that separates the gas after leaving the vacuum pump 806. Another manufacturing tool may have a cryogenic pump that separates the gas after leaving the test apparatus 10 and before entering the vacuum pump 806.

[0177] As described above, each slot assembly 18A, 18B, etc. has its own heating control board 848 and other similar components. The heating control board 848 independently controls the introduction of nitrogen and dielectric gases to the contacts of the corresponding first wafer test module 28A, second wafer test module 28B, etc.

[0178] Figure 25 FIG. 1 is a top view of the slot assembly 18A when holding the first wafer test module 28A. Figure 26 yes Figure 25 Cross-sectional view of 26A-26B. Figure 27 yes Figure 25 Cross-sectional view of 27A-27B.

[0179] Figure 28 and 29 They are Figure 26 and 27 Detailed view of the areas marked "C" and "D" in Figure 3. Figure 28 Shown are the horizontal conveyor 304 , the pusher blades 308 , and the backing plate 74 with the pressure relief passage 608 formed therein. Figure 28 Also shown is a degassing duct 828, which is fixed to the horizontal conveyor 304. The degassing duct 828 has a fixed degassing interface 832. The back plate 74 has a movable degassing interface 836.

[0180] In use, the fixed structure degassing interface 832 and the movable structure degassing interface 836 are separated from each other. Figure 1 As described above, the wafer chuck 72 moves downward to contact the thermal chuck 34. The fixed structure degassing interface 832 moves downward and engages the movable structure degassing interface 836. The seal seals the fixed structure degassing interface 832 and the movable structure degassing interface 836. Then, the pressure relief channel 608 extends from the backing plate 74 through the degassing conduit 828. Figure 24 and 28 The illustrated vacuum may be applied to the reduced pressure passage 608 via the degassing line 828 .

[0181] Figure 29 The horizontal transport device 304, the pusher blade 308 and the backing plate 74 are shown, and the gas supply channel 852 is formed in the backing plate 74. The gas supply pipe 826 is mounted to the horizontal transport device 304. The gas supply pipe 826 has a fixed structure gas supply interface 842. The backing plate 74 has a movable structure gas supply interface 846. The fixed structure gas supply interface 842 is initially separated from the movable structure gas supply interface 846. When the wafer chuck 72 moves downward to the position aligned with the wafer chuck 72, the fixed structure gas supply interface 842 is separated from the movable structure gas supply interface 846. Figure 1 When the hot chuck 34 in the tank is in contact, the movable structure gas supply interface 846 moves downward to contact the fixed structure gas supply interface 842. The seal seals the movable structure gas supply interface 846 to the fixed structure gas supply interface 842. The gas supply channel 852 then extends through the horizontal conveyor 304, the gas supply conduit 826, into and through the backing plate 74. Figure 24 As shown, nitrogen and dielectric pressurized gas are supplied to the area between the contacts through gas supply conduit 826 and backing plate 74. After the test is completed, backing plate 74 and Figure 28 The degassing duct 828 and Figure 29 The gas supply line 826 is shown separated.

[0182] Figure 30 A gas box is shown forming part of slot assembly 18A. Gas box 860 connects couplers 820A, 822A, and 824A to the slot assembly 18A. Figure 29 The gas supply pipe 826 and Figure 28 Degassing duct 828 is shown.

[0183] like Figure 31 and 32As shown, the gas box 860 includes a base 862, an intermediate substrate 864, a channel block 866, a steering block 868, a mounting plate 870, various regulators including a second nitrogen pressure regulator 830, a dielectric gas pressure regulator 834, and a vacuum regulator 844, and various connectors including a vacuum receiving connector 872, a nitrogen receiving connector 874, a dielectric gas receiving connector 876, a vacuum supply connector 880, a gas supply connector 882, a valve control connector 884, as well as a releasable interface 892 and a cover 896.

[0184] A vacuum receiving connector 872, a nitrogen receiving connector 874, and a dielectric gas receiving connector 876 are fixed to the front of the base 862. The base 862 has a channel (not shown) formed therein that extends from the connectors 872, 874, and 876 to three releasable interfaces 892. A vacuum supply connector 880 and a gas supply connector 882 are fixed to one side of the base 862. More channels within the base 862 connect the connectors 880 and 882 to two or more releasable interfaces 892. The connectors 872, 874, 876, 880, and 882 are located generally in the same plane.

[0185] The steering block 868 and the channel block 866 are mounted to the intermediate base plate 864. The releasable intermediate base plate 864 has three releasable interfaces (not shown) spaced equidistant from the releasable interfaces 892 connected to the connectors 872, 874, and 876. The channel block 866 has two releasable interfaces (not shown) spaced equidistant from the releasable interfaces 892 connected to the connectors 880 and 882. When the intermediate base plate 864 is mounted on the base 862, the releasable interfaces of the intermediate base plate 864 are tightly fitted with the releasable interfaces 892 of the base 862. A channel is formed by passing through the intermediate base plate 864, the steering block 868, and the channel block 866. The indexing block 868 therefore connects the connectors 872, 874, and 878 to the channel block 866. The steering block 868 also converts the gas flow from being horizontally parallel in a first direction 890 to being vertically parallel in a second direction 894 at right angles to the first direction 890.

[0186] Regulators 830, 834, and 844 are mounted on channel block 866. Regulators 830, 834, and 844 can individually regulate the various gases passing through channel block 866. After leaving regulators 830 and 834, channel block 866 merges the channels leading from regulators 830 and 834 before passing through a releasable port 892 in base 862 to gas supply connector 882.

[0187] The mounting plate 870 is fixed to one side of the intermediate base plate 864. The valve control connector 884 is fixed to the mounting plate 870. The valve control connector 884 is electrically connected to the electrical terminals on the regulators 830, 834, and 844.

[0188] The cover 896 is shaped to fit over the channel block 866, the steering block 868, the mounting plate 870, and the intermediate base plate 864. Slots in the sides of the cover 896 allow the valve control connector 884 to protrude outwardly to the cover 896.

[0189] When in use, the gas supply connector 882 is connected to Figure 24 The vacuum supply connector 880 is connected to the inlet hole 838 in the Figure 24 The valve control connector 884 is connected to the outlet port 840 shown in FIG. Figure 24 820A and 824A.

[0190] Signals are provided to regulators 830, 834, and 844 through valve control connector 884 to control the flow of gas and vacuum to gas supply connector 882 and vacuum supply connector 880. For example, if nitrogen is introduced, vacuum regulator 844 is opened to introduce vacuum to vacuum supply connector 880 through vacuum receiving connector 872, and dielectric gas pressure regulator 830 is opened to connect dielectric gas receiving connector 876 to gas supply connector 882.

[0191] Gas box 860 provides a serviceable form factor for regulators 830, 834, and 844. Intermediate substrate 864 can be released from base 862 so that base 862 can remain mounted to Figure 30 The remainder of the slot assembly 18A in the middle is connected while the regulators 830, 834 and 844 or the valve control connector 884 are serviced. The releasable interface 892 allows for a vertical connection between the intermediate base plate 864 and the base 862, wherein all gas and vacuum lines are connected simultaneously in a single, simple operation. Thus, there is no need to disconnect the lines from the connectors 872 to 882.

[0192] Figure 33Other aspects of the test apparatus are shown. Certain components have been described with reference to the previous figures. For example, the components of the slot assembly 18A include the thermal chuck 34, the thermal fluid channel 224, the connecting plate 66, and the first slot assembly interface 40. The components of the first wafer test module 28A that have been described include the signal distribution board 500, the reinforcement board 776, the contact plate 502, the wafer contact probes 504, the contact plate front contacts 562, the wafer test module interface 78, and the wafer chuck 72. As previously described, the contact plate front contacts 562 are located on the tips of the wafer contact probes 504. Some of the contact plate front contacts 562 are power contact plate front contacts that provide power to the terminals 588 (see FIG. 5 ) of the wafer 32A. Figure 8A and 8B ) selected terminals. During testing, the power contact plate front contacts provide power to wafer 32A. During testing, other ones of the contact plate front contacts 562 provide signals to wafer 32A and receive signals from it.

[0193] Other components of the test apparatus include a tray 900 , a ground return probe 902 , a wafer chuck probe 908 , and a vacuum line 910 .

[0194] Tray 900 includes a substrate 912 of dielectric material and a conductive layer 914 formed on substrate 912. Conductive layer 914 has a conductive portion 916 and a return terminal area 918. Conductive portion 916 and return terminal area 918 have exposed upper surfaces 920. Wafer 32A has terminals that form part of the circuitry within wafer 32A and are located on the underside of wafer 32A. The terminals located on the underside of wafer 32A contact the exposed upper surfaces 920 of conductive portion 916. Conductive layer 914 can then be used to provide a reference voltage, such as a ground voltage, to the terminals on the underside of wafer 32A.

[0195] The ground return probes 902 are mounted on the contact plate 502. The lower end of each ground return probe 902 forms a ground return contact 922. The ground return probes 902 extend beyond the edge of the wafer 32A so that the ground return contact 922 contacts the return terminal area 918. The ground return probes 902 form an electrical conductor that connects the conductive layer 914 to the signal distribution board 500. The electrical conductor extends through the signal distribution board 500, the wafer test module interface 78, the first slot assembly interface 40, the connection board 66, and reaches the tester electronics described with reference to the previous figures. The tester electronics can then provide a reference voltage, such as ground, to the terminal on the underside of the wafer 32A.

[0196] Wafer chuck probes 908 are mounted to the contact plate 502. Each wafer chuck probe 908 extends beneath the contact plate 502 through the wafer 32A and the tray 900 and has a lower tip that contacts the wafer chuck 72. A ground reference voltage is then provided to the wafer chuck 72 through the signal distribution board 500 and the wafer chuck probes 908. By grounding the wafer chuck 72, the wafer chuck 72 is maintained at a known voltage, which makes it possible to control arcing between various conductive components, such as arcing between terminals on the underside of the wafer 32A and the wafer chuck 72.

[0197] When testing of wafer 32A is complete, wafer 32A can be removed from tray 900 and tray 900 can remain on wafer chuck 72. Alternatively, after testing is complete, tray 900 carrying wafer 32A is removed from wafer chuck 72, and tray 900 can provide structural rigidity for very thin wafers. In either case, tray 900 and wafer chuck 72 together form a wafer holder 924 for wafer 32A while testing wafer 32A.

[0198] A plurality of vacuum openings 926 are formed through the tray 900 and partially through the wafer chuck 72. A vacuum channel 928 in the wafer chuck 72 connects the lower ends of the vacuum openings 926 to each other. The vacuum duct 910 also defines a vacuum channel and is connected to the vacuum channel 928 in the wafer chuck 72. The vacuum duct 910 can be used, for example, Figure 28 Interfaces 832 and 836 are shown connected to vacuum channel 928 .

[0199] In use, vacuum is provided to the vacuum opening 926 through the vacuum line 910 and the vacuum channel 928. Because the vacuum opening 926 is open at the top, the lower surface of the wafer 32A is exposed to the vacuum. When the vacuum is applied, the vacuum secures the wafer 32A to the tray 900. When the first wafer test module 28A is assembled and before the first wafer test module 28A is inserted into the slot assembly 18A, a vacuum can be applied to secure the wafer 32A to the tray 900. Figure 11 The same pressure relief check valve 600 and vacuum relief check valve 602 shown for keeping the first wafer test module 28A closed maintain the vacuum. When the first wafer test module 28A is inserted into the slot assembly 18A, the vacuum can be maintained by Figure 28 Interfaces 832 and 836 in Figure 24 A vacuum pump 806 is shown maintaining the vacuum.

[0200] Figure 34 yes Figure 33Detail "E" in FIG. 1 is an enlarged view of the vacuum opening 926. The vacuum opening 926 includes a proximal portion 932, a distal portion 934, and an enlarged portion 936. The proximal portion 932 has a relatively small diameter and extends through the tray 900. The enlarged portion 936 is formed in the upper surface of the wafer chuck 72 and has a much larger diameter than the proximal portion 932. The distal portion 934 is formed by the bottom of the enlarged portion 936 and extends to the bottom of the wafer chuck 72. Figure 33 Vacuum opening 926 is shown. The diameter of distal portion 934 is much smaller than the diameter of enlarged portion 936.

[0201] By varying the diameter of vacuum opening 926 from inlet opening 940 to outlet opening 942, the likelihood of arcing between conductive layer 914 and wafer chuck 72 can be reduced when conductive layer 914 and wafer chuck 72 are at different voltages. The large diameter of enlarged portion 936 creates a greater distance that an arc must travel between conductive layer 914, through inlet opening 940, through proximal portion 932, and through the space within enlarged portion 936 before reaching the conductive metal material of wafer chuck 72. Additionally, an electrical insulator 944 is formed around inlet opening 940 to further separate the metal of conductive layer 914 from inlet opening 940.

[0202] The vacuum provided through vacuum openings 926 also serves to hold tray 900 against wafer chuck 72. Chamfers 948 are formed around the upper periphery of enlarged portion 936 for deburring purposes and to ensure flush contact between the lower surface of tray 900 and the upper surface of wafer chuck 72. Figure 35 and 36 is a right-angle cross-section of the wafer chuck 72 and the tray 900. The figure shows the relative positioning of the tray 900 and the groove 950 for the lip seal 77, which will be referred to as Figure 14 Describe in more detail.

[0203] While certain exemplary embodiments have been described and shown in the drawings, it is to be understood that these embodiments are merely illustrative and not restrictive of the invention, and that the invention is not limited to the specific construction and arrangements shown and described, as modifications may occur to those skilled in the art.

Claims

1. A testing device comprising: a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a pressure relief passage formed through one of the components, the pressure relief passage having an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity; a reduced pressure supply connected to the reduced pressure passage, the reduced pressure supply allowing gas to leave the closed cavity when opened and preventing gas from entering the closed cavity when closed; an electronic tester connected to the microelectronic circuit to test the microelectronic circuit; a gas supply passage formed through one of the components, the gas supply passage having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity; as well as A gas supply inlet is connected to the gas supply channel, and opening of the gas supply inlet allows gas to enter the closed cavity and into the space between the contacts.

2. The testing device according to claim 1, further comprising: A dielectric gas source is connected to the gas supply channel.

3. The testing device according to claim 1, wherein: The dielectric gas reduces arcing between the contacts compared to air.

4. The testing device according to claim 1, further comprising: A vacuum pump is connected to the reduced pressure supply.

5. The testing device according to claim 1 , further comprising: An orifice is connected to the gas supply channel to control the flow of the dielectric gas through the gas supply channel.

6. The testing device according to claim 1, further comprising: An orifice is connected to the reduced pressure passage to control the flow of the dielectric gas through the reduced pressure passage.

7. The testing device according to claim 1, further comprising: a movable support structure comprising the first component and the second component; a first electrical interface on the movable support structure and connected to the contacts; a fixed structure, the movable support structure being receivable to be retained by and removable from the fixed structure; as well as A second electrical interface, the second electrical interface is on the fixed structure, when the movable support structure is held by the fixed structure, the second electrical interface is connected to the first electrical interface, and when the movable support structure is removed from the fixed structure, the second electrical interface is disconnected from the first electrical interface, wherein the electronic tester is connected to the terminal through the second electrical interface, the first electrical interface and the contact.

8. The testing device according to claim 1, further comprising: A vacuum regulator is connected to the reduced pressure passage to control the flow of gas through the reduced pressure passage.

9. The testing device according to claim 8, further comprising: A dielectric gas pressure regulator is connected to the gas supply channel to control the flow of dielectric gas to the gas supply channel.

10. The testing device according to claim 9, further comprising: A nitrogen pressure regulator is connected to the gas supply passage to control the flow of nitrogen to the gas supply passage.

11. The testing device according to claim 10, further comprising: A channel block is connected to the dielectric gas pressure regulator and the nitrogen gas pressure regulator and to the gas supply channel to selectively supply the nitrogen gas or the dielectric gas to the gas supply channel.

12. The testing device according to claim 11, further comprising: A gas supply connector is configured to be connected to the gas supply channel to supply the nitrogen gas or the dielectric gas to the gas supply channel.

13. The testing device according to claim 12, further comprising: A vacuum supply connector is provided for connecting to the reduced pressure passage to provide vacuum from the vacuum regulator to the reduced pressure passage.

14. The testing device according to claim 13, wherein: The vacuum supply connector is connected to the vacuum regulator through the channel block.

15. The testing device according to claim 13, further comprising: a vacuum receiving connector connectable to a vacuum pump to connect the vacuum regulator to the vacuum pump; a nitrogen receiving connector connectable to a nitrogen supply inlet to connect the nitrogen supply inlet to the nitrogen pressure regulator; as well as A dielectric gas receiving connector is connectable to the dielectric gas supply inlet to connect the dielectric gas supply inlet to the dielectric gas pressure regulator.

16. The testing device according to claim 15, further comprising: A base is provided, wherein the gas supply connector, vacuum supply connector, vacuum receiving connector, nitrogen receiving connector, and dielectric gas receiving connector are mounted to the base.

17. The testing device according to claim 16, further comprising: an intermediate substrate, wherein the channel block is mounted to the intermediate substrate, wherein the intermediate substrate is separable from the base in a vertical direction, wherein the base and the intermediate substrate have mating interfaces that releasably connect the gas supply connector, the vacuum supply connector, the vacuum receiving connector, the nitrogen receiving connector, and the dielectric gas receiving connector to the channel block.

18. The testing device according to claim 17, further comprising: a mounting plate fixed to the intermediate substrate; as well as A valve control connector is fixed to the mounting plate, through which electrical signals can be provided to the vacuum regulator, the nitrogen regulator, and the dielectric gas regulator.

19. The testing device according to claim 15, further comprising: A turning block connects the vacuum receiving connector, the nitrogen receiving connector, and the dielectric gas receiving connector to the channel block and transforms gas flow from horizontally parallel in a first direction to vertically parallel in a second direction at right angles to the first direction.

20. The testing device according to claim 10, further comprising: A control circuit controls the vacuum regulator, the medium gas pressure regulator and the nitrogen pressure regulator.

21. The testing device according to claim 1, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure, the testing apparatus further comprising: a gas supply conduit, said gas supply conduit forming part of said fixed structure; a fixed structure gas supply interface, the interface forming part of the fixed structure; and a movable structure gas supply interface located on the movable structure and configured to cooperate with the fixed structure gas supply interface when the wafer chuck moves toward the thermal chuck to connect the inlet opening of the gas supply channel to the gas supply conduit of the fixed structure.

22. The testing device according to claim 1, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure, the testing apparatus further comprising: a degassing duct, the degassing duct forming part of the fixed structure; a fixed structure degassing interface, the fixed structure degassing interface forming part of the fixed structure; and A movable structure degassing interface is on the movable structure and is configured to cooperate with the fixed structure degassing interface when the wafer chuck moves toward the thermal chuck to connect the outlet opening of the reduced pressure channel to the degassing conduit of the fixed structure.

23. The testing device according to claim 1, wherein: Opening of the reduced pressure supply allows gas to exit the enclosed cavity causing the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

24. The testing device according to claim 1, wherein: The pressure-reducing passage is formed in the first component.

25. The testing apparatus of claim 1 , further comprising a latching system, the latching system comprising: A first latch assembly, the first latch assembly having: a first portion engaged with the first component; a second portion engaged with the second component; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; as well as an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device maintains the first and second components locked in the closed position and an unlocked position in which the locking device permits the first and second components to move from the closed relationship to the spaced relationship.

26. The testing device of claim 1 , further comprising a pressure monitoring system, the pressure monitoring system comprising: a pressure sensor positioned to detect pressure within the enclosed cavity; as well as An electrical pressure sensor interface is connected to the pressure sensor to communicate the pressure with an electronic tester.

27. A wafer testing module, comprising: a movable support structure comprising a first member and a second member for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a reduced pressure passage formed through one of the components, the reduced pressure passage having an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity; a reduced pressure supply connected to the reduced pressure passage, the reduced pressure supply allowing gas to leave the closed cavity when opened and preventing gas from entering the closed cavity when closed; a first electrical interface on the movable support structure and connected to the contact for connecting to a second electrical interface on the fixed structure when the movable support structure is removably retained by the fixed structure; a gas supply passage formed through one of the components, the gas supply passage having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity; as well as A gas supply inlet is connected to the gas supply channel, and opening of the gas supply inlet allows gas to enter the closed cavity and into the space between the contacts.

28. The wafer testing module according to claim 27, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure, the wafer testing module further comprising: A movable structure gas supply interface is configured to cooperate with a fixed structure gas supply interface when the wafer chuck moves toward the thermal chuck to connect the inlet opening of the gas supply channel to the gas supply conduit of the fixed structure.

29. The wafer testing module according to claim 27, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure, the wafer testing module further comprising: A movable structure degassing interface is configured to cooperate with a fixed structure degassing interface when the wafer chuck moves toward the thermal chuck to connect the outlet opening of the decompression channel to the degassing pipeline of the fixed structure.

30. The wafer testing module according to claim 27, wherein: Opening of the reduced pressure supply allows gas to exit the enclosed cavity causing the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

31. The wafer testing module according to claim 27, wherein: The pressure-reducing passage is formed in the first component.

32. The wafer test module of claim 27, further comprising a latching system, the latching system comprising: A first latch assembly, the first latch assembly having: a first portion engaged with the first component; a second portion engaged with the second component; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; as well as an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device maintains the first and second components locked in the closed position and an unlocked position in which the locking device permits the first and second components to move from the closed relationship to the spaced relationship.

33. The wafer testing module according to claim 27, further comprising a pressure monitoring system, the pressure monitoring system comprising: a pressure sensor positioned to detect pressure within the enclosed cavity; as well as An electrical pressure sensor interface is connected to the pressure sensor to communicate the pressure with an electronic tester.

34. A method of testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first component and a second component, the second component having contacts that abut terminals of the substrate, the terminals being connected to the microelectronic circuit; positioning a cavity seal between the first component and the second component to form a closed cavity by surfaces of the first component and the second component and the cavity seal; transmitting signals between an electronic tester and the microelectronic circuit to test the microelectronic circuit; as well as A dielectric gas is allowed to enter the enclosed cavity into the space between the contacts.

35. The method according to claim 34, wherein forming a reduced pressure passage through one of the components, the reduced pressure passage having an inlet opening at the enclosed cavity and an outlet opening external to the enclosed cavity, the method further comprising: A gas supply inlet is opened to allow dielectric gas to enter the enclosed cavity into the space between the contacts through a gas supply channel formed through one of the components.

36. The method of claim 34, wherein: The dielectric gas reduces arcing between the contacts compared to air.

37. The method of claim 34, further comprising: The flow of the dielectric gas through the gas supply channel is controlled by passing the dielectric gas through an orifice.

38. The method of claim 34, further comprising: The flow of the dielectric gas through the reduced pressure passage is controlled by passing the dielectric gas through an orifice.

39. The method of claim 34, wherein: The first component and the second component form part of a movable support structure, the method further comprising: The movable supporting structure is received by a fixed structure, wherein a first electrical interface on the movable supporting structure is connected to a second electrical interface on the fixed structure, wherein the signal is transmitted between the electronic tester and the microelectronic circuit through the terminals, contacts and the first electrical interface and the second electrical interface to test the microelectronic circuit.

40. The method of claim 34, further comprising: The flow of gas through the reduced pressure passage is controlled using a vacuum regulator connected to the reduced pressure passage.

41. The method of claim 40, further comprising: The flow of dielectric gas to the gas supply channel is controlled using a dielectric gas pressure regulator connected to the gas supply channel.

42. The method of claim 41 , further comprising: A nitrogen pressure regulator is connected to the gas supply passage to control the flow of nitrogen gas to the gas supply passage.

43. The method of claim 42, further comprising: A control circuit is used to control the vacuum regulator, the medium gas pressure regulator, and the nitrogen pressure regulator.

44. The method of claim 39, wherein The first component is a wafer chuck in the form of a flat piece having a flat surface, the method further comprising: The flat surface of the wafer chuck is moved toward the flat surface of the fixed structure thermal chuck to further mate the movable structure gas supply interface with the fixed structure gas supply interface, thereby connecting the inlet opening of the gas supply channel to the fixed structure gas supply pipeline.

45. The method of claim 34, wherein The first component is a wafer chuck in the form of a flat piece having a flat surface, the method further comprising: The flat surface of the wafer chuck is moved toward the flat surface of the fixed structure thermal chuck to further mate the movable structure degassing interface with the fixed structure degassing interface to connect the outlet opening of the decompression channel to the fixed structure degassing pipeline.

46. ​​The method of claim 34, wherein: Opening the reduced pressure supply to allow gas to exit the enclosed cavity causes the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

47. The method of claim 34, wherein: The pressure-reducing passage is formed in the first component.

48. The method of claim 34, further comprising: an engagement mechanism is operated to move the locking device between a locked position in which the locking device maintains the first and second components locked in the closed position and an unlocked position in which the locking device allows the first and second components to move from the closed relationship to the spaced relationship, the locking device comprising: a first portion engaged with the first component; a second portion engaged with the second component; A connecting portion has opposite ends fixed to the first portion and the second portion, respectively.

49. The method of claim 34, further comprising: detecting the pressure in the closed cavity; as well as The pressure is communicated to the electronic tester.

50. A gas box comprising: a vacuum regulator connectable to the reduced pressure passage to control the flow of gas through the reduced pressure passage; a dielectric gas pressure regulator connectable to the gas supply passage to control the flow of dielectric gas to the gas supply passage; a nitrogen pressure regulator, the nitrogen pressure regulator controlling the flow of nitrogen to the gas supply channel; as well as A channel block is connected to the dielectric gas pressure regulator and the nitrogen pressure regulator and is connectable to the gas supply channel to selectively supply the nitrogen gas or the dielectric gas to the gas supply channel.

51. The gas cartridge of claim 50, further comprising: A gas supply connector is configured to be connected to the gas supply channel to supply the nitrogen gas or the dielectric gas to the gas supply channel.

52. The gas cartridge of claim 51 , further comprising: A vacuum supply connector is provided for connecting to the reduced pressure passage to provide vacuum from the vacuum regulator to the reduced pressure passage.

53. A gas cartridge according to claim 52, wherein The vacuum supply connector is connected to the vacuum regulator through the channel block.

54. The gas cartridge of claim 52, further comprising: a vacuum receiving connector connectable to a vacuum pump to connect the vacuum regulator to the vacuum pump; a nitrogen receiving connector connectable to a nitrogen supply inlet to connect the nitrogen supply inlet to the nitrogen pressure regulator; as well as A dielectric gas receiving connector is connectable to the dielectric gas supply inlet to connect the dielectric gas supply inlet to the dielectric gas pressure regulator.

55. The gas cartridge of claim 54, further comprising: A base is provided, wherein the gas supply connector, vacuum supply connector, vacuum receiving connector, nitrogen receiving connector, and dielectric gas receiving connector are mounted to the base.

56. The gas cartridge of claim 55, further comprising: an intermediate substrate, wherein the channel block is mounted to the intermediate substrate, wherein the intermediate substrate is separable from the base in a vertical direction, wherein the base and the intermediate substrate have mating interfaces that releasably connect the gas supply connector, the vacuum supply connector, the vacuum receiving connector, the nitrogen receiving connector, and the dielectric gas receiving connector to the channel block.

57. The gas cartridge of claim 56, further comprising: a mounting plate fixed to the intermediate substrate; as well as A valve control connector is fixed to the mounting plate, through which electrical signals can be provided to the vacuum regulator, the nitrogen regulator, and the dielectric gas regulator.

58. The gas cartridge of claim 54, further comprising: A turning block connects the vacuum receiving connector, the nitrogen receiving connector, and the dielectric gas receiving connector to the channel block and transforms gas flow from horizontally parallel in a first direction to vertically parallel in a second direction at right angles to the first direction.

59. A testing device comprising: a movable support structure comprising first and second parts for holding a substrate therebetween, the substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, wherein the first part is a wafer chuck in the form of a planar member having a flat surface; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a pressure relief passage formed through one of the components, the pressure relief passage having an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity; a reduced pressure supply connected to the reduced pressure passage, the reduced pressure supply allowing gas to leave the closed cavity when opened and preventing gas from entering the closed cavity when closed; a first electrical interface on the movable support structure and connected to the contacts; a movable structure degassing interface, the interface being on the movable structure; a fixed structure, the movable support structure being receivable to be retained by and removable from the fixed structure; A second electrical interface, the second electrical interface is on the fixed structure, when the movable structure is held by the fixed structure, the second electrical interface is connected to the first electrical interface, and when the movable support structure is removed from the fixed structure, the second electrical interface is disconnected from the first electrical interface, wherein the electronic tester is connected to the terminal through the second electrical interface, the first electrical interface and the contact. a thermal chuck in the fixed structure, wherein the flat surface of the wafer chuck is movable toward the flat surface of the thermal chuck; a degassing duct, the degassing duct forming part of the fixed structure; a fixed structure degassing interface, the fixed structure degassing interface forming a portion of the fixed structure, the movable structure degassing interface being configured to cooperate with the fixed structure degassing interface when the wafer chuck moves toward the thermal chuck to connect the outlet opening of the decompression channel to the degassing conduit of the fixed structure; as well as An electronic tester is connected to the microelectronic circuit to test the microelectronic circuit.

60. The testing device of claim 59, further comprising: a gas supply passage formed through one of the components, the gas supply passage having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity; as well as A gas supply inlet is connected to the gas supply channel, and opening of the gas supply inlet allows gas to enter the closed cavity and into the space between the contacts.

61. The testing device of claim 60, further comprising: A dielectric gas source is connected to the gas supply channel.

62. The testing device of claim 61, wherein: The dielectric gas reduces arcing between the contacts compared to air.

63. The testing device of claim 60, further comprising: A vacuum pump is connected to the reduced pressure supply.

64. The testing device of claim 60, further comprising: An orifice is connected to the gas supply channel to control the flow of the dielectric gas through the gas supply channel.

65. The testing device of claim 60, further comprising: An orifice is connected to the reduced pressure passage to control the flow of the dielectric gas through the reduced pressure passage.

66. The testing device of claim 60, further comprising: A vacuum regulator is connected to the reduced pressure passage to control the flow of gas through the reduced pressure passage.

67. The testing device of claim 66, further comprising: A dielectric gas pressure regulator is connected to the gas supply channel to control the flow of dielectric gas to the gas supply channel.

68. The testing device of claim 67, further comprising: A nitrogen pressure regulator is connected to the gas supply passage to control the flow of nitrogen gas to the gas supply passage.

69. The testing device of claim 68, further comprising: A channel block is connected to the dielectric gas pressure regulator and the nitrogen gas pressure regulator and to the gas supply channel to selectively supply the nitrogen gas or the dielectric gas to the gas supply channel.

70. The testing device of claim 69, further comprising: A gas supply connector is configured to be connected to the gas supply channel to supply the nitrogen gas or the dielectric gas to the gas supply channel.

71. The testing device of claim 70, further comprising: A vacuum supply connector is provided for connecting to the reduced pressure passage to provide vacuum from the vacuum regulator to the reduced pressure passage.

72. The testing device of claim 71, wherein: The vacuum supply connector is connected to the vacuum regulator through the channel block.

73. The testing device of claim 71 , further comprising: a vacuum receiving connector connectable to a vacuum pump to connect the vacuum regulator to the vacuum pump; a nitrogen receiving connector connectable to a nitrogen supply inlet to connect the nitrogen supply inlet to the nitrogen pressure regulator; as well as A dielectric gas receiving connector is connectable to the dielectric gas supply inlet to connect the dielectric gas supply inlet to the dielectric gas pressure regulator.

74. The testing device of claim 73, further comprising: A base is provided, wherein the gas supply connector, vacuum supply connector, vacuum receiving connector, nitrogen receiving connector, and dielectric gas receiving connector are mounted to the base.

75. The testing device of claim 74, further comprising: an intermediate substrate, wherein the channel block is mounted to the intermediate substrate, wherein the intermediate substrate is separable from the base in a vertical direction, wherein the base and the intermediate substrate have mating interfaces that releasably connect the gas supply connector, the vacuum supply connector, the vacuum receiving connector, the nitrogen receiving connector, and the dielectric gas receiving connector to the channel block.

76. The testing device of claim 75, further comprising: a mounting plate fixed to the intermediate substrate; as well as A valve control connector is fixed to the mounting plate, through which electrical signals can be provided to the vacuum regulator, the nitrogen regulator, and the dielectric gas regulator.

77. The testing device of claim 73, further comprising: A turning block connects the vacuum receiving connector, the nitrogen receiving connector, and the dielectric gas receiving connector to the channel block and transforms gas flow from horizontally parallel in a first direction to vertically parallel in a second direction at right angles to the first direction.

78. The testing device of claim 68, further comprising: A control circuit controls the vacuum regulator, the medium gas pressure regulator and the nitrogen pressure regulator.

79. The testing device of claim 59, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure, the testing apparatus further comprising: a gas supply conduit, said gas supply conduit forming part of said fixed structure; a fixed structure gas supply interface, the interface forming part of the fixed structure; and A movable structure gas supply interface is located on the movable structure and is configured to cooperate with the fixed structure gas supply interface when the wafer chuck moves toward the thermal chuck to connect the inlet opening of the gas supply channel to the gas supply conduit of the fixed structure.

80. The testing device of claim 59, wherein: Opening of the reduced pressure supply allows gas to exit the enclosed cavity causing the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

81. The testing device of claim 59, wherein: The pressure-reducing passage is formed in the first component.

82. The testing device of claim 59, further comprising a latching system, the latching system comprising: A first latch assembly, the first latch assembly having: a first portion engaged with the first component; a second portion engaged with the second component; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; as well as an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device maintains the first and second components locked in the closed position and an unlocked position in which the locking device permits the first and second components to move from the closed relationship to the spaced relationship.

83. The testing device of claim 59, further comprising a pressure monitoring system, the pressure monitoring system comprising: a pressure sensor positioned to detect pressure within the enclosed cavity; as well as An electrical pressure sensor interface is connected to the pressure sensor to communicate the pressure with an electronic tester.

84. A wafer testing module, comprising: a movable support structure comprising a first component and a second component for holding therebetween a substrate carrying a microelectronic circuit and having a plurality of terminals connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a flat piece having a flat surface movable toward a flat surface of a thermal chuck of a fixed structure; a plurality of contacts on the second component, the contacts matching the terminals to contact the terminals; a cavity seal, the cavity seal being between the first component and the second component, the cavity seal forming a closed cavity together with surfaces of the first component and the second component; a reduced pressure passage formed through one of the components, the reduced pressure passage having an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity; a reduced pressure supply connected to the reduced pressure passage, the reduced pressure supply allowing gas to leave the closed cavity when opened and preventing gas from entering the closed cavity when closed; a first electrical interface on the movable support structure and connected to the contact for connecting to a second electrical interface on the fixed structure when the movable support structure is removably retained by the fixed structure; as well as A movable structure degassing interface is configured to cooperate with a fixed structure degassing interface when the wafer chuck moves toward the thermal chuck to connect the outlet opening of the decompression channel to the degassing conduit of the fixed structure.

85. The wafer testing module according to claim 84, further comprising: a gas supply passage formed through one of the components, the gas supply passage having an inlet opening outside the enclosed cavity and an outlet opening at the enclosed cavity; as well as A gas supply inlet is connected to the gas supply channel, and opening of the gas supply inlet allows gas to enter the closed cavity and into the space between the contacts.

86. The wafer testing module according to claim 85, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the flat surface being movable toward a flat surface of a thermal chuck of a fixed structure, the wafer testing module further comprising: A movable structure gas supply interface is configured to cooperate with a fixed structure gas supply interface when the wafer chuck moves toward the thermal chuck to connect the inlet opening of the gas supply channel to the gas supply conduit of the fixed structure.

87. The wafer testing module according to claim 84, wherein: Opening of the reduced pressure supply allows gas to exit the enclosed cavity causing the first and second components to move relative to each other to ensure proper contact between the contacts and the terminals.

88. The wafer testing module according to claim 84, wherein: The pressure-reducing passage is formed in the first component.

89. The wafer test module of claim 84, further comprising a latching system, the latching system comprising: A first latch assembly, the first latch assembly having: a first portion engaged with the first component; a second portion engaged with the second component; a connecting portion having opposite ends respectively fixed to the first portion and the second portion to form a locking device; as well as an engagement mechanism connected to the locking device and operable to move the locking device between a locked position in which the locking device maintains the first and second components locked in the closed position and an unlocked position in which the locking device permits the first and second components to move from the closed relationship to the spaced relationship.

90. The wafer testing module according to claim 84, further comprising a pressure monitoring system, the pressure monitoring system comprising: a pressure sensor positioned to detect pressure within the enclosed cavity; as well as An electrical pressure sensor interface is connected to the pressure sensor to communicate the pressure with an electrical tester.

91. A method of testing a microelectronic circuit held by a substrate, comprising: holding the substrate between a first component and a second component, the second component having contacts that abut terminals of the substrate, the terminals being connected to the microelectronic circuit, wherein the first component is a wafer chuck in the form of a planar member having a flat surface; positioning a cavity seal between the first component and the second component to form a closed cavity by surfaces of the first component and the second component and the cavity seal; receiving the movable support structure via a fixed structure, wherein a first electrical interface on the movable support structure is connected to a second electrical interface on the fixed structure; Moving the flat surface of the wafer chuck toward the flat surface of the fixed structure thermal chuck to further mate the movable structure degassing interface with the fixed structure degassing interface, thereby connecting the outlet opening of the decompression channel to the fixed structure degassing conduit; as well as Signals are transmitted between an electronic tester and the microelectronic circuit to test the microelectronic circuit, wherein the signals are transmitted between the electronic tester and the microelectronic circuit to test the microelectronic circuit through the terminals, contacts, and first and second electrical interfaces.

92. The method of claim 91, further comprising: The dielectric gas is allowed to enter the closed cavity into the space between the contacts.

93. The method of claim 92, wherein: A reduced pressure passage is formed through one of the components, the reduced pressure passage having an inlet opening at the enclosed cavity and an outlet opening outside the enclosed cavity, the method further comprising: A gas supply inlet is opened to allow dielectric gas to enter the enclosed cavity into the space between the contacts through a gas supply channel formed through one of the components.

94. The method of claim 91, wherein The dielectric gas reduces arcing between the contacts compared to air.

95. The method of claim 93, further comprising: The flow of the dielectric gas through the gas supply channel is controlled by passing the dielectric gas through an orifice.

96. The method of claim 93, further comprising: The flow of the dielectric gas through the reduced pressure passage is controlled by passing the dielectric gas through an orifice.

97. The method of claim 93, wherein The first component and the second component form part of a movable support structure, the method further comprising: The movable supporting structure is received by a fixed structure, wherein a first electrical interface on the movable supporting structure is connected to a second electrical interface on the fixed structure, wherein the signal is transmitted between the electronic tester and the microelectronic circuit through the terminals, contacts and the first electrical interface and the second electrical interface to test the microelectronic circuit.

98. The method of claim 93, further comprising: The flow of gas through the reduced pressure passage is controlled using a vacuum regulator connected to the reduced pressure passage.

99. The method of claim 93, further comprising: The flow of dielectric gas to the gas supply channel is controlled using a dielectric gas pressure regulator connected to the gas supply channel.

100. The method of claim 93, further comprising: A nitrogen pressure regulator is connected to the gas supply passage to control the flow of nitrogen gas to the gas supply passage.

101. The method according to claim 100, further comprising: The vacuum regulator, the medium gas pressure regulator and the nitrogen pressure regulator are controlled by a control circuit.

102. The method of claim 97, wherein: The first component is a wafer chuck in the form of a flat piece having a flat surface, the method further comprising: The flat surface of the wafer chuck is moved toward the flat surface of the fixed structure thermal chuck to further mate the movable structure gas supply interface with the fixed structure gas supply interface, thereby connecting the inlet opening of the gas supply channel to the fixed structure gas supply pipeline.

103. The method of claim 91, wherein Opening the reduced pressure supply to allow gas to exit the enclosed cavity moves the first and second components relative to each other to ensure proper contact between the contacts and the terminals.

104. The method of claim 91, wherein The pressure-reducing passage is formed in the first component.

105. The method of claim 91, further comprising: an engagement mechanism is operated to move the locking device between a locked position in which the locking device maintains the first and second components locked in the closed position and an unlocked position in which the locking device allows the first and second components to move from the closed relationship to the spaced relationship, the locking device comprising: a first portion engaged with the first component; a second portion engaged with the second component; and A connecting portion has opposite ends fixed to the first portion and the second portion, respectively.

106. The method of claim 91, further comprising: detecting the pressure in the closed cavity; as well as The pressure is communicated to the electronic tester.

107. A testing device comprising: a tray for releasably holding a wafer, wherein the tray has at least a portion that is electrically conductive and has an exposed surface for contacting rear wafer terminals on a rear side of the wafer; contact plate; contact plate front contacts mounted to the contact plate, each contact plate front contact having a surface positioned to contact a corresponding front wafer terminal on the front side of the wafer; an electronic tester connected to the contact plate front contacts such that, in use, current is conducted between the electronic tester and circuitry in the wafer through the front side wafer contacts and the contact plate front contacts to test the circuitry; as well as An electrical conductor connects the conductive portions such that, in use, the circuit is connected to the electronic tester via the back wafer contacts, the exposed surfaces of the conductive portions and the conductive paths.

108. The testing device of claim 107, further comprising: A thermal chuck is provided to which the tray is thermally connected and transfers heat between the thermal chuck and the wafer in use.

109. The testing device of claim 108, wherein: The thermal chuck has a thermal channel such that, in use, a fluid flows through the thermal channel and heat is transferred between the fluid and the thermal chuck.

110. The testing device of claim 107, further comprising: a wafer chuck on which the tray is positioned, the wafer chuck having a vacuum passage therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum passage in the wafer chuck such that when vacuum is applied to the vacuum passage, the vacuum secures the back side of the wafer to the tray.

111. The testing device according to claim 110, wherein: The tray comprises: An electrical insulator surrounds the inlet opening of each vacuum opening.

112. The testing device of claim 110, further comprising: At least one wafer chuck probe is mounted to the contact plate, the wafer chuck probe having a ground contact that contacts the wafer chuck.

113. The testing device according to claim 112, wherein: The wafer chuck probe extends beyond an edge of the tray.

114. The testing apparatus of claim 112, further comprising a plurality of wafer chuck probes.

115. The testing device of claim 107, wherein: The tray includes a return terminal area electrically connected to the exposed surface of the tray, and the contact plate front contacts mounted to the contact plate are power contact plate front contacts, and the electrical return conductor includes: A ground return contact is mounted to the contact plate and has a surface positioned to contact the return terminal area on the tray.

116. The testing device of claim 115, further comprising: a plurality of wafer contact probes, wherein the wafer contact probes are mounted on the contact plate, and the front end contacts of the power contact plate are located on the wafer contact probes; as well as At least one ground return probe is mounted to the contact plate, the ground return contact being on the ground return probe.

117. The testing device of claim 116, wherein: The ground return probe extends beyond the edge of the wafer.

118. The test apparatus of claim 116, further comprising a plurality of ground return probes.

119. The testing device of claim 115, further comprising: A signal distribution board, comprising: Signal distribution board substrate; a signal distribution board contact, the signal distribution board contact being located on the signal distribution board substrate; a signal distribution board terminal, the signal distribution board terminal being located on the signal distribution board substrate; and Signal distribution board conductors connect the signal distribution board contacts to the signal distribution board terminals.

120. The testing device of claim 119, further comprising: A reinforcement plate is positioned to support the signal distribution board substrate.

121. A method for testing a wafer, comprising: holding the wafer in a tray, wherein the tray has at least a portion that is electrically conductive and has an exposed surface for contacting rear wafer terminals on a rear side of the wafer; moving a contact plate and the tray relative to each other so that surfaces of contact plate contacts mounted to the contact plate contact corresponding front wafer contacts on the front side of the wafer; conducting current between an electronic tester and circuits in the wafer through the front side wafer contacts and the contact pad contacts to test the circuits, the circuit being connected to the electronic tester via the back wafer terminals, the exposed surface of the conductive portion, and the conductive path; as well as The wafer is removed from the tray.

122. The method of claim 121, further comprising: thermally coupling the tray to the thermal chuck; as well as Heat is transferred between the thermal chuck and the wafer.

123. The method of claim 122, wherein: A fluid flows through the thermal channel of the thermal chuck, and heat is transferred between the fluid and the thermal chuck.

124. The method of claim 121 , wherein the tray is positioned on the wafer chuck, the wafer chuck having a vacuum passage therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum passage in the wafer chuck, such that the method further comprises: A vacuum is applied to the vacuum channel, the vacuum securing the backside of the wafer to the tray.

125. The method of claim 124, wherein The tray comprises: An electrical insulator surrounds the inlet opening of each vacuum opening.

126. The method of claim 124, further comprising: Contact is made between a ground contact of at least one wafer chuck probe mounted to the contact plate and the wafer chuck.

127. The method of claim 126, wherein The wafer chuck probe extends beyond an edge of the tray.

128. The method of claim 126, further comprising establishing contact between a plurality of wafer chuck probes mounted to the contact plate and the wafer chuck.

129. The method of claim 121, wherein The tray includes a return terminal area electrically connected to the exposed surface of the tray, and the contact plate front contacts mounted to the contact plate are power contact plate front contacts, and the electrical return conductor includes: A ground return contact is mounted to the contact plate and has a surface positioned to contact the return terminal area on the tray.

130. The method of claim 129, wherein: A plurality of wafer contact probes are mounted on the contact plate, and the front end contacts of the power contact plate are located on the wafer contact probes; as well as At least one ground return probe is mounted to the contact plate, the ground return contact being on the ground return probe.

131. The method of claim 130, wherein: The ground return probe extends beyond the edge of the wafer.

132. The method of claim 130, wherein: A plurality of ground return probes are mounted to the contact plate.

133. The method of claim 129, further comprising: Connecting the contact plate to a signal distribution board, the signal distribution board comprising: Signal distribution board substrate; a signal distribution board contact, the signal distribution board contact being located on the signal distribution board substrate; a signal distribution board terminal, the signal distribution board terminal being located on the signal distribution board substrate; and Signal distribution board conductors connect the signal distribution board contacts to the signal distribution board terminals.

134. The method of claim 133, further comprising: A reinforcement plate is positioned to support the signal distribution board substrate.

135. A testing device comprising: Wafer chuck; a tray for releasably holding a wafer, the tray being releasably positionable on the wafer chuck, the wafer chuck having a vacuum passage therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum passage in the wafer chuck such that when vacuum is applied to the vacuum passages, the vacuum secures the back side of the wafer to the tray; contact plate; contact plate contacts mounted to the contact plate, each contact plate contact having a surface positioned to contact a corresponding front wafer terminal on the front side of the wafer; as well as An electronic tester is connected to the contact plate contacts so that, in use, current is conducted between the electronic tester and circuits in the wafer through the front side wafer contacts and the contact plate contacts to test the circuits.

136. The testing device of claim 135, further comprising: A thermal chuck is provided to which the tray is thermally connected and transfers heat between the thermal chuck and the wafer in use.

137. The testing device of claim 136, wherein: The thermal chuck has a thermal channel such that, in use, a fluid flows through the thermal channel and heat is transferred between the fluid and the thermal chuck.

138. The testing device of claim 135, wherein: The tray has at least a portion that is conductive and has an exposed surface for contacting rear wafer terminals on a rear side of the wafer, the testing apparatus further comprising: An electrical conductor connects the conductive portions such that, in use, the circuit is connected to the electronic tester via the back wafer contacts, the exposed surfaces of the conductive portions and the conductive paths.

139. The testing device of claim 138, wherein: The tray comprises: An electrical insulator surrounds the inlet opening of each vacuum opening.

140. The testing device of claim 138, further comprising: At least one wafer chuck probe is mounted to the contact plate, the wafer chuck probe having a ground contact that contacts the wafer chuck.

141. The testing device of claim 140, wherein: The wafer chuck probe extends beyond an edge of the tray.

142. The testing apparatus of claim 140, further comprising a plurality of wafer chuck probes.

143. The testing device of claim 138, wherein: The tray includes a return terminal area electrically connected to the exposed surface of the tray, and the contact plate front contacts mounted to the contact plate are power contact plate front contacts, and the electrical return conductor includes: A ground return contact is mounted to the contact plate and has a surface positioned to contact the return terminal area on the tray.

144. The testing device of claim 135, further comprising: a plurality of wafer contact probes, wherein the wafer contact probes are mounted on the contact plate, and the front end contacts of the power contact plate are located on the wafer contact probes; At least one ground return probe is mounted to the contact plate, the ground return contact being on the ground return probe.

145. The testing device of claim 144, wherein: The ground return probe extends beyond the edge of the wafer.

146. The test apparatus of claim 144, further comprising a plurality of ground return probes.

147. The testing device of claim 143, further comprising: A signal distribution board, comprising: Signal distribution board substrate; a signal distribution board contact, the signal distribution board contact being located on the signal distribution board substrate; a signal distribution board terminal, the signal distribution board terminal being located on the signal distribution board substrate; and Signal distribution board conductors connect the signal distribution board contacts to the signal distribution board terminals.

148. The testing device of claim 147, further comprising: A reinforcement plate is positioned to support the signal distribution board substrate.

149. A method for testing a wafer, comprising: Keep the wafers in the tray; positioning the tray on a chuck; applying a vacuum to a vacuum channel through the wafer chuck, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum channel in the wafer chuck such that the vacuum secures the back side of the wafer to the tray; moving a contact plate and the tray relative to each other so that surfaces of contact plate contacts mounted to the contact plate contact corresponding front wafer contacts on the front side of the wafer; conducting current between an electronic tester and circuits in the wafer through front side wafer contacts and the contact pad contacts to test the circuits; and The wafer is removed from the tray.

150. The method of claim 149, further comprising: thermally coupling the tray to the thermal chuck; as well as Heat is transferred between the thermal chuck and the wafer.

151. The method of claim 150, wherein A fluid flows through the thermal channel of the thermal chuck, and heat is transferred between the fluid and the thermal chuck.

152. The method of claim 149, wherein The tray has at least a portion that is conductive and has an exposed surface for contacting rear wafer terminals on the rear side of the wafer, and the circuit is connected to the electronic tester through the rear wafer terminals, the exposed surface of the conductive portion and the conductive path.

153. The method of claim 152, wherein The tray comprises: An electrical insulator surrounds the inlet opening of each vacuum opening.

154. The method of claim 152, further comprising: Contact is made between a ground contact of at least one wafer chuck probe mounted to the contact plate and the wafer chuck.

155. The method of claim 154, wherein The wafer chuck probe extends beyond an edge of the tray.

156. The method of claim 154 further comprising contacting the wafer chuck between a plurality of wafer chuck probes mounted to the contact plate.

157. The method of claim 149, wherein The tray includes a return terminal area electrically connected to the exposed surface of the tray, and the contact plate front contacts mounted to the contact plate are power contact plate front contacts, and the electrical return conductor includes: A ground return contact is mounted to the contact plate and has a surface positioned to contact the return terminal area on the tray.

158. The method of claim 157, wherein: A plurality of wafer contact probes are mounted on the contact plate, and the front end contacts of the power contact plate are located on the wafer contact probes; as well as At least one ground return probe is mounted to the contact plate, the ground return contact being on the ground return probe.

159. The method of claim 158, wherein The ground return probe extends beyond the edge of the wafer.

160. The method of claim 158, wherein A plurality of ground return probes are mounted to the contact plate.

161. The method of claim 157, further comprising: Connecting the contact plate to a signal distribution board, the signal distribution board comprising: Signal distribution board substrate; a signal distribution board contact, the signal distribution board contact being located on the signal distribution board substrate; a signal distribution board terminal, the signal distribution board terminal being located on the signal distribution board substrate; and Signal distribution board conductors connect the signal distribution board contacts to the signal distribution board terminals.

162. The method of claim 161, further comprising: A reinforcement plate is positioned to support the signal distribution board substrate.

163. A testing device comprising: a vacuum conduit defining a vacuum passage; a wafer holder for releasably holding a wafer, the wafer holder having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum channel such that when a vacuum is applied to the vacuum channel, the vacuum secures the back side of the wafer to the wafer holder, wherein each vacuum opening has an inlet opening at the wafer, an outlet opening remote from the wafer, and an enlarged portion between the inlet opening and the outlet opening to reduce arcing between the openings; contact plate; contact plate contacts mounted to the contact plate, each contact plate contact having a surface positioned to contact a corresponding front wafer terminal on the front side of the wafer; as well as An electronic tester is connected to the contact plate contacts so that, in use, current is conducted between the electronic tester and circuits in the wafer through the front side wafer contacts and the contact plate contacts to test the circuits.

164. The testing device of claim 163, further comprising: A thermal chuck is provided to which the wafer holder is thermally connected when in use, and heat is transferred between the thermal chuck and the wafer.

165. The testing device of claim 164, wherein: The thermal chuck has a thermal channel such that, in use, a fluid flows through the thermal channel and transfers heat between the fluid and the thermal chuck.

166. The testing device of claim 163, wherein: The wafer holder has at least a portion that is electrically conductive and has an exposed surface for contacting rear wafer terminals on a rear side of the wafer; as well as An electrical conductor connects the conductive portions such that, in use, the circuit is connected to the electronic tester via the back wafer contacts, the exposed surfaces of the conductive portions and the conductive paths.

167. The testing device of claim 163, wherein: The wafer holder comprises: Wafer chuck; and a tray for releasably holding a wafer, the tray being releasably positionable on the wafer chuck, the wafer chuck having a vacuum passage therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum passage in the wafer chuck such that when vacuum is applied to the vacuum passages, the vacuum secures the back side of the wafer to the tray.

168. The testing device of claim 167, wherein: The tray comprises: An electrical insulator surrounds the inlet opening of each vacuum opening.

169. The testing device of claim 167, wherein: The tray has at least a portion that is electrically conductive and has an exposed surface for contacting rear wafer terminals on a rear side of the wafer; as well as An electrical conductor connects the conductive portions such that, in use, the circuit is connected to the electronic tester via the back wafer contacts, the exposed surfaces of the conductive portions and the conductive paths.

170. The testing device of claim 169, further comprising: At least one wafer chuck probe is mounted to the contact plate, the wafer chuck probe having a ground contact that contacts the wafer chuck.

171. The testing device of claim 170, wherein: The wafer chuck probe extends beyond an edge of the tray.

172. The testing apparatus of claim 170, further comprising a plurality of wafer chuck probes.

173. The testing device of claim 169, wherein: The tray includes a return terminal area electrically connected to the exposed surface of the tray, and the contact plate front contacts mounted to the contact plate are power contact plate front contacts, and the electrical return conductor includes: A ground return contact is mounted to the contact plate and has a surface positioned to contact the return terminal area on the tray.

174. The testing device of claim 163, further comprising: a plurality of wafer contact probes, wherein the wafer contact probes are mounted on the contact plate, and the front end contacts of the power contact plate are located on the wafer contact probes; as well as At least one ground return probe is mounted to the contact plate, the ground return contact being on the ground return probe.

175. The testing device of claim 174, wherein: The ground return probe extends beyond the edge of the wafer.

176. The test device of claim 174, further comprising a plurality of ground return probes.

177. The testing device of claim 173, further comprising: A signal distribution board, comprising: Signal distribution board substrate; a signal distribution board contact, the signal distribution board contact being located on the signal distribution board substrate; a signal distribution board terminal, the signal distribution board terminal being located on the signal distribution board substrate; and Signal distribution board conductors connect the signal distribution board contacts to the signal distribution board terminals.

178. The testing device of claim 177, further comprising: A reinforcement plate is positioned to support the signal distribution board substrate.

179. A method for testing a wafer, comprising: releasably holding a wafer in a wafer holder having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to a vacuum channel; applying a vacuum to the vacuum channel, the vacuum securing the back side of the wafer to the wafer holder; moving a contact plate and the tray relative to each other so that surfaces of contact plate contacts mounted to the contact plate contact corresponding front wafer contacts on the front side of the wafer; conducting current between an electronic tester and circuitry in the wafer through front-side wafer contacts and contact plate contacts to test the circuitry, wherein each vacuum opening has an entry opening at the wafer, an exit opening remote from the wafer, and an enlarged portion between the entry opening and the exit opening to reduce arcing between the openings; as well as The wafer is removed from the tray.

180. The method of claim 179, further comprising: thermally coupling the tray to the thermal chuck; as well as Heat is transferred between the thermal chuck and the wafer.

181. The method according to claim 180, wherein A fluid flows through the thermal channel of the thermal chuck, and heat is transferred between the fluid and the thermal chuck.

182. The method of claim 179, wherein The tray has at least a portion that is conductive and has an exposed surface for contacting rear wafer terminals on the rear side of the wafer, and the circuit is connected to the electronic tester through the rear wafer terminals, the exposed surface of the conductive portion, and the conductive path.

183. The method of claim 179, wherein The wafer holder comprises: Wafer chuck; and a tray for releasably holding a wafer, the tray being releasably positionable on the wafer chuck, the wafer chuck having a vacuum passage therethrough, the tray having a plurality of vacuum openings therethrough, each vacuum opening connecting a back side of the wafer to the vacuum passage in the wafer chuck such that when vacuum is applied to the vacuum passages, the vacuum secures the back side of the wafer to the tray.

184. The method of claim 182, wherein The tray comprises: An electrical insulator surrounds the inlet opening of each vacuum opening.

185. The method of claim 182, further comprising: Contact is made between a ground contact of at least one wafer chuck probe mounted to the contact plate and the wafer chuck.

186. The method of claim 185, wherein The wafer chuck probe extends beyond an edge of the tray.

187. The method of claim 186 further comprising contacting the wafer chuck between a plurality of wafer chuck probes mounted to the contact plate.

188. The method of claim 179, wherein The tray includes a return terminal area electrically connected to the exposed surface of the tray, and the contact plate front contacts mounted to the contact plate are power contact plate front contacts, and the electrical return conductor includes: A ground return contact is mounted to the contact plate and has a surface positioned to contact the return terminal area on the tray.

189. The method of claim 188, wherein: A plurality of wafer contact probes are mounted on the contact plate, and the front end contacts of the power contact plate are located on the wafer contact probes; as well as At least one ground return probe is mounted to the contact plate, the ground return contact being on the ground return probe.

190. The method of claim 189, wherein The ground return probe extends beyond the edge of the wafer.

191. The method according to claim 189, wherein A plurality of ground return probes are mounted to the contact plate.

192. The method according to claim 188, further comprising: Connecting the contact plate to a signal distribution board, the signal distribution board comprising: Signal distribution board substrate; a signal distribution board contact, the signal distribution board contact being located on the signal distribution board substrate; a signal distribution board terminal, the signal distribution board terminal being located on the signal distribution board substrate; and Signal distribution board conductors connect the signal distribution board contacts to the signal distribution board terminals.

193. The method according to claim 192, further comprising: A reinforcement plate is positioned to support the signal distribution board substrate.

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