Device and method for separating multi-size wafers in drying tank

Abstract

The invention relates to a device and a method for separating multi-size wafers in a drying tank. The device comprises a carrier moving mechanism, a cutter moving mechanism, a linear driving mechanism, a cam connecting rod mechanism and a wafer separating cover. The carrier moving mechanism comprises a connecting platform and a bearing platform arranged below the connecting platform, two carrier brackets capable of being movably adjusted in the first horizontal direction are arranged on the bearing platform, the two carrier brackets are matched to bear carrier baskets with different widths, and an electric cylinder module is arranged between the connecting platform and the bearing platform. The tool moving mechanism comprises a separation platform arranged above the connecting platform, two separation tools used for separating wafer groups of different sizes are arranged on the separation platform, and the separation tools can horizontally stretch out and draw back in the second horizontal direction perpendicular to the first horizontal direction. The wafer separation cover is movably arranged above the carrier basket and used for bearing separated wafer sets, and two sets of partition plates which are symmetrically arranged and used for separating the wafer sets are arranged in the wafer separation cover.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning and drying, and in particular to a device and method for separating wafers of multiple sizes in a drying tank. Background Art

[0002] Wafer cleaning and drying are critical processes in semiconductor device manufacturing. Their purpose is to remove contaminants such as organic and inorganic matter and particles from the wafer surface to prevent defects or even failure in subsequent processes. After cleaning, the wafers must be separated from the carrier using a wafer separation device for drying.

[0003] Currently, common wafer separation devices are generally only suitable for wafers of a single size. When processing wafers of different sizes in the same MRD drying device, it is usually necessary to replace wafer carriers and wafer separation tools of different specifications and readjust the equipment settings. This method is prone to equipment downtime, manual disassembly and assembly, and low efficiency. It is difficult to achieve seamless switching between wafers of different sizes. Especially when facing the demand for mixed sizes, the size compatibility and adaptability of existing separation devices are particularly insufficient, and it is difficult to meet the current demand for precise and efficient wafer processing. Summary of the Invention

[0004] The object of the present invention is to provide a device and method for separating multi-sized wafers in a drying tank, which can separate wafer groups and carrier baskets of different sizes.

[0005] To achieve the above object, according to a first aspect of the present invention, a device for separating multi-sized wafers in a drying tank is provided, comprising:

[0006] The carrier moving mechanism includes a connecting platform and a carrying platform arranged below the connecting platform, the carrying platform is provided with two carrier brackets that can be moved and adjusted along a first horizontal direction, the two carrier brackets cooperate to support carrier baskets of different widths, and an electric cylinder module is provided between the connecting platform and the carrying platform;

[0007] The tool moving mechanism includes a separation platform provided above the connection platform, the separation platform being provided with two separation tools for separating wafer groups of different sizes, the separation tools being horizontally extendable and retractable along a second horizontal direction perpendicular to the first horizontal direction;

[0008] A linear drive mechanism, used for driving the separation platform to move back and forth vertically, comprising a carrier, on which both the carrier moving mechanism and the tool moving mechanism are arranged;

[0009] a cam connecting rod mechanism, disposed on the carrier frame, for cooperating with the linear drive mechanism to drive the carrier moving mechanism and the tool moving mechanism to move back and forth vertically to separate the wafer group from the carrier basket;

[0010] A wafer separation cover is movably disposed above the carrier basket and is used to receive the separated wafer groups. Two groups of symmetrically arranged partition plates are disposed within the wafer separation cover and are used to separate the wafer groups. The two groups of partition plates can be adjusted in spacing along a first horizontal direction, and multiple partition plates in the same group can be adjusted in equal spacing along a second horizontal direction.

[0011] An optical recognition system, disposed on the top and side of the wafer separation device, for identifying the size and position height of the wafer group and the carrier basket;

[0012] A control system is used to adjust the size and position of the carrier bracket, the separation tool and the wafer separation cover according to the recognition information of the optical recognition system.

[0013] Optionally, the axis of the carrier bracket is tilted at a preset angle to the horizontal plane, and the wafer separation cover is parallel to the carrier bracket.

[0014] Optionally, a first left and right rotating screw rod is provided on the carrying platform along a first horizontal direction, and the two carrier brackets are provided on two first sliding blocks of the first left and right rotating screw rod.

[0015] Optionally, the separation tool includes a tool body and a telescopic portion that can be extended into the tool body, the separation platform is provided with a tool bracket, and the tool bracket is provided with a tool adjustment mechanism, and the tool adjustment mechanism includes:

[0016] The first adjusting gear and the second adjusting gear are controlled to rotate synchronously in opposite directions;

[0017] A first adjusting rack and a second adjusting rack are respectively provided on the tool body and the telescopic portion, the first adjusting gear is meshedly connected to the first adjusting rack, and the second adjusting gear is meshedly connected to the second adjusting rack;

[0018] a first transmission gear and a second transmission gear, wherein a synchronous belt is sleeved between the first transmission gear and the first adjustment gear;

[0019] a reverse transmission gear meshing with the second transmission gear, a synchronous belt being provided between the reverse transmission gear and the second adjustment gear;

[0020] A main transmission assembly, consisting of a transmission gear and a timing belt, for driving the first transmission gear and the second transmission gear to rotate synchronously in the same direction;

[0021] The driving motor is arranged on the separation platform, and the movable end of the driving motor is connected to the transmission gear in the main transmission assembly.

[0022] Optionally, support rods that can be limited and moved along the first horizontal direction are correspondingly provided on both sides of the wafer separation cover, and the two groups of partition plates are correspondingly mounted on the two support rods. Adjustment shafts with controlled rotation are correspondingly provided on both sides of the wafer separation cover along the second horizontal direction, and a plurality of spiral grooves are provided on the adjustment shafts along their axial direction. A linear bearing is provided on the partition plate, and the side of the linear bearing is limitedly provided in the spiral groove. The adjustment shaft cooperates with the linear bearing to adjust the multiple partition plates in the same group to equal intervals.

[0023] Optionally, a second left and right screw rod is provided on the wafer separation cover along the first horizontal direction, and an adjustment motor is correspondingly provided on two second sliders of the second left and right screw rod, and the movable end of the adjustment motor is connected to the adjustment shaft.

[0024] Optionally, the cam-linkage mechanism comprises:

[0025] A cam plate is provided on the carrier frame, wherein the side edge of the cam plate is divided into a synchronization section of a vertical structure and a separation section of an arc structure;

[0026] a first connecting rod, one end of which is rotatably connected to the separation platform;

[0027] a second connecting rod, one end of which is rotatably connected to the connecting platform, the other end of which is rotatably connected to the other end of the first connecting rod, and a locking member is provided between the separation platform and the connecting platform;

[0028] The idler wheel is arranged at the connection between the first connecting rod and the second connecting rod and is rollably arranged at the side edge of the cam plate.

[0029] According to a second aspect of the present invention, a method for separating wafers of multiple sizes in a drying tank is provided, comprising the following steps:

[0030] Controlling the optical recognition system to identify the size and position height of the wafer group and the carrier basket, and adjusting the size and position of the carrier bracket, the separation tool and the wafer separation cover according to the recognition information of the optical recognition system;

[0031] The linear drive mechanism is controlled to cooperate with the cam connecting rod mechanism to move and drive the tool moving mechanism and the carrier moving mechanism to move so as to separate the wafer group and the carrier basket.

[0032] Optionally, controlling the optical recognition system to identify the size and position height of the wafer group and the carrier basket, and adjusting the size and position of the carrier bracket, the separation tool, and the wafer separation cover according to the recognition information of the optical recognition system comprises the following steps:

[0033] Controlling the carrier moving mechanism and the tool moving mechanism to move upward synchronously so that the carrier bracket rises to a target pickup position above the liquid level of the drying tank, and at this time moving the wafer group and the carrier basket to above the carrier bracket;

[0034] Controlling the optical recognition system on the top to recognize the size and position height of the wafer group and the carrier basket;

[0035] Controlling the first left and right screws to adjust the distance between the two carrier brackets according to the carrier basket width and wafer group thickness information identified by the optical recognition system, and controlling the tool adjustment mechanism to adjust the length of the separation tool to match the size of the wafer group and the carrier basket;

[0036] Placing the wafer group and the carrier basket on the carrier bracket, and controlling the optical recognition system on the top to detect whether the carrier basket is accurately placed on the carrier bracket;

[0037] Based on the position height information of the carrier basket identified by the optical recognition system, while controlling the carrier moving mechanism and the tool moving mechanism to move downward synchronously so that the wafer group and the carrier basket are immersed in the drying tank, the electric cylinder module is controlled to drive the carrier bracket to move to the target height position;

[0038] The wafer separation cover is moved to above the carrier basket, and the locking member is controlled to unlock the separation platform and the connection platform;

[0039] The optical recognition system at the top is controlled to identify the wafer gap and wafer diameter within the wafer group. According to the wafer gap and wafer diameter information identified by the optical recognition system, the second left and right screws are controlled to adjust the spacing between the two groups of partition plates. At the same time, the adjustment axis is controlled to adjust the multiple partition plates in the same group to equal spacing to match the wafer gap and wafer diameter within the wafer group.

[0040] Optionally, controlling the linear drive mechanism to cooperate with the cam-link mechanism to drive the tool moving mechanism and the carrier moving mechanism to move so as to separate the wafer group and the carrier basket comprises the following steps:

[0041] Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to move the tool moving assembly and the carrier moving assembly to move upward synchronously so that the wafer assembly and the top of the carrier basket are at a target reference plane to reach an initial separation position, at which time the carrier moving assembly stops;

[0042] Controlling the tool moving assembly to continue to rise so that the separation tool ejects and separates the wafer group from the carrier basket and lifts it into the wafer separation cover for drying;

[0043] After drying is completed, the tool moving assembly is controlled to move so that the separation tool lifts the wafer group down and returns it to the carrier basket;

[0044] The wafer separation cover is moved away from above the carrier basket, and the locking member is controlled to lock the separation platform and the connection platform;

[0045] The carrier bracket is controlled to rise to a target pickup position above the liquid level of the drying tank.

[0046] The beneficial effects of the present invention are as follows: by automatically adjusting the spacing of the carrier brackets, the length of the separation tool, and the distribution structure of the partition plate in the wafer separation cover according to the wafer diameter, thickness, spacing, and carrier basket width information collected by the optical recognition system, adaptive matching of wafer groups of different sizes and their corresponding carrier baskets is achieved; at the same time, by providing a connecting platform, a bearing platform, and an electric cylinder module in the carrier moving structure, the height position of the carrier bracket and the carrier basket can be adjusted according to the height difference of carrier baskets of different sizes, so that the top of the wafer groups of different sizes and the carrier basket are on the same target reference plane, thereby unifying the initial separation position of the wafers; the separation tool is set on the separation platform and can complete the vertical ejection action with the cooperation of the linear drive mechanism and the cam connecting rod mechanism, thereby achieving effective separation of the wafer group from the carrier basket. The overall structure improves the dimensional compatibility of the equipment, the accuracy of wafer separation, and the processing efficiency, significantly meeting the current requirements for continuous, efficient, and automated processing in the cleaning and drying process of multi-sized wafers.

[0047] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 This is a first schematic structural diagram of a device for separating multi-sized wafers in a drying tank according to an embodiment of the present invention;

[0049] Figure 2 This is a second schematic structural diagram of a device for separating multi-sized wafers in a drying tank according to an embodiment of the present invention;

[0050] Figure 3 This is a schematic structural diagram of a tool adjustment mechanism of a device for separating multi-sized wafers in a drying tank according to an embodiment of the present invention;

[0051] Figure 4 This is a schematic structural diagram of the first left and right screw rods of a device for separating multi-sized wafers in a drying tank according to one embodiment of the present invention;

[0052] Figure 5 This is a schematic structural diagram of a wafer separation cover of a device for separating multi-sized wafers in a drying tank according to an embodiment of the present invention;

[0053] Figure 6 This is a schematic structural diagram of a partition plate of a device for separating multi-sized wafers in a drying tank according to an embodiment of the present invention;

[0054] Figure 7 This is a schematic structural diagram of a locking shaft of a device for separating multi-sized wafers in a drying tank according to an embodiment of the present invention;

[0055] Figure 8 This is a schematic flow chart of a method for separating wafers of various sizes in a drying tank according to an embodiment of the present invention;

[0056] Figure 9 for Figure 8 Schematic flow chart of step S10;

[0057] Figure 10 for Figure 8 Schematic flow chart of step S20;

[0058] In the figure: 1. Carrier moving mechanism; 11. Connecting platform; 12. Carrier platform; 121. First left and right screw rod; 13. Carrier bracket; 131. Limit block; 14. Carrier basket; 15. Electric cylinder module; 2. Tool moving mechanism; 21. Separation platform; 22. Separation tool; 221. Tool body; 222. Telescopic part; 23. Tool bracket; 3. Linear drive mechanism; 31. Carrier; 4. Cam-link mechanism; 41. Cam plate; 42. First connecting rod; 43. Second connecting rod; 44. Idle wheel; 45. Locking part; 5. Wafer separation cover; 51. Partition plate; 52. Support rod; 53. Adjustment shaft; 54. Spiral groove; 55. Linear bearing; 56. Second left and right screw rod; 57. Adjustment motor; 58. Locking shaft; 6. Optical recognition system; 7. Tool adjustment mechanism; 71. First adjustment gear; 72. Second adjustment gear; 73. First adjustment rack; 74. Second adjustment rack; 75. First transmission gear; 76. Second transmission gear; 77. Reverse transmission gear; 78. Main transmission assembly; 79. Drive motor. DETAILED DESCRIPTION

[0059] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0060] In the description of the present invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings and are intended solely to facilitate and simplify the description of the present invention. They are not intended to indicate or imply that the devices or components referred to must have, be constructed, or operate in a specific orientation, and therefore should not be construed as limitations on the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0061] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be internal communication between two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances. In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0062] See Figures 1 to 7A preferred embodiment of the present application shows a device and method for separating multi-sized wafers in a drying tank. The device includes a carrier moving mechanism 1, a tool moving mechanism 2, a linear drive mechanism 3, a cam connecting rod mechanism 4, a wafer separation cover 5, an optical recognition system 6, and a control system. The carrier moving mechanism 1 includes a connecting platform 11 and a carrying platform 12 arranged below the connecting platform 11. The carrying platform 12 is provided with two carrier brackets 13 that can be moved and adjusted along a first horizontal direction. The two carrier brackets 13 cooperate to support carrier baskets 14 of different widths. An electric cylinder module 15 is provided between the connecting platform 11 and the carrying platform 12. The tool moving mechanism 2 includes a separation platform 21 arranged above the connecting platform 11. The separation platform 21 is provided with two separation tools 22 for separating wafer groups of different sizes. The separation tools 22 can be horizontally extended and retracted along a second horizontal direction perpendicular to the first horizontal direction. The linear drive mechanism 3 is used to drive the separation platform 21 to move back and forth vertically. It includes a carrying frame 31. The carrier moving mechanism 1 and the tool moving mechanism 2 are both arranged on the carrying frame 31. The cam connecting rod mechanism 4 is arranged on the carrier 31, and is used to cooperate with the linear drive mechanism 3 to drive the carrier moving mechanism 1 and the tool moving mechanism 2 to move back and forth vertically to separate the wafer group from the carrier basket 14. The wafer separation cover 5 is movably arranged above the carrier basket 14 to receive the separated wafer group. Two groups of symmetrically arranged partition plates 51 for separating the wafer groups are arranged in the wafer separation cover 5. The spacing between the two groups of partition plates 51 can be adjusted along the first horizontal direction, and multiple partition plates 51 in the same group can be adjusted at equal intervals along the second horizontal direction. The optical recognition system 6 is arranged on the top and side of the wafer separation device to identify the size and position height of the wafer group and the carrier basket 14. The control system is used to adjust the size and position of the carrier bracket 13, the separation tool 22 and the wafer separation cover 5 according to the recognition information of the optical recognition system 6.

[0063] According to the solution of the embodiment of the present invention, the spacing of the carrier brackets 13, the length of the separation tool 22, and the distribution structure of the partition plates 51 in the wafer separation cover 5 are automatically adjusted based on the information of wafer diameter, thickness, spacing, and carrier basket 14 width collected by the optical recognition system 6, thereby achieving adaptive matching of wafer groups of different sizes and their corresponding carrier baskets 14. At the same time, by providing a connection platform 11, a supporting platform 12, and an electric cylinder module 15 in the carrier movement structure, the height position of the carrier bracket 13 and carrier basket 14 can be adjusted according to the height differences of carrier baskets 14 of different sizes, so that wafer groups of different sizes and the top of the carrier basket 14 are on the same target reference plane, thereby unifying the initial separation position of the wafers. The separation tool 22 is mounted on the separation platform 21 and, in conjunction with the linear drive mechanism 3 and the cam linkage mechanism 4, can perform a vertical ejection action to effectively separate the wafer group from the carrier basket 14. The overall structure improves the dimensional compatibility of the equipment, the precision of wafer separation, and the processing efficiency, significantly meeting the current requirements for continuous, efficient, and automated processing in the cleaning and drying process of multi-sized wafers.

[0064] The following is a detailed description with specific embodiments:

[0065] Furthermore, the axis of the carrier bracket 13 is tilted at a preset angle to the horizontal plane, and the wafer separation cover 5 is parallel to the carrier bracket 13. By setting the axis of the carrier bracket 13 to a preset angle with the horizontal plane, the wafers carried in the carrier basket 14 can naturally slide and stick to the tilted side, thereby improving the stability of the wafers in the carrier and avoiding the displacement of the wafers during movement or immersion. In addition, the tilted placement of the wafers makes it easier to control the discharge of surface liquid, which is beneficial to improving the drying efficiency and effect. Furthermore, the wafer separation cover 5 above the carrier basket 14 is also set to the same tilt angle and parallel to the carrier basket 14 to ensure that the wafers can be smoothly separated and enter the wafer separation cover 5. In the specific setting, a tilting platform can be placed at the base of the carrier 31 to achieve the tilt of the carrier bracket 13. In this embodiment, the angle between the axis of the carrier bracket 13 and the horizontal plane is 3°.

[0066] Specifically, see Figure 1 and Figure 4 The carrier platform 12 is provided with a first left-right screw rod 121 arranged along a first horizontal direction. Two carrier brackets 13 are mounted on two first sliders of the first left-right screw rod 121. When the first left-right screw rod 121 is driven to rotate, the spacing between the two carrier brackets 13 can be precisely adjusted, allowing for rapid adaptation to carrier baskets 14 of varying widths without manual intervention. The carrier brackets 13 are provided with a plurality of limit blocks 131, which are used to secure the carrier baskets 14.

[0067] Specifically, see Figure 2 and Figure 3 The separation tool 22 includes a tool body 221 and a telescopic portion 222 that extends into the tool body 221. A tool holder 23 is mounted on the separation platform 21. A tool adjustment mechanism 7 is housed within the tool holder 23. The tool adjustment mechanism 7 includes a first adjustment gear 71, a second adjustment gear 72, a first adjustment rack 73, a second adjustment rack 74, a first transmission gear 75, a second transmission gear 76, a reverse transmission gear 77, a main transmission assembly 78, and a drive motor 79. The first adjustment gear 71 and the second adjustment gear 72 rotate synchronously in opposite directions under controlled conditions. The first adjustment rack 73 and the second adjustment rack 74 are mounted on the tool body 221 and the telescopic portion 222, respectively. The first adjustment gear 71 meshes with the first adjustment rack 73, while the second adjustment gear 72 meshes with the second adjustment rack 74. A timing belt is interposed between the first transmission gear 75 and the first adjustment gear 71. The reverse transmission gear 77 meshes with the second transmission gear 76, and a timing belt is interposed between the reverse transmission gear 77 and the second adjustment gear 72. The main transmission assembly 78 is composed of a transmission gear and a synchronous belt, which is used to drive the first transmission gear 75 and the second transmission gear 76 to rotate synchronously in the same direction. The drive motor 79 is set on the separation platform 21, and the movable end of the drive motor 79 is connected to the transmission gear in the main transmission assembly 78. The synchronous adjustment of the telescopic part 222 and the tool body 221 is achieved by a pair of gear rack mechanisms meshing with each other in the tool adjustment mechanism 7. The main transmission assembly 78 cooperates with the drive motor 79 to achieve synchronous adjustment of the length of the separation tool 22, so that the length of the separation tool 22 can be automatically matched according to the wafer group thickness information provided by the optical recognition system 6, effectively avoiding the problem of wafer leakage or the separation tool 22 being stuck at the bottom of the carrier basket 14 due to the inconsistency between the length of the separation tool 22 and the thickness of the wafer group during the separation process.

[0068] Specifically, see Figure 5 and Figure 6On either side of the wafer separation cover 5 are correspondingly provided support rods 52 that can be limited and moved along a first horizontal direction. Two sets of partition plates 51 are correspondingly mounted on the two support rods 52. On either side of the wafer separation cover 5 are correspondingly provided along a second horizontal direction with controllable rotation adjustment shafts 53. The adjustment shafts 53 are provided with several spiral grooves 54 along their axes. The partition plates 51 are provided with linear bearings 55, with their sides limited within the spiral grooves 54. The adjustment shafts 53 and linear bearings 55 cooperate to adjust the spacing between multiple partition plates 51 within the same set. A second left and right screw rod 56 is provided on the wafer separation cover 5 along the first horizontal direction. Adjustment motors 57 are correspondingly provided on the two second sliders of the second left and right screw rods 56. The movable ends of the adjustment motors 57 are connected to the adjustment shafts 53. It should be noted that the wafer separation cover 5 has movable slots on both sides in the first horizontal direction. The ends of the support rods 52 are slidably arranged in the movable slots via stoppers 131. This allows the support rods 52 to be moved and adjusted synchronously when the second left and right screw rods 56 adjust the spacing between the two sets of partition plates 51. The partition plates 51 are adjusted to the same spacing by driving the adjustment motor 57 to rotate and linking the adjustment shaft 53, thereby matching the wafer gap.

[0069] Specifically, see Figure 7 A rotatable locking shaft 58 is correspondingly provided on both sides of the wafer separation cover 5 along the second horizontal direction. The locking shaft 58 passes through the partition plate 51 on the same side and is provided with an unlocking flat edge. When the unlocking flat edge is facing downward, the wafer inserted into the wafer separation cover 5 can be locked to facilitate the drying process. When the unlocking flat edge is facing one side of the wafer, the wafer can be unlocked.

[0070] Specifically, see Figure 1 and Figure 2 The cam-link mechanism 4 includes a cam plate 41, a first link 42, a second link 43 and an idler wheel 44. The cam plate 41 is arranged on the carrier 31, and the side edge of the cam plate 41 is divided into a synchronization section of a vertical structure and a separation section of an arc-shaped structure. One end of the first link 42 is rotatably connected to the separation platform 21, one end of the second link 43 is rotatably connected to the connection platform 11, and the other end of the second link 43 is rotatably connected to the other end of the first link 42. A locking member 45 is provided between the separation platform 21 and the connection platform 11. The idler wheel 44 is provided at the connection between the first link 42 and the second link 43, and is rollably provided at the side edge of the cam plate 41. The cam-link structure is adopted, so that as the linear drive mechanism 3 rises and falls, the separation platform 21 and the connection platform 11 can cooperate with the different edge sections (synchronization section and separation section) of the cam plate 41 to complete the separation and merging of the wafer group and the carrier basket 14.

[0071] See Figure 8 The present invention also provides a method for separating multi-sized wafers in a drying tank, comprising the following steps:

[0072] Step S10: Control the optical recognition system 6 to identify the size and position height of the wafer group and the carrier basket 14, and adjust the size and position of the carrier bracket 13, the separation tool 22 and the wafer separation cover 5 according to the recognition information of the optical recognition system 6;

[0073] Step S20 : ​​controlling the linear drive mechanism 3 to cooperate with the cam linkage mechanism 4 to move the tool moving mechanism 2 and the carrier moving mechanism 1 to separate the wafer assembly and the carrier basket 14 .

[0074] See Figure 9 , the S10 includes the following steps:

[0075] Step S101: Control the carrier moving mechanism 1 and the tool moving mechanism 2 to move upward synchronously so that the carrier bracket 13 rises to the target pickup position above the liquid level of the drying tank. At this time, the wafer group and the carrier basket 14 are moved above the carrier bracket 13;

[0076] Step S102 : Control the optical recognition system 6 on the top to recognize the size and position height of the wafer group and the carrier basket 14 ;

[0077] Step S103: Based on the width of the carrier basket 14 and the thickness of the wafer stack identified by the optical recognition system 6 , the first left and right screw rods 121 are controlled to adjust the distance between the two carrier brackets 13 , and the tool adjustment mechanism 7 is controlled to adjust the length of the separation tool 22 to match the size of the wafer stack and the carrier basket 14 ;

[0078] Step S104: placing the wafer assembly and the carrier basket 14 on the carrier bracket 13, and controlling the optical recognition system 6 on the top to detect whether the carrier basket 14 is correctly placed on the carrier bracket 13;

[0079] Step S105: Based on the position height information of the carrier basket 14 identified by the optical recognition system 6, the carrier moving mechanism 1 and the tool moving mechanism 2 are controlled to move downward synchronously to immerse the wafer stack and the carrier basket 14 into the drying tank. At the same time, the electric cylinder module 15 is controlled to drive the carrier bracket 13 to move to the target height position.

[0080] Step S106 : moving the wafer separation cover 5 to above the carrier basket 14 , and controlling the locking member 45 to unlock the separation platform 21 and the connection platform 11 ;

[0081] Step S107: Control the optical recognition system 6 on the top to identify the wafer gap and wafer diameter in the wafer group, and control the second left and right screw rods 56 to adjust the spacing between the two groups of partition plates 51 according to the wafer gap and wafer diameter information identified by the optical recognition system 6. At the same time, control the adjustment shaft 53 to adjust the multiple partition plates 51 in the same group to equal spacing to match the wafer gap and wafer diameter in the wafer group.

[0082] In step S101 , the connecting platform 11 and the carrying platform 12 are locked together by the locking member 45 , so that the carrier moving mechanism 1 and the tool moving mechanism 2 can move upward synchronously to allow the carrier bracket 13 to extend above the liquid level of the drying tank to reach the target pickup position.

[0083] In step S105, the distance between the carrying platform 12 and the connecting platform 11 is adjusted by the electric cylinder module 15, which is actually to adjust the distance between the bottom of the carrier bracket 13 and the separation tool 22, so as to ensure that the wafer groups of different sizes and the top of the carrier basket 14 are located at the target reference plane (in this embodiment, the target reference plane is the liquid level of the drying tank). The target reference plane is not the initial separation position. At this position, the idler wheel 44 reaches the inflection point between the synchronization section and the separation section and is about to separate. The reason why the different-sized wafer groups and the top of the carrier basket 14 are located at the target reference plane for initial separation is, for example, if the small-sized wafers are separated after the large-sized wafers are separated, if the height position of the carrier bracket 13 is not adjusted, the separation position of the small-sized wafers will be below the liquid surface, and the separation stroke will remain unchanged (the distance from the bottom of the carrier basket 14 to the bottom of the wafer separation cover 5). Since the diameter of the small-sized wafers is small, it is easy for the bottom of the small-sized wafer to completely break away from the carrier basket 14 during the separation process, and the top has not yet extended into the wafer separation cover 5, resulting in the small-sized wafer having no support and falling out. Therefore, after the large-sized wafers are separated, the carrier bracket 13 needs to be lifted to make up for the gap between the top of the small-sized wafer and the top of the large-sized wafer, so as to ensure that the tops of the different-sized wafer groups are at the liquid surface of the drying tank when they are initially separated (in order to ensure that the wafers do not fall, the distance between the wafer separation cover 5 and the liquid surface needs to be set to be less than the diameter of the smallest-sized wafer). At the same time, when the carrier bracket 13 moves and adjusts, its bottom horizontal section must be higher than or flush with the top of the separation tool 22 to prevent the separation tool 22 from pushing out the wafer in the unseparated stage and affecting the subsequent separation process when it is lower than the separation tool 22.

[0084] In step S106, before separation begins, the connecting platform 11 and the carrying platform 12 need to be unlocked to allow the idler wheel 44 to freely pass through the separation section of the cam plate 41 to separate the wafer stack and the carrier basket 14. In other non-separation situations, locking the connecting platform 11 and the carrying platform 12 can increase the stability of the mechanism movement.

[0085] See Figure 10 , step S20 includes the following steps:

[0086] Step S201: Control the linear drive assembly to cooperate with the cam connecting rod assembly to move and drive the tool moving assembly and the carrier moving assembly to move upward synchronously so that the wafer assembly and the top of the carrier basket 14 are at the target reference plane to reach the initial separation position, at which time the carrier moving assembly stops;

[0087] Step S202: Control the tool moving assembly to continue to rise so that the separation tool 22 pushes the wafer group out of the carrier basket 14 and lifts it into the wafer separation cover 5 for drying;

[0088] Step S203: After drying is completed, the tool moving assembly is controlled to move so that the separation tool 22 lifts the wafer group and lowers it back into the carrier basket 14;

[0089] Step S204: The wafer separation cover 5 is moved away from above the carrier basket 14, and the locking member 45 is controlled to lock the separation platform 21 and the connection platform 11;

[0090] Step S205: Control the carrier bracket 13 to rise to a target pickup position above the liquid level in the drying tank.

[0091] In steps S201 and S202, when the top of the wafer assembly and the carrier basket 14 are located at the target reference plane, the idler wheel 44 reaches the inflection point between the synchronization section and the separation section. As the idler wheel 44 continues to move toward the separation section, the first connecting rod 42 and the second connecting rod 43 open, the carrier bracket 13 and the carrier basket 14 remain stationary, and the tool bracket 23 and the separation tool 22 continue to move upward to push the wafer out of the carrier basket 14, thereby achieving separation. When the wafer moves upward and extends into the wafer separation cover 5, the side optical recognition system 6 identifies the wafer position. At this time, the locking shaft 58 is controlled to rotate to lock the wafer, and the separation tool 22 moves downward to avoid it. After drying is completed, the locking shaft 58 rotates to unlock the wafer, and the separation tool 22 moves upward again to its previous position to support the wafer.

[0092] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0093] The above-described embodiments merely illustrate several implementations of the present invention, and while their descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make numerous variations and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A device for separating wafers of multiple sizes in a drying tank, characterized in that: include: The carrier moving mechanism includes a connecting platform and a carrying platform arranged below the connecting platform, the carrying platform is provided with two carrier brackets that can be moved and adjusted along a first horizontal direction, the two carrier brackets cooperate to support carrier baskets of different widths, and an electric cylinder module is provided between the connecting platform and the carrying platform; The tool moving mechanism includes a separation platform provided above the connection platform, the separation platform being provided with two separation tools for separating wafer groups of different sizes, the separation tools being horizontally extendable and retractable along a second horizontal direction perpendicular to the first horizontal direction; A linear drive mechanism, used for driving the separation platform to move back and forth vertically, comprising a carrier, on which both the carrier moving mechanism and the tool moving mechanism are arranged; a cam connecting rod mechanism, disposed on the carrier frame, for cooperating with the linear drive mechanism to drive the carrier moving mechanism and the tool moving mechanism to move back and forth vertically to separate the wafer group from the carrier basket; A wafer separation cover is movably disposed above the carrier basket and is used to receive the separated wafer groups. Two groups of symmetrically arranged partition plates are disposed within the wafer separation cover and are used to separate the wafer groups. The two groups of partition plates can be adjusted in spacing along a first horizontal direction, and multiple partition plates in the same group can be adjusted in equal spacing along a second horizontal direction. An optical recognition system, disposed on the top and side of the wafer separation device, for identifying the size and position height of the wafer group and the carrier basket; A control system is used to adjust the size and position of the carrier bracket, the separation tool and the wafer separation cover according to the recognition information of the optical recognition system.

2. The multi-size wafer separation device in a drying tank according to claim 1, characterized in that: The axis of the carrier bracket is tilted at a preset angle to the horizontal plane, and the wafer separation cover is parallel to the carrier bracket.

3. The multi-size wafer separation device in a drying tank according to claim 1, characterized in that: The carrying platform is provided with a first left and right rotating screw rod along a first horizontal direction, and the two carrier brackets are provided on two first sliding blocks of the first left and right rotating screw rod.

4. The device for separating multi-sized wafers in a drying tank according to claim 1, wherein: The separation tool comprises a tool body and a telescopic portion that can be inserted into the tool body. A tool bracket is provided on the separation platform. A tool adjustment mechanism is provided in the tool bracket. The tool adjustment mechanism comprises: The first adjusting gear and the second adjusting gear are controlled to rotate synchronously in opposite directions; A first adjusting rack and a second adjusting rack are respectively provided on the tool body and the telescopic portion, the first adjusting gear is meshedly connected to the first adjusting rack, and the second adjusting gear is meshedly connected to the second adjusting rack; a first transmission gear and a second transmission gear, wherein a synchronous belt is sleeved between the first transmission gear and the first adjustment gear; a reverse transmission gear meshing with the second transmission gear, a synchronous belt being provided between the reverse transmission gear and the second adjustment gear; A main transmission assembly, consisting of a transmission gear and a timing belt, for driving the first transmission gear and the second transmission gear to rotate synchronously in the same direction; The driving motor is arranged on the separation platform, and the movable end of the driving motor is connected to the transmission gear in the main transmission assembly.

5. The device for separating multi-sized wafers in a drying tank according to claim 1, wherein: Support rods that can be limited and moved along the first horizontal direction are correspondingly provided on both sides of the wafer separation cover, and the two groups of partition plates are correspondingly mounted on the two support rods. Adjustment shafts with controlled rotation are correspondingly provided on both sides of the wafer separation cover along the second horizontal direction, and a plurality of spiral grooves are provided on the adjustment shafts along their axial direction. A linear bearing is provided on the partition plate, and the side of the linear bearing is limitedly provided in the spiral groove. The adjustment shaft cooperates with the linear bearing to adjust the multiple partition plates in the same group to equal intervals.

6. The device for separating multi-sized wafers in a drying tank according to claim 5, wherein: A second left and right screw rod is provided on the wafer separation cover along the first horizontal direction, and an adjustment motor is correspondingly provided on the two second sliders of the second left and right screw rods, and the movable end of the adjustment motor is connected to the adjustment shaft.

7. The device for separating multi-sized wafers in a drying tank according to claim 1, wherein: The cam-linkage mechanism comprises: A cam plate is provided on the carrier frame, wherein the side edge of the cam plate is divided into a synchronization section of a vertical structure and a separation section of an arc structure; a first connecting rod, one end of which is rotatably connected to the separation platform; a second connecting rod, one end of which is rotatably connected to the connecting platform, the other end of which is rotatably connected to the other end of the first connecting rod, and a locking member is provided between the separation platform and the connecting platform; The idler wheel is arranged at the connection between the first connecting rod and the second connecting rod and is rollably arranged at the side edge of the cam plate.

8. A method for separating multi-sized wafers in a drying tank according to any one of claims 1 to 7, characterized in that: The steps include: Controlling the optical recognition system to identify the size and position height of the wafer group and the carrier basket, and adjusting the size and position of the carrier bracket, the separation tool and the wafer separation cover according to the recognition information of the optical recognition system; The linear drive mechanism is controlled to cooperate with the cam connecting rod mechanism to move and drive the tool moving mechanism and the carrier moving mechanism to move so as to separate the wafer group and the carrier basket.

9. The method for separating multi-sized wafers in a drying tank according to claim 8, wherein: The controlling the optical recognition system to recognize the size and position height of the wafer group and the carrier basket, and adjusting the size and position of the carrier bracket, the separation tool, and the wafer separation cover according to the recognition information of the optical recognition system, comprises the following steps: Controlling the carrier moving mechanism and the tool moving mechanism to move upward synchronously so that the carrier bracket rises to a target pickup position above the liquid level of the drying tank, and at this time moving the wafer group and the carrier basket to above the carrier bracket; Controlling the optical recognition system on the top to recognize the size and position height of the wafer group and the carrier basket; Controlling the first left and right screws to adjust the distance between the two carrier brackets according to the carrier basket width and wafer group thickness information identified by the optical recognition system, and controlling the tool adjustment mechanism to adjust the length of the separation tool to match the size of the wafer group and the carrier basket; Placing the wafer group and the carrier basket on the carrier bracket, and controlling the optical recognition system on the top to detect whether the carrier basket is accurately placed on the carrier bracket; Based on the position height information of the carrier basket identified by the optical recognition system, while controlling the carrier moving mechanism and the tool moving mechanism to move downward synchronously so that the wafer group and the carrier basket are immersed in the drying tank, the electric cylinder module is controlled to drive the carrier bracket to move to the target height position; The wafer separation cover is moved to above the carrier basket, and the locking member is controlled to unlock the separation platform and the connection platform; The optical recognition system at the top is controlled to identify the wafer gap and wafer diameter within the wafer group. According to the wafer gap and wafer diameter information identified by the optical recognition system, the second left and right screws are controlled to adjust the spacing between the two groups of partition plates. At the same time, the adjustment axis is controlled to adjust the multiple partition plates in the same group to equal spacing to match the wafer gap and wafer diameter within the wafer group.

10. The method for separating multi-sized wafers in a drying tank according to claim 8, wherein: The step of controlling the linear drive mechanism to cooperate with the cam linkage mechanism to drive the tool moving mechanism and the carrier moving mechanism to move so as to separate the wafer group and the carrier basket comprises the following steps: Controlling the linear drive assembly to cooperate with the cam connecting rod assembly to move the tool moving assembly and the carrier moving assembly to move upward synchronously so that the wafer assembly and the top of the carrier basket are at a target reference plane to reach an initial separation position, at which time the carrier moving assembly stops; Controlling the tool moving assembly to continue to rise so that the separation tool ejects and separates the wafer group from the carrier basket and lifts it into the wafer separation cover for drying; After drying is completed, the tool moving assembly is controlled to move so that the separation tool lifts the wafer group down and returns it to the carrier basket; The wafer separation cover is moved away from above the carrier basket, and the locking member is controlled to lock the separation platform and the connection platform; The carrier bracket is controlled to rise to a target pickup position above the liquid level of the drying tank.

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