High-buffering self-cleaning type flexible composite abrasive material and preparation method and precision grinding application of high-buffering self-cleaning type flexible composite abrasive material

Abstract

The invention belongs to the field of high-end manufacturing of electronic devices, optical elements and the like, and particularly relates to a high-buffering self-cleaning type flexible composite abrasive and a preparation method and precision grinding application thereof. Through collaborative design of the elastic buffer body and the self-cleaning functional component, a three-dimensional network buffer structure is constructed, so that the grinding stress is reduced by 70%, and the surface scratch depth is less than or equal to 0.3 mu m. The chip removal rate is larger than or equal to 90% through photocatalysis and super-hydrophobic characteristics, the heat dissipation and chip containing capacity is optimized in combination with a microcosmic porous structure, and the machining precision and efficiency of precision elements are remarkably improved. The grinding material is suitable for precise grinding scenes of optical elements, electronic devices and the like, and solves the technical defects of insufficient buffering and poor self-cleaning of traditional grinding materials.

Description

Technical Field

[0001] The present invention belongs to the field of high-end manufacturing of electronic devices, optical elements, etc., and specifically relates to a high-buffered self-cleaning flexible composite abrasive, a preparation method thereof, and precision grinding applications. Background Art

[0002] In high-end manufacturing fields such as electronic devices, optical components, and precision molds, precision grinding is a key process for ensuring component accuracy and surface quality. As precision manufacturing evolves towards miniaturization and high precision, higher requirements are placed on the abrasive's cushioning and self-cleaning capabilities.

[0003] Currently, abrasives used in precision grinding have the following major shortcomings: First, traditional rigid abrasives (such as aluminum oxide and silicon carbide) have poor cushioning properties, easily causing scratches and cracks on the surface of precision components during the grinding process, making them difficult to meet the grinding requirements of high-precision components. Second, while some flexible abrasives offer some cushioning properties, they lack self-cleaning capabilities. Debris generated during grinding easily adheres to the abrasive surface or the machining area, causing secondary wear and reducing grinding accuracy and efficiency.

[0004] In addition, existing abrasives have difficulty striking a balance between buffering, self-cleaning, and grinding efficiency. In precision grinding applications, problems such as unstable processing quality and low production efficiency often occur due to the single performance of the abrasive. To improve the current situation, some technologies have attempted to enhance abrasive performance by adding buffers or surface modification. However, these improvements have not deeply studied the synergistic mechanism between abrasive buffering, self-cleaning, and grinding performance, nor have they systematically addressed the problem of balancing multiple performances in precision grinding. In actual applications, it is still impossible to achieve stable and efficient operation of abrasives in precision grinding, making it difficult to meet the urgent demand for high-quality, high-efficiency grinding in modern precision manufacturing. Summary of the Invention

[0005] In response to the problems in the prior art that traditional rigid abrasives easily cause damage to the substrate and flexible abrasives have poor self-cleaning ability, resulting in low grinding efficiency and insufficient precision, the present invention proposes a high-buffered self-cleaning flexible composite abrasive, its preparation method and precision grinding application.

[0006] The technical solution of the present invention is: A highly buffered, self-cleaning, flexible composite abrasive, comprising the following components in percentage by mass: Sodium bicarbonate matrix: 60%-80%; Elastic buffer: 10%-20%, selected from polyurethane, silicone rubber; Self-cleaning functional components: nano-titanium dioxide 5%-10%, graphene 5%-10%; Auxiliary additives: dispersants, lubricants totaling 0.1%-0.3%; The elastic buffer body and the self-cleaning functional component are compounded through a three-dimensional network buffer structure to form a highly buffered flexible matrix with controllable deformation; and the nano-titanium dioxide and graphene work synergistically to achieve photocatalytic decomposition of debris and super-hydrophobic separation.

[0007] Furthermore, in the above-mentioned high-buffering self-cleaning flexible composite abrasive, the ratio of nano-titanium dioxide to graphene is 1:1-2:1.

[0008] Furthermore, in the above-mentioned high-buffering self-cleaning flexible composite abrasive, the elastic buffer body is structure-optimized through molecular dynamics simulation, so that the grinding stress is reduced by more than 70%, and the surface roughness Ra value is ≤0.2μm.

[0009] Furthermore, the above-mentioned highly buffered, self-cleaning, flexible composite abrasive has a microporous structure with a porosity of 30%-40%, uniform pore distribution, a chip holding capacity increased by 60%, and a heat dissipation efficiency improved by 50%.

[0010] The method for preparing the abrasive comprises the following steps: Step 1, blending the sodium bicarbonate matrix and the elastic buffer at 40° C.-50° C.; Step 2: Add nano-titanium dioxide, graphene and auxiliary additives, and stir at high speed until evenly dispersed; Step 3: After compression molding, the abrasive is cured at a low temperature below 50° C. to obtain the abrasive.

[0011] The abrasive is used for precision grinding. During grinding, the abrasive is used to grind optical elements or semiconductor substrates under a grinding pressure of 0.2-0.3 MPa for 10-20 minutes.

[0012] Furthermore, in the above-mentioned precision grinding application, debris on the abrasive surface is removed by irradiation after grinding, and the irradiation time is 10-15 minutes.

[0013] Advantages and beneficial effects of the present invention: 1. Improved the buffering performance of the grinding process, controlling the grinding stress below 0.5MPa, which is 70% lower than that of traditional rigid abrasives, effectively avoiding surface damage of precision components; 2. Enhanced self-cleaning efficiency. Under light conditions, the debris removal rate on the abrasive surface reaches over 90%, which is 60% higher than that of ordinary flexible abrasives, keeping the grinding interface clean. 3. Improved grinding accuracy, reducing the surface roughness Ra value to within 0.2μm, which is 60% higher than traditional abrasives, meeting the needs of high-end precision grinding; 4. The present invention optimizes the abrasive formula and structure to ensure stable performance under various complex working conditions such as high temperature (≤80°C), high humidity (humidity ≤85%), and high load.

[0014] 5. This invention overcomes the strict environmental requirements of traditional abrasives and is widely applicable to precision grinding scenarios in diverse working conditions, such as the processing of electronic devices and optical components in diverse environments, thus expanding its application range. Unlike the high energy consumption and high pollution of traditional abrasive preparation processes, this invention conforms to the concept of green manufacturing, reduces energy consumption by 40% during the preparation process, eliminates harmful waste gas and waste liquid emissions, and promotes the sustainable development of the precision grinding industry. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 The microstructure diagram of the abrasive obtained in Example; Figure 2 This is a comparison diagram of the rigid impact of the abrasive of Example 1 of the present invention and the traditional abrasive, wherein (a) is flexible impact and (b) is rigid impact of the traditional abrasive; Figure 3 The scratches on the optical glass substrate surface under the microscope in Example 1. DETAILED DESCRIPTION

[0016] In a specific embodiment, a highly buffered self-cleaning flexible composite abrasive is composed of the following components in percentage by mass: Sodium bicarbonate matrix: 60%-80%; Elastic buffer: 10%-20%, selected from polyurethane, silicone rubber; Self-cleaning functional components: nano-titanium dioxide 5%-10%, graphene 5%-10%; Auxiliary additives: dispersants, lubricants totaling 0.1%-0.3%; The elastic buffer and the self-cleaning functional component are compounded through a three-dimensional network buffer structure to form a highly buffered flexible matrix with controllable deformation; sodium bicarbonate serves as a matrix, providing water-soluble self-decomposition properties; the elastic buffer gives the abrasive high buffering performance, reducing damage to the workpiece surface; and the nano-titanium dioxide and graphene work synergistically to achieve photocatalytic decomposition of debris and super-hydrophobic separation; auxiliary additives ensure uniform dispersion of the components, thereby improving the performance of the abrasive.

[0017] The specific implementation methods of the present invention are further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention but cannot be used to limit the scope of the present invention. Example 1

[0018] This embodiment provides a highly buffered, self-cleaning, flexible composite abrasive, comprising the following components in percentage by mass: Sodium bicarbonate matrix: 70%; Elastic buffer: silicone rubber 15%; Self-cleaning functional components: nano-titanium dioxide 8%, graphene 6.9%; Auxiliary additives: dispersant, lubricant totaling 0.1%; The preparation method comprises the following steps: 1. Select optical glass as the grinding substrate, polish it with 1000# and 2000# water-abrasive sandpaper in turn to remove surface impurities, then ultrasonically clean it with deionized water for 10 minutes and dry it for later use; 2. Blend sodium bicarbonate and silicone rubber at 40°C; 3. Add nano-titanium dioxide, graphene and auxiliary additives, and disperse them evenly through high-speed stirring; 4. The abrasive is obtained by molding and low temperature curing (50°C).

[0019] The microstructure of the abrasive obtained is as follows Figure 1 As shown in Figure 3, the porosity of its microporous structure is 30%, and the pores are evenly distributed.

[0020] The prepared abrasive was used for grinding the surface of optical glass. The grinding pressure was controlled at 0.3 MPa and the grinding time was 15 minutes.

[0021] Testing of grinding results: Surface roughness: detected by profilometer, Ra value is 0.18μm.

[0022] Scratches: Figure 3 As shown, there are no obvious scratches when observed under a microscope.

[0023] Self-cleaning effect: After 10 minutes of light exposure after grinding, the debris removal rate reaches 92%.

[0024] Chip capacity detection: Chip capacity increased by 60% through actual grinding chip collection Heat dissipation efficiency testing: Through thermocouple temperature measurement and infrared thermal imaging testing, the heat dissipation efficiency is improved by 50%.

[0025] Example 2

[0026] This embodiment provides a highly buffered, self-cleaning, flexible composite abrasive, comprising the following components in percentage by mass: Sodium bicarbonate matrix: 65%; Elastic buffer: polyurethane 19.7%; Self-cleaning functional components: nano-titanium dioxide 10%, graphene 5%; Auxiliary additives: dispersant, lubricant totaling 0.3%; The preparation method comprises the following steps: 1. Select a silicon wafer as the grinding substrate, clean it with acetone ultrasonically for 5 minutes to remove oil stains, and then rinse with deionized water and dry it; 2. Blend sodium bicarbonate and polyurethane at 45°C; 3. Add nano titanium dioxide, graphene and auxiliary additives; 4. The abrasive is obtained by molding and low temperature curing (40°C).

[0027] The prepared abrasive was used to grind the surface of a silicon wafer at a grinding pressure of 0.25 MPa for 20 minutes.

[0028] Testing of grinding results: Surface roughness: Ra value is 0.15μm.

[0029] Scratch condition: Observed under a microscope, no damaging scratches.

[0030] Self-cleaning effect: After 15 minutes of light exposure after grinding, the debris removal rate is 90%.

[0031] Chip capacity detection: Through actual grinding chip collection, the chip capacity is increased by 55%.

[0032] Heat dissipation efficiency testing: Through thermocouple temperature measurement and infrared thermal imaging testing, the heat dissipation efficiency is improved by 55%.

[0033] Comparative Example: The same optical glass substrate as in Example 1 was selected and polished and cleaned in the same manner. The optical glass surface was ground using a conventional alumina rigid abrasive at a grinding pressure of 0.3 MPa for 15 minutes.

[0034] Testing of grinding results: Surface roughness: Ra value is 0.6μm.

[0035] Scratch condition: Obvious scratches can be seen under a microscope.

[0036] By comparing Examples 1 and 2 with the comparative example, the highly buffered self-cleaning flexible composite abrasive of the present invention can effectively reduce surface roughness and avoid scratches in precision grinding, and has an excellent self-cleaning effect, which is significantly better than traditional rigid abrasives.

[0037] The above embodiments are intended only to illustrate the technical concepts and features of the present invention and to enable those skilled in the art to understand and implement the present invention accordingly. They are not intended to limit the scope of protection of the present invention. Any changes and modifications made without departing from the spirit and substance of the present invention are intended to be covered by the scope of protection of the claims of the present invention.

Claims

1. A highly buffered self-cleaning flexible composite abrasive, characterized in that: It is composed of the following components in percentage by mass: Sodium bicarbonate matrix: 60%-80%; Elastic buffer: 10%-20%, selected from polyurethane, silicone rubber; Self-cleaning functional components: nano-titanium dioxide 5%-10%, graphene 5%-10%; Auxiliary additives: dispersants, lubricants totaling 0.1%-0.3%; The elastic buffer body and the self-cleaning functional component are compounded through a three-dimensional network buffer structure to form a highly buffered flexible matrix with controllable deformation; and the nano-titanium dioxide and graphene work synergistically to achieve photocatalytic decomposition of debris and super-hydrophobic separation.

2. The high-buffered self-cleaning flexible composite abrasive according to claim 1, characterized in that: The ratio of the nano-titanium dioxide to the graphene is 1:1-2:

1.

3. The high-buffered self-cleaning flexible composite abrasive according to claim 1, characterized in that: The elastic buffer body is structure-optimized through molecular dynamics simulation, so that the grinding stress is reduced by more than 70%, and the surface roughness Ra value is ≤0.2μm.

4. The high-buffered self-cleaning flexible composite abrasive according to claim 1, characterized in that: The microscopic porous structure of the abrasive has a porosity of 30%-40%, the pores are evenly distributed, the chip holding capacity is increased by 60%, and the heat dissipation efficiency is improved by 50%.

5. A method for preparing the abrasive according to any one of claims 1 to 4, characterized in that: The following steps are involved: Step 1, blending the sodium bicarbonate matrix and the elastic buffer at 40° C.-50° C.; Step 2: Add nano-titanium dioxide, graphene and auxiliary additives, and stir at high speed until evenly dispersed; Step 3: After compression molding, the abrasive is cured at a low temperature below 50° C. to obtain the abrasive.

6. An application of the abrasive according to any one of claims 1 to 4 for precision grinding, characterized in that: During grinding, the optical element or semiconductor substrate is ground using the abrasive under a grinding pressure of 0.2-0.3 MPa for 10-20 minutes.

7. The precision grinding application according to claim 6, characterized in that: After grinding, the debris on the abrasive surface is removed by irradiation, and the irradiation time is 10-15 minutes.

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