Flatness detection device of semiconductor ceramic heating plate and detection method thereof
By simulating the close fit between the semiconductor and the ceramic heating plate and monitoring temperature changes in real time, the problem of existing detection devices ignoring the influence of the contact state is solved, and accurate detection of the flatness of the ceramic heating plate is achieved, thereby improving the accuracy and effectiveness of the detection.
Patent Information
- Application Number
- CN202511212957.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-08-28
- Publication Date
- 2025-09-30
- Estimated Expiration
- 2045-08-28
AI Technical Summary
The existing ceramic heating plate flatness detection device ignores the deformation effect of the semiconductor and the ceramic heating plate in the contact state under a simulated high-temperature environment, resulting in inaccurate detection results.
A flatness detection device for a semiconductor ceramic heating plate was designed. The device included a lifting and docking device, a rotating adjustment shaft, a fitting simulation board, a mobile detection device, a mobile adjustment platform, a self-cleaning detection barrel, a limit fixing device, and a connecting seat. The device simulated the close fitting state between the semiconductor and the ceramic heating plate, monitored the temperature changes in real time, and performed preliminary and simulation tests.
The accuracy and effectiveness of the test results are improved, and the flatness changes of the ceramic heating plate under actual use conditions can be comprehensively and accurately evaluated, which enhances the flexibility and practicality of the test and ensures the cleanliness and stability of the test environment.
Smart Images

Figure CN120721040A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of semiconductor processing equipment, and in particular to a flatness detection device and a detection method for a semiconductor ceramic heating plate. Background Art
[0002] Ceramic heating plates are heating elements made of ceramic material, offering excellent high-temperature resistance, corrosion resistance, and insulation properties. In semiconductor manufacturing, ceramic heating plates are often used to heat wafers in the reaction chamber. When the temperature within the reaction chamber fluctuates, the ceramic heating plates themselves are susceptible to deformation. Conventional methods for measuring the deformation of ceramic heating plates can only measure the deformation state of the plate at room temperature. However, deformation detection of ceramic heating plates at high temperatures is more practical and instructive in semiconductor processing.
[0003] Chinese patent CN118565422A discloses a deformation detection device and method for a wafer tray, as well as a semiconductor processing device. The deformation detection device includes: a first slide, which is arranged above the wafer tray; a second slide, which is arranged on the first slide and rotates circumferentially along the wafer tray on the first slide; and a detection probe, which is arranged on the second slide and rotates circumferentially with the second slide. The detection probe translates radially along the wafer tray on the second slide to determine the height of multiple positions on the surface of the wafer tray to indicate the deformation of the surface of the wafer tray. Through the above-mentioned deformation detection device for the wafer tray, the flatness of the wafer tray can be quickly detected in environments with different temperatures, especially in high temperature environments, which not only improves the detection efficiency but also can obtain accurate detection results.
[0004] The above-mentioned device can detect the flatness of the ceramic heating plate in a high-temperature environment. This function meets the basic detection needs to a certain extent. However, in actual applications, the working state of the ceramic heating plate is far more complicated than a simple high-temperature environment. In particular, when the ceramic heating plate is put into use, its top will fit tightly with the semiconductor to form a heat conduction interface. This fitting state not only involves temperature conduction, but also may cause the ceramic heating plate to produce additional deformation under the action of force or thermal stress due to the physical contact between the semiconductor and the ceramic heating plate, thereby affecting its flatness. During the simulation test process, the existing detection device often ignores the impact of the contact between the semiconductor and the ceramic heating plate, resulting in certain limitations in the test results. Since the contact state between the semiconductor and the ceramic heating plate is not included in the detection scope, the existing detection device cannot comprehensively and accurately evaluate the flatness of the ceramic heating plate under actual use conditions. The test results under this single simulation environment may not truly reflect the performance of the ceramic heating plate in a real working scenario, thereby reducing the accuracy and effectiveness of the test. Summary of the Invention
[0005] In order to solve the above problems, a device and method for detecting the flatness of a semiconductor ceramic heating plate are provided, which effectively improve the accuracy and effectiveness of the detection results by simulating the detection device.
[0006] In order to solve the problems of the prior art, the present invention provides a flatness detection device for a semiconductor ceramic heating plate, comprising a simulation detection device installed on a workbench, the simulation detection device comprising a lifting and docking device, a rotating adjustment shaft, a bonding simulation plate, a moving detection device, a moving adjustment platform, a self-cleaning detection barrel, a limiting fixing device and a connecting seat; the lifting and docking device is installed above the workbench, and the working end of the lifting and docking device extends vertically downward; the rotating adjustment shaft is installed at the axis center position of the lifting and docking device; the bonding simulation plate is installed at the bottom of the rotating adjustment shaft, and a temperature sensor is provided inside the bonding simulation plate; the moving detection device is installed on the rotating adjustment shaft, and the detection end of the moving detection device is set vertically downward; the moving adjustment platform is set below the bonding simulation plate, and the moving end of the moving adjustment platform slides horizontally; the self-cleaning detection barrel is installed on the moving adjustment platform; the limiting fixing device is installed inside the self-cleaning detection barrel, and the top of the limiting fixing device is used to support the ceramic heating plate to be detected, and the limiting fixing device is slidably connected to the self-cleaning detection barrel; the connecting seat is installed below the moving adjustment platform, and the connecting seat is used to connect the heating element of the ceramic heating plate.
[0007] Preferably, the lifting and docking device includes a fixed mounting frame installed on the workbench, a first linear drive is installed on the fixed mounting frame, and a docking abutment frame is installed at the output end of the first linear drive.
[0008] Preferably, a first limiting slide rail is provided at the axis position of the rotary adjustment shaft, and the first limiting slide rail is used for slidingly installing the mobile detection device. A plurality of limiting installation grooves are provided on the outer side of the rotary adjustment shaft, and a rotating slip ring is installed on the limiting installation groove. The rotating slip ring is slidingly connected to the limiting installation groove, and the rotating slip ring is rotatably connected to the docking interference frame. A second linear drive is installed above the rotary adjustment shaft, and the second linear drive is fixedly connected to the docking interference frame. The output end of the second linear drive is rotatably connected to the rotary adjustment shaft, and the rotary adjustment shaft also includes a first rotary drive device that drives the rotating slip ring to rotate.
[0009] Preferably, a simulated bonding surface is provided at the bottom of the bonding simulation plate, a detection port is provided on the bonding simulation plate, a rotating shielding plate is installed inside the detection port, the rotating shielding plate is rotatably connected to the bonding simulation plate, an elastic retaining spring is installed between the rotating shielding plate and the bonding simulation plate, and the bonding simulation plate also includes a trigger push rod installed on the mobile detection device.
[0010] Preferably, the mobile detection device includes a third linear drive installed inside the first limit slide rail, and the mobile detection device also includes a first ball screw slide installed inside the first limit slide rail. The first ball screw slide is slidingly connected to the first limit slide rail, and the first ball screw slide is connected to the output end of the third linear drive. The plane detector is installed at the movable end of the first ball screw slide, and the plane detector is used to detect the flatness of the ceramic heating plate.
[0011] Preferably, the movable adjustment platform includes a guide adjustment frame installed on the workbench, the guide adjustment frame is used to guide the movement of the limiting fixing device, the guide adjustment frame is installed with a second ball screw slide, and the movable end of the second ball screw slide is installed with an annular mounting frame.
[0012] Preferably, the self-cleaning detection barrel is fixedly connected to the annular mounting frame, and a plurality of arc-shaped air blowing pipes are provided inside the self-cleaning detection barrel, and the arc-shaped air blowing pipes are covered with air outlet holes. A suction port is provided on the side of the self-cleaning detection barrel, and a second limiting slide rail is also provided on the outside of the self-cleaning detection barrel. The self-cleaning detection barrel also includes a vacuum cleaner connected to the suction port.
[0013] Preferably, the limiting and fixing device includes a lifting push plate slidably mounted on a third limiting slide rail, guide wheels are installed on both sides of the lifting push plate, the guide wheels are in contact with the guide adjustment frame, a plurality of limiting suction cups and a plurality of third limiting slide rails are provided on the top of the lifting push plate, a synchronous adjustment disk is installed at the bottom of the lifting push plate, a plurality of inclined slide rails are installed on the synchronous adjustment disk, and movable adjustment blocks are installed inside the plurality of third limiting slide rails, a clamping shaft is provided at the top of the movable adjustment block, a sliding shaft is installed at the bottom of the movable adjustment block, and the sliding shaft is slidably connected to the inclined slide rail, and the limiting and fixing device also includes a second rotation drive device that drives the synchronous adjustment disk to rotate.
[0014] Preferably, the connecting seat is arranged below the limiting fixing device, the connecting seat is provided with an electrical connection port, the top of the connecting seat is provided with an inclined blocking plate, and the inclined blocking plate is provided with blocking teeth.
[0015] A method for detecting the flatness of a semiconductor ceramic heating plate comprises the following steps: S1. Move the adjustment table to move the semiconductor ceramic heating plate to be tested directly below the bonding simulation board to ensure the relative position is accurate; S2. Start the lifting and docking device to drive the rotating adjustment shaft, the fitting simulation board and the mobile detection device to descend synchronously to prepare for preliminary testing.
[0016] S3. The mobile detection device cooperates with the rotating adjustment shaft to perform preliminary detection. If it fails, the detection is stopped; if it passes, the test is continued.
[0017] S4. After the preliminary test is passed, the mobile test device is reset, and the rotating adjustment shaft drives the bonding simulation plate to descend and bond to the ceramic heating plate.
[0018] S5. The connector transmits electrical energy to start the heating simulation of the ceramic heating plate. The temperature sensor on the simulation board monitors the temperature change in real time until it reaches the specified detection temperature.
[0019] S6. After heating to the specified temperature, the adjustment shaft is rotated to drive the bonding simulation plate to rise and separate from the ceramic heating plate. The mobile detection device is tested again, and the two data are compared to analyze the change in the flatness of the ceramic heating plate to determine whether it is qualified.
[0020] Compared with the prior art, the present invention has the following beneficial effects: 1. Through the combined design of a lifting docking device, a rotary adjustment shaft, and a bonding simulation plate, this invention accurately simulates the tight fit between a semiconductor and a ceramic heating plate in actual operation. A temperature sensor installed within the bonding simulation plate monitors temperature changes at the bonding interface in real time, accurately reflecting the deformation of the ceramic heating plate under the effects of heat and force. This design effectively overcomes the limitation of existing detection devices that ignore the effects of contact between the semiconductor and the ceramic heating plate, thereby improving the accuracy and effectiveness of the test results.
[0021] 2. The present invention adopts a multifunctional integrated design, which includes two stages: preliminary detection and simulation detection. The preliminary detection stage can quickly screen out unqualified ceramic heating plates, avoiding unnecessary subsequent detection steps. The simulation detection stage can simulate the heating process under actual working conditions, and accurately judge the deformation of the ceramic heating plate by comparing the flatness data before and after heating. This multifunctional integrated design not only enhances the flexibility of detection, but also improves the comprehensiveness and accuracy of the test results. At the same time, the design of the connecting seat enables the device to be easily connected to the heating element of the ceramic heating plate to perform heating simulation work, further improving the practicality and applicability of the detection.
[0022] 3. This invention integrates a lifting and docking device, a rotating adjustment shaft, a fitting simulation board, a mobile testing device, a mobile adjustment platform, a self-cleaning testing bucket, a position-limiting fixture, and a connecting base, achieving automated control of the testing process. This allows for comprehensive testing of various positions on the ceramic heating plate. The automatic dust removal function of the self-cleaning testing bucket ensures a clean and stable testing environment, preventing impurities from affecting test results. This automated testing process not only improves testing efficiency but also ensures the stability and reliability of test results. BRIEF DESCRIPTION OF THE DRAWINGS
[0023] Figure 1 It is a schematic perspective view of a device for detecting the flatness of a semiconductor ceramic heating plate according to the present invention.
[0024] Figure 2 It is a front view of a flatness detection device for a semiconductor ceramic heating plate of the present invention.
[0025] Figure 3 yes Figure 2 Plane sectional view at section AA.
[0026] Figure 4 It is a front view of a partial structure of a flatness detection device for a semiconductor ceramic heating plate of the present invention.
[0027] Figure 5 yes Figure 4 Plane sectional view at section BB.
[0028] Figure 6 It is a schematic three-dimensional diagram of a laminating simulation board in a flatness detection device for a semiconductor ceramic heating plate of the present invention.
[0029] Figure 7 This is a three-dimensional schematic diagram of part of the structure of a flatness detection device for a semiconductor ceramic heating plate of the present invention. Figure 1 .
[0030] Figure 8 yes Figure 7 A partial enlarged view of point C in the middle.
[0031] Figure 9 This is a three-dimensional schematic diagram of part of the structure of a flatness detection device for a semiconductor ceramic heating plate of the present invention. Figure 2 .
[0032] Figure 10 yes Figure 9 A partial enlarged view of point D in the middle.
[0033] Figure 11 The present invention is a schematic perspective view of a connecting seat in a device for detecting the flatness of a semiconductor ceramic heating plate.
[0034] The numbers in the figure are: 1. Workbench; 11. Ceramic heating plate; 2. Lifting docking device; 21. Fixed mounting bracket; 22. First linear actuator; 23. Docking and abutting bracket; 3. Rotating adjustment shaft; 31. First limit slide rail; 32. Limit mounting slot; 33. First rotary drive device; 34. Second linear actuator; 35. Rotating slip ring; 4. Fitting simulation board; 41. Detection port; 42. Rotating shielding plate; 43. Elastic retaining spring; 44. Triggering ejector; 5. Mobile detection device; 51. Third linear actuator; 52. First ball screw slide; 53. Plane detector; 6. Mobile adjustment table; 61. Second ball screw slide; 6 2. Annular mounting frame; 63. Guide adjustment frame; 631. Detection plane; 632. Unloading plane; 633. Guide slope; 7. Self-cleaning detection barrel; 71. Arc-shaped air blow pipe; 72. Suction port; 73. Vacuum cleaner; 74. Second limit slide rail; 8. Limit fixing device; 81. Lifting push plate; 811. Guide wheel; 812. Limit suction cup; 813. Third limit slide rail; 82. Synchronous adjustment disk; 83. Inclined slide rail; 84. Movable adjustment block; 841. Clamping shaft; 842. Sliding shaft; 85. Second rotary drive device; 9. Connecting seat; 91. Inclined blocking plate; 92. Blocking teeth; 93. Electrical connection port. DETAILED DESCRIPTION
[0035] In order to further understand the features, technical means, specific objectives and functions achieved by the present invention, the present invention is further described in detail below with reference to the accompanying drawings and specific embodiments.
[0036] See also Figures 1 to 11 As shown, a flatness detection device for a semiconductor ceramic heating plate includes a simulation detection device installed on a workbench 1, the simulation detection device includes a lifting and docking device 2, a rotation adjustment shaft 3, a bonding simulation plate 4, a moving detection device 5, a moving adjustment platform 6, a self-cleaning detection barrel 7, a limit fixing device 8 and a connecting seat 9; the lifting and docking device 2 is installed above the workbench 1, and the working end of the lifting and docking device 2 extends vertically downward; the rotation adjustment shaft 3 is installed at the axis center position of the lifting and docking device 2; the bonding simulation plate 4 is installed at the bottom of the rotation adjustment shaft 3, and the bonding simulation plate 4 is provided with a temperature sensor inside. sensor; the mobile detection device 5 is installed on the rotating adjustment shaft 3, and the detection end of the mobile detection device 5 is set vertically downward; the mobile adjustment platform 6 is set below the fitting simulation board 4, and the mobile end of the mobile adjustment platform 6 slides horizontally; the self-cleaning detection barrel 7 is installed on the mobile adjustment platform 6; the limiting fixing device 8 is installed inside the self-cleaning detection barrel 7, and the top of the limiting fixing device 8 is used to support the ceramic heating plate 11 to be detected, and the limiting fixing device 8 is slidably connected to the self-cleaning detection barrel 7; the connecting seat 9 is installed below the mobile adjustment platform 6, and the connecting seat 9 is used to connect the heating element of the ceramic heating plate 11.
[0037] The lifting and docking device 2 is located above the workbench 1, and its working end extends vertically downward, which is used to drive the rotating adjustment shaft 3, the bonding simulation plate 4 and the mobile detection device 5 to rise and fall synchronously. By precisely controlling the lifting height, accurate docking with the ceramic heating plate 11 is achieved. The rotating adjustment shaft 3 is installed at the axial position of the lifting and docking device 2, which is used to drive the bonding simulation plate 4 and the mobile detection device 5 to rotate and adjust the displacement. Through rotation adjustment, the mobile detection device 5 can be moved to different detection positions to perform a comprehensive inspection of the ceramic heating plate 11. The bonding simulation plate 4 is installed at the bottom of the rotating adjustment shaft 3, and a temperature sensor is provided inside to simulate the tight fitting state between the semiconductor and the ceramic heating plate 11, and to monitor the temperature changes of the bonding interface in real time. Through the bonding simulation plate 4, the force and thermal stress exerted on the ceramic heating plate 11 under actual working conditions can be simulated, thereby detecting changes in its flatness. The mobile detection device 5 is installed on the rotating adjustment shaft 3, and the detection end is set vertically downward to detect the flatness of the ceramic heating plate 11. The mobile detection device 5 can move to different detection positions as the rotary adjustment shaft 3 rotates, so as to perform comprehensive and accurate measurement on the ceramic heating plate 11 .
[0038] The movable adjustment platform 6 is arranged below the fitting simulation board 4, and the movable end of the movable adjustment platform 6 slides horizontally to carry and move the self-cleaning detection barrel 7 and the limiting fixture 8. Through the precise control of the movable adjustment platform 6, the ceramic heating plate 11 can be quickly positioned and moved. The self-cleaning detection barrel 7 is installed on the movable adjustment platform 6 and has an automatic dust cleaning function to ensure the cleanliness and stability of the detection environment. Through the automatic cleaning function, the influence of dust and other impurities on the detection results can be effectively avoided. The limiting fixture 8 is installed inside the self-cleaning detection barrel 7, and the top is used to support the ceramic heating plate 11 to be tested and to position and fix it. The limiting fixture 8 can ensure the stability and accuracy of the ceramic heating plate 11 during the detection process. The connecting seat 9 is installed below the movable adjustment platform 6 and is used to connect the heating element of the ceramic heating plate 11. Through the connecting seat 9, electric energy can be supplied to the ceramic heating plate 11 to perform heating simulation work.
[0039] The testing process is divided into two stages: preliminary testing and simulation testing: Initial Test: The movable adjustment platform 6 moves the ceramic heating plate 11 to the position directly below the lamination simulation plate 4. The lifting and docking device 2 lowers the rotary adjustment shaft 3, the lamination simulation plate 4, and the movable detection device 5. The movable detection device 5 cooperates with the rotary adjustment shaft 3 to perform a preliminary flatness test on the ceramic heating plate 11. If the initial test fails, no further testing is required. If the initial test passes, a simulated test is performed.
[0040] Simulation test: After the preliminary test is qualified, the mobile detection device 5 is reset and separated from the test area, and the rotary adjustment shaft 3 drives the fitting simulation plate 4 to descend and fit the top of the ceramic heating plate 11. The connecting seat 9 transmits electrical energy to the ceramic heating plate 11 to simulate heating, and the temperature sensor monitors the temperature changes in real time. When the ceramic heating plate 11 is heated to the specified detection temperature, the rotary adjustment shaft 3 drives the fitting simulation plate 4 to rise and separate from the ceramic heating plate 11, and the mobile detection device 5 cooperates with the rotary adjustment shaft 3 to move to the detection position for a second test. By comparing the first and second test data, it can be determined whether the ceramic heating plate 11 is deformed after heating. After the test is completed, the staff separates the heating element from the connecting seat 9, resets the various components, and moves the adjustment platform 6 to drive the ceramic heating plate 11 to the placement position so that the ceramic heating plate 11 to be tested can be replaced for the next test. The simulation test device can achieve a comprehensive and accurate test of the flatness of the ceramic heating plate 11 under high temperature and stress conditions, effectively improving the accuracy and effectiveness of the test.
[0041] See also Figures 2 to 5 As shown, the lifting docking device 2 includes a fixed mounting frame 21 mounted on the workbench 1 , a first linear drive 22 is mounted on the fixed mounting frame 21 , and a docking abutment frame 23 is mounted on the output end of the first linear drive 22 .
[0042] A first linear drive 22 is mounted on the fixed mounting frame 21. The output end of the first linear drive 22 is connected to the docking and abutment frame 23. When the movable adjustment platform 6 has accurately moved the ceramic heating plate 11 to be tested to the position directly below the fitting simulation plate 4, the fitting simulation plate 4, the rotating adjustment shaft 3 and the mobile detection device 5 need to be pressed down during the test. When docking with the ceramic heating plate 11, the first linear drive 22 starts and drives the docking and abutment frame 23 to move linearly vertically downward. The downward pressure of the docking and abutment frame 23 will simultaneously drive the rotating adjustment shaft 3, the fitting simulation plate 4 and the mobile detection device 5 to move downward as a whole. In this process, the docking and abutment frame 23 not only provides the necessary driving force, but also ensures precise docking with the self-cleaning detection barrel 7, thereby ensuring the accuracy and stability of the movement of the fitting simulation plate 4, the rotating adjustment shaft 3 and the mobile detection device 5. By precisely controlling the stroke of the first linear drive 22, the lifting height can be precisely regulated to meet the requirements of precise docking with the ceramic heating plate 11.
[0043] See also Figures 2 to 5As shown, a first limiting slide rail 31 is provided at the axial position of the rotation adjustment shaft 3, and the first limiting slide rail 31 is used for slidingly installing the mobile detection device 5. A plurality of limiting installation grooves 32 are provided on the outer side of the rotation adjustment shaft 3, and a rotating slip ring 35 is installed on the limiting installation groove 32. The rotating slip ring 35 is slidingly connected to the limiting installation groove 32, and the rotating slip ring 35 is rotationally connected to the docking interference frame 23. A second linear driver 34 is installed above the rotation adjustment shaft 3, and the second linear driver 34 is fixedly connected to the docking interference frame 23. The output end of the second linear driver 34 is rotationally connected to the rotation adjustment shaft 3, and the rotation adjustment shaft 3 also includes a first rotation drive device 33 that drives the rotating slip ring 35 to rotate.
[0044] The first limiting rail 31 allows for smooth and precise sliding installation of the mobile detection device 5, ensuring that the mobile detection device 5 can be quickly and accurately positioned to different detection positions as needed. The outer side of the rotary adjustment shaft 3 is equipped with multiple limiting mounting grooves 32, on which rotating slip rings 35 are mounted. The sliding connection between the rotating slip rings 35 and the limiting mounting grooves 32 not only enhances the stability of the rotary adjustment shaft 3 but also allows for flexible rotational adjustment of the rotary adjustment shaft 3 within a certain range.
[0045] To achieve precise control of the rotary adjustment shaft 3, the output end of the second linear actuator 34 is rotatably connected to the rotary adjustment shaft 3. The telescopic movement of the second linear actuator 34 enables precise vertical movement of the rotary adjustment shaft 3. This allows the rotary adjustment shaft 3 to perform necessary lifting and lowering operations during the preliminary and simulated testing stages.
[0046] In addition, the rotary adjustment shaft 3 is equipped with a first rotary drive device 33, which is fixedly mounted on the docking abutment frame 23 and connected to the rotating slip ring 35 via its output end. During the initial detection phase, the first rotary drive device 33 is activated and drives the rotating slip ring 35 to rotate, thereby driving the rotary adjustment shaft 3 and the mobile detection device 5 to rotate synchronously. This rotation adjustment mechanism ensures that the mobile detection device 5 can perform comprehensive and uniform flatness detection on the ceramic heating plate 11.
[0047] During the simulation test phase, the second linear actuator 34 is activated, driving the rotary adjustment shaft 3 and the bonding simulation plate 4 to press downward until they are in close contact with the ceramic heating plate 11. This simulated contact pressure design can simulate the forces and thermal stresses experienced by the ceramic heating plate 11 under actual working conditions, thereby more accurately assessing changes in its flatness. After heating is complete, the second linear actuator 34 is activated again, driving the bonding simulation plate 4 upward, and then the rotary adjustment shaft 3 cooperates with the mobile detection device 5 to perform a second flatness test.
[0048] The first rotation driving device 33 is a prior art and will not be described in detail here.
[0049] See also Figures 2 to 6 As shown, a simulated bonding surface is provided at the bottom of the bonding simulation plate 4, a detection port 41 is provided on the bonding simulation plate 4, a rotating shielding plate 42 is installed inside the detection port 41, the rotating shielding plate 42 is rotatably connected to the bonding simulation plate 4, an elastic retaining spring 43 is installed between the rotating shielding plate 42 and the bonding simulation plate 4, and the bonding simulation plate 4 also includes a trigger push rod 44 installed on the mobile detection device 5.
[0050] A simulated bonding surface is provided at the bottom of the bonding simulation plate 4. The simulated bonding surface is used to tightly contact the detection surface of the ceramic heating plate 11 to be tested, so as to simulate the bonding state of the semiconductor and the ceramic heating plate 11 under actual working conditions. A detection port 41 is also provided on the bonding simulation plate 4. A rotating shielding plate 42 is installed inside the detection port 41. The rotating shielding plate 42 and the bonding simulation plate 4 are opened and closed by a rotating connection, and an elastic retaining spring 43 is installed between the two to ensure that the rotating shielding plate 42 remains shielded in the non-testing state, thereby effectively preventing external factors from affecting the bonding state between the bonding simulation surface and the ceramic heating plate 11, and ensuring the uniformity and stability of the bonding.
[0051] During the detection process, when the mobile detection device 5 detects the flatness of the ceramic heating plate 11, the rotating adjustment shaft 3 will first drive the fitting simulation plate 4 to rise, so that it is out of contact with the ceramic heating plate 11. Subsequently, the mobile detection device 5 will be adjusted to an appropriate detection position along the preset first limit slide rail 31. During this process, the trigger push rod 44 installed on the mobile detection device 5 will conflict with the rotating shielding plate 42. This conflicting action will overcome the elastic force of the elastic retaining spring 43, causing the rotating shielding plate 42 to rotate and thus open the detection port 41. The opening of the detection port 41 provides an unobstructed channel for the detection end of the mobile detection device 5, enabling it to accurately and comprehensively detect the plane of the ceramic heating plate 11.
[0052] When the mobile detection device 5 completes the detection and resets, the interference between the trigger push rod 44 and the rotating shielding plate 42 is released. At this time, the elastic retaining spring 43 will use its elastic force to push the rotating shielding plate 42 to rotate in the opposite direction around the rotation axis until it is completely reset and re-shields the detection port 41.
[0053] See also Figures 2 to 5As shown, the mobile detection device 5 includes a third linear drive 51 installed inside the first limiting slide 31, and the mobile detection device 5 also includes a first ball screw slide 52 installed inside the first limiting slide 31. The first ball screw slide 52 is slidingly connected to the first limiting slide 31, and the first ball screw slide 52 is connected to the output end of the third linear drive 51. The plane detector 53 is installed at the movable end of the first ball screw slide 52, and the plane detector 53 is used to detect the flatness of the ceramic heating plate 11.
[0054] Driven by the third linear actuator 51, the first ball screw slide 52 can slide and adjust along the first limit rail 31, thereby achieving precise control of the position of the flatness detector 53. The flatness detector 53 is mounted on the movable end of the first ball screw slide 52. The flatness detector 53 has high-precision measurement capabilities and can accurately detect the flatness of the ceramic heating plate 11. The first ball screw slide 52 can drive the mobile detection device 5 to move horizontally.
[0055] When the rotary adjustment shaft 3 rotates, since the mobile detection device 5 is installed on the rotary adjustment shaft 3 , the plane detector 53 will rotate synchronously therewith, so that the plane detector 53 can perform comprehensive detection on different positions of the ceramic heating plate 11 .
[0056] By driving the first ball screw slide 52 to slide along the first limit slide rail 31 through the third linear drive 51 and performing precise measurement by the plane detector 53, a comprehensive and accurate detection of the flatness of the ceramic heating plate 11 is achieved, thereby improving the efficiency and accuracy of the detection.
[0057] See also Figure 2 、 Figure 7 and Figure 9 As shown, the movable adjustment platform 6 includes a guide adjustment frame 63 installed on the workbench 1, the guide adjustment frame 63 is used to guide the movement of the limiting fixing device 8, a second ball screw slide 61 is installed on the guide adjustment frame 63, and a ring mounting frame 62 is installed on the movable end of the second ball screw slide 61.
[0058] The guide adjustment frame 63 is provided with a moving path for accurately guiding the limiting fixing device 8. The guide adjustment frame 63 is integrated with a second ball screw slide 61, and the movable end of the second ball screw slide 61 is connected to a ring mounting frame 62 for stably carrying the self-cleaning detection barrel 7.
[0059] The guide and adjustment frame 63 is structurally divided into a detection plane 631 and a discharge plane 632. A guide slope 633 provides a smooth transition between the detection plane 631 and the discharge plane 632. The detection plane 631 supports and abuts the position-limiting fixture 8 during the detection process, ensuring it remains in the correct detection position. The discharge plane 632 supports the position-limiting fixture 8 and allows it to enter the discharge state after the detection is complete. The guide slope 633 ensures a smooth transition and position switching of the position-limiting fixture 8 between the detection plane 631 and the discharge plane 632.
[0060] When the self-cleaning detection barrel 7 and the position-limiting fixture 8 it carries need to be moved, the second ball screw slide 61 is activated. Its precisely controlled movement, in conjunction with the annular mounting bracket 62, enables stable horizontal movement of the self-cleaning detection barrel 7. During this movement, the position-limiting fixture 8 slides along the path pre-set by the guide adjustment bracket 63, ensuring precise and stable movement.
[0061] The synergistic effect of the second ball screw slide 61 and the guide adjustment frame 63 enables the mobile adjustment platform 6 to efficiently adjust the position of the self-cleaning detection barrel 7 and the limit fixing device 8 to meet the positioning requirements at different stages of the detection process, thereby ensuring the smooth progress of the entire detection process.
[0062] See also Figure 3 、 Figure 7 and Figure 9 As shown, the self-cleaning detection barrel 7 is fixedly connected to the annular mounting frame 62, and a plurality of arc-shaped air blowing pipes 71 are provided inside the self-cleaning detection barrel 7. The arc-shaped air blowing pipes 71 are covered with air outlet holes. A suction port 72 is provided on the side of the self-cleaning detection barrel 7, and a second limiting slide rail 74 is also provided on the outside of the self-cleaning detection barrel 7. The self-cleaning detection barrel 7 also includes a vacuum cleaner 73 connected to the suction port 72.
[0063] The self-cleaning inspection barrel 7 is fixedly connected to the movable end of the second ball screw slide 61 via an annular mounting bracket 62, enabling stable horizontal movement. Multiple arc-shaped air blowing pipes 71 are located within the self-cleaning inspection barrel 7. These pipes are evenly distributed with air outlets for blowing air into the barrel 7. Furthermore, a suction port 72 is provided on the side of the self-cleaning inspection barrel 7, which is connected to a vacuum cleaner 73, forming a gas circulation path.
[0064] During the inspection process, arc-shaped air blowing pipe 71 is activated, blowing air into the interior of self-cleaning inspection barrel 7 through the air outlet, forming an internal airflow. Simultaneously, vacuum cleaner 73 sucks the air inside self-cleaning inspection barrel 7 through suction port 72, causing the airflow to circulate within self-cleaning inspection barrel 7. This circulating airflow effectively carries and sweeps up dust and impurities inside self-cleaning inspection barrel 7, which are then sucked into the interior by vacuum cleaner 73, thereby achieving the automatic dust cleaning function within self-cleaning inspection barrel 7.
[0065] A second limiting slide rail 74 is further provided on the outer side of the self-cleaning detection barrel 7 , and the second limiting slide rail 74 is used for installing the limiting fixing device 8 .
[0066] The vacuum cleaner 73 is prior art and will not be described in detail here.
[0067] See also Figure 3 、 Figure 7 、 Figure 8 、 Figure 9 and Figure 10 As shown, the limiting and fixing device 8 includes a lifting push plate 81 slidably mounted on the third limiting slide rail 813, and guide wheels 811 are installed on both sides of the lifting push plate 81. The guide wheels 811 are in contact with the guide adjustment frame 63, and a plurality of limiting suction cups 812 and a plurality of third limiting slide rails 813 are provided on the top of the lifting push plate 81. A synchronous adjustment disk 82 is installed at the bottom of the lifting push plate 81, and a plurality of inclined slide rails 83 are provided on the synchronous adjustment disk 82. A movable adjustment block 84 is installed inside each third limiting slide rail 813, and a clamping shaft 841 is provided at the top of the movable adjustment block 84. A sliding shaft 842 is installed at the bottom of the movable adjustment block 84, and the sliding shaft 842 is slidably connected to the inclined slide rail 83. The limiting and fixing device 8 also includes a second rotation drive device 85 that drives the synchronous adjustment disk 82 to rotate.
[0068] The guide wheel 811 is in close contact with the guide and adjustment frame 63, ensuring precise guidance along the preset path during movement. The lifting push plate 81 moves synchronously with the horizontal movement of the self-cleaning detection barrel 7 and can also be raised and lowered under the guidance of the guide and adjustment frame 63 to meet the needs of different detection stages.
[0069] The top of the lifting push plate 81 is equipped with multiple limiting suction cups 812. The limiting suction cups 812 can generate an adsorption force after being activated to firmly adsorb the ceramic heating plate 11 on the lifting push plate 81. At the same time, the lifting push plate 81 is also provided with multiple third limiting slide rails 813 to provide sliding tracks for the movable adjustment block 84.
[0070] The top of the movable adjustment block 84 is equipped with a clamping shaft 841, and the bottom is connected to a sliding shaft 842. The sliding shaft 842 is slidably connected to the inclined slide rail 83 on the synchronous adjustment disk 82. When the second rotation drive device 85 is started, it will drive the synchronous adjustment disk 82 to rotate. The inclined slide rail 83 pushes the sliding shaft 842 to move as the synchronous adjustment disk 82 rotates, thereby prompting the movable adjustment block 84 to move linearly along the third limiting slide rail 813. Since multiple movable adjustment blocks 84 are pushed at the same time, they will drive their respective clamping shafts 841 to shrink synchronously, thereby achieving effective clamping and positioning of the ceramic heating plate 11.
[0071] While the clamping shaft 841 contracts to clamp the ceramic heating plate 11, the limiting suction cup 812 also starts working, further enhancing the adsorption and limiting effect on the ceramic heating plate 11, ensuring that the ceramic heating plate 11 remains stable and motionless during the detection process, thereby improving the accuracy and reliability of the detection.
[0072] See also Figure 3 and Figure 11 As shown, the connecting seat 9 is arranged below the limiting fixing device 8, and an electrical connection port 93 is provided on the connecting seat 9. An inclined blocking plate 91 is provided on the top of the connecting seat 9, and a blocking tooth 92 is provided on the inclined blocking plate 91.
[0073] The connection base 9 is arranged below the limiting fixture 8, ensuring that when the ceramic heating plate 11 is accurately placed on the limiting fixture 8, the heating element connection line at its bottom can naturally hang down to the position of the connection base 9. The connection base 9 is specially designed with an electrical connection port 93, which facilitates the staff to quickly and accurately insert the heating element connection line of the ceramic heating plate 11 into place, thereby establishing a stable electrical connection.
[0074] In order to ensure that the connecting wire does not fall off due to movement or vibration during the inspection process, an inclined blocking plate 91 is added to the connecting base 9, and blocking teeth 92 are set on the blocking plate. The geometric shape and arrangement of these blocking teeth 92 are carefully calculated to ensure that they can effectively clamp the connecting wire and prevent it from accidentally falling off during the inspection process.
[0075] During the inspection process, when the movable adjustment platform 6 drives the self-cleaning inspection barrel 7 and the position-limiting fixture 8 to the discharge area, the operator can conveniently place the ceramic heating plate 11 onto the position-limiting fixture 8. At this point, the connecting wire at the bottom of the ceramic heating plate 11 will naturally droop to the area of the connecting seat 9. Subsequently, when the movable adjustment platform 6 drives the entire device back to its original position, the blocking teeth 92 on the inclined blocking plate 91 immediately come into play, effectively blocking the connecting wire and ensuring a secure connection during the subsequent inspection process.
[0076] Once the connecting wire is firmly blocked on the connecting seat 9, the staff can easily insert the connecting wire into the electrical connection port 93, thereby establishing an electrical connection between the ceramic heating plate 11 and the detection device.
[0077] A method for detecting the flatness of a semiconductor ceramic heating plate comprises the following steps: S1. Move the adjustment platform 6 to move the semiconductor ceramic heating plate 11 to be tested to the position directly below the laminating simulation board 4 to ensure that the relative position is accurate.
[0078] S2. Start the lifting docking device 2, driving the rotating adjustment shaft 3, the fitting simulation board 4 and the mobile detection device 5 to descend synchronously to prepare for preliminary detection.
[0079] S3, the mobile detection device 5 cooperates with the rotating adjustment shaft 3 to perform preliminary detection, and stops the detection if it fails, and continues the test if it passes.
[0080] S4 , after the preliminary test is qualified, the mobile test device 5 is reset, and the rotating adjustment shaft 3 drives the laminating simulation plate 4 to descend and laminat e the ceramic heating plate 11 .
[0081] S5, the connecting seat 9 transmits electric energy to start the heating simulation of the ceramic heating plate 11, and the temperature sensor on the simulation board 4 monitors the temperature change in real time until it reaches the specified detection temperature.
[0082] S6. After heating to the specified temperature, the adjusting shaft 3 is rotated to drive the fitting simulation plate 4 to rise and separate from the ceramic heating plate 11. The detection device 5 is moved to detect again, and the two data are compared to analyze the change in the flatness of the ceramic heating plate 11 to determine whether it is qualified.
[0083] The above embodiments merely represent one or more embodiments of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of protection of the present invention. It should be noted that a person of ordinary skill in the art may make various modifications and improvements without departing from the spirit of the present invention, and such modifications and improvements fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the appended claims.
Claims
1. A device for detecting the flatness of a semiconductor ceramic heating plate, comprising a simulation detection device mounted on a workbench (1), characterized in that: The simulation detection device includes a lifting docking device (2), a rotating adjustment shaft (3), a fitting simulation plate (4), a moving detection device (5), a moving adjustment table (6), a self-cleaning detection barrel (7), a limiting fixing device (8) and a connecting seat (9); The lifting docking device (2) is installed above the workbench (1); The rotary adjustment shaft (3) is installed at the axis center position of the lifting docking device (2); The laminating simulation plate (4) is mounted on the bottom of the rotating adjustment shaft (3), and a temperature sensor is provided inside the laminating simulation plate (4); The mobile detection device (5) is mounted on the rotary adjustment shaft (3), and the detection end of the mobile detection device (5) is arranged vertically downward; The movable adjustment platform (6) is arranged below the laminating simulation board (4), and the movable end of the movable adjustment platform (6) slides horizontally; The self-cleaning detection barrel (7) is mounted on the movable adjustment platform (6); The limiting fixture (8) is installed inside the self-cleaning detection barrel (7), the top of the limiting fixture (8) is used to support the ceramic heating plate (11) to be detected, and the limiting fixture (8) is slidably connected to the self-cleaning detection barrel (7); The connecting seat (9) is installed below the movable adjustment platform (6), and the connecting seat (9) is used to connect the heating element of the ceramic heating plate (11).
2. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 1, wherein: The lifting docking device (2) comprises a fixed mounting frame (21) mounted on the workbench (1), a first linear drive (22) being mounted on the fixed mounting frame (21), and a docking abutment frame (23) being mounted on the output end of the first linear drive (22).
3. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 2, wherein: A first limiting slide rail (31) is provided at the axis center of the rotating adjustment shaft (3), a plurality of limiting installation grooves (32) are provided on the outer side of the rotating adjustment shaft (3), a rotating slip ring (35) is installed on the limiting installation groove (32), and the rotating slip ring (35) is rotatably connected to the docking contact frame (23), and a second linear drive (34) is installed above the rotating adjustment shaft (3).
4. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 1, wherein: The bottom of the laminating simulation plate (4) is provided with a simulated laminating surface, the laminating simulation plate (4) is provided with a detection port (41), a rotating shielding plate (42) is installed inside the detection port (41), the rotating shielding plate (42) is rotatably connected to the laminating simulation plate (4), an elastic retaining spring (43) is installed between the rotating shielding plate (42) and the laminating simulation plate (4), and the laminating simulation plate (4) further includes a triggering rod (44) installed on the mobile detection device (5).
5. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 3, wherein: The mobile detection device (5) includes a third linear driver (51) installed inside the first limiting slide rail (31). The mobile detection device (5) also includes a first ball screw slide (52) installed inside the first limiting slide rail (31). The first ball screw slide (52) is slidably connected to the first limiting slide rail (31). The first ball screw slide (52) is connected to the output end of the third linear driver (51). A plane detector (53) is installed at the movable end of the first ball screw slide (52). The plane detector (53) is used to detect the flatness of the ceramic heating plate (11).
6. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 1, wherein: The movable adjustment platform (6) includes a guide adjustment frame (63) mounted on the workbench (1), the guide adjustment frame (63) is used to guide the movement of the limit fixing device (8), a second ball screw slide (61) is mounted on the guide adjustment frame (63), and a ring mounting frame (62) is mounted on the movable end of the second ball screw slide (61).
7. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 6, wherein: The self-cleaning detection barrel (7) is fixedly connected to the annular mounting frame (62). A plurality of arc-shaped air blowing pipes (71) are provided inside the self-cleaning detection barrel (7). The arc-shaped air blowing pipes (71) are covered with air outlet holes. A suction port (72) is provided on the side of the self-cleaning detection barrel (7). A second limiting slide rail (74) is also provided on the outside of the self-cleaning detection barrel (7). The self-cleaning detection barrel (7) also includes a vacuum cleaner (73) connected to the suction port (72).
8. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 7, wherein: The limiting fixing device (8) includes a lifting push plate (81) slidably mounted on a third limiting slide rail (813), guide wheels (811) are mounted on both sides of the lifting push plate (81), the guide wheels (811) are in contact with the guide adjustment frame (63), a plurality of limiting suction cups (812) and a plurality of third limiting slide rails (813) are provided on the top of the lifting push plate (81), a synchronous adjustment disk (82) is mounted on the bottom of the lifting push plate (81), a plurality of inclined slide rails (83) are provided on the synchronous adjustment disk (82), a movable adjustment block (84) is mounted inside each third limiting slide rail (813), a clamping shaft (841) is mounted on the top of the movable adjustment block (84), a sliding shaft (842) is mounted on the bottom of the movable adjustment block (84), and the sliding shaft (842) is slidably connected to the inclined slide rail (83).
9. The device for detecting the flatness of a semiconductor ceramic heating plate according to claim 1, wherein: The connecting seat (9) is arranged below the limiting fixing device (8), the connecting seat (9) is provided with an electrical connection port (93), the top of the connecting seat (9) is provided with an inclined blocking plate (91), and the inclined blocking plate (91) is provided with blocking teeth (92).
10. A method for detecting the flatness of a semiconductor ceramic heating plate, using the device for detecting the flatness of a semiconductor ceramic heating plate according to any one of claims 1 to 9, characterized in that: The following steps are included: S1. Move the adjustment platform (6) to move the semiconductor ceramic heating plate (11) to be tested to the bottom of the fitting simulation plate (4) to ensure the relative position is accurate; S2, start the lifting docking device (2), drive the rotating adjustment shaft (3), the fitting simulation board (4) and the mobile detection device (5) to descend synchronously, and prepare for preliminary detection; S3, the mobile detection device (5) cooperates with the rotating adjustment shaft (3) to perform preliminary detection, and stops the detection if it fails, and continues the test if it passes; S4, after the preliminary test is qualified, the mobile detection device (5) is reset, and the rotating adjustment shaft (3) drives the bonding simulation plate (4) to descend and bond to the ceramic heating plate (11); S5: The connecting seat (9) transmits electric energy to start the heating simulation of the ceramic heating plate (11), and the temperature sensor on the simulation board (4) monitors the temperature change in real time until it reaches the specified detection temperature; S6. After heating to the specified temperature, the adjusting shaft (3) is rotated to drive the fitting simulation plate (4) to rise and separate from the ceramic heating plate (11). The detection device (5) is moved to detect again, and the two data are compared to analyze the change in the flatness of the ceramic heating plate (11) to determine whether it is qualified.
Citation Information
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