Memory heat dissipation module and preparation method thereof

Abstract

The invention provides a memory heat dissipation module and a preparation method thereof, the memory heat dissipation module comprises a heat dissipation assembly composed of a front plate and a back plate, the front plate and the back plate form a cavity structure comprising a phase change area and a backflow area in a welding mode, the lower part of a vacuum cavity is filled with a phase change medium, and the phase change medium can be transferred to the upper backflow area after being heated. The vacuum cavity is divided into a plurality of backflow channels through the supporting protruding blocks, the heat dissipation teeth and the heat dissipation through holes covering the surfaces of the supporting protruding blocks are formed in the front plate through the stamping technology, heat of the supporting protruding blocks can be transmitted to the heat dissipation teeth and the heat dissipation through holes without any blocking, and the heat dissipation capacity is improved while the front plate is supported. According to the embodiment of the invention, a structure for clamping the memory by the two groups of heat dissipation assemblies is provided, and the whole heat dissipation device is divided into an upper air cooling area and a lower clamping area, so that the installation of the memory is not influenced. The heat dissipation effect of 30W power consumption of the memory can be met, and the heat dissipation device is particularly suitable for being used in the memory of a data center / server / intelligent chip.

Description

Technical Field

[0001] The present invention relates to a heat dissipation device, in particular to a memory heat dissipation module and a preparation method thereof. Background Art

[0002] With the rise of artificial intelligence, the demand for computing power in data centers, servers, and smart chips is increasing. The power consumption of individual servers has increased significantly, and the power consumption of the memory modules they support is also increasing. Relying on the memory's own heat dissipation is insufficient to meet its thermal efficiency requirements. The difficulty in dissipating memory heat lies in the limited space within the device. The thickness and weight of the memory itself do not allow for the use of overly complex heat dissipation modules. Traditional approaches to improving memory heat dissipation have focused on improving the material or structure of the memory itself, coupled with air cooling modules to increase the heat dissipation area or enhance heat dissipation capacity. However, these improvements are limited and cannot meet the growing heat dissipation needs. Therefore, a new heat dissipation device is needed to increase the heat dissipation capacity of the memory. Summary of the Invention

[0003] To solve the above technical problems, the present invention provides a memory heat dissipation module, including a heat dissipation component, wherein the heat dissipation component includes:

[0004] a front plate, one side of the front plate being in contact with the heat source;

[0005] a back plate, disposed opposite to the other side of the front plate and enclosing a sealed vacuum cavity with the front plate;

[0006] A phase change zone is located at the lower part of the vacuum cavity and is filled with a phase change medium;

[0007] a reflow zone, located at the upper portion of the vacuum cavity and connected to the phase change zone;

[0008] Multiple groups of support bumps are arranged in the reflow area, connected between the front plate and the back plate and separating the vacuum cavity, and vertically arranged reflow channels are formed between the multiple groups of support bumps;

[0009] and a plurality of heat dissipation holes provided on the front panel, wherein the heat dissipation holes are provided corresponding to the positions of the support protrusions, the inner sides of the heat dissipation holes are sealed and connected to the support protrusions, and the outer sides of the heat dissipation holes are provided with heat dissipation teeth;

[0010] The outer side surfaces of the two groups of front plates are arranged opposite to each other, and a clamping position at the lower part and an air cooling channel at the upper part are formed between the two groups of front plates.

[0011] Furthermore, the front plate is provided with a heat conducting portion in contact with the heat source on the outer side of the phase change region to enhance the heat transfer capability from the heat source to the phase change medium.

[0012] Furthermore, the heat conducting portion is a heat conducting block attached to the surface of the heat source or an interface material coated on the outer side of the front plate.

[0013] Furthermore, the back plate includes an outer sealing edge arranged around the edge and a recessed area surrounded by the outer sealing edge, and the supporting protrusion is formed in the recessed area; the front plate is sealed to the outer sealing edge and the supporting protrusion.

[0014] Furthermore, a plurality of support portions are arranged in the phase change region, and the support portions are located between the front plate and the back plate.

[0015] Furthermore, the heat dissipation components are divided into two groups, which are respectively connected to both sides of the heat source. The outer side surfaces of the two groups of front plates are arranged opposite to each other, and a clamping position at the bottom and an air cooling channel at the top are formed between the two groups of front plates.

[0016] Furthermore, an air cooling component is provided, and both ends of the air cooling channel are open. The air flow generated by the air cooling component flows from one end opening to the other end of the air cooling channel.

[0017] Furthermore, the two groups of heat dissipation components are provided with connecting edges on the opposite surfaces thereof, and the connecting edges extend from the edges of the heat dissipation components, and the two groups of heat dissipation components are connected by the connecting edges.

[0018] Furthermore, the heat dissipation teeth on the two groups of front panels are arranged at intervals in the vertical direction.

[0019] The present invention also provides a method for preparing the memory heat dissipation module, comprising the following steps:

[0020] S1. Prepare two sets of back plates and front plates respectively, punch out support bumps on one side of the back plate, and punch out heat dissipation holes and heat dissipation teeth at positions corresponding to the support bumps on the front plate;

[0021] S2. Assemble the back plate and the front plate, and seal the edge of the back plate and the edge of the supporting bump by welding to maintain the sealing of the vacuum chamber;

[0022] S3, injecting phase change medium into the vacuum chamber from the liquid injection port and extracting the vacuum, and sealing the liquid injection port;

[0023] S4. Connect the two sets of heat dissipation components and clamp the heat source between the two sets of front plates so that the heat dissipation surfaces on both sides of the heat source fit in with the outer side of the phase change zone.

[0024] The present invention provides a memory heat dissipation module and its preparation method. The module comprises a heat dissipation assembly consisting of a front plate and a back plate. The front and back plates are welded to form a cavity structure containing a phase change zone and a reflow zone. The lower portion of the vacuum cavity is filled with a phase change medium, which transfers heat to the upper reflow zone. The present invention's support bumps divide the vacuum cavity into multiple reflow channels. Heat dissipation teeth and heat dissipation holes are formed on the surface of the support bumps through a stamping process. Heat from the support bumps is unimpededly transferred to the heat dissipation teeth and heat dissipation holes, thereby supporting the front plate and increasing heat dissipation capacity. In an embodiment, a structure is provided in which two sets of heat dissipation assemblies clamp the memory, dividing the entire heat dissipation device into an upper air-cooling area and a lower clamping area. Heat is concentrated in the upper air-cooling area and can be quickly carried away by the cooling airflow. The lower clamping area stably secures the memory in place without affecting its installation. The present invention has the advantages of a stable structure and easy assembly. It can meet the heat dissipation requirements of 30W memory power consumption and is particularly suitable for memory use in data centers, servers, and smart chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of the heat dissipation assembly of the present invention;

[0026] Figure 2 is an exploded schematic diagram of the heat dissipation assembly of the present invention;

[0027] Figure 3 It is a structural schematic diagram of a memory heat dissipation module of the present invention;

[0028] Figure 4 This is an exploded schematic diagram of a memory heat dissipation module of the present invention;

[0029] Figure 5 It is a side view of a memory heat dissipation module of the present invention.

[0030] Figure numerals: front panel 1, back panel 2, vacuum cavity 3, support bump 4, heat dissipation through hole 5, heat dissipation teeth 6, outer sealing edge 7, support portion 8, connecting edge 9, first connecting hole 10, second connecting hole 11, liquid filling port 12, memory 13, slot 14, phase change zone 15, reflow zone 16, air cooling channel 17. DETAILED DESCRIPTION

[0031] Example 1: A memory heat dissipation module suitable for memory heat dissipation of electronic devices such as servers, data centers, and GPU chips, see Figure 1 and Figure 2The heat dissipation assembly comprises a pair of opposing front and back plates 1 and 2. Both the front and back plates are plate-shaped structures, sealed at their edges. Air between the two plates is extracted, forming a sealed vacuum chamber 3 between them. From top to bottom, the vacuum chamber 3 is divided into a recirculation zone 16 and a phase change zone 15. The phase change zone 15 is filled with a phase change medium. The recirculation zone 16 is located above and connected to the phase change zone 15. The outer surface of the front plate 1 contacts the heat source at the position corresponding to the phase change zone 15. Heat is transferred from the front plate 1 to the phase change medium within the vacuum chamber. Upon being heated, the phase change medium undergoes a phase change and flows upward. Upon reaching the recirculation zone 16, it releases heat, condenses into a liquid, and then returns to the phase change zone 15 below, continuing to exchange heat with the heat source. The vacuum chamber provides a sufficient and stable phase change environment for the phase change medium, reducing heat loss due to conduction and convection, and improving the thermal radiation efficiency of the phase change medium.

[0032] In this embodiment, phase change media such as water and alcohol are selected, and the phase change temperature in a vacuum environment is close to room temperature, which can better dissipate heat for the memory 13 in the use environment of the heat source.

[0033] The purpose of the present invention is to construct a heat dissipation component based on the phase change principle. Multiple groups of support bumps 4 made of thermally conductive material are arranged side by side in the recirculation zone 16. The support bumps 4 are connected between the front plate 1 and the back plate 2 and isolate the vacuum chamber 3, so that multiple vertically arranged recirculation channels are formed between the support bumps 4. The recirculation channels are connected to the phase change zone 15. The phase change medium in the recirculation zone 16 exchanges heat with each support bump 4, and after cooling, returns to the phase change zone 15 along each recirculation channel. Heat dissipation holes 5 are opened in the front plate 1 at positions corresponding to each support bump 4. The inner side edges of the heat dissipation holes 5 are sealed to the support bump 4, and heat dissipation teeth 6 are opened outward on the outer sides of the heat dissipation holes 5. The heat exchanged between the support bump 4 and the phase change medium is transferred to the atmosphere through each heat dissipation tooth 6, thereby fully exchanging heat with the external atmospheric environment.

[0034] In the above structure, the support protrusion 4 is connected to the inner side of the front plate 1, dividing the recirculation area 16 into multiple recirculation channels without affecting the sealing of the vacuum chamber 3; the support protrusion 4 can support the front plate 1 to prevent the front plate 1 from deforming during the vacuum extraction process. The heat dissipation holes 5 are arranged in an array on the surface of the front plate 1, so that the outer surface of the support protrusion 4 is unobstructed, and the heat in the recirculation channel is directly transferred to the atmosphere through the support protrusion 4. The heat dissipation teeth 6 concentrate the heat transferred from the support protrusion 4 on the heat dissipation teeth 6, extending the heat exchange area with the atmosphere without blocking the heat dissipation holes 5.

[0035] Furthermore, the front panel 1 is provided with a heat conducting portion outside the phase change region 15, which contacts the heat source and enhances heat transfer from the heat source to the phase change medium. The heat conducting portion can be a heat conducting block made of a thermally conductive material, which contacts the heat transfer surface of the heat source, transferring heat and locating the heat source. Alternatively, the heat conducting portion can be an interface material applied to the outer surface of the front panel 1, dissipating heat through the interface material.

[0036] Furthermore, the back plate 2 and front plate 1 are each made of a thermally conductive metal material, such as stainless steel or copper. The back plate 2 includes an outer sealing edge 7 around its edge and a recessed area enclosed by the outer sealing edge 7. Support protrusions 4 are formed within the recessed area, their upper surfaces roughly flush with the outer sealing edge 7. Heat dissipation holes 5 are formed on the surface of the front plate 1, and heat dissipation teeth 6 are stamped from the edges of the heat dissipation holes 5, providing a convenient and quick seal. The front plate 1 and back plate 2 are sealed using a laser welding process. After assembly, the edge of the front plate 1 is attached to the outer sealing edge 7 of the back plate 2, and the center of the front plate 1 is attached to the edge of the support protrusions 4. The support protrusions 4 are connected to the edges of each heat dissipation hole 5, effectively supporting the front plate 1 and maintaining a high vacuum level in the return flow channel. Heat dissipation holes 5 are provided on the surface of the support protrusions 4, allowing them to transfer heat to the front plate 1. Some of the heat from the support protrusions 4 flows unimpeded into the atmosphere, while some of the heat is concentrated in the heat dissipation teeth 6, thereby improving the heat exchange efficiency of the support protrusions 4.

[0037] Furthermore, an injection port 12 is provided at the edge of the heat dissipation assembly, specifically the outer sealing edge 7 of the back panel 2. This port 12 connects to the vacuum chamber 3. After welding the back panel 2 to the front panel 1, the phase change medium is injected into the vacuum chamber through the port 12. The port 12 is then connected to a vacuum pump to extract the gas from the vacuum chamber 3. The port 12 is then removed or sealed to ensure a high vacuum level within the vacuum chamber 3. The entire molding process is simple and easy, and the support bumps 4 provide sufficient support for the front panel 1.

[0038] Furthermore, multiple support portions 8 are arranged within the phase change region 15. These support portions 8 are located between the front panel 1 and the back panel 2. These support portions 8 can be ribbed, columnar, or otherwise arranged throughout the phase change region 15. Similar to the support bumps 4, the support portions 8 provide support for the front panel 1 during the vacuum stage to prevent excessive deformation.

[0039] The present invention is different from the capillary heat dissipation structure in the prior art. The heat dissipation structure is designed based on the principle of phase change medium reflux, and has the advantages of strong heat dissipation capacity, low molding difficulty, and high structural strength.

[0040] Example 2: Figure 3 and Figure 4The figure shows an example of the application of the above-mentioned heat dissipation assembly in a memory cooling system. The memory cooling system includes a slot 14 and an air-cooling component positioned at the end of the slot 14 along the length of the slot 14. The heat source is the memory module inserted into the slot 14. Two sets of heat dissipation components, as described in Example 1, are also provided. The two sets of heat dissipation components are connected to either side of the memory 13. The front plates 1 of each phase change heat dissipation component are positioned opposite each other and contact one surface of the memory 13, exchanging heat with that surface. The space between the two sets of front plates 1 is divided into an upper heat absorption zone and a lower heat dissipation zone corresponding to the phase change zone 15 and the reflow zone 16. The memory 13 is located in the heat absorption zone and is sandwiched between the heat dissipation components on both sides. The heat dissipation teeth 6 of the two front plates 1 are positioned opposite each other, forming an air cooling channel 17 between the two front plates 1. The air cooling channel 17 is open at both ends. The cooling air generated by the air cooling component enters through the air cooling channel through one end opening and exits through the other end opening. The air flow removes heat from the air cooling channel 17, thereby cooling the support bump 4 and the heat dissipation teeth 6.

[0041] Furthermore, the heat dissipation teeth 6 on the two groups of front panels 1 are not limited to a symmetrical arrangement in the vertical direction, but are arranged in a vertically intersecting pattern. This arrangement allows the width of the air cooling channel 17 to be adapted to the width of the memory 13, increasing the heat dissipation area of ​​the heat dissipation teeth 6 without increasing the width of the air cooling channel 17. In this embodiment, the support protrusions 4 are arranged in eight groups, and each group of support protrusions 4 has 4-6 heat dissipation holes 5 arranged vertically. The size of a single heat dissipation tooth 6 is approximately half the size of the air cooling channel 17. This arrangement structure can enhance the convection area between the heat dissipation teeth 6 and the cooling gas.

[0042] In this embodiment, connecting edges 9 are provided on the opposite surfaces of the two groups of heat dissipation components. The connecting edges 9 are further arranged to extend from the edge of the heat dissipation component to the opposite side from the edge of the front plate 1. First connecting holes 10 are respectively provided at corresponding positions of the two groups of connecting edges 9. Connectors, such as rivets, screws, etc., are installed in the first connecting holes 10. The positions of the two groups of heat dissipation components are fixed by riveting or screwing, and the two groups of heat dissipation components are fixed as a whole, so that the two groups of heat dissipation components can stably clamp the memory 13, and the connecting edges 9 are arranged on the edge of the front plate 1 for easier processing; since the bottom of the heat dissipation component is the heat conduction and clamping area of ​​the memory 13, the connecting edges 9 are preferentially arranged on the upper edge and side edge of the front plate 1, and the position of the side edge connecting edge 9 is set in the lower clamping area as much as possible to avoid blocking the air cooling channel 17.

[0043] Furthermore, the surfaces opposite to each other of the two heat dissipation components are provided with positioning components for positioning the two heat dissipation components, including: Figure 2As shown, the second connection holes 11 are provided on the surfaces of the two heat dissipation components. These second connection holes 11 are formed on the surface of the heat-conducting bumps to prevent the vacuum level of the vacuum chamber 3 from being affected during connection. Connectors are inserted into the second connection holes 11 to secure the positions of the two heat dissipation components from the center. It should be noted that the positioning components are not limited to riveted or screwed structures; other common snap-on or buckled structures may also be used. For example, positioning posts may be provided on one heat dissipation component and positioning holes may be provided on the other heat dissipation component to achieve positioning of the two heat dissipation components.

[0044] Combine Figures 3 to 5 The preparation process of this embodiment is roughly as follows: prepare two groups of back plates 2 and front plates 1 respectively, punch out support protrusions 4 on one side surface of the back plate 2, and punch out heat dissipation holes 5 and heat dissipation teeth 6 at positions corresponding to the support protrusions 4 on the front plate 1; assemble the back plate 2 and the front plate 1, and seal the edges of the back plate 2 and the edges of the support protrusions 4 by welding to maintain the sealing degree of the vacuum cavity 3; inject phase change medium into the vacuum cavity 3 from the liquid injection port 12 and draw vacuum, and seal the liquid injection port 12; connect the two groups of heat dissipation components, clamp the heat source between the two groups of front plates 1, so that the heat dissipation surfaces on both sides of the heat source are in contact with the outer side of the phase change zone 15.

[0045] In this embodiment, two sets of heat sink components sandwich the memory 13. The lower portion of the memory 13 extends beyond the lower surface of the front panel 1, forming a single unit with the memory 13. When the memory 13 is inserted into the slot 14, the heat generated by the memory 13 is transferred to the phase-change medium. After the phase change, the phase-change medium is then transferred via the heat-conducting bumps to the heat dissipation holes 5 and heat dissipation teeth 6. The two opposing front panels 1 limit the air-cooling area, and the air-cooling components dissipate heat from the air-cooling channels 17. Actual device testing shows that this embodiment can meet the energy consumption requirements of memory exceeding 30W, far exceeding the existing heat dissipation devices using capillary structures.

[0046] Although the embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and are not to be construed as limitations on the present invention. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A memory heat dissipation module, characterized in that: The device comprises two sets of heat dissipation components respectively connected to both sides of a heat source, wherein the heat dissipation components include: A front plate (1), one side of the front plate (1) being in contact with a heat source; A back plate (2) is arranged on the other side of the front plate (1) and encloses the front plate (1) to form a sealed vacuum cavity (3); A phase change region (15) is located at the lower portion of the vacuum cavity (3), wherein the phase change region (15) is filled with a phase change medium; a reflow zone (16), located at the upper portion of the vacuum cavity (3) and connected to the phase change zone (15); Multiple groups of support bumps (4) are made of heat-conducting material and are arranged in the reflow area (16), connected between the front plate (1) and the back plate (2) and separating the vacuum cavity (3), with vertically arranged reflow channels formed between the multiple groups of support bumps (4); and a plurality of heat dissipation holes (5) provided on the front plate (1), wherein the heat dissipation holes (5) are provided at positions corresponding to the support protrusions (4), the inner sides of the heat dissipation holes (5) are sealed and connected to the support protrusions (4), and the outer sides of the heat dissipation holes (5) are provided with heat dissipation teeth (6); The outer side surfaces of the two sets of front plates (1) are arranged opposite to each other, and a clamping position at the lower part and an air cooling channel (17) at the upper part are formed between the two sets of front plates (1).

2. The memory heat dissipation module according to claim 1, wherein: The front plate (1) is provided with a heat conducting portion in contact with a heat source on the outside of the phase change region (15) to enhance the heat transfer capability from the heat source to the phase change medium.

3. The memory heat dissipation module according to claim 2, wherein: The heat conducting portion is a heat conducting block attached to the surface of the heat source or an interface material coated on the outer side of the front plate (1).

4. The memory heat dissipation module according to claim 1, wherein: The back plate (2) comprises an outer sealing edge (7) arranged around the edge and a recessed area surrounded by the outer sealing edge (7), and the supporting protrusion (4) is formed in the recessed area; the front plate (1) is sealed to the outer sealing edge (7) and the supporting protrusion (4).

5. The memory heat dissipation module according to claim 1, wherein: A plurality of support portions (8) are arranged in the phase change region (15), and the support portions (8) are located between the front plate (1) and the back plate (2).

6. The memory heat dissipation module according to claim 1, wherein: An air cooling component is also provided. Both ends of the air cooling channel (17) are open. The air flow generated by the air cooling component flows from one end opening of the air cooling channel (17) to the other end.

7. The memory heat dissipation module according to claim 1, wherein: The opposing surfaces of the two groups of heat dissipation components are provided with connecting edges (9), the connecting edges (9) extending from the edges of the heat dissipation components, and the two groups of heat dissipation components are connected by means of the connecting edges (9).

8. The memory heat dissipation module according to claim 1, wherein: The heat dissipation teeth (6) on the two groups of front plates (1) are arranged at intervals in the vertical direction.

9. The method for preparing a memory heat dissipation module according to claim 1, wherein: The steps include: S1. Prepare two sets of back plates (2) and front plates (1) respectively, punch out support bumps (4) on one side surface of the back plate (2), and punch out heat dissipation holes (5) and heat dissipation teeth (6) at positions corresponding to the support bumps (4) on the front plate (1); S2, assembling the back plate (2) and the front plate (1), sealing the edge of the back plate (2) and the edge of the supporting protrusion (4) by welding, and maintaining the sealing degree of the vacuum cavity (3); S3, injecting a phase change medium into the vacuum cavity (3) from the liquid injection port (12), extracting the vacuum, and sealing the liquid injection port (12); S4. Connect the two sets of heat dissipation components and clamp the heat source between the two sets of front plates (1) so that the heat dissipation surfaces on both sides of the heat source are in contact with the outer sides of the phase change zone (15).

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