Printed circuit board with embedded electronic device and manufacturing method thereof

Abstract

The invention relates to the technical field of printed circuit boards, and discloses a printed circuit board with an embedded electronic device and a manufacturing method thereof, the printed circuit board with the embedded electronic device comprises a radiator which comprises a main body part and a connecting boss which are integrally formed, the connecting boss is arranged on the outer surface of the main body part in a protruding manner, and the connecting boss is connected with a first electronic device; the first connecting layer is provided with an avoiding groove; the first substrate is provided with a containing groove, and the connecting boss is located in the avoiding groove and the containing groove; the first daughter board comprises a first dielectric layer and a first circuit layer, the first dielectric layer is provided with a first through hole, a first conductive part is arranged in the first through hole, the first electronic device and / or the connecting boss are / is connected with the first conductive part, and the first circuit layer is connected with the first conductive part. The printed circuit board with the embedded electronic device and the manufacturing method of the printed circuit board are used for solving the problem that the heat dissipation effect of the electronic device in an existing printed circuit board with the embedded electronic device is poor.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a printed circuit board with embedded electronic devices and a manufacturing method thereof. Background Art

[0002] With the continuous development of the electronic communications industry and automotive electronics, the requirements for related printed circuit board products are becoming increasingly stringent, with a trend towards miniaturization and multifunctionality, and the demand for heat dissipation performance is also increasing. Current printed circuit boards (PCBs) typically embed electronic components (such as chips) within the PCB. Heat generated by these components, such as chips, cannot be dissipated promptly. Excessive temperature increases can lead to reduced performance and service life, necessitating enhanced thermal management of these components.

[0003] In the related art, after the electronic device is embedded in the printed circuit board, the electronic device control network is connected to the outer circuit layer through a blind hole. At the same time, a heat sink needs to be placed at the bottom of the electronic device to dissipate the heat of the electronic device. That is, the electronic device and the heat sink need to be embedded in the printed circuit board together. For high-power electronic devices, the heat dissipation requirements cannot be met by the heat sink alone. Therefore, a heat sink block is added to the bottom of the heat sink by welding or pressing with thermal conductive adhesive to effectively reduce the heat of the electronic device. However, the heat dissipation effect of the electronic device in this printed circuit board with embedded electronic devices is not good. Summary of the Invention

[0004] The present application provides a printed circuit board with embedded electronic devices and a manufacturing method thereof, which are used to improve the problem of poor heat dissipation effect of electronic devices in existing printed circuit boards with embedded electronic devices.

[0005] In a first aspect, an embodiment of the present application provides a printed circuit board with embedded electronic devices, comprising: A heat sink comprising an integrally formed main body and a connecting boss, wherein the connecting boss is protruding from an outer surface of the main body, and the connecting boss is connected to a first electronic device; a first connecting layer, the first connecting layer being stacked with the main body, and the first connecting layer being provided with a avoiding groove; a first substrate, wherein the first substrate and the first connecting layer are stacked and located on a side of the first connecting layer away from the main body; the first substrate is provided with a receiving groove, and the connecting boss is located in the avoiding groove and the receiving groove; A first sub-board, the first sub-board is stacked on a side of the first substrate away from the main body, the first sub-board includes a first dielectric layer and a first circuit layer arranged in a stacked manner, the first dielectric layer is located between the first substrate and the first circuit layer, the first dielectric layer is provided with a first through hole, a first conductive portion is provided inside the first through hole, the first electronic device and / or the connecting boss is connected to the first conductive portion, and the first circuit layer is connected to the first conductive portion.

[0006] In some embodiments, a heat dissipation duct is provided inside the radiator, and the heat dissipation duct is formed on the main body and / or the connecting boss.

[0007] In some embodiments, a heat dissipation cavity is provided inside the heat sink.

[0008] In some embodiments, the heat dissipation cavity includes a first cavity and a second cavity that are connected to each other, the first cavity is formed in the main body, and the second cavity is formed in the connecting boss.

[0009] In some embodiments, the heat dissipation cavity is formed in the main body, and a heat dissipation duct is further provided inside the main body. The heat dissipation duct is located on a side of the heat dissipation cavity away from the first substrate, and the heat dissipation duct is isolated from the heat dissipation cavity.

[0010] In some embodiments, a support column is provided inside the heat dissipation cavity. The support column extends along the arrangement direction of the heat sink and the first sub-board, and both ends of the support column are connected to the inner wall of the heat dissipation cavity.

[0011] In some embodiments, the radiator is provided with a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet are communicated with the heat dissipation cavity.

[0012] In some embodiments, a heat dissipation protrusion is provided on the outer surface of the main body.

[0013] In some embodiments, a limiting groove is provided on the side of the connecting boss facing away from the main body, the first electronic component is arranged in the limiting groove, and the height of the first electronic component is less than the depth of the limiting groove; or, the first electronic component is arranged on the side of the boss facing away from the main body.

[0014] In some embodiments, a plurality of the first through holes are provided, the plurality of the first through holes include a first hole and a second hole, the first conductive portion includes a first portion provided inside the first hole and a second portion provided inside the second hole, the first portion is connected to the first electronic device, and the second portion is connected to the connecting boss; the first circuit layer includes a first circuit and a second circuit, the first circuit is connected to the first portion, and the second circuit is connected to the second portion.

[0015] In some embodiments, two of each of the first dielectric layer, the first substrate, and the first sub-board are provided, and the first dielectric layer, the first substrate, and the first sub-board are provided in one-to-one correspondence. The main body is located between the two first dielectric layers, and the connecting bosses are provided on opposite sides of the main body, and the connecting bosses on opposite sides of the main body are respectively provided corresponding to the two first dielectric layers.

[0016] In some embodiments, the printed circuit board also includes a thermally conductive insulation layer, a second substrate and a second sub-board arranged in sequence and stacked, the thermally conductive insulation layer is located between the main body and the second substrate, and the connecting boss is located on the side of the main body facing away from the second substrate; a thermally conductive seat is provided inside the second substrate, the thermally conductive seat is connected to a second electronic device, and the thermally conductive seat is connected to the thermally conductive insulation layer; the second sub-board includes a second dielectric layer and a second circuit layer arranged in a stacked manner, the second dielectric layer is located between the second substrate and the second circuit layer, the second dielectric layer is provided with a second through hole, a second conductive part is provided inside the second through hole, the second electronic device and / or the thermally conductive seat is connected to the second conductive part, and the second circuit layer is connected to the second conductive part.

[0017] In a second aspect, an embodiment of the present application provides a method for manufacturing a printed circuit board with embedded electronic devices, which is used to manufacture the printed circuit board with embedded electronic devices as described in the first aspect, comprising: The heat sink, the first connecting layer, the first substrate, and a processing board are sequentially stacked and pressed together to obtain a motherboard, wherein the processing board is stacked on a side of the first substrate facing away from the main body, and the processing board includes a stacked connecting dielectric layer and a first conductive layer, wherein the connecting dielectric layer is located between the first substrate and the first conductive layer; Electroplated holes are processed on the motherboard, wherein the electroplated holes include the first through holes penetrating the connecting dielectric layer and the functional holes penetrating the first conductive layer, the first through holes and the functional holes are coaxially arranged, and the connecting dielectric layer forms the first dielectric layer; The electroplated conductive part is filled in the electroplated hole, and the electroplated conductive part includes a first conductive part located in the first through hole and a process conductive part located in the functional hole. The process conductive part is connected to the first conductive part, and the process conductive part and the first conductive layer form the first circuit layer.

[0018] In some embodiments, before sequentially stacking and pressing the heat sink, the first connecting layer, the first substrate, and the processing board together, the method for manufacturing the printed circuit board with embedded electronic devices further includes: Providing a heat dissipation plate, the heat dissipation plate comprising the main body portion and the heat dissipation portion stacked together; Part of the heat dissipation portion is removed, and the remaining heat dissipation portion is the connecting boss; The first electronic component is arranged on the connecting boss.

[0019] In some embodiments, after providing the heat sink and before removing part of the heat dissipation portion, a first alignment hole is processed on the heat sink; when removing part of the heat dissipation portion, the first alignment hole is used as an alignment reference; when setting the first electronic component on the connecting boss, the first alignment hole is used as an alignment reference.

[0020] In some embodiments, after removing part of the heat dissipation portion and before setting the first electronic component on the connecting boss, a limiting groove is processed on the connecting boss based on the first alignment hole; setting the first electronic component on the connecting boss includes: using the first alignment hole as an alignment reference, and setting the first electronic component in the limiting groove.

[0021] In some embodiments, before sequentially stacking and pressing the heat sink, the first connecting layer, the first substrate, and the processing board together, the method for manufacturing the printed circuit board with embedded electronic devices further includes: providing a first core plate, a second core plate and a connecting insulating layer; Processing a second alignment hole, a third alignment hole, and a fourth alignment hole on the first core plate, the second core plate, and the connecting insulating layer respectively; Processing a first window on the first core plate with the second alignment hole, processing a second window on the second core plate with the third alignment hole, and processing a third window on the connecting insulating layer with the fourth alignment hole; The first core board, the second core board, and the connecting insulating layer are stacked together to obtain the first substrate, wherein the connecting insulating layer is located between the first core board and the second core board, and the first opening window, the second opening window, and the third opening window constitute the accommodating groove; When the heat sink, the first connection layer, the first substrate and the processing plate are sequentially stacked and pressed together, the second alignment hole, the third alignment hole and the fourth alignment hole are all arranged corresponding to the first alignment hole.

[0022] In some embodiments, connection alignment holes are provided on the first connection layer. When the heat sink, the first connection layer, the first substrate and the processing plate are sequentially stacked and pressed together, the positioning pins are sequentially inserted into the first alignment hole, the connection alignment hole, the second alignment hole, the fourth alignment hole and the third alignment hole.

[0023] In some embodiments, after the heat sink, the first connecting layer, the first substrate and the processing board are sequentially stacked and pressed together, and before the electroplating holes are processed on the motherboard, a fifth alignment hole is processed on the motherboard, and the fifth alignment hole passes through the processing board, and the fifth alignment hole, the connecting alignment hole, the first alignment hole, the second alignment hole, the third alignment hole and the fourth alignment hole are coaxially arranged; when the electroplating holes are processed on the motherboard, the fifth alignment hole is used as a reference.

[0024] The printed circuit board with embedded electronic devices provided in the embodiment of the present application has the beneficial effect that: since the heat sink includes an integrally formed main body and a connecting boss, the connecting boss is protruding from the outer surface of the main body, the connecting boss is connected to the first electronic device, the first connecting layer is stacked with the main body, the first connecting layer is provided with a avoidance groove, the first substrate is stacked with the first connecting layer, and the first substrate is located on the side of the first connecting layer away from the main body, the first substrate is provided with a receiving groove, the connecting boss is located in the avoidance groove and the receiving groove, and the first sub-board is stacked on the side of the first substrate away from the main body, the first sub-board includes a stacked first dielectric layer and a first circuit layer, the first dielectric layer is located between the first substrate and the first circuit layer, the first dielectric layer is provided with a first through hole, and the first conductive part is provided inside the first through hole, the first electronic device and / or the connecting boss is connected to the first conductive part, and the first circuit layer is connected to the first conductive part, so the heat generated by the first electronic device can be directly discharged through the connecting boss and the main body, and the heat dissipation effect is better.

[0025] The beneficial effects of the method for manufacturing a printed circuit board with embedded electronic devices provided in the present application compared to the prior art can be referred to the description of the beneficial effects of the printed circuit board with embedded electronic devices provided in the present application compared to the prior art, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the embodiments or descriptions of the prior art. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0027] Figure 1 It is a structural diagram of a printed circuit board in the related art; Figure 2 1 is a schematic structural diagram of a printed circuit board with embedded electronic components in the first embodiment of the present application; Figure 3 2 is a schematic structural diagram of a printed circuit board with embedded electronic components in a second embodiment of the present application; Figure 4 1 is a schematic structural diagram of a printed circuit board with embedded electronic components in a third embodiment of the present application; Figure 5 1 is a schematic structural diagram of a printed circuit board with embedded electronic components in a fourth embodiment of the present application; Figure 6 is a schematic structural diagram of a printed circuit board with embedded electronic components in a fifth embodiment of the present application; Figure 7 1 is a schematic structural diagram of a printed circuit board with embedded electronic components in a sixth embodiment of the present application; Figure 8 is a schematic structural diagram of a printed circuit board with embedded electronic components in a seventh embodiment of the present application; Figure 9 is a schematic structural diagram of a printed circuit board with embedded electronic components in an eighth embodiment of the present application; Figure 10 1 is a schematic structural diagram of a printed circuit board with embedded electronic components in a ninth embodiment of the present application; Figure 11 1 is a schematic structural diagram of a printed circuit board with embedded electronic components in a tenth embodiment of the present application; Figure 12 is a schematic structural diagram of a printed circuit board with embedded electronic components in the eleventh embodiment of the present application; Figure 13 is a schematic structural diagram of a printed circuit board with embedded electronic components in the twelfth embodiment of the present application; Figure 14 is a schematic structural diagram of a printed circuit board with embedded electronic components in the thirteenth embodiment of the present application; Figure 15 is a flow chart of a method for manufacturing a printed circuit board with embedded electronic components in a fourteenth embodiment of the present application; Figure 16is a schematic structural diagram of a printed circuit board with embedded electronic components in a fourteenth embodiment of the present application; Figure 17 yes Figure 16 A schematic structural diagram of a printed circuit board with embedded electronic components; Figure 18 It is a structural diagram of a printed circuit board with embedded electronic components in the fifteenth embodiment of the present application.

[0028] The meanings of the marks in the figure are: 1. Electronic components; 2. Heat sink; 3. Thermal adhesive layer; 4. Heat sink; 1000, imposition; 100. Printed circuit boards; 00, first electronic device; 01, second electronic device; 110, process edge; 10. Radiator; 101, first alignment hole; 11, main body; 12, boss; 13, heat dissipation duct; 14, heat dissipation cavity; 1401, first cavity; 1402, second cavity; 141, liquid inlet; 142, liquid outlet; 20. First connection layer; 21. Connect the alignment holes; 30. a first substrate; 31, first core plate; 311, second alignment hole; 32, second core plate; 321, third alignment hole; 33, connecting insulation layer; 331, fourth alignment hole; 40. First sub-board; 401, fifth alignment hole; 41, first dielectric layer; 42, first circuit layer; 421, first circuit; 422, second circuit; 43, first conductive portion; 431, first portion; 432, second portion; 50. Thermally conductive insulating layer; 60. a second substrate; 61. Thermal seat; 70, second sub-board; 71. Second dielectric layer; 72. Second circuit layer; 73. Second conductive portion. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solutions and advantages of this application more clear, the following further describes this application in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this application and are not intended to limit this application.

[0030] It should be noted that when an element is referred to as being “fixed on” or “disposed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. Throughout the description of this application, "plurality" means two or more, unless otherwise specifically defined.

[0032] References to "one embodiment," "some embodiments," or "an embodiment" in this specification mean that a particular feature, structure, or characteristic described in conjunction with that embodiment is included in one or more embodiments of the present invention. Thus, phrases such as "in one embodiment," "in some embodiments," "in other embodiments," and "in other embodiments" appearing in various places in this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. Furthermore, in one or more embodiments, particular features, structures, or characteristics may be combined in any suitable manner.

[0033] In order to illustrate the technical solution of the present application, the following description is given with reference to specific drawings and embodiments.

[0034] With the continuous development of the electronic communications industry and automotive electronics, the requirements for related printed circuit board products are becoming increasingly stringent, with a trend towards miniaturization and multifunctionality, and the demand for heat dissipation performance is also increasing. Current printed circuit boards generally embed electronic devices (such as chips) within the PCB. Heat generated by these devices (such as chips) cannot be dissipated promptly. Excessive temperature increases can lead to reduced performance and service life, necessitating enhanced thermal management of these devices.

[0035] Please refer to Figure 1 , Figure 1 It is a structural diagram of a printed circuit board in the related art.

[0036] In the related art, after the electronic device 1 is embedded in the printed circuit board, the control network of the electronic device 1 is connected to the outer circuit layer through a blind hole. At the same time, a heat dissipation base 2 needs to be placed at the bottom of the electronic device 1 to dissipate the heat of the electronic device 1. That is, the electronic device 1 and the heat dissipation base 2 need to be embedded in the printed circuit board together. For high-power electronic devices 1, the heat dissipation requirements cannot be met by the heat dissipation base 2 alone. Therefore, a heat dissipation block 4 is added to the bottom of the heat dissipation base 2 by welding or pressing with thermal conductive glue to effectively reduce the heat of the electronic device 1.

[0037] When the high-heat electronic device 1 inside the printed circuit board is in use, the heat of the electronic device 1 needs to be transferred from the electronic device 1 to the heat dissipation base 2 first, and then transferred to the bottom heat dissipation block 4 through the welding layer or the thermal conductive adhesive layer 3. If welding is used for connection, there will usually be a certain suspended gap between the heat dissipation base 2 and the radiator, which will affect the heat dissipation. If pressed thermal conductive adhesive is used, since there is an extra layer of thermal conductive adhesive layer 3 between the heat dissipation base 2 and the radiator, the thermal conductive adhesive technology has certain limitations due to the thermal conductivity of the thermal conductive adhesive, which will also affect the heat dissipation. Therefore, whether welding or pressed thermal conductive adhesive technology is used, the heat dissipation effect cannot achieve the best effect. Therefore, the heat dissipation effect of the electronic device 1 in the existing printed circuit board with embedded electronic devices 1 is not good, and whether the heat dissipation base 2 and the bottom heat dissipation block 4 are pressed or welded, they need to be carried out after the printed circuit board is completed, which has the problem of complex process.

[0038] In view of this, the present application provides a printed circuit board with embedded electronic devices and a manufacturing method thereof. Since the heat sink includes an integrally formed main body and a connecting boss, the connecting boss is protruding from the outer surface of the main body, the connecting boss is connected to the first electronic device, the first connecting layer is stacked with the main body, the first connecting layer is provided with a avoidance groove, the first substrate is stacked with the first connecting layer, and the first substrate is located on the side of the first connecting layer away from the main body, the first substrate is provided with a receiving groove, the connecting boss is located in the avoidance groove and the receiving groove, and the first sub-board is stacked on the side of the first substrate away from the main body, the first sub-board includes a stacked first dielectric layer and a first circuit layer, the first dielectric layer is located between the first substrate and the first circuit layer, the first dielectric layer is provided with a first through hole, and a first conductive part is provided inside the first through hole, the first electronic device and / or the connecting boss is connected to the first conductive part, and the first circuit layer is connected to the first conductive part, so the heat generated by the first electronic device can be directly discharged through the connecting boss and the main body, and the heat dissipation effect is better.

[0039] Please refer to Figure 2 , Figure 2 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the first embodiment of the present application.

[0040] A first embodiment of the present application provides a printed circuit board 100 with embedded electronic devices, including a heat sink 10 , a first connection layer 20 , a first substrate 30 and a first sub-board 40 .

[0041] The heat sink 10 includes an integrally formed main body 11 and a connecting boss 12 . The connecting boss 12 is protruding from the outer surface of the main body 11 , and the first electronic device 00 is connected to the connecting boss 12 .

[0042] The main body 11 and connecting boss 12 can be integrally cast or machined. The heat sink 10 can be made of copper, aluminum, or ceramic (such as aluminum oxide, aluminum nitride, silicon oxide, or silicon nitride). The heat sink 10 can also be a copper-aluminum composite plate (e.g., a copper plate facing the connecting boss 12 and an aluminum plate facing away from the boss 12), or a composite plate integrally formed of a ceramic base and copper. The surface of the main body 11 facing away from the connecting boss 12 can be flat, and the central portion of the heat sink 10 can be solid.

[0043] The first electronic device 00 may be a chip or other electronic devices. The first electronic device 00 may be connected to the connecting boss 12 by means of embedding, clamping, bonding, welding or screw connection.

[0044] One or more connecting bosses 12 and the first electronic device 00 may be provided.

[0045] Since the main body 11 and the connecting boss 12 are integrally provided, the heat generated by the first electronic device 00 can be directly conducted away through the connecting boss 12 and the main body 11 , resulting in a better heat dissipation effect.

[0046] The first connection layer 20 is stacked with the main body 11 , and the first connection layer 20 is provided with a relief groove.

[0047] The material of the first connection layer 20 may be PP (Prepreg) or polyimide, etc. The avoidance groove passes through the first connection layer 20 .

[0048] The first substrate 30 is stacked with the first connection layer 20 and is located on a side of the first connection layer 20 away from the main body 11 . The first substrate 30 is provided with a receiving groove, and the connecting boss 12 is located in the avoiding groove and the receiving groove.

[0049] The first substrate 30 may include a dielectric layer and a circuit layer. For example, the first substrate 30 may be composed of one core substrate, one dielectric layer, and one circuit layer; N core substrates, one dielectric layer, and one circuit layer; one core substrate, N dielectric layers, and N circuit layers; or N core substrates, N dielectric layers, and N circuit layers; where N is a positive integer greater than or equal to 2.

[0050] The accommodating groove may be provided corresponding to the avoiding groove, and the accommodating groove passes through the first substrate 30 .

[0051] The first sub-board 40 is stacked on the side of the first substrate 30 away from the main body 11. The first sub-board 40 includes a first dielectric layer 41 and a first circuit layer 42 arranged in a stacked manner. The first dielectric layer 41 is located between the first substrate 30 and the first circuit layer 42. The first dielectric layer 41 is provided with a first through hole. A first conductive portion 43 is provided inside the first through hole. The first electronic device 00 and / or the connecting boss 12 are connected to the first conductive portion 43, and the first circuit layer 42 is connected to the first conductive portion 43.

[0052] The first dielectric layer 41 can be made of PP (Prepreg) or polyimide. The first circuit layer 42 can be made of copper, aluminum, or silver. One or more first through holes can be provided. The first conductive portion 43 can be made of copper, aluminum, or silver.

[0053] When the first electronic device 00 is connected to the first conductive part 43 and the first circuit layer 42 is connected to the first conductive part 43 , part of the heat of the first electronic device 00 can also be dissipated through the first conductive part 43 and the first circuit layer 42 .

[0054] From the above, it can be seen that the printed circuit board 100 with embedded electronic devices provided in the embodiment of the present application, since the heat sink 10 includes an integrally formed main body 11 and a connecting boss 12, the connecting boss 12 is protruding from the outer surface of the main body 11, the connecting boss 12 is connected to the first electronic device 00, the first connecting layer 20 is stacked with the main body 11, the first connecting layer 20 is provided with a avoidance groove, the first substrate 30 is stacked with the first connecting layer 20, and the first substrate 30 is located on the side of the first connecting layer 20 away from the main body 11, the first substrate 30 is provided with a receiving groove, the connecting boss 12 is located in the avoidance groove and the receiving groove, and The first sub-board 40 is stacked on the side of the first substrate 30 away from the main body 11. The first sub-board 40 includes a first dielectric layer 41 and a first circuit layer 42 that are stacked. The first dielectric layer 41 is located between the first substrate 30 and the first circuit layer 42. The first dielectric layer 41 is provided with a first through hole. A first conductive portion 43 is provided inside the first through hole. The first electronic device 00 and / or the connecting boss 12 are connected to the first conductive portion 43, and the first circuit layer 42 is connected to the first conductive portion 43. Therefore, the heat generated by the first electronic device 00 can be directly discharged through the connecting boss 12 and the main body 11, and the heat dissipation effect is better.

[0055] The printed circuit board 100 with embedded electronic devices provided in the embodiment of the present application solves the problem of increased production costs caused by the complicated process caused by welding or pressing with thermal conductive adhesive after the production of such printed circuit boards 100, by directly embedding the heat sink 10 into the printed circuit board 100 in an integral molding manner instead of welding or pressing with thermal conductive adhesive. In addition, the heat dissipation effect of the integral molding method is better than that of welding or pressing with thermal conductive adhesive.

[0056] In the first embodiment, a limiting groove is provided on the side of the connecting boss 12 facing away from the main body 11 , the first electronic component 00 is disposed in the limiting groove, and the height of the first electronic component 00 is smaller than the depth of the limiting groove.

[0057] By adopting the above solution, the first electronic device 00 can be limited by the limiting groove, which facilitates the control of the connection accuracy between the first electronic device 00 and the heat sink 10, and can prevent the first sub-board 40 from squeezing the first electronic device 00 and causing damage to the first electronic device 00.

[0058] Optionally, multiple first through holes are provided, and the multiple first through holes include a first hole and a second hole. The first conductive part 43 includes a first part 431 provided inside the first hole and a second part 432 provided inside the second hole. The first part 431 is connected to the first electronic device 00, and the second part 432 is connected to the connecting boss 12. The first circuit layer 42 includes a first circuit 421 and a second circuit 422. The first circuit 421 is connected to the first part 431, and the second circuit 422 is connected to the second part 432.

[0059] With such a configuration, the first part 431 can be used to connect the first electronic device 00 with the first circuit 421, meeting the circuit conduction function requirements of the first electronic device 00, and the second part 432 can be used to connect the connecting boss 12 with the second circuit 422, and the second part 432 and the second circuit 422 can be used to conduct heat away from the connecting boss 12.

[0060] It is understood that the first electronic device 00 may be provided with a pad, and the pad of the first electronic device 00 is connected to the first portion 431. A plurality of first holes and second holes may be provided. The first line 421 may be a control network, and the second line 422 may be a power network.

[0061] Please refer to Figure 3 , Figure 3 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the second embodiment of the present application.

[0062] In the second embodiment, two first dielectric layers 41, two first substrates 30, and two first sub-boards 40 are provided, and the first dielectric layers 41, the first substrates 30, and the first sub-boards 40 are provided in a one-to-one correspondence. The main body 11 is located between the two first dielectric layers 41. Connecting bosses 12 are provided on opposite sides of the main body 11, and the connecting bosses 12 on the opposite sides of the main body 11 are respectively provided corresponding to the two first dielectric layers 41.

[0063] By adopting the above solution, the heat dissipation effect of the multi-layer printed circuit board 100 with embedded electronic components can be improved.

[0064] Please refer to Figure 4 , Figure 4 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the third embodiment of the present application.

[0065] In the third embodiment, the first electronic device 00 is disposed on a side of the boss 12 facing away from the main body 11 .

[0066] By adopting the above solution, the first electronic device 00 can be better fixed.

[0067] It is understandable that, in other embodiments, when a plurality of connecting bosses 12 are provided, some of the connecting bosses 12 are provided with limiting grooves, while some of the connecting bosses 12 are not provided with limiting grooves.

[0068] Please refer to Figure 5 , Figure 5 It is a structural diagram of a printed circuit board with embedded electronic components in the fourth embodiment of the present application.

[0069] In the fourth embodiment, the printed circuit board 100 further includes a thermally conductive insulating layer 50, a second substrate 60, and a second sub-board 70, which are sequentially and stacked. The thermally conductive insulating layer 50 is located between the main body 11 and the second substrate 60, and the connecting boss 12 is located on the side of the main body 11 facing away from the second substrate 60. A thermally conductive seat 61 is provided inside the second substrate 60, and the thermally conductive seat 61 is connected to the second electronic device 01. The thermally conductive seat 61 is connected to the thermally conductive insulating layer 50.

[0070] The second sub-board 70 includes a second dielectric layer 71 and a second circuit layer 72 arranged in a stacked manner. The second dielectric layer 71 is located between the second substrate 60 and the second circuit layer 72. The second dielectric layer 71 is provided with a second through hole. A second conductive portion 73 is provided inside the second through hole. The second electronic device 01 and / or the thermal seat 61 are connected to the second conductive portion 73, and the second circuit layer 72 is connected to the second conductive portion 73.

[0071] By adopting the above solution, the first electronic device 00 that generates more heat can be effectively dissipated by connecting the boss 12 and the main body 11, and the second electronic device 01 that generates less heat can be effectively dissipated by the thermal insulating layer 50 and the main body 11, and the processing is relatively convenient.

[0072] It should be noted that the thermally conductive insulating layer 50 may be made of high-conductivity PP, thermally conductive silicone, or thermally conductive polyimide film. The second substrate 60 may include a dielectric layer and a circuit layer. For example, the second substrate 60 may consist of one core substrate, one dielectric layer, and one circuit layer; N core substrates, one dielectric layer, and one circuit layer; one core substrate, N dielectric layers, and N circuit layers; or N core substrates, N dielectric layers, and N circuit layers; where N is a positive integer greater than or equal to 2.

[0073] The heat conducting base 61 can be made of copper, aluminum, or ceramic. The second dielectric layer 71 can be made of PP or polyimide. The second circuit layer 72 can be made of copper, aluminum, or silver. The structure of the second sub-board 70 can be similar to that of the first sub-board 40.

[0074] Please refer to Figure 6 , Figure 6 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in a fifth embodiment of the present application.

[0075] In the fifth embodiment, a heat dissipation duct 13 is provided inside the heat sink 10 . The heat dissipation duct 13 is formed on the main body 11 and / or the connecting boss 12 .

[0076] By adopting the above solution, the contact area between the heat sink 10 and the air can be increased, thereby improving the heat dissipation effect of the heat sink 10 on the first electronic device 00 .

[0077] It should be noted that a plurality of heat dissipation ducts 13 may be provided, and the plurality of heat dissipation ducts 13 are arranged at intervals.

[0078] In the fifth embodiment, a heat dissipation duct 13 is formed on the main body 11, and a plurality of fins are provided on the side of the main body 11 away from the connecting boss 12, and a heat dissipation duct 13 is formed between adjacent fins. The radiator 10 forms an air-cooled radiator 10, and the contact area between the radiator 10 and the air can be increased through the fin design, thereby improving the heat dissipation performance.

[0079] In other embodiments, the heat dissipation duct 13 may also be formed on the connecting boss 12 or formed on both the main body 11 and the connecting boss 12 .

[0080] Please refer to Figure 7 , Figure 71 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in a sixth embodiment of the present application.

[0081] In the sixth embodiment, a heat dissipation duct 13 is provided inside the heat sink 10, and the heat dissipation duct 13 is formed on the main body 11 and / or the connecting boss 12; two first dielectric layers 41, two first substrates 30, and two first sub-boards 40 are provided, and the first dielectric layers 41, the first substrate 30, and the first sub-boards 40 are provided in a one-to-one correspondence. The main body 11 is located between the two first dielectric layers 41, and connecting bosses 12 are provided on opposite sides of the main body 11, and the connecting bosses 12 on opposite sides of the main body 11 are respectively provided corresponding to the two first dielectric layers 41.

[0082] By adopting the above solution, the heat dissipation effect of the multi-layer printed circuit board 100 with embedded electronic components can be improved.

[0083] It should be noted that a plurality of fins may be provided inside the main body 11 , and heat dissipation ducts 13 are formed between adjacent fins, so that the radiator 10 forms an air-cooled radiator 10 .

[0084] Please refer to Figure 8 , Figure 8 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the seventh embodiment of the present application.

[0085] In the seventh embodiment, a heat dissipation cavity 14 is provided inside the heat sink 10 .

[0086] By adopting the above solution, a coolant or other cooling medium can be provided in the heat dissipation cavity 14 to improve the heat dissipation effect of the radiator 10 on the first electronic device 00 .

[0087] It should be noted that the radiator 10 may be a liquid cooling radiator or a temperature homogenizing plate, and the heat dissipation cavity 14 is formed on the main body 11 and / or the connecting boss 12 .

[0088] In the seventh embodiment, the radiator 10 is provided with a liquid inlet 141 and a liquid outlet 142 . Both the liquid inlet 141 and the liquid outlet 142 are communicated with the heat dissipation cavity 14 . The radiator 10 may be a liquid-cooled radiator.

[0089] By adopting the above solution, the coolant can be circulated into the cooling cavity through the liquid inlet 141 and the liquid outlet 142 , thereby improving the heat dissipation effect of the radiator 10 on the first electronic device 00 .

[0090] It is understood that the coolant can be water, etc. The radiator 10 can be a hollow liquid-cooled radiator. In the liquid-cooled radiator, liquid can be injected into the heat dissipation cavity 14 of the radiator 10 through the liquid inlet 141, and then flow out through the liquid outlet 142. The liquid flow design in the heat dissipation cavity 14 removes heat from the high-power first electronic device 00 (chip), thereby improving heat dissipation performance.

[0091] Optionally, a support column is provided inside the heat dissipation cavity 14 , the support column extends along the arrangement direction of the heat sink 10 and the first sub-board 40 , and both ends of the support column are connected to the inner wall of the heat dissipation cavity 14 .

[0092] This arrangement can prevent the heat sink 10 from collapsing and causing leakage of the heat dissipation cavity 14 when the heat sink 10 , the first connection layer 20 , the first substrate 30 and the first sub-board 40 are pressed together.

[0093] Please refer to Figure 9 , Figure 9 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the eighth embodiment of the present application.

[0094] In the eighth embodiment, a heat dissipation cavity 14 is provided inside the radiator 10, and the radiator 10 is provided with a liquid inlet 141 and a liquid outlet 142, both of which are connected to the heat dissipation cavity 14; two first dielectric layers 41, two first substrates 30, and two first sub-boards 40 are provided, and the first dielectric layers 41, the first substrates 30, and the first sub-boards 40 are provided in one-to-one correspondence, the main body 11 is located between the two first dielectric layers 41, and connecting bosses 12 are provided on opposite sides of the main body 11, and the connecting bosses 12 on opposite sides of the main body 11 are respectively provided corresponding to the two first dielectric layers 41.

[0095] By adopting the above solution, the heat dissipation effect of the multi-layer printed circuit board 100 with embedded electronic components can be improved.

[0096] Please refer to Figure 10 , Figure 10 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in a ninth embodiment of the present application.

[0097] In the ninth embodiment, a heat dissipation cavity 14 is provided inside the heat sink 10 , and the heat sink 10 is configured as a temperature homogenizing plate.

[0098] By adopting the above solution, the heat of the high-power first electronic device 00 can be reduced by cooling and reflowing the cooling liquid in the heat dissipation cavity 14 , thereby improving the heat dissipation performance.

[0099] It should be noted that the temperature equalizer is also called VC, the full name of which is Vapor Chamber, and its Chinese name is steam chamber or steam cavity. It mainly uses the principle of phase change heat transfer to quickly dissipate heat. When the first electronic device 00 generates heat, the liquid inside the VC will absorb the heat and quickly vaporize into gas. The gas diffuses to the area with lower temperature in the heat dissipation cavity 14, and then condenses into liquid again (that is, through the four steps of conduction, evaporation, convection and condensation, the heat is circulated by utilizing the physical principle of liquid evaporation absorbing heat and condensation dissipating heat, and the temperature of the hottest part of the radiator 10 (connecting boss 12) is reduced to the same temperature as the surrounding area). In this process, the heat is dissipated by the radiator 10. Through this continuously cyclic phase change process, efficient heat dissipation of the first electronic device 00 is achieved.

[0100] Please refer to Figure 11 , Figure 11 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the tenth embodiment of the present application.

[0101] In the tenth example, a heat dissipation cavity 14 is provided inside the radiator 10, and the radiator 10 is configured as a temperature uniformity plate; two first dielectric layers 41, two first substrates 30, and two first sub-boards 40 are provided, and the first dielectric layers 41, the first substrates 30, and the first sub-boards 40 are provided in one-to-one correspondence, the main body 11 is located between the two first dielectric layers 41, and connecting bosses 12 are provided on opposite sides of the main body 11, and the connecting bosses 12 on opposite sides of the main body 11 are respectively provided corresponding to the two first dielectric layers 41.

[0102] By adopting the above solution, the heat dissipation effect of the multi-layer printed circuit board 100 with embedded electronic components can be improved.

[0103] Please refer to Figure 12 , Figure 12 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the eleventh embodiment of the present application.

[0104] In the eleventh example, a heat dissipation cavity 14 is provided inside the radiator 10, and the radiator 10 is configured as a temperature uniformity plate; two first dielectric layers 41, two first substrates 30, and two first sub-boards 40 are provided, and the first dielectric layers 41, the first substrates 30, and the first sub-boards 40 are provided in one-to-one correspondence, the main body 11 is located between the two first dielectric layers 41, and connecting bosses 12 are provided on opposite sides of the main body 11, and the connecting bosses 12 on opposite sides of the main body 11 are respectively provided corresponding to the two first dielectric layers 41; the heat dissipation cavity 14 includes a first cavity 1401 and a second cavity 1402 that are connected, the first cavity 1401 is formed on the main body 11, and the second cavity 1402 is formed on the connecting boss 12.

[0105] By adopting the above solution, the contact area between the cooling liquid in the heat dissipation cavity 14 and the connecting boss 12 can be increased, and the cooling liquid can be closer to the first electronic device 00 that generates heat, so that the heat can be better removed by the cooling liquid, thereby achieving a high thermal conductivity effect.

[0106] It can be understood that the radiator 10 is provided with a liquid inlet 141 and a liquid outlet 142, and the liquid inlet 141 and the liquid outlet 142 are both connected to the heat dissipation cavity 14, that is, when the radiator 10 is a liquid-cooled radiator, the heat dissipation cavity 14 can also include a first cavity 1401 and a second cavity 1402 that are connected, the first cavity 1401 is formed on the main body 11, and the second cavity 1402 is formed on the connecting boss 12.

[0107] It can also be understood that when one first dielectric layer 41, one first substrate 30 and one first sub-board 40 are each provided, the heat dissipation cavity 14 can also include a first cavity 1401 and a second cavity 1402 that are connected to each other, the first cavity 1401 being formed on the main body 11 and the second cavity 1402 being formed on the connecting boss 12.

[0108] It should be noted that a recess having the same shape as the boss 12 may be provided in the internal structure of the boss 12 to form the second cavity 1402 .

[0109] Please refer to Figure 13 , Figure 13 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the twelfth embodiment of the present application.

[0110] In the twelfth embodiment, the heat dissipation cavity 14 is formed in the main body 11 . A heat dissipation duct 13 is further provided inside the main body 11 . The heat dissipation duct 13 is located on the side of the heat dissipation cavity 14 away from the first substrate 30 and is isolated from the heat dissipation cavity 14 .

[0111] By adopting the above solution, the heat dissipation duct 13 can be used in conjunction with the heat dissipation cavity 14 to improve the heat dissipation effect of the heat sink 10 on the first electronic device 00 .

[0112] In the twelfth embodiment, the radiator 10 is provided with a liquid inlet 141 and a liquid outlet 142 , and both the liquid inlet 141 and the liquid outlet 142 are communicated with the heat dissipation cavity 14 .

[0113] Please refer to Figure 14 , Figure 14 1 is a schematic structural diagram of a printed circuit board 100 with embedded electronic components in the thirteenth embodiment of the present application.

[0114] In the thirteenth embodiment, the heat dissipation cavity 14 is formed in the main body 11, and a heat dissipation duct 13 is also provided inside the main body 11. The heat dissipation duct 13 is located on the side of the heat dissipation cavity 14 away from the first substrate 30, and the heat dissipation duct 13 is isolated from the heat dissipation cavity 14. The radiator 10 is configured as a temperature equalizing plate.

[0115] By adopting the above solution, the heat dissipation duct 13 can be used in conjunction with the heat dissipation cavity 14 to improve the heat dissipation effect of the heat sink 10 on the first electronic device 00 .

[0116] In some embodiments, a heat dissipation protrusion is provided on the outer surface of the main body 11 .

[0117] By adopting the above solution, the contact area between the main body 11 and the air can be increased, thereby improving the heat dissipation effect of the heat sink 10 on the first electronic device 00 .

[0118] It should be noted that the heat dissipation protrusions can be configured as fins or needle-shaped protrusions, and one or more heat dissipation protrusions can be provided.

[0119] Please refer to Figures 15 to 17 , Figure 15 FIG. 1 is a flow chart of a method for manufacturing a printed circuit board 100 with embedded electronic components in the fourteenth embodiment of the present application. Figure 16 FIG. 1 is a structural diagram of a printed circuit board 100 with embedded electronic components in the fourteenth embodiment of the present application. Figure 17 yes Figure 16 The structure diagram of the panel 1000 corresponding to the printed circuit board 100 with embedded electronic components is shown.

[0120] A fourteenth embodiment of the present application provides a method for manufacturing a printed circuit board 100 with embedded electronic devices, which is used to manufacture the printed circuit board 100 with embedded electronic devices according to the first aspect, comprising: S100: The heat sink 10, the first connecting layer 20, the first substrate 30 and the processing board are stacked and pressed together in sequence to obtain a motherboard, wherein the processing board is stacked on the side of the first substrate 30 away from the main body 11, and the processing board includes a stacked connecting medium layer and a first conductive layer, and the connecting medium layer is located between the first substrate 30 and the first conductive layer.

[0121] S200 : Electroplated holes are processed on the motherboard. The electroplated holes include a first through hole penetrating the connecting dielectric layer and a functional hole penetrating the first conductive layer. The first through hole and the functional hole are coaxially arranged to connect the dielectric layers to form a first dielectric layer 41 .

[0122] S300: Filling the electroplated conductive part in the electroplated hole, the electroplated conductive part includes a first conductive part 43 located in the first through hole and a process conductive part located in the functional hole, the process conductive part is connected to the first conductive part 43, and the process conductive part and the first conductive layer form a first circuit layer 42.

[0123] For example, the electroplated conductive portion may be filled in the electroplated hole by electroplating copper and electroplating, and the first conductive layer may be thickened to within a required range by electroplating.

[0124] The manufacturing method of the printed circuit board 100 with embedded electronic devices provided in the embodiment of the present application is that the heat sink 10 includes an integrally formed main body 11 and a connecting boss 12, the connecting boss 12 is protruding from the outer surface of the main body 11, the connecting boss 12 is connected to the first electronic device 00, the first connecting layer 20 is stacked with the main body 11, the first connecting layer 20 is provided with a avoidance groove, the first substrate 30 is stacked with the first connecting layer 20, and the first substrate 30 is located on the side of the first connecting layer 20 away from the main body 11, the first substrate 30 is provided with a receiving groove, the connecting boss 12 is located in the avoidance groove and the receiving groove, and the first connecting layer 20 is stacked with the first connecting layer 20. A sub-board 40 is stacked on the side of the first substrate 30 away from the main body 11. The first sub-board 40 includes a first dielectric layer 41 and a first circuit layer 42 arranged in a stacked manner. The first dielectric layer 41 is located between the first substrate 30 and the first circuit layer 42. The first dielectric layer 41 is provided with a first through hole. A first conductive part 43 is provided inside the first through hole. The first electronic device 00 and / or the connecting boss 12 are connected to the first conductive part 43, and the first circuit layer 42 is connected to the first conductive part 43. Therefore, the heat generated by the first electronic device 00 can be directly discharged through the connecting boss 12 and the main body 11, and the heat dissipation effect is better.

[0125] The method for manufacturing the printed circuit board 100 with embedded electronic components provided in the embodiment of the present application has simple process and convenient operation.

[0126] Optionally, after the plated conductive part is filled in the plated hole by copper deposition and electroplating, the outer layer circuit, AOI (Automated Optical Inspection), solder mask, character, testing, FQC (Final Quality Control) and packaging processes can be continued.

[0127] Outer layer circuit: The outer layer circuit is produced by exposure, development and etching.

[0128] AOI: optically inspects the quality of outer circuits.

[0129] Solder mask: Solder mask is processed according to conventional manufacturing methods, and the high-temperature heat dissipation PAD (solder pad, such as the second line 422) is not covered with solder mask. Characters: Print characters in the usual way.

[0130] Test: Open and short circuit test on the line.

[0131] FQC: FQC inspects the products.

[0132] Packaging and shipment: Products that have passed the inspection will be packaged and shipped as required.

[0133] When the first substrate 30 and the first sub-board 40 are multi-layer boards, they can be obtained by multiple inner layer circuits and lamination, which will not be described in detail here.

[0134] Before the heat sink 10, the first connection layer 20, the first substrate 30 and the processing plate are sequentially stacked and pressed together, the method for manufacturing the printed circuit board 100 with embedded electronic components further includes: First, a heat dissipation plate is provided. The heat dissipation plate includes a main body portion 11 and a heat dissipation portion that are stacked.

[0135] For example, the main body 11 and the heat dissipation portion are integrally formed.

[0136] Part of the heat dissipation portion is removed, and the remaining heat dissipation portion is the connecting boss 12 .

[0137] For example, part of the heat dissipation portion may be removed by chemical etching, mechanical milling (such as controlled depth milling), or laser burning.

[0138] The first electronic device 00 is placed on the connecting boss 12 .

[0139] For example, the first electronic device 00 can be connected to the connecting boss 12 by means of embedding, clamping, bonding, welding or screw connection.

[0140] By adopting the above solution, the heat sink 10 can be manufactured more conveniently.

[0141] In the fourteenth embodiment, after providing the heat sink and before removing part of the heat dissipation portion, a first alignment hole 101 is processed on the heat sink; when removing part of the heat dissipation portion, the first alignment hole 101 is used as the alignment reference; when the first electronic device 00 is set on the connecting boss 12, the first alignment hole 101 is used as the alignment reference.

[0142] By adopting the above solution, the alignment accuracy between the connecting boss 12 and the first electronic device 00 can be improved, making it easier to accurately position the first electronic device 00 on the connecting boss 12 .

[0143] For example, when part of the heat dissipation part is removed by chemical etching, the first alignment hole 101 provides a graphic reference. When the graphic circuit is realized with reference to the first alignment hole 101, the connecting boss 12 is covered by film pasting, exposure, and development to expose the non-boss 12 area, and then the non-boss 12 area is etched away by etching; when part of the heat dissipation part is removed by depth control gong, the first alignment hole 101 is used as a positioning reference when the depth control gong equipment is gonged to remove the non-boss 12 area.

[0144] It should be noted that the first alignment hole 101 can be drilled by mechanical processing. If the heat sink is a ceramic substrate, the first alignment hole 101 can be laser drilled or directly made during sintering.

[0145] Among them, after removing part of the heat dissipation part and before setting the first electronic device 00 on the connecting boss 12, a limiting groove is processed on the connecting boss 12 with the first alignment hole 101 as a reference; setting the first electronic device 00 on the connecting boss 12 includes: using the first alignment hole 101 as an alignment reference, and setting the first electronic device 00 in the limiting groove.

[0146] Such an arrangement can improve the alignment reference between the limiting groove and the first electronic component 00, making it easier to accurately place the first electronic component 00 in the limiting groove.

[0147] It should be noted that the limiting grooves can be drilled by mechanical processing. If the heat sink is a ceramic substrate, the limiting grooves can be laser drilled or directly produced during sintering.

[0148] For example, when the first electronic device 00 is a chip, the chip positioning uses the first alignment hole 101 as the reference alignment hole, and the SMT (Surface Mount Technology) placement machine performs Mark (reference point) identification (i.e., the first alignment hole 101). Machine vision can automatically calculate the Mark center system coordinates, establish the conversion relationship between the placement machine system coordinates and the heat sink and chip coordinates, and calculate the precise movement coordinates of the placement machine. The placement head grabs the suction nozzle and absorbs the chip at the corresponding position according to the type, number and other parameters of the imported placement component, and the visual processing program detects, identifies and aligns the absorbed chip.

[0149] Optionally, before sequentially and stacking the heat sink 10, the first connection layer 20, the first substrate 30, and the processing plate and pressing them together, the method for manufacturing the printed circuit board 100 with embedded electronic components further includes: First, the first core plate 31 , the second core plate 32 , and the connection insulating layer 33 are provided.

[0150] For example, the first core board 31 and the second core board 32 may be copper clad laminates, etc. The material of the connecting insulating layer 33 may be PP (Prepreg) or polyimide, etc.

[0151] Next, a second alignment hole 311 , a third alignment hole 321 and a fourth alignment hole 331 are processed on the first core plate 31 , the second core plate 32 and the connecting insulating layer 33 respectively.

[0152] For example, the second alignment hole 311 , the third alignment hole 321 and the fourth alignment hole 331 may be processed on the first core plate 31 , the second core plate 32 and the connecting insulating layer 33 respectively by mechanical milling or laser burning.

[0153] Again, a first window is machined on the first core plate 31 with the second alignment hole 311 , a second window is machined on the second core plate 32 with the third alignment hole 321 , and a third window is machined on the connecting insulating layer 33 with the fourth alignment hole 331 .

[0154] For example, the first window, the second window and the third window can be processed by mechanical milling or laser burning.

[0155] Then, the first core plate 31, the second core plate 32 and the connecting insulating layer 33 are stacked together to obtain the first substrate 30, the connecting insulating layer 33 is located between the first core plate 31 and the second core plate 32, and the first window, the second window and the third window form a accommodating groove.

[0156] Next, when the heat sink 10 , the first connection layer 20 , the first substrate 30 and the processing plate are stacked and pressed together in sequence, the second alignment hole 311 , the third alignment hole 321 and the fourth alignment hole 331 are all arranged corresponding to the first alignment hole 101 .

[0157] By adopting the above solution, the first substrate 30 can be manufactured more conveniently, and the alignment accuracy of the first substrate 30 and the heat sink 10 can be improved, so that the connecting boss 12 can accurately extend into the avoidance groove and the accommodating groove.

[0158] In the fourteenth embodiment, a connection alignment hole 21 is provided on the first connection layer 20. When the heat sink 10, the first connection layer 20, the first substrate 30 and the processing plate are sequentially stacked and pressed together, the positioning pins are sequentially inserted into the first alignment hole 101, the connection alignment hole 21, the second alignment hole 311, the fourth alignment hole 331 and the third alignment hole 321.

[0159] By adopting the above solution, the alignment accuracy of the heat sink 10 , the first connection layer 20 , the first substrate 30 and the processing plate can be improved.

[0160] Among them, after the heat sink 10, the first connecting layer 20, the first substrate 30 and the processing board are stacked and pressed together in sequence, and before the electroplating holes are processed on the motherboard, the fifth alignment hole 401 is processed on the motherboard. The fifth alignment hole 401 passes through the processing board, and the fifth alignment hole 401, the connecting alignment hole 21, the first alignment hole 101, the second alignment hole 311, the third alignment hole 321 and the fourth alignment hole 331 are coaxially arranged; when the electroplating holes are processed on the motherboard, the fifth alignment hole 401 is used as a reference.

[0161] By adopting the above solution, the alignment accuracy between the plated hole and the first electronic device 00 can be improved, so that when the plated conductive part is subsequently filled in the plated hole, the pad of the first electronic device 00 is ensured to be accurately connected to the first conductive part 43.

[0162] It can be understood that the first alignment hole 101 first provides a reference for making the connecting boss 12 when the heat sink 10 is made, and then provides a reference for making the limiting groove in the connecting boss 12, and then provides a reference for positioning when setting the first electronic device 00. The second alignment hole 311, the third alignment hole 321 and the fourth alignment hole 331 are provided for making the window of the first core plate 31, the second core plate 32 and the connecting insulating layer 33 between the first core plate 31 and the second core plate 32 as a reference. The fifth alignment hole 401 is provided as a reference for positioning the electroplated holes processed on the motherboard, and the fifth alignment hole 401, the connection alignment hole 21, the first alignment hole 101, the second alignment hole 311, the third alignment hole 321 and the fourth alignment hole 331 are coaxially arranged, which can improve the precise positioning during pressing, so that the connection boss 12 is accurately positioned after pressing, and the positioning of the electroplated holes made after pressing can be achieved, so that the electroplated holes can be accurately drilled on the solder pads of the first electronic device 00 without any offset problems.

[0163] Optionally, the first alignment hole 101, the second alignment hole 311, the third alignment hole 321, the fourth alignment hole 331 and the connecting alignment hole 21 are each provided in plurality and are arranged one to one, and the number of positioning pins is less than the number of the first alignment hole 101; the fifth alignment hole 401 is processed on the motherboard, including: the fifth alignment hole 401 is processed from the side of the heat sink 10 away from the first connecting layer 20 through the first alignment hole 101 where no positioning pin is set.

[0164] By adopting the above-mentioned solution, the alignment accuracy of the heat sink 10, the first connecting layer 20, the first substrate 30 and the processing board can be improved, and the alignment accuracy of the electroplated hole and the first electronic device 00 can be improved, so that when the electroplated conductive part is subsequently filled in the electroplated hole, it is ensured that the solder pad of the first electronic device 00 is accurately connected to the first conductive part 43.

[0165] It is understandable that the fifth alignment hole 401 can be first processed from the side of the heat sink 10 away from the first connection layer 20 through the first alignment hole 101 without a positioning pin, and then the electroplating hole is drilled. When the heat dissipation cavity 14 is set inside the heat sink 10, the fifth alignment hole 401 only passes through the first substrate 30 and the first sub-board 40.

[0166] By machining the fifth alignment hole 401 through the first alignment hole 101 without a positioning pin on the side of the heat sink 10 facing away from the first connection layer 20, the embedding accuracy of the connecting boss 12 and the alignment accuracy of the electroplated hole and the solder pad of the first electronic device 00 can be improved.

[0167] Optionally, when the first alignment hole 101 is processed on the heat sink, the first rivet hole is processed on the heat sink; when the second alignment hole 311, the third alignment hole 321 and the fourth alignment hole 331 are correspondingly processed on the first core plate 31, the second core plate 32 and the connecting insulating layer 33, the second rivet hole, the third rivet hole and the fourth rivet hole are correspondingly processed on the first core plate 31, the second core plate 32 and the connecting insulating layer 33; when the radiator 10, the first connecting layer 20, the first substrate 30 and the processing plate are arranged in sequence and stacked and pressed together, the radiator 10 and the first substrate 30 are fixed by rivets passed through the first rivet hole, the second rivet hole, the third rivet hole and the fourth rivet hole.

[0168] Such an arrangement enables the heat sink 10 , the first connection layer 20 , the first substrate 30 and the processing board to be tightly connected.

[0169] It is understandable that a fifth riveting hole may be provided on the first connecting layer 20 , and the rivet is passed through the fifth riveting hole.

[0170] It should be noted that the first alignment hole 101, the second alignment hole 311, the third alignment hole 321, the fourth alignment hole 331, the connecting alignment hole 21 and the fifth alignment hole 401 can all be set on the process edge 110, and the unit of multiple printed circuit boards 100 can be simultaneously manufactured by making a panel 1000.

[0171] Please refer to Figure 18 , Figure 18 It is a structural diagram of a printed circuit board 100 with embedded electronic components in the fifteenth embodiment of the present application.

[0172] In the fifteenth embodiment, a heat dissipation cavity 14 is provided inside the heat sink 10 . The heat dissipation cavity 14 is formed in the main body 11 . The first alignment hole 101 is configured as a blind hole and isolated from the heat dissipation cavity 14 .

[0173] By adopting the above solution, it is possible to avoid damage to the heat dissipation cavity 14 caused by machining the first alignment hole 101 .

[0174] It is understandable that the first alignment hole 101 may be provided in a non-functional circuit area within the unit. The first alignment hole 101 does not penetrate the heat sink 10 but penetrates other layers of the heat sink 10 .

[0175] The above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. These modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present application, and should all be included in the scope of protection of the present application.

Claims

1. A printed circuit board with embedded electronic components, characterized in that: include: A heat sink comprising an integrally formed main body and a connecting boss, wherein the connecting boss is protruding from an outer surface of the main body, and the connecting boss is connected to a first electronic device; a first connecting layer, the first connecting layer being stacked with the main body, and the first connecting layer being provided with a avoiding groove; a first substrate, wherein the first substrate and the first connecting layer are stacked and located on a side of the first connecting layer away from the main body; the first substrate is provided with a receiving groove, and the connecting boss is located in the avoiding groove and the receiving groove; A first sub-board, the first sub-board is stacked on a side of the first substrate away from the main body, the first sub-board includes a first dielectric layer and a first circuit layer arranged in a stacked manner, the first dielectric layer is located between the first substrate and the first circuit layer, the first dielectric layer is provided with a first through hole, a first conductive portion is provided inside the first through hole, the first electronic device and / or the connecting boss is connected to the first conductive portion, and the first circuit layer is connected to the first conductive portion.

2. The printed circuit board with embedded electronic components according to claim 1, characterized in that: A heat dissipation duct is provided inside the radiator, and the heat dissipation duct is formed on the main body and / or the connecting boss.

3. The printed circuit board with embedded electronic components according to claim 1, wherein: A heat dissipation cavity is provided inside the radiator.

4. The printed circuit board with embedded electronic components according to claim 3, characterized in that: The heat dissipation cavity includes a first cavity and a second cavity that are connected to each other. The first cavity is formed on the main body, and the second cavity is formed on the connecting boss.

5. The printed circuit board with embedded electronic components according to claim 3, characterized in that: The heat dissipation cavity is formed in the main body. A heat dissipation duct is further provided inside the main body. The heat dissipation duct is located on a side of the heat dissipation cavity away from the first substrate, and the heat dissipation duct is isolated from the heat dissipation cavity.

6. The printed circuit board with embedded electronic components according to claim 3, characterized in that: A support column is provided inside the heat dissipation cavity. The support column extends along the arrangement direction of the radiator and the first sub-board, and both ends of the support column are connected to the inner wall of the heat dissipation cavity.

7. The printed circuit board with embedded electronic components according to claim 3, characterized in that: The radiator is provided with a liquid inlet and a liquid outlet, and both the liquid inlet and the liquid outlet are communicated with the heat dissipation cavity.

8. The printed circuit board with embedded electronic components according to claim 1, wherein: The outer surface of the main body is provided with a heat dissipation protrusion.

9. The printed circuit board with embedded electronic components according to claim 1, characterized in that: A limiting groove is provided on the side of the connecting boss away from the main body, the first electronic component is arranged in the limiting groove, and the height of the first electronic component is less than the depth of the limiting groove; or, the first electronic component is arranged on the side of the boss away from the main body.

10. The printed circuit board with embedded electronic components according to claim 1, characterized in that: There are multiple first through holes, and the multiple first through holes include a first hole and a second hole. The first conductive part includes a first part arranged inside the first hole and a second part arranged inside the second hole. The first part is connected to the first electronic device, and the second part is connected to the connecting boss; the first circuit layer includes a first circuit and a second circuit. The first circuit is connected to the first part, and the second circuit is connected to the second part.

11. The printed circuit board with embedded electronic components according to any one of claims 1 to 10, characterized in that: Two of each of the first dielectric layer, the first substrate, and the first sub-board are provided, and the first dielectric layer, the first substrate, and the first sub-board are provided in one-to-one correspondence. The main body is located between the two first dielectric layers. The connecting bosses are provided on opposite sides of the main body, and the connecting bosses on opposite sides of the main body are respectively provided corresponding to the two first dielectric layers.

12. The printed circuit board with embedded electronic components according to any one of claims 1 to 10, characterized in that: The printed circuit board also includes a thermally conductive insulating layer, a second substrate, and a second sub-board arranged in sequence and stacked together, the thermally conductive insulating layer being located between the main body and the second substrate, and the connecting boss being located on the side of the main body facing away from the second substrate; a thermally conductive seat being provided inside the second substrate, the thermally conductive seat being connected to a second electronic device, and the thermally conductive seat being connected to the thermally conductive insulating layer; the second sub-board includes a second dielectric layer and a second circuit layer being stacked together, the second dielectric layer being located between the second substrate and the second circuit layer, the second dielectric layer being provided with a second through hole, a second conductive portion being provided inside the second through hole, the second electronic device and / or the thermally conductive seat being connected to the second conductive portion, and the second circuit layer being connected to the second conductive portion.

13. A method for manufacturing a printed circuit board with embedded electronic devices, characterized in that: A printed circuit board for manufacturing an embedded electronic device according to any one of claims 1 to 12, comprising: The heat sink, the first connecting layer, the first substrate, and a processing board are sequentially stacked and pressed together to obtain a motherboard, wherein the processing board is stacked on a side of the first substrate facing away from the main body, and the processing board includes a stacked connecting dielectric layer and a first conductive layer, wherein the connecting dielectric layer is located between the first substrate and the first conductive layer; Electroplated holes are processed on the motherboard, wherein the electroplated holes include the first through holes penetrating the connecting dielectric layer and the functional holes penetrating the first conductive layer, the first through holes and the functional holes are coaxially arranged, and the connecting dielectric layer forms the first dielectric layer; The electroplated conductive part is filled in the electroplated hole, and the electroplated conductive part includes a first conductive part located in the first through hole and a process conductive part located in the functional hole. The process conductive part is connected to the first conductive part, and the process conductive part and the first conductive layer form the first circuit layer.

14. The method for manufacturing a printed circuit board with embedded electronic components according to claim 13, wherein: Before the heat sink, the first connection layer, the first substrate, and the processing plate are sequentially stacked and pressed together, the method for manufacturing the printed circuit board with embedded electronic components further includes: Providing a heat dissipation plate, the heat dissipation plate comprising the main body portion and the heat dissipation portion stacked together; Part of the heat dissipation portion is removed, and the remaining heat dissipation portion is the connecting boss; The first electronic component is arranged on the connecting boss.

15. The method for manufacturing a printed circuit board with embedded electronic components according to claim 14, wherein: After providing the heat sink and before removing part of the heat dissipation part, a first alignment hole is processed on the heat sink; when removing part of the heat dissipation part, the first alignment hole is used as the alignment reference; when setting the first electronic component on the connecting boss, the first alignment hole is used as the alignment reference.

16. The method for manufacturing a printed circuit board with embedded electronic components according to claim 15, wherein: After removing part of the heat dissipation portion and before placing the first electronic component on the connecting boss, a limiting groove is machined on the connecting boss based on the first alignment hole; The step of arranging the first electronic component on the connecting boss includes: using the first alignment hole as an alignment reference and arranging the first electronic component in the limiting groove.

17. The method for manufacturing a printed circuit board with embedded electronic components according to claim 15, wherein: Before the heat sink, the first connection layer, the first substrate, and the processing plate are sequentially stacked and pressed together, the method for manufacturing the printed circuit board with embedded electronic components further includes: providing a first core plate, a second core plate and a connecting insulating layer; Processing a second alignment hole, a third alignment hole, and a fourth alignment hole on the first core plate, the second core plate, and the connecting insulating layer respectively; Processing a first window on the first core plate with the second alignment hole, processing a second window on the second core plate with the third alignment hole, and processing a third window on the connecting insulating layer with the fourth alignment hole; The first core board, the second core board, and the connecting insulating layer are stacked together to obtain the first substrate, wherein the connecting insulating layer is located between the first core board and the second core board, and the first opening window, the second opening window, and the third opening window constitute the accommodating groove; When the heat sink, the first connection layer, the first substrate and the processing plate are sequentially stacked and pressed together, the second alignment hole, the third alignment hole and the fourth alignment hole are all arranged corresponding to the first alignment hole.

18. The method for manufacturing a printed circuit board with embedded electronic components according to claim 17, wherein: The first connecting layer is provided with connecting alignment holes. When the heat sink, the first connecting layer, the first substrate and the processing plate are stacked and pressed together in sequence, the positioning pins are inserted into the first alignment hole, the connecting alignment hole, the second alignment hole, the fourth alignment hole and the third alignment hole in sequence.

19. The method for manufacturing a printed circuit board with embedded electronic components according to claim 18, wherein: After the heat sink, the first connecting layer, the first substrate and the processing board are sequentially stacked and pressed together, and before the electroplating holes are processed on the motherboard, a fifth alignment hole is processed on the motherboard. The fifth alignment hole passes through the processing board, and the fifth alignment hole, the connecting alignment hole, the first alignment hole, the second alignment hole, the third alignment hole and the fourth alignment hole are coaxially arranged; when the electroplating holes are processed on the motherboard, the fifth alignment hole is used as a reference.

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