Packaging device

Abstract

A package device includes a first conductor frame and a second conductor frame galvanically isolated from the first conductor frame, the first conductor frame including a first conductor, a first wire and a first bonding wire, one end of the first wire being connected to the first conductor, and the other end of the first wire being connected to the second conductor. The first conductor frame comprises a first conductor, a first wire and a second conductor, the other end of the first wire is connected with the input end of the transmitter bare chip through a first bonding wire, the first bonding wire crosses the area between the two ends of the first wire, the first conductor, the first wire and the first bonding wire form an 8-shaped loop, the second conductor frame comprises a second conductor, a second wire and a second bonding wire, and the second wire is magnetically coupled with the first wire; one end of the second wire is connected with the second conductor, the other end of the second wire is connected with the input end of the receiver through the second bonding wire, the second bonding wire crosses the area between the two ends of the second wire, and the second conductor, the second wire and the second bonding wire form an 8-shaped loop.

Description

Technical Field

[0001] The present application relates to the field of radio frequency technology, and in particular to a packaging device. Background Art

[0002] Some communication links require electrical isolation. The main methods for achieving this isolation include optocoupler isolation, capacitive isolation, and magnetic coupling. Traditional optocoupler isolation technology, due to its shortcomings such as rapid aging, high power consumption, slow speed, and difficulty in integration, is gradually failing to meet the requirements of modern industrial equipment. Magnetic coupling isolation offers advantages such as ease of integration, high speed, and low power consumption.

[0003] Currently, in the packaging devices isolated by magnetic coupling, the external radiation is large and it is easily disturbed by the external magnetic field. Summary of the Invention

[0004] The technical problem to be solved by the present application is to provide a lead frame and a packaging device with low external radiation and not easily affected by external magnetic field interference.

[0005] The present application discloses a packaged device, comprising: a first conductor frame, a second conductor frame, a transmitter die, and a receiver die, wherein the first conductor frame is galvanically isolated from the second conductor frame;

[0006] The first conductor frame includes a first conductor, a first wire, and a first bonding wire. The first conductor supports the transmitter die and is connected to the output terminal of the transmitter die. One end of the first wire is connected to the first conductor, and the other end of the first wire is connected to the input terminal of the transmitter die via the first bonding wire. The first bonding wire spans the area between the two ends of the first wire. The first bonding wire, the first conductor, the transmitter die, and the first wire form a figure-8 loop.

[0007] The second conductor frame includes: a second conductor, a second wire, and a second bonding wire. The second conductor is used to carry the receiver die and is connected to the output end of the receiver die. The second wire is magnetically coupled to the first wire. One end of the second wire is connected to the second conductor, and the other end of the second wire away from the second conductor is connected to the input end of the receiver die through the second bonding wire. The second bonding wire spans the area between the two ends of the second wire. The second bonding wire, the second conductor, the receiver die, and the second wire form an 8-shaped loop.

[0008] When the transmitter die transmits an electrical signal, current flows through the first conductor frame. If current flows sequentially through the transmitter die, the first conductor, the first wire, and the first bonding wire, the second bonding wire, the second conductor, the receiver die, and the second wire form a figure-8 loop, including the first conductive loop and the second conductive loop. The areas enclosed by the first conductive loop and the second conductive loop generate magnetic fields in opposite directions. If current flows sequentially through the transmitter die, the first bonding wire, the first wire, and the first conductor, the areas enclosed by the first conductive loop and the second conductive loop also generate magnetic fields in opposite directions. Because the areas enclosed by the first and second conductive loops are close to each other, and because magnetic lines of force in a magnetic field preferentially form a magnetic loop with the nearest opposite pole, when current flows through the figure-8 loop formed by the second bonding wire, the second conductor, the receiver die, and the second wire, the magnetic fields generated by the first and second conductive loops converge, minimizing external radiation and improving the stability of signal transmission by the transmitter die. Since the second wire is magnetically coupled to the first wire and the second wire is located near the first wire, the 8-shaped loop formed by the second bonding wire, the second conductor, the receiver die and the second wire gathers the magnetic field to improve the magnetic coupling performance between the first wire and the second wire.

[0009] The figure-8 loop formed by the second bond wire, the second conductor, the receiver die, and the second conductor includes a third conductive loop and a fourth conductive loop. The second conductor is magnetically coupled to the first conductor, generating an induced current in the second conductor. The induced current flows from the end of the second conductor away from the second conductor to the end of the second conductor closer to the second conductor, or from the end of the second conductor closer to the second conductor to the end of the second conductor away from the second conductor. The induced current flows through the figure-8 loop formed by the second bond wire, the second conductor, the receiver die, and the second conductor, generating magnetic fields in opposite directions in the areas enclosed by the third and fourth conductive loops. When the interfering magnetic field passes through the area enclosed by the third conductive loop and the area enclosed by the fourth conductive loop, the induced current flows through the third conductive loop and the fourth conductive loop. The magnetic field generated in one of the areas enclosed by the third conductive loop or the area enclosed by the fourth conductive loop can be superimposed in the same direction as the interfering magnetic field, and the other cancels out the interfering magnetic field in the opposite direction. In this way, the total magnetic flux of the interfering magnetic field passing through the first conductive loop and the second conductive loop is small or almost zero, thereby improving the anti-interference ability of the first conductor when magnetically coupled with the second conductor.

[0010] In conjunction with the first aspect, in one possible implementation, the first conductive line includes a first bend and a second bend connected to each other. One end of the first bend is connected to the first conductor, the other end of the first bend is connected to one end of the second bend, and the other end of the second bend is connected to the transmitter die via a first bonding wire. The first bonding wire spans the region where the first and second bends connect, and the first bonding wire is spaced apart from the region where the first and second bends connect. The first bonding wire, the transmitter die, the first conductor, and the first bend form a first conductive loop, and the first bonding wire and the second bend form a second conductive loop.

[0011] Because the first bonding wire crosses the area where the first bend portion and the second bend portion are connected, when current flows through the first wire, the directions of the current flowing in the first conductive loop and the second conductive loop are opposite, and the magnetic fields generated by the first conductive loop and the second conductive loop are opposite. The magnetic field generated by the first conductive loop and the magnetic field generated by the second conductive loop will converge, which can reduce the external radiation of magnetic energy and improve the magnetic coupling performance of the first wire and the second wire.

[0012] In conjunction with the first aspect, in one possible implementation, the winding direction of the first bend from the end connected to the first conductor to the end connected to the second bend is a first direction, and the winding direction of the second bend from the end connected to the first bend to the end connected to the first bonding wire is a second direction, and the first direction is opposite to the second direction. When the first direction is counterclockwise, the second direction is clockwise, and when the first direction is clockwise, the second direction is counterclockwise. The first wire is roughly wound in an S shape, and the first bonding wire spans the area where the first bend and the second bend are connected. While maintaining a certain length of the first wire, the first wire can occupy a smaller area of ​​the lead frame, reducing the magnetic coupling between the first wire and the second wire, and the magnetic energy is more concentrated, reducing the external radiation of magnetic energy, and improving the magnetic coupling performance of the first wire and the second wire.

[0013] In conjunction with the first aspect, in one possible implementation, the first bend portion includes multiple straight segments connected sequentially along a first direction from one end connected to the first conductor to one end connected to the second bend portion, with adjacent straight segments in the first bend portion forming an angle less than 180°. The second bend portion includes multiple straight segments connected sequentially along a second direction from one end connected to the first bend portion to one end connected to the first bonding wire, with adjacent straight segments in the second bend portion forming an angle less than 180°. The first bend portion is formed by connecting multiple straight segments, and the second bend portion is formed by connecting multiple straight segments. This eliminates the need to create complex arcs when manufacturing the first wire, facilitating the processing and forming of the first wire.

[0014] In the present application, the width of the straight line segment may be greater than or equal to 0.25 mm. For example, the width of the straight line segment in the present application may be 0.35 mm.

[0015] In conjunction with the first aspect, in one possible implementation, the second conductive line includes a third bend and a fourth bend connected to each other. One end of the third bend is connected to the second conductor, the other end of the third bend is connected to one end of the fourth bend, and the other end of the fourth bend is connected to the second bonding wire. The second bonding wire spans the region where the third and fourth bends are connected. The second bonding wire, the receiver die, the second conductor, and the third bend form a third conductive loop, and the second bonding wire and the fourth bend form a fourth conductive loop.

[0016] Because the second bond wire crosses the connection area between the third and fourth bends, the second bond wire, the receiver die, the second conductor, and the third bend form a third conductive loop, while the second bond wire and the fourth bend form a fourth conductive loop. When the second conductor is magnetically coupled to the first conductor, the direction of the magnetic field generated by the induced current flowing through the third conductive loop is opposite to the direction of the magnetic field generated by the induced current flowing through the fourth conductive loop. This means that when an interfering magnetic field passes through the third and fourth conductive loops, the magnetic field generated by one of the third and fourth conductive loops in the same direction as the interfering magnetic field can be superimposed, while the magnetic field generated by the other in the opposite direction can cancel the interfering magnetic field. This results in a small or nearly zero total magnetic flux through the first and second conductive loops, thereby improving the anti-interference capability of the first conductor when magnetically coupled to the second conductor.

[0017] In combination with the first aspect, in one possible implementation, the winding direction of the third bend portion from the end connected to the second conductor to the end connected to the fourth bend portion is a first direction, and the winding direction of the fourth bend portion from the end connected to the third bend portion to the end connected to the second bonding wire is a second direction. The first direction is opposite to the second direction. Exemplarily, if the first direction is clockwise, the second direction is counterclockwise, and if the first direction is counterclockwise, the second direction is clockwise.

[0018] The second wire is roughly wound into an S shape, and the second bonding wire spans the area where the third bend portion and the fourth bend portion are connected, so that the first wire can maintain a longer length while reducing the area occupied by the second wire on the lead frame. The magnetic energy of the first wire and the second wire is more concentrated during magnetic coupling, which reduces the external radiation of magnetic energy and improves the magnetic coupling performance of the first wire and the second wire.

[0019] In conjunction with the first aspect, in one possible implementation, the third bend portion includes multiple straight segments connected sequentially along a first direction from one end connected to the second conductor to one end connected to the fourth bend portion, with adjacent straight segments in the third bend portion forming an angle less than 180°. The fourth bend portion includes multiple straight segments connected sequentially along a second direction from one end connected to the third bend portion to one end connected to the second bonding wire, with adjacent straight segments in the fourth bend portion forming an angle less than 180°. The third bend portion is formed by connecting multiple straight segments, and the fourth bend portion is formed by connecting multiple straight segments. This eliminates the need to create complex arcs when manufacturing the second wire, facilitating the processing and forming of the second wire.

[0020] With reference to the first aspect, in one possible implementation, the first conductive line includes a first bend portion and a second bend portion connected to each other, one end of the first bend portion is connected to the first conductor, the other end of the first bend portion is connected to one end of the second bend portion, and the other end of the second bend portion is connected to the transmitter die via a first bonding wire, wherein the first bonding wire spans a region where the first bend portion and the second bend portion connect;

[0021] The second conductive line includes a third bend and a fourth bend connected to each other. One end of the third bend is connected to the second conductor, the other end of the third bend is connected to one end of the fourth bend, and the other end of the fourth bend is connected to the second bonding wire. The second bonding wire spans the region where the third and fourth bends connect. The first bend is electrically isolated from the third bend and magnetically coupled to the third bend. The second bend is electrically isolated from the fourth bend and magnetically coupled to the fourth bend. The first conductive line is generally S-shaped, and the second conductive line is generally S-shaped. The second conductive line extends along the extension trajectory of the first conductive line. The first bend in the first conductive line is magnetically coupled to the third bend in the second conductive line, and the second bend in the first conductive line is magnetically coupled to the fourth bend in the second conductive line. This improves the magnetic coupling performance between the second conductive line and the first conductive line.

[0022] In conjunction with the first aspect, in one possible implementation, at least a portion of the straight segments in the first bend are arranged parallel to at least a portion of the straight segments in the third bend, and at least a portion of the straight segments in the second bend are arranged parallel to at least a portion of the straight segments in the fourth bend. This can make the overall structure of the lead frame more regular, effectively improving the utilization of the lead frame area. It can also improve the magnetic coupling performance between the second conductor and the first conductor.

[0023] In conjunction with the first aspect, in one possible implementation, the first wire and the second conductor are located on the same side of the first conductor in the width direction of the lead frame, the first wire is connected to the first conductor, and the second conductor is spaced apart from the first conductor. In the width direction of the lead frame, the first wire and the second conductor are located on the same side of the second conductor, the first wire and the second conductor are spaced apart from each other, and the second wire is connected to the second conductor. The first wire and the second conductor are located on the same side of the first conductor, and the first wire and the second bend are located on the same side of the second conductor. The first conductor and the second conductor are spaced apart along the length of the lead frame. Because the first wire and the second wire are both S-shaped, the magnetic coupling structure formed by the first wire and the second wire is more compact, and the magnetic coupling structure formed by the first wire and the second wire occupies a smaller area of ​​the lead frame. This increases the area of ​​the lead frame occupied by the first conductor, thereby increasing the area of ​​the first conductor used to accommodate the transmitter die, and / or increases the area of ​​the lead frame occupied by the second conductor, thereby increasing the area of ​​the second conductor used to accommodate the receiver die. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the background technology, the drawings required for use in the embodiments of the present application or the background technology will be described below.

[0025] Figure 1 A schematic diagram of a flyback topology structure provided in one embodiment of the present application;

[0026] Figure 2 A schematic structural diagram of a packaging device provided in one embodiment of the present application;

[0027] Figure 3 A schematic diagram of magnetic field concentration in a first conductive loop and a second conductive loop provided in an embodiment of the present application;

[0028] Figure 4 A schematic diagram of the third conductive loop and the fourth conductive loop provided in an embodiment of the present application for resisting external magnetic field interference;

[0029] Figure 5 A schematic structural diagram of another packaging device provided in an embodiment of the present application;

[0030] Figure 6 A comparison chart of the near-field magnetic field strength of the lead frame 7 provided in this application and a traditional packaging device.

[0031] Description of reference numerals:

[0032] 1. Transformer primary; 2. Transformer secondary; 3. Isolation communication link; 4. Controller; 5. Switch; 6. Packaged device; 7. Lead frame; 8. Package body; 9. Transmitter die; 10. Receiver die; 11. First conductor frame; 12. Second conductor frame; 13. First conductor; 14. First wire; 15. First bond wire; 16. First conductive loop; 17. Second conductive loop; 18. Second conductor; 19. Second wire; 20. Second bond wire; 21. Third conductor 1. The first and second conductive loops are as follows: 1. The first and second conductive loops are as follows: 2 ... DETAILED DESCRIPTION

[0033] In a switching power supply topology, a microcontroller unit (MCU) is required to control the opening and closing of switches (power switches) on the primary side and the secondary side of the transformer.

[0034] Take the flyback topology structure of fast charging technology as an example, see Figure 1 The transformer primary side 1 and the transformer secondary side 2 are isolated from each other in terms of high and low voltage. The voltage information of the transformer secondary side 2 is sent to the controller 4 through the isolated communication link, and the controller 4 can control the switch set on the primary side.

[0035] In a power topology employing switch 5, the communication link requires electrical isolation. The isolated communication link 3 can include a packaged device 6 and a circuit board. Packaged device 6 has pins, and packaged device 6 is connected to the circuit board via the pins. Currently, magnetically coupled isolation packaged devices 6 used in isolated communication links have significant external radiation and are easily interfered with by external magnetic fields.

[0036] In view of this, the present application proposes a lead frame 7 and a packaging device 6 with low external radiation and strong resistance to magnetic field interference.

[0037] In order to make the purpose, technical solutions and advantages of this application clearer, this application will be further described in detail below with reference to the accompanying drawings.

[0038] See Figure 2 , Figure 2The packaged device 6 provided in the embodiment of the present application may be a digital isolator packaged device, an isolated gate driver packaged device 6, an isolated switching power supply controller 4, etc. The packaged device 6 can be applied to an isolated communication link 3 of a flyback topology.

[0039] The packaged device 6 includes a lead frame 7 , a transmitter die 9 , a receiver die 10 and a package body 8 . The package body 8 is used to accommodate the lead frame 7 , the transmitter die 9 and the receiver die 10 .

[0040] The lead frame 7 includes a first conductor frame 11 and a second conductor frame 12. The first conductor frame 11 and the second conductor frame 12 are galvanically isolated. Galvanic isolation here means that there is no electrical coupling between the first and second conductor frames 11, 12, and electrical signals can still be transmitted between the first and second conductor frames 11, 12. Specifically, the first conductor frame 11 includes a first conductor 13, a first wire 14, and a first bonding wire 15. The first conductor 13 is used to support the transmitter die 9 and is connected to the output terminal of the transmitter die 9. One end of the first wire 14 is connected to the first conductor 13, and the other end of the first wire 14, away from the first conductor 13, is connected to the input terminal of the transmitter die 9 via the first bonding wire 15. The first bonding wire 15 spans the area between the two ends of the first wire 14. The first bonding wire, the first conductor, the transmitter die, and the first wire form a figure-8 loop. The first bonding wire, the first conductor, the transmitter die, and the first conductive line form an 8-shaped loop including a first conductive loop 16 and a second conductive loop 17. Specifically, the first bonding wire 15, the first conductor 13, the transmitter die 9, and a portion of the first conductive line 14 form the first conductive loop 16, and the first bonding wire 15 and another portion of the first conductive line 14 form the second conductive loop 17. In the present application, the first bonding wire 15 spans the area between the two ends of the first conductive line 14 and is isolated from the area between the two ends of the first conductive line 14. The first conductive loop 16 and the second conductive loop 17 form a DD structure, which is roughly in the shape of an "8".

[0041] In the embodiment provided in the present application, the transmitter die is provided with a first pad connected to the first conductor via a bonding wire, and the transmitter die further has a second pad connected to the first bonding wire.

[0042] The second conductor frame 12 includes a second conductor 18, a second wire 19, and a second bonding wire 20. The second conductor 18 is used to support the receiver die 10 and is connected to the output terminal of the receiver die 10. The second wire 19 is magnetically coupled to the first wire 14. One end of the second wire 19 is connected to the second conductor 18, and the other end of the second wire 19, away from the second conductor 18, is connected to the input terminal of the receiver die 10 via the second bonding wire 20. The second bonding wire 20 spans the area between the two ends of the second wire 19. The second bonding wire, the second conductor, the receiver die, and the second wire form an 8-shaped loop. The 8-shaped loop formed by the second bonding wire, the second conductor, the receiver die, and the second wire includes a third conductive loop and a fourth conductive loop. Specifically, the second bonding wire 20, the second conductor 18, the receiver die 10, and a portion of the second wire 19 form a third conductive loop 21, and another portion of the second bonding wire 20 and the second wire 19 form a fourth conductive loop 22. The second bonding wire 20 spans the regions at both ends of the second conductive line 19 and is isolated from the region between the two ends of the second conductive line 19 . The third conductive loop 21 and the fourth conductive loop 22 form a DD structure, which is roughly in the shape of an “8”.

[0043] In the embodiment provided in this application, the receiver die is provided with a third pad connected to the second conductor via a bonding wire, and the receiver die further has a fourth pad connected to the second bonding wire.

[0044] It should be noted that when current flows through the first conductor 14, it can generate a magnetic field, causing the second conductor 19 to generate an induced current, thereby achieving magnetic coupling between the first conductor 14 and the second conductor 19. It will be appreciated that by utilizing the magnetic coupling between the first conductor 14 and the second conductor 19, the first conductor frame 11 and the second conductor frame 12 can transmit electrical signals without being electrically coupled.

[0045] In the first conductor frame 11, the first bonding wire 15 spans across the ends of the first conductor 14 to form a first conductive loop 16 and a second conductive loop 17. Because the first conductor 13 carries and is connected to the transmitter die 9, when the transmitter die 9 transmits an electrical signal, current flows through the first conductor frame 11. The direction of the magnetic field generated by the first conductive loop 16 and the direction of the magnetic field generated by the second conductive loop 17 are opposite. The area enclosed by the first conductive loop 16 and the area enclosed by the second conductive loop 17 are relatively close. The magnetic lines of force in the magnetic field preferentially select the nearest opposite pole to form a magnetic loop. The magnetic fields generated by the first conductive loop 16 and the second conductive loop 17 are concentrated near the first conductor 14, resulting in low external radiation and improved stability of the transmitter's transmitted signal. Because the second conductor 19 is magnetically coupled to the first conductor 14 and is located near the first conductor 14, the magnetic field concentrated by the first conductive loop 16 and the second conductive loop 17 can improve the magnetic coupling performance between the first conductor 14 and the second conductor 19. For example, see Figure 3 , current i flows through the first conductive wire, and the first conductive loop 16 and the second conductive loop 17 generate a magnetic field. Since the magnetic fields generated by the first conductive loop 16 and the second conductive loop 17 are in opposite directions, the magnetic lines of force of the magnetic field in the first conductive loop 16 and the magnetic lines of force in the second conductive loop 17 can easily form a magnetic loop, which can achieve magnetic concentration, so that the magnetic fields gathered in the first conductive loop 16 and the second conductive loop 17 can effectively act on the second conductive wire 19, thereby improving the magnetic coupling performance of the first conductive wire 14 and the second conductive loop 19.

[0046] In the second conductor frame 12, the second bonding wire 20 spans between the two ends of the second conductor 19 to form a third conductive loop 21 and a fourth conductive loop 22. Because the second conductor 18 carries the receiver die 10 and is connected to the output terminal of the receiver die 10, the second conductor 19 and the first conductor 14 are magnetically coupled. When current flows through the first conductor 14, a magnetic field is generated. Based on the magnetic field generated by the first conductive loop 16 and the second conductive loop 17, an induced current flows in the second conductor 19. The induced current flows from the end of the second conductor 19 away from the second conductor 18 to the end of the second conductor 19 closer to the second conductor 18, or from the end of the second conductor 19 closer to the second conductor 18 to the end of the second conductor 19 away from the second conductor 18. The direction of the magnetic field generated by the induced current flowing through the third conductive loop 21 is opposite to the direction of the magnetic field generated by the induced current flowing through the fourth conductive loop 22. See [Refer to the ' ... Figure 4 When the interfering magnetic field passes through the third conductive loop 21 and the fourth conductive loop 22, the magnetic field generated by one of the third conductive loop 21 and the fourth conductive loop 22 can be superimposed in the same direction as the interfering magnetic field, while the magnetic field generated by the other one cancels out the interfering magnetic field in the opposite direction. As a result, the total magnetic flux of the interfering magnetic field passing through the first conductive loop 16 and the second conductive loop 17 is small or almost zero, thereby improving the anti-interference capability of the first conductive wire 14 during magnetic coupling with the second conductive wire 19. It should be noted that the area of ​​the area enclosed by the third conductive loop is approximately the same as the area of ​​the area enclosed by the fourth conductive loop, and the ratio of the area enclosed by the third conductive loop to the area enclosed by the fourth conductive loop is 0.8-1.2.

[0047] In the examples provided in this application, see Figure 5The first conductive line 14 includes a first bend portion 23 and a second bend portion 24 connected to each other. One end of the first bend portion 23 is connected to the first conductor 13, and the other end of the first bend portion 23 is connected to one end of the second bend portion 24. The other end of the second bend portion 24 is connected to the transmitter die 9 through a first bonding wire 15. The first bonding wire 15 spans the area where the first bend portion 23 and the second bend portion 24 are connected. The first bonding wire 15 is spaced apart from the area where the first bend portion 23 and the second bend portion 24 are connected. The first bonding wire 15, the transmitter die 9, the first conductor 13, and the first bend portion 23 form a first conductive loop 16, and the first bonding wire 15 and the second bend portion 24 form a second conductive loop 17.

[0048] The winding direction of the first bend 23 from the end connected to the first conductor 13 to the end connected to the second bend 24 is a first direction, and the winding direction of the second bend 24 from the end connected to the first bend 23 to the end connected to the first bonding wire 15 is a second direction, with the first direction and the second direction being opposite. When the first direction is counterclockwise, the second direction is clockwise, and when the first direction is clockwise, the second direction is counterclockwise. The first wire 14 is wound roughly in an S-shape, and the first bonding wire 15 spans the area where the first bend 23 and the second bend 24 connect. While maintaining a certain length, the first wire 14 can occupy a smaller area of ​​the lead frame 7, thereby improving the magnetic coupling performance between the first wire 14 and the second wire 19.

[0049] In the embodiment provided herein, the first bend 23 includes multiple straight segments connected sequentially along a first direction from the end connected to the first conductor 13 to the end connected to the second bend 24, with adjacent straight segments in the first bend 23 forming an angle less than 180°. The second bend 24 includes multiple straight segments connected sequentially along a second direction from the end connected to the first bend 23 to the end connected to the first bonding wire 15, with adjacent straight segments in the second bend 24 forming an angle less than 180°. Exemplarily, the multiple straight segments in the first bend 23 are connected sequentially in a counterclockwise direction, and the multiple straight segments in the second bend 24 are connected sequentially in a counterclockwise direction. Specifically, the multiple straight segments in the first bend 23 include a first straight segment 27 and a second straight segment 28. The multiple straight segments in the second bend 24 include a third straight segment 29, a fourth straight segment 30, and a fifth straight segment 31. One end of first straight segment 27 is connected to first conductor 13. The end of first straight segment 27 away from first conductor 13 is connected to second straight segment 28. The end of second straight segment 28 away from first straight segment 27 is connected to one end of third straight segment 29. The end of third straight segment 29 away from second straight segment 28 is connected to fourth straight segment 30. The end of fourth straight segment 30 away from third straight segment 29 is connected to one end of fifth straight segment 31. First straight segment 27 and second straight segment 28 are connected counterclockwise to form first bend 23. Third straight segment 29, fourth straight segment 30, and fifth straight segment 31 are connected clockwise to form second bend 24. First bond wire 15 is connected to the end of fifth straight segment 31 away from fourth straight segment 30. First bond wire 15 crosses the area where second straight segment 28 and third straight segment 29 connect to connect to transmitter die 9. First bond wire 15, transmitter die 9, first conductor 13, first straight segment 27, and second straight segment 28 form a first conductive loop 16. The third straight segment 29, the fourth straight segment 30, the fifth straight segment 31, and the first bonding wire 15 form a second conductive loop 17. In the embodiment provided herein, to improve the mechanical strength of the first wire 14, the first conductor frame 11 further includes a first connection reinforcement segment, which connects the first wire 14 to the first conductor 13, or connects the first wire 14 to a pin in the packaged device 6. Exemplarily, the first connection reinforcement segment is connected between the first conductor 13 and the second straight segment 28, and is arranged parallel to the first straight segment 27.

[0050] In the embodiment provided in the present application, the second conductive line 19 includes a third bend portion 25 and a fourth bend portion 26 connected to each other, one end of the third bend portion 25 is connected to the second conductor 18, the other end of the third bend portion 25 is connected to one end of the fourth bend portion 26, the other end of the fourth bend portion 26 is connected to the second bonding wire 20, the second bonding wire 20 spans the area where the third bend portion 25 and the fourth bend portion 26 are connected, the second bonding wire 20, the receiver die 10, the second conductor 18 and the third bend portion 25 form a third conductive loop 21, and the second bonding wire 20 and the fourth bend portion 26 form a fourth conductive loop 22.

[0051] The winding direction of the third bend 25 from the end connected to the second conductor 18 to the end connected to the fourth bend 26 is a first direction, and the winding direction of the fourth bend 26 from the end connected to the third bend 25 to the end connected to the second bonding wire 20 is a second direction, with the first direction being opposite to the second direction. The first direction can be counterclockwise, and the second direction can be clockwise. The second wire 19 is wound roughly in an S-shape, and the second bonding wire 20 spans the area where the third bend 25 and the fourth bend 26 connect. This allows the first wire 14 to maintain a longer length while reducing the area occupied by the second wire 19 on the lead frame 7. This allows the magnetic energy of the first wire 14 and the second wire 19 to be more concentrated during magnetic coupling, reducing external radiation of magnetic energy and improving the magnetic coupling performance between the first wire 14 and the second wire 19.

[0052] The third bend 25 includes a plurality of straight segments connected in sequence in a counterclockwise direction, with the angle between two adjacent straight segments in the third bend 25 being less than 180°. The fourth bend 26 includes a plurality of straight segments connected in sequence in a clockwise direction, with the angle between two adjacent straight segments in the fourth bend 26 being less than 180°. Specifically, the third bend 25 includes a sixth straight segment 32, a seventh straight segment 33, and an eighth straight segment 34 connected in sequence in a counterclockwise direction. The sixth straight segment 32 is connected between the second conductor 18 and the seventh straight segment 33. The fourth bend 26 includes a ninth straight segment 35, a tenth straight segment 36, an eleventh straight segment 37, and a twelfth straight segment 38 connected in sequence in a clockwise direction. The ninth straight segment 35 is connected between the eighth straight segment 34 and the tenth straight segment 36. In the embodiment provided herein, to improve the mechanical strength of the second wire 19, the second conductor frame 12 further includes a second connection reinforcement segment, which connects the second wire 19 to the second conductor 18, or connects the second wire 19 to a pin in the packaged device 6. Exemplarily, the second connection reinforcement segment is connected between the twelfth straight segment 38 and the pin of the packaged device 6.

[0053] In the embodiment provided herein, the first bend 23 is galvanically isolated from the third bend 25 and magnetically coupled to the first bend 23 and the third bend 25. The second bend 24 is galvanically isolated from the fourth bend 26 and magnetically coupled to the second bend 24 and the fourth bend 26. The first conductor 14 is generally S-shaped, and the second conductor 19 is generally S-shaped. The second conductor 19 extends along the extension path of the first conductor 14. The first bend 23 of the first conductor 14 and the third bend 25 of the second conductor 19 are magnetically coupled, and the second bend 24 of the first conductor 14 and the fourth bend 26 of the second conductor 19 are magnetically coupled, thereby improving the magnetic coupling performance between the second conductor 19 and the first conductor 14.

[0054] In the embodiment provided herein, at least a portion of the straight segments in the first bend 23 are arranged parallel to at least a portion of the straight segments in the third bend 25, and at least a portion of the straight segments in the second bend 24 are arranged parallel to at least a portion of the straight segments in the fourth bend 26. This can make the overall structure of the lead frame 7 more regular, effectively improving the area utilization of the lead frame 7. It can also improve the magnetic coupling performance between the second wire 19 and the first wire 14. Specifically, in the lead frame 7, the first straight segment 27 is arranged parallel to the sixth straight segment 32, the second straight segment 28 is arranged parallel to the eighth straight segment 34, the ninth straight segment 35 is arranged parallel to the second straight segment 28, the tenth straight segment 36 is arranged parallel to the third straight segment 29, the eleventh straight segment 37 is arranged parallel to the fourth straight segment 30, and the twelfth straight segment 38 is arranged parallel to the fifth straight segment 31, thereby improving the magnetic coupling performance between the second wire 19 and the first wire 14.

[0055] The lead frame 7 disclosed in this application forms a dual-DD magnetic coupling structure. A first conductive frame 11 includes a first conductive wire 14. A first bonding wire 15 connects the end of the first conductive wire 14, distal from the first conductive wire 14, to the transmitter die 9. The first bonding wire 15 spans the region between the two ends of the first conductive wire 14, forming a first conductive loop 16 and a second conductive loop 17 in the first conductive frame 11. When an electrical signal flows through the first conductive frame 11, the magnetic field generated by the first conductive loop 16 is in the opposite direction to the magnetic field generated by the second conductive loop 17. A second conductive frame 12 includes a second conductive wire 19, which is magnetically coupled to the first conductive wire 14. The first conductive wire 14 is S-shaped, and the second conductive wire 19 bends along the trajectory of the first conductive wire 14. The second conductive wire 19 is galvanically isolated from the first conductive wire 14, and the first conductive wire 14 and the second conductive wire 19 are magnetically coupled. The second bonding wire 20 connects the end of the second wire 19 away from the second conductor 18 and the receiver die 10. The second bonding wire 20 spans the area between the two ends of the second wire 19, so that the second conductor frame 12 forms a third conductive loop 21 and a fourth conductive loop 22. Figure 6 , Figure 6This is a comparison chart of the near-field magnetic field strength of the lead frame 7 provided in this application and the conventional packaged device 39. Both the conventional packaged device 39 and the packaged device 6 provided in this application were simulated at a 1KΩ port impedance and a 100MHz signal source frequency. The simulation results use the same scale. The difference between the conventional packaged device 39 and the packaged device 6 in this application is that the conventional packaged device 39 lacks a first conductive loop and a second conductive loop capable of forming opposite magnetic field directions. The simulation results show that the near-field magnetic field strength of the packaged device 6 in this application is higher, the near-field magnetic field strength of the packaged device 6 in this application is more concentrated, and the magnetic field radiation is smaller.

[0056] In the embodiment provided in the present application, the first wire 14 and the second conductor 18 are located on the same side of the first conductor 13 in the width direction of the lead frame 7, the first wire 14 is connected to the first conductor 13, and the second conductor 18 is spaced apart from the first conductor 13; the first wire 14 and the second wire 19 are located on the same side of the second conductor 18 in the width direction of the lead frame 7, the first wire 14 and the second conductor 18 are spaced apart from each other, and the second wire 19 is connected to the second conductor 18. The first wire 14 and the second wire 19 are located on the same side of the first conductor 13, and the first wire 14 and the second bend are located on the same side of the second conductor 18. The first conductor 13 and the second conductor 18 are spaced apart along the length direction of the lead frame 7. Since the first wire 14 and the second wire 19 are both S-shaped, the magnetic coupling structure formed by the first wire 14 and the second wire 19 is more compact, and the magnetic coupling structure formed by the first wire 14 and the second wire 19 occupies a relatively small area of ​​the lead frame 7. In this way, the area ratio of the first conductor 13 occupied by the lead frame 7 can be increased, thereby increasing the area of ​​the first conductor 13 used to place the transmitter bare chip 9, and / or increasing the area ratio of the second conductor 18 occupied by the lead frame 7, thereby increasing the area of ​​the second conductor 18 used to place the receiver bare chip 10.

[0057] For ease of understanding, the length of lead frame 7 is defined as the X-axis, and the width of lead frame 7 is defined as the Y-axis. First conductor 13 and second conductor 18 are spaced apart along the X-axis, with the first conductor 13 having a larger dimension in the Y-axis than the second conductor 18. First wire 14 is connected to first conductor 13, and first wire 14 and second conductor 18 are located on the same side of first conductor 13 in the X-axis of lead frame 7. Second wire 19 is connected to second conductor 18, and second wire 19 and first wire 14 are located on the same side of second conductor 18 in the Y-axis of lead frame 7. This allows for a more concentrated distribution of first wire 14 and second wire 19, reducing the area of ​​lead frame 7 occupied by first wire 14 and second wire 19 in the XY plane, thereby increasing the area of ​​lead frame 7 occupied by first conductor 13 and second conductor 18 in the XY plane.

[0058] In the embodiment provided in the present application, the size of the first conductor frame 11 in the Y-axis direction can be 9.4 mm, the self-inductance value of the first conductor frame 11 can be 7.3nH-8.6nH, the mutual inductance value of the first conductor frame and the second conductor frame 12 can be 0.87nH, and the coupling coefficient of the first conductor frame 11 and the second conductor frame 12 can be 0.11.

[0059] The first, second, third, fourth and various numerical numbers involved in this document are only for the convenience of description and are not intended to limit the scope of this application.

[0060] It should be understood that in the various embodiments of the present application, the size of the serial numbers of the above-mentioned processes does not mean the order of execution. The execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of the present application.

[0061] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A packaged device, characterized in that: include: a first conductor frame, a second conductor frame, a transmitter die, and a receiver die, the first conductor frame being galvanically isolated from the second conductor frame; The first conductor frame includes: a first conductor, a first wire, and a first bonding wire. The first conductor is used to carry the transmitter die and is connected to the output terminal of the transmitter die. One end of the first wire is connected to the first conductor, and the other end of the first wire is connected to the input terminal of the transmitter die through the first bonding wire. The first bonding wire spans a region between two ends of the first wire. The first bonding wire, the first conductor, the transmitter die, and the first wire form an 8-shaped loop. The second conductor frame includes: a second conductor, a second wire, and a second bonding wire. The second conductor is used to support the receiver die and is connected to the output end of the receiver die. The second wire is magnetically coupled to the first wire. One end of the second wire is connected to the second conductor, and the other end of the second wire away from the second conductor is connected to the input end of the receiver die through the second bonding wire. The second bonding wire spans the area between the two ends of the second wire. The second bonding wire, the second conductor, the receiver die, and the second wire form an 8-shaped loop.

2. The packaged device according to claim 1, wherein: The first conductive line includes: a first bend portion and a second bend portion connected to each other, one end of the first bend portion is connected to the first conductor, the other end of the first bend portion is connected to one end of the second bend portion, and the other end of the second bend portion is connected to the transmitter die via the first bonding wire, and the first bonding wire spans the area where the first bend portion and the second bend portion are connected.

3. The packaged device according to claim 2, wherein: The winding direction of the first bending portion from the end connected to the first conductor to the end connected to the second bending portion is a first direction, and the winding direction of the second bending portion from the end connected to the first bending portion to the end connected to the first bonding wire is a second direction, and the first direction is opposite to the second direction.

4. The packaged device according to claim 3, wherein: The first bend portion includes a plurality of straight line segments connected in sequence along a first direction from an end connected to the first conductor to an end connected to the second bend portion, and adjacent straight line segments in the first bend portion form an angle less than 180°; the second bend portion includes a plurality of straight line segments connected in sequence along a second direction from an end connected to the first bend portion to an end connected to the first bonding wire, and adjacent straight line segments in the second bend portion form an angle less than 180°.

5. The packaged device according to any one of claims 1 to 4, wherein: The second conductive line includes: a third bend portion and a fourth bend portion connected to each other, one end of the third bend portion is connected to the second conductor, the other end of the third bend portion is connected to one end of the fourth bend portion, the other end of the fourth bend portion is connected to the second bonding wire, and the second bonding wire spans the area where the third bend portion and the fourth bend portion are connected.

6. The packaged device according to claim 5, wherein: The winding direction of the third bend portion from the end connected to the second conductor to the end connected to the fourth bend portion is a first direction, and the winding direction of the fourth bend portion from the end connected to the third bend portion to the end connected to the second bonding wire is a second direction, and the first direction is opposite to the second direction.

7. The packaged device according to claim 6, wherein: The third bend portion includes a plurality of straight line segments connected in sequence along the first direction from the end connected to the second conductor to the end connected to the fourth bend portion, and adjacent straight line segments in the third bend portion form an angle less than 180°; the fourth bend portion includes a plurality of straight line segments connected in sequence along the second direction from the end connected to the third bend portion to the end connected to the second bonding wire, and adjacent straight line segments in the fourth bend portion form an angle less than 180°.

8. The packaged device according to claim 1, wherein: The first conductive line includes: a first bend portion and a second bend portion connected to each other, one end of the first bend portion is connected to the first conductor, the other end of the first bend portion is connected to one end of the second bend portion, and the other end of the second bend portion is connected to the input terminal of the transmitter die via the first bonding wire, and the first bonding wire crosses the region where the first bend portion and the second bend portion are connected; The second conductive line includes: a third bend portion and a fourth bend portion connected to each other, one end of the third bend portion is connected to the second conductor, the other end of the third bend portion is connected to one end of the fourth bend portion, and the other end of the fourth bend portion is connected to the input terminal of the receiver die via the second bonding wire, and the second bonding wire crosses the area where the third bend portion and the fourth bend portion are connected; The first bending portion is electrically isolated from the third bending portion, and the first bending portion is magnetically coupled to the third bending portion; The second bent portion is electrically isolated from the fourth bent portion, and the second bent portion is magnetically coupled to the fourth bent portion.

9. The packaged device according to claim 8, wherein: At least part of the straight line segments in the first bending portion are parallel to at least part of the straight line segments in the third bending portion, and at least part of the straight line segments in the second bending portion are parallel to at least part of the straight line segments in the fourth bending portion.

10. The packaged device according to claim 1, wherein: The first wire and the second conductor are located on the same side of the first conductor in a width direction of the packaged device, the first wire is connected to the first conductor, and the second conductor is spaced apart from the first conductor; The first wire and the second wire are located on the same side of the second conductor in a width direction of the lead frame, the first wire is spaced apart from the second conductor, and the second wire is connected to the second conductor.

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