Substrate manufacturing method, substrate and device
By using a laser beam to modify the glass substrate at different focal planes and etching solution corrosion, the low efficiency problem caused by the separate production of blind grooves and through holes in the existing technology is solved, and the effect of efficiently producing TGV holes and blind grooves is achieved.
Patent Information
- Application Number
- CN202510866077.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-06-25
- Publication Date
- 2025-09-26
AI Technical Summary
In the prior art, blind grooves and through holes need to be made on a glass substrate separately, which results in a long process time and affects the production efficiency.
A laser beam is used to modify the substrate at different focal planes to form a modified area, and an etching solution is used to etch through holes and blind grooves. The focal plane difference of the laser beam is used to control the modification depth and range.
The production efficiency of blind grooves and through holes on substrates is improved, and the simultaneous formation of TGV holes and blind grooves is achieved to meet the diverse needs of substrates.
Smart Images
Figure CN120709149A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of advanced semiconductor packaging technology, and in particular to a method for manufacturing a substrate, a substrate, and a device. Background Art
[0002] A through-glass via (TGV) is an electrical interconnect structure that passes vertically through a glass substrate, similar to a through-silicon via (TSV), but capable of three-dimensional interconnection. TGV 3D interconnect technology offers excellent electrical and optical properties, good mechanical stability, and low cost, making it a promising alternative to organic through-hole interconnects. TGV holds broad application prospects in advanced packaging, integrated passive devices, and optoelectronic device integration, and is considered a key technology for next-generation advanced packaging.
[0003] In some substrate applications, in addition to creating TGV holes on the substrate, blind grooves are also required to accommodate electronic devices (such as chips) and heat sinks. Currently, blind grooves and TGV holes on glass substrates need to be made separately, which results in a long overall process and affects production efficiency. Summary of the Invention
[0004] The present application provides a method for manufacturing a substrate, a substrate, and a device for improving the efficiency of manufacturing blind grooves and TGV holes on a substrate.
[0005] In order to achieve the above objectives, this application adopts the following technical solutions:
[0006] In a first aspect, a method for manufacturing a substrate is provided, the method being used to manufacture through holes and blind grooves on the substrate, wherein the substrate includes a first surface and a second surface relative to each other, the first surface includes a first area and a second area, the first area is used to form a first through hole, and the second area is used to form a blind groove, the method comprising: determining the focal plane of a laser beam as a first focal plane, and modifying the first area to form a first modified area; determining the focal plane of the laser beam as a second focal plane, and modifying the second area to form a second modified area, wherein the distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface; and placing the substrate in an etching solution so that the first modified area forms a first through hole, and the second modified area forms a blind groove.
[0007] In the manufacturing method of the substrate provided in the present application, the focal plane of the laser beam is used as the first focal plane, and the first area is modified to form a first modified area. The focal plane of the laser beam is used as the second focal plane, and the second area is modified to form a second modified area. Since the distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface, when the modification is performed at the first focal plane, the modified glass will penetrate the substrate. After the focal plane moves to the second focal plane, the modification treatment performed in the second area will not penetrate the substrate, and a modified area is formed within a certain depth of the second area. The substrate is further placed in an etching solution, so that the first modified area is corroded to form a first through hole, that is, a TGV hole, and the second modified area is formed into a blind groove. That is, through the manufacturing method of the substrate provided in the present application, after being corroded by the etching solution, a TGV hole and a blind groove are formed on the substrate, thereby improving the manufacturing efficiency of substrates with TGV holes and blind grooves.
[0008] In a possible design, the above-mentioned modification of the second region to form the second modified zone specifically includes: controlling the laser beam to move in a straight line within the second region to modify the second region to form the second modified zone.
[0009] In a possible design, when the laser beam moves in a straight line in the second area, the distance between the centers of two adjacent light spots formed by the laser is greater than the radius of the light spot and smaller than the diameter of the light spot.
[0010] In one possible design, determining the focal plane of the laser beam as the second focal plane includes: controlling the movement of the laser head to move the focal plane of the laser beam from the first focal plane to the second focal plane.
[0011] In a possible design, the first focal plane is located at a central plane in the thickness direction of the substrate, and the second focal plane is located on a side of the first surface away from the second surface.
[0012] In a possible design, the pulse width of the laser used for modification in the second modification zone is in the range of 5000-7000 femtoseconds (fs).
[0013] In one possible design, before placing the substrate in the etching solution, the method further includes: determining the focal plane of the laser beam as a third focal plane to form a third modified area in the second area; the step of placing the substrate in the etching solution to form a blind groove in the second modified area also includes forming a second through hole in the third modified area, the second through hole being used to penetrate the bottom of the blind groove and the second surface.
[0014] In this design, a second through hole is formed at the bottom of the blind groove to penetrate the bottom of the blind groove and the second surface, so that corresponding circuits can be designed at the bottom of the blind groove to achieve electrical interconnection between the electronic components in the blind groove and the lower side of the substrate.
[0015] In one possible design, the manufacturing method also includes making a positioning hole on the substrate, the first surface also includes a third area, the focal plane of the laser beam is determined to be the first focal plane, and the step of modifying the first area to form a first modified area also includes: forming multiple fourth modified areas in the third area; the fourth modified area is used to form a third through hole, and the multiple third through holes are arranged in sequence and surrounded by an annular structure with a first aperture, the aperture of the third through hole is the same or substantially the same as the aperture of the first through hole, and the first aperture is larger than the aperture of the first through hole; placing the substrate in an etching solution to form the first through hole in the first modified area, and the step of forming a blind groove in the second modified area also includes: the modified glass of the multiple fourth modified areas is corroded to remove the material inside the annular structure, and a positioning hole with an aperture of the first aperture is formed in the third area.
[0016] In this design, positioning holes are produced on the substrate, that is, a method for producing TGV holes, blind grooves and positioning holes on the substrate is provided to meet the diverse needs of the substrate.
[0017] In a second aspect, a substrate is provided. The substrate has a first through hole and a blind groove. The first through hole and the blind groove are manufactured using the above-mentioned substrate manufacturing method.
[0018] According to a third aspect, a substrate is provided, wherein the substrate has a first through hole and a blind groove.
[0019] In a fourth aspect, a substrate fabrication apparatus is provided. The apparatus is used to fabricate through holes and blind grooves on a substrate. The substrate includes a first surface and a second surface facing each other. The first surface includes a first region and a second region. The first region is used to form the through hole, and the second region is used to form the blind groove. The fabrication apparatus includes: a laser head, configured to emit a laser beam in response to a control signal. A control module, coupled to the laser head, controls the laser head to emit the laser beam at a position where the laser beam has a first focal plane, thereby forming a first modified region in the first region. A laser head drive module, coupled to the control module, receives signals from the control module and drives the laser head to move to a position where the laser beam has a second focal plane. The control module further controls the laser head to emit the laser beam at the second focal plane, thereby forming a second modified region in the second region. The distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface. A substrate drive module, coupled to the control module, receives signals from the control module and drives the substrate into an etching solution for etching, thereby forming a first through hole in the first modified region and a blind groove in the second modified region. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 A schematic flow chart of a method for manufacturing a substrate provided in an embodiment of the present application;
[0021] Figure 2 A schematic diagram of a substrate provided in an embodiment of the present application;
[0022] Figure 3 A schematic diagram of a manufacturing process of a method for manufacturing a substrate provided in an embodiment of the present application;
[0023] Figure 4 A schematic diagram of a focal plane provided in an embodiment of the present application;
[0024] Figure 5 A schematic diagram of a light spot provided in an embodiment of the present application;
[0025] Figure 6 A schematic diagram of a substrate having a blind groove and a through hole provided in an embodiment of the present application;
[0026] Figure 7 A schematic diagram of a manufacturing process of a method for manufacturing a substrate provided in an embodiment of the present application;
[0027] Figure 8 A schematic diagram of a manufacturing process of a method for manufacturing a substrate provided in an embodiment of the present application;
[0028] Figure 9 A schematic structural diagram of a substrate manufacturing device provided in an embodiment of the present application.
[0029] Reference numerals:
[0030] 100-substrate, 110-first surface, 111-first area, 112-second area, 113-first through hole, 114-blind groove, 115-first modified area, 116-second modified area, 117-third modified area, 118-second through hole, 120-second surface, 130-first focal plane, 140-second focal plane, 150-third area, 151-fourth modified area, 152-third through hole, 153-annular result, 154-positioning hole, 200-substrate manufacturing device, 210-laser head, 220-control module, 230-laser head drive module, 240-substrate drive module. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical solutions and advantages of the present application more clear, the present application is further described in detail below with reference to the accompanying drawings and embodiments. Examples of embodiments are shown in the accompanying drawings, in which the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application and are not to be construed as limiting the present application. In addition, it should be understood that the specific embodiments described herein are merely used to explain the present application and are not intended to limit the present application.
[0032] In the description of this application, it should be understood that the terms "length", "width", "up", "down", "left", "right", "horizontal", "top", "bottom", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on this application.
[0033] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.
[0034] In the description of this application, it should be noted that, unless otherwise expressly specified or limited, the terms "installed," "connected," and "connected" should be understood in a broad sense. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections, electrical connections, or mutual communication; they can refer to direct connections or indirect connections through an intermediate medium; they can refer to internal communication between two components or the interaction between two components. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.
[0035] In this application, unless otherwise expressly specified or limited, a first feature being "above" or "below" a second feature may include the first and second features being in direct contact, or may include the first and second features being in contact not directly but through another feature between them. Moreover, a first feature being "above," "above," and "above" a second feature may include the first feature being directly above or obliquely above the second feature, or may simply mean that the first feature is higher in level than the second feature. A first feature being "below," "below," and "below" a second feature may include the first feature being directly below or obliquely below the second feature, or may simply mean that the first feature is lower in level than the second feature.
[0036] The disclosure below provides many different embodiments or examples for realizing the different structures of the present application. In order to simplify the disclosure of the present application, the components and settings of specific examples are described below. Of course, they are merely examples, and the purpose is not to limit the present application. In addition, the present application may repeat reference values and / or reference letters in different examples, and such repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present application provides various specific process and material examples, but those skilled in the art will appreciate the application of other processes and / or the use of other materials.
[0037] The present application provides a method for manufacturing a substrate, which is used to manufacture through holes and blind grooves on the substrate, wherein the substrate includes a first surface and a second surface relative to each other, the first surface includes a first area and a second area, the first area is used to form a first through hole, and the second area is used to form a blind groove. The method includes: determining the focal plane of the laser beam as the first focal plane, modifying the first area to form a first modified area; determining the focal plane of the laser beam as the second focal plane, modifying the second area to form a second modified area, and the distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface; placing the substrate in an etching solution so that the first modified area forms a first through hole and the second modified area forms a blind groove.
[0038] In the manufacturing method of the substrate provided in the present application, the focal plane of the laser beam is used as the first focal plane, and the first area is modified to form a first modified area. The focal plane of the laser beam is used as the second focal plane, and the second area is modified to form a second modified area. Since the distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface, when the modification is performed at the first focal plane, the modified glass will penetrate the substrate. After the focal plane moves to the second focal plane, the modification treatment performed in the second area will not penetrate the substrate, and a modified area is formed within a certain depth of the second area. Further, the substrate is placed in an etching solution, so that the first modified area can be corroded to form a first through hole, that is, a TGV hole, and the second modified area forms a blind groove, which can be used to accommodate some electronic devices (such as chips), heat sinks, etc.
[0039] like Figure 1 As shown, an embodiment of the present application provides a method for manufacturing a substrate, including steps S1100-S1400.
[0040] S1100 , providing a substrate 100 .
[0041] Among them, such as Figure 2As shown, substrate 100 includes a first surface 110 and a second surface 120 facing each other. First surface 110 includes a first area 111 and a second area 112. First area 111 is used to form a first through hole 113, and second area 112 is used to form a blind groove 114. First through hole 113 is a TGV hole used to achieve electrical interconnection between chips or packaging layers. Blind groove 114 is used to accommodate some electronic devices (such as chips), heat sinks, etc.
[0042] like Figure 3 As shown in (a) of FIG. 1 , the surface of the substrate 100 includes a first region 111 and a second region 112 in a rectangular shape. Optionally, the first region 111 and the second region 112 may also be circular regions, elliptical regions, or irregular regions. Figure 3 The shapes shown in the figure do not constitute a limitation on the shapes of the first area and the second area in the embodiment of the present application.
[0043] In the embodiments provided in the present application, the substrate 100 is taken as a glass substrate for illustration. In other embodiments, the substrate 100 may also be a ceramic substrate or a silicon substrate, etc., and the embodiments of the present application do not specifically limit this.
[0044] In some embodiments, the substrate 100 may be a rectangular plate structure. Of course, the substrate 100 may also be a circular, irregular or other shaped plate structure, which is not specifically limited in the present embodiment.
[0045] As a possible implementation manner, the thickness range of the substrate 100 is 5μm-10mm. Preferably, the thickness range of the substrate 100 is 200μm-500μm. For example, the thickness range of the substrate 100 is 250μm, 300μm, 350μm, 400μm or 450μm, etc. This embodiment of the present application does not specifically limit this.
[0046] S1200 , determining the focal plane of the laser beam as the first focal plane 130 , and modifying the first region 111 to form a first modified area 115 .
[0047] As a possible implementation method, the laser head is controlled to set the focal plane of the laser beam as the first focal plane 130, and a laser induction method is used in the first area 111 of the substrate 100 to perform laser modification treatment, such as Figure 3 As shown in (b), a first modified area 115 is formed in the first region 111 on the substrate 100.
[0048] Optionally, the above-mentioned laser modification treatment can be specifically: using a high-precision laser (such as an ultraviolet laser or a femtosecond laser), and adjusting the focal plane of the laser beam to the first focal plane 130, irradiating the first area 111 to reduce the chemical stability of the glass, and forming a modified first modified zone 115.
[0049] In some embodiments, the pulse width of the laser used to modify the first modified area is in the range of 500-1000 fs.
[0050] S1300 , determining the focal plane of the laser beam as the second focal plane 140 , and modifying the second region 112 to form a second modified area 116 .
[0051] The distance from the second focal plane 140 to the second surface 120 is greater than the distance from the first focal plane 130 to the second surface 120 .
[0052] As a possible implementation method, the laser head is controlled to set the focal plane of the laser beam as the second focal plane 140, and a laser induction method is used in the second area 112 of the substrate 100 to perform laser modification treatment, such as Figure 3 As shown in (b), a second modified area 116 is formed in the second region 112 on the substrate 100.
[0053] For example, Figure 4 A side view of the substrate 100 is shown, and a preferred positional relationship between the first focal plane 130 and the second focal plane 140 and the substrate 100 is shown. The first focal plane 130 is located at the center plane of the substrate 100 in the thickness direction, and the second focal plane 140 is located on the side of the first surface 110 away from the second surface 120. For example, the second focal plane 140 may be 0.3 mm to 0.4 mm away from the side of the first surface 110 away from the second surface 120.
[0054] In some embodiments, before forming the second modified area 116 in the second region 112 , the position of the second focal plane may be determined according to the thickness of the substrate, the focal depth, and the depth of the blind groove.
[0055] In some embodiments, the pulse width of the laser used for modifying the second modified zone is in the range of 5000-7000 fs, preferably in the range of 5500-6500 fs.
[0056] In some embodiments, determining the focal plane of the laser beam as the second focal plane 140 includes controlling a laser head to move so that the focal plane of the laser beam moves from the first focal plane 130 to the second focal plane 140 .
[0057] For example, when the laser head is at the first height, the focal plane of the laser beam is the first focal plane 130. Since the second focal plane 140 is 0.6 mm above the first focal plane 130, the focal plane of the laser beam can be moved from the first focal plane 130 to the second focal plane 140 by controlling the laser head to move upward 0.6 mm to the second height.
[0058] In other embodiments, determining the focal plane of the laser beam as the first focal plane 130 includes: controlling the movement of the first laser head so that the focal plane of the laser beam of the first laser head is located at the first focal plane 130; determining the focal plane of the laser beam as the second focal plane 140 includes: controlling the movement of the second laser head so that the focal plane of the laser beam of the second laser head is located at the second focal plane 140.
[0059] It should be noted that the parameters of the first laser head and the second laser head may be consistent or inconsistent. For example, the laser intensity of the first laser head required to form the first modified area 115 penetrating the substrate 100 is higher than the laser intensity of the second laser head required to form the second modified area 116 on the substrate 100. The embodiments of the present application do not make specific limitations on this.
[0060] In some embodiments, modifying the second region 112 to form the second modified zone 116 specifically includes controlling the laser beam to move linearly within the second region 112 to modify the second region 112 to form the second modified zone 116 .
[0061] When the laser beam moves in a straight line in the second area 112, Figure 5 As shown, the distance between the centers of two adjacent light spots formed by the laser is greater than the radius of the light spot and smaller than the diameter of the light spot, so that the modified area corresponding to each light spot in the multiple light spots can be spliced into a second modified area 116 for making a blind groove.
[0062] S1400 , placing the substrate 100 in an etching solution, so that the first modified area 115 forms a first through hole 113 , and the second modified area 116 forms a blind groove 114 .
[0063] As a possible implementation method, after forming the first modified area 115 and the second modified area 116, the substrate 100 is placed in an etching solution to corrode the modified glass in the first modified area 115 and the modified glass in the second modified area 116, so that after the modified glass in the first modified area 115 is corroded, the first through hole 113 is formed, and after the modified glass in the second modified area 116 is corroded, the blind groove 114 is formed.
[0064] Optionally, the etching solution may be an acidic or alkaline solution (such as a hydrofluoric acid solution). Since the glass of the first modified area 115 and the second modified area 116 on the substrate 100 is modified by laser induction, it can be etched out in the etching solution. Figure 3 As shown in (c), after the materials of the first modified area 115 and the second modified area 116 are removed, the first modified area 115 forms a first through hole 113 and the second modified area 116 forms a blind groove 114.
[0065] For example, Figure 6 A side view of a substrate 100 having a first through hole 113 and a blind groove 114 manufactured by the method for manufacturing a substrate provided by the above embodiment of the present application is shown.
[0066] In one design, in order to achieve signal or electrical connection between the electronic device (such as a chip) placed in the blind groove 114 and other components on the lower side of the substrate 100, after the second modified area is formed in the second region, the method for manufacturing the substrate provided by the present application further includes:
[0067] As a possible implementation manner, before placing the substrate in the etching solution, the focal plane of the laser beam is determined to be a third focal plane, and the third modified area 117 is formed in the second region 112 .
[0068] Among them, the third focal plane can be any position between the central plane of the substrate 100 in the thickness direction and the plane below the bottom plane of the blind groove 114 and at a distance of half the thickness of the substrate 100. Preferably, the third focal plane is the middle position between the bottom plane of the blind groove 114 and the second surface 120.
[0069] It can be understood that since the focal plane of the laser beam can form a modified area that penetrates the substrate 100 when it is at the first focal plane (the central plane of the substrate 100 in the thickness direction), the focal plane of the laser beam is set to a position between the central plane and the lower side of the bottom plane of the blind groove 114 and a plane with a distance of half the thickness of the substrate 100, which can penetrate the bottom of the blind groove 114 and the second surface 120.
[0070] For example, Figure 7 (a) shows a top view of a third modified area 117 formed in the second region 112, Figure 7 (b) shows a side view of a third modified region 117 formed in the second region 112.
[0071] Furthermore, the substrate 100 is placed in an etching solution to form the blind groove 114 in the second modified area 116 and the second through hole 118 in the third modified area 117 .
[0072] For example, Figure 7As shown in (c) , the second through hole 118 is used to penetrate the bottom of the blind groove 114 and the second surface 120 .
[0073] As another possible implementation, after the substrate is placed in an etching solution and the blind groove 114 is formed in the second modified region 116, the focal plane of the laser beam is determined to be a third focal plane, thereby forming a third modified region 117 in the second region 112. The substrate 100 is further placed in an etching solution to corrode the modified glass in the third modified region 117, thereby forming a second through hole 118.
[0074] In one design, the method for manufacturing a substrate provided in an embodiment of the present application further includes manufacturing a positioning hole 154 on the substrate 100. Figure 8 As shown in (a), the first surface 110 further includes a third area 150 .
[0075] As a possible implementation, the focal plane of the laser beam is determined to be the first focal plane 130, and a plurality of fourth modified areas 151 are formed in the third region 150. The fourth modified areas 151 are used to form third through holes 152. The aperture of the third through hole 152 is the same or substantially the same as the aperture of the first through hole 113. Figure 8 As shown in (b), a plurality of fourth modified areas 151 are sequentially arranged to form an annular structure 153 having a first aperture, and the first aperture is larger than the aperture of the first through hole 113 .
[0076] Optionally, a high-precision laser (such as an ultraviolet laser or a femtosecond laser) may be used to irradiate the third region 150 to reduce the chemical stability of the glass and form a plurality of modified fourth modified regions 151 in the third region 150 .
[0077] The aperture of the third through hole 152 is the same as or substantially the same as the aperture of the first through hole 113 , that is, the difference between the aperture of the third through hole 152 and the aperture of the first through hole 113 is smaller than a preset threshold.
[0078] Furthermore, the step of placing the substrate 100 in an etching solution to form a first through hole 113 in the first modified area 115 and a blind groove 114 in the second modified area 116 also includes: the modified glass of multiple fourth modified areas 151 is corroded to remove the material inside the annular structure 153, and a positioning hole 154 with an aperture of the first aperture is formed in the third area 150.
[0079] For example, Figure 8 As shown in (c) of FIG. 1 , the laser-induced modified glass in the plurality of third modified regions 151 is etched by an etching solution to form a plurality of third through holes 152. Further, after the plurality of third modified regions 151 are etched, the intermediate material falls out, and the plurality of third through holes 152 are formed into positioning holes 154 having a first aperture diameter.
[0080] In some embodiments, the present application provides a substrate having a first through hole and a blind groove, and the first through hole and the blind groove are manufactured using the manufacturing method of the substrate provided in the above embodiments of the present application.
[0081] Optionally, the first through hole is a TGV hole, and the blind groove is used to accommodate some electronic devices (such as chips), heat sinks, etc.
[0082] In some embodiments, the present application provides a substrate having a first through hole and a blind groove.
[0083] Those skilled in the art can clearly understand that for the convenience and brevity of description, the above-described fabrication of through holes and blind grooves on the substrate can refer to the corresponding substrates and implementation principles in the aforementioned embodiments, and will not be repeated here.
[0084] In some embodiments, as Figure 9 As shown, the present application provides a substrate manufacturing device 200, which is used to manufacture through holes and blind grooves on a substrate 100. The substrate 100 includes a first surface and a second surface opposite to each other. The first surface includes a first area and a second area. The first area is used to form the through holes, and the second area is used to form the blind grooves. The manufacturing device includes:
[0085] The laser head 210 is configured to respond to a control signal and emit a laser beam;
[0086] The control module 220 is coupled to the laser head 210 and is used to control the laser head 210 to emit the laser beam at a position where the focal plane of the laser beam is the first focal plane, and to form a first modified area in the first region;
[0087] The laser head driving module 230 is coupled to the control module 220 and connected to the laser head 210, and is used to receive a signal from the control module 220 and drive the laser head 210 to move to a position where the focal plane of the laser beam is the second focal plane;
[0088] The control module 220 is further configured to control the laser head 210 to be positioned at a second focal plane, emitting a laser beam so as to form a second modified area in the second region; the distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface;
[0089] The substrate driving module 240 is coupled to the control module 220 and is used to receive a signal from the control module 220 and drive the substrate 100 to move into the etching solution for etching, so that the first modified area forms a first through hole and the second modified area forms a blind groove.
[0090] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the above-described fabrication of the through holes on the substrate can refer to the corresponding substrates and implementation principles in the aforementioned embodiments, and will not be repeated here.
[0091] The above are only preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application should be included in the scope of protection of the present application.
Claims
1. A method for manufacturing a substrate, characterized in that: The method is used to form a through hole and a blind groove on the substrate, the substrate comprising a first surface and a second surface opposite to each other, the first surface comprising a first area and a second area, the first area being used to form a first through hole, and the second area being used to form the blind groove, the method comprising: determining a focal plane of the laser beam as a first focal plane, and modifying the first region to form a first modified area; determining a focal plane of the laser beam as a second focal plane, modifying the second region to form a second modified area, wherein a distance from the second focal plane to the second surface is greater than a distance from the first focal plane to the second surface; The substrate is placed in an etching solution so that the first modified area forms the first through hole and the second modified area forms a blind groove.
2. The production method according to claim 1, characterized in that Modifying the second region to form a second modified zone specifically comprises: The laser beam is controlled to move in a straight line within the second region to modify the second region to form a second modified area.
3. The production method according to claim 2, characterized in that: When the laser beam moves in a straight line within the second area, the distance between the centers of two adjacent light spots formed by the laser is greater than the radius of the light spot and smaller than the diameter of the light spot.
4. The production method according to claim 1, characterized in that Determining the focal plane of the laser beam as the second focal plane includes: The laser head is controlled to move so that the focal plane of the laser beam moves from the first focal plane to the second focal plane.
5. The production method according to claim 1, characterized in that: The first focal plane is located at a central plane in a thickness direction of the substrate, and the second focal plane is located at a side of the first surface away from the second surface.
6. The production method according to claim 1, characterized in that: The pulse width of the laser used for modification in the second modification zone is in the range of 5000-7000 femtoseconds.
7. The production method according to any one of claims 1 to 6, characterized in that: Before placing the substrate in the etching solution, the method further comprises: determining the focal plane of the laser beam as a third focal plane to form a third modified area in the second region; The step of placing the substrate in an etching solution to form a blind groove in the second modified area further includes forming a second through hole in the third modified area, wherein the second through hole is used to penetrate the bottom of the blind groove and the second surface.
8. The production method according to any one of claim 1, characterized in that: The manufacturing method further includes forming a positioning hole on the substrate, the first surface further includes a third area, the focal plane of the laser beam is determined to be a first focal plane, and the step of modifying the first area to form a first modified area further includes: forming a plurality of fourth modified areas in the third region; the fourth modified areas are used to form third through holes, the plurality of third through holes are sequentially arranged and enclosed in an annular structure having a first aperture, the aperture of the third through holes being the same as or substantially the same as the aperture of the first through hole, and the first aperture being larger than the aperture of the first through hole; The step of placing the substrate in an etching solution to form a first through hole in the first modified area and a blind groove in the second modified area further includes: etching the modified glass in the plurality of fourth modified areas to remove material inside the annular structure, and forming the positioning hole with the first aperture in the third area.
9. A substrate, characterized in that The substrate has a first through hole and a blind groove, and the first through hole and the blind groove are manufactured by the substrate manufacturing method according to any one of claims 1 to 8.
10. A substrate, characterized in that: The substrate has a first through hole and a blind groove.
11. A substrate manufacturing device, characterized in that: The manufacturing device is used to manufacture through holes and blind grooves on the substrate, the substrate includes a first surface and a second surface opposite to each other, the first surface includes a first area and a second area, the first area is used to form the through holes, and the second area is used to form the blind grooves, the manufacturing device includes: a laser head, configured to respond to a control signal and emit a laser beam; a control module coupled to the laser head, configured to control the laser head to position the focal plane of the laser beam as a first focal plane, emit the laser beam, and form a first modified area in the first region; a laser head driving module, coupled to the control module, configured to receive a signal from the control module and drive the laser head to move to a position where the focal plane of the laser beam is a second focal plane; The control module is further configured to control the position of the laser head at a second focal plane and emit the laser beam so as to form a second modified area in the second region; the distance from the second focal plane to the second surface is greater than the distance from the first focal plane to the second surface; The substrate driving module is coupled to the control module, and is used to receive a signal from the control module and drive the substrate to move into an etching solution for etching, so that the first modified area forms a first through hole and the second modified area forms a blind groove.