Package substrate and manufacturing method thereof

Abstract

The invention relates to the technical field of semiconductor packaging, and discloses a packaging substrate and a manufacturing method thereof. The packaging substrate comprises a substrate and a blocking structure. The substrate includes an effective pattern region. The blocking structure is arranged in the substrate. Wherein the blocking structure surrounds the effective pattern area in the circumferential direction of the effective pattern area. According to the invention, the effectiveness of preventing cracks in the substrate from expanding can be improved, the cracks are reduced or prevented from expanding to the effective pattern area, and the yield and reliability of the packaging substrate are improved.

Description

Technical Field

[0001] The present application belongs to the field of semiconductor packaging technology, and specifically relates to a packaging substrate and a manufacturing method thereof. Background Art

[0002] In the substrate manufacturing process, scribing and lamination are critical steps. During scribing, contact between the cutting tool and the substrate can introduce microcracks and surface defects. These defects can become the starting point for fracture during subsequent processing or when subjected to external forces. Glass substrates are inherently brittle and have a low tolerance for defects. Furthermore, cracks tend to propagate rapidly and non-directionally. When cracks extend into the active area of ​​the substrate, they can impact the yield and reliability of the substrate unit.

[0003] Related technologies employ methods such as grooves formed on the surface of substrates or films to restrict crack propagation. However, these methods only prevent crack propagation within the thickness range near the substrate surface and are ineffective in preventing crack propagation within the substrate interior. For example, the effectiveness of these methods in preventing crack propagation in the middle region of the substrate along its thickness is poor. Summary of the Invention

[0004] This application aims to solve at least one of the technical problems existing in the related art.

[0005] Therefore, a first aspect of the present application provides a packaging substrate.

[0006] A second aspect of the present application provides a method for manufacturing a packaging substrate.

[0007] In view of this, according to the first aspect of an embodiment of the present application, a packaging substrate is proposed, comprising: a substrate including an effective graphic area; a blocking structure arranged inside the substrate; wherein, along the circumference of the effective graphic area, the blocking structure surrounds the effective graphic area.

[0008] In a feasible implementation, the blocking structure includes: a plurality of blocking units, which are arranged inside the substrate and extend along the thickness direction of the substrate; wherein, along the circumference of the effective graphic area, the plurality of blocking units are arranged in sequence at intervals or in an overlapping manner.

[0009] In a feasible implementation, when the plurality of blocking units are arranged in sequence and spaced apart, a plurality of blocking structures are provided, and the plurality of blocking structures surround the outside of the effective graphic area layer by layer; wherein the blocking units in two adjacent blocking structures are alternately arranged.

[0010] In a feasible implementation, the blocking unit includes a linear crack, and the width of the linear crack is less than or equal to 0.5 μm.

[0011] In a feasible implementation, the distance between the blocking structure and the adjacent surface of the substrate is H; wherein, 0.5L>H≥0, and L is the thickness of the substrate.

[0012] In a feasible implementation, the packaging substrate further includes: a buffer layer, which is disposed on the surface of the substrate, and the buffer layer at least covers the area where the blocking structure is located.

[0013] In a feasible implementation, the substrate includes a glass substrate.

[0014] According to a second aspect of an embodiment of the present application, a method for manufacturing a package substrate is provided, comprising the following steps:

[0015] Providing a substrate, wherein the substrate includes an effective pattern area;

[0016] forming a blocking structure inside the substrate;

[0017] Wherein, along the circumference of the effective pattern area, the blocking structure surrounds the effective pattern area.

[0018] In a feasible implementation, the step of forming a blocking structure inside the substrate includes: performing a laser modification process on the substrate to form a blocking structure inside the substrate; wherein, during the laser modification process, the laser parameters are:

[0019] The wavelength range is 515nm to 1064nm;

[0020] Single pulse energy ≤ 100 μJ;

[0021] Pulse width ≤ 500fs.

[0022] In a feasible implementation, the method for manufacturing a packaging substrate further includes: forming a buffer layer on the surface of the substrate; wherein the buffer layer at least covers the area where the blocking structure is located.

[0023] The packaging substrate and the manufacturing method thereof provided in this application can achieve at least the following technical effects:

[0024] In this application, a barrier structure is provided within the substrate to prevent crack propagation within the substrate, thereby improving the effectiveness of preventing crack propagation within the substrate. The barrier structure surrounds the active pattern area along its circumference, preventing crack propagation at the outer edge of the active pattern area, reducing or preventing crack propagation into the active pattern area, and improving the yield and reliability of the package substrate.

[0025] The above general description and the following description are exemplary and explanatory only and are not intended to limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] One or more embodiments are exemplarily described by corresponding drawings. These exemplary descriptions and drawings do not limit the embodiments. Elements with the same reference numerals in the drawings are shown as similar elements. The drawings do not constitute a scale limitation. In addition,

[0027] Figure 1 Schematic diagram of the planar structure of the package substrate provided in the embodiment of the present disclosure Figure 1 ;

[0028] Figure 2 for Figure 1 AA cross-sectional view of ;

[0029] Figure 3 Schematic diagram of the planar structure of the package substrate provided in the embodiment of the present disclosure Figure 2 ;

[0030] Figure 4 for Figure 3 BB cross-sectional diagram;

[0031] Figure 5 Schematic diagram of the planar structure of the package substrate provided in the embodiment of the present disclosure Figure 3 ;

[0032] Figure 6 for Figure 5 Schematic diagram of CC cross-section;

[0033] Figure 7 Schematic diagram of the planar structure of the package substrate provided in the embodiment of the present disclosure Figure 4 ;

[0034] Figure 8 for Figure 7 DD cross-sectional diagram;

[0035] Figure 9 The process of manufacturing the packaging substrate provided by the embodiment of the present disclosure Figure 1 ;

[0036] Figure 10 The process of manufacturing the packaging substrate provided by the embodiment of the present disclosure Figure 2 .

[0037] The reference numerals indicate:

[0038] 100: packaging substrate;

[0039] 101: substrate; 1011: effective pattern area; 1012: dicing street; 102: blocking structure; 1021: blocking unit; 103: buffer layer. DETAILED DESCRIPTION

[0040] In order to be able to understand the features and technical content of the embodiments of the present disclosure in more detail, the implementation of the embodiments of the present disclosure is described in detail below in conjunction with the accompanying drawings. The accompanying drawings are for reference only and are not used to limit the embodiments of the present disclosure. In the following technical description, for the sake of convenience of explanation, a full understanding of the disclosed embodiments is provided through multiple details. However, one or more embodiments can still be implemented without these details. In other cases, to simplify the drawings, well-known structures and devices can be simplified for display.

[0041] In the description and claims of the embodiments of the present disclosure, as well as in the accompanying drawings, the terms "first," "second," and the like are used to distinguish similar items and are not necessarily used to describe a particular order or precedence. It should be understood that the terms used in this manner are interchangeable where appropriate to describe the embodiments of the present disclosure herein. In addition, the terms "including," "having," and any variations thereof are intended to cover non-exclusive inclusions.

[0042] In the embodiments of the present disclosure, the terms "upper", "lower", "inside", "middle", "outside", "front", "back" and the like indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. These terms are mainly intended to better describe the embodiments of the present disclosure and their embodiments, and are not intended to limit the indicated devices, elements or components to having a specific direction, or to be constructed and operated in a specific direction. Moreover, in addition to being used to indicate directions or positional relationships, some of the above terms may also be used to indicate other meanings. For example, the term "upper" may also be used to indicate a certain dependency or connection relationship in certain circumstances. For those of ordinary skill in the art, the specific meanings of these terms in the embodiments of the present disclosure can be understood according to specific circumstances.

[0043] Furthermore, the terms "disposed," "connected," and "fixed" should be interpreted broadly. For example, "connected" can mean a fixed connection, a removable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection, an indirect connection through an intermediary, or an internal connection between two devices, elements, or components. Those skilled in the art will understand the specific meanings of these terms in the embodiments of this disclosure based on the specific circumstances.

[0044] Unless otherwise stated, the term "plurality" means two or more.

[0045] In the embodiment of the present disclosure, the character " / " indicates that the preceding and following objects are in an "or" relationship. For example, A / B means: A or B.

[0046] The term "and / or" describes an association between objects, indicating that three relationships can exist. For example, A and / or B means: A or B, or A and B.

[0047] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present disclosure can be combined with each other.

[0048] like Figures 1 to 8 As shown, a first aspect of an embodiment of the present application provides a package substrate 100. Package substrate 100 includes a substrate 101 and a blocking structure 102. Substrate 101 includes an effective graphic area 1011. Blocking structure 102 is disposed within substrate 101. Blocking structure 102 surrounds effective graphic area 1011 along its circumference.

[0049] In this embodiment, by providing a blocking structure 102 within the substrate 101, crack propagation within the interior region of the substrate 101 can be prevented, thereby improving the effectiveness of preventing crack propagation within the substrate 101. For example, by providing a blocking structure 102 within the interior region of the substrate 101 in the thickness direction, the effectiveness of preventing crack propagation can be improved.

[0050] In this embodiment, along the circumference of the effective graphic area 1011, the blocking structure 102 surrounds the effective graphic area 1011, and a structure that prevents crack expansion is formed on the outer edge of the effective graphic area 1011, thereby reducing or preventing cracks from expanding into the effective graphic area 1011 and improving the yield and reliability of the packaging substrate 100.

[0051] In one application example, during the manufacturing process, microcracks or defects may form when a cutting tool contacts substrate 101. This embodiment provides a barrier structure 102 within substrate 101, surrounding active pattern area 1011. This effectively protects active pattern area 1011 within the thickness of substrate 101, reducing or preventing microcracks or defects from extending into active pattern area 1011.

[0052] It should be noted that substrate 101 may include multiple active pattern areas 1011. These multiple active pattern areas 1011 are spaced apart. Substrate 101 may also include scribe lines 1012. Scribe lines 1012 are located between two adjacent active pattern areas 1011. Active pattern areas 1011 may be used to implement circuit functions, integrate and interconnect components, and so on. Scribe lines 1012 may be used to provide cutting paths.

[0053] In one possible implementation, Figures 1 to 8 As shown, the blocking structure 102 is arranged on the dicing street 1012 and close to the effective pattern area 1011 to reduce or prevent microcracks or defects from extending to the effective pattern area 1011 when the cutting tool cuts the dicing street 1012, thereby forming effective protection for the effective pattern area 1011.

[0054] In one possible implementation, Figure 1 and Figure 2 As shown, the blocking structure 102 is provided with one.

[0055] In one possible implementation, Figure 3 and Figure 4 As shown, a plurality of blocking structures 102 are provided. The plurality of blocking structures 102 surround the outside of the effective pattern area 1011 layer by layer.

[0056] In some embodiments, as Figures 1 to 8 As shown, the blocking structure 102 includes a plurality of blocking units 1021. The blocking units 1021 are disposed inside the substrate 101 and extend along the thickness direction of the substrate 101. The blocking units 1021 are sequentially arranged in an intermittent or overlapping manner along the circumference of the effective pattern area 1011.

[0057] In this embodiment, the blocking unit 1021 extends along the thickness direction of the substrate 101 to block the expansion of the crack.

[0058] In this embodiment, Figure 3 and Figure 4 As shown, along the circumference of the effective pattern area 1011 , multiple barrier units 1021 are arranged in sequence at intervals, so that the entirety of the multiple barrier units 1021 can surround the effective pattern area 1011 , that is, forming a barrier structure 102 to reduce or prevent cracks from extending to the effective pattern area 1011 .

[0059] In this embodiment, Figure 1 and Figure 2 As shown, multiple blocking units 1021 are arranged in an overlapping manner, that is, two adjacent blocking units 1021 partially or completely overlap, and multiple blocking units 1021 are arranged in an overlapping manner to form a whole surrounding the effective graphic area 1011, that is, forming a blocking structure 102 to reduce or prevent cracks from extending to the effective graphic area 1011.

[0060] In some embodiments, as Figure 3 and Figure 4As shown, when multiple blocking units 1021 are arranged in sequence, there are multiple blocking structures 102, and the multiple blocking structures 102 surround the outside of the effective pattern area 1011 layer by layer. The blocking units 1021 in two adjacent blocking structures 102 are arranged alternately.

[0061] In this embodiment, multiple barrier units 1021 are arranged in a sequentially spaced arrangement, i.e., a gap exists between adjacent barrier units 1021. Multiple barrier structures 102 surround the exterior of the active pattern area 1011 layer by layer, i.e., multiple layers of barrier structures 102 surround the exterior of the active pattern area 1011. The barrier units 1021 in two adjacent barrier structures 102 are alternately arranged, i.e., the location of a barrier unit 1021 in one barrier structure 102 corresponds to the gap between two barrier units 1021 in the other barrier structure 102. This allows the multiple barrier structures 102 to collectively form a structure that protects the active pattern area 1011, reducing or preventing cracks from extending into the active pattern area 1011. Furthermore, in this embodiment, each barrier structure 102 is formed as an internally discontinuous structure formed by a plurality of barrier units 1021 arranged in a spaced arrangement. This reduces or prevents crack propagation while improving the yield and reliability of the package substrate 100 in subsequent processing steps.

[0062] In one feasible embodiment, along the circumference of the active pattern area 1011, the area of ​​the active pattern area 1011 covered by the plurality of barrier units 1021 is greater than or equal to 80%. That is, the plurality of barrier units 1021 are arranged to form the barrier structure 102, wherein the ratio of the total area of ​​the projections of the plurality of barrier units 1021 on the circumferential side surfaces of the active pattern area 1011 to the total area of ​​the circumferential side surfaces of the active pattern area 1011 is greater than or equal to 80%, thereby reducing or preventing crack propagation while improving the reliability of the package substrate 100. It will be understood that, if a plurality of barrier structures 102 are provided, the ratio of the total area of ​​the projections of all barrier units 1021 in the plurality of barrier structures 102 on the circumferential side surfaces of the active pattern area 1011 to the total area of ​​the circumferential side surfaces of the active pattern area 1011 is greater than or equal to 80%.

[0063] It should be noted that the specific structure of the barrier unit 1021 is not limited, for example, it can be a regular geometric shape or an irregular geometric shape. Moreover, along the extension direction of the barrier unit 1021, the barrier unit 1021 can be discontinuous or continuous.

[0064] In a feasible implementation manner, two adjacent blocking units 1021 have the same structure.

[0065] In a feasible implementation manner, the structures of two adjacent blocking units 1021 are different.

[0066] In some embodiments, as Figure 3 and Figure 4 As shown, the blocking unit 1021 includes linear cracks. The linear cracks extend along the thickness direction of the substrate 101, and multiple linear cracks are arranged at intervals or overlapped along the circumference of the effective pattern area 1011. The width of the linear cracks is less than or equal to 0.5 μm.

[0067] In this embodiment, linear cracks extending along the thickness of substrate 101 can prevent crack propagation within the thickness range near the surface of substrate 101, as well as within the interior of substrate 101, thereby enhancing the effectiveness of preventing crack propagation. Multiple linear cracks are arranged at intervals or overlapped along the circumference of active pattern area 1011 to form barrier structure 102, reducing or preventing crack propagation into active pattern area 1011.

[0068] In this embodiment, the width of the linear crack is less than or equal to 0.5 μm, so that the size of the barrier unit 1021 can be less than or equal to 10 μm. -7 m, so that the blocking unit 1021 is formed into a microstructure that is substantially invisible to the naked eye, which greatly reduces the size of the prefabricated structure and improves the yield and reliability of the package substrate 100 in subsequent processing.

[0069] It can be understood that the length direction of the linear crack is the extension direction of the linear crack (ie, the thickness direction of the substrate 101), and the width direction of the linear crack is perpendicular to or nearly perpendicular to the length direction. The width of the linear crack is the maximum width in the width direction cross section.

[0070] In one possible implementation, Figure 4 As shown, the linear crack is discontinuous along its extension direction, thereby reducing or preventing crack expansion while improving the yield and reliability of the packaging substrate 100 in subsequent processing.

[0071] In some embodiments, as Figure 2 As shown, the distance between the blocking structure 102 and the surface of the adjacent substrate 101 is H. Here, 0.5L>H≥0, and L is the thickness of the substrate 101 .

[0072] In this embodiment, the distance between the blocking structure 102 and the surface of the adjacent substrate 101, that is, in the thickness direction of the substrate 101, the distance between the upper surface of the blocking structure 102 and the upper surface of the substrate 101, and the distance between the lower surface of the blocking structure 102 and the lower surface of the substrate 101.

[0073] In this embodiment, 0.5L>H≥0, that is, along the thickness direction of the substrate 101, the blocking structure 102 can extend to the surface of the substrate 101, so as to prevent the crack from expanding in the thickness range near the surface of the substrate 101, and prevent the crack from expanding in the internal area of ​​the substrate 101, thereby improving the effect of preventing the crack from expanding, and thereby improving the reliability of the packaging substrate 100.

[0074] In some embodiments, as Figures 5 to 8 As shown, the package substrate 100 further includes a buffer layer 103. The buffer layer 103 is disposed on the surface of the substrate 101. The buffer layer 103 at least covers the area where the barrier structure 102 is located.

[0075] In this embodiment, the buffer layer 103 covers at least the area where the barrier structure 102 is located. That is, the buffer layer 103 may only cover the area where the barrier structure 102 is located. The buffer layer 103 may also cover other areas of the substrate 101. For example, the buffer layer 103 may cover the entire surface of the substrate 101. By covering the area where the barrier structure 102 is located with the buffer layer 103, lateral reinforcement and stress relief are achieved, thereby improving the reliability of the package substrate 100 in subsequent processing steps (such as build-up). Moreover, the buffer layer 103 is easy to manufacture and has low cost.

[0076] It should be noted that, in this embodiment, the horizontal direction is a direction perpendicular to or nearly perpendicular to the thickness section of the substrate 101. Figure 6 and Figure 8 The horizontal arrows in the figure are used to illustrate only some horizontal directions. There are other horizontal directions that are not illustrated in the figure.

[0077] Specifically, by providing the buffer layer 103, surface cracks of the substrate 101 can be stopped, and the interaction force between the stacking layer and the substrate 101 (glass substrate) can be transferred to the interface between the buffer layer 103 and the stacking layer, which has a certain deformation toughness, thereby effectively reducing the risk of fracture.

[0078] In the related art, during the lamination process, the mismatch of the thermal expansion coefficient of the material may cause thermal stress. Especially when an obstacle structure such as a groove is formed on the surface of the substrate or film, if the stress is concentrated at the defect near the dicing path, it is easy to induce fracture. The large-sized pre-set structures such as grooves in the related art will greatly reduce the stiffness of the original substrate (the stiffness decreases exponentially as the size of the pre-set structure increases), affecting the feasibility of subsequent processes. In this embodiment, the blocking unit 1021 is a microstructure that is basically invisible to the naked eye, which greatly reduces the size of the prefabricated structure. In addition, a buffer layer 103 is added to the blocking structure 102 to achieve lateral reinforcement and stress release, thereby reducing the risk of stress concentration and fracture at the blocking structure 102 during subsequent processes such as lamination.

[0079] In one possible implementation, Figure 6 and Figure 8 As shown, buffer layers 103 are provided on both opposite surfaces of the substrate 101 , and the buffer layers 103 on both sides correspondingly cover the opposite sides of the blocking structure 102 to improve the lateral reinforcement and stress release effects.

[0080] In a feasible embodiment, the buffer layer 103 only covers the area where the blocking structure 102 is located and the dicing line 1012 area, so that the buffer layer 103 can be removed in subsequent processes (by laser ablation, etc.), and its bonding force state hardly affects the reliability of the effective graphic area 1011 of the substrate 101, thereby improving the yield and reliability of the packaging substrate 100.

[0081] In some embodiments, the substrate 101 includes a glass substrate.

[0082] This embodiment is applicable to glass substrates with a low tolerance for defects. Specifically, when the substrate 101 is a glass substrate, a blocking structure 102 is provided inside the glass substrate to reduce or prevent cracks from extending to the effective graphic area 1011, thereby improving the effect of preventing crack extension and thereby improving the yield and reliability of the packaging substrate 100.

[0083] like Figures 1 to 9 As shown, the second aspect of the embodiment of the present application provides a method for manufacturing a package substrate 100, comprising the following steps:

[0084] S901, providing a substrate, wherein the substrate includes an effective pattern area.

[0085] S902 , forming a blocking structure inside the substrate, wherein the blocking structure surrounds the effective pattern area along a circumference of the effective pattern area.

[0086] In this embodiment, by forming a barrier structure 102 within substrate 101, crack propagation within substrate 101 can be stopped. When barrier structure 102 extends to the surface of substrate 101, crack propagation on the surface of substrate 101 can also be stopped, thereby improving the effectiveness of preventing crack propagation. By surrounding active pattern area 1011 with barrier structure 102, a crack propagation-blocking structure is formed at the outer edge of active pattern area 1011, reducing or preventing crack propagation into active pattern area 1011, thereby improving the yield and reliability of package substrate 100.

[0087] In some embodiments, the step of forming the blocking structure 102 inside the substrate 101 includes performing a laser modification process on the substrate 101 to form the blocking structure 102 inside the substrate 101. During the laser modification process, the laser parameters are as follows: a wavelength range of 515 nm to 1064 nm; a single pulse energy of ≤100 μJ; and a pulse width of ≤500 fs.

[0088] In this embodiment, by setting laser parameters with a wavelength range of 515nm to 1064nm, a single pulse energy ≤100μJ, and a pulse width ≤500fs, the glass substrate is laser modified to form a blocking structure 102 inside the substrate 101, and the blocking structure 102 can be formed into a hidden cutting affected area that is basically invisible to the naked eye, so as to reduce or prevent crack propagation while improving the yield and reliability of the packaging substrate 100 in subsequent processing.

[0089] like Figures 1 to 10 As shown, the embodiment of the present application also proposes a method for manufacturing a package substrate 100, comprising the following steps:

[0090] S101. Provide a substrate, wherein the substrate includes an effective graphic area.

[0091] S102 , forming a blocking structure inside the substrate, wherein the blocking structure surrounds the effective pattern area along a circumference of the effective pattern area.

[0092] S103 , forming a buffer layer on the surface of the substrate, wherein the buffer layer at least covers the area where the blocking structure is located.

[0093] In this embodiment, the buffer layer 103 covers at least the area where the barrier structure 102 is located, thereby achieving lateral reinforcement and stress relief, thereby improving the reliability of the package substrate 100 during subsequent processing (e.g., build-up). Furthermore, the buffer layer 103 is easy to manufacture and low in cost. Specifically, the provision of the buffer layer 103 can achieve surface crack termination on the substrate 101 and transfer the interaction force between the build-up layer and the substrate 101 (glass substrate) to the interface between the buffer layer 103 and the build-up layer, which has a certain degree of deformation toughness. This effectively reduces the risk of cracking caused by the longitudinal expansion of the pre-installed barrier structure 102 during the build-up process.

[0094] It should be noted that, in actual application, the method of this embodiment is compatible with both semiconductor processes and substrate 101 processes, and has strong compatibility. Moreover, it has little impact on post-manufacturing processes, and has good practicality.

[0095] It should be noted that in this embodiment, the specific method for forming the buffer layer 103 on the surface of the substrate 101 is not limited, such as vapor deposition, sintering, or pressing. The material of the buffer layer 103 is not limited, such as polyethylene terephthalate, polyimide (PI), or titanium / copper (Ti / Cu) materials with high ductility. The thickness of the buffer layer 103 is not limited.

[0096] The above are merely preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, and improvements made within the spirit and principles of the present application shall be included within the scope of protection of the present application. The above are merely preferred embodiments of the present application. It should be noted that those skilled in the art may make various improvements and variations without departing from the technical principles of the present application, and such improvements and variations shall also be considered within the scope of protection of the present application.

Claims

1. A packaging substrate, characterized in that: include: a substrate including an effective pattern area; a blocking structure, disposed inside the substrate; Wherein, along the circumference of the effective pattern area, the blocking structure surrounds the effective pattern area.

2. The packaging substrate according to claim 1, wherein: The blocking structure comprises: a plurality of blocking units, each of which is disposed inside the substrate and extends along a thickness direction of the substrate; Wherein, along the circumference of the effective pattern area, a plurality of the blocking units are sequentially arranged in an intermittent or overlapping manner.

3. The packaging substrate according to claim 2, wherein: In the case where the plurality of blocking units are sequentially spaced apart, the plurality of blocking structures are provided, and the plurality of blocking structures surround the outside of the effective pattern area layer by layer; Wherein, the blocking units in two adjacent blocking structures are arranged alternately.

4. The packaging substrate according to claim 2, wherein: The blocking unit includes a linear crack, and a width of the linear crack is less than or equal to 0.5 μm.

5. The packaging substrate according to any one of claims 1 to 4, characterized in that: The distance between the blocking structure and the adjacent surface of the substrate is H; Wherein, 0.5L>H≥0, L is the thickness of the substrate.

6. The packaging substrate according to any one of claims 1 to 4, characterized in that: Also includes: A buffer layer is provided on the surface of the substrate, and the buffer layer at least covers the area where the blocking structure is located.

7. The packaging substrate according to any one of claims 1 to 4, characterized in that: The substrate includes a glass substrate.

8. A method for manufacturing a packaging substrate, characterized in that: The steps include: Providing a substrate, wherein the substrate includes an effective pattern area; forming a blocking structure inside the substrate; Wherein, along the circumference of the effective pattern area, the blocking structure surrounds the effective pattern area.

9. The manufacturing method according to claim 8, characterized in that The step of forming a blocking structure inside the substrate includes: performing a laser modification process on the substrate to form a blocking structure inside the substrate; Wherein, during the laser modification process, the laser parameters are: The wavelength range is 515nm to 1064nm; Single pulse energy ≤ 100 μJ; Pulse width ≤ 500fs.

10. The manufacturing method according to claim 8 or 9, characterized in that: Also includes: forming a buffer layer on the surface of the substrate; Wherein, the buffer layer at least covers the area where the blocking structure is located.

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