Overcurrent performance testing device for chip capacitor

Abstract

The invention relates to a capacitor testing device, in particular to an over-current performance testing device for a chip capacitor. The invention aims to provide a chip capacitor over-current performance testing device, and aims to solve the problems that when a chip capacitor is tested at present, an outer electrode of the chip capacitor is difficult to align accurately, so that poor contact or unstable signals are caused, and the testing accuracy is influenced; meanwhile, multi-step testing is carried out in sequence, and operation is complex and time-consuming. A chip capacitor over-current performance testing device comprises a shell, two side faces in the shell are respectively provided with a sliding rail, and the two sliding rails are respectively provided with an electric sliding block in a sliding mode. According to the invention, the three driving frames perform vertical displacement in sequence, the first conductive rod, the second conductive rod and the third conductive rod can be in accurate contact with two external electrodes of the chip capacitor respectively, and different testing devices such as an LCR tester, a withstand voltage tester and a leakage current tester can be accessed in sequence. Therefore, the parameters of the chip capacitor can be comprehensively detected.

Description

Technical Field

[0001] The invention relates to a capacitor testing device, in particular to a chip capacitor overcurrent performance testing device. Background Art

[0002] During the production process, chip capacitors are usually tested by random sampling. Random sampling refers to randomly selecting a certain number of samples from batch-produced products for testing, rather than conducting a full inspection of every product. This method can significantly reduce testing costs and time while ensuring quality control. The chip capacitors sampled are tested using LCR testers, voltage testers, and leakage current testers to comprehensively evaluate their electrical performance, insulation performance, and reliability, ensuring that they meet design requirements and operate stably in actual applications.

[0003] First, the sizes of chip capacitors are inconsistent and generally small, which makes it difficult to accurately align the two external electrodes on the chip capacitors when using LCR testers, voltage testers and leakage current testers for testing, resulting in poor contact or unstable test signals, which in turn affects the accuracy of the test results; secondly, the detection process requires the use of LCR testers, voltage testers and leakage current testers in sequence to perform multi-step tests on chip capacitors. The operation process is complicated and time-consuming, which not only reduces the detection efficiency, but also easily introduces errors due to human operational errors, further affecting the consistency and reliability of the test. Summary of the Invention

[0004] In order to overcome the current shortcomings of difficulty in accurately aligning the outer electrodes of chip capacitors when testing chip capacitors, resulting in poor contact or unstable signals, affecting test accuracy; at the same time, performing multi-step testing in sequence, which is complicated and time-consuming, reduces detection efficiency and is prone to introducing human errors, affecting test consistency and reliability, the purpose of the present invention is to provide a chip capacitor over-current performance testing device that can accurately correct and fix chip capacitors of different sizes to ensure stable contact between their outer electrodes and test probes, so that different detection equipment can be used in sequence to efficiently test the chip capacitors, significantly improving detection efficiency, while reducing human operation errors and improving the accuracy and consistency of test results.

[0005] The technical solution is: a chip capacitor over-current performance test device, including a shell, a slide rail is installed on each of the two side surfaces of the shell, an electric slider is slidably provided on the two slide rails, a mounting plate is installed between the two electric sliders, a sliding shell is installed on the top of the mounting plate, the sliding shell slides out of the shell, a groove is opened on the top of the sliding shell, a chip capacitor is placed in the groove on the top of the sliding shell, a correction mechanism for correcting the chip capacitor is provided on the shell and the sliding shell, a testing mechanism for testing the chip capacitor is provided on the shell and the sliding shell, and a driving mechanism is provided on the shell, the mounting plate and the testing mechanism.

[0006] As a further preferred solution, the correction mechanism includes a sliding plate, a sliding plate is slidingly provided on two opposite side surfaces of the sliding shell, a screw rod is rotatably provided on the side of the two sliding plates away from each other, a gear is installed in the middle of the two screw rods, a fixing nut is installed on the two side surfaces of the sliding shell close to the two sliding plates, the sides of the two screw rods away from each other are respectively connected to the two fixing nuts by threads, two movable racks are slidingly provided on the outer shell, two reset springs are connected between the movable rack and the top of the outer shell, and the two movable racks are respectively located on one side of the two gears.

[0007] As a further preferred embodiment, the testing mechanism includes a first conductive rod, and the other two sides of the two sliding plates that are away from each other are slidingly provided with a first conductive rod, a second conductive rod and a third conductive rod, and the two first conductive rods, the two second conductive rods and the two third conductive rods are each installed with a spring seat, and each spring seat is connected to the sliding shell with a transverse spring, and the outer shell is installed with two first conductive plates, two second conductive plates and two third conductive plates, and the two first conductive rods, the two second conductive rods and the two third conductive rods are in sliding contact with the two first conductive plates, the two second conductive plates and the two third conductive plates respectively.

[0008] As a further preferred solution, a first conductive rod, a second conductive rod and a third conductive rod form a group of conductive rods, and there are two groups of conductive rods in total.

[0009] As a further preferred solution, the driving mechanism includes a driving frame, three driving frames are slidingly provided on the mounting plate, six cross bars are slidingly provided on the sliding shell, a guide wheel is rotatably provided on the side of the six cross bars away from each other, a bottom wheel is rotatably provided at the bottom of each driving frame, a bottom plate is installed on the outer shell, and three trapezoidal blocks are evenly spaced and installed on the bottom plate.

[0010] As a further preferred solution, two inclined surfaces are provided on the upper portion of each driving frame, and each guide wheel is in contact with the inclined surfaces on the upper portion of the driving frame respectively.

[0011] As a further preferred solution, the three trapezoidal blocks are staggered on the bottom plate, and the three trapezoidal blocks correspond to the three bottom wheels respectively.

[0012] As a further preferred solution, it also includes balls. A plurality of balls are evenly spaced and embedded on one side of the two sliding plates close to each other, and the balls are in rolling connection with the sliding plates.

[0013] As a further preferred solution, it also includes an adjustment mechanism arranged on the sliding shell and the movable rack, the adjustment mechanism is used to adjust the distance between the two sliding plates approaching or moving away from each other, the adjustment mechanism includes a contact block, a contact block is installed on the side where the two movable racks move away from each other, two chamfered surfaces are provided on the contact block, a slide is slidably provided on the two side surfaces of the sliding shell close to the two fixing nuts, a roller is rotatably provided at the bottom of the two slides, two threaded rods are threadedly connected to the sliding shell, and the other ends of the two threaded rods are rotatably connected to the two slides respectively.

[0014] The present invention has the following advantages: 1. Through the three driving frames performing vertical displacement in sequence, the first conductive rod, the second conductive rod and the third conductive rod can respectively achieve precise contact with the two outer electrodes of the chip capacitor. This design enables the chip capacitor to be connected to different test equipment in sequence after being fixed and calibrated, such as an LCR tester, a withstand voltage tester and a leakage current tester, thereby achieving comprehensive testing of key parameters such as capacitance value, insulation resistance, withstand voltage performance and leakage current. This not only significantly improves the detection efficiency, but also reduces human errors through automated operation, ensuring the accuracy and consistency of the test results.

[0015] 2. By moving the two sets of conductive rods toward each other, the chip capacitor can be displaced. At the same time, the ball guide mechanism is used to accurately position the chip capacitor to ensure that it is always centered during the test, so that the first conductive rod, the second conductive rod, and the third conductive rod can achieve close and stable contact with the external electrodes on both sides of the chip capacitor. Through this highly reliable contact method, the chip capacitor can be connected to equipment such as LCR testers, voltage testers, and leakage current testers in sequence to quickly complete the testing of key parameters such as capacitance value, insulation resistance, voltage resistance performance, and leakage current. This solution significantly improves detection efficiency and reduces manual intervention. At the same time, the high-precision guide and contact design further improves the consistency and repeatability of the test, providing reliable protection for production quality control.

[0016] 3. When the sizes of chip capacitors are inconsistent, the operator can use an Allen wrench to drive the two high-precision threaded rods to rotate forward and backward. When the threaded rods rotate forward, they drive the slide and roller to move along the guide rail away from the fixed nut, thereby adjusting the contact timing between the roller and the contact block, and dynamically adjusting the spacing between the sliding plates to adapt to chip capacitors of different sizes; this adjustable structure significantly improves the applicability of the device, is compatible with the testing needs of chip capacitors of various specifications, and enhances the versatility and flexibility of the equipment. At the same time, the adjustment mechanism is easy to operate, ensuring that chip capacitors of different sizes maintain stable alignment and contact during testing, avoiding test errors caused by size differences, and greatly reducing equipment replacement or adjustment time, improving detection efficiency, and providing reliable guarantees for the rapid and accurate detection of chip capacitors of multiple specifications. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the three-dimensional structure of the present invention.

[0018] Figure 2 It is a schematic diagram of the cross-sectional three-dimensional structure of the present invention.

[0019] Figure 3 It is a schematic diagram of the three-dimensional structure of the testing mechanism and the driving mechanism of the present invention.

[0020] Figure 4 It is a schematic diagram of the three-dimensional structure of the correction mechanism of the present invention.

[0021] Figure 5 It is a schematic diagram of the three-dimensional structure of the testing mechanism of the present invention.

[0022] Figure 6 It is a schematic cross-sectional three-dimensional structural diagram of the testing mechanism and the driving mechanism of the present invention.

[0023] Figure 7 It is a schematic diagram of the three-dimensional structure of the driving mechanism of the present invention.

[0024] Figure 8 It is a schematic diagram of the three-dimensional structure of the first conductive rod, the second conductive rod, the third conductive rod and the driving mechanism of the present invention.

[0025] Figure 9 It is a schematic diagram of the disassembled three-dimensional structure of some parts of the correction mechanism of the present invention.

[0026] Figure 10 It is a schematic diagram of the disassembled three-dimensional structure of the slide rail, electric slider, mounting plate and some parts of the testing mechanism of the present invention.

[0027] Figure 11 It is a schematic diagram of the disassembled three-dimensional structure of some parts of the driving mechanism of the present invention.

[0028] Figure 12 It is a schematic diagram of the three-dimensional structure of the correction mechanism and the adjustment mechanism of the present invention.

[0029] Figure 13 It is a schematic diagram of the three-dimensional structure of some parts of the testing mechanism of the present invention.

[0030] Figure 14 It is a schematic cross-sectional three-dimensional structural diagram of the correction mechanism and the adjustment mechanism of the present invention.

[0031] Figure 15 It is a schematic diagram of the three-dimensional structure of the sliding shell and the correction mechanism of the present invention.

[0032] Figure 16 It is a schematic diagram of the three-dimensional structure of some parts of the adjustment mechanism of the present invention.

[0033] Among them: 1-housing, 2-slide rail, 3-electric slider, 4-mounting plate, 5-sliding shell, 51-chip capacitor, 61-sliding plate, 62-screw, 63-gear, 64-fixing nut, 65-movable rack, 66-reset spring, 60-ball, 711-first conductive rod, 712-second conductive rod, 713-third conductive rod, 74-spring seat, 75-transverse spring, 761-first conductive plate, 762-second conductive plate, 763-third conductive plate, 81-driving frame, 82-cross bar, 83-guide wheel, 84-bottom wheel, 85-bottom plate, 86-trapezoidal block, 9-adjusting mechanism, 91-contact block, 92-slide plate, 93-roller, 94-threaded rod. DETAILED DESCRIPTION

[0034] The following further illustrates the technical solution with reference to specific embodiments. It should be noted that terms such as "up," "down," "left," and "right" used herein to indicate directions refer only to the positions of the structures depicted in the corresponding drawings. Component numbers, such as "first" and "second," are used solely to distinguish the components being described and do not convey any sequential or technical meaning. Terms such as "connected" and "coupled" in this application include both direct and indirect connections unless otherwise specified.

[0035] Example 1: A device for testing the overcurrent performance of a chip capacitor, such as Figures 1-15 As shown, it includes a shell 1, and a slide rail 2 is installed on each side of the shell 1 by bolts. An electric slider 3 is slidably provided on each slide rail 2, and the electric slider 3 will slide horizontally along the slide rail 2. A mounting plate 4 is installed between the two electric sliders 3 by bolts, and a sliding shell 5 is installed on the top of the mounting plate 4. The sliding shell 5 slides out of the shell 1, and a groove is opened on the top of the sliding shell 5. A chip capacitor 51 is placed in the groove on the top of the sliding shell 5. A correction mechanism for correcting the chip capacitor 51 is provided on the shell 1 and the sliding shell 5. A testing mechanism for testing the chip capacitor 51 is provided on the shell 1 and the sliding shell 5. A driving mechanism is provided on the shell 1, the mounting plate 4 and the testing mechanism.

[0036] The correction mechanism includes a sliding plate 61. A sliding plate 61 for correcting the chip capacitor 51 is slidingly provided on two opposite side surfaces of the sliding shell 5. A screw rod 62 is rotatably provided on the side of the two sliding plates 61 away from each other through a bearing. A gear 63 is installed in the middle of the two screw rods 62. A fixing nut 64 is installed on the two side surfaces of the sliding shell 5 close to the two sliding plates 61. The two screw rods 62 are respectively connected to the two fixing nuts 64 on the sides away from each other through threads. Two movable racks 65 are slidingly provided on the outer shell 1. Two reset springs 66 are connected between the movable rack 65 and the top inside the outer shell 1. The two movable racks 65 are respectively located on one side of the two gears 63. After the gear 63 moves, it will engage with the movable rack 65.

[0037] The testing mechanism includes a first conductive rod 711. A first conductive rod 711, a second conductive rod 712, and a third conductive rod 713 are slidingly provided on the other two sides of the two sliding plates 61 that are away from each other. A spring seat 74 is installed on each of the two first conductive rods 711, the two second conductive rods 712, and the two third conductive rods 713. A transverse spring 75 is connected between each spring seat 74 and the sliding shell 5. Two first conductive plates 761, two second conductive plates 762, and two third conductive plates 763 are installed on the outer shell 1. The two first conductive rods 711, the two second conductive rods 712, and the two third conductive rods 713 are in sliding contact with the two first conductive plates 761, the two second conductive plates 762, and the two third conductive plates 763, respectively.

[0038] A first conductive rod 711 , a second conductive rod 712 and a third conductive rod 713 form a group of conductive rods, and there are two groups of conductive rods in total.

[0039] The driving mechanism includes a driving frame 81. Three driving frames 81 are slidably provided on the mounting plate 4. Six cross bars 82 are slidably provided on the sliding shell 5. A guide wheel 83 is rotatably provided on the side of the six cross bars 82 away from each other. A bottom wheel 84 is rotatably provided at the bottom of each driving frame 81. A bottom plate 85 is installed on the outer shell 1, and three trapezoidal blocks 86 are evenly spaced and installed on the bottom plate 85.

[0040] Two inclined surfaces are provided on the upper portion of each driving frame 81 , and each guide wheel 83 contacts the inclined surfaces on the upper portion of the driving frame 81 .

[0041] The three trapezoidal blocks 86 are staggered on the bottom plate 85 , and the three trapezoidal blocks 86 correspond to the three bottom wheels 84 respectively.

[0042] The sliding plates 61 further include balls 60 . A plurality of balls 60 are evenly spaced and embedded on one side of the two sliding plates 61 that are close to each other. The balls 60 are in rolling connection with the sliding plates 61 .

[0043] When testing the chip capacitor 51, the operator connects two wires on two different test devices to the first conductive plate 761 and the third conductive plate 763 on different sides in sequence, and then connects the two wires on another test device to the two second conductive plates 762. The operator places the chip capacitor 51 in the groove on the sliding shell 5, with two sides of the chip capacitor 51 located between the two sliding plates 61, and the two outer electrodes on the chip capacitor 51 located between the two sets of conductive rods. The operator controls the two electric sliders 3 to move along the two slide rails 2, and the two electric sliders 3 drive the mounting plate 4, the sliding shell 5, the chip capacitor 51, the two sliding plates 61, and the two outer electrodes of the chip capacitor 51. The plate 61, two screw rods 62, two gears 63, two fixing nuts 64, two first conductive rods 711, two second conductive rods 712, two third conductive rods 713, six spring seats 74, six transverse springs 75, three driving frames 81, six transverse rods 82, six guide wheels 83 and three bottom wheels 84 move. The two first conductive rods 711, two second conductive rods 712 and two third conductive rods 713 will slide along the two first conductive plates 761, two second conductive plates 762 and two third conductive plates 763. After the two gears 63 are engaged with the two movable racks 65, the two gears 63 will drive the two screw rods 62 to rotate. Under the action of the two fixing nuts 64, the two screw rods 62 rotate and move toward each other, and the two screw rods 62 drive the two sliding plates 61 and the balls 60 on both sides to move toward each other, and the balls 60 on both sides will push the chip capacitor 51 to move, and the two sliding plates 61 will contact one side of the chip capacitor 51. After the balls 60 on both sides correct and fix the chip capacitor 51, the two gears 63 are disengaged from the two movable racks 65; initially, the six transverse springs 75 are in a stretched state, and the three bottom wheels 84 move to contact and separate with the three trapezoidal blocks 86 in turn, and the three driving frames 81 will move up and down in turn, and the two on both sides will move up and down. When the chamfered surfaces on the driving frames 81 move upward in sequence, the two cross bars 82 on both sides and the two guide wheels 83 on both sides will move in a direction approaching each other in sequence under the action of the cross springs 75 on both sides. The two cross bars 82 on both sides will respectively drive the first conductive plate 761 and the third conductive plate 763 on the different sides to move in a direction approaching each other. When the chamfered surface on the middle driving frame 81 moves upward, the two middle cross bars 82 and the two middle guide wheels 83 will move in a direction approaching each other under the action of the two middle cross springs 75. The two middle cross bars 82 will drive the two second conductive rods 712 to move in a direction approaching each other.By sequentially moving the three drive racks 81 vertically, the first conductive rod 711, the second conductive rod 712, and the third conductive rod 713 can respectively achieve precise contact with the two outer electrodes of the chip capacitor 51. This design allows the chip capacitor 51 to be connected to different test equipment, such as an LCR tester, a withstand voltage tester, and a leakage current tester, after being fixed and calibrated, to achieve comprehensive testing of key parameters such as capacitance, insulation resistance, withstand voltage performance, and leakage current. This not only significantly improves testing efficiency, but also reduces human error through automated operation, ensuring the accuracy and consistency of test results. When the chamfered surfaces on the three drive racks 81 move downward in sequence, under the action of the cross spring 75, the cross bar 82 drives the first conductive rod 711, the second conductive rod 712, and the third conductive rod 713 to move and reset in sequence. By moving the two groups of conductive rods toward each other, the chip capacitor 51 can be pushed to move. At the same time, the ball 60 guide mechanism is used to accurately position the chip capacitor 51, ensuring that it is always centered during the test. Rod 712 and the third conductive rod 713 can achieve close and stable contact with the external electrodes on both sides of the chip capacitor 51. Through this highly reliable contact method, the chip capacitor 51 can be connected to equipment such as LCR tester, voltage tester and leakage current tester in sequence to quickly complete the detection of key parameters such as capacitance value, insulation resistance, voltage resistance and leakage current. This solution significantly improves the detection efficiency and reduces manual intervention. At the same time, through high-precision guidance and contact design, the consistency and repeatability of the test are further improved, providing reliable production quality control. After testing the chip capacitor 51, the operator controls the two electric sliders 3 to move in the opposite direction along the two slide rails 2 and reset. The two electric sliders 3 drive the mounting plate 4, the sliding housing 5, the chip capacitor 51, the two sliding plates 61, the two screw rods 62, the two gears 63, the two fixing nuts 64, the two first conductive rods 711, the two second conductive rods 712, the two third conductive rods 713, the six spring seats 74, the six transverse springs 75, the three drive frames 81, the six transverse rods 82, the six guide wheels 83, and the three bottom wheels 84 to move in the opposite direction and reset.

[0044] Example 2: Based on Example 1, Figure 12-16As shown, it also includes an adjusting mechanism 9 arranged on the sliding shell 5 and the movable rack 65, the adjusting mechanism 9 is used to adjust the distance between the two sliding plates 61 approaching or moving away from each other, the adjusting mechanism 9 includes a contact block 91, and a contact block 91 is installed on the side where the two movable racks 65 move away from each other, and the contact block 91 is provided with two chamfered surfaces. A slide plate 92 is slidably provided on both side surfaces of the sliding shell 5 close to the two fixing nuts 64, and a roller 93 is rotatably provided at the bottom of the two slide plates 92. Two threaded rods 94 are threadedly connected to the sliding shell 5, and the other ends of the two threaded rods 94 are rotatably connected to the two slide plates 92 respectively.

[0045] When the sizes of the chip capacitors 51 are inconsistent, the operator can use an Allen wrench to drive the two threaded rods 94 to rotate forward and reverse; when the threaded rods 94 rotate forward, the two threaded rods 94 synchronously drive the two slides 92 and the rollers 93 mounted thereon to move along the guide rail in a direction away from the fixed nut 64; when the threaded rods 94 rotate reversely, the two threaded rods 94 synchronously drive the two slides 92 and the rollers 93 mounted thereon to move along the guide rail in a direction close to the fixed nut 64; this design can adjust the contact timing between the two rollers 93 and the contact block 91, thereby dynamically adjusting the distance between the two sliding plates 61 so that it can Flexible adaptation to chip capacitors 51 of different sizes; through this adjustable structure, the device significantly improves the scope of application, and can be compatible with the detection requirements of chip capacitors 51 of various specifications, thereby enhancing the versatility and flexibility of the equipment; at the same time, the adjustment mechanism 9 is easy to operate, and can ensure that chip capacitors 51 of different sizes always maintain a stable alignment and contact state during the detection process, effectively avoiding test errors caused by size differences; in addition, the adjustment mechanism 9 also greatly reduces the time for equipment replacement or adjustment, further improves the detection efficiency, and provides reliable guarantees for the rapid and accurate detection of chip capacitors 51 of multiple specifications.

[0046] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications or substitutions that can be easily conceived by a person skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be based on the scope of protection of the claims.

Claims

1. A chip capacitor overcurrent performance test device, characterized by: The invention comprises a housing (1), wherein two sides of the housing (1) are respectively provided with a slide rail (2), an electric slider (3) is slidably provided on each of the two slide rails (2), a mounting plate (4) is mounted between the two electric sliders (3), a sliding housing (5) is mounted on the top of the mounting plate (4), the sliding housing (5) slides out of the housing (1), a groove is formed on the top of the sliding housing (5), a chip capacitor (51) is placed in the groove on the top of the sliding housing (5), a correction mechanism for correcting the chip capacitor (51) is provided on the housing (1) and the sliding housing (5), a testing mechanism for testing the chip capacitor (51) is provided on the housing (1) and the sliding housing (5), and a driving mechanism is provided on the housing (1), the mounting plate (4) and the testing mechanism.

2. The chip capacitor overcurrent performance test device according to claim 1, characterized in that: The correction mechanism includes a sliding plate (61), a sliding plate (61) is slidably provided on two opposite side surfaces of the sliding shell (5), a screw rod (62) is rotatably provided on the side of the two sliding plates (61) away from each other, a gear (63) is installed in the middle of the two screw rods (62), a fixing nut (64) is installed on the two side surfaces of the sliding shell (5) close to the two sliding plates (61), the sides of the two screw rods (62) away from each other are respectively connected to the two fixing nuts (64) by threads, two movable racks (65) are slidably provided on the housing (1), two return springs (66) are connected between the movable rack (65) and the top of the housing (1), and the two movable racks (65) are respectively located on one side of the two gears (63).

3. The chip capacitor overcurrent performance test device according to claim 2, characterized in that: The testing mechanism includes a first conductive rod (711), and two sides of the two sliding plates (61) that are away from each other are each provided with a first conductive rod (711), a second conductive rod (712) and a third conductive rod (713) in a sliding manner. A spring seat (74) is installed on each of the two first conductive rods (711), the two second conductive rods (712) and the two third conductive rods (713). A transverse spring (75) is connected between each spring seat (74) and the sliding shell (5). Two first conductive plates (761), two second conductive plates (762) and two third conductive plates (763) are installed on the shell (1). The two first conductive rods (711), the two second conductive rods (712) and the two third conductive rods (713) are in sliding contact with the two first conductive plates (761), the two second conductive plates (762) and the two third conductive plates (763), respectively.

4. The chip capacitor overcurrent performance test device according to claim 3, characterized in that: A first conductive rod (711), a second conductive rod (712) and a third conductive rod (713) form a group of conductive rods, and there are two groups of conductive rods in total.

5. The chip capacitor overcurrent performance test device according to claim 3, characterized in that: The driving mechanism includes a driving frame (81), three driving frames (81) are slidably provided on the mounting plate (4), six cross bars (82) are slidably provided on the sliding shell (5), and a guide wheel (83) is rotatably provided on the side away from each other of the six cross bars (82). A bottom wheel (84) is rotatably provided at the bottom of each driving frame (81), a bottom plate (85) is installed on the shell (1), and three trapezoidal blocks (86) are evenly spaced and installed on the bottom plate (85).

6. The chip capacitor overcurrent performance test device according to claim 5, characterized in that: Two inclined surfaces are provided on the upper portion of each driving frame (81), and each guide wheel (83) is in contact with the inclined surfaces on the upper portion of the driving frame (81).

7. The chip capacitor overcurrent performance test device according to claim 5, characterized in that: The three trapezoidal blocks (86) are staggered on the bottom plate (85), and the three trapezoidal blocks (86) correspond to the three bottom wheels (84) respectively.

8. The chip capacitor overcurrent performance test device according to claim 2, characterized in that: It also includes balls (60), and a plurality of balls (60) are evenly spaced and embedded on the sides of the two sliding plates (61) close to each other, and the balls (60) are connected to the sliding plates (61) in a rolling manner.

9. The chip capacitor overcurrent performance test device according to claim 5, characterized in that: The invention also includes an adjusting mechanism (9) provided on the sliding shell (5) and the movable rack (65), the adjusting mechanism (9) being used to adjust the distance between the two sliding plates (61) approaching each other or moving away from each other, the adjusting mechanism (9) including a contact block (91), a contact block (91) being installed on each side of the two movable racks (65) moving away from each other, the contact block (91) being provided with two chamfered surfaces, a slide plate (92) being slidably provided on both side surfaces of the sliding shell (5) close to the two fixing nuts (64), a roller (93) being rotatably provided at the bottom of each of the two slide plates (92), two threaded rods (94) being threadedly connected to the sliding shell (5), the other ends of the two threaded rods (94) being rotatably connected to the two slide plates (92) respectively.

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