Preparation method of insulating conductive part and insulating conductive part
By placing a glue solution between the insulating layer tapes and heating and curing it, the problems of excessive thickness and bubbles in the PI insulating layer are solved, efficient insulating layer bonding and high temperature resistance are achieved, and manufacturing costs are reduced.
Patent Information
- Application Number
- CN202510847487.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-24
- Publication Date
- 2025-09-26
AI Technical Summary
In the prior art, the thickness of the PI insulation layer is too thick, resulting in high costs, and bubbles and cracks are easily generated when the PI film tape is wound, affecting the quality of the insulation layer.
A first glue solution is set between the conductor and the first layer of insulating film tape, and a second glue solution is set between the first and second layers of insulating film tapes. The fluidity of the liquid glue is used to fill the gaps caused by uneven tension distribution during winding, and the glue is cured by heating to enhance the bonding strength.
The generation of bubbles is effectively avoided, the bonding strength and high temperature resistance of the insulation layer are improved, and the thickness of the insulation layer and the manufacturing cost are reduced.
Smart Images
Figure CN120709007A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of manufacturing conductive parts for new energy electric vehicles, and more specifically, to a preparation method of an insulating conductive part and the insulating conductive part. Background Art
[0002] Conductive parts are commonly used for conductive connections between battery packs in new energy vehicles, between battery packs and charging ports, and between battery packs and power units.
[0003] Insulating conductive parts usually include conductive bars / rods and an insulating layer covering the conductive bars / rods. In the prior art, the insulating layer is usually a PA insulating layer formed by an extrusion process. However, the high temperature resistance range of PA material is below 150°C. When the battery experiences thermal runaway, the temperature will far exceed 150°C and reach 300~500°C in a short period of time. The PA insulating layer will quickly melt at this temperature and lose its insulating protection capability.
[0004] In contrast, PI materials have excellent thermal stability. However, PI materials are relatively expensive, and the thickness of the insulation layer coated by the extrusion process is relatively thick, which significantly increases the manufacturing cost of the PI insulation layer and makes it difficult to promote. Therefore, a low-cost method of replacing PA materials with PI materials is urgently needed in the field.
[0005] To avoid the problem of excessively thick insulation layers during extrusion, existing techniques involve wrapping multiple layers of PI film tape around the conductive bars / rods and sintering them. This significantly reduces the thickness of the PI insulation layer, thereby lowering manufacturing costs. However, uneven tension distribution during PI film wrapping can easily create gaps between the film layers, forming bubbles. After sintering, these bubbles can easily crack or bulge, resulting in substandard insulation quality. Summary of the Invention
[0006] The purpose of the present invention is to overcome the above-mentioned defects in the prior art and provide a method for preparing an insulating conductive part and an insulating conductive part to avoid the generation of bubbles.
[0007] To achieve the above object, the technical solution of the present invention is as follows: A method for preparing an insulating conductive part includes the following steps: Providing a conductor, and forming a first glue solution on the surface of the conductor; Winding a first insulating film tape on the first glue solution; forming a second glue solution on the surface of the first insulating layer film tape; Winding a second layer of insulating film tape on the second glue solution; The first glue solution, the first insulating film tape, the second glue solution and the second insulating film tape are heated to obtain the insulating conductive member.
[0008] The present invention also provides an insulating conductive part produced by the above production method.
[0009] The implementation of the present invention will have the following beneficial effects: The embodiment of the present invention arranges a first glue solution between the conductor and the first layer of insulating film tape, and arranges a second glue solution between the first and second layers of insulating film tapes, and utilizes the fluidity of the liquid glue to fill the gaps caused by uneven tension distribution when the insulating film tapes are wound, thereby avoiding the generation of bubbles after heating. At the same time, the glue can enhance the bonding strength between the insulating film tape and the conductor and between adjacent insulating film tapes. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0011] in: Figure 1 It is a flow chart of a method for preparing an insulating conductive member according to a specific embodiment of the present invention.
[0012] Figure 2 It is a flow chart of a method for preparing an insulating conductive member according to another specific embodiment of the present invention. DETAILED DESCRIPTION
[0013] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.
[0014] refer to Figure 1 The present invention discloses a method for preparing an insulating conductive member, comprising the following steps: 1) Providing a conductor and forming a first glue solution on the surface of the conductor.
[0015] 2) Wrapping a first layer of insulating film tape on the first glue solution.
[0016] 3) Forming a second glue solution on the surface of the first insulating layer film tape.
[0017] 4) Wrap a second layer of insulating film tape around the second glue solution.
[0018] 5) Heating the first glue solution, the first insulating film tape, the second glue solution, and the second insulating film tape to obtain an insulating conductive member.
[0019] The above-mentioned technical solution of the present invention sets a first glue solution between the conductor and the first layer of insulating film tape, and sets a second glue solution between the first and second layers of insulating film tapes, and uses the fluidity of the liquid glue to fill the gaps caused by uneven tension distribution when the insulating film tapes are wound, thereby avoiding the generation of bubbles after heating. At the same time, the glue can enhance the bonding strength between the insulating film tape and the conductor and between adjacent insulating film tapes.
[0020] In the above technical solution, the heating process solidifies the first glue solution and the second glue solution, and at the same time, softens the first insulating layer film tape and the second insulating layer film tape, thereby enhancing the chemical crosslinking and fusion between the first insulating layer film tape and the second insulating layer film tape.
[0021] In a specific embodiment, the first insulating film layer and the second insulating film layer are both PI film tapes, and the heating temperature is 300° C. to 400° C. In other embodiments, the first insulating film layer and the second insulating film layer may also be made of different materials.
[0022] The materials of the first and second insulating film layers can each independently include one or more high-temperature resistant insulating polymer materials such as PI, PEEK, PTFE, and PPS. These materials have superior high-temperature resistance compared to PA. It is worth noting that the materials of the first and second insulating film layers can be one or a mixture of two or more high-temperature resistant insulating polymer materials such as PI, PEEK, PTFE, and PPS, or can also be a multilayer composite material formed from one or more high-temperature resistant insulating polymer materials such as PI, PEEK, PTFE, and PPS.
[0023] In a preferred embodiment, the first glue solution includes an adhesive and a prepolymer of the first insulating film tape, and the second glue solution includes an adhesive, a prepolymer of the first insulating film tape, and a prepolymer of the second insulating film tape. The adhesive primarily acts as a bond, and the addition of the prepolymer to the glue serves the following purposes: first, to increase the degree of cross-linking after curing; second, to improve the compatibility of the adhesive with adjacent insulating film tapes, preventing separation of the adhesive from the insulating film tapes after curing; and third, to enhance the insulating properties of the cured glue.
[0024] Specifically, the adhesive includes one or more of epoxy resin, silicone resin, and silicone resin. These materials not only exhibit adhesive properties, enhancing bond strength, but also possess excellent high-temperature resistance. Furthermore, these materials are compatible with the insulating film layer and, during subsequent heating, further cross-link and fuse with the insulating film layer, enhancing its high-temperature resistance.
[0025] The silicone resin is preferably phenyl silicone, which has better high temperature resistance.
[0026] The precursor solution of PI can be a polyamide solution, the precursor solution of PEEK can be composed of 4,4′-difluorobenzophenone, hydroquinone and diphenyl sulfone solvent, the precursor solution of PTFE can be a TFE monomer solution, and the precursor solution of PPS can be composed of p-dichlorobenzene, sodium sulfide and polar solvent N-methylpyrrolidone or hexamethylphosphoric triamide.
[0027] In the first glue solution or the second glue solution, the mass percentage of the adhesive is 20% to 50%, and the mass percentage of the prepolymer is 20% to 50%.
[0028] refer to Figure 2 The present invention also provides a continuous preparation method for an insulating conductive member, which can significantly improve productivity and includes the following steps: The conductor is transported forward by a power device and sequentially passes through a preheating device, a first glue solution, a first winding machine, a second glue solution, a second winding machine and a heating device for online continuous production to obtain an insulated conductive part.
[0029] The preheating device preheats the conductor online. The preheated conductor heats the first and second glue solutions, increasing their viscosity, enhancing their adhesion, and increasing the thickness of the glue layer, ensuring sufficient glue is squeezed to fill gaps and dislodge air bubbles during winding of the insulation tape. Furthermore, the preheated conductor generates heat internally, which, combined with the heating process, heats the first glue solution, the first insulation tape, the second glue solution, and the second insulation tape, ensuring more uniform heating across the insulation layer, a more complete cross-linking reaction, and improved bonding strength between the insulation layer and the conductor.
[0030] The preheated conductor is passed through the first glue solution, or the first glue solution is sprayed or coated on the preheated conductor. Specifically, the first glue solution can be loaded into a box, and the conductor is passed through the box, and the first glue solution adheres to the conductor surface. Alternatively, the first glue solution can be sprayed onto the surface of the conductor during transmission through a nozzle, or the conductor is passed through an annular nozzle, and the water outlet of the annular nozzle is located inside the ring.
[0031] The conductor coated with the first glue solution is wound with a first insulating film tape by a first winding machine.
[0032] The conductor wrapped with the first insulating film tape is passed through the second glue solution, or the second glue solution is sprayed or coated on the outside of the conductor wrapped with the first insulating film tape. The specific implementation method is the same as that of the first glue solution.
[0033] The conductor coated with the second glue solution is wound with a second insulating film tape by a second winding machine.
[0034] The conductor wrapped with the second insulating film tape is heated by a heating device to obtain an insulating conductive part.
[0035] Preferably, adjacent wraps of the first insulating tape layer partially overlap, with an overlap ratio of 1% to 10%; adjacent wraps of the second insulating tape layer partially overlap, with an overlap ratio of 45% to 55%, and the second insulating tape layer is wound in the opposite direction to the first. This method first reduces the overlap ratio of the first insulating tape layer, fully enveloping the conductor with a low overlap ratio, leaving the conductor unexposed. Then, the overlap ratio of the second insulating tape layer is increased to 45% to 55%, achieving higher insulation performance with less tape and reducing costs.
[0036] Preferably, a first guide pressure wheel is provided between the second winding machine and the heating device, and the conductor wrapped with the second layer of insulating film tape is compacted by the first guide pressure wheel. The function of the first guide pressure wheel is to make the insulating film tape more tightly bonded with the glue and the conductor.
[0037] Preferably, the heating device includes a first heating device and a second heating device arranged in sequence, the heating temperature of the second heating device is greater than the heating temperature of the first heating device, and the heating process is carried out by gradient heating through two consecutive heating devices, so that the insulating layer film tape and the glue are fully and evenly fused and solidified, thereby improving the performance of the insulating layer.
[0038] A second guide roller is installed between the first and second heating devices. This allows the glue and insulation tape to fuse more quickly and tightly during the heating and fusing process. The first and second guide rollers also effectively remove air bubbles, improving insulation performance.
[0039] Furthermore, the present invention is provided with a cooling device and a winding device in sequence after the second heating device, and an unwinding device is provided before the preheating device. The cooling device cools the insulating conductive part, and the winding device winds up and stores the insulating conductive part. The unwinding device is used to continuously release the conductor, thereby forming continuous production and improving production efficiency.
[0040] Alternatively, a cooling device and a cutting device are sequentially provided after the second heating device, and the cutting device cuts and collects the insulating conductive parts in sections.
[0041] Furthermore, it also includes an electric spark testing device and a diameter measuring device. The insulating conductive part passes through the electric spark testing device and the diameter measuring device. The electric spark testing device is used to detect whether the insulating conductive part has leakage, and the diameter measuring device is used to detect the outer diameter size of the insulating conductive part.
[0042] The present invention also provides an insulating conductive part produced by the above production method.
[0043] The following are specific examples.
[0044] Example 1 A method for preparing an insulating conductive part includes the following steps: 1) Provide an aluminum alloy conductor and preheat the aluminum alloy conductor to 120°C.
[0045] 2) Prepare the first glue solution. First, take the cyclohexanone solution and place it in a reaction vessel. Add PriamineTM1074 diamine and stir thoroughly to dissolve. Then add BTDA (3,3',4,4'-benzophenone tetracarboxylic dianhydride) and stir mechanically to dissolve to obtain a polyamic acid solution, i.e., a PI prepolymer solution with a solid content of 30%. Then, add 20 wt% of epoxy resin YX8100BH30 and 5 wt% of curing agent CUA-4 to obtain the first glue solution. The second glue solution is the same as the first glue solution.
[0046] 3) forming a first glue solution on the surface of the aluminum alloy conductor; 4) Wrap the first layer of PI film tape (17 μm thick) on the first glue solution, with an overlap rate of 5% between adjacent layers; 5) forming a second glue solution on the surface of the first PI film tape; 6) Wrap a second layer of PI film tape (17 μm thick) around the second glue solution, with an overlap rate of 50% between adjacent wraps; 7) The conductor wrapped with the second layer of PI film tape is placed in an oven and heated at 350° C. for 15 seconds, and then cooled to obtain an insulating conductive member. The thickness of the insulating layer of the insulating conductive member is about 50 μm.
[0047] Comparative Example 1 The difference between Comparative Example 1 and Example 1 is that only two layers of PI film tapes are wound without using glue. The specific preparation method is as follows: 1) Provide aluminum alloy conductors and preheat them to 120°C; 2) Wrap the first layer of PI film tape (17 μm thick) on the aluminum alloy conductor, with an overlap rate of 5% between adjacent turns; 3) Wrap a second layer of PI film tape (thickness 17 μm) with an overlap rate of 50% between adjacent turns; 4) The conductor wrapped with the second layer of PI film tape was placed in an oven and heated at 350° C. for 15 seconds, and then cooled to obtain an insulating conductive member. The thickness of the insulating layer of the insulating conductive member was about 35 μm.
[0048] Comparative Example 2 In Comparative Example 2, compared with Comparative Example 1, the number of PI film tape layers is increased from two to three, so that the thickness of the insulating layer is equivalent to the thickness of the insulating layer of the conductive member prepared in Example 1. The specific preparation method is as follows: 1) Provide aluminum alloy conductors and preheat them to 120°C; 2) Wrap the first layer of PI film tape (17 μm thick) on the aluminum alloy conductor, with an overlap rate of 5% between adjacent turns; 3) Wrap a second layer of PI film tape (thickness 17 μm) with an overlap rate of 50% between adjacent turns; 4) Continue to wind the third layer of PI film tape (thickness 17μm), with the overlap rate of two adjacent turns being 50%; 5) The conductor wrapped with the third layer of PI film tape was placed in an oven and heated at 350° C. for 30 seconds, and then cooled to obtain an insulating conductive part. The thickness of the insulating layer of the insulating conductive part was about 50 μm.
[0049] Comparative Example 3 The difference between Comparative Example 3 and Example 1 is that glue is used only between the conductor and the first layer of PI film tape. The specific preparation method is as follows: 1) Provide an aluminum alloy conductor and preheat the aluminum alloy conductor to 120°C.
[0050] 2) Prepare the glue solution. First, take the cyclohexanone solution and place it in a reaction vessel. Add Priamine™ 1074 diamine and stir thoroughly to dissolve. Then add BTDA (3,3',4,4'-benzophenone tetracarboxylic dianhydride) and stir mechanically to dissolve to obtain a polyamic acid solution, i.e., a PI precursor solution, with a solid content of 30%. Then, add 20 wt% of epoxy resin YX8100BH30 and 5 wt% of curing agent CUA-4 to obtain a glue solution.
[0051] 3) Wrap the first layer of PI film tape (thickness 17 μm) on the aluminum alloy conductor, with an overlap rate of 5% between adjacent turns; 4) forming a glue solution on the surface of the first layer of PI film tape; 5) Wrap a second layer of PI film tape (17 μm thick) on the glue solution, with an overlap rate of 50% between adjacent layers. 6) The conductor wrapped with the second layer of PI film tape was placed in an oven and heated at 350° C. for 15 seconds, and then cooled to obtain an insulating conductive member. The thickness of the insulating layer of the insulating conductive member was about 50 μm.
[0052] Comparative Example 4 The difference between Comparative Example 4 and Example 1 is that glue is used only between the first layer of PI film tape and the second layer of PI film tape. The specific preparation method is as follows: 1) Provide an aluminum alloy conductor and preheat the aluminum alloy conductor to 120°C.
[0053] 2) Prepare the glue solution. First, take the cyclohexanone solution and place it in a reaction vessel. Add Priamine™ 1074 diamine and stir thoroughly to dissolve. Then add BTDA (3,3',4,4'-benzophenone tetracarboxylic dianhydride) and stir mechanically to dissolve to obtain a polyamic acid solution, i.e., a PI precursor solution, with a solid content of 30%. Then, add 20 wt% of epoxy resin YX8100BH30 and 5 wt% of curing agent CUA-4 to obtain a glue solution.
[0054] 3) forming a glue solution on the surface of the aluminum alloy conductor; 4) Wrap the first layer of PI film tape (17 μm thick) on the glue solution, with an overlap rate of 5% between adjacent wraps; 5) Wrap a second layer of PI film tape (17 μm thick) on the first layer of PI film tape, with an overlap rate of 50% between two adjacent layers; 6) The conductor wrapped with the second layer of PI film tape was placed in an oven and heated at 350° C. for 15 seconds, and then cooled to obtain an insulating conductive member. The thickness of the insulating layer of the insulating conductive member was about 50 μm.
[0055] Comparative Example 5 The difference between Comparative Example 5 and Example 1 is that the glue solution does not include the prepolymer. The specific preparation method is as follows: 1) Provide an aluminum alloy conductor and preheat the aluminum alloy conductor to 120°C.
[0056] 2) Preparing a first glue solution: First, taking a cyclohexanone solution and placing it in a reaction vessel, adding 20 wt % of epoxy resin YX8100BH30 and 5 wt % of curing agent CUA-4 to obtain a first glue solution; the second glue solution is the same as the first glue solution.
[0057] 3) forming a first glue solution on the surface of the aluminum alloy conductor; 4) Wrap the first layer of PI film tape (17 μm thick) on the first glue solution, with an overlap rate of 5% between adjacent layers; 5) forming a second glue solution on the surface of the first PI film tape; 6) Wrap a second layer of PI film tape (17 μm thick) around the second glue solution, with an overlap rate of 50% between adjacent wraps; 7) The conductor wrapped with the second layer of PI film tape is placed in an oven and heated at 350° C. for 15 seconds, and then cooled to obtain an insulating conductive member. The thickness of the insulating layer of the insulating conductive member is about 50 μm.
[0058] Comparative Example 6 The difference between Comparative Example 6 and Example 1 is that the glue solution does not include an adhesive. The specific preparation method is as follows: 1) Provide an aluminum alloy conductor and preheat the aluminum alloy conductor to 120°C.
[0059] 2) Prepare the first glue solution. First, take the cyclohexanone solution and place it in a reaction vessel. Add Priamine™ 1074 diamine and stir thoroughly to dissolve. Then add BTDA (3,3',4,4'-benzophenone tetracarboxylic dianhydride) and stir mechanically to dissolve to obtain a polyamic acid solution, i.e., a PI prepolymer solution with a prepolymer solid content of 30%. The second glue solution is the same as the first glue solution.
[0060] 3) forming a first glue solution on the surface of the aluminum alloy conductor; 4) Wrap the first layer of PI film tape (17 μm thick) on the first glue solution, with an overlap rate of 5% between adjacent layers; 5) forming a second glue solution on the surface of the first PI film tape; 6) Wrap a second layer of PI film tape (17 μm thick) around the second glue solution, with an overlap rate of 50% between adjacent wraps; 7) The conductor wrapped with the second layer of PI film tape is placed in an oven and heated at 350° C. for 15 seconds, and then cooled to obtain an insulating conductive member. The thickness of the insulating layer of the insulating conductive member is about 50 μm.
[0061] Test Case The insulating conductive members prepared in Example 1 and Comparative Examples 1 to 6 were tested for insulation resistance at room temperature, high temperature insulation resistance at 200°C, high temperature insulation resistance at 300°C, high temperature insulation resistance at 400°C, and insulation layer peel strength. The test results are shown in Table 1.
[0062] Table 1: Index test results of the insulating conductive parts prepared in Example 1 and Comparative Examples 1 to 4 From Table 1, it can be seen that the insulation resistance of Example 1 (double glue layer) at room temperature to 400°C is better than that of Comparative Example 1 (no glue) and Comparative Example 2 (three layers without glue).
[0063] Comparative Example 1 suffered insulation failure at 400° C. due to interlayer bubbles, and the peel strength was only 1.2 N / mm (less than 15% of that of Example 1).
[0064] Example 1: The gap is filled with glue, and the insulation resistance is still >10 at 400℃ 9 Ω·m, which verifies the criticality of the fluidity of liquid glue to gap filling.
[0065] Example 1, Comparative Example 1, and Comparative Example 2 demonstrate that the fluidity of the glue can fill winding gaps and prevent sintering bubbles. The glue-free solution leads to high-temperature insulation collapse due to interlayer bubbles, proving that glue is a necessary solution to the bubble problem.
[0066] The insulation resistance at 300°C of Comparative Example 3 (only interlayer glue) and Comparative Example 4 (only bottom layer glue) is 1 to 2 orders of magnitude lower than that of Example 1. The insulation resistance at 300°C of Comparative Example 3 (only interlayer glue) is reduced to 10 9 ~10¹ 0 Ω·m (Example 1: >10¹¹ Ω·m). Comparative Example 4 (primer glue only) achieved a peel strength of 5.8 N / mm (lower than 8.5 N / mm in Example 1), demonstrating that both the conductor-insulation layer and insulation layer-insulation layer interfaces require glue coverage for comprehensive protection. A single-layer glue solution, due to incomplete interfacial bonding, results in a more than 30% decrease in high-temperature insulation and a greater than 30% loss in peel strength.
[0067] Comparative Example 5 (no prepolymer) failed at 400°C, while the peel strength of Comparative Example 6 (no adhesive) was only 2.0 N / mm (less than 24% of that of Example 1), indicating that: the prepolymer (such as polyamic acid) increases the cross-linking degree of the glue and enhances the high-temperature insulation; the adhesive (such as epoxy resin) provides basic bonding force to ensure the interlayer bonding strength.
[0068] The above-described embodiments merely represent several implementation methods of the present invention. While the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.
Claims
1. A method for preparing an insulating conductive member, characterized in that: The following processes are included: Providing a conductor, and forming a first glue solution on the surface of the conductor; Winding a first insulating film tape on the first glue solution; forming a second glue solution on the surface of the first insulating layer film tape; Winding a second layer of insulating film tape on the second glue solution; The first glue solution, the first insulating film tape, the second glue solution and the second insulating film tape are heated to obtain the insulating conductive member.
2. The method for preparing an insulating conductive member according to claim 1, wherein: The first glue solution includes an adhesive and a precursor of the first insulating film tape; The second glue solution includes an adhesive, a precursor of the first insulating film tape, and a precursor of the second insulating film tape.
3. The method for preparing an insulating conductive member according to claim 2, wherein: The adhesive comprises one or more of epoxy resin, silicone resin and silicone resin; The material of the first insulating layer membrane tape includes one or more of PI, PEEK, PTFE and PPS; The material of the second insulating layer membrane tape includes one or more of PI, PEEK, PTFE and PPS.
4. The method for preparing an insulating conductive member according to any one of claims 1 to 3, characterized in that: The following processes are included: The conductor is transported forward by a power device and sequentially passes through a preheating device, a first glue solution, a first winding machine, a second glue solution, a second winding machine and a heating device for online continuous production to obtain the insulating conductive part; The preheating device preheats the conductor online, and the preheated conductor passes through the first glue solution, or the first glue solution is sprayed or coated on the outside of the preheated conductor; Winding the conductor coated with the first glue solution with a first insulating film tape by the first winding machine; Passing the conductor wrapped with the first insulating film tape through the second glue solution, or spraying or coating the conductor wrapped with the first insulating film tape with the second glue solution; Winding the conductor coated with the second glue solution with a second insulating film tape by the second winding machine; The conductor wrapped with the second insulating film tape is heated by the heating device to obtain the insulating conductive part.
5. The method for preparing an insulating conductive member according to claim 4, wherein: The two adjacent circles of the first insulating layer tape are partially overlapped, with an overlap rate of 1% to 10%; Two adjacent circles of the second insulating layer film tape are partially overlapped, with an overlap rate of 45% to 55%.
6. The method for preparing an insulating conductive member according to claim 4, wherein: A first guide pressing wheel is further provided between the second winding machine and the heating device, and the conductor wrapped with the second insulating film tape is compacted by passing through the first guide pressing wheel.
7. The method for preparing an insulating conductive member according to claim 6, wherein: The heating device comprises a first heating device and a second heating device arranged in sequence, wherein the heating temperature of the second heating device is greater than the heating temperature of the first heating device; A second guide pressure wheel is further provided between the first heating device and the second heating device.
8. The method for preparing an insulating conductive member according to claim 7, wherein: A cooling device and a winding device are sequentially provided after the second heating device, or a cooling device and a cutting device are sequentially provided after the second heating device. The cooling device cools the insulating conductive member; The winding device winds up and stores the insulating conductive member; The cutting device cuts and collects the insulating conductive parts in sections.
9. The method for preparing an insulating conductive member according to claim 8, characterized in that: It also includes an electric spark testing device and a diameter measuring device.
10. An insulating conductive part produced by the production method according to any one of claims 1 to 9.