Double-sided packaging structure and preparation method thereof

Abstract

The invention provides a double-sided packaging structure and a preparation method thereof, and relates to the technical field of chip packaging, the double-sided packaging structure comprises a plastic package body, a substrate is arranged in the plastic package body, a first chip and a second chip are arranged on the upper side and the lower side of the substrate respectively, one side of the first chip is connected with a first heat dissipation plate through a first heat conduction glue layer, and the other side of the first chip is connected with a second heat dissipation plate through a second heat conduction glue layer; the side, away from the first chip, of the first heat dissipation plate is exposed out of the plastic package body and forms a first heat dissipation face, one side of the second chip is connected with the second heat dissipation plate through a second heat conduction glue layer, and the side, away from the second chip, of the second heat dissipation plate is exposed out of the plastic package body and forms a second heat dissipation face. According to the double-sided packaging structure, the first heat dissipation plate and the second heat dissipation plate are arranged, so that the heat dissipation area of the double-sided packaging structure can be increased, the overall heat dissipation performance of the double-sided packaging structure is greatly improved, the service life of the chip is prolonged, and the working stability of the chip is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip packaging, and in particular to a double-sided packaging structure and a preparation method thereof. Background Art

[0002] A double-sided packaging structure involves packaging both the front and back sides of a chip on a single substrate, achieving higher levels of integration and functionality. This structure typically includes multiple chips, controllers, and electronic components, placed on either side of the substrate and electrically connected and packaged using various connection methods.

[0003] Chinese patent application number CN215731655U discloses a double-sided packaging structure comprising a substrate, a chip, a plastic encapsulation layer, and multiple anti-warpage components. The chip is mounted on two opposing sides of the substrate; the plastic encapsulation layer covers the opposing sides of the substrate and encapsulates the chip; and multiple anti-warpage components are mounted on opposing sides of the substrate and encapsulated within the plastic encapsulation layer to balance the weight of the chip on the substrate and the thermal stress of the packaging structure. By providing the anti-warpage components embedded in the plastic encapsulation layer, the anti-warpage components effectively reduce and suppress warping of the packaging structure in a direction perpendicular to the substrate by balancing the weight of the chip on the substrate and improving the thermal stress of the packaging structure. This improves the stability and reliability of the packaging structure.

[0004] In the above double-sided packaging structure, although the anti-warping component embedded in the plastic packaging layer can enhance the heat dissipation of the chip, the heat dissipation area of ​​the anti-warping component is small, which affects the overall heat dissipation performance. Summary of the Invention

[0005] The present invention provides a double-sided packaging structure and a preparation method thereof, which are used to solve the technical problem that the heat dissipation area of ​​the current double-sided packaging structure is small, affecting the overall heat dissipation performance.

[0006] To solve the above technical problems, the present invention discloses a double-sided packaging structure, comprising: a plastic package body, a substrate arranged in the plastic package body, a first chip and a second chip respectively arranged on the upper and lower sides of the substrate, one side of the first chip is connected to a first heat sink through a first thermal conductive adhesive layer, the side of the first heat sink away from the first chip is exposed to the plastic package body and forms a first heat dissipation surface, and one side of the second chip is connected to a second heat sink through a second thermal conductive adhesive layer, the side of the second heat sink away from the second chip is exposed to the plastic package body and forms a second heat dissipation surface.

[0007] Preferably, a plurality of heat conducting belts are arranged between the first heat dissipation plate and the second heat dissipation plate, and the plurality of heat conducting belts are symmetrically arranged on the left and right sides of the substrate. The heat conducting belts include a first heat transfer section, a second heat transfer section and a third heat transfer section from top to bottom.

[0008] Preferably, one end of the first heat transfer section is fixedly connected to the bottom wall of the first heat dissipation plate, and the other end of the first heat transfer section extends into the connecting hole, which is arranged in the second heat dissipation plate. The longitudinal cross-section of the connecting hole is an isosceles trapezoidal shape, the length of the upper end of the connecting hole is greater than the length of the lower end of the connecting hole, and the lower end of the first heat transfer section is adapted to the inner wall of the connecting hole.

[0009] Preferably, a second heat transfer section is provided at one end of the first heat transfer section away from the first heat dissipation plate, the second heat transfer section is perpendicular to the first heat transfer section, the second heat transfer section is provided in a positioning groove, the positioning groove is provided on the bottom wall of the second heat dissipation plate, and one end of the positioning groove is connected to the connecting hole.

[0010] Preferably, a third heat transfer section is provided at one end of the second heat transfer section away from the first heat transfer section, the third heat transfer section is perpendicular to the second heat transfer section, the third heat transfer section is provided in a limiting groove, the limiting groove is provided on the side wall of the second heat dissipation plate, one end of the limiting groove is connected to the positioning groove, the third heat transfer section includes a connecting end and a clamping end, the connecting end is connected to one end of the second heat transfer section, and the other end of the connecting end is connected to the clamping end, the clamping end is in the shape of an isosceles triangle, the length of the clamping end close to the connecting end is greater than the length of the connecting end, and the inner wall of the limiting groove is adapted to the third heat transfer section.

[0011] Preferably, a method for preparing a double-sided packaging structure is further included, which is used to prepare the double-sided packaging structure, comprising the following steps:

[0012] providing a substrate;

[0013] Mounting a first chip on one side of the substrate;

[0014] Disposing a first thermal conductive adhesive layer on the surface of the first chip, and installing a first heat dissipation plate on the first thermal conductive adhesive layer to obtain a first assembly;

[0015] Flip the first assembly 180 degrees and mount the second chip on the substrate;

[0016] Disposing a second thermally conductive adhesive layer on the surface of the second chip, and press-fitting a second heat dissipation plate on the second thermally conductive adhesive layer to obtain a second assembly;

[0017] The second assembly is plastic-sealed to obtain a double-sided packaging structure product.

[0018] Preferably, a press-fitting device is used to press-fit the second heat sink onto the second thermal conductive adhesive layer. The press-fitting device includes a press-fitting plate, a plurality of press-fitting holes are arranged in the press-fitting plate, a fixing assembly is arranged in the press-fitting holes, and the fixing assembly is used to fix the first combination. A supporting plate is arranged on the rear side of the press-fitting plate, a driving mechanism is arranged on the front side of the supporting plate, a movable plate is arranged at the output end of the driving mechanism, and a plurality of pressure columns are arranged at the lower end of the movable plate. The pressure columns correspond one-to-one to the press-fitting holes, a pressure plate is arranged at the lower end of the pressure columns, and a press-fitting assembly is arranged on the lower surface of the pressure plate.

[0019] Preferably, the fixing assembly includes a shell, which is arranged at the center of the press-fitting hole, a through hole is arranged on the top of the shell, a support column is slidably arranged in the through hole, a support plate is arranged at the upper end of the support column, the support plate is used to support the first heat dissipation plate, the lower end of the support plate extends into the shell and is provided with a first elastic member, and the lower end of the first elastic member is connected to the bottom wall of the shell.

[0020] Preferably, adjustment rods are symmetrically arranged on both sides of the support column, the upper surface of the adjustment rod is connected to the inner wall of the shell for left and right sliding, one end of the adjustment rod is connected to the lower end of the support column through a pull rope, the other end of the adjustment rod extends to the outside of the shell and a telescopic mechanism is arranged, a splint is arranged at the output end of the telescopic mechanism, the splint is perpendicular to the adjustment rod, and a second elastic member is arranged between the telescopic mechanism and the shell.

[0021] Preferably, the upper end of the clamping plate is higher than the upper surface of the second heat dissipation plate.

[0022] The technical solution of the present invention has the following advantages: The present invention provides a double-sided packaging structure and a preparation method thereof, relating to the field of chip packaging technology. The double-sided packaging structure includes a plastic package body, a substrate disposed within the plastic package body, a first chip and a second chip disposed on the upper and lower sides of the substrate, respectively. One side of the first chip is connected to a first heat sink via a first thermally conductive adhesive layer, the first heat sink being exposed to the plastic package body on a side away from the first chip and forming a first heat dissipation surface. One side of the second chip is connected to a second heat sink via a second thermally conductive adhesive layer, the second heat sink being exposed to the plastic package body on a side away from the second chip and forming a second heat dissipation surface. In the present invention, by providing the first and second heat sinks, the heat dissipation area of ​​the double-sided packaging structure can be increased, thereby significantly enhancing the overall heat dissipation performance of the double-sided packaging structure, extending the service life of the chip, and improving the operational stability of the chip.

[0023] Other features and advantages of the present invention will be described in the following description, and in part will become apparent from the description, or will be understood by practicing the present invention. The purpose and other advantages of the present invention can be realized and obtained by the devices particularly pointed out in the written description and the accompanying drawings.

[0024] The technical solution of the present invention is further described in detail below through the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 This is a schematic diagram of the overall structure of a double-sided packaging structure of the present invention;

[0027] Figure 2 This is a bottom view of a double-sided packaging structure of the present invention;

[0028] Figure 3 This is a schematic diagram of the first heat dissipation plate in the present invention;

[0029] Figure 4 For the present invention Figure 1 Cross-sectional view of the local structure at AA in the middle;

[0030] Figure 5 For the present invention Figure 1 Cross-sectional view of the local structure at the middle BB;

[0031] Figure 6 This is a schematic structural diagram of a press-fitting device in a method for preparing a double-sided packaging structure according to the present invention;

[0032] Figure 7 For the present invention Figure 6 A magnified view of the structure at point C in the middle;

[0033] Figure 8 For the present invention Figure 7 A magnified view of the structure at point D in the middle;

[0034] Figure 9 For the present invention Figure 8 Enlarged view of the structure at point E in the middle.

[0035] In the figure: 1, plastic package; 2, substrate; 3, first chip; 4, second chip; 5, first thermal conductive adhesive layer; 6, first heat sink; 7, second thermal conductive adhesive layer; 8, second heat sink; 9, thermal conductive tape; 10, first heat transfer section; 11, second heat transfer section; 12, third heat transfer section; 13, connecting hole; 14, positioning groove; 15, limiting groove; 16, press plate; 17, press hole; 18, carrying plate; 19, movable plate; 20, pressure column; 21, pressure plate; 22, housing; 23, support column; 24, support plate; 25, First elastic member; 26. Adjusting rod; 27. Pull rope; 28. Telescopic mechanism; 29. ​​Clamp; 30. Second elastic member; 31. Fixed plate; 32. First swing plate; 33. Mounting plate; 34. Spring rod; 35. Second swing plate; 36. Mounting frame; 37. Pressing roller; 38. Fixed block; 39. First rotating drum; 40. Driving rod; 41. Connecting spring; 42. Spiral groove; 43. Driving column; 44. First magnetic strip; 45. Second rotating drum; 46. Second magnetic strip; 47. Sliding block; 48. Positioning plate; 49. Positioning hole. DETAILED DESCRIPTION

[0036] The preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0037] In addition, in the present invention, descriptions such as "first" and "second" are only used for descriptive purposes, and do not specifically refer to the order or sequence, nor are they used to limit the present invention. They are only used to distinguish components or operations described with the same technical terms, and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one such feature. In addition, the technical solutions and technical features between the various embodiments can be combined with each other, but this must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0038] Example 1:

[0039] The embodiment of the present invention provides a double-sided packaging structure, such as Figure 1-Figure 5 As shown, it includes: a plastic package body 1, a substrate 2 is arranged in the plastic package body 1, a first chip 3 and a second chip 4 are respectively arranged on the upper and lower sides of the substrate 2, one side of the first chip 3 is connected to a first heat sink 6 through a first thermal conductive adhesive layer 5, and the first heat sink 6 is exposed to the plastic package body 1 on a side away from the first chip 3 and forms a first heat dissipation surface, and one side of the second chip 4 is connected to a second heat sink 8 through a second thermal conductive adhesive layer 7, and the second heat sink 8 is exposed to the plastic package body 1 on a side away from the second chip 4 and forms a second heat dissipation surface.

[0040] The working principle and beneficial effects of the above technical solution are as follows: a first chip 3 and a second chip 4 are respectively installed on the upper and lower sides of the substrate 2, and several first chips 3 and second chips 4 can be provided to improve the integration. A first thermal conductive adhesive layer 5 is provided on the side of the first chip 3 away from the substrate 2, and a first heat sink 6 is bonded through the first thermal conductive adhesive layer 5. The area of ​​the first heat sink 6 is larger than the area of ​​the first chip 3. The heat generated by the first chip 3 can be transferred to the first heat sink 6 and dissipated through the first heat dissipation surface, thereby realizing the heat dissipation of the first chip 3. A second thermal conductive adhesive layer 7 is provided on the side of the second chip 4 away from the substrate 2, and a second heat sink 8 is bonded through the second thermal conductive adhesive layer 7. The area of ​​the second heat sink 8 is larger than the area of ​​the second chip 4. The heat generated by the second chip 4 can be transferred to the second heat sink 8 and dissipated through the second heat dissipation surface, thereby realizing the heat dissipation of the second chip 4. By providing the first heat sink 6 and the second heat sink 8, the heat dissipation area of ​​the double-sided packaging structure can be increased, thereby greatly enhancing the overall heat dissipation performance of the double-sided packaging structure, extending the service life of the chip, and improving the stability of the chip operation.

[0041] Example 2:

[0042] On the basis of the above embodiment 1, Figure 2-Figure 5As shown, a plurality of heat-conducting belts 9 are provided between the first heat dissipation plate 6 and the second heat dissipation plate 8. The plurality of heat-conducting belts 9 are symmetrically arranged on the left and right sides of the substrate 2. The heat-conducting belts 9 include a first heat transfer section 10, a second heat transfer section 11 and a third heat transfer section 12 from top to bottom.

[0043] One end of the first heat transfer section 10 is fixedly connected to the bottom wall of the first heat dissipation plate 6. The other end of the first heat transfer section 10 extends into the connection hole 13. The connection hole 13 is provided in the second heat dissipation plate 8. The longitudinal cross-section of the connection hole 13 is in the shape of an isosceles trapezoid. The upper end of the connection hole 13 is longer than the lower end of the connection hole 13. The lower end of the first heat transfer section 10 is adapted to the inner wall of the connection hole 13.

[0044] A second heat transfer section 11 is provided at one end of the first heat transfer section 10 away from the first heat dissipation plate 6. The second heat transfer section 11 is perpendicular to the first heat transfer section 10 and is disposed in a positioning groove 14. The positioning groove 14 is disposed on the bottom wall of the second heat dissipation plate 8. One end of the positioning groove 14 is connected to the connecting hole 13.

[0045] A third heat transfer section 12 is provided at one end of the second heat transfer section 11 away from the first heat transfer section 10. The third heat transfer section 12 is perpendicular to the second heat transfer section 11 and is disposed within a limiting groove 15. The limiting groove 15 is disposed on a side wall of the second heat dissipation plate 8. One end of the limiting groove 15 communicates with the positioning groove 14. The third heat transfer section 12 includes a connecting end and a clamping end. The connecting end is connected to one end of the second heat transfer section 11, and the other end of the connecting end is connected to the clamping end. The clamping end is in the shape of an isosceles triangle. The length of the clamping end closest to the connecting end is greater than that of the connecting end. The inner wall of the limiting groove 15 is adapted to fit the third heat transfer section 12.

[0046] The working principle and beneficial effects of the above technical solution are as follows: a plurality of conductive belts 9 are arranged between the first heat sink 6 and the second heat sink 8, and heat transfer between the first heat sink 6 and the second heat sink 8 can be achieved through the conductive belts 9. When the heat of the first chip 3 is higher than that of the second chip 4, the heat absorbed by the first heat sink 6 can be transferred to the second heat sink 8 through the conductive belts 9, thereby accelerating the heat dissipation speed, improving the heat dissipation efficiency, preventing heat from accumulating locally in the first chip 3, and avoiding the performance degradation or malfunction of the first chip 3 due to overheating. In addition, by arranging a plurality of conductive belts 9, the heat can be transferred to the first heat sink 6 and the second heat sink 8. The heat is evenly distributed between the two sides to avoid the situation where the local temperature is too high or too low, which helps to maintain the consistency of the temperature inside the double-sided packaging structure and prolong the service life of the first chip 3 and the second chip 4. At least four conductive belts 9 are provided, and the four conductive belts 9 are respectively provided at the four corners of the first heat dissipation plate 6. The conductive belts 9 include a first heat transfer belt, a second heat transfer belt and a third heat transfer belt. Among them, one end of the first heat transfer section 10 is fixedly connected to the bottom wall of the first heat dissipation plate 6, and the other end extends into the connecting hole 13. Since the connecting hole 13 is in the shape of an isosceles trapezoid, and the end of the first heat transfer section 10 is adapted to the inner wall of the connecting hole 13, When the first heat transfer section 10 contacts the connection hole 13, the second heat sink 8 cannot move further toward the second chip 4, preventing the gap between the second heat sink 8 and the second chip 4 from being too small. The second heat transfer section 11 is bent and snapped into the positioning groove 14. The positioning groove 14 positions the second heat transfer section 11 to prevent it from shifting. The third heat transfer section 12 is perpendicular to the second heat transfer section 11. The snap-fit ​​end of the third heat transfer section 12 is snapped into the limiting groove 15. Since the snap-fit ​​end is in the shape of an isosceles triangle, the length of the snap-fit ​​end near the connection end is greater than the length of the connection end. The third heat transfer section 12 cannot be in the limiting groove 15. 5, and under the plastic sealing of the plastic sealing body 1, the third heat transfer section 12 cannot escape from the limiting groove 15, thereby enhancing the reliability of the connection between the first heat sink 6 and the second heat sink 8, preventing the first heat sink 6, the second heat sink 8 from being separated from the plastic sealing body 1, ensuring the heat dissipation performance of the double-sided packaging structure, and extending the service life. In addition, the maximum width of the clamping end is smaller than the minimum width of the connecting hole 13, ensuring that the clamping end can smoothly pass through the connecting hole 13, and is easy to align under the guiding effect of both sides of the clamping end, which is conducive to the rapid installation of the second heat sink 8. Compared with the traditional welding method, the installation efficiency and installation reliability are improved.

[0047] Example 3:

[0048] On the basis of Example 2, the embodiment of the present invention further provides a method for preparing a double-sided packaging structure, which is used to prepare the double-sided packaging structure, comprising the following steps:

[0049] Providing a substrate 2;

[0050] Mount the first chip 3 on one side of the substrate 2;

[0051] A first thermal conductive adhesive layer 5 is provided on the surface of the first chip 3, and a first heat dissipation plate 6 is installed on the first thermal conductive adhesive layer 5 to obtain a first assembly;

[0052] Flip the first assembly 180° and install the second chip 4 on the substrate 2;

[0053] A second thermal conductive adhesive layer 7 is provided on the surface of the second chip 4, and a second heat dissipation plate 8 is press-fitted on the second thermal conductive adhesive layer 7 to obtain a second assembly;

[0054] The second assembly is plastic-sealed to obtain a double-sided packaging structure product.

[0055] The working principle and beneficial effects of the above technical solution are as follows: providing a substrate 2; mounting a first chip 3 on one side of the substrate 2, the first chip 3 being mounted on the side of the substrate 2 by surface mounting or flip-chip mounting; then applying thermally conductive adhesive on the surface of the first chip 3 to form a first thermally conductive adhesive layer 5, and mounting a first heat sink 6 on the first thermally conductive adhesive layer 5 to form a first assembly; then flipping the first assembly 180°, mounting a second chip 4 on the substrate 2, applying thermally conductive adhesive on the surface of the second chip 4 to form a second thermally conductive adhesive layer 7, and press-fitting a second heat sink 8 on the second thermally conductive adhesive layer 7 to form a second assembly; finally, plastic-sealing the second assembly to form a finished double-sided packaging structure. Since the area of ​​the first heat sink 6 is larger than that of the first chip 3 and the area of ​​the second heat sink 8 is larger than that of the second chip 4, the heat dissipation area of ​​the double-sided packaging structure can be increased, thereby significantly enhancing the overall heat dissipation performance of the double-sided packaging structure, extending the service life of the chip, and improving the stability of the chip operation. The first thermally conductive adhesive layer 5 and the second thermally conductive adhesive layer 7 can both be made of thermally conductive silicone rubber, so that the heat of the first chip 3 and the second chip 4 can be quickly dissipated.

[0056] Example 4:

[0057] On the basis of Example 3, Figure 4-Figure 9 As shown, a press-fitting device is used to press-fit the second heat sink 8 onto the second thermally conductive adhesive layer 7. The press-fitting device includes a press-fitting plate 16. A plurality of press-fitting holes 17 are provided in the press-fitting plate 16. A fixing assembly is provided in the press-fitting hole 17. The fixing assembly is used to fix the first assembly. A supporting plate 18 is provided on the rear side of the press-fitting plate 16. A driving mechanism is provided on the front side of the supporting plate 18. A movable plate 19 is provided on the output end of the driving mechanism. A plurality of pressure columns 20 are provided on the lower end of the movable plate 19. The pressure columns 20 correspond one-to-one to the press-fitting holes 17. A press plate 21 is provided on the lower end of the press column 20. A press-fitting assembly is provided on the lower surface of the press plate 21.

[0058] The working principle and beneficial effects of the above technical solution are as follows: when installing the second heat sink 8, in order to improve the reliability of the connection between the first heat sink 6 and the second heat sink 8, the second heat sink 8 is pressed onto the second thermally conductive adhesive layer 7 by a press-fitting device. Specifically, the first assembly is turned over, with the first heat sink 6 of the first assembly facing downward. Then, the second chip 4 is installed on the substrate 2, and a second thermally conductive adhesive layer 7 is prepared on the surface of the second chip 4. After the second thermally conductive adhesive layer 7 is prepared, the connection holes 13 of the second heat sink 8 are aligned with the thermally conductive tape 9 and placed on the second thermally conductive adhesive layer 7, and then the thermally conductive tape 9 is placed on the second thermally conductive adhesive layer 7. The first assembly of the two heat sinks 8 is placed in the press-fitting hole 17, and the first assembly is fixed by a fixing assembly. The driving mechanism is started. The driving mechanism can optionally be an electric push rod. The driving mechanism can drive the movable plate 19 to move downward. The movable plate 19 drives the pressure column 20 to move downward. The pressure column 20 drives the pressure plate 21 into the press-fitting hole 17. The press-fitting assembly presses down, causing the heat conducting belt 9 to bend. The second heat transfer section 11 of the heat conducting belt 9 is pressed into the positioning groove 14, and the third heat transfer section 12 is pressed into the limiting groove 15. After press-fitting, the second assembly is obtained. Finally, after plastic sealing, the double-sided packaging structure can be obtained.

[0059] Example 5:

[0060] On the basis of Example 3, Figure 7 As shown, the fixing assembly includes a shell 22, which is arranged at the center of the press-fitting hole 17. A through hole is provided on the top of the shell 22, and a support column 23 is slidably provided in the through hole. A support plate 24 is provided at the upper end of the support column 23. The support plate 24 is used to support the first heat dissipation plate 6. The lower end of the support plate 24 extends into the shell 22 and is provided with a first elastic member 25. The lower end of the first elastic member 25 is connected to the bottom wall of the shell 22;

[0061] Adjustment rods 26 are symmetrically provided on both sides of the support column 23. The upper surface of the adjustment rod 26 is slidably connected to the inner wall of the housing 22. One end of the adjustment rod 26 is connected to the lower end of the support column 23 via a pull rope 27. The other end of the adjustment rod 26 extends to the outside of the housing 22 and is provided with a telescopic mechanism 28. A clamping plate 29 is provided at the output end of the telescopic mechanism 28. The clamping plate 29 is perpendicular to the adjustment rod 26. A second elastic member 30 is provided between the telescopic mechanism 28 and the housing 22.

[0062] The upper end of the clamping plate 29 is higher than the upper surface of the second heat dissipation plate 8 .

[0063] The working principle and beneficial effects of the above technical solution are as follows: the first heat sink 6 of the first assembly is placed downward on the support plate 24, the support plate 24 moves downward under the action of the gravity of the first assembly, the support plate 24 drives the support column 23 to slide downward in the through hole, the first elastic member 25 is compressed, and at the same time the support column 23 drives the adjustment rod 26 to slide in the direction close to the support column 23 through the pull rope 27, the adjustment rod 26 drives the telescopic mechanism 28 to move in the direction close to the housing 22, the second elastic member 30 is compressed, and the telescopic mechanism 28 drives the clamping plate 29 in the direction close to the first heat sink 6 Movement, and gradually contact with the outer side of the first heat sink 6, the first combination is kept in the center of the press-fitting hole 17 through the clamping plates 29 on both sides, which is convenient for the press-fitting of the press-fitted components and improves the consistency of the press-fitting. The first elastic member 25 and the second elastic member 30 can both adopt reset springs, and the telescopic mechanism 28 can choose an electric telescopic rod. The telescopic mechanism 28 can drive the clamping plate 29 to move up and down, so that the clamping plate 29 can adapt to different first combinations, and the height of the clamping plate 29 can always be kept higher than the upper surface of the second heat sink 8 to prevent the second heat sink 8 from shifting during the press-fitting process.

[0064] Example 6:

[0065] On the basis of Example 5, Figure 8 As shown, the pressing assembly includes two fixed plates 31, which are symmetrically arranged on the lower surface of the pressing plate 21. A first swinging plate 32 is arranged on the side of the fixed plate 31 near the clamping plate 29. One end of the first swinging plate 32 is hingedly connected to the side wall of the fixed plate 31, and the other end of the first swinging plate 32 is hingedly connected to the upper side wall of the mounting plate 33. A spring rod 34 is arranged between the first swinging plate 32 and the pressing plate 21. One end of the spring rod 34 is hingedly connected to the lower surface of the pressing plate 21, and the other end of the spring rod 34 is hingedly connected to the side wall of the first swinging plate 32. A second swinging plate 35 is arranged below the first swinging plate 32, and the second swinging plate 35 is parallel to the first swinging plate 32. One end of the second swinging plate 35 is hingedly connected to the side wall of the fixed plate 31, and the other end of the second swinging plate 35 is hingedly connected to the lower side wall of the mounting plate 33. Mounting frames 36 are symmetrically arranged on the front and rear sides of the mounting plate 33, and a pressure roller 37 is rotatably arranged in the mounting frame 36.

[0066] The working principle and beneficial effects of the above technical solution are as follows: during press-fitting, as the pressing plate 21 moves downward, the pressing roller 37 corresponding to the thermal conductive belt 9 gradually contacts the upper surface of the second heat dissipation plate 8, and then the pressing plate 21 continues to move downward, the first swing plate 32 and the second swing plate 35 rotate, the spring rod 34 is compressed, and the pressing roller 37 rolls along the upper surface of the second heat dissipation plate 8 toward the clamping plate 29. When the pressing roller 37 contacts the second heat transfer section 11 of the thermal conductive belt 9, the pressing roller 37 can press the second heat transfer section 11 into the positioning groove 14. When the pressing roller 37 rolls to the outside of the second heat dissipation plate 8, as the pressing plate 21 continues to press downward, the pressing roller 37 can press the third heat transfer section 12 into the limiting groove 15, limit the movement of the third heat transfer section 12, and thus complete the press-fitting of the second heat sink 8. The third heat transfer section 12 cannot slide in the limiting groove 15, and under the plastic sealing of the plastic sealing body 1, the third heat transfer section 12 cannot escape from the limiting groove 15, thereby enhancing the reliability of the connection between the first heat sink 6 and the second heat sink 8, and preventing the first heat sink 6, the second heat sink 8 and the plastic sealing body 1 from separating. The first heat sink 6, the second heat sink 8 and the thermal conductive tape 9 are made of the same thermally conductive material, which improves the heat dissipation performance of the double-sided packaging structure and extends the service life.

[0067] Example 7:

[0068] On the basis of Example 6, Figure 8 、 Figure 9 As shown, two fixed blocks 38 are provided on the side of the splint 29 away from the second heat dissipation plate 8, and a first rotating cylinder 39 is rotatably provided between the two fixed blocks 38. The first rotating cylinder 39 is parallel to the splint 29, and a driving rod 40 is provided in the first rotating cylinder 39. The lower end of the driving rod 40 is connected to the upper surface of the lower fixed block 38 through a connecting spring 41. The upper end of the driving rod 40 passes through the upper fixed block 38 and extends to the top of the fixed block 38. The driving rod 40 and the upper fixed block 38 are slidably connected up and down through the position. A spiral groove 42 is provided on the inner wall of the first rotating cylinder 39 along the axial direction of the first rotating cylinder 39, and a driving column 43 is provided on the side wall of the driving rod 40. One end of the driving column 43 extends into the spiral groove 42. The outer wall of the first rotating cylinder 39 A number of first mounting grooves are provided, a first magnetic strip 44 is provided in the first mounting groove, a second rotating drum 45 is provided for rotation outside the first rotating drum 39, a number of second mounting grooves are provided on the inner wall of the second rotating drum 45, a second magnetic strip 46 is provided in the second mounting groove, the second magnetic strip 46 and the first magnetic strip 44 are close to each other on one side with opposite magnetic poles, the upper and lower ends of the outer wall of the second rotating drum 45 are provided with external threads with opposite thread rotation directions, the upper and lower ends of the second rotating drum 45 are respectively threadedly connected with sliding blocks 47, a positioning plate 48 is provided on the side of the sliding block 47 close to the splint 29, a positioning hole 49 corresponding to the positioning plate 48 is provided in the splint 29, and the end of the positioning plate 48 away from the sliding block 47 passes through the positioning hole 49 and extends to the inner side of the splint 29.

[0069] The working principle and beneficial effects of the above technical solution are as follows: a distance sensor is set at the end of the positioning plate 48 away from the sliding block 47, and the two positioning plates 48 are respectively located on the upper and lower sides of the second heat dissipation plate 8. The distance sensor can detect the distance between the positioning plate 48 and the second heat dissipation plate 8, and the telescopic mechanism 28 is started. The telescopic mechanism 28 can drive the clamping plate 29 to move up and down through the telescopic mechanism 28, thereby driving the fixed block 38 to move up and down. When the distances between the two positioning plates 48 and the second heat dissipation plate 8 are the same, the telescopic mechanism 28 is closed, and then the driving mechanism is started, and the pressing plate 21 gradually contacts the upper end of the driving rod 40. When the pressing plate 21 contacts the upper end of the driving rod 40, the pressure roller 37 has not yet contacted the upper surface of the second heat dissipation plate 8. At this time, As the pressure plate 21 moves downward, the driving rod 40 slides vertically downward in the fixed block 38 on the upper side, and the driving rod 40 drives the driving column 43 to move downward, the connecting spring 41 is compressed, and the driving column 43 is slidably connected to the inner wall of the spiral groove 42. When the driving column 43 moves downward, it can drive the first rotating drum 39 to rotate between the two fixed blocks 38 by cooperating with the spiral groove 42. The first rotating drum 39 drives the second rotating drum 45 to rotate synchronously through the magnetic force of the first magnetic strip 44 and the second magnetic strip 46. When the second rotating drum 45 rotates, the two sliding blocks 47 move in the direction of approaching each other, thereby driving the two positioning plates 48 to move in the direction close to the second heat dissipation plate 8 until the positioning plates 48 contact the second heat dissipation plate 8 At this time, the second heat sink 8 is clamped between the two positioning plates 48. As the pressure plate 21 continues to press down, the pressure roller 37 contacts the surface of the second heat sink 8 and gradually presses the second heat transfer section 11 into the positioning groove 14, and presses the third heat transfer section 12 into the limiting groove 15. During the pressing process, the pressure plate 21 drives the driving rod 40 to continue to slide downward, but the positioning plate 48 contacts the second heat sink 8. The first magnetic strip 44 cannot continue to drive the second magnetic strip 46 to move synchronously, and the second rotating drum 45 cannot continue to rotate. The first rotating drum 39 rotates inside the second rotating drum 45. At this time, the pressure of the two positioning plates 48 on the second heat sink 8 does not exceed the preset pressure range, avoiding the second heat sink 8 from being clamped. At the same time, The two positioning plates 48 can adapt to the second heat sinks 8 of different thicknesses, and the pressure on different second heat sinks 8 will not exceed the preset pressure range, thereby ensuring the consistency and reliability of the press-fitting of the second heat sink 8. Moreover, during the rolling and pressing process of the pressure roller 37, the upper and lower positioning plates 48 can fix the second heat sink 8 at a preset height, so that the second heat sink 8 remains stable, and will not cause damage to the first chip 3 and the second chip 4 due to excessive pressure from the pressure roller 37, nor will it cause squeezing of the first thermal conductive adhesive layer 5 and the second thermal conductive adhesive layer 7 to cause overflow of the first thermal conductive adhesive layer 5 and the second thermal conductive adhesive layer 7, thereby ensuring the thermal conductivity of the first thermal conductive adhesive layer 5 and the second thermal conductive adhesive layer 7, and enhancing the overall heat dissipation performance of the double-sided packaging structure.

[0070] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0071] In the present invention, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection, electrical connection, or communication; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on specific circumstances.

[0072] Although the embodiments of the present invention have been disclosed above, they are not limited to the applications listed in the description and implementation methods. They can be fully applied to various fields suitable for the present invention. For those familiar with the art, additional modifications can be easily implemented. Therefore, without departing from the general concept defined by the claims and the scope of equivalents, the present invention is not limited to the specific details and illustrations shown and described herein.

Claims

1. A double-sided packaging structure, characterized in that: include: A plastic package (1) is provided in the plastic package (1), a substrate (2) is provided in the plastic package (1), a first chip (3) and a second chip (4) are provided on the upper and lower sides of the substrate (2), one side of the first chip (3) is connected to a first heat dissipation plate (6) via a first heat conductive adhesive layer (5), a side of the first heat dissipation plate (6) away from the first chip (3) is exposed to the plastic package (1) and forms a first heat dissipation surface, and one side of the second chip (4) is connected to a second heat dissipation plate (8) via a second heat conductive adhesive layer (7), a side of the second heat dissipation plate (8) away from the second chip (4) is exposed to the plastic package (1) and forms a second heat dissipation surface.

2. The double-sided packaging structure according to claim 1, characterized in that: A plurality of heat-conducting belts (9) are arranged between the first heat-dissipating plate (6) and the second heat-dissipating plate (8). The plurality of heat-conducting belts (9) are symmetrically arranged on the left and right sides of the base plate (2). The heat-conducting belts (9) include, from top to bottom, a first heat-transfer section (10), a second heat-transfer section (11), and a third heat-transfer section (12).

3. The double-sided packaging structure according to claim 2, characterized in that: One end of the first heat transfer section (10) is fixedly connected to the bottom wall of the first heat dissipation plate (6), and the other end of the first heat transfer section (10) extends into the connection hole (13). The connection hole (13) is arranged in the second heat dissipation plate (8). The longitudinal section of the connection hole (13) is in the shape of an isosceles trapezoid. The length of the upper end of the connection hole (13) is greater than the length of the lower end of the connection hole (13). The lower end of the first heat transfer section (10) is adapted to the inner wall of the connection hole (13).

4. The double-sided packaging structure according to claim 3, characterized in that: A second heat transfer section (11) is provided at one end of the first heat transfer section (10) away from the first heat dissipation plate (6). The second heat transfer section (11) is perpendicular to the first heat transfer section (10). The second heat transfer section (11) is provided in a positioning groove (14). The positioning groove (14) is provided on the bottom wall of the second heat dissipation plate (8). One end of the positioning groove (14) is communicated with the connecting hole (13).

5. The double-sided packaging structure according to claim 4, characterized in that: A third heat transfer section (12) is provided at one end of the second heat transfer section (11) away from the first heat transfer section (10). The third heat transfer section (12) is perpendicular to the second heat transfer section (11). The third heat transfer section (12) is provided in a limiting groove (15). The limiting groove (15) is provided on the side wall of the second heat dissipation plate (8). One end of the limiting groove (15) is communicated with the positioning groove (14). The third heat transfer section (12) includes a connecting end and a clamping end. The connecting end is connected to one end of the second heat transfer section (11), and the other end of the connecting end is connected to the clamping end. The clamping end is in the shape of an isosceles triangle. The length of the clamping end close to the connecting end is greater than that of the connecting end. The inner wall of the limiting groove (15) is adapted to the third heat transfer section (12).

6. A method for preparing a double-sided packaging structure, for preparing the double-sided packaging structure according to any one of claims 2 to 5, characterized in that: The following steps are involved: Providing a substrate (2); Mounting a first chip (3) on one side of the substrate (2); A first heat-conducting adhesive layer (5) is provided on the surface of a first chip (3), and a first heat dissipation plate (6) is installed on the first heat-conducting adhesive layer (5) to obtain a first assembly; Turning the first assembly 180 degrees, and mounting a second chip (4) on the substrate (2); A second heat-conducting adhesive layer (7) is provided on the surface of the second chip (4), and a second heat dissipation plate (8) is press-fitted on the second heat-conducting adhesive layer (7) to obtain a second assembly; The second assembly is plastic-sealed to obtain a double-sided packaging structure product.

7. The method for preparing a double-sided packaging structure according to claim 6, wherein: A press-fitting device is used to press-fit the second heat dissipation plate (8) onto the second heat-conducting adhesive layer (7). The press-fitting device includes a press-fitting plate (16), a plurality of press-fitting holes (17) are arranged in the press-fitting plate (16), a fixing assembly is arranged in the press-fitting holes (17), and the fixing assembly is used to fix the first assembly. A bearing plate (18) is arranged on the rear side of the press-fitting plate (16), a driving mechanism is arranged on the front side of the bearing plate (18), a movable plate (19) is arranged at the output end of the driving mechanism, and a plurality of pressing columns (20) are arranged at the lower end of the movable plate (19), the pressing columns (20) correspond to the pressing holes (17) one by one, a pressing plate (21) is arranged at the lower end of the pressing columns (20), and a press-fitting assembly is arranged on the lower surface of the pressing plate (21).

8. The method for preparing a double-sided packaging structure according to claim 7, wherein: The fixing assembly includes a shell (22), the shell (22) is arranged at the center of the press-fitting hole (17), a through hole is arranged on the top of the shell (22), a support column (23) is slidably arranged in the through hole, a support plate (24) is arranged at the upper end of the support column (23), the support plate (24) is used to support the first heat dissipation plate (6), the lower end of the support plate (24) extends into the shell (22) and is provided with a first elastic member (25), and the lower end of the first elastic member (25) is connected to the bottom wall of the shell (22).

9. The method for preparing a double-sided packaging structure according to claim 8, wherein: Adjustment rods (26) are symmetrically arranged on both sides of the support column (23). The upper surface of the adjustment rod (26) is connected to the inner wall of the shell (22) in a left-right sliding manner. One end of the adjustment rod (26) is connected to the lower end of the support column (23) through a pull rope (27). The other end of the adjustment rod (26) extends to the outside of the shell (22) and is provided with a telescopic mechanism (28). A clamping plate (29) is provided at the output end of the telescopic mechanism (28). The clamping plate (29) is perpendicular to the adjustment rod (26). A second elastic member (30) is provided between the telescopic mechanism (28) and the shell (22).

10. The method for preparing a double-sided packaging structure according to claim 9, wherein: The upper end of the clamping plate (29) is higher than the upper surface of the second heat dissipation plate (8).

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