Packaging structure with electromagnetic shielding function and forming method thereof

Abstract

The invention relates to a packaging structure with an electromagnetic shielding function and a forming method thereof. The packaging structure with the electromagnetic shielding function comprises an adapter plate which comprises a substrate and an accommodating cavity located in the substrate; the wiring layer is located on the adapter plate; the first chip is positioned in the accommodating cavity and is electrically connected with the wiring layer; the electromagnetic shielding layer at least covers the inner wall of the accommodating cavity; and the second chip is located on the adapter plate, and the second chip is electrically connected with the wiring layer. Various types of chips such as a radio frequency chip can be integrated in the accommodating cavity, so that the functions of the packaging structure can be expanded, the application field of the packaging structure is expanded, the manufacturing process of the packaging structure is simplified, and the manufacturing cost of the packaging structure is greatly reduced.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a packaging structure with electromagnetic shielding function and a forming method thereof. Background Art

[0002] As various technology industries place increasingly higher demands on the integration and electrical performance of semiconductor devices, packaging technology also needs to adapt to continuous development and innovation. When using traditional 2D (two-dimensional) packaging technology to integrate multiple chips, such as using a fan-out packaging structure, the size of the packaging structure (such as the volume of the packaging structure or the surface area of ​​the packaging structure) will increase, and its application in products with size restrictions will be limited. In order to solve this problem, 3D (three-dimensional) packaging structures have emerged. In the current advanced three-dimensional packaging structures, chip-to-chip (i.e., die to die) mounting methods are more commonly used, and the base chip (i.e., base die) is mostly an active silicon adapter board, and the TMV (Through Molding Via, plastic layer through hole) process is used to connect the upper and lower packages. However, this three-dimensional packaging structure has at least the following problems: (1) The base chip is an active chip formed using the TSV (Through Silicon Via) process, which has a high processing cost; (2) It does not have an electromagnetic shielding function and is therefore not suitable for integrating a radio frequency chip inside the packaging structure; (3) The chip-to-chip bonding process is a high-cost process, which leads to a significant increase in the manufacturing cost of the packaging structure; (4) The use of the TMV process limits the number of I / O interfaces and is not suitable for interconnections requiring a high number of I / O interfaces; (5) The entire three-dimensional packaging structure is relatively thick, which is not conducive to the miniaturization of the packaging structure.

[0003] Therefore, how to simplify the manufacturing process of the packaging structure and reduce the manufacturing cost of the packaging structure while expanding the function of the packaging structure so that the packaging structure can integrate multiple types of chips is a technical problem that needs to be solved urgently. Summary of the Invention

[0004] The present invention provides a packaging structure with electromagnetic shielding function and a forming method thereof, which are used to expand the function of the packaging structure while simplifying the manufacturing process of the packaging structure and reducing the manufacturing cost of the packaging structure, so that the packaging structure can integrate various types of chips.

[0005] According to some embodiments, the present invention provides a packaging structure with electromagnetic shielding function, comprising:

[0006] An adapter plate comprising a substrate and a receiving cavity located in the substrate;

[0007] A wiring layer, located on the adapter board;

[0008] A first chip is located in the accommodating cavity and is electrically connected to the wiring layer;

[0009] an electromagnetic shielding layer, covering at least the inner wall of the accommodating cavity;

[0010] The second chip is located on the adapter board, and the second chip is electrically connected to the wiring layer.

[0011] In some embodiments, the wiring layer includes a grounding circuit, and the electromagnetic shielding layer is electrically connected to the grounding circuit; or,

[0012] The adapter board also has a grounding terminal located outside the wiring layer, and the electromagnetic shielding layer is electrically connected to the grounding terminal.

[0013] In some embodiments, the adapter plate includes an upper surface and a lower surface that are relatively distributed; and the wiring layer includes:

[0014] a top wiring layer, located on the upper surface of the adapter board, the second chip being electrically connected to the top wiring layer;

[0015] A bottom wiring layer is located on the lower surface of the adapter board, the first chip is electrically connected to the bottom wiring layer, and the top wiring layer is electrically connected to the bottom wiring layer.

[0016] In some embodiments, the adapter plate further includes:

[0017] A conductive connection column passes through the substrate, and one end of the conductive connection column is electrically connected to the top wiring layer, and the other end of the conductive connection column is electrically connected to the bottom wiring layer.

[0018] In some embodiments, the electromagnetic shielding layer is electrically connected to the bottom wiring layer; or,

[0019] The electromagnetic shielding layer is electrically connected to the top wiring layer.

[0020] In some embodiments, further comprising:

[0021] Solder balls are located on a surface of the bottom wiring layer facing away from the first chip, and the solder balls are electrically connected to the bottom wiring layer.

[0022] In some embodiments, the accommodating cavity penetrates the substrate, the top wiring layer covers the top surface of the substrate and closes the top of the accommodating cavity, and the bottom wiring layer covers the bottom surface of the substrate and closes the bottom of the accommodating cavity;

[0023] The first chip is located on a surface of the bottom wiring layer facing the top wiring layer.

[0024] In some embodiments, the electromagnetic shielding layer continuously covers the sidewall of the accommodation cavity, a portion of the surface of the wiring layer, and the surface of the first chip.

[0025] In some embodiments, a plurality of the first chips are arranged on the bottom wiring layer at intervals along a direction parallel to the upper surface of the transfer board;

[0026] The electromagnetic shielding layer continuously covers the sidewall of the accommodation cavity, a portion of the surface of the bottom wiring layer, and the surfaces of the plurality of first chips.

[0027] In some embodiments, further comprising:

[0028] A third chip is located in the accommodating cavity. The third chip is located above the first chip and is electrically connected to the top wiring layer.

[0029] In some embodiments, the first chip includes a functional surface and a back surface that are oppositely distributed, and the functional surface of the first chip faces the bottom wiring layer;

[0030] The third chip includes a functional surface and a back surface that are relatively distributed. The functional surface of the third chip faces the top wiring layer, and the electromagnetic shielding layer on the back surface of the first chip is connected to the back surface of the third chip through an adhesive layer.

[0031] In some embodiments, the back surface of the third chip is continuously connected to the electromagnetic shielding layers on the back surfaces of the plurality of first chips through the adhesive layer.

[0032] In some embodiments, in a direction parallel to the upper surface of the transfer board, the width of the second chip is greater than the width of the accommodation cavity.

[0033] In some embodiments, further comprising:

[0034] a first plastic packaging layer, filled in the accommodating cavity, covering the surface of the electromagnetic shielding layer and plastic-sealing the first chip;

[0035] The second plastic packaging layer is located above the adapter board, and the second plastic packaging layer plastic packages the second chip.

[0036] In some embodiments, the substrate has a plurality of spaced-apart accommodating cavities, and each of the accommodating cavities is provided with the first chip;

[0037] The electromagnetic shielding layer is continuously distributed in the plurality of accommodating cavities; or, a plurality of discrete electromagnetic shielding layers are distributed in the plurality of accommodating cavities in a one-to-one correspondence.

[0038] According to other embodiments, the present invention further provides a method for forming a packaging structure with electromagnetic shielding function, comprising the following steps:

[0039] forming an adapter plate, wherein the adapter plate includes a substrate and a receiving cavity located in the substrate;

[0040] Mounting a first chip in the accommodating cavity and forming an electromagnetic shielding layer that at least covers the inner wall of the accommodating cavity;

[0041] A wiring layer is formed on the adapter board, and a second chip is mounted on the adapter board, wherein the first chip and the second chip are both electrically connected to the wiring layer.

[0042] In some embodiments, the specific steps of forming the adapter plate include:

[0043] providing a substrate;

[0044] The substrate is etched to form the accommodating cavity penetrating the substrate.

[0045] In some embodiments, before etching the substrate, the following steps are further included:

[0046] A plurality of conductive connection pillars are formed penetrating the substrate.

[0047] In some embodiments, the adapter plate includes an upper surface and a lower surface that are relatively distributed. The specific steps of mounting the first chip in the accommodating cavity and forming an electromagnetic shielding layer that at least covers the inner wall of the accommodating cavity include:

[0048] providing a carrier board;

[0049] Mounting the adapter plate on the carrier plate along the lower surface of the adapter plate toward the carrier plate;

[0050] Mounting the first chip on the carrier in the accommodating cavity;

[0051] The electromagnetic shielding layer is formed to continuously cover the inner wall of the accommodation cavity and the surface of the first chip.

[0052] In some embodiments, the specific steps of mounting the first chip on the carrier in the receiving cavity include:

[0053] A plurality of the first chips are mounted on the carrier in the accommodating cavity, and the plurality of the first chips are arranged at intervals along a direction parallel to the upper surface of the transfer board.

[0054] In some embodiments, the specific steps of forming the electromagnetic shielding layer that continuously covers the inner wall of the accommodating cavity and the surface of the first chip include:

[0055] The electromagnetic shielding layer is formed by a sputtering process to continuously cover the inner wall of the accommodating cavity and the entire surface of the first chip.

[0056] In some embodiments, the first chip includes a functional surface and a back surface that are relatively distributed, and the functional surface of the first chip faces the carrier; before forming a wiring layer on the adapter board, the following steps are further included:

[0057] Providing a third chip, wherein the third chip includes a functional surface and a back surface that are relatively distributed;

[0058] The third chip is mounted on the electromagnetic shielding layer on the back side of the first chip in the accommodation cavity through an adhesive layer, with the back side of the third chip facing the first chip.

[0059] In some embodiments, the specific steps of attaching the third chip to the electromagnetic shielding layer on the back side of the first chip in the accommodation cavity through an adhesive layer include:

[0060] The third chip is mounted on the electromagnetic shielding layer on the back side of the plurality of first chips in the accommodation cavity through an adhesive layer.

[0061] In some embodiments, before forming a wiring layer on the transfer board and mounting the second chip on the transfer board, the following steps are further included:

[0062] A first molding layer is formed to fill the accommodating cavity and to mold the first chip and the third chip.

[0063] In some embodiments, the substrate includes a bottom surface facing the carrier and a top surface opposite the bottom surface, and the electromagnetic shielding layer further covers the top surface of the substrate. The specific steps of forming a first molding layer that fills the accommodating cavity and molds the first chip and the third chip include:

[0064] forming a first molding layer that fills the accommodating cavity and molds the first chip and the third chip, wherein the first molding layer is also located on the top surface of the substrate;

[0065] The first plastic packaging layer on the top surface of the substrate and the electromagnetic shielding layer covering the top surface of the substrate are removed by a grinding process.

[0066] In some embodiments, the steps of forming a wiring layer on the transfer board and mounting the second chip on the transfer board include:

[0067] forming a top wiring layer covering the upper surface of the adapter board and the top surface of the first plastic packaging layer;

[0068] Mounting the second chip on the top wiring layer, and electrically connecting the second chip to the top wiring layer;

[0069] removing the carrier plate;

[0070] A bottom wiring layer is formed covering the lower surface of the adapter board and the bottom surface of the first plastic packaging layer to form the wiring layer including the top wiring layer and the bottom wiring layer, and the first chip is electrically connected to the bottom wiring layer.

[0071] In some embodiments, before removing the carrier board, the method further includes the following steps:

[0072] A second plastic encapsulation layer for encapsulating the second chip is formed on the transfer board.

[0073] In some embodiments, after forming the bottom wiring layer covering the lower surface of the adapter board and the bottom surface of the first plastic packaging layer, the following steps are further included:

[0074] Solder balls are formed on a surface of the bottom wiring layer facing away from the first chip, and the solder balls are electrically connected to the bottom wiring layer.

[0075] The present invention provides a packaging structure with electromagnetic shielding function and a method for forming the same. The structure forms a housing cavity within the substrate of an adapter board, mounts a first chip within the housing cavity, forms an electromagnetic shielding layer within the housing cavity that covers at least the inner wall of the housing cavity, forms a wiring layer on the adapter board, and mounts a second chip on the wiring layer, so that both the first chip and the second chip are electrically connected to the wiring layer. The provision of the electromagnetic shielding layer provides the housing cavity with electromagnetic shielding function, thereby enabling the integration of various types of chips, such as radio frequency chips, within the housing cavity, thereby expanding the functionality of the packaging structure and broadening its application areas. The wiring layer enables the electrical connection between the second chip and the adapter board, and between the second chip and the first chip, without the need for a chip-to-chip bonding process. This not only simplifies the manufacturing process of the packaging structure, but also significantly reduces the manufacturing cost of the packaging structure, helps reduce the overall thickness of the packaging structure, and promotes the miniaturization of the packaging structure. By providing the housing cavity within the adapter board, utilizing the housing cavity to accommodate the first chip, and combining the wiring layer, a large number of I / O interface interconnections can be provided, making the structure suitable for the preparation of packaging structures requiring a high number of I / O interfaces. The present invention does not require the use of processes such as TMV, thereby further reducing manufacturing costs and difficulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0076] To more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly describes the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0077] Figure 1 This is a schematic structural diagram of a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention;

[0078] Figure 2 is another structural schematic diagram of a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention;

[0079] Figure 3 This is another structural diagram of a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention;

[0080] Figure 4 is a flow chart of a method for forming a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention;

[0081] Figure 5 is a schematic cross-sectional view of an adapter plate in a specific embodiment of the present invention;

[0082] Figure 6 is a schematic top view of an adapter plate in a specific embodiment of the present invention;

[0083] Figure 7 is a structural diagram of a specific embodiment of the present invention after the adapter board is mounted on the carrier board;

[0084] Figure 8 This is a structural diagram of a specific embodiment of the present invention after the first chip is mounted in the accommodating cavity;

[0085] Figure 9 is a schematic structural diagram after the electromagnetic shielding layer is formed in a specific embodiment of the present invention;

[0086] Figure 10 This is a schematic diagram of the structure after the third chip is mounted on the first chip in a specific embodiment of the present invention;

[0087] Figure 11 is a schematic structural diagram after the first plastic sealing layer is formed in a specific embodiment of the present invention;

[0088] Figure 12 is a structural schematic diagram of the first plastic sealing layer and the electromagnetic shielding layer after grinding in a specific embodiment of the present invention;

[0089] Figure 13is a schematic diagram of the structure after the top wiring layer is formed in a specific embodiment of the present invention;

[0090] Figure 14 is a schematic diagram of the structure after the second chip is mounted on the top wiring layer in a specific embodiment of the present invention;

[0091] Figure 15 is a schematic structural diagram after the second plastic sealing layer is formed in a specific embodiment of the present invention;

[0092] Figure 16 This is a schematic diagram of the structure after the carrier board is removed in a specific embodiment of the present invention;

[0093] Figure 17 is a schematic diagram of the structure after forming the bottom wiring layer and solder balls in a specific embodiment of the present invention;

[0094] Figure 18 It is a structural schematic diagram of separating adjacent packaging structures with electromagnetic shielding function in a specific embodiment of the present invention. DETAILED DESCRIPTION

[0095] The specific embodiments of the packaging structure with electromagnetic shielding function and the method for forming the same provided by the present invention are described in detail below with reference to the accompanying drawings.

[0096] This specific embodiment provides a packaging structure with electromagnetic shielding function. Figure 1 FIG. 1 is a schematic diagram of a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention. Figure 1 As shown, the packaging structure with electromagnetic shielding function includes:

[0097] The adapter plate includes a substrate 10 and a receiving cavity located in the substrate 10;

[0098] A wiring layer, located on the adapter board;

[0099] A first chip 11 is located in the accommodation cavity and electrically connected to the wiring layer;

[0100] an electromagnetic shielding layer 15, covering at least the inner wall of the accommodating cavity;

[0101] The second chip 12 is located on the transfer board, and the second chip 12 is electrically connected to the wiring layer.

[0102] Specifically, the substrate 10 in the adapter board can be but is not limited to a silicon substrate. This specific embodiment is described by taking the substrate 10 as a silicon substrate as an example. By etching the substrate 10, a receiving cavity for at least receiving the first chip 11 is formed inside the substrate 10. The electromagnetic shielding layer 15 at least covers the inner wall of the receiving cavity, thereby electromagnetically shielding the first chip 11 located inside the receiving cavity, so that the type of the first chip 11 can be flexibly adjusted according to actual needs. For example, the first chip 11 can be a radio frequency chip, which helps to expand the function of the packaging structure and expand the application field of the packaging structure. The wiring layer is arranged on the adapter board. In one example, the wiring layer is a high-density wiring layer, and the wiring layer includes a dielectric layer and a high-density metal trace located in the dielectric layer. The wiring layer is electrically connected to the adapter board, and the first chip 11 and the second chip 12 are both electrically connected to the wiring layer, so that the electrical connection between the second chip 12 and the adapter board and the electrical connection between the second chip 12 and the first chip 11 are realized through the wiring layer, without the need to use a chip-to-chip bonding process, which not only simplifies the manufacturing process of the packaging structure, but also greatly reduces the manufacturing cost of the packaging structure, and helps to reduce the overall thickness of the packaging structure, and promotes the development of the packaging structure towards miniaturization. By setting the accommodating cavity in the adapter board, and using the accommodating cavity to accommodate the first chip 11, and combining the setting of the wiring layer, a large number of I / O interface interconnections can be provided for the adapter board, which is suitable for the preparation of packaging structures that require a high number of I / O interfaces. In this specific embodiment, there is no need to use processes such as TMV, thereby further reducing manufacturing costs and manufacturing difficulty.

[0103] In some embodiments, the electromagnetic shielding layer 15 may be a metal shielding layer formed on the inner wall of the accommodating cavity by a metal sputtering process.

[0104] In some embodiments, the electromagnetic shielding layer 15 continuously covers the side walls of the accommodating cavity, part of the surface of the wiring layer and the surface of the first chip 11, so that the electromagnetic shielding layer 15 can not only prevent the first chip 11 from being affected by electromagnetic interference in the external environment, but also prevent electromagnetic interference between the first chip 11 and the second chip 12, thereby further ensuring the performance stability of the packaging structure with electromagnetic shielding function.

[0105] In some embodiments, the wiring layer includes a grounding circuit, and the electromagnetic shielding layer 15 is electrically connected to the grounding circuit; or,

[0106] The adapter board also has a ground terminal located outside the wiring layer, and the electromagnetic shielding layer 15 is electrically connected to the ground terminal.

[0107] For example, by setting the grounding circuit in the wiring layer and electrically connecting the electromagnetic shielding layer 15 with the grounding circuit in the wiring layer, the electromagnetic shielding layer 15 is grounded through the grounding circuit in the wiring layer, and there is no need to additionally set a grounding terminal electrically connected to the electromagnetic shielding layer 15 outside the wiring layer. This not only simplifies the manufacturing process of the packaging structure with electromagnetic shielding function, but also improves the circuit arrangement density inside the packaging structure with electromagnetic shielding function, which helps to further reduce the size of the packaging structure with electromagnetic shielding function.

[0108] For another example, the adapter board is provided with a grounding terminal located outside the wiring layer, and the electromagnetic shielding layer 15 is grounded through the grounding terminal, which helps to simplify the line structure in the wiring layer and avoid mutual influence between the grounding terminal and the wiring layer, further ensuring the reliability of the packaging structure with electromagnetic shielding function.

[0109] In some embodiments, the adapter plate includes an upper surface and a lower surface that are relatively distributed; and the wiring layer includes:

[0110] a top wiring layer 21 located on the upper surface of the adapter board, the second chip 12 being electrically connected to the top wiring layer 21;

[0111] The bottom wiring layer 22 is located on the lower surface of the adapter board. The first chip 11 is electrically connected to the bottom wiring layer 22 , and the top wiring layer 21 is electrically connected to the bottom wiring layer 22 .

[0112] In some embodiments, the adapter plate further includes:

[0113] A conductive connection pillar 20 passes through the substrate 10 , and one end of the conductive connection pillar 20 is electrically connected to the top wiring layer 21 , and the other end of the conductive connection pillar 20 is electrically connected to the bottom wiring layer 22 .

[0114] For example, the adapter board includes the upper surface and the lower surface opposite to the upper surface. The surface of the substrate 10 facing the top wiring layer 21 is the top surface of the substrate 10, and the surface of the substrate 10 facing the bottom wiring layer 22 is the bottom surface of the substrate 10. The top surface of the substrate 10 serves as the upper surface of the adapter board, and the bottom surface of the substrate 10 serves as the lower surface of the adapter board. The second chip 12 is located above the upper surface of the adapter board, the top wiring layer 21 is arranged between the second chip 12 and the substrate 10 of the adapter board, and the bottom wiring layer 22 is located on the lower surface of the adapter board. In one example, the top wiring layer 21 includes a top dielectric layer covering the upper surface of the adapter board and a top high-density metal trace located inside the top dielectric layer. The bottom wiring layer 22 includes a bottom dielectric layer covering the lower surface of the adapter board and a bottom high-density metal trace located inside the bottom dielectric layer. The conductive connection pillar 20 extends through the substrate 10 in a direction perpendicular to the upper surface of the adapter board, with one end of the conductive connection pillar 20 electrically connected to the top high-density metal trace in the top wiring layer 21 and the other end electrically connected to the bottom high-density metal trace in the bottom wiring layer 22. In one example, the conductive connection pillar 20 is located outside the accommodating cavity, and multiple conductive connection pillars 20 are distributed around the periphery of the accommodating cavity to provide more I / O interfaces for the adapter board and ensure a stable electrical connection between the top wiring layer 21 and the bottom wiring layer 22. The term "multiple" in this embodiment refers to more than two.

[0115] In order to improve the flexibility of grounding the electromagnetic shielding layer 15, in some embodiments, the electromagnetic shielding layer 15 is electrically connected to the bottom wiring layer 22; or,

[0116] The electromagnetic shielding layer 15 is electrically connected to the top wiring layer 21 .

[0117] In one example, a bottom grounding circuit is provided in the bottom wiring layer 22 , and the electromagnetic shielding layer 15 is electrically connected to the bottom grounding circuit in the bottom wiring layer 22 , that is, the electromagnetic shielding layer 15 is grounded through the bottom wiring layer 22 .

[0118] In another example, a top grounding line is provided in the top wiring layer 21 , and the electromagnetic shielding layer 15 is electrically connected to the top grounding line in the top wiring layer 21 , that is, the electromagnetic shielding layer 15 is grounded through the top wiring layer 21 .

[0119] In another example, a bottom grounding line is provided in the bottom wiring layer 22, the electromagnetic shielding layer 15 is electrically connected to the top wiring layer 21, one end of the conductive connecting column 20 is electrically connected to the top wiring layer 21, and the other end is electrically connected to the bottom grounding line in the bottom wiring layer 22, so that the electromagnetic shielding layer 15 is grounded through the top wiring layer 21, the conductive connecting column 20 and the bottom wiring layer 22 in sequence.

[0120] In some embodiments, the packaging structure with electromagnetic shielding function further includes:

[0121] The solder balls 14 are located on a surface of the bottom wiring layer 22 facing away from the first chip 11 , and the solder balls 14 are electrically connected to the bottom wiring layer 22 .

[0122] Specifically, a plurality of solder balls 14 are arranged at intervals on a surface of the bottom wiring layer 22 facing away from the substrate 10, and the solder balls 14 are electrically connected to the bottom wiring layer 22. The bottom wiring layer 22 can be electrically connected to a packaging substrate (e.g., a PCB) through the solder balls 14, so that signals in the bottom wiring layer 22 and the top wiring layer 21 can be led out through the solder balls 14, or control signals can be transmitted to the bottom wiring layer 22 and the top wiring layer 21 through the solder balls 14.

[0123] In some embodiments, the accommodating cavity penetrates the substrate 10, the top wiring layer 21 covers the top surface of the substrate 10 and closes the top of the accommodating cavity, and the bottom wiring layer 22 covers the bottom surface of the substrate 10 and closes the bottom of the accommodating cavity;

[0124] The first chip 11 is located on a surface of the bottom wiring layer 22 facing the top wiring layer 21 .

[0125] For example, in a direction perpendicular to the upper surface of the adapter board, the accommodating cavity passes through the substrate 10, that is, the top of the accommodating cavity exposes the top wiring layer 21, and the bottom of the accommodating cavity exposes the bottom wiring layer 22. The first chip 11 includes a relatively distributed functional surface and a back surface. The first chip 11 is mounted on the bottom wiring layer 22 with the functional surface facing the bottom wiring layer 22, and a first conductive bump is provided on the functional surface of the first chip 11. The first chip 11 is electrically connected to the bottom wiring layer 22 through the first conductive bump. This specific embodiment helps to increase the space of the accommodating cavity by setting the accommodating cavity to pass through the substrate 10, so as to facilitate the integration of different numbers or types of chips in the accommodating cavity as needed, thereby improving the integration of the packaging structure with electromagnetic shielding function while further increasing the number of I / O interfaces in the adapter board, so as to further expand the application field of the packaging structure with electromagnetic shielding function.

[0126] In some embodiments, a plurality of the first chips 11 are arranged on the bottom wiring layer 22 at intervals along a direction parallel to the upper surface of the transfer board;

[0127] The electromagnetic shielding layer 15 continuously covers the sidewalls of the accommodation cavity, a portion of the surface of the bottom wiring layer 22 , and the surfaces of the plurality of first chips 11 .

[0128] In some embodiments, the packaging structure with electromagnetic shielding function further includes:

[0129] The third chip 13 is located in the accommodation cavity. The third chip 13 is located above the first chip 11 and is electrically connected to the top wiring layer 21 .

[0130] In some embodiments, the first chip 11 includes a functional surface and a back surface that are relatively distributed, and the functional surface of the first chip 11 faces the bottom wiring layer 22;

[0131] The third chip 13 includes a functional surface and a back surface that are relatively distributed. The functional surface of the third chip 13 faces the top wiring layer 21 , and the electromagnetic shielding layer 15 on the back surface of the first chip 11 is connected to the back surface of the third chip 13 via an adhesive layer 18 .

[0132] In some embodiments, the back surface of the third chip 13 is continuously connected to the electromagnetic shielding layer 15 on the back surface of the plurality of first chips 11 through the adhesive layer 18. Figure 1 shown.

[0133] For example, a plurality of the first chips 11 are arranged in the accommodating cavity at intervals along a direction parallel to the upper surface of the adapter plate, and a plurality of the first chips 11 are mounted on the bottom wiring layer 22 with their functional surfaces facing the bottom wiring layer 22, that is, a plurality of the first chips 11 are flip-chip mounted on the bottom wiring layer 22, and each of the first chips 11 is electrically connected to the bottom wiring layer 22, as shown in FIG. Figure 1 shown. Figure 1 In the example, two first chips 11 are arranged in the accommodating cavity at intervals along a direction parallel to the upper surface of the adapter board. The electromagnetic shielding layer 15 continuously covers the entire side wall of the accommodating cavity, part of the top surface of the bottom wiring layer 22 (the top surface of the bottom wiring layer 22 refers to the surface of the bottom wiring layer 22 facing the top wiring layer 21) and the surfaces of multiple first chips 11 (including the side surfaces of each first chip 11 and the top surface of the first chip 11 facing the top wiring layer 21), so that the electromagnetic shielding layer 15 can not only prevent multiple first chips 11 from being subjected to electromagnetic interference in the external environment, but also prevent electromagnetic interference between adjacent first chips 11, thereby further ensuring the performance stability of the packaging structure with electromagnetic shielding function. In one example, the multiple first chips 11 located in the accommodating cavity are of the same type. In another example, there are at least two first chips 11 of different types in the accommodating cavity.

[0134] The third chip 13 includes a functional surface and a back surface that are positioned opposite each other. Third conductive bumps 23 are provided on the functional surface of the third chip 13, and the adhesive layer 18 is provided on the back surface of the third chip 13. The projection of the third chip 13 on the top surface of the substrate 10 continuously overlaps the projections of the multiple first chips 11 on the top surface of the substrate 10, thereby enabling the third chip 13 to be continuously connected to the electromagnetic shielding layer 15 on the back surfaces of the multiple first chips 11 via the adhesive layer 18. In one example, the adhesive layer 18 is an insulating adhesive layer to prevent mutual interference between the third chip 13 and the first chips 11. The functional surface of the third chip 13 faces the top wiring layer 21, and the third chip 13 is electrically connected to the top wiring layer 21 via the third conductive bumps 23. Placing the third chip 13 within the accommodating cavity not only increases the number of I / O interfaces on the adapter board, but also facilitates the integration of multiple chips of different sizes or types into the adapter board, further expanding the application areas of the package structure with electromagnetic shielding function. At the same time, since the electromagnetic shielding layer 15 covers the entire side wall of the accommodating cavity, part of the top surface of the bottom wiring layer 22 and the surface of multiple first chips 11, the electromagnetic shielding layer 15 can not only prevent the first chip 11 and the third chip 13 from being affected by electromagnetic interference in the external environment, but also achieve electromagnetic shielding between the first chip 11 and the third chip 13, that is, avoid electromagnetic interference between the first chip 11 and the third chip 13.

[0135] Figure 2 FIG. 1 is another structural diagram of a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention. In other embodiments, such as Figure 2 As shown, the accommodating cavity contains a plurality of third chips 13 corresponding to the plurality of first chips 11, and a plurality of independent adhesive layers 18 are distributed on the back surfaces of the plurality of third chips 13 in a one-to-one correspondence. Each third chip 13 is attached to the electromagnetic shielding layer 15 on the back surface of the corresponding first chip 11 through an adhesive layer 18. Figure 2 The structure shown can further increase the number of chips integrated in the accommodating cavity, thereby further improving the integration level of the packaging structure with electromagnetic shielding function.

[0136] Figure 3 FIG. 1 is another structural diagram of a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention. In some other embodiments, such as Figure 3As shown, the accommodating cavity contains only one first chip 11 and one third chip 13. The first chip 11 is located on the bottom wiring layer 22 with its functional surface facing the bottom wiring layer 22. The back of the third chip 13 is covered with the adhesive layer 18, and the third chip 13 is bonded to the electromagnetic shielding layer on the back of the first chip 11 through the adhesive layer 18. The functional surface of the third chip 13 is provided with a third conductive bump 23, and the third chip 13 is electrically connected to the top wiring layer 21 through the third conductive bump 23. The size of the third chip 13 can be greater than, equal to, or smaller than the size of the first chip 11.

[0137] In some embodiments, in a direction parallel to the upper surface of the transfer board, the width of the second chip 12 is greater than the width of the accommodation cavity.

[0138] For example, the second chip 12 includes a functional surface and a back surface that are relatively distributed, and a second conductive bump 19 is provided on the functional surface of the second chip. The second chip 12 is mounted on the top wiring layer 21 with its functional surface facing the top wiring layer 21, and the second chip 12 is electrically connected to the top wiring layer 21 via the second conductive bump 19. By mounting a larger second chip 12 on the top wiring layer 21, multiple chips of different sizes can be integrated into the package structure with electromagnetic shielding function, thereby further improving the integration level of the package structure with electromagnetic shielding function and expanding the functionality of the package structure with electromagnetic shielding function.

[0139] In some embodiments, the packaging structure with electromagnetic shielding function further includes:

[0140] A first plastic packaging layer 16 is filled in the accommodating cavity, and the first plastic packaging layer 16 covers the surface of the electromagnetic shielding layer 15 and plastic packages the first chip 11;

[0141] The second plastic packaging layer 17 is located above the transfer board, and the second plastic packaging layer 17 plastic packages the second chip 12 .

[0142] For example, if Figure 1As shown, the first molding layer 16 fills the accommodating cavity and molds the first chip 11 and the third chip 13 in the accommodating cavity. The second molding layer 17 is located above the adapter board and molds the second chip 12. By providing the first molding layer 16 and the second molding layer 17, not only can the first chip 11, the second chip 12 and the third chip 13 be protected, but also the strength of the adapter board can be enhanced, and the stress on the opposite sides of the top wiring layer 21 can be balanced, reducing or even avoiding a large degree of deformation of the top wiring layer 21. In one example, the material of the first molding layer 16 and the material of the second molding layer 17 are the same, for example, the material of the first molding layer 16 and the material of the second molding layer 17 are both epoxy resin molding compound.

[0143] In some embodiments, the substrate 10 has a plurality of spaced-apart accommodating cavities, and each of the accommodating cavities is provided with the first chip 11 ;

[0144] The electromagnetic shielding layer 15 is continuously distributed in the plurality of accommodating cavities; or, a plurality of separate electromagnetic shielding layers 15 are distributed in the plurality of accommodating cavities in a one-to-one correspondence.

[0145] For example, by providing a plurality of spaced-apart accommodating cavities within the substrate 10, it is possible to utilize the plurality of accommodating cavities to integrate chips with various functions within the adapter board, thereby increasing the diversity of chips that can be integrated within the package structure with electromagnetic shielding function. In one example, one electromagnetic shielding layer 15 is continuously distributed within the plurality of accommodating cavities, thereby helping to simplify the manufacturing process of the electromagnetic shielding layer 15. In another example, a plurality of discrete electromagnetic shielding layers 15 are distributed in a one-to-one correspondence within the plurality of accommodating cavities, thereby enabling the type of chips integrated within the different accommodating cavities to be flexibly adjusted as needed, thereby further increasing the manufacturing and use flexibility of the package structure with electromagnetic shielding function.

[0146] This specific embodiment also provides a method for forming a packaging structure with electromagnetic shielding function. Figure 4 This is a flow chart of a method for forming a packaging structure with electromagnetic shielding function in a specific embodiment of the present invention. The schematic diagram of the packaging structure with electromagnetic shielding function formed in this specific embodiment can be seen in FIG. Figure 1-Figure 3 .like Figures 1-4 As shown, the method for forming the packaging structure with electromagnetic shielding function includes the following steps:

[0147] Step S41, forming an adapter plate, wherein the adapter plate includes a substrate 10 and a receiving cavity located in the substrate 10;

[0148] Step S42 , mounting the first chip 11 in the accommodating cavity and forming an electromagnetic shielding layer 15 that at least covers the inner wall of the accommodating cavity;

[0149] Step S43 , forming a wiring layer on the adapter board, and mounting the second chip 12 on the adapter board, wherein both the first chip 11 and the second chip 12 are electrically connected to the wiring layer.

[0150] Figure 5 is a schematic cross-sectional view of an adapter plate in a specific embodiment of the present invention, Figure 6 : is a schematic top view of an adapter plate in a specific embodiment of the present invention. In some embodiments, the specific steps of forming the adapter plate include:

[0151] providing a substrate 10;

[0152] The substrate 10 is etched to form the accommodating cavity 50 penetrating the substrate 10 .

[0153] In some embodiments, before etching the substrate 10, the following steps are further included:

[0154] A plurality of conductive connecting pillars 20 are formed penetrating the substrate 10 .

[0155] For example, a silicon wafer is provided as the substrate 10, and the substrate 10 includes a top surface 101 and a bottom surface 102 opposite to the top surface 101. The substrate 10 is etched to form a plurality of silicon vias (TSVs) penetrating the substrate 10. Metal materials such as copper are filled into the TSVs to form the conductive connecting pillars 20. Afterwards, the substrate 10 is etched to form the accommodating cavity 50 penetrating the substrate 10 in the substrate 10, and the periphery of each accommodating cavity 50 is provided with a plurality of conductive connecting pillars 20, such as Figure 5 and Figure 6 shown. Figure 5 The dotted box in the figure represents a unit structure, which is subsequently used to form a packaging structure with electromagnetic shielding function.

[0156] Figure 7 1 is a schematic diagram of the structure after the adapter board is mounted on the carrier board in a specific embodiment of the present invention. Figure 8 1 is a schematic diagram of the structure after the first chip is mounted in the receiving cavity in a specific embodiment of the present invention. Figure 9 Schematic diagram of the structure after the electromagnetic shielding layer is formed in a specific embodiment of the present invention. Figure 7 、 Figure 8 and Figure 9Each dotted box in the figure represents a unit structure, each of which is subsequently used to form a package structure with electromagnetic shielding function. In some embodiments, the adapter plate includes an upper surface and a lower surface that are relatively distributed. The specific steps of mounting the first chip 11 in the accommodating cavity 50 and forming the electromagnetic shielding layer 15 that at least covers the inner wall of the accommodating cavity 50 include:

[0157] Providing a carrier plate 80;

[0158] The adapter plate is mounted on the carrier plate 80 along the lower surface of the adapter plate toward the carrier plate 80, as shown in FIG. Figure 7 As shown;

[0159] The first chip 11 is mounted on the carrier 80 in the receiving cavity 50, as shown in FIG. Figure 8 As shown;

[0160] The electromagnetic shielding layer 15 is formed to continuously cover the inner wall of the accommodating cavity 50 and the surface of the first chip 11, such as Figure 9 shown.

[0161] In some embodiments, the specific steps of mounting the first chip 11 on the carrier 80 in the receiving cavity 50 include:

[0162] A plurality of first chips 11 are mounted on the carrier board 80 in the receiving cavity 50 , and the plurality of first chips 11 are arranged at intervals along a direction parallel to the upper surface of the transfer board.

[0163] In some embodiments, the specific steps of forming the electromagnetic shielding layer 15 that continuously covers the inner wall of the accommodating cavity 50 and the surface of the first chip 11 include:

[0164] The electromagnetic shielding layer 15 is formed by sputtering to continuously cover the inner wall of the accommodating cavity 50 and the entire surface of the first chip 11 .

[0165] For example, the substrate 10 includes a top surface 101 and a bottom surface 102 that are relatively distributed, and the top surface 101 of the substrate 10 serves as the upper surface of the adapter board, and the bottom surface 102 of the substrate 10 serves as the lower surface of the adapter board. In a direction perpendicular to the upper surface of the adapter board, each of the accommodating cavities 50 penetrates the substrate 10. The first chip 11 includes a functional surface and a back surface that are relatively distributed, and a first conductive bump is provided on the functional surface of the first chip. The adapter board is mounted on the carrier board 80 through a peeling layer (see Figure 7 ), the first chip 11 is mounted on the upper surface of the carrier 80 with the functional surface of the first chip 11 facing the carrier 80, as shown in FIG. Figure 8As shown. Multiple first chips 11 can be synchronously mounted in the same accommodating cavity 50, and multiple first chips 11 are spaced apart in a direction parallel to the upper surface of the adapter board. Then, a sputtering process is used to simultaneously sputter metal material into the multiple accommodating cavities 50 to form the electromagnetic shielding layer that continuously covers the top surface 101 of the substrate 10, the side walls of the accommodating cavity 50, part of the bottom surface of the accommodating cavity 50 and the surface of the first chip 11 (including the side surfaces of the first chip 11 and the top surface of the first chip 11), as shown. Figure 9 This specific embodiment realizes electromagnetic shielding between the first chip 11 and the external environment and electromagnetic shielding between adjacent first chips 11 through a single sputtering process, thereby further reducing the manufacturing cost of the package structure with electromagnetic shielding function and simplifying the manufacturing process.

[0166] Figure 10 This is a schematic diagram of the structure after the third chip is mounted on the first chip in a specific embodiment of the present invention. Figure 10 Each dotted box in the figure represents a unit structure, each of which is subsequently used to form a package structure with electromagnetic shielding function. In some embodiments, the first chip 11 includes a functional surface and a back surface that are relatively distributed, and the functional surface of the first chip 11 faces the carrier 80. Before forming the wiring layer on the adapter board, the following steps are also included:

[0167] Providing a third chip 13, wherein the third chip 13 includes a functional surface and a back surface that are relatively distributed;

[0168] The third chip 13 is mounted on the electromagnetic shielding layer 15 on the back side of the first chip 11 in the accommodation cavity 50 through the adhesive layer 18, and the back side of the third chip 13 faces the first chip 11. Figure 10 shown.

[0169] In some embodiments, the specific steps of attaching the third chip 13 to the electromagnetic shielding layer 15 on the back side of the first chip 11 in the accommodating cavity 50 through an adhesive layer 18 include:

[0170] The third chip 13 is mounted on the electromagnetic shielding layer 15 on the back of the plurality of first chips 11 in the accommodation cavity 50 through the adhesive layer 18. Figure 1 and Figure 10 shown.

[0171] For example, the third chip 13 includes a functional surface and a back surface that are relatively distributed. A third conductive bump 23 is provided on the functional surface of the third chip 13, and the adhesive layer 18 is provided on the back surface of the third chip 13. The third chip 13 is connected to the electromagnetic shielding layer 15 on the back surface of the first chip 11, with the adhesive layer 18 facing the first chip 11. The projection of the third chip 13 on the top surface of the substrate 10 continuously covers the projections of multiple first chips 11 on the top surface of the substrate 10, thereby enabling the third chip 13 to be continuously connected to the electromagnetic shielding layers 15 on the back surfaces of multiple first chips 11 via the adhesive layer 18. In one example, the adhesive layer 18 is an insulating adhesive layer to prevent mutual interference between the third chip 13 and the first chip 11. Placing the third chip 13 within the accommodating cavity 50 not only further increases the number of I / O interfaces on the adapter board, but also facilitates the integration of multiple chips of different sizes or types into the adapter board, further expanding the application areas of the package structure with electromagnetic shielding function. At the same time, since the electromagnetic shielding layer 15 covers the entire side wall of the accommodating cavity, part of the top surface of the bottom wiring layer 22 and the surface of multiple first chips 11, the electromagnetic shielding layer 15 can not only prevent the third chip 13 from being affected by electromagnetic interference in the external environment, but also achieve electromagnetic shielding between the first chip 11 and the third chip 13, that is, avoid electromagnetic interference between the first chip 11 and the third chip 13.

[0172] Figure 11 is a schematic structural diagram after the first plastic sealing layer is formed in a specific embodiment of the present invention, Figure 12 Schematic diagram of the structure after the first plastic packaging layer and the electromagnetic shielding layer are ground in a specific embodiment of the present invention. Figure 11 and Figure 12 Each dotted box in the figure represents a unit structure, and each of the unit structures is subsequently used to form a package structure with electromagnetic shielding function. In some embodiments, before forming a wiring layer on the adapter board and attaching the second chip 12 to the adapter board, the following steps are also included:

[0173] A first molding layer 16 is formed to fill the accommodating cavity 50 and to mold the first chip 11 and the third chip 13. Figure 11 shown.

[0174] In some embodiments, the substrate 10 includes a bottom surface 102 facing the carrier 80 and a top surface 101 opposite the bottom surface 102 , and the electromagnetic shielding layer 15 further covers the top surface 101 of the substrate 10 . The specific steps of forming the first molding layer 16 that fills the accommodating cavity 50 and molds the first chip 11 and the third chip 13 include:

[0175] forming a first molding layer 16 that fills the accommodating cavity 50 and molds the first chip 11 and the third chip 13 , and the first molding layer 16 is also located on the top surface 101 of the substrate 10 ;

[0176] The first plastic packaging layer 16 on the top surface 101 of the substrate 10 and the electromagnetic shielding layer 15 covering the top surface 101 of the substrate 10 are removed by a grinding process.

[0177] For example, after the electromagnetic shielding layer 15 is formed, the first plastic sealing layer 16 is formed by a plastic sealing process to fill the accommodating cavity 50 and cover the top surface 101 of the substrate 10, and the first plastic sealing layer 16 plastic seals the first chip 11 and the third chip 13 in the accommodating cavity 50. Figure 11 Next, the first plastic encapsulation layer 16 on the top surface 101 of the substrate 10 and the electromagnetic shielding layer 15 covering the top surface 101 of the substrate 10 are removed by a grinding process to expose the conductive connection column 20 and the third conductive bump 23, as shown. Figure 1 and Figure 12 In one example, after the grinding process, the surface of the exposed conductive connection pillar 20 , the surface of the exposed third conductive bump 23 , and the surface of the remaining first plastic encapsulation layer 16 are flush.

[0178] Figure 13 is a schematic diagram of the structure after the top wiring layer is formed in a specific embodiment of the present invention, Figure 14 1 is a schematic diagram of the structure after the second chip is mounted on the top wiring layer in a specific embodiment of the present invention. Figure 15 is a schematic structural diagram after the second plastic sealing layer is formed in a specific embodiment of the present invention, Figure 16 is a schematic diagram of the structure after removing the carrier board in a specific embodiment of the present invention, Figure 17 Schematic diagram of the structure after forming the bottom wiring layer and solder balls in a specific embodiment of the present invention. Figure 14 、 Figure 15 、 Figure 16 and Figure 17Each dotted box in the figure represents a unit structure, and each of the unit structures is subsequently used to form a package structure with electromagnetic shielding function. In some embodiments, the specific steps of forming a wiring layer on the adapter board and mounting the second chip 12 on the adapter board include:

[0179] A top wiring layer 21 is formed to cover the upper surface of the adapter board and the top surface of the first plastic packaging layer 16, as shown in FIG. Figure 1 and Figure 13 As shown;

[0180] The second chip 12 is mounted on the top wiring layer 21, and the second chip 12 is electrically connected to the top wiring layer 21. Figure 1 and Figure 14 As shown;

[0181] Remove the carrier plate 80, as shown Figure 16 As shown;

[0182] A bottom wiring layer 22 is formed covering the lower surface of the adapter board and the bottom surface of the first plastic layer 16 to form the wiring layer including the top wiring layer 21 and the bottom wiring layer 22, and the first chip 11 is electrically connected to the bottom wiring layer 22, as shown in FIG. Figure 17 shown.

[0183] In some embodiments, before removing the carrier plate 80, the following steps are further included:

[0184] A second plastic encapsulation layer 17 is formed on the transfer board to encapsulate the second chip 12, such as Figure 15 shown.

[0185] In some embodiments, after forming the bottom wiring layer 22 covering the lower surface of the adapter board and the bottom surface of the first plastic layer 16 , the following steps are further included:

[0186] Solder balls 14 are formed on a surface of the bottom wiring layer 22 facing away from the first chip 11 , and the solder balls 14 are electrically connected to the bottom wiring layer 22 .

[0187] Figure 18 1 is a schematic diagram of a structure in which adjacent packaging structures with electromagnetic shielding functions are separated in a specific embodiment of the present invention. For example, a top wiring layer 21 is formed to cover the upper surface of the adapter board and the top surface of the first plastic layer 16, and the third conductive bump 23 on the functional surface of the third chip 13 is electrically connected to the top wiring layer 21, as shown in FIG. Figure 1 and Figure 13As shown. In one example, the top wiring layer 21 includes a top dielectric layer covering the upper surface of the adapter board and a top high-density metal trace located inside the top dielectric layer. The second chip 12 includes a functional surface and a back surface that are relatively distributed, and a second conductive bump 19 is provided on the functional surface of the second chip 12. The second chip 12 is mounted on the top wiring layer 21 with the second conductive bump 19 facing the top wiring layer 21, and the second chip 12 is electrically connected to the top wiring layer 21 through the second conductive bump 19, as shown. Figure 1 and Figure 14 Then, a second plastic encapsulation layer 17 is formed on the transfer board to encapsulate the second chip 12 using a plastic encapsulation process, as shown in FIG. Figure 1 and Figure 15 As shown. By providing the first plastic encapsulation layer 16 and the second plastic encapsulation layer 17, not only can the first chip 11, the second chip 12, and the third chip 13 be protected, but the strength of the adapter board can also be enhanced, and the stress on the two opposite sides of the top wiring layer 21 can be balanced, thereby reducing or even preventing a large degree of deformation of the top wiring layer 21. In one example, the material of the first plastic encapsulation layer 16 and the material of the second plastic encapsulation layer 17 are the same, for example, the material of the first plastic encapsulation layer 16 and the material of the second plastic encapsulation layer 17 are both epoxy resin molding compound.

[0188] Then, flip as Figure 15 The structure shown in FIG. 8 is shown in FIG. 8 and the carrier plate 80 is peeled off through the peeling layer to expose the lower surface of the adapter plate. Figure 16 As shown. Then, a bottom wiring layer 22 is formed to cover the lower surface of the adapter board and the bottom surface of the first plastic layer 16, and the first chip 11 is electrically connected to the bottom wiring layer 22 through the first conductive bump, and the conductive connection column 20 is also electrically connected to the bottom wiring layer 22. In one example, the bottom wiring layer 22 includes a bottom dielectric layer covering the lower surface of the adapter board and a bottom high-density metal trace located inside the bottom dielectric layer. Afterwards, a solder ball 14 is formed on the surface of the bottom wiring layer 22 facing away from the first chip 11, and the solder ball 14 is electrically connected to the bottom wiring layer 22, as shown. Figure 1 and Figure 17 Then, cut along the cutting path 190 as shown. Figure 17 The structure shown in FIG. 1 separates adjacent packaging structures having electromagnetic shielding functions, such as Figure 18 shown.

[0189] This embodiment provides a package structure with electromagnetic shielding function and its formation method. A cavity is formed within the substrate of an adapter board, a first chip is mounted within the cavity, and an electromagnetic shielding layer is formed within the cavity to cover at least the inner wall of the cavity. A wiring layer is formed on the adapter board, and a second chip is mounted on the wiring layer, so that both the first chip and the second chip are electrically connected to the wiring layer. The provision of the electromagnetic shielding layer provides the cavity with electromagnetic shielding function, enabling the integration of various types of chips, such as radio frequency chips, within the cavity, thereby helping to expand the functionality and application of the package structure. The wiring layer enables electrical connections between the second chip and the adapter board, and between the second chip and the first chip, without the need for chip-to-chip bonding. This not only simplifies the manufacturing process of the package structure, but also significantly reduces the manufacturing cost of the package structure, helps reduce the overall thickness of the package structure, and promotes the development of miniaturization of the package structure. By providing the cavity within the adapter board, utilizing the cavity to accommodate the first chip, and combining it with the wiring layer, a large number of I / O interface interconnections can be provided, making it suitable for the preparation of package structures requiring a high number of I / O interfaces. This specific embodiment does not require the use of processes such as TMV, thereby further reducing manufacturing costs and difficulty.

[0190] It should be noted that the terms "including," "having," and their variations, as used in this document, are intended to cover non-exclusive inclusions. Terms such as "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a specific order or precedence, unless the context clearly indicates otherwise. Such usage should be understood to be interchangeable where appropriate. The term "one or more" may be used to describe a feature, structure, or characteristic in the singular, or in the plural, depending at least in part on the context, to describe a feature, structure, or combination of features. The term "based on" should be understood as not necessarily intended to express an exclusive set of factors, but may alternatively, also depending at least in part on the context, allow for the presence of other factors that are not necessarily explicitly described. Furthermore, the embodiments of the present invention and the features therein may be combined with one another, unless there is a conflict. Furthermore, descriptions of well-known components and technologies have been omitted from the above description to avoid unnecessary confusion regarding the concepts of the present invention. In each of the above embodiments, each embodiment focuses on its differences from the other embodiments, and reference may be made to the same or similar parts between the embodiments.

[0191] The above description is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A packaging structure with electromagnetic shielding function, characterized in that: include: An adapter plate comprising a substrate and a receiving cavity located in the substrate; A wiring layer, located on the adapter board; A first chip is located in the accommodating cavity and is electrically connected to the wiring layer; an electromagnetic shielding layer, covering at least the inner wall of the accommodating cavity; The second chip is located on the adapter board, and the second chip is electrically connected to the wiring layer.

2. The packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The wiring layer includes a grounding circuit, and the electromagnetic shielding layer is electrically connected to the grounding circuit; or, The adapter board also has a grounding terminal located outside the wiring layer, and the electromagnetic shielding layer is electrically connected to the grounding terminal.

3. The packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The adapter plate includes an upper surface and a lower surface that are relatively distributed; the wiring layer includes: a top wiring layer, located on the upper surface of the adapter board, the second chip being electrically connected to the top wiring layer; A bottom wiring layer is located on the lower surface of the adapter board, the first chip is electrically connected to the bottom wiring layer, and the top wiring layer is electrically connected to the bottom wiring layer.

4. The packaging structure with electromagnetic shielding function according to claim 3, characterized in that: The adapter plate further includes: A conductive connection column passes through the substrate, and one end of the conductive connection column is electrically connected to the top wiring layer, and the other end of the conductive connection column is electrically connected to the bottom wiring layer.

5. The packaging structure with electromagnetic shielding function according to claim 4, characterized in that: The electromagnetic shielding layer is electrically connected to the bottom wiring layer; or, The electromagnetic shielding layer is electrically connected to the top wiring layer.

6. The packaging structure with electromagnetic shielding function according to claim 3, characterized in that: Also includes: Solder balls are located on a surface of the bottom wiring layer facing away from the first chip, and the solder balls are electrically connected to the bottom wiring layer.

7. The packaging structure with electromagnetic shielding function according to claim 3, characterized in that: The accommodating cavity passes through the substrate, the top wiring layer covers the top surface of the substrate and closes the top of the accommodating cavity, and the bottom wiring layer covers the bottom surface of the substrate and closes the bottom of the accommodating cavity; The first chip is located on a surface of the bottom wiring layer facing the top wiring layer.

8. The packaging structure with electromagnetic shielding function according to claim 7, characterized in that: The electromagnetic shielding layer continuously covers the sidewall of the accommodation cavity, a portion of the surface of the wiring layer, and the surface of the first chip.

9. The packaging structure with electromagnetic shielding function according to claim 7, characterized in that: A plurality of the first chips are arranged on the bottom wiring layer at intervals along a direction parallel to the upper surface of the adapter board; The electromagnetic shielding layer continuously covers the sidewall of the accommodation cavity, a portion of the surface of the bottom wiring layer, and the surfaces of the plurality of first chips.

10. The packaging structure with electromagnetic shielding function according to claim 8 or 9, characterized in that: Also includes: A third chip is located in the accommodating cavity. The third chip is located above the first chip and is electrically connected to the top wiring layer.

11. The packaging structure with electromagnetic shielding function according to claim 10, characterized in that: The first chip comprises a functional surface and a back surface that are relatively distributed, and the functional surface of the first chip faces the bottom wiring layer; The third chip includes a functional surface and a back surface that are relatively distributed. The functional surface of the third chip faces the top wiring layer, and the electromagnetic shielding layer on the back surface of the first chip is connected to the back surface of the third chip through an adhesive layer.

12. The packaging structure with electromagnetic shielding function according to claim 11, characterized in that: The back surface of the third chip is continuously connected to the electromagnetic shielding layers on the back surfaces of the plurality of first chips through the adhesive layer.

13. The packaging structure with electromagnetic shielding function according to claim 11, characterized in that: In a direction parallel to the upper surface of the transfer board, the width of the second chip is greater than the width of the accommodation cavity.

14. The packaging structure with electromagnetic shielding function according to claim 4, characterized in that: Also includes: a first plastic packaging layer, filled in the accommodating cavity, covering the surface of the electromagnetic shielding layer and plastic-sealing the first chip; The second plastic packaging layer is located above the adapter board, and the second plastic packaging layer plastic packages the second chip.

15. The packaging structure with electromagnetic shielding function according to claim 1, characterized in that: The substrate has a plurality of accommodating cavities arranged at intervals, and each of the accommodating cavities is provided with the first chip; The electromagnetic shielding layer is continuously distributed in the plurality of accommodating cavities; or, a plurality of discrete electromagnetic shielding layers are distributed in the plurality of accommodating cavities in a one-to-one correspondence.

16. A method for forming a packaging structure with electromagnetic shielding function, characterized in that: The steps include: forming an adapter plate, wherein the adapter plate includes a substrate and a receiving cavity located in the substrate; Mounting a first chip in the accommodating cavity and forming an electromagnetic shielding layer that at least covers the inner wall of the accommodating cavity; A wiring layer is formed on the adapter board, and a second chip is mounted on the adapter board, wherein the first chip and the second chip are both electrically connected to the wiring layer.

17. The method for forming a packaging structure with electromagnetic shielding function according to claim 16, wherein: The specific steps of forming the adapter plate include: providing a substrate; The substrate is etched to form the accommodating cavity penetrating the substrate.

18. The method for forming a packaging structure with electromagnetic shielding function according to claim 17, wherein: Before etching the substrate, the method further includes the following steps: A plurality of conductive connection pillars are formed penetrating the substrate.

19. The method for forming a packaging structure with electromagnetic shielding function according to claim 17, wherein: The adapter plate includes an upper surface and a lower surface that are relatively distributed. The specific steps of mounting the first chip in the accommodating cavity and forming an electromagnetic shielding layer that at least covers the inner wall of the accommodating cavity include: providing a carrier board; Mounting the adapter board on the carrier board; Mounting the adapter plate on the carrier plate along the lower surface of the adapter plate toward the carrier plate; Mounting the first chip on the carrier in the accommodating cavity; The electromagnetic shielding layer is formed to continuously cover the inner wall of the accommodation cavity and the surface of the first chip.

20. The method for forming a packaging structure with electromagnetic shielding function according to claim 19, wherein: The specific steps of mounting the first chip on the carrier in the accommodating cavity include: mounting multiple first chips on the carrier in the accommodating cavity, and the multiple first chips are arranged at intervals along a direction parallel to the upper surface of the adapter board.

21. The method for forming a packaging structure with electromagnetic shielding function according to claim 20, wherein: The specific steps of forming the electromagnetic shielding layer that continuously covers the inner wall of the accommodating cavity and the surface of the first chip include: The electromagnetic shielding layer is formed by a sputtering process to continuously cover the inner wall of the accommodating cavity and the entire surface of the first chip.

22. The method for forming a packaging structure with electromagnetic shielding function according to claim 21, wherein: The first chip includes a functional surface and a back surface that are relatively distributed, and the functional surface of the first chip faces the carrier board; before forming a wiring layer on the adapter board, the following steps are also included: Providing a third chip, wherein the third chip includes a functional surface and a back surface that are relatively distributed; The third chip is mounted on the electromagnetic shielding layer on the back side of the first chip in the accommodation cavity through an adhesive layer, with the back side of the third chip facing the first chip.

23. The method for forming a packaging structure with electromagnetic shielding function according to claim 22, wherein: The specific steps of attaching the third chip to the electromagnetic shielding layer on the back side of the first chip via an adhesive layer in the accommodating cavity include: The third chip is mounted on the electromagnetic shielding layer on the back side of the plurality of first chips in the accommodation cavity through an adhesive layer.

24. The method for forming a packaging structure with electromagnetic shielding function according to claim 23, wherein: Before forming a wiring layer on the adapter board and mounting the second chip on the adapter board, the following steps are also included: A first molding layer is formed to fill the accommodating cavity and to mold the first chip and the third chip.

25. The method for forming a packaging structure with electromagnetic shielding function according to claim 24, wherein: The substrate includes a bottom surface facing the carrier and a top surface opposite to the bottom surface, and the electromagnetic shielding layer also covers the top surface of the substrate. The specific steps of forming a first plastic encapsulation layer that fills the accommodating cavity and plastic encapsulates the first chip and the third chip include: forming a first molding layer that fills the accommodating cavity and molds the first chip and the third chip, wherein the first molding layer is also located on the top surface of the substrate; The first plastic packaging layer on the top surface of the substrate and the electromagnetic shielding layer covering the top surface of the substrate are removed by a grinding process.

26. The method for forming a packaging structure with electromagnetic shielding function according to claim 24, wherein: The specific steps of forming a wiring layer on the adapter board and mounting a second chip on the adapter board include: forming a top wiring layer covering the upper surface of the adapter board and the top surface of the first plastic packaging layer; Mounting the second chip on the top wiring layer, and electrically connecting the second chip to the top wiring layer; removing the carrier plate; A bottom wiring layer is formed covering the lower surface of the adapter board and the bottom surface of the first plastic packaging layer to form the wiring layer including the top wiring layer and the bottom wiring layer, and the first chip is electrically connected to the bottom wiring layer.

27. The method for forming a packaging structure with electromagnetic shielding function according to claim 26, wherein: Before removing the carrier board, the method further includes the following steps: A second plastic encapsulation layer for encapsulating the second chip is formed on the transfer board.

28. The method for forming a packaging structure with electromagnetic shielding function according to claim 26, wherein: After forming the bottom wiring layer covering the lower surface of the adapter board and the bottom surface of the first plastic packaging layer, the following steps are further included: Solder balls are formed on a surface of the bottom wiring layer facing away from the first chip, and the solder balls are electrically connected to the bottom wiring layer.

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