Energy storage converter, energy storage system and power utilization device

Abstract

The embodiment of the present application relates to the field of energy storage, and provides an energy storage converter, an energy storage system and an electric equipment, the energy storage converter comprising: a first structure part and a second structure part adjacent in a predetermined direction, the first structure part comprising a first circuit board, a heat dissipation module and a second circuit board distributed in sequence from bottom to top, the second structure part comprising an inductor module and a third circuit board distributed in sequence from bottom to top, the predetermined direction being perpendicular to the thickness direction of the first circuit board; wherein the current in the energy storage converter flows through the first circuit board, the second circuit board, the third circuit board and the inductor module in sequence. The embodiment of the present application changes the layout of each circuit board in the energy storage converter, so that the current flows through the right first circuit board and the second circuit board from bottom to top in sequence, and then flows through the left third circuit board and the inductor from top to bottom, so that the current flow path is the shortest, the circuit and power consumption are reduced, and the electromagnetic interference is minimized.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of energy storage, and in particular to an energy storage converter, an energy storage system and an electrical equipment. BACKGROUND

[0002] A power conversion system (PCS), also known as an energy storage inverter, is one of the core devices in an energy storage system. The PCS includes power conversion components (e.g., IGBTs), control components, protection components, communication modules, and a heat dissipation system (e.g., including a heat sink, a fan, or a liquid cooling plate), among other components.

[0003] However, in existing PCSs, the current flow path is long, and the current flow is complex. The longer the current path, the greater the resistance encountered. This results in more energy being dissipated as heat during current transmission, thereby increasing the power consumption of the PCS and reducing its efficiency. Moreover, the long current path can increase electromagnetic interference, especially under high-frequency operating conditions. EMI can cause signal quality to degrade, affecting the normal operation of the control circuit, and in severe cases, can cause system failure. SUMMARY

[0004] The present application provides an energy storage converter, an energy storage system and an electrical equipment, at least for solving the problem that the current flow path in the existing PCS is long and complex, resulting in greater resistance, greater power consumption, and greater electromagnetic interference.

[0005] According to some embodiments of the present application, the present application provides an energy storage converter, comprising: a first structure part and a second structure part adjacent in a predetermined direction, the first structure part comprising a first circuit board, a heat dissipation module and a second circuit board distributed in sequence from bottom to top, the first circuit board comprising a power control module of an inverter circuit and a power conversion module of the inverter circuit, the second circuit board comprising a direct current voltage regulation module, the second structure part comprising an inductor module and a third circuit board distributed in sequence from bottom to top, the third circuit board comprising a sampling module, the predetermined direction being perpendicular to the thickness direction of the first circuit board; wherein the current in the energy storage converter flows through the first circuit board, the second circuit board, the third circuit board and the inductor module in sequence.

[0006] In some embodiments, the first structure part further comprises: an air flow generating device, the air flow generating device being located at at least one side of the heat dissipation module, the side being a surface other than a first surface and a second surface of the heat dissipation module, the first surface being a surface opposite to the first circuit board, and the second surface being a surface opposite to the second circuit board.

[0007] In some embodiments, the airflow generating device comprises: a first airflow generating device located on a first side of the heat dissipation module, the first side being a side surface of the heat dissipation module close to the inductor module; and a second airflow generating device located on a second side of the heat dissipation module, the first side and the second side being opposite surfaces, the airflow direction generated by the first airflow generating device and the airflow direction generated by the second airflow generating device are both a first airflow direction, the first airflow direction being a direction from the heat dissipation module to the inductor module.

[0008] In some embodiments, the energy storage converter further comprises: a box body, the first structure and the second structure are located in the box body, and the airflow generating device is movably installed on the box body through a sliding rail mechanism.

[0009] In some embodiments, the sliding rail mechanism comprises at least one pair of first and second sliding rails matched with each other, the first sliding rail is fixed to an inner wall of the box body, and the second sliding rail is fixed to the airflow generating device, wherein the airflow generating device moves along a preset track under the guidance of the first and second sliding rails.

[0010] In some embodiments, the energy storage converter further comprises: a bracket installed on the box body through a first adapter, the bracket being located on a first side of the airflow generating device; and a baffle installed on a second side of the airflow generating device, the first side and the second side being opposite sides.

[0011] In some embodiments, the heat dissipation module comprises: a plurality of arranged heat sinks, the airflow generating device is fixed on the base plate of a first target heat sink and the base plate of a second target heat sink through a second adapter, the first target heat sink being a column of heat sinks closest to the inductor module, and the second target heat sink being a column of heat sinks farthest from the inductor module.

[0012] In some embodiments, the heat sink comprises: at least one heat-conducting connecting piece, the fins of the heat sink are connected through the heat-conducting connecting piece.

[0013] In some embodiments, the heat-conducting connecting piece has a heat conductivity of 395-400.

[0014] In some embodiments, the first circuit board has a plurality of heat generating elements on a surface close to the heat dissipation module, the heat generating elements are electrically connected to the first circuit board through a plurality of pins, the plurality of pins are arranged in a straight line on a target surface of the heat generating elements, the target surface being a surface perpendicular to the first circuit board, and the straight line formed by the plurality of pins on the target surface is parallel to the first circuit board.

[0015] In some embodiments, one of the heat sinks is connected to at least one of the heat generating elements through a third connector.

[0016] In some embodiments, the first circuit board, the heat dissipation module and the inductor module have at least partial overlap in the orthographic projection on the surface of the second structure part away from the first structure part, and the second circuit board and the third circuit board have at least partial overlap in the orthographic projection on the surface of the second structure part away from the first structure part.

[0017] According to some embodiments of the present application, another aspect of the embodiments of the present application provides an energy storage system, comprising any of the energy storage converters.

[0018] According to some embodiments of the present application, another aspect of the embodiments of the present application provides a power utilization device, comprising any of the energy storage converters.

[0019] The technical solutions provided by the embodiments of the present application have at least the following advantages: by changing the layout of the circuit boards in the energy storage converter, the current flows from the bottom to the top through the right first circuit board and the second circuit board, and then from the top to the bottom through the left third circuit board and the inductor, so that the current flow path is the shortest, the circuit and power consumption are reduced, and the electromagnetic interference is minimized. The problems of long and complex current flow path, large resistance, large power consumption and large electromagnetic interference in the existing energy storage converter are solved. BRIEF DESCRIPTION OF DRAWINGS

[0020] One or more embodiments are exemplarily illustrated by the drawings in the corresponding drawings, and the exemplarily illustrations do not constitute a limitation on the embodiments, unless specifically stated. The drawings in the drawings do not constitute a proportional limitation; in order to more clearly illustrate the technical solutions in the embodiments or the prior art, the drawings needed in the embodiments will be briefly introduced below, and obviously, the drawings in the following description can also be used to obtain other drawings without creative labor for those skilled in the art.

[0021] Figure 1 A structural schematic diagram of an energy storage converter provided according to the prior art is shown;

[0022] Figure 2 A structural schematic diagram of an energy storage converter provided according to the embodiments of the present application is shown;

[0023] Figure 3 A practical structural schematic diagram of an energy storage converter provided according to the embodiments of the present application is shown;

[0024] Figure 4A structural schematic diagram of a slide rail mechanism and an airflow generating device in an energy storage converter is shown according to an embodiment of the present application.

[0025] Figure 5 A structural schematic diagram of a baffle in an energy storage converter is shown according to an embodiment of the present application.

[0026] Figure 6 A partial structural schematic diagram of an energy storage converter is shown according to an embodiment of the present application.

[0027] Figure 7 A positional relationship schematic diagram of a partition plate and a heat dissipation module in an energy storage converter is shown according to an embodiment of the present application.

[0028] Figure 8 A structural schematic diagram of a heat dissipation device is shown according to an embodiment of the present application.

[0029] Figure 9 A structural schematic diagram of a first circuit board is shown according to an embodiment of the present application.

[0030] Figure 10 A connection structural schematic diagram of a heat dissipation device and a heat generating element is shown according to an embodiment of the present application.

[0031] Figure 11 A positional relationship schematic diagram of a heat dissipation device and a heat generating element is shown according to an embodiment of the present application.

[0032] Figure 12 A positional relationship schematic diagram of various components in an energy storage converter is shown according to an embodiment of the present application.

[0033] Figure 13 A positional relationship schematic diagram of various components in another energy storage converter is shown according to an embodiment of the present application.

[0034] Among the above drawings, the following reference signs are included:

[0035] 01, box body; 10, first structure part; 11, first circuit board; 111, heat generating element; 112, third connector; 12, heat dissipation module; 121, heat dissipation device; 122, second connector; 123, heat conduction connecting piece; 13, second circuit board; 14, airflow generating device; 141, first airflow generating device; 142, second airflow generating device; 20, second structure part; 21, inductance module; 22, third circuit board; 30, slide rail mechanism; 40, baffle; 50, partition plate. DETAILED DESCRIPTION

[0036] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise explicitly specified and limited.

[0037] Reference herein to "embodiments" means that the particular features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of the present application. The appearance of this phrase in various places in the specification does not necessarily all refer to the same embodiment, nor is it necessarily a separate or alternative embodiment to other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0038] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B, which can mean: A exists, A and B exist, and B exists. In addition, the character " / " herein generally represents that the front and rear associated objects are in an "or" relationship.

[0039] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two), and similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0040] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the embodiments of the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the embodiments of the present application.

[0041] In the description of the embodiments of the present application, unless otherwise explicitly specified and limited, the technical terms "mounting", "connecting", "connecting", "fixing" and the like should be understood in a broad sense, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0042] In the drawings corresponding to the embodiments of the present application, the thickness and area of the layers are exaggerated for better understanding and ease of description. When describing that a component (such as a layer, a film, a region, or a substrate) is on or on the surface of another component, the component can be "directly" on the surface of the other component, or a third component can exist between the two components. On the contrary, when describing that a component is on the surface of another component or a component surface is formed or provided with another component, it means that there is no third component between the two components. In addition, when describing that a component is "approximately" formed on another component, it means that the component is not formed on the entire surface (or front surface) of the other component, nor is it formed on a part of the edge of the entire surface.

[0043] In the description of the embodiments of the present application, when a certain component "includes" another component, unless otherwise specified, other components are not excluded, and other components can also be further included. In addition, when a layer, a film, a region, or a plate, etc. component is referred to as "on / over" another component, it can be "directly on" another component (i.e. between the surface of another component and another component, there is no other component), or another component can exist therebetween. In addition, when a layer, a film, a region, a plate, etc. component is "directly on" another component, or when a layer, a film, a region, a plate, etc. component is on the surface of another component, it means that there is no other component therebetween.

[0044] The terms used in the description of various described embodiments herein are only used to describe specific embodiments, and are not intended to be limiting. As used in the description of various described embodiments and the appended claims, "the part" is also intended to include the plural form, unless the context clearly indicates otherwise. Among them, the components include layers, films, regions, or plates, etc.

[0045] As Figure 1 As shown in the background art, in the prior art energy storage converter, the power circuit board (i.e. the first circuit board 11) is installed in a relatively upper position, i.e. the power circuit board below can be installed with inductance modules and sampling modules, etc. And the current flow in the energy storage converter is sequentially through the power circuit board, the DC connection board, the sampling capacitor and the inductance. Based on the functional structure limitation of the energy storage converter, the DC connection board needs to be installed above the power circuit board, if the sampling capacitor and the inductance are installed below the power circuit board, then the current flow will first flow through the DC connection board above from the middle power circuit board, and then flow downward through the capacitor and the inductance. In this way, the path of the current will be long and complex. This long path design has the following key problems:

[0046] 1. Increased energy loss: Due to the presence of numerous connectors, wires, and circuit boards in the current path, these elements constitute additional resistance. According to Ohm's Law (V=IR), heat is generated when current flows through these resistors, causing energy to dissipate as heat. This increases the converter's total power consumption and reduces conversion efficiency.

[0047] 2. Electromagnetic Interference (EMI): Long current paths are more prone to EMI under high-frequency operating conditions. This is because high-frequency currents generate varying electromagnetic fields around conductors, which can interact with signal lines in control circuits, leading to signal quality degradation. In extreme cases, EMI can interfere with the normal operation of control circuits and even cause system failures, affecting the stability and reliability of the entire energy storage system.

[0048] To address the problems of long and complex current flow paths in existing energy storage converters, which lead to high resistance, high power consumption, and high electromagnetic interference, this application provides an energy storage converter, an energy storage system, and an electrical device.

[0049] The embodiments of this application will now be described in detail with reference to the accompanying drawings. However, those skilled in the art will understand that many technical details have been provided in the embodiments of this application to facilitate a better understanding of the application. However, the technical solutions claimed in this application can be implemented even without these technical details and various variations and modifications based on the following embodiments.

[0050] This embodiment provides an energy storage converter. Figure 2 This is a schematic diagram of the structure of an energy storage converter according to an embodiment of this application. Figure 2 As shown, the energy storage converter includes: a first structural part 10 and a second structural part 20 adjacent to each other in a predetermined direction. The first structural part 10 includes a first circuit board 11, a heat dissipation module 12 and a second circuit board 13 distributed sequentially from bottom to top. The first circuit board 11 includes a power control module and a power conversion module of the inverter circuit. The second circuit board 13 includes a DC voltage regulation module. The second structural part 20 includes an inductor module 21 and a third circuit board 22 distributed sequentially from bottom to top. The third circuit board 22 includes a sampling module. The predetermined direction is perpendicular to the thickness direction of the first circuit board 11. The current in the energy storage converter flows sequentially through the first circuit board 11, the second circuit board 13, the third circuit board 22 and the inductor module 21.

[0051] The first circuit board is a power circuit board, the second circuit board is a DC connection board, and the third circuit board is a capacitor board. The predetermined direction is the length direction of the horizontal energy storage converter. In the energy storage converter, the power circuit board, the DC connection board, the heat dissipation module, the sampling capacitor, and the inductor cooperate with each other to ensure the efficiency, stability, and safety of energy conversion in the energy storage system.

[0052] The power circuit board is the core component of the energy storage converter (PCS), which contains power electronic devices such as IGBT (Insulated Gate Bipolar Transistor), MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), and related control and protection circuits. These electronic devices are responsible for converting electrical energy, i.e., converting electrical energy from one form to another in DC-AC (Direct Current to Alternating Current) or AC-DC (Alternating Current to Direct Current) mode. The power circuit board carries the power control module and power conversion module of the inverter circuit. The power control module is responsible for regulating the power output of the converter to ensure that it can respond to changes in load demand; the power conversion module converts DC power to AC power or vice versa.

[0053] The main function of the power circuit board is power conversion, which can quickly and efficiently complete the conversion of electrical energy form according to the needs of the energy storage system. The control circuit ensures the accuracy and stability of the conversion process, and the protection circuit protects the devices from damage in abnormal conditions such as overload and short circuit, ensuring system safety.

[0054] The heat dissipation module is located above the first circuit board and directly contacts the circuit board, used to absorb and dissipate the heat generated by the first circuit board during operation.

[0055] The DC connection board, also known as the DC bus board or busbar, is an intermediate link for connecting the DC input source of the PCS and the power circuit board. It is usually made of high-conductivity materials such as copper, used for efficient transmission of DC current. The DC connection board contains a DC voltage regulation module. The function of this module is to adjust the DC voltage output from the power circuit board to ensure that it meets the requirements of the subsequent circuit or load. The reasonable layout of the DC connection board helps to reduce energy consumption during voltage regulation. The role of the DC connection board is to transmit electrical energy from energy storage batteries or other DC power sources to the power circuit board without loss or with low loss, providing stable DC power input for subsequent power conversion. In addition, it also serves as a convergence point for multiple DC power sources, facilitating system expansion and maintenance.

[0056] The sampling capacitor is usually used in the signal sampling circuit of the energy storage converter and is an electronic component used to store charge. It can temporarily store charge in the circuit and then release it, playing a role in smoothing voltage, filtering, and energy storage. In the PCS, the sampling capacitor is used in the voltage and current sampling circuit to accurately measure and monitor the input and output voltage, current, and other parameters of the inverter.

[0057] Inductors are passive electronic components that can store magnetic field energy, commonly used for filtering, energy storage, and impedance matching, etc. In energy storage inverters, inductors often appear in the form of filter inductors, which are used to smooth the current, reduce the high-frequency components in the current, and improve the quality of electrical energy. The main functions of inductors in PCS are filtering and energy storage. During the conversion process, inductors can smooth the pulse current generated by the power circuit board, reduce the harmonics in the output current, and improve the purity of electrical energy. In addition, inductors can also store a part of the energy to provide or absorb energy when the instantaneous power demand changes, which helps to stabilize the working state of the system.

[0058] As shown in Figure 2 , the current in the energy storage inverter first flows through the power control and conversion module of the first circuit board 11, then is cooled by the heat dissipation module 12, then reaches the DC voltage regulation module of the second circuit board 13, then flows to the sampling module of the third circuit board 22, and finally is filtered and stored by the inductor module 21. Compared with traditional designs, the present embodiment optimizes the layout of the circuit boards, reduces the length of the current transmission path, and thus reduces the energy loss during current transmission, improving the conversion efficiency of the PCS. The heat dissipation module 12 is directly installed above the first circuit board 11 that generates heat, which can more quickly and effectively absorb heat. At the same time, due to the optimization of the overall layout, the heat dissipation effect of the heat dissipation module 12 is enhanced, which helps to prolong the service life of the equipment. By reasonably planning the relative positions of the circuit boards, the length of the signal lines in the current path is reduced, thereby reducing the generation of EMI under high-frequency operating conditions, ensuring the stability of the control circuit and the signal quality, and improving the overall reliability of the system. The use of vertical layout saves horizontal space, making the overall chassis size smaller, not only improving the energy density, but also reducing the material and manufacturing costs, especially considering that the chassis material is aluminum-zinc coated sheet, the reduction in size is more significant in terms of cost savings.

[0059] The above embodiment changes the layout of each circuit board in the energy storage inverter, so that the current flows from the first circuit board on the right, then from the second circuit board on the right, and then from the third circuit board on the left and the inductor from top to bottom. This can make the current flow path the shortest, reduce the circuit and power consumption, and minimize electromagnetic interference. It solves the problem of long and complex current flow path in existing energy storage inverters, which results in large resistance, large power consumption, and large electromagnetic interference.

[0060] In some embodiments, as shown in Figure 3As shown, the first structure part further comprises an airflow generating device 14, which is located on at least one side of the heat dissipation module 12, the side being a surface other than the first surface of the heat dissipation module 12 and the second surface of the heat dissipation module 12, the first surface being a surface opposite to the first circuit board 11, and the second surface being a surface opposite to the second circuit board 13.

[0061] The airflow generating device can be a fan. Since the heat dissipation module is located between the first circuit board and the second circuit board, if the fan is installed above or below, it will be blocked by the first circuit board and the second circuit board, and the airflow blown by the fan will be directly blocked by the circuit board and cannot be conducted to the heat dissipation module, so the heat dissipation module cannot be effectively cooled.

[0062] Installing the airflow generating device on the side can more effectively and accurately cool the heat dissipation module. By concentrating airflow in the heat dissipation channel, the heat exchange speed can be significantly improved, ensuring that power electronic devices such as IGBTs are at the optimal operating temperature and reducing the risk of thermal failure. This layout reduces the direct thermal impact of the airflow generating device on the first circuit board and the second circuit board, and also helps to reduce EMI, especially for circuit parts that are sensitive to temperature and electromagnetic environment, such as voltage regulation modules and sampling circuits. This helps to maintain the stability of the circuit, reduces signal distortion, and improves conversion efficiency. By placing the airflow generating device on the side rather than the top or bottom, it can better utilize the vertical space, helping to reduce the overall size of the cabinet, increase the energy density, and provide more flexibility for the placement of other components such as inductors and sampling capacitors. By positioning the airflow generating device on the side of the heat dissipation module, the heat dissipation management is significantly enhanced, while reducing the adverse effects on the circuit board, optimizing the spatial layout of the device and the maintenance convenience, and ultimately improving the conversion efficiency, reliability and cost-effectiveness of the energy storage converter.

[0063] According to the performance and design of the energy storage converter, the airflow generating device can be installed on at least one side of the heat dissipation module, i.e. it can be installed on only one side of the heat dissipation module, or on all four sides, or on only two sides. The number of airflow generating devices installed on one side can also be adaptively selected, i.e. one or more, but subject to the size limitations of the energy storage converter, for example: the length of all fans installed on one side cannot exceed the length of the heat dissipation module on that side.

[0064] Preferably, as Figure 3As shown, the airflow generating device 14 includes a first airflow generating device 141 located on a first side of the heat dissipation module 12, the first side being a side surface of the heat dissipation module 12 close to the inductor module 21; and a second airflow generating device 142 located on a second side of the heat dissipation module 12, the first side and the second side being opposite surfaces, the airflow direction generated by the first airflow generating device 141 and the airflow direction generated by the second airflow generating device 142 are both first airflow directions, the first airflow directions being directions from the heat dissipation module 12 to the inductor module 21.

[0065] The first airflow generating device and the second airflow generating device can both be fans. In a power conversion system (PCS), the inductor also needs to be cooled, because the inductor generates heat when working. The function of the inductor is to store energy in the circuit, smooth the current, and filter electromagnetic interference (EMI) in the process of electric energy conversion. However, the realization of these functions is accompanied by energy loss, mainly in the form of heat loss.

[0066] In the design of a power conversion system, in order to realize miniaturization design and reduce the volume of the power conversion system and save space, it is necessary to reduce the redundancy of devices as much as possible. Therefore, a device layout that can cool both the power circuit board and the inductor is designed. On the basis of this design, the first airflow generating device is placed between the heat dissipation module and the inductor module, and the second airflow generating device is placed on the side of the heat dissipation module opposite the first airflow generating device, which can satisfy the heat dissipation of both the heat dissipation module and the inductor module.

[0067] In addition, the first airflow generating device 141 and the second airflow generating device 142 are arranged in a symmetrical or asymmetrical configuration, the purpose of which is to guide the heat dissipated from the heat dissipation module 12 to the vicinity of the inductor module 21. This configuration not only enhances the cooling effect of the heat dissipation module 12, but also benefits the heat dissipation of the inductor module 21, because the inductor module 21 also generates considerable heat when working at high frequency. When designing, internal air ducts can be established to ensure that the airflow flows along the set path, avoiding dead angles or turbulent airflow, and improving the thermal management efficiency of the entire device. Considering the noise problem of the airflow generating device when it is running, soundproofing materials or low-noise fans can be added to the design to reduce the acoustic impact of the device when it is running.

[0068] The bi-directional air flow design can significantly improve the heat dissipation effect of the heat dissipation module 12, while taking into account the cooling needs of the inductor module 21. The directional flow of air ensures that heat can be quickly transferred from the key heat generating parts (mainly the power circuit board where the IGBTs are located) to the outside of the device, avoiding local overheating and improving the reliability and safety of the device. By setting air flow generating devices on both sides of the heat dissipation module 12, a smoother air flow channel can be created, reducing air resistance. This means that even at the same fan speed, the cooling efficiency can be improved, resulting in better heat dissipation without increasing energy consumption. Such a design allows for more compact space planning, combining the air flow generating device with the heat dissipation module and the inductor module, rather than occupying additional volume. This helps to improve the energy density of the device, allowing the same capacity of PCS to be implemented in a smaller volume, which is beneficial for the miniaturization of the device and flexible deployment on site. By optimizing the layout of the air flow generating device, the electromagnetic influence on sensitive elements on the circuit board is reduced, especially on the sampling module and control circuit of the first circuit board 11 and the second circuit board 13, which helps to maintain the integrity of the system signal.

[0069] In addition, the heat dissipation module can be a heat sink, and the first air flow generating device and the second air flow generating device are installed on the base of the heat sink through a screw connection structure.

[0070] In some embodiments, as shown in Figure 4 As shown in FIG. 1, the energy storage converter further includes a box body 01, and the first structure and the second structure are located in the box body 01. The air flow generating device 14 is movably installed on the box body 01 through a sliding rail mechanism 30.

[0071] In the design of the energy storage converter, the box body 01 not only accommodates the first structure (mainly including the power circuit board and the heat dissipation module) and the second structure (such as the inductor module), but also innovatively uses the sliding rail mechanism 30, so that the air flow generating device 14 (usually a fan or a blower) can be movably installed. Specifically, the air flow generating device 14 is installed on the box body 01 through the sliding rail mechanism 30, which can be easily pulled out and pushed in without disassembling the box body 01, providing great convenience for maintenance and cleaning.

[0072] The slide rail mechanism 30 can be a sliding guide rail that ensures the airflow generating device 14 can move smoothly and without resistance inside the cabinet 01. The slide rail can be linear or curved to adapt to the shape of the cabinet, to accommodate different cabinet designs. The airflow generating device 14 is designed to be detachable, and can be easily pulled out or pushed back through the slide rail mechanism 30, which not only facilitates the cleaning of dust accumulated on the fan blades or heat sinks, but also facilitates the replacement of damaged airflow generating devices without disassembling the entire cabinet. The cabinet 01 is designed with a special maintenance channel inside to ensure that the airflow generating device 14 does not interfere with other components when sliding, and also facilitates maintenance operations for maintenance personnel.

[0073] The slide rail-mounted airflow generating device 14 greatly simplifies the maintenance process. Maintenance personnel can directly pull out the airflow generating device for cleaning or inspection without disassembling the entire cabinet, reducing maintenance difficulty and time cost, and improving the maintainability and service life of the equipment. With the movable airflow generating device, the cooling strategy can be adjusted more flexibly. For example, when the PCS is in high-load operation, the fan can be pushed closer to the heat dissipation module to enhance the cooling effect; when the device is in low-load or standby state, the fan can be appropriately moved away to reduce unnecessary energy consumption. Through the movable design of the slide rail mechanism 30, the installation and maintenance of the airflow generating device 14 can be more safe and efficient, reducing equipment failures caused by improper maintenance or insufficient cooling, and improving the overall safety and reliability of the system. The design of the slide rail movable airflow generating device not only improves the maintenance convenience and cooling efficiency of the energy storage converter, but also optimizes the space layout and enhances the EMI management capability of the equipment, thereby improving the safety, reliability and economy of the PCS as a whole.

[0074] In some embodiments, the slide rail mechanism includes at least one pair of first and second slide rails (not shown in the figure) that cooperate with each other. The first slide rail is fixed to the inner wall of the cabinet, and the second slide rail is fixed to the airflow generating device. The airflow generating device moves along a predetermined track under the guidance of the first and second slide rails.

[0075] In some specific embodiments of the energy storage converter, the slide rail mechanism is designed as at least one pair of first and second slide rails. The first slide rail is fixed to the inner wall of the cabinet, and the second slide rail is installed on the airflow generating device, ensuring that the airflow generating device can stably and smoothly move along a predetermined track inside the cabinet. This design not only provides maintenance convenience, but also optimizes the positioning and operating efficiency of the airflow generating device.

[0076] The first and second sliding rails can be made of metal materials such as aluminum or steel to ensure sufficient strength and durability. The surface of the sliding rails should be specially treated, such as plating or lubrication, to reduce friction and ensure smooth sliding. The preset track should take into account the layout of the heat dissipation module and the inductor module to ensure that the airflow generating device can most effectively cover the main heating area during the push-pull movement, while avoiding collision or interference with other internal components. The first sliding rail is fixed to the inner wall of the box by screws or welding, while the second sliding rail is installed on the frame of the airflow generating device by appropriate fixing parts such as clamps or screws, ensuring the stability of the structure and the safety of operation.

[0077] The double-rail sliding design allows the airflow generating device to move in the box without the need to disassemble the box or the airflow generating device, greatly simplifying the cleaning and inspection process, reducing maintenance costs and time. Moreover, the pull-out design of the airflow generating device facilitates regular cleaning and replacement, reducing the impact of dust accumulation and equipment aging, thereby extending the service life of the entire energy storage converter and reducing maintenance costs. The design of the sliding rail mechanism allows the airflow generating device to be moved to the edge of the box when not in use, freeing up space for other equipment or components. This flexibility helps to optimize the internal layout of the box and improve energy density.

[0078] In some embodiments, as shown in FIG. 1, the energy storage converter further comprises a bracket (not shown in the figure) mounted on the box 01 through a first adapter, and a baffle 40 installed on the second side of the airflow generating device, the first side and the second side being opposite sides. Figure 5 In some embodiments, the energy storage converter not only includes a sliding rail mechanism to achieve movable installation of the airflow generating device, but also additionally designs a bracket and a baffle 40 to further optimize the positioning and airflow management of the airflow generating device. Specifically, the bracket is mounted on the box 01 through a first adapter and is located on the first side of the airflow generating device to provide support and positioning. The baffle 40 is installed on the second side (opposite the first side) of the airflow generating device to guide airflow and prevent it from spreading disorderly, ensuring that the airflow can effectively focus on the key areas that need to be cooled.

[0079] The bracket can be an L-shaped or U-shaped structure fixed to the inner wall of the box 01 through a first adapter such as a clamping slot, screw fixation, or magnetic attraction. The bracket on the first side not only provides physical support to keep the airflow generating device stable during sliding, but also serves as a mobile stopper to ensure that the device does not exceed the preset track.

[0080]

[0081] ​The baffle 40 is located on the second side of the airflow generating device and can be a flat baffle or a complex structure with flow guide grooves, used to guide the airflow towards specific directions such as the heat dissipation module or the inductor module. The opening size and shape of the baffle 40 can be optimized according to the actual heat management needs.

[0082] In combination with the layout of the bracket and the baffle 40, the airflow path can be precisely planned to ensure that the airflow not only covers the entire heat dissipation module but also avoids directly impacting sensitive circuit elements, reducing EMI (Electromagnetic Interference) problems caused by airflow. The installation of the bracket and the baffle 40 should be designed to be easily disassembled, which not only simplifies the maintenance process of the airflow generating device, but also facilitates the adjustment of the airflow path to adapt to the heat dissipation needs under different working conditions.

[0083] The addition of the baffle 40 can precisely control the direction of the airflow generated by the airflow generating device, ensuring that the airflow can effectively focus on key areas such as the heat dissipation module and the inductor module, improving cooling efficiency and reducing the risk of local overheating. The bracket not only provides physical support for the airflow generating device, but also limits its movement range, avoiding possible vibration or displacement of the equipment under the action of high-speed airflow, enhancing the overall stability and reliability of the system. The detachable bracket and baffle 40 design allows for quick replacement or cleaning without the need to completely disassemble the box or the airflow generating device itself, reducing maintenance time and cost, and also prolonging the life cycle of the equipment. The bracket and baffle 40 not only serve airflow management, but also can undertake other functions, such as the bracket can be part of the wiring slot, and the baffle 40 can be integrated as part of the EMI shield, further optimizing the space layout inside the box and the multifunctionality of the equipment. Since the positions of the baffle 40 and the bracket can be fine-tuned according to specific needs, this design enhances the adaptability of the energy storage converter to different working environments and conditions, allowing the equipment to maintain optimal cooling status in different scenarios.

[0084] The design of the flow guide grooves on the baffle is mainly used to guide and optimize the airflow path, ensuring that the airflow can cover and cool the key heat generating areas of the energy storage converter, such as IGBTs, capacitors and other power electronic components, in the most effective way. The structural design of the flow guide grooves not only affects the direction of the airflow, but also has an important impact on the cooling efficiency, noise level and overall aerodynamic performance of the equipment.

[0085] The shape of the flow guide grooves can be linear, wavy, S-shaped or more complex geometric shapes, depending on the layout of the target airflow area. In terms of size, the width and height of the flow guide grooves should be moderate, ensuring that they can guide sufficient airflow without excessively hindering the airflow, causing pressure loss and noise increase.

[0086] The angle of the flow guide slots is critical. Generally, the inlet and outlet angles of the flow guide slots should match the airflow direction of the airflow generating device to reduce energy loss when the airflow enters and exits the flow guide slots. In addition, by adjusting the angle of the flow guide slots, the direction of the airflow can be precisely controlled to blow more concentratedly to the designated heat dissipation area.

[0087] The number and layout of the flow guide slots on the baffle need to be optimized according to the heat distribution characteristics of the internal components of the device. Near the hot spot area, more flow guide slots can be designed to achieve more efficient point-to-point cooling; while in the non-hot spot area, the number of flow guide slots can be reduced so that the airflow can flow more naturally, reducing unnecessary turbulence.

[0088] The material selection of the flow guide slots should consider its resistance to airflow and durability. Generally, lightweight and high-strength alloy materials such as aluminum alloy are used, combined with smooth processing and rust-proof coating, to reduce airflow friction and extend service life.

[0089] The flow guide slots can guide the airflow directly to the heat sink, reducing the ineffective circulation and leakage of the airflow, significantly improving the heat dissipation efficiency, and helping the device to operate stably under high load. Optimized airflow path reduces turbulence and airflow impact, reducing noise and vibration during device operation, providing a quieter and more stable operating environment. The presence of the flow guide slots does not affect the regular maintenance of the device, and the adjustable design can also help maintenance personnel better control the airflow direction during cleaning or inspection, avoiding dust from entering areas where airflow is not desired. The dynamically adjustable flow guide slot design can adapt to changes in the working environment, whether it is fluctuations in thermal load or the need for airflow direction, and can respond in real time to provide the best cooling effect.

[0090] In some embodiments, the opening and closing or shape of the flow guide slots can be adjusted in real time through electromechanical structures to respond to different working loads and environmental conditions, further optimizing the heat dissipation effect.

[0091] In a typical energy storage converter box design, the flow guide slots on the baffle are designed as straight lines, with the inlet angle slightly downward and the outlet angle upward, so that the airflow can rise vertically along the heat sink, avoiding direct impact on the inductor module, thereby reducing electromagnetic interference. This design is suitable for cases where IGBTs and heat sinks are located in the same vertical plane.

[0092] In other embodiments, the flow guide slots are S-shaped, and the S-shaped flow guide slot design is suitable for cases where airflow needs to be guided in more complex environments. For example, when the airflow needs to bypass obstacles in the box, such as capacitor modules or other electronic components, S-shaped flow guide slots can ensure smooth turning of the airflow while maintaining sufficient speed and direction stability, effectively covering the heat dissipation area.

[0093] In other embodiments, the flow guide slots can be designed to be adjustable, where the shape or opening degree of the flow guide slots can be adjusted by external control (such as electric motors or air pressure devices). In high-load working mode, the flow guide slots will automatically open or adjust to a state more suitable for high-speed airflow passing through. In low-load or standby mode, the flow guide slots can be closed or adjusted to a more energy-saving form, reducing unnecessary airflow consumption and noise.

[0094] Inside the energy storage converter, multiple high-precision temperature sensors should be placed around the key heat-generating components such as IGBTs and capacitors. These sensors can be thermocouples, thermistors, or infrared temperature sensors, used to monitor the temperature of these components in real time. After the temperature data is collected by the sensors, it is transmitted to the main control unit through internal buses or wireless methods. The main control unit includes a microprocessor and a storage unit, which is used to store and process temperature data to determine whether to adjust the flow guide slots to optimize heat dissipation. The adjustment of the flow guide slots is usually realized through electric actuators, which can be stepper motors or servo motors, adjusting the opening degree or direction of the flow guide slots according to the instructions of the main control unit.

[0095] When the temperature of IGBTs or capacitors exceeds the preset threshold, the main control unit automatically triggers the electric actuators to adjust the angle or opening degree of the flow guide slots to direct more airflow directly to the overheated components to speed up heat dissipation. For example: when the temperature monitoring system detects that the temperature of IGBTs rises to 80℃, the main control unit calculates the required airflow increase through a preset algorithm. The main control unit sends instructions to the electric actuators, instructing them to adjust the opening degree of the flow guide slots closest to the IGBTs to the maximum, while adjusting the direction of the flow guide slots to directly point to the IGBTs. As the temperature decreases, the opening degree and direction of the flow guide slots will automatically return to the normal state to balance heat dissipation and energy consumption.

[0096] The inside of the energy storage converter can be divided into multiple temperature monitoring areas, and the angle and opening degree of the flow guide slots in each area are independently adjusted to respond to the temperature changes in each area. For example: when the temperature sensor detects that the temperature of the capacitor area is higher than 75℃, the main control unit starts the flow guide slot adjustment algorithm for that area. The electric actuators adjust the angle of the corresponding flow guide slots to align with the capacitors, while increasing the opening degree of the flow guide slots to direct a large flow of air directly to cool the capacitors. At the same time, if the temperature of the IGBTs area is low, the flow guide slots can be adjusted to a smaller opening degree to reduce unnecessary airflow, thereby saving energy.

[0097] Alternatively, by analyzing the temperature gradient in the IGBTs and capacitor areas, the direction and opening of the flow channels can be intelligently adjusted to achieve a balanced temperature distribution. For example, temperature sensors continuously monitor the temperature in each area, the main control unit analyzes the temperature distribution, and identifies areas with higher temperatures. The main control unit calculates the required airflow for each area and adjusts the flow channels via electric actuators, guiding the airflow to preferentially pass through the higher-temperature areas. As the temperature distribution tends to be balanced, the angle and opening of the flow channels are adjusted to the system's preset optimal state, achieving the temperature control target of the entire system.

[0098] Intelligent adjustment of the airflow channels enables rapid temperature response and even distribution, effectively preventing localized overheating, reducing thermal stress on IGBTs and capacitors, and extending component lifespan. Dynamically adjusting the airflow channel opening reduces unnecessary airflow, lowering fan or blower energy consumption and improving overall system energy efficiency. Intelligent airflow control reduces unnecessary airflow speed and turbulence, effectively lowering noise levels during equipment operation.

[0099] In some embodiments, such as Figure 6 As shown, the heat dissipation module includes a plurality of heat sinks 121 arranged in a row. The airflow generating device 14 is fixed on the substrate of the first target heat sink and the substrate of the second target heat sink by the second connector 122. The first target heat sink is the row of heat sinks 121 closest to the inductor module, and the second target heat sink is the row of heat sinks 121 furthest from the inductor module.

[0100] Specifically, the heat sink can be a direct-flow heat sink, and the second connector can be a dedicated fixing clamp, screw fastener, or magnetic device. The design must ensure that the airflow generator can be securely fixed to the heat sink substrate, while also allowing for easy disassembly and maintenance when needed. The airflow generator is fixed to the substrates of both the first and second target heat sinks. Its specific location should consider the airflow coverage and intensity to ensure the entire heat dissipation module is uniformly and effectively covered by airflow, while avoiding direct airflow impact on the inductor module to reduce unnecessary noise and electromagnetic interference. The heat sinks can be arranged in multiple rows according to the layout of IGBTs (Insulated Gate Bipolar Transistors) or other major heat-generating components. The design of different rows of heat sinks (such as the shape, size, and density of the heat sink fins) should be optimized based on their relative position to the inductor module to achieve optimal thermal management and airflow guidance. Considering the fixed position of the airflow generator, the internal airflow design of the enclosure needs special planning to ensure smooth airflow from the first target heat sink to the second target heat sink, covering the entire heat dissipation module, while reducing turbulence and dead zones within the enclosure to improve heat dissipation efficiency.

[0101] By fixing the airflow generator to the heat sinks at both ends of the heat dissipation module, uniform airflow distribution across the module is ensured, improving heat exchange efficiency, preventing localized overheating, extending equipment lifespan, and enhancing performance stability. Optimized placement of the airflow generator also helps reduce noise generated by airflow impacting the inductor module and other sensitive components, providing a quieter operating environment, especially in applications requiring low noise. The design of the second connector simplifies the assembly and disassembly of the airflow generator, eliminating the need to disassemble the entire enclosure for maintenance, saving time and costs, and facilitating quick inspection and replacement. This design allows for more compact integration of the airflow generator and heat sink, contributing to a smaller overall equipment size, optimizing internal space layout, and increasing energy density, enabling higher power conversion within a limited space.

[0102] In addition, such as Figure 7 As shown, some embodiments also include baffles 50 on both sides of the radiator. The baffles can enclose or semi-enclose the spaces on both sides of the radiator, forming directional airflow channels. This design guides airflow more directly and concentratedly towards the radiator, preventing aimless diffusion of airflow within the enclosure, thereby improving heat dissipation efficiency. In the radiator layout, the baffles on both sides form an airflow channel with the radiator, ensuring that the airflow generated by the fan is directly aimed at the radiator, reducing airflow detours and turbulence, and enhancing heat dissipation. The baffles prevent hot air emitted by the radiator from re-entering the air intake, forming hot air circulation and reducing heat dissipation performance. The baffles help ensure unidirectional airflow, i.e., hot air is exhausted and cold air enters, forming effective heat exchange. The distance between the baffle and the radiator should be designed appropriately, neither too tight to obstruct airflow nor too wide to cause hot air backflow. Typically, a slight gap is left between the baffle and the radiator to allow airflow but prevent hot air backflow. The baffles can also act as an acoustic barrier, absorbing or reflecting noise generated by the fan, reducing the overall noise level of the equipment. Installing thick baffles on both sides of the heat sink, with sound-absorbing materials (such as sound-absorbing sponge or foam) as the baffle lining, can effectively reduce noise generated during fan operation. The baffles also act as a physical barrier, protecting internal electronic components from external factors (such as dust, moisture, or foreign objects), improving equipment stability and lifespan. The baffles can be designed with micropores or louvers, allowing airflow while effectively blocking external dust and foreign objects from entering, protecting sensitive electronic components. The presence of baffles also enhances the structural stability of the entire enclosure, especially under conditions of high vibration or complex installation environments, helping to reduce structural deformation and vibration transmission. Adding reinforcing ribs or using high-strength materials (such as metal alloys) to the baffle design can significantly improve the structural strength of the baffles, thereby enhancing the overall stability of the enclosure.

[0103] In some embodiments, such asFigure 8 As shown, the heat sink 121 includes at least one thermally conductive connector 123, through which the fins of the heat sink 121 are connected.

[0104] In the design of the heat dissipation module of the energy storage converter, the fins of the heat sink are connected by a thermally conductive connector, aiming to improve the thermal conductivity efficiency and structural stability, while optimizing the layout and airflow management of the heat sink. This design can ensure that heat is quickly and evenly transferred from the heat-generating components to the heat sink, thereby improving the overall heat dissipation performance.

[0105] The thermally conductive connector is made of high thermal conductivity materials such as copper or aluminum, as these materials have excellent thermal conductivity performance. The fins of the heat sink are connected to the heat sink substrate through the thermally conductive connector, which is usually designed as a thin sheet or tube structure with a large contact area to improve the efficiency of the thermal conduction path and the structural rigidity of the heat sink.

[0106] The thermally conductive connector not only enhances thermal conduction, but also strengthens the structural stability of the heat sink, reducing damage caused by long-term operation or vibration. Each fin of the heat sink is connected to the substrate or other fins through the thermally conductive connector, forming a stable thermal conduction network. The thermally conductive connector can be designed with a shape that enhances structural stability, such as reinforcing ribs or a mesh structure, while ensuring sufficient thermal conductivity performance. The entire heat sink module forms a whole through the thermally conductive connector, improving the structural strength of the heat sink and reducing the risk of damage caused by external forces such as vibration.

[0107] The thermally conductive connector made of high thermal conductivity materials can significantly improve the thermal conduction efficiency between the fins of the heat sink and the heat-generating components, allowing heat to be quickly transferred from the heat-generating components to the heat sink, and then dissipated to the environment through airflow. The airflow guide structure on the thermally conductive connector can effectively optimize the airflow path, ensuring that the airflow evenly covers the heat sink, reducing airflow dead zones, and improving cooling efficiency. The integrated thermally conductive connector not only enhances the structural stability of the heat sink, but also prolongs the service life of the heat sink by reducing vibration and improving the thermal cycling capability of the material.

[0108] In some embodiments, as shown in Figure 8 The thermal conductivity of the thermally conductive connector 123 is 395-400.

[0109] When designing the thermally conductive connector, materials with high thermal conductivity (for example, 395-400 W / (m·K)) are particularly selected to achieve high-efficiency thermal conduction performance. Such high-thermal-conductivity materials usually refer to high-purity copper or specially treated aluminum alloys, which can provide an excellent thermal conduction path between the heat source and the heat sink.

[0110] High thermal conductivity materials can quickly conduct heat from heat sources (such as IGBTs or capacitors) to heat sinks, shorten the thermal response time of the heat conduction path, ensure timely heat dissipation, and avoid local overheating. High thermal conductivity materials can promote the uniform distribution of heat on the connecting piece, reduce the thermal resistance between the heat source and the heat sink, and make full use of each part of the heat sink, avoiding the decrease in heat dissipation efficiency caused by uneven heat conduction. Under the same heat sink area and airflow conditions, high thermal conductivity connecting pieces can significantly improve the overall heat dissipation efficiency. This is because heat can be transferred more quickly and evenly to the heat sink surface, and heat can be quickly removed by airflow. High thermal conductivity materials help reduce the temperature gradient between the heat source and the heat sink. This means that a smaller temperature difference can be maintained between the heat source and the heat sink, reducing thermal stress caused by excessive temperature difference and prolonging the service life of the assembly. High thermal conductivity materials maintain good thermal conductivity performance at different environmental temperatures, which means that even in extreme temperature conditions, the heat dissipation system of the energy storage inverter can remain stable, ensuring normal operation of the device.

[0111] Assuming that the IGBTs inside the energy storage inverter are running under high load, a large amount of heat will be generated. By using a thermal conductivity connecting piece with a thermal conductivity of 395-400 W / (m·K) to connect the IGBTs and the heat sink, it can be observed that heat can be quickly conducted from the IGBTs to the heat sink, and even under high load conditions, the temperature of the IGBTs can quickly stabilize within a safe range. The temperature of the heat sink is more uniform, avoiding the occurrence of local hot spots, improving the overall working efficiency of the heat sink. The thermal management system of the entire energy storage inverter responds faster and can better adapt to rapidly changing working conditions, such as sudden load increases or environmental temperature changes.

[0112] Selecting high thermal conductivity materials as the thermal conductivity connecting piece 123 is crucial for improving the thermal management performance of the energy storage inverter. It not only significantly improves the heat conduction efficiency, but also ensures uniform temperature distribution, reduces thermal stress, and prolongs the service life of the device. This design concept reflects a deep understanding of material performance and a pursuit of overall optimization of the heat dissipation system, and is an important part of building high-performance energy storage solutions.

[0113] In some embodiments, as shown in Figure 9 The first circuit board 11 has a plurality of heat generating elements 111 on the surface close to the heat dissipation module. The heat generating elements 111 are electrically connected to the first circuit board 11 through a plurality of pins. The plurality of pins are arranged in a straight line on the target surface of the heat generating elements 111. The target surface is perpendicular to the surface of the first circuit board 11. The straight line formed by the plurality of pins on the target surface is parallel to the first circuit board 11.

[0114] As shown in Figure 9As shown, the heating element is laid flat on the first circuit board, and by laying the heating element flat and welding it above the power circuit board (first circuit board), the pins of the heating element are less likely to be damaged, increasing the reliability of the entire system; and the heat dissipation module is directly installed above the heating element, and after the heating element heats up, the heat spreads upward and is directly dissipated through the heat dissipation module, achieving better heat dissipation.

[0115] If the heating element is installed below the power circuit board, then after the heating element heats up, the heat naturally spreads upward, increasing the temperature of the power circuit board, so the power of the heat dissipation module needs to be set larger to dissipate heat from both the heating element and the power circuit board, and since the heat generated by the heating element spreads upward, and the heat dissipation module is installed below the heating element, the heat dissipation effect of the heat dissipation module will be reduced, and in order to meet the heat dissipation requirements, a larger and more powerful heat dissipation module is needed, which not only occupies a larger space in the system, but also has a larger power loss. That is, the volume and power consumption of the heat dissipation module of the prior art are larger than those of the present embodiment. In the present embodiment, after the heating element heats up, the heat naturally spreads upward and is directly transmitted to the heat dissipation module above. This heat spreading direction conforms to the principle of natural thermodynamics, making the heat dissipation process smoother and more efficient. The heat dissipation module can be more closely attached to the heating element, and a larger contact area, more dense or more efficient heat dissipation fins can be considered in the design to meet the direct heat dissipation requirements.

[0116] Laying the heating element flat and welding it above the power circuit board, and directly installing the heat dissipation module above the heating element not only saves device space, but also saves a welding process, and after the heating element heats up, the heat spreads upward and is directly dissipated through the heat dissipation module, achieving better heat dissipation, solving the problems of complex welding process, low heat dissipation efficiency, and low reliability in the installation of the heating element and the heat dissipation module on the power circuit board in the prior art.

[0117] In some embodiments, as shown in Figure 10 As shown, one of the above heat sinks 121 is connected to at least one of the above heating elements 111 through a third connector 112.

[0118] The third joint, which can be a screw, a clamp, or a spring clip, among other types, not only serves as a robust link between the heat-generating element and the heat dissipation module, but also effectively resists the loosening of the connection caused by vibrations, temperature fluctuations, and external physical impacts, significantly improving the mechanical strength and stability of the energy storage converter system. The precise pressure applied by the third joint ensures a gapless fit between the heat-generating element and the cooling structure, directly reducing the obstacles to heat conduction and achieving efficient heat transfer. With this design, the heat generated by the device during operation can be quickly captured and directed to the cooling device, significantly reducing the surface temperature of the device and effectively extending its service life and overall life cycle.

[0119] Compared with traditional welding or adhesive fixing techniques, the modular installation strategy using the third joint significantly optimizes the assembly and disassembly process of the heat-generating element and the heat dissipation module, providing unprecedented convenience for the maintenance and upgrade of the energy storage system. When any module needs to be replaced due to failure, the third joint makes such operations quick and non-destructive, greatly reducing the maintenance cycle and the cost of maintenance operations. This non-permanent connection method brings higher flexibility and economy to the energy storage system.

[0120] The unique design of the third joint gives it a certain flexibility or adjustment function, allowing it to effectively cope with the thermal expansion and contraction of the heat-generating element and the heat dissipation module under dynamic operating temperatures. This flexibility is particularly crucial in repeated temperature cycles, as it effectively buffers the mechanical stress caused by temperature changes, reducing the likelihood of material wear and structural damage, further consolidating the structural stability of the system and laying a solid foundation for long-term safe operation.

[0121] In summary, the use of the third joint not only strengthens the stable connection between the heat-generating element and the heat dissipation module, significantly improves the thermal management efficiency of the energy storage converter, simplifies the maintenance process of the system, but also effectively alleviates the potential threat of temperature fluctuations to the structural integrity of the system, ensuring the efficient, stable, and durable operation of the energy conversion system. The multifunctionality of this joint plays a crucial role in meeting the complex demands of modern energy storage technology, providing solid technical support for building high-performance and highly reliable energy storage equipment.

[0122] As shown in Figure 9 , the heat-generating elements are arrayed on the first circuit board, and this layout strategy ensures that the projections of each device pin and the cooling device on the horizontal plane have no overlapping areas. This innovation not only maximizes the utilization efficiency of the limited space on the circuit board, but also provides more freedom for other circuit traces and component allocations by preventing the cooling structure from blocking the device pins, thereby promoting the compactness and high-density integration of the circuit board design. As shown in Figure 11As shown, heat-generating elements 111 located in the same row or column share heat dissipation resources, achieving a great simplification of the cooling system structure. Such a design not only reduces the total number of cooling devices required, lowering manufacturing costs, but also reduces the physical burden on the circuit board by reducing the use of connecting devices, improving the overall stability and reliability of the system. The shared heat dissipation module design not only reduces the number of heat sinks but also reduces the installation complexity, making the assembly process more efficient and reducing maintenance costs. The combination of array layout and shared heat dissipation scheme helps to evenly distribute the heat generated by heat-generating elements, preventing local temperature from being too high, which is crucial for maintaining the thermal balance of the power circuit board. Shared heat dissipation resources ensure that each heat-generating element can obtain sufficient cooling, significantly extending the service life of the device and improving the overall thermal management efficiency of the system. The precise matching of heat-generating elements and heat dissipation modules allows heat to be quickly and evenly dispersed, avoiding local overheating and ensuring performance stability and safety during long-term operation.

[0123] The array arrangement and clear projection separation design greatly facilitate maintenance work. Maintenance personnel do not need to worry about the obstruction of cooling devices when checking or replacing heat-generating elements and can directly access each device and its pins, which has immeasurable value in device maintenance and fault location, significantly speeding up repair and reducing equipment downtime. In the design, heat-generating elements and cooling modules use a non-obstructive layout to ensure that the cooling structure does not hinder direct access to the device during maintenance or upgrading, simplifying the maintenance process and improving fault location efficiency.

[0124] The array arrangement of heat-generating elements and shared heat dissipation modules is an innovative breakthrough in the field of modern energy storage converter thermal management and space optimization. It not only achieves efficient space utilization and cost control but also optimizes heat energy distribution, extends device life, and more importantly, greatly improves device maintainability and fault location efficiency, providing strong technical support for improving the overall performance, stability, and economy of energy storage systems.

[0125] Placing the heat dissipation module above the heat-generating element allows for the optional provision of one heat dissipation module for each heat-generating element or the sharing of the same heat dissipation module by a group of heat-generating elements (multiple) or the use of a comprehensive large-area heat dissipation module to uniformly handle the heat dissipation needs of all heat-generating elements. This grouping or unified cooling strategy aims to balance cost and efficiency, implementing shared cooling for heat-generating elements with similar heat generation, which can to some extent control the overall investment in heat dissipation modules and achieve economic optimization through resource sharing.

[0126] When the heat dissipation module is dedicated to a single heat-generating component, this precise one-to-one pairing strategy ensures that the heat dissipation module can closely match the surface of the heat-generating component, creating an efficient heat conduction channel directly through the heat source. By eliminating intermediate links, this direct contact maximizes the resistance in the heat transfer process, accelerates the heat dissipation rate, effectively controls the operating temperature of the heat-generating component, and significantly improves the overall heat dissipation efficiency of the system. Configuring a dedicated heat dissipation module for each heat-generating component not only greatly simplifies the heat management layout of the circuit board, avoiding the common problems of space constraints and uneven heat flow distribution when multiple devices share the same heat dissipation module, but also gives the circuit board design unprecedented freedom and flexibility.

[0127] More importantly, this personalized cooling solution significantly improves the maintenance convenience and modular upgrade potential of the system. Since each heat-generating component and its corresponding heat dissipation module do not interfere with each other, once a failure or maintenance requirement occurs, precise operations can be performed on the affected components without affecting the entire system, greatly reducing the complexity of maintenance, shortening the downtime of the equipment, and facilitating the updating of specific heat-generating components or heat dissipation modules, ensuring that the system can continue to adapt to changing technical and performance requirements.

[0128] In addition, the one-to-one heat dissipation module design also reflects a deep understanding and flexible response to the characteristics of diverse heat-generating components. It allows designers to tailor the most suitable heat dissipation module type and size according to the specific thermal behavior, physical size, and special requirements of the installation location of each heat-generating component. This customized selection not only improves the response speed and cooling accuracy of the system, but also promotes the optimization of the overall system efficiency, making it better adapt to complex circuit architectures and harsh working conditions.

[0129] When the heat dissipation module is dedicated to a single heat-generating component, this one-to-one assembly mode ensures that the heat dissipation module can seamlessly fit the heat-generating component, building a core heat conduction link directly to the heat source. This unique design of direct contact greatly reduces the obstacles in the heat conduction process, accelerates the heat dissipation rhythm, and significantly suppresses the operating temperature of the heat-generating component, enhancing the heat dissipation efficiency and thermal management efficiency of the system. Each heat-generating component is assigned an independent heat dissipation module, which not only cleverly simplifies the thermal design complexity of the circuit board layout and optimizes the layout, but also avoids the common problems of space constraints and uneven heat energy distribution when multiple devices share the same heat dissipation module.

[0130] Moreover, this exclusive cooling solution demonstrates superior advantages in maintenance and upgrading. Since each heat-generating component and its corresponding heat dissipation module are independent of each other, when a device or its heat dissipation module encounters a failure or needs regular inspection, local and precise intervention measures can be implemented, avoiding the potential risk of chain reactions and ensuring the continuous operation of the remaining components. This targeted maintenance not only greatly saves the time and effort required for repair, but also significantly improves the modular upgrade capability and the convenience of daily maintenance of the overall equipment, laying a solid foundation for the long-term stable operation of the system.

[0131] In addition, the one-to-one heat dissipation module configuration reflects a design concept that carefully considers the thermal properties, physical form, and installation environment of individual heat-generating components. It authorizes designers to carefully select the best heat dissipation module type and parameters that match each heat-generating component's unique thermal characteristics, size specifications, and specific location on the circuit board. This highly customized selection not only promotes the refinement and personalization of heat management but also effectively drives the improvement of the overall system performance, enabling it to comfortably handle the diverse thermal management challenges in complex circuit architectures and achieving the perfect fusion of system efficiency and circuit design needs.

[0132] In summary, this one-to-one heat dissipation module assembly scheme, with its efficient heat conduction, simple layout optimization, precise maintenance strategy, and highly personalized selection mechanism, brings unprecedented breakthroughs in thermal management for high-power electronic devices such as energy storage converters, and is a powerful guarantee for improving system operation stability, optimizing circuit design, and promoting long-term development of equipment.

[0133] Moreover, this one heat dissipation module to one heat-generating component arrangement allows for more flexible placement of heat-generating components on the power circuit board. This design allows each heat-generating component to be customized with the most suitable cooling solution based on its power level and thermal characteristics. For example, high-power IGBTs may require larger first connectors and more effective heat dissipation modules, while low-power devices can use smaller connectors and heat dissipation modules, enabling flexible configuration and optimization of the system.

[0134] Choosing a large heat dissipation module that covers the entire domain, although the initial investment may be larger, in the long run, this integrated solution not only saves valuable circuit board space, making the layout more refined, but also exhibits economies of scale during production and installation. Batch manufacturing and deployment of large heat dissipation modules are often more cost-effective than installing multiple small devices. It reduces the fragmentation of material procurement and redundant steps in the manufacturing process, reducing overall material and labor consumption.

[0135] However, integrated large-scale heat dissipation modules also present new engineering challenges, primarily due to significantly increased requirements for stability and structural support. Given their considerable size and the weight they bear, the circuit board design must incorporate additional structural reinforcement elements, such as adding support points or using high-strength fixing components, to ensure the heat dissipation module remains stable under its own weight and unexpected mechanical stresses. To achieve this, the number of fixing points on the heat dissipation module needs to be increased to four or more to distribute the load and enhance structural reliability. Furthermore, in terms of heat dissipation module selection, either through-hole or pin-type heat sinks can be considered. Both types have their advantages: through-hole heat sinks have a simple structure and are easy to install; while pin-type heat sinks, although slightly more complex in construction, offer a larger heat dissipation area and superior heat exchange performance.

[0136] In summary, by flexibly employing assembly strategies for heat dissipation modules, whether for group sharing or full-area coverage, an optimal balance can be found between cost control, space management, and heat dissipation efficiency. Meanwhile, facing the structural stability challenges posed by large heat dissipation modules, reasonable support design and high-quality fixing components become indispensable key elements, ensuring the system's reliability and durability in complex operating environments.

[0137] In some embodiments, such as Figure 12 and Figure 13 As shown, the orthographic projections of the first circuit board 11, the heat dissipation module 12, and the inductor module 21 on the surface of the second structure away from the first structure overlap at least partially, and the orthographic projections of the second circuit board 13 and the third circuit board 22 on the surface of the second structure away from the first structure overlap at least partially.

[0138] By overlapping the components in the layout, more key components can be accommodated within the same enclosure size, thereby increasing energy density. This is especially important for portable or space-constrained energy storage applications. The vertical overlap of the first circuit board 11, the heat dissipation module 12, and the inductor module 21 allows the inductor module to be installed in the side space of the first circuit board and the heat dissipation module without occupying additional bottom space of the enclosure.

[0139] The overlapping layout of the inductor module and the heat dissipation module allows the heat generated by the inductor module to be directly absorbed by the heat dissipation module, improving overall thermal efficiency. The inductor module 21 is located on the side of the heat dissipation module 12, and its heat is quickly dissipated through the heat dissipation module and airflow generator, preventing overheating. This overlapping layout simplifies wiring between circuit boards, reduces wiring length, lowers the risk of electromagnetic interference, and facilitates component installation and maintenance.

[0140] Embodiments of this application also provide an energy storage system, including any of the above-described energy storage converters.

[0141] The energy storage converter design proposed in this application can significantly improve energy density within limited volume through device sinking, array arrangement, and optimized heat dissipation and connection technology. This spatial optimization not only reduces the physical size of the converter, but also promotes the compact layout of the overall energy storage system, providing physical space for high energy storage and efficient conversion, especially suitable for space-limited application scenarios such as urban distributed energy systems, electric vehicle charging stations, etc. The energy storage system using the energy storage converter design of this application not only optimizes in terms of physical space and cost control, but also makes significant progress in heat management, maintenance, and flexibility of upgrading. These comprehensive advantages not only improve the overall efficiency of the system, but also enhance its adaptability in complex environments and long-term operation stability.

[0142] The embodiments of the present application also provide an electrical equipment comprising any of the above-mentioned energy storage converters.

[0143] The energy storage converter design in this application significantly improves spatial utilization efficiency through device sinking, layout optimization of heat sinks and devices, and shared heat management strategies. For electrical equipment, this means that a more powerful energy storage system can be integrated in a more compact space, reducing the equipment footprint and freeing up valuable space for other key components such as battery packs, control units, or user interfaces, thereby achieving overall miniaturization and lightweight design of the equipment, enhancing portability and deployment flexibility. The electrical equipment using the energy storage converter design of this application benefits from its comprehensive advantages in spatial efficiency, cost control, heat management, maintenance convenience, and performance improvement, demonstrating significant market competitiveness and user value. These optimizations not only improve the practicality of the equipment, but also enhance its long-term economic and reliable operation, opening up new possibilities for power supply and management in various application scenarios, especially in industrial automation, data centers, and renewable energy systems that have high requirements for energy efficiency and stability, showing great potential.

[0144] Those skilled in the art can understand that the above-mentioned embodiments are specific embodiments for implementing the present application, and in actual application, various changes can be made in form and details without departing from the spirit and scope of the present application. Any person skilled in the art can make various modifications and changes without departing from the spirit and scope of the present application, therefore the protection scope of the present application should be limited by the scope defined in the claims.

Claims

1. An energy storage converter, characterized in that, include: The first structural portion and the second structural portion are adjacent to each other in a predetermined direction. The first structural portion includes a first circuit board, a heat dissipation module and a second circuit board distributed from bottom to top. The first circuit board includes a power control module of the inverter circuit and a power conversion module of the inverter circuit. The second circuit board includes a DC voltage regulation module. The second structural portion includes an inductor module and a third circuit board distributed from bottom to top. The third circuit board includes a sampling module. The predetermined direction is perpendicular to the thickness direction of the first circuit board. The current in the energy storage converter flows sequentially through the first circuit board, the second circuit board, the third circuit board, and the inductor module.

2. The energy storage converter according to claim 1, characterized in that, The first structural part further includes: An airflow generating device is located on at least one side of the heat dissipation module. The side is a surface other than the first surface and the second surface of the heat dissipation module. The first surface is the surface opposite to the first circuit board, and the second surface is the surface opposite to the second circuit board.

3. The energy storage converter according to claim 2, characterized in that, The airflow generating device includes: A first airflow generating device is located on a first side of the heat dissipation module, which is the surface of the heat dissipation module closest to the inductor module. The second airflow generating device is located on the second side of the heat dissipation module. The first side and the second side are opposite surfaces. The airflow direction generated by the first airflow generating device and the airflow direction generated by the second airflow generating device are both the first airflow direction, which is the direction from the heat dissipation module to the inductor module.

4. The energy storage converter according to claim 2, characterized in that, The energy storage converter also includes: The housing contains the first structural part and the second structural part, and the airflow generating device is movably mounted on the housing via a slide rail mechanism.

5. The energy storage converter according to claim 4, characterized in that, The slide rail mechanism includes at least one pair of cooperating first slide rails and second slide rails. The first slide rail is fixed to the inner wall of the housing, and the second slide rail is fixed to the airflow generating device. The airflow generating device moves along a preset trajectory under the guidance of the first slide rail and the second slide rail.

6. The energy storage converter according to claim 4, characterized in that, The energy storage converter also includes: A bracket is mounted on the housing via a first connector, and the bracket is located on the first side of the airflow generating device; A baffle is installed on the second side of the airflow generating device, wherein the first side and the second side are opposite sides.

7. The energy storage converter according to claim 2, characterized in that, The heat dissipation module includes: Multiple heat sinks are arranged in a row. The airflow generating device is fixed to the substrate of the first target heat sink and the substrate of the second target heat sink by a second connector. The first target heat sink is the row of heat sinks closest to the inductor module, and the second target heat sink is the row of heat sinks furthest from the inductor module.

8. The energy storage converter according to claim 7, characterized in that, The heat sink includes: At least one thermally conductive connector is provided, through which the fins of the radiator are connected.

9. The energy storage converter according to claim 8, characterized in that, The thermal conductivity of the thermally conductive connector is 395~400.

10. The energy storage converter according to claim 7, characterized in that, The first circuit board has multiple heating elements on its surface near the heat dissipation module. The heating elements are electrically connected to the first circuit board through multiple pins. The multiple pins are arranged in a straight line on the target surface of the heating elements. The target surface is a surface perpendicular to the first circuit board. The straight line formed by the multiple pins on the target surface is parallel to the first circuit board.

11. The energy storage converter according to claim 10, characterized in that, One of the heat sinks is connected to at least one of the heat-generating elements via a third connector.

12. The energy storage converter according to claim 1, characterized in that, The orthographic projections of the first circuit board, the heat dissipation module, and the inductor module on the surface of the second structure away from the first structure overlap at least partially, and the orthographic projections of the second circuit board and the third circuit board on the surface of the second structure away from the first structure overlap at least partially.

13. An energy storage system, characterized in that, Includes the energy storage converter as described in any one of claims 1 to 12.

14. An electrical appliance, characterized in that, Includes the energy storage converter as described in any one of claims 1 to 12.

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