Special hydrogen continuous furnace for electronic device gold tin soldering

Abstract

The present application belongs to the technical field of electronic device welding, and particularly relates to a hydrogen continuous furnace special for electronic device gold-tin welding, which comprises a shell, a mesh belt conveying assembly A arranged at the feeding side of the shell, a mesh belt conveying assembly B arranged inside the shell and extending to the discharging side of the shell, and a preheating assembly, wherein the preheating assembly comprises: a casing pipe distributed along the feeding direction; a closure arranged between the conveying section and the upper heating component; and a blocking piece reciprocally moving in the gap A in the up-down direction. The hydrogen continuous furnace special for electronic device gold-tin welding in the technical solution comprises a mesh belt conveying assembly A and a preheating assembly arranged at the feeding side of the furnace body to form a separate preheating area. By adding the separate preheating area, the conveying speed of the mesh belt conveying assembly A can be adjusted according to the preheating time required by different electronic devices to reach the standard preheating temperature. The mesh belt conveying assembly A and the mesh belt conveying assembly B exist independently and are used jointly, and do not conflict with the welding time required when the electronic devices are not welded.

Description

Technical Field

[0001] This invention belongs to the technical field of furnaces for soldering electronic devices, and particularly relates to a hydrogen continuous furnace for soldering gold and tin in electronic devices. Background Technology

[0002] Gold-tin soldering is the process of soldering electronic components together using gold-tin solder. Due to its high reliability, excellent thermal and electrical conductivity, and the fact that it requires no flux, gold-tin solder is widely used in electronic component packaging, especially in applications with extremely high requirements for thermal management and hermeticity, such as optoelectronic devices, high-power semiconductor lasers, and ceramic packaging.

[0003] Furthermore, because gold-tin solder is highly susceptible to oxidation at high temperatures, the presence of the oxide layer hinders atomic diffusion between the solder and the workpiece, reducing solder strength and reliability. To ensure rapid, controllable, and repeatable batch soldering of gold-tin eutectic solder under conditions of no oxidation, no flux, high cleanliness, and high consistency, and to meet the core process requirements of high-reliability electronic packaging, gold-tin soldering of electronic devices is generally performed in a dedicated hydrogen continuous furnace.

[0004] Before welding, electronic components need to be preheated to reduce thermal shock, improve wettability, and enhance weld quality. In existing technology, electronic components are transported to a heating zone within the furnace via a conveyor belt for preheating. This heating zone typically includes preheating, holding, reflow, and cooling, with each zone having independent temperature control. Simultaneously, the welding process is completed during the transport of the electronic components. Since different electronic components require different preheating times, adjusting the conveyor belt speed to meet these preheating needs would affect both welding time and weld quality.

[0005] To address the above issues, a hydrogen continuous furnace specifically designed for gold-tin soldering of electronic devices was developed. Summary of the Invention

[0006] To address the problems in the prior art, the present invention proposes the following technical solution:

[0007] A continuous hydrogen furnace for soldering gold and solder in electronic devices includes a shell, a mesh belt conveyor assembly A disposed on the inlet side of the shell, a mesh belt conveyor assembly B disposed inside the shell and extending to the outlet side of the shell, and a preheating assembly. Both the mesh belt conveyor assembly B and the mesh belt conveyor assembly A have independent power mechanisms. The mesh belt conveyor assembly A includes a mesh belt that is generally rectangular in shape, with a gap A between the upper and lower sides of the mesh belt, and the upper side of the mesh belt is a conveying section. The preheating assembly includes:

[0008] The housing tubes are distributed along the feeding direction, the conveying section passes through the housing tubes, the upper part of the housing tubes is provided with upper heating elements, and the lower end of the housing tubes has an opening;

[0009] A sealing component is provided between the conveying section and the upper heating element. There are two sealing components, which are close to or far apart from each other in the horizontal direction. The ends of the two sealing components that are close to each other are provided with grooves, and the ends that are far apart from each other can be moved through the side wall of the housing tube. When the two sealing components are close to each other to the point of contact, the inside of the housing tube is divided to form cavity A and cavity B, and the grooves on the two sealing components form a complete through hole.

[0010] A sealing element located in gap A and reciprocating in the vertical direction, wherein a lower heating element is provided on the sealing element;

[0011] In this process, the sealing component moves upward to block the opening, while the two sealing components move away from each other simultaneously. Cavity A and Cavity B form a complete preheating cavity, and the upper heating element and the lower heating element work simultaneously to preheat the electronic device as a whole. The sealing component moves downward to form a gap with the opening, while the two sealing components move closer to each other until they touch. The upper heating element works, and the hot air ejected from the through hole preheats the electronic device locally.

[0012] As a preferred embodiment of the above technical solution, the mesh belt conveyor assembly A further includes four drive rollers arranged in a matrix, and the four drive rollers are connected to the same mesh belt.

[0013] As a preferred embodiment of the above technical solution, an air supply pipe is provided through the upper end of the housing tube, and an air supply pump is provided on the air supply pipe. The air supply pump ejects the heat in the cavity A through the gap between the upper heating components as hot air from the through hole.

[0014] As a preferred embodiment of the above technical solution, it also includes a power component that drives the sealing component to move in the vertical direction;

[0015] The power component includes a base plate mounted on the housing, and an electric telescopic rod is provided between the base plate and the sealing component.

[0016] As a preferred embodiment of the above technical solution, the power component further includes pulley groups corresponding to the two sealing components respectively. The pulley group includes pulley one, pulley two and steel cables. Pulley one is located below the sealing component, pulley two is located outside the casing tube, one end of the two steel cables is connected to the sealing component, and the other end passes around the bottom of pulley one and the top of pulley two in sequence before being connected to the two sealing components respectively.

[0017] An electromagnet is provided on a section of the enclosure located outside the housing tube, and an armature is provided on the outer wall of the housing tube corresponding to the electromagnet.

[0018] When the sealing component moves upward, it drives the two sealing components to move away from each other through the pulley system. When the sealing component moves downward, the two sealing components move closer to each other until they come into contact under the magnetic force of the electromagnet and the armature.

[0019] As a preferred embodiment of the above technical solution, a frame is movably fitted onto a section of the closure outside the housing tube. After the frame and the closure are adjusted to an appropriate position, they are fixed by a screw. The electromagnet is located on the frame.

[0020] The pulley is rotatably fitted with a long rod, and the long rod is movably fitted with a long tube. The long tube is installed on the base plate, and the long rod and the long tube are adjusted to an appropriate position and then fixed by a screw.

[0021] As a preferred embodiment of the above technical solution, the housing tube extends outward to form a support plate, and the support plate has two vertically distributed support plates corresponding to a frame, with the frame and support plate slidingly engaged.

[0022] As a preferred embodiment of the above technical solution, the sealing member extends outward to form a positioning plate, and when the sealing member moves upward to the opening, the positioning plate abuts against the lower end of the casing tube.

[0023] As a preferred embodiment of the above technical solution, the upper part of the casing tube is provided with multiple partitions, and upper heating elements with different temperature requirements are provided between two adjacent partitions. The lower heating elements are provided corresponding to the upper heating elements, and the end face of the sealing member is provided with a groove to accommodate the lower heating elements.

[0024] As a preferred embodiment of the above technical solution, the conveying section and the bottom wall of the casing tube are in a sliding support fit.

[0025] The beneficial effects of this invention are as follows:

[0026] 1. This technical solution provides a hydrogen continuous furnace for gold-tin soldering of electronic devices. A separate preheating zone, consisting of a mesh belt conveyor assembly A and a preheating assembly, is set up on the furnace body's feeding side, replacing the original preheating zone in the furnace body's heating section. Before the electronic device enters the soldering position, the mesh belt conveyor assembly A transports the electronic device, completing the preheating operation during transport and reducing thermal shock to the electronic device during gold-tin soldering. This technical solution adds a separate preheating zone, allowing adjustment of the conveying speed of the mesh belt conveyor assembly A according to the preheating time required for different electronic devices to reach the standard preheating temperature. The mesh belt conveyor assembly A and mesh belt conveyor assembly B exist independently but are used in conjunction, without conflicting with the soldering time required for the electronic device soldering.

[0027] 2. The hydrogen continuous furnace for gold-tin soldering of electronic devices in this technical solution has two preheating functions: overall preheating and local preheating. Different preheating methods can be adopted according to whether the electronic device to be soldered needs to be heated evenly or only a specific area needs to be preheated. It is highly targeted and has a good preheating effect. Attached Figure Description

[0028] Figure 1 The diagram shown is a schematic diagram of a hydrogen continuous furnace for soldering gold and tin in electronic devices according to Example 1.

[0029] Figure 2 What is shown is Figure 1 Schematic diagram of a local structure in the middle;

[0030] Figure 3 What is shown is Figure 2 Side view of the middle structure;

[0031] Figure 4 The diagram shown is a structural schematic of the closure component in Embodiment 1;

[0032] Figure 5 The diagram shown is a schematic representation of the external structure of the preheating component in Example 1;

[0033] Figure 6 The diagram shown is a schematic diagram of the preheating component state during the overall preheating of the electronic devices in Example 1;

[0034] Figure 7 The diagram shown is a schematic of the preheating component state during local preheating of electronic devices in Example 1.

[0035] Reference numerals: Casing 100;

[0036] Mesh belt conveyor assembly A200; mesh belt 210; conveyor section 211; drive roller 220;

[0037] Preheating component 300; casing tube 310; opening 311; partition 312; upper heating element 313; air supply duct 314; air supply pump 315; support plate 316; sealing component 320; tank 321; frame 322; electromagnet 323; armature 324; sealing component 330; lower heating element 331; positioning plate 332; base plate 341; electric telescopic rod 342; pulley one 343; pulley two 344; steel cable 345; long pipe 346; long rod 347. Detailed Implementation

[0038] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0039] Example 1

[0040] like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 , Figure 7As shown, a hydrogen continuous furnace for soldering gold and tin in electronic devices includes a shell 100, a mesh belt conveyor assembly A200 disposed on the feeding side of the shell 100, a mesh belt conveyor assembly B disposed inside the shell 100 and extending to the discharging side of the shell 100, and a preheating assembly 300. Both the mesh belt conveyor assembly B and the mesh belt conveyor assembly A200 have independent power mechanisms.

[0041] The mesh belt conveyor assembly A200 includes a mesh belt 210 arranged in a rectangular shape, with a gap A between the upper and lower sides of the mesh belt 210. The upper side of the mesh belt 210 is a conveying section 211. The mesh belt conveyor assembly A200 also includes four drive rollers 220 arranged in a matrix, one of which is equipped with a drive element to rotate. The four drive rollers 220 are connected to the same mesh belt 210, synchronously driving the mesh belt 210 to rotate. The conveying direction of the mesh belt 210 is as follows: Figure 1 , Figure 2 As shown by the arrow in the image.

[0042] Mesh belt conveyor components A200 and B are used to transport electronic components. Mesh belt conveyor component A200 is located on the feeding side of housing 100 and is suitable for transporting electronic components that are preheated before welding. Mesh belt conveyor component B is located inside housing 100 and extends to the discharge side of housing 100, and is suitable for welding operations and post-weld discharge operations. In this technical solution, mesh belt conveyor component A200 is added on the feeding side. Mesh belt conveyor component A200 and mesh belt conveyor component B exist independently and are used together to meet the different preheating requirements of different electronic components without affecting the welding time requirements of the electronic components. The conveying speed of mesh belt conveyor components A200 and B is based on the welding time required. The speed of mesh belt conveyor component A200 can be lower than the speed of mesh belt conveyor component B, and the electronic components can be kept warm in mesh belt conveyor component A200.

[0043] The preheating assembly 300 includes: a housing tube 310 distributed along the feeding direction, a conveying section 211 passing through the housing tube 310, and further, the conveying section 211 and the bottom wall of the housing tube 310 are in sliding support cooperation to support the mesh belt 210 for conveying electronic devices, so as to avoid the electronic devices from sinking on the mesh belt due to the influence of factors such as the length of the mesh belt and the weight of the electronic devices during the conveying of electronic devices, which would affect the positional accuracy of the electronic devices and further affect the welding effect when the electronic devices are welded. The upper part of the housing tube 310 is provided with an upper heating element 313, and the lower end of the housing tube 310 has an opening 311.

[0044] A sealing member 320 is provided between the conveying section 211 and the upper heating element 313. There are two sealing members 320, which are close to each other or far apart in the horizontal direction. The ends of the two sealing members 320 that are close to each other are provided with grooves 321, and the ends that are far apart from each other can be moved through the side wall of the housing tube 310. When the two sealing members 320 are close to each other until they touch, the inside of the housing tube 310 is divided to form cavity A and cavity B, and the grooves 321 on the two sealing members 320 form a complete through hole.

[0045] A sealing element 330 is located in gap A and moves back and forth in the vertical direction. A lower heating element 331 is provided on the sealing element 330.

[0046] The mesh belt conveyor assembly A200 transports electronic devices, and during the transport process, the preheating assembly 300 preheats the electronic devices. Specifically, the sealing component 330 moves upward to seal the opening 311, while simultaneously the two sealing components 320 move away from each other, forming a complete preheating chamber with cavities A and B. The upper heating element 313 and the lower heating element 331 work simultaneously to preheat the electronic devices as a whole. The sealing component 330 moves downward until there is a gap between it and the opening 311, while simultaneously the two sealing components 320 move closer together until they touch. The upper heating element 313 then operates, and hot air ejected from the through-hole preheats the electronic devices locally.

[0047] This technical solution provides a hydrogen continuous furnace for gold-tin soldering of electronic devices. A separate preheating zone, consisting of a mesh belt conveyor assembly A200 and a preheating assembly 300, is set up on the furnace body's feeding side, replacing the original preheating zone in the furnace body's heating section. Before the electronic device enters the soldering position, the mesh belt conveyor assembly A200 transports the electronic device, completing the preheating operation during transport and reducing thermal shock to the electronic device during gold-tin soldering. This technical solution adds a separate preheating zone, allowing adjustment of the conveying speed of the mesh belt conveyor assembly A200 according to the preheating time required for different electronic devices to reach the standard preheating temperature. The mesh belt conveyor assembly A200 and the mesh belt conveyor assembly 300 exist independently but are used in conjunction, without conflicting with the soldering time required for the electronic device soldering.

[0048] This technical solution presents a hydrogen continuous furnace specifically designed for gold-tin soldering of electronic devices. It features both overall preheating and localized preheating functions, allowing for different preheating methods depending on whether the electronic device to be soldered requires uniform heating or only preheating of a specific area. This targeted approach ensures excellent preheating results. For example, Figure 6As shown, when the electronic device needs to be preheated as a whole, the sealing component 330 moves upward to the sealing opening 311, and at the same time, the two sealing components 320 move away synchronously. Cavity A and cavity B form a complete preheating cavity. The electronic device is located in the preheating cavity. The upper heating element 313 and the lower heating element 331 work synchronously to preheat the electronic device as a whole, and the preheating is uniform.

[0049] like Figure 7 As shown, when a local preheating operation is required for electronic devices, the sealing member 330 moves downward to form a gap with the opening 311. At the same time, the two sealing members 320 move closer to each other until they touch. The upper heating element 313 operates, and the hot gas ejected from the through hole preheats the electronic device locally. The operation of preheating a specific area with hot gas ejected from the through hole adopts centralized fixed-point preheating to reduce the heating of unnecessary areas of the electronic device. At the same time, the operation of the sealing member 330 moving downward to form a gap with the opening 311 allows the hot gas ejected from the through hole to be discharged from below, without affecting adjacent preheating areas, thus ensuring gas flow.

[0050] When performing localized preheating of electronic devices, to ensure the preheating effect by considering factors such as the intensity of hot gas ejected from the through-holes, the preheating component 300 is further optimized, such as... Figure 3 As shown, an air supply pipe 314 is installed through the upper end of the housing tube 310. An air supply pump 315 is installed on the air supply pipe 314. The air supply pump 315 ejects heat from the cavity A as hot air through the gaps between the upper heating elements 313 and through the through holes. When local preheating is required, the air supply pump 315 is started, and the air is heated through the gaps between the upper heating elements 313 and then ejected through the through holes to the location of the electronic components that need preheating.

[0051] In this technical solution, the two closure components 320 move closer or further apart in the horizontal direction, while the sealing component 330 moves back and forth in the vertical direction. Therefore, the preheating assembly 300 is further constrained. Specifically, to accommodate the movement path of the sealing component 330, such as… Figure 2 , Figure 3 As shown, the preheating component 300 also includes a power component that drives the sealing component 330 to move in the vertical direction;

[0052] The power component includes a base plate 341 mounted on the housing 100, and an electric telescopic rod 342 is provided between the base plate 341 and the sealing member 330. By changing the overall length of the electric telescopic rod 342, the sealing member 330 is moved in the vertical direction. More specifically, the overall length of the electric telescopic rod 342 shortens, causing the sealing member 330 to move downward, and the overall length of the electric telescopic rod 342 extends, causing the sealing member 330 to move upward.

[0053] To meet the requirements of the movement path setting for the enclosure 320, such as Figure 3 As shown, the power component also includes pulley sets corresponding to the two enclosures 320. The pulley sets include pulley one 343, pulley two 344, and steel cables 345. Pulley one 343 is located below the sealing member 330, and pulley two 344 is located outside the housing tube 310. One end of the two steel cables 345 is connected to the sealing member 330, and the other end passes under pulley one 343 and above pulley two 344 in sequence before being connected to the two enclosures 320 respectively. An electromagnet 323 is provided on a section of the enclosure 320 outside the housing tube 310, and an armature 324 is provided on the outer wall of the housing tube 310 corresponding to the electromagnet 323.

[0054] When the blocking component 330 moves upward, it drives the two sealing components 320 to move away from each other via a pulley system. When the blocking component 330 moves downward, the two sealing components 320 move closer to each other until they come into contact under the magnetic force of the electromagnet 323 and the armature 324. This satisfies the setting of the movement path of the sealing component 320. At the same time, it adapts to the setting requirements that when the blocking component 330 moves upward, the two sealing components 320 move away from each other, and when the blocking component 330 moves downward, the two sealing components 320 move closer to each other until they come into contact. This ensures the synchronicity of the movement of the sealing component 320 and the blocking component 330. In addition, only one power source is needed, reducing the operating cost of the device.

[0055] Different electronic components have different soldering positions, and for electronic components that use local preheating operations, the required preheating position also varies. Therefore, this technical solution is further optimized to meet the different preheating position requirements of various electronic components, such as... Figure 3 As shown, a frame 322 is movably fitted onto a section of the closure 320 outside the housing tube 310. After the frame 322 and the closure 320 are adjusted to an appropriate position, they are fixed by screws. An electromagnet 323 is located on the frame 322. The specific adjustment method between the frame 322 and the closure 320 is that the two frames 322 move synchronously to the right or synchronously to the left on the closure 320, and their moving distance is consistent, so as to ensure that the two closures 320 can reach a contact state when they approach each other. The grooves 321 on the two closures 320 can form a complete through hole. The core is that the position of the through hole changes according to the different preheating positions.

[0056] At the same time, the effective working length of the steel cable 345 also needs to be adjusted. The pulley 343 is rotatably fitted with a long rod 347, and the long rod 347 is movably fitted with a long tube 346. The long tube 346 is installed on the base plate 341. After the long rod 347 and the long tube 346 are adjusted to the appropriate position, they are fixed by screw 2. By changing the overall length of the long rod 347 and the long tube 346, the height position of the pulley 343 is changed, thereby achieving the purpose of changing the effective working length of the steel cable 345.

[0057] In this technical solution, by adjusting the position of the through hole for implementing the preheating function, the preheating operation can be performed according to the required preheating position when the electronic device is preheating locally, thus meeting the preheating requirements of different positions of the electronic device; at the same time, the enclosure 320 uses electromagnet 323 and armature 324 to achieve the reset setting, which is not affected by the length of the reset component such as spring, thus meeting the position adjustment requirements of the enclosure 320.

[0058] like Figure 3 , Figure 5 As shown, the housing tube 310 extends outward to form a support plate 316. The support plate 316 is assembled with the housing 100 to fix the position of the housing tube 310. Two support plates 316 are respectively provided in the vertical direction for each frame 322. A steel cable 345 movably passes through the lower support plate 316. The frame 322 and the support plate 316 slide together to support the closure member 320, keeping the closure member 320 in a horizontal state. This further limits the movement path of the closure member 320, preventing positional deviations, and simultaneously reducing the stress between the closure member 320 and the housing tube 310, ensuring smooth movement.

[0059] like Figure 3 , Figure 5 As shown, the sealing component 330 extends outward to form a positioning plate 332. When the sealing component 330 moves upward to the opening 311, the positioning plate 332 abuts against the lower end of the housing tube 310 to prevent the sealing component 330 from moving too much and causing it to abut against the mesh belt 210, thus affecting the transmission operation. At the same time, the outwardly extending positioning plate 332 is connected to the steel cable 345, reducing the required length of the steel cable 345 and further ensuring the stability of use.

[0060] like Figure 2 As shown, the upper part of the housing tube 310 is provided with multiple partitions 312, and upper heating elements 313 with different temperature requirements are provided between two adjacent partitions 312. More specifically, the temperature standard increases sequentially from the feeding side to the discharging side. The specific temperature standard in this embodiment is set according to the preheating temperature required by different electronic devices. The lower heating element 331 is provided corresponding to the upper heating element 313, and the end face of the sealing member 330 is provided with a groove to accommodate the lower heating element 331.

[0061] The housing tube 310 adopts a multi-stage preheating setting to gradually heat up the electronic components, reduce thermal shock, avoid local overheating or cold spots, ensure uniform heating of electronic components, and improve product quality. The partition 312 separates the upper heating components 313 with different temperature requirements, and the groove separates the lower heating components 331 with different temperature requirements, thus separating the different preheating sections and reducing the mutual influence between different preheating sections.

[0062] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it.

Claims

1. A continuous hydrogen furnace for soldering gold and solder in electronic devices, comprising a shell, a mesh belt conveyor assembly A disposed on the feeding side of the shell, a mesh belt conveyor assembly B disposed inside the shell and extending to the discharging side of the shell, and a preheating assembly, characterized in that, Both the mesh belt conveyor assembly B and the mesh belt conveyor assembly A have independent power mechanisms. The mesh belt conveyor assembly A includes a mesh belt that is generally rectangular in shape, with a gap A between the upper and lower sides of the mesh belt, and the upper side of the mesh belt is the conveying section. The preheating assembly includes: The housing tubes are distributed along the feeding direction, the conveying section passes through the housing tubes, the upper part of the housing tubes is provided with upper heating elements, and the lower end of the housing tubes has an opening; A sealing component is provided between the conveying section and the upper heating element. There are two sealing components, which are close to or far apart from each other in the horizontal direction. The ends of the two sealing components that are close to each other are provided with grooves, and the ends that are far apart from each other can be moved through the side wall of the housing tube. When the two sealing components are close to each other to the point of contact, the inside of the housing tube is divided to form cavity A and cavity B, and the grooves on the two sealing components form a complete through hole. A sealing element located in gap A and reciprocating in the vertical direction, wherein a lower heating element is provided on the sealing element; In this process, the sealing component moves upward to block the opening, while the two sealing components move away from each other simultaneously. Cavity A and Cavity B form a complete preheating cavity, and the upper heating element and the lower heating element work simultaneously to preheat the electronic device as a whole. The sealing component moves downward to form a gap with the opening, while the two sealing components move closer to each other until they touch. The upper heating element works, and the hot air ejected from the through hole preheats the electronic device locally.

2. The hydrogen continuous furnace for gold-tin soldering of electronic devices according to claim 1, characterized in that, The mesh belt conveyor assembly A also includes four drive rollers arranged in a matrix, and the four drive rollers are connected to the same mesh belt.

3. The hydrogen continuous furnace for gold-tin soldering of electronic devices according to claim 1, characterized in that, An air supply pipe is provided through the upper end of the housing tube, and an air supply pump is provided on the air supply pipe. The air supply pump sprays the heat in the cavity A out through the through hole as hot air through the gap between the upper heating components.

4. The hydrogen continuous furnace for gold-tin soldering of electronic devices according to claim 1, characterized in that, It also includes a power component that drives the sealing component to move in the vertical direction; The power component includes a base plate mounted on the housing, and an electric telescopic rod is provided between the base plate and the sealing component.

5. A continuous hydrogen furnace for gold-tin soldering of electronic devices according to claim 4, characterized in that, The power component also includes pulley sets corresponding to the two sealing components. The pulley sets include pulley one, pulley two, and steel cables. Pulley one is located below the sealing component, and pulley two is located outside the housing tube. One end of the two steel cables is connected to the sealing component, and the other end passes around the bottom of pulley one and the top of pulley two in sequence before being connected to the two sealing components respectively. An electromagnet is provided on a section of the enclosure located outside the housing tube, and an armature is provided on the outer wall of the housing tube corresponding to the electromagnet. When the sealing component moves upward, it drives the two sealing components to move away from each other through the pulley system. When the sealing component moves downward, the two sealing components move closer to each other until they come into contact under the magnetic force of the electromagnet and the armature.

6. A continuous hydrogen furnace for gold-tin soldering of electronic devices according to claim 5, characterized in that, The closure is movably fitted with a frame on a section outside the housing tube. After the frame and the closure are adjusted to an appropriate position, they are fixed with screws. The electromagnet is located on the frame. The pulley is rotatably fitted with a long rod, and the long rod is movably fitted with a long tube. The long tube is installed on the base plate, and the long rod and the long tube are adjusted to an appropriate position and then fixed by a screw.

7. A continuous hydrogen furnace for gold-tin soldering of electronic devices according to claim 6, characterized in that, The casing tube extends outward to form a support plate. The support plate has two vertically distributed support plates corresponding to a frame. The frame and the support plate are slidably fitted together.

8. A continuous hydrogen furnace for gold-tin soldering of electronic devices according to claim 5, characterized in that, The sealing element extends outward to form a positioning plate. When the sealing element moves upward to the opening, the positioning plate abuts against the lower end of the housing tube.

9. A continuous hydrogen furnace for gold-tin soldering of electronic devices according to claim 1, characterized in that, The upper part of the casing tube is provided with multiple partitions, and upper heating elements with different temperature requirements are arranged between two adjacent partitions. The lower heating elements are arranged corresponding to the upper heating elements, and the end face of the sealing member is provided with a groove to accommodate the lower heating elements.

10. A continuous hydrogen furnace for gold-tin soldering of electronic devices according to claim 1, characterized in that, The conveying section is in sliding support with the bottom wall of the casing tube.

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