Single laser repair apparatus and method of operation thereof

Abstract

A method of operating a single laser repair apparatus for repairing a defective line in a circuit board. The circuit has a conductive portion and a defect portion. The operation method comprises the following steps: a laser light source of a single-laser dual-optical-path repairing piece of the single-laser repairing module emits an initial laser beam to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam; the second laser beam is shielded by the switching unit, and the first laser beam is transmitted to the circuit board through the switching unit, so that the defect part is converted into a sintering part; and shielding the first laser beam by the switching unit and transmitting the second laser beam to the circuit board through the switching unit so as to trim the sintered part, so that the sintered side surface of the sintered part is flush with the two conductive side surfaces of the two conductive parts.

Description

Technical Field

[0001] The present invention relates to a single laser repair device and an operating method thereof, and more particularly to a single laser repair device and an operating method thereof that can sinter and trim circuits of a circuit board having open circuit defects and short circuit defects. Background Art

[0002] Generally speaking, laser repair equipment is used to repair circuits on PCBs with shorts and opens. For example, laser repair equipment uses a laser head to emit a laser beam at the defective circuit. However, when repairing a defective circuit, the laser beam's energy power is too concentrated or its divergence angle is too large. This can cause the repaired circuit to come into contact with adjacent circuits, resulting in a short circuit or other defects. Summary of the Invention

[0003] In order to solve the technical problems existing in the prior art, the present invention provides a single laser repair device, which can prevent the repaired circuit from easily contacting its adjacent circuits and causing a circuit short circuit.

[0004] The present invention provides a single laser repair device for repairing defective circuits in circuit boards, wherein the defective circuits have two conductive portions and a defective portion located between the two conductive portions. The single laser repair device includes a single laser repair module. The single laser repair module includes a single laser dual-path repair component. More specifically, the single laser dual-path repair component is disposed within the single laser repair module. The single laser dual-path repair component includes a laser light source, a power distribution unit, and a switching unit. The laser light source emits an initial laser beam. The power distribution unit is disposed on one side of the laser light source. The initial laser beam passes through the power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam. The energy power of the first laser beam is different from the energy power of the second laser beam. The switching unit is disposed on one side of the power distribution unit. The switching unit shields the second laser beam and allows the first laser beam to pass through the switching unit and reach the circuit board, thereby converting the defective portion of the circuit board into a sintered portion. After the defective portion of the circuit is converted into a sintered portion, the switching unit is used to shield the first laser beam and transmit the second laser beam through the switching unit to the circuit board to trim the sintered portion so that the sintered side surface of the sintered portion is flush with the two conductive side surfaces of the two conductive portions.

[0005] According to one embodiment of the present invention, the single-laser dual-optical path patch further includes a first light spot adjustment unit and a second light spot adjustment unit. The first light spot adjustment unit is located between the power distribution unit and the switching unit and is configured to receive a first laser beam passing through the power distribution unit. The second light spot adjustment unit is located on one side of the first light spot adjustment unit and is configured to receive a second laser beam passing through the power distribution unit. The divergence angle of the first laser beam passing through the first light spot adjustment unit is different from the divergence angle of the second laser beam passing through the second light spot adjustment unit.

[0006] According to one embodiment of the present invention, the energy power of the first laser beam passing through the power distribution unit is greater than the energy power of the second laser beam passing through the power distribution unit, and / or the divergence angle of the first laser beam passing through the first light spot adjustment unit is greater than the divergence angle of the second laser beam passing through the second light spot adjustment unit.

[0007] According to one embodiment of the present invention, the two conductive portions are two metal wires or two polysilicon fuses. The circuit defect is a short circuit defect. The defect is sintered by the first laser beam, causing a portion of the defect to diffuse outward and expose a portion of the circuit board substrate, thereby transforming the defect into a sintered portion. The width of each of the two conductive portions is smaller than the width of the portion of the substrate exposed by the defect.

[0008] According to one embodiment of the present invention, the two conductive portions are two metal wires or two polysilicon fuses. The circuit defect is an open circuit defect. The first laser beam is used to sinter the opposing sides of the two conductive portions to diffusely cover the defect, transforming the defect into a sintered portion and allowing the two conductive portions to conduct.

[0009] According to one embodiment of the present invention, the two conductive portions are two metal wires or two polysilicon fuses. The circuit defect is an open circuit defect. The single laser repair module includes an inkjet head. The inkjet head is used to spray conductive adhesive onto the defective portion of the circuit. The conductive adhesive partially covers the two conductive portions. The first laser beam sinters the conductive adhesive located on the circuit, converting the defective portion into a sintered portion.

[0010] According to one embodiment of the present invention, the above-mentioned single laser repair equipment further includes a first displacement module, a second displacement module, a third displacement module and a detection module. The first displacement module is connected to the single laser repair module and is used to move the single laser repair module in a first direction. The second displacement module is connected to the first displacement module and is used to move the first displacement module in a second direction. The third displacement module has a carrier. The carrier is used to carry a circuit board. The third displacement module is used to move the carrier in a third direction. Each of the first direction, the second direction and the third direction is perpendicular to the other two. The detection modules are arranged on opposite sides of the third displacement module. When the third displacement module moves to drive the carrier to pass through the detection module, the detection module is used to detect the thickness of the circuit in the circuit board.

[0011] According to one embodiment of the present invention, the single laser repair module includes a detection lens. The detection lens faces the circuit board and is used to detect the current position of the circuit board, generating a motion drive signal based on the current position. The motion drive signal is used to drive the first, second, and third displacement modules to move, thereby positioning the single laser repair module and the circuit board to a specific position.

[0012] According to another aspect of the present invention, a method for operating a single laser repair device is provided, wherein the single laser repair device is used to repair defective circuits on a circuit board to prevent the repaired circuits from easily contacting adjacent circuits and causing a short circuit.

[0013] According to one embodiment of the present invention, a method for operating a single laser repair device is provided for repairing a defective circuit in a circuit board, wherein the defective circuit has two conductive portions and a defective portion located between the two conductive portions. The method comprises: a laser light source of a single laser dual-path repair component of a single laser repair module emits an initial laser beam to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam, wherein the energy power of the first laser beam is different from the energy power of the second laser beam; shielding the second laser beam by a switching unit and transmitting the first laser beam through the switching unit to the circuit board, thereby converting the defective portion of the defective circuit into a sintered portion; and shielding the first laser beam by the switching unit and transmitting the second laser beam through the switching unit to the circuit board, thereby trimming the sintered portion so that the sintered side surface of the sintered portion is flush with the two conductive side surfaces of the two conductive portions.

[0014] According to one embodiment of the present invention, the above method also includes: receiving the first laser beam passing through the power distribution unit by a first light spot adjustment unit and receiving the second laser beam passing through the power distribution unit by a second light spot adjustment unit, wherein the divergence angle of the first laser beam passing through the first light spot adjustment unit is different from the divergence angle of the second laser beam passing through the second light spot adjustment unit.

[0015] According to one embodiment of the present invention, the step of converting the defective portion into the sintered portion further comprises: sintering opposite sides of the two conductive portions with a first laser beam to diffusely cover the defective portion, so that the defective portion is converted into the sintered portion and the two conductive portions are conductive.

[0016] According to one embodiment of the present invention, the above-mentioned conversion of the defective portion into the sintered portion further includes: removing a portion of the circuit so that the circuit has a defective portion, wherein the defect in the circuit is an open circuit defect, and the two conductive portions are two metal wires or two polysilicon fuses; spraying a conductive adhesive onto the defective portion of the circuit using an inkjet head of a single laser repair module, wherein the conductive adhesive partially covers the two conductive portions; and sintering the conductive adhesive located in the circuit using a first laser beam, thereby converting the defective portion into the sintered portion.

[0017] According to one embodiment of the present invention, the above-mentioned conversion of the defect portion into the sintered portion further includes: sintering the defect portion using a first laser beam, causing a portion of the defect portion to diffuse outward and expose a portion of the substrate of the circuit board, thereby converting the defect portion into the sintered portion, wherein the defect in the circuit is a short circuit defect, and the width of each of the two conductive portions is smaller than the width of the portion of the substrate exposed by the sintered portion.

[0018] According to one embodiment of the present invention, the above method also includes: driving the first displacement module, the second displacement module, and the third displacement module to move along the first direction, the second direction, and the third direction, respectively, so that the single laser repair module connected to the first displacement module and the circuit board on the carrier of the third displacement module move, wherein each of the first direction, the second direction, and the third direction is perpendicular to the other two; and detecting the current position of the circuit board by using the detection lens of the single laser repair module to generate a movement drive signal according to the current position, wherein the movement drive signal is used to drive the first displacement module, the second displacement module, and the third displacement module to move, so that the single laser repair module and the circuit board are positioned to a specific position.

[0019] According to one embodiment of the present invention, the method further includes moving the carrier on the third displacement module so that the carrier passes through the detection modules provided on both sides of the third displacement module and detects the thickness of the circuits in the circuit board by the detection modules.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] According to the above-described embodiment of the present invention, a single laser repair device can be used to repair circuits with open and short circuit defects on a circuit board. The single laser dual-path repair device can emit a first laser beam and a second laser beam with different energy powers and / or different divergence angles toward the circuit board. Furthermore, the first laser beam emitted by the single laser dual-path repair device can transform the defective portion of the circuit into a sintered portion between two conductive portions, while the second laser beam emitted by the single laser dual-path repair device can trim the sintered portion so that the sintered side surface of the sintered portion is flush with the two conductive side surfaces of the two conductive portions. The configuration of the single laser dual-path repair device in emitting the first and second laser beams prevents the side surface of the repaired circuit from contacting other circuits, thereby preventing the repaired circuit from developing short circuits or other defects. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 4 is a perspective view of a single laser repair device according to an embodiment of the present invention.

[0023] Figure 2 yes Figure 1 Front view of the single laser repair module.

[0024] Figure 3 FIG. 4 is a schematic diagram of a single-laser dual-optical-path repair component emitting a first laser beam according to an embodiment of the present invention.

[0025] Figure 4 FIG. 4 is a schematic diagram of a single-laser dual-optical-path repair component emitting a second laser beam according to an embodiment of the present invention.

[0026] Figure 5 FIG. 4 is a flow chart of an operating method of a single laser repair device according to an embodiment of the present invention.

[0027] Figures 6 to 8 1 is a cross-sectional view of a circuit board with an open circuit defect in different states during repair according to an embodiment of the present invention.

[0028] Figure 9 and Figure 10 1 is a top view of a circuit board with an open circuit defect in different states during repair according to an embodiment of the present invention.

[0029] Figure 11 and Figure 12 1 is a cross-sectional view of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present invention.

[0030] Figure 13 and Figure 14 1 is a top view of a circuit board with an open circuit defect in different states during repair according to another embodiment of the present invention.

[0031] Figure 15 and Figure 16 1 is a cross-sectional view of a circuit board with a short circuit defect in different states during repair according to an embodiment of the present invention.

[0032] Figures 17 to 19 1 is a top view of a circuit board with a short circuit defect in different states during repair according to an embodiment of the present invention.

[0033] Description of the figure number:

[0034] 100: Single laser repair equipment

[0035] 110: Single laser repair module

[0036] 111: Single laser dual optical path repair parts

[0037] 112: Laser light source

[0038] 114: Power distribution unit

[0039] 115: Switching unit

[0040] 116: Detection Lens

[0041] 118: Inkjet head

[0042] 120: First displacement module

[0043] 130: Second displacement module

[0044] 140: Third displacement module

[0045] 142: Carrier

[0046] 150: Detection module

[0047] 200: Circuit board

[0048] 210: Line

[0049] 211: Sintered side

[0050] 212: Sintering department

[0051] 213: Conductive side

[0052] 214: Conductive part

[0053] 220: Substrate

[0054] 1131: First light spot adjustment unit

[0055] 1132: Second light spot adjustment unit

[0056] 2121: Defect Department

[0057] C: Conductive adhesive

[0058] D1: First direction

[0059] D2: Second direction

[0060] D3: Third direction

[0061] L0: Initial laser beam

[0062] L1: First laser beam

[0063] L2: Second laser beam

[0064] S1: Steps

[0065] S2: Steps

[0066] S3: Steps

[0067] T: thickness

[0068] W1: width

[0069] W2: width. DETAILED DESCRIPTION

[0070] Please refer to Figures 1 to 4 , Figure 1 is a perspective view of a single laser repair device 100 according to one embodiment of the present invention. Figure 2 yes Figure 1 A front view of the single laser repair module 110, Figure 3 is a schematic diagram of a single laser dual optical path repair component 111 emitting a first laser beam L1 according to an embodiment of the present invention, and Figure 4 Schematic diagram of the single laser dual optical path repair component 111 emitting the second laser beam L2 according to one embodiment of the present invention. Figures 1 to 4 The single laser repair device 100 can be used to repair a defective circuit 210 of a circuit board 200 (described in detail below). The single laser repair device 100 includes a single laser repair module 110 . The single laser repair module 110 includes a single laser dual-path repair component 111 .

[0071] In some embodiments, the single-laser dual-optical path patch 111 includes a laser light source 112, a power distribution unit 114, and a switching unit 115. The laser light source 112 is configured to emit an initial laser beam L0. The power distribution unit 114 is disposed on one side of the laser light source 112. The initial laser beam L0 passes through the power distribution unit 114 to generate a first laser beam L1 and a second laser beam L2 that is different from the first laser beam L1. The energy power of the first laser beam L1 is different from the energy power of the second laser beam L2. For example, the energy power of the first laser beam L1 is greater than the energy power of the second laser beam L2.

[0072] In some embodiments, the single-laser dual-optical path patch 111 further includes a first optical spot adjustment unit 1131 and a second optical spot adjustment unit 1132. The first optical spot adjustment unit 1131 is located between the power distribution unit 114 and the switching unit 115 and is configured to receive the first laser beam L1 passing through the power distribution unit 114. The second optical spot adjustment unit 1132 is located on one side of the first optical spot adjustment unit 1131 and is configured to receive the second laser beam L2 passing through the power distribution unit 114. The divergence angle of the first laser beam L1 passing through the first optical spot adjustment unit 1131 is different from the divergence angle of the second laser beam L2 passing through the second optical spot adjustment unit 1132. For example, the divergence angle of the first laser beam L1 is greater than the divergence angle of the second laser beam L2.

[0073] In some embodiments, the switching unit 115 is disposed on one side of the power distribution unit 114. The switching unit 115 is configured to shield the second laser beam L2 and allow the first laser beam L1 to pass through the switching unit 115 and be transmitted to the circuit board 200, or shield the first laser beam L1 and allow the second laser beam L2 to pass through the switching unit 115 and be transmitted to the circuit board 200.

[0074] In some embodiments, the single laser repair device 100 further includes a first displacement module 120, a second displacement module 130, a third displacement module 140, and a detection module 150. The first displacement module 120 is connected to the single laser repair module 110 and is used to move the single laser repair module 110 in a first direction D1. The second displacement module 130 is connected to the first displacement module 120 and is used to move the first displacement module 120 in a second direction D2. The third displacement module 140 has a carrier 142. The carrier 142 is used to support the circuit board 200. The third displacement module 140 is used to move the carrier 142 in a third direction D3. Each of the first direction D1, the second direction D2, and the third direction D3 is perpendicular to the other two. The detection module 150 is disposed on opposite sides of the third displacement module 140. When the third displacement module 140 moves to drive the carrier 142 to pass through the inspection module 150 , the inspection module 150 can be used to inspect the thickness T of the circuits 210 in the circuit board 200 .

[0075] Furthermore, the single laser repair module 110 includes a detection lens 116 and an inkjet head 118. The detection lens 116 faces the circuit board 200 and is used to detect the current position of the circuit board 200, generating a motion drive signal based on the current position. The motion drive signal is used to drive the first displacement module 120, the second displacement module 130, and the third displacement module 140 to move, thereby positioning the single laser repair module 110 and the circuit board 200 to a specific position.

[0076] The following description will explain the operation of a single laser repair device. Figure 5 , Figure 5 This is a flow chart of a method for operating a single laser repair device according to one embodiment of the present invention. The method includes the following steps. First, in step S1, the laser light source of the single laser dual-path repair component of the single laser repair module emits an initial laser beam to a power distribution unit to generate a first laser beam and a second laser beam different from the first laser beam, wherein the energy power of the first laser beam is different from the energy power of the second laser beam.

[0077] Please note that in other embodiments, other optical components may be used to generate the first laser beam and the second laser beam, and the energy power of the first laser beam may be designed to be the same as the energy power of the second laser beam, but the divergence angle of the first laser beam may be different from the divergence angle of the second laser beam. In summary, in the present invention, the energy power of the first laser beam is different from the energy power of the second laser beam, and / or the divergence angle of the first laser beam is different from the divergence angle of the second laser beam.

[0078] Next, in step S2, the switching unit shields the second laser beam and transmits the first laser beam through the switching unit to the circuit board, converting the defective portion of the defective circuit into a sintered portion. Then, in step S3, the switching unit shields the first laser beam and transmits the second laser beam through the switching unit to the circuit board to trim the sintered portion, ensuring that the sintered side surface of the sintered portion is flush with the two conductive side surfaces of the two conductive portions. The following description will detail each of these steps.

[0079] Figures 6 to 8 1 is a cross-sectional view of a circuit 210 of a circuit board 200 with an open defect in different states during repair according to an embodiment of the present invention. Figure 9 and Figure 10 2 is a top view of a circuit 210 of a circuit board 200 with an open circuit defect in different states during repair according to an embodiment of the present invention. Figure 1 、 Figure 3 、 Figures 6 to 10 The operating method of the single laser repairing apparatus 100 can be used to repair a defective circuit 210 of a circuit board 200. The defective circuit 210 has two conductive portions 214 and a defective portion 2121 located between the two conductive portions 214.

[0080] First, the first displacement module 120, the second displacement module 130, and the third displacement module 140 can be driven along the first direction D1, the second direction D2, and the third direction D3, respectively, to move the single laser repair module 110 connected to the first displacement module 120 and the circuit board 200 on the stage 142 of the third displacement module 140. For example, the detection lens 116 of the single laser repair module 110 can detect the current position of the circuit board 200 and generate a movement drive signal based on the current position. The movement drive signal is used to drive the first displacement module 120, the second displacement module 130, and the third displacement module 140 to move, positioning the single laser repair module 110 and the circuit board 200 to a specific position. Furthermore, the stage 142 can be moved on the third displacement module 140, allowing the stage 142 to detect the thickness T of the circuit board 210 on the circuit board 200 via the inspection modules 150 disposed on both sides of the third displacement module 140.

[0081] In some embodiments, the laser light source 112 of the single-laser dual-optical path repair component 111 of the single-laser repair module 110 can emit an initial laser beam L0 to the power distribution unit 114 to generate a first laser beam L1 and a second laser beam L2 different from the first laser beam. Subsequently, the first laser beam L1 passing through the power distribution unit 114 can be received by the first light spot adjustment unit 1131, and the second laser beam L2 passing through the power distribution unit 114 can be received by the second light spot adjustment unit 1132.

[0082] In some embodiments, a portion of the circuit 210 may be removed, resulting in a defective portion 2121 on the circuit 210, with the two conductive portions 214 being two metal wires or two polysilicon fuses, wherein the circuit defect is an open circuit defect. In some embodiments, the inkjet head 118 of the single laser repair module 110 may be used to spray conductive adhesive C onto the defective portion 2121 of the circuit 210, with the conductive adhesive C partially covering the two conductive portions 214. Subsequently, the switching unit 115 may be used to shield the second laser beam L2 and allow the first laser beam L1 to pass through the switching unit 115 and reach the circuit board 200, thereby transforming the defective portion 2121 of the defective circuit 210 into a sintered portion 212. In other words, the first laser beam L1 sinters the conductive adhesive C on the circuit 210, transforming the defective portion 2121 into the sintered portion 212. Afterwards, the switching unit 115 can be used to shield the first laser beam L1 and transmit the second laser beam L2 through the switching unit 115 to the circuit board 200 to trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG. Figure 10 shown.

[0083] Please refer to Figures 11 to 14 , Figure 11 and Figure 12 is a cross-sectional view of a circuit 210 of a circuit board 200 having an open circuit defect in different states during repair according to another embodiment of the present invention, and Figure 13 and Figure 14 1 is a top view of a circuit board 200 having an open defect in different states during repair according to another embodiment of the present invention. Figures 11 to 14 The embodiment shown is similar to Figures 6 to 10 The difference between the embodiments shown is that the single laser repair module 110 does not use the inkjet head 118 to spray the conductive adhesive C (such as Figure 7 As shown), instead, the first laser beam L1 is used to directly sinter the two opposite sides of the two conductive portions 214 to diffusely cover the defective portion 2121, so that the defective portion 2121 is transformed into the sintered portion 212 and the two conductive portions 214 are connected to each other.

[0084] Please refer to Figures 15 to 19 , Figure 15 and Figure 16 is a cross-sectional view of a circuit 210 of a circuit board 200 having a short circuit defect in different states during repair according to an embodiment of the present invention, and Figures 17 to 19 1 is a top view of a circuit 210 of a circuit board 200 with a short circuit defect in different states during repair according to an embodiment of the present invention. Figure 1 、 Figure 3 、 Figures 15 to 19 In this embodiment, there are two lines 210, and the defect between the two lines 210 is a short-circuit defect. First, the first laser beam L1 can be used to sinter the defect portion 2121, so that a portion of the defect portion 2121 diffuses outward and exposes a portion of the substrate 220 of the circuit board 200, thereby transforming the defect portion 2121 into a sintered portion 212. Figure 18 As shown, the width W1 of each of the two conductive portions 214 is smaller than the width W2 of the portion of the sintered portion 212 exposed from the substrate 220. After confirming that the width W2 of the sintered portion 212 exposed from the substrate 220 is larger than the width W1 of the conductive portion 214, the sintered portion 212 can be trimmed using the second laser beam L2 so that the sintered side surface 211 of the sintered portion 212 is flush with the two conductive side surfaces 213 of the two conductive portions 214, as shown in FIG. Figure 19 shown.

[0085] In summary, the single laser repair device 100 can be used to repair circuits 210 with open and short defects on a circuit board 200. The single laser dual-path repair device 111 can emit a first laser beam L1 and a second laser beam L2 having different energy powers and / or different divergence angles toward the circuit board 200. Furthermore, the first laser beam L1 emitted by the single laser dual-path repair device 111 can transform a defective portion 2121 of the circuit 210 into a sintered portion 212 between two conductive portions 214. The second laser beam L2 emitted by the single laser dual-path repair device 111 can trim the sintered portion 212 so that the sintered side surface 211 of the sintered portion 212 is flush with the conductive side surface 213 of the conductive portion 214. The configuration of the single laser dual-path repair device 111 of the single laser repair device 100 to emit the first laser beam L1 and the second laser beam L2 prevents the side surface of the repaired circuit from contacting other circuits, thereby preventing the repaired circuit from shorting.

Claims

1. A single laser repair device, characterized in that: Used for repairing a circuit (210) with a defect on a circuit board (200), wherein the circuit (210) with the defect has two conductive parts (214) and a defective part (2121) located between the two conductive parts (214), and the single laser repair device comprises: A single laser repair module (110) comprising: A single laser dual optical path repair component (111) is disposed in the single laser repair module (110) and comprises: a laser light source (112) for emitting an initial laser beam (L0); A power distribution unit (114) is provided on one side of the laser light source (112), and the initial laser beam (L0) passes through the power distribution unit (114) to generate a first laser beam (L1) and a second laser beam (L2) different from the first laser beam (L1), wherein an energy power of the first laser beam (L1) is different from an energy power of the second laser beam (L2); as well as A switching unit (115) is provided on one side of the power distribution unit (114), wherein the switching unit (115) is used to shield the second laser beam (L2) and allow the first laser beam (L1) to pass through the switching unit (115) and be transmitted to the circuit board (200), so that the defective portion (2121) of the circuit (210) is transformed into a sintered portion (212). After the defective portion (2121) of the circuit (210) is transformed into the sintered portion (212), the switching unit (115) is used to shield the first laser beam (L1) and allow the second laser beam (L2) to pass through the switching unit (115) and be transmitted to the circuit board (200) to trim the sintered portion (212), so that a sintered side surface (211) of the sintered portion (212) is flush with the two conductive side surfaces (213) of the two conductive portions (214).

2. The single laser repair device according to claim 1, wherein: The single laser dual optical path repair component (111) further comprises: a first light spot adjustment unit (1131), located between the power distribution unit (114) and the switching unit (115), and used for receiving the first laser beam (L1) passing through the power distribution unit (114); and A second light spot adjustment unit (1132) is located on one side of the first light spot adjustment unit (1131) and is used to receive the second laser beam (L2) passing through the power distribution unit (114), wherein a divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is different from a divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132).

3. The single laser repair device according to claim 2, wherein: The energy power of the first laser beam (L1) passing through the power distribution unit (114) is greater than the energy power of the second laser beam (L2) passing through the power distribution unit (114), and / or the divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is greater than the divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132).

4. The single laser repair device according to claim 1, wherein: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is a short-circuit defect. The defect part (2121) is sintered by the first laser beam (L1) so that a portion of the defect part (2121) diffuses outward and exposes a portion of a substrate (220) of the circuit board (200), thereby converting the defect part (2121) into the sintered part (212). The width (W1) of each of the two conductive parts (214) is smaller than the width (W2) of the portion of the defect part (2121) exposed on the substrate (220).

5. The single laser repair device according to claim 1, wherein: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is an open circuit defect. The two opposite sides of the two conductive parts (214) are sintered by the first laser beam (L1) to diffusely cover the defective part (2121), so that the defective part (2121) is transformed into the sintered part (212) and the two conductive parts (214) are conductive.

6. The single laser repair device according to claim 1, wherein: The two conductive parts (214) are two metal wires or two polysilicon fuses, and the defect of the circuit (210) is an open circuit defect. The single laser repair module (110) has an inkjet head (118). The inkjet head (118) is used to spray a conductive adhesive (C) on the defective part (2121) of the circuit (210). The conductive adhesive (C) partially covers the two conductive parts (214). The first laser beam (L1) sintered the conductive adhesive (C) located on the circuit (210) so that the defective part (2121) becomes the sintered part (212).

7. The single laser repair device according to claim 1, wherein: Also includes: a first displacement module (120) connected to the single laser repair module (110) and used for moving the single laser repair module (110) in a first direction (D1); a second displacement module (130) connected to the first displacement module (120) and used to move the first displacement module (120) in a second direction (D2); a third displacement module (140) having a carrier (142), wherein the carrier (142) is used to carry the circuit board (200), and the third displacement module (140) is used to move the carrier (142) in a third direction (D3), wherein each of the first direction (D1), the second direction (D2), and the third direction (D3) is perpendicular to the other two; and A detection module (150) is arranged on opposite sides of the third displacement module (140), wherein when the third displacement module (140) moves to drive the carrier (142) to pass through the detection module (150), the detection module (150) is used to detect a thickness (T) of the circuit (210) in the circuit board (200).

8. The single laser repair device according to claim 7, wherein: The single laser repair module (110) has a detection lens (116) facing the circuit board (200) and used to detect a current position of the circuit board (200) to generate a movement drive signal according to the current position, wherein the movement drive signal is used to drive the first displacement module (120), the second displacement module (130) and the third displacement module (140) to move, so that the single laser repair module (110) and the circuit board (200) are positioned at a specific position.

9. A method for operating a single laser repair device, characterized in that: The method is used for repairing a circuit (210) having a defect on a circuit board (200), wherein the circuit (210) having the defect has two conductive parts (214) and a defective part (2121) located between the two conductive parts (214), and comprises: A laser light source (112) of a single laser dual-path repair component (111) of a single laser repair module (110) emits an initial laser beam (L0) to a power distribution unit (114) to generate a first laser beam (L1) and a second laser beam (L2) different from the first laser beam (L1), wherein an energy power of the first laser beam (L1) is different from an energy power of the second laser beam (L2); By shielding the second laser beam (L2) through a switching unit (115), the first laser beam (L1) is transmitted to the circuit board (200) through the switching unit (115), so that the defective portion (2121) of the circuit (210) with the defect is transformed into a sintered portion (212); and The switching unit (115) shields the first laser beam (L1) and transmits the second laser beam (L2) through the switching unit (115) to the circuit board (200) to trim the sintering portion (212), so that a sintering side surface (211) of the sintering portion (212) is flush with the two conductive side surfaces (213) of the two conductive portions (214).

10. The operating method according to claim 9, characterized in that: Also includes: The first laser beam (L1) passing through the power distribution unit (114) is received by a first light spot adjustment unit (1131), and the second laser beam (L2) passing through the power distribution unit (114) is received by a second light spot adjustment unit (1132), wherein a divergence angle of the first laser beam (L1) passing through the first light spot adjustment unit (1131) is different from a divergence angle of the second laser beam (L2) passing through the second light spot adjustment unit (1132).

11. The operating method according to claim 9, wherein: The step of converting the defective portion (2121) into the sintered portion (212) further comprises: The first laser beam (L1) is used to sinter the two opposite sides of the two conductive parts (214) to diffusely cover the defective part (2121), so that the defective part (2121) is transformed into the sintered part (212) and the two conductive parts (214) are conductive.

12. The operating method according to claim 9, wherein: The step of converting the defective portion (2121) into the sintered portion (212) further comprises: Removing a portion of the circuit (210) so that the circuit (210) has the defective portion (2121), wherein the defect of the circuit (210) is an open circuit defect, and the two conductive portions (214) are two metal wires or two polysilicon fuses; spraying a conductive adhesive (C) on the defective portion (2121) of the circuit (210) by an inkjet head (118) of the single laser repair module (110), wherein the conductive adhesive (C) partially covers the two conductive portions (214); and The conductive adhesive (C) located on the circuit (210) is sintered by the first laser beam (L1), so that the defective portion (2121) is transformed into the sintered portion (212).

13. The operating method according to claim 9, wherein: The step of converting the defective portion (2121) into the sintered portion (212) further comprises: The defective portion (2121) is sintered by the first laser beam (L1), causing a portion of the defective portion (2121) to diffuse outward and expose a portion of a substrate (220) of the circuit board (200), thereby transforming the defective portion (2121) into the sintered portion (212), wherein the defect of the circuit (210) is a short-circuit defect, and a width (W1) of each of the two conductive portions (214) is smaller than a width (W2) of the portion of the sintered portion (212) exposed on the substrate (220).

14. The operating method according to claim 9, further comprising: A first displacement module (120), a second displacement module (130), and a third displacement module (140) are driven to move along a first direction (D1), a second direction (D2), and a third direction (D3), respectively, so that the single laser repair module (110) connected to the first displacement module (120) and the circuit board (200) on a carrier (142) of the third displacement module (140) move, wherein each of the first direction (D1), the second direction (D2), and the third direction (D3) is perpendicular to the other two; and A detection lens (116) of the single laser repair module (110) detects a current position of the circuit board (200) to generate a movement drive signal according to the current position, wherein the movement drive signal is used to drive the first displacement module (120), the second displacement module (130) and the third displacement module (140) to move, so that the single laser repair module (110) and the circuit board (200) are positioned at a specific position.

15. The operating method according to claim 14, characterized in that: Also includes: Moving the carrier (142) on the third displacement module (140) so that the carrier (142) passes through a detection module (150) disposed on both sides of the third displacement module (140); and The thickness (T) of the circuit (210) in the circuit board (200) is detected by the detection module (150).

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