A method, system and circuit board for laser cutting a circuit

Abstract

The application discloses a kind of methods for laser cutting circuit, system and its circuit board, method includes: obtaining circuit pattern information and the first pose information of substrate;According to circuit pattern information and the first pose information determine laser marking atlas;According to laser marking atlas, control laser emission device is carried out laser etching on substrate and obtains line mark point;Obtain the copper layer thickness information of substrate;According to copper layer thickness information and line mark point, control laser emission device is cut on substrate and obtains target circuit board with target line.According to laser marking position, laser etching is carried out on substrate and obtains corresponding line mark point, according to line mark point, copper layer cutting is sequentially carried out and target line is obtained, so that the cutting of line is quickly completed, the line manufacturing efficiency and precision of thick copper circuit board are improved, and can be widely applied to the technical field of circuit board manufacturing.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and in particular to a method, system and circuit board for laser cutting of circuits. Background Technology

[0002] In current circuit board manufacturing, the etching process typically involves applying a dry film to a copper-clad circuit board and then performing chemical etching. However, when the copper layer of the circuit board is relatively thick, the etching efficiency is low, and areas not covered by the dry film on the thick copper are also etched by the chemical etching, resulting in poor etching precision. Summary of the Invention

[0003] In view of this, the purpose of this invention is to provide a method, system and circuit board for laser cutting of circuits, which can improve the efficiency and accuracy of circuit fabrication of thick copper circuit boards.

[0004] In a first aspect, embodiments of the present invention provide a method for laser cutting circuits, comprising the following steps:

[0005] Obtain circuit pattern information and the first pose information of the substrate;

[0006] A laser marking pattern is determined based on the circuit pattern information and the first pose information, wherein the laser marking pattern indicates the position of the laser marking on the substrate;

[0007] The laser emitting device is controlled to perform laser etching on the substrate according to the laser marking pattern to obtain line marking points;

[0008] Obtain the copper layer thickness information of the substrate;

[0009] Based on the copper layer thickness information and the line marking points, the laser emitting device is controlled to cut a target circuit board with the target lines on the substrate.

[0010] Optionally, determining the laser marking pattern based on the circuit pattern information and the first pose information includes:

[0011] Based on the circuit diagram information and preset marking rules, multiple first marking points and multiple second marking points are determined. The first marking points are arranged along both sides of the line indicated by the circuit diagram information, and the second marking points surround the line indicated by the circuit diagram information.

[0012] The first coordinate position of the first marker point and the second coordinate position of the second marker point are determined based on the first pose information and the mapping ratio.

[0013] The laser marking map is obtained by corresponding the first mark point with the first coordinate position and the second mark point with the second coordinate position.

[0014] Optionally, determining multiple first marker points and multiple second marker points based on the circuit pattern information and preset marking rules includes:

[0015] Determine the starting point, ending point, turning point, and segment of the line based on the circuit diagram information;

[0016] A start marker point is set according to the starting point of the line so that the start marker point indicates the starting position of the line;

[0017] Road segment markers are set according to the line diameter and line spacing of the line segment, so that the road segment markers are arranged on both sides of the line segment;

[0018] Corner markers are set at the corners of the line turning points so that the corner markers indicate the arrangement direction of the road segment markers on the next line segment.

[0019] An end marker is set according to the end point of the route so that the end marker indicates the end position of the route. The start marker, the segment marker, the corner marker, and the end marker all belong to the first marker.

[0020] Multiple second marker points are set around the line indicated by the circuit diagram information, so that the multiple second marker points surround the line indicated by the circuit diagram information.

[0021] Optionally, the step of controlling the laser emitting device to perform laser etching on the substrate according to the laser marking pattern to obtain line marking points includes:

[0022] The laser emitting device is controlled to emit a first laser with a first preset laser energy to perform laser etching at the first coordinate position to obtain the first mark point, and the first depth of the first mark point is less than or equal to the copper layer thickness.

[0023] The laser emitting device is controlled to emit a second laser with a second preset laser energy to perform laser etching at the second coordinate position to obtain the second mark point. The second depth of the second mark point is less than or equal to the substrate thickness, and the substrate thickness is equal to the plate thickness plus the copper layer thickness. Both the first mark point and the second mark point belong to the circuit mark point.

[0024] Optionally, obtaining the copper layer thickness information of the substrate includes:

[0025] A first magnetic field with a preset magnetic field strength is emitted toward the substrate to generate an eddy current magnetic field in the copper layer on the substrate.

[0026] The second magnetic field is obtained by superimposing the first magnetic field with the eddy current magnetic field;

[0027] The copper layer thickness information is obtained based on the second magnetic field and the preset thickness relationship table, which is used to indicate the correspondence between the second magnetic field and the copper layer thickness.

[0028] Optionally, controlling the laser emitting device to cut a target circuit board with target lines on the substrate based on the copper layer thickness information and the line marking points includes:

[0029] The first unit laser energy of the laser emitting device is determined based on the copper layer thickness information and the first preset etching time. The first unit laser energy represents the laser energy per unit area.

[0030] The laser emission device is configured with a first laser divergence based on a first diameter of the first marking point, and the first laser divergence characterizes the etching area of ​​the laser at the first marking point.

[0031] The second unit laser energy of the laser emitting device is determined based on the substrate thickness and the second preset etching time. The second unit laser energy represents the laser energy per unit area. The substrate thickness is equal to the plate thickness plus the copper layer thickness.

[0032] The second laser divergence of the laser emitting device is configured according to the second diameter of the second mark point, and the second laser divergence characterizes the etching area of ​​the laser at the second mark point;

[0033] The laser emitting device is controlled to sequentially emit a third laser with the first laser divergence and the first unit laser energy along the first marked point, so that the third laser etches the copper layer within the first preset etching time to obtain the target line;

[0034] The laser emitting device is controlled to sequentially emit a fourth laser with the second laser divergence and the second unit laser energy along the second mark point, so that the fourth laser etches the substrate within the second preset etching time to obtain the target circuit board.

[0035] Optionally, after obtaining the target route, the method further includes:

[0036] Obtain the copper layer area between the target lines;

[0037] The third unit laser energy of the laser emitting device is determined based on the copper layer thickness information and the third preset etching time.

[0038] The third laser divergence of the laser emitting device is adjusted according to the copper layer region so that the laser of the laser emitting device is adapted to the copper layer region.

[0039] The laser emitting device is controlled to emit a fifth laser having the third laser divergence and the third unit laser energy, so that the fifth laser etches the copper layer in the copper layer region within the third preset etching time.

[0040] Secondly, embodiments of the present invention provide a system for laser cutting circuits, comprising:

[0041] The first acquisition device is used to acquire circuit pattern information and the first pose information of the substrate;

[0042] A first processing device is configured to determine a laser marking pattern based on the circuit pattern information and the first pose information, wherein the laser marking pattern indicates the position of the laser marking on the substrate.

[0043] The second processing device is used to control the laser emitting device to perform laser etching on the substrate according to the laser marking pattern to obtain line marking points;

[0044] The second acquisition device is used to acquire information about the copper layer thickness of the substrate;

[0045] The third processing device is used to control the laser emitting device to cut a target circuit board with target lines on the substrate according to the copper layer thickness information and the line marking points.

[0046] A control device is used to control the first acquisition device, the second acquisition device, the first processing device, the second processing device, and the third processing device to work in a coordinated manner.

[0047] Optionally, it also includes those integrated into the same process equipment:

[0048] Video device for acquiring video images of a substrate;

[0049] An eddy current measurement device is used to emit a first magnetic field with a preset magnetic field strength onto a substrate to generate an eddy current magnetic field in a copper layer on the substrate, and to measure the thickness information of the copper layer based on the first magnetic field and the eddy current magnetic field.

[0050] A cleaning device used to clean residue from the substrate.

[0051] Thirdly, embodiments of the present invention provide a circuit board obtained by the laser cutting method described above.

[0052] The implementation of this invention provides the following beneficial effects: This invention provides a method for laser cutting circuits, comprising: acquiring circuit pattern information and a first pose information of a substrate; determining a laser marking pattern based on the circuit pattern information and the first pose information, wherein the laser marking pattern indicates the laser marking positions on the substrate; controlling a laser emitting device to perform laser etching on the substrate according to the laser marking pattern to obtain circuit marking points; acquiring copper layer thickness information of the substrate; and controlling the laser emitting device to cut the substrate according to the copper layer thickness information and the circuit marking points to obtain a target circuit board with target circuits. By determining the laser marking positions on the substrate based on the specific circuit pattern and substrate pose, laser etching is performed on the substrate to obtain corresponding circuit marking points. Copper layer cutting is then performed sequentially according to the circuit marking points to obtain the target circuits. After cutting the substrate, the target circuit board is obtained, thereby quickly completing the cutting of circuits and circuit boards, improving the efficiency and accuracy of circuit fabrication for thick copper circuit boards. Attached Figure Description

[0053] Figure 1 This is a schematic flowchart of a laser cutting method for circuits provided in an embodiment of the present invention;

[0054] Figure 2 This is a schematic diagram of laser cutting provided in an embodiment of the present invention;

[0055] Figure 3 This is a schematic diagram of the cross-section of the substrate provided in an embodiment of the present invention;

[0056] Figure 4 This is a schematic diagram of the structure of a laser cutting circuit system provided in an embodiment of the present invention.

[0057] Reference numerals: substrate 100, second marker 110, target line 120, start marker 121, segment marker 122, corner marker 123, end marker 124, copper layer area 125, target circuit board 130. Detailed Implementation

[0058] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0059] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0060] In the description of this invention, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0061] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0062] like Figure 1 As shown, in a first aspect, embodiments of the present invention provide a method for laser cutting circuits, applied to... Figure 2 The laser cutting shown Figure 3 The substrate cross-section shown includes the following steps.

[0063] S100: Obtain circuit pattern information and first pose information of substrate 100.

[0064] Specifically, the circuit graphic information in this application refers to the circuit information indicated by the vector graphic file exported from PCB design software, including the geometric parameters of the lines (line width, path, node coordinates), the design coordinates of the positioning points, etc. Key features (such as the start / end point of the line, corners, and theoretical coordinates of the positioning points) are extracted through graphic analysis algorithms and converted into a coordinate system that the device can recognize (such as the mechanical coordinate system of a laser emitting device).

[0065] The first pose information indicates the initial position (coordinates on the X and Y axes) and orientation (rotation angle θ, tilt, etc.) of the substrate 100 placed on the laser processing platform, reflecting the deviation between the actual position of the substrate 100 and the platform's reference coordinate system. The pose parameters are calculated by capturing images of the substrate 100's edges or pre-marked features (such as the substrate 100's outline and positioning holes) using an industrial camera and combining these images with image recognition algorithms (such as edge detection and Hough transform). If the substrate 100 has positioning holes, the hole coordinates can be detected using a mechanical probe or laser displacement sensor to infer the pose. The specific pose determination method is not limited here.

[0066] S200: Determine the laser marking pattern based on the circuit pattern information and the first pose information, wherein the laser marking pattern indicates the position of the laser marking on the substrate 100.

[0067] Specifically, based on the specific lines indicated by the circuit diagram information, the marking points that need to be marked on both sides of the lines are determined; that is, the specific lines can be obtained based on the marking points. Based on the substrate pose indicated by the first position information, the arrangement area of ​​the lines indicated by the circuit diagram information on the substrate 100 is determined, and the coordinates and sizes of the arrangement area are matched with the marking points on the lines to generate a corresponding laser marking pattern. Based on the laser marking pattern, the specific laser marking positions on the substrate 100 and the sizes of the line marking points at the laser marking positions can be determined.

[0068] S300: Based on the laser marking pattern, the laser emitting device is controlled to perform laser etching on the substrate 100 to obtain line marking points.

[0069] Specifically, based on the laser marking positions on the laser marking map and the size of the line marking points at those positions, line marking points of corresponding sizes are etched sequentially at the laser marking positions. The specific marking order at each laser marking position is determined according to the specific circuit and is not specifically limited here. After the laser emitting device completes the marking, a camera positioned above the substrate 100 photographs the line marking points. The size (e.g., diameter deviation ≤ 0.05mm) and clarity (no blurring or defects) of the line marking points are verified based on the captured video or photograph. The deviation between the actual line marking point coordinates and the theoretical values ​​in the map is measured. If the deviation is ≤ 0.03mm, it is considered acceptable (this is just an example; the specific deviation value is determined according to the specific circuit precision and process and is not limited here). Otherwise, the laser emitting device is controlled to etch and grind down the unacceptable line marking points, and the line marking points are re-etched.

[0070] S400: Obtain the copper layer thickness information of the substrate 100.

[0071] Specifically, the copper layer thickness information indicates the specific copper layer thickness on substrate 100. This copper layer thickness information can be pre-input and stored according to different substrate 100 models, so that the corresponding copper layer thickness information can be automatically retrieved when a specific substrate 100 model is identified. The copper layer thickness information can also be input in real-time via an external input port, or measured in real-time by a measuring device positioned above substrate 100. The specific measuring device can be a laser measuring device or an eddy current measuring device. A laser measuring device measures the copper layer thickness using the time difference of reflected light, while an eddy current measuring device uses the principle of electromagnetic induction to measure the copper layer thickness on a non-magnetic substrate 100 (such as FR-4). The specific measurement method is not limited here.

[0072] S500: Based on the copper layer thickness information and the line marking points, control the laser emitting device to cut a target circuit board 130 with target lines 120 on the substrate 100.

[0073] Specifically, the laser emitting device is controlled to perform laser cutting sequentially along the line marking points, and the specific unit laser energy (i.e., the laser cutting rate) is determined according to the copper layer thickness indicated by the copper layer thickness information and the preset cutting time of the laser emitting device. The specific laser divergence is also determined according to the size of the line marking points, thereby cutting out the specific target line 120. Simultaneously, the copper layer and the board material are cut at the line marking points around the target line 120, thereby cutting the target circuit board 130 with the target line 120 from the substrate 100.

[0074] In some optional embodiments, determining the laser marking pattern based on the circuit pattern information and the first pose information includes:

[0075] S210. Based on the circuit diagram information and preset marking rules, determine a plurality of first marking points and a plurality of second marking points 110. The first marking points are arranged along both sides of the line indicated by the circuit diagram information, and the second marking points 110 surround the line indicated by the circuit diagram information.

[0076] S220. Determine the first coordinate position of the first marker point and the second coordinate position of the second marker point 110 based on the first pose information and the mapping ratio;

[0077] S230. The laser marking map is obtained by corresponding the first mark point with the first coordinate position and the second mark point 110 with the second coordinate position.

[0078] Specifically, refer to Figure 2 Based on the circuit diagram information, and combined with preset marking rules, a first marking point and a second marking point 110 are set. The first marking point must be set closely to the line indicated by the circuit diagram, arranged along both sides of the line, and the arrangement must follow the preset rules regarding spacing and quantity. For example, a pair is set at regular intervals on straight sections, and the number is appropriately increased at corners to accurately correspond to the direction and details of the line. The second marking point 110 is arranged around the line indicated by the circuit diagram to form an enclosing state of the line. Key positions on the outer perimeter of the line are selected, such as the vertices or edges of the smallest enclosing area, and at least three are required to form a stable enclosing structure, thereby achieving the positioning of the overall line range and subsequent circuit board cutting.

[0079] After obtaining the first and second marker points 110, their actual coordinates on the substrate 100 are calculated by combining the first pose information of the substrate 100 and a preset mapping ratio. The first pose information reflects the initial position and orientation of the substrate 100 on the processing platform, including translation and rotation angles; the mapping ratio is used to convert the size units in the circuit pattern design into actual physical units on the substrate 100. Using the first pose information and the preset mapping ratio, the relative position of the first marker point in the design is converted and calculated to obtain its corresponding first coordinate position on the substrate 100; similarly, the second marker point 110 is processed in the same way to determine its corresponding second coordinate position, ensuring that the coordinate position accurately reflects the actual distribution of the marker points on the substrate 100.

[0080] Each first marker point is associated with its calculated first coordinate position, and each second marker point 110 is also associated with its corresponding second coordinate position. The set of all marker points and their corresponding coordinate positions constitutes the required laser marking pattern. This pattern clearly indicates the specific positions of various marker points on the substrate 100, facilitating subsequent laser etching operations.

[0081] In some optional embodiments, determining multiple first marker points and multiple second marker points 110 based on the circuit pattern information and preset marking rules includes:

[0082] S211. Determine the starting point, ending point, turning point, and segment of the circuit based on the circuit diagram information.

[0083] S212. Set a start marker point 121 according to the starting point of the line, so that the start marker point 121 indicates the starting point position of the line;

[0084] S213. Set up road segment markers 122 according to the line diameter and line spacing of the line segment, so that the road segment markers 122 are arranged on both sides of the line segment;

[0085] S214. Set corner markers 123 according to the corners of the line turning points, so that the corner markers 123 indicate the arrangement direction of the road segment markers 122 on the next line segment;

[0086] S215. Set an end marker 124 according to the end point of the route so that the end marker 124 indicates the end point of the route. The start marker 121, the road segment marker 122, the corner marker 123 and the end marker 124 all belong to the first marker.

[0087] S216. A plurality of second marker points 110 are provided at the periphery of the line indicated by the circuit diagram information, so that the plurality of second marker points 110 surround the line indicated by the circuit diagram information.

[0088] Specifically, key features are first extracted from the circuit diagram information to identify the starting point, ending point, inflection points, and segments of the line. The first marker is then refined: a start marker 121 is set based on the line's starting point, directly corresponding to the line's initial position and clearly indicating the beginning of the line; segment markers 122 are set based on the line diameter and spacing, arranged in an orderly fashion on both sides of the line segment, with their density and spacing conforming to preset rules to adapt to the actual parameters of the line segment and ensure accurate reflection of its direction; corner markers 123 are set according to the corner characteristics of the inflection points, as the line direction changes at the inflection point, and their function is to clearly indicate the arrangement direction of the segment markers 122 on the next line segment, ensuring the continuity of subsequent marker arrangements; and an end marker 124 is set based on the line's ending point to clearly indicate the line's ending position. The starting marker 121, the segment marker 122, the corner marker 123, and the ending marker 124 together constitute the first marker point, which comprehensively covers all key parts of the route from the starting point to the ending point. Therefore, the target route 120 can be obtained by laser cutting based on the first marker point. The starting marker 121, segment marker 122, corner marker 123, and ending marker 124 can be determined by different colors, shapes, or arrangements; no specific limitations are imposed.

[0089] For the second marker point 110, multiple points are set in the outer area of ​​the line indicated by the circuit graphic information. The distribution of these second marker points 110 must follow preset rules to ensure that they can form a state of surrounding the entire line, thereby positioning and defining the range of the line as a whole.

[0090] In some optional embodiments, the step of controlling the laser emitting device to perform laser etching on the substrate 100 according to the laser marking pattern to obtain line marking points includes:

[0091] S310. Control the laser emitting device to emit a first laser with a first preset laser energy to perform laser etching at the first coordinate position to obtain the first mark point, wherein the first depth of the first mark point is less than or equal to the copper layer thickness.

[0092] S320. Control the laser emitting device to emit a second laser with a second preset laser energy to perform laser etching at the second coordinate position to obtain the second mark point 110. The second depth of the second mark point 110 is less than or equal to the substrate thickness. The substrate thickness is equal to the plate thickness plus the copper layer thickness. Both the first mark point and the second mark point 110 belong to the circuit mark point.

[0093] Specifically, the laser emitting device is controlled to emit a first laser with a first preset laser energy, and the substrate 100 is laser-etched according to the first coordinate position corresponding to the first mark point in the laser marking pattern. During the etching process, it is necessary to ensure that the first depth of the first mark point is less than or equal to the thickness of the copper layer. This is because the first mark point is mainly used to assist in the precise positioning of the circuit, and it is only necessary to form an identifiable mark on the copper layer to avoid etching too deeply and damaging the substrate 100, thus affecting the insulation and mechanical strength of the substrate 100.

[0094] Then, the laser emitting device is controlled to emit a second laser with a second preset laser energy, and an etching operation is performed according to the second coordinate position corresponding to the second mark point 110 in the laser marking pattern to obtain the second mark point 110. Here, it is required that the second depth of the second mark point 110 is less than or equal to the substrate thickness, and the substrate thickness is the sum of the board thickness and the copper layer thickness. Since the second mark point 110 plays the role of surrounding the circuit and assisting in macroscopic positioning, appropriately increasing the etching depth can make it easier to identify. Furthermore, the laser emitting device cuts the substrate 100 according to the second mark point 110 to obtain the target circuit board 130. Therefore, the depth of the second mark point 110 can not exceed the substrate thickness.

[0095] In some optional embodiments, obtaining the copper layer thickness information of the substrate 100 includes:

[0096] S410: A first magnetic field with a preset magnetic field strength is emitted to the substrate 100 to generate an eddy current magnetic field in the copper layer on the substrate 100.

[0097] S420. The first magnetic field is superimposed with the eddy current magnetic field to obtain the second magnetic field;

[0098] S430. Obtain copper layer thickness information according to the second magnetic field and the preset thickness relationship table, wherein the preset thickness relationship table is used to indicate the correspondence between the second magnetic field and the copper layer thickness.

[0099] Specifically, a first magnetic field with a preset magnetic field strength is emitted to the substrate 100 through an eddy current measuring device. The first magnetic field acts on the copper layer on the surface of the substrate 100. Since copper is a conductive material, an induced current, i.e., eddy current, is generated inside the copper layer under the influence of the alternating first magnetic field. The presence of the eddy current will correspondingly generate an eddy current magnetic field. The strength of this eddy current magnetic field is closely related to the thickness of the copper layer. The thicker the copper layer, the more significant the eddy current effect, and the stronger the generated eddy current magnetic field.

[0100] The emitted first magnetic field is superimposed with the eddy current magnetic field generated by the copper layer to obtain the second magnetic field. The direction of the eddy current magnetic field is opposite to that of the first magnetic field (according to Lenz's law), so the superimposed second magnetic field is the result of the interaction between the two. Its magnetic field strength will change due to the cancellation effect of the eddy current magnetic field, and this change is specifically related to the thickness of the copper layer.

[0101] The copper layer thickness information is determined based on the obtained second magnetic field and a preset thickness relationship table. This preset thickness relationship table, established through extensive prior experiments, details the matching relationship between the specific parameters (such as magnetic field strength and magnetic induction intensity) of the second magnetic field formed by the superposition of the first and eddy current magnetic fields and the corresponding copper layer thicknesses for different copper layer thicknesses. Once the current second magnetic field parameters are obtained, the thickness information of the copper layer on substrate 100 can be accurately obtained by querying the corresponding entry in the relationship table.

[0102] In some optional embodiments, controlling the laser emitting device to cut a target circuit board 130 with target lines 120 on the substrate 100 according to the copper layer thickness information and the line markers includes:

[0103] S510. Determine the first unit laser energy of the laser emitting device based on the copper layer thickness information and the first preset etching time. The first unit laser energy represents the laser energy per unit area.

[0104] S520. Configure the first laser divergence of the laser emitting device according to the first diameter of the first marking point, wherein the first laser divergence characterizes the etching area of ​​the laser at the first marking point.

[0105] S530. Determine the second unit laser energy of the laser emitting device based on the substrate thickness and the second preset etching time. The second unit laser energy represents the laser energy per unit area. The substrate thickness is equal to the plate thickness plus the copper layer thickness.

[0106] S540. Configure the second laser divergence of the laser emitting device according to the second diameter of the second mark point 110, wherein the second laser divergence characterizes the etching area of ​​the laser at the second mark point 110.

[0107] S550. Control the laser emitting device to sequentially emit a third laser with the first laser divergence and the first unit laser energy along the first mark point, so that the third laser etches the copper layer within the first preset etching time to obtain the target line 120.

[0108] S560, control the laser emitting device to sequentially emit a fourth laser with the second laser divergence and the second unit laser energy along the second mark point 110, so that the fourth laser etches the substrate 100 within the second preset etching time to obtain the target circuit board 130.

[0109] Specifically, based on the obtained copper layer thickness information and the first preset etching time, the first unit laser energy of the laser emitting device is calculated. The first unit laser energy represents the laser energy of the third laser per unit area. Its value must ensure that the copper layer can be accurately etched within the first preset etching time to form the target line 120. The thicker the copper layer, the greater the required first unit laser energy, while also matching the first preset etching time to ensure that the etching effect meets the requirements. Simultaneously, the first laser divergence of the laser emitting device is configured. The first laser divergence is set according to the first diameter of the first marker point. The first laser divergence reflects the etching area of ​​the third laser at the first marker point. By adjusting the first laser divergence, the etching range of the third laser is made compatible with the first diameter of the first marker point, ensuring accurate etching at the first marker point.

[0110] The second unit laser energy is calculated by combining the substrate thickness (the substrate thickness is the sum of the plate thickness and the copper layer thickness) and the second preset etching time. The second unit laser energy represents the laser energy of the fourth laser per unit area. Since the material and thickness of the substrate 100 are different from those of the copper layer, the setting of the second unit laser energy must be sufficient to effectively etch the substrate 100 within the second preset etching time without causing excessive damage to the substrate 100.

[0111] Next, the second laser divergence is configured. Set according to the second diameter of the second marker point 110, the second laser divergence reflects the etching area of ​​the fourth laser at the second marker point 110. By adjusting the second laser divergence, the etching area of ​​the fourth laser at the second marker point 110 is matched with the second diameter of the second marker point 110, ensuring accurate etching of the substrate 100 and conforming to the overall contour requirements of the target circuit board 130.

[0112] Then, the laser emitting device is controlled to emit a third laser along the first marker point. The third laser has the first laser divergence and the first unit laser energy configured beforehand. Within the first preset etching time, the third laser sequentially etches the copper layer at multiple first marker points, forming the desired target line 120 along the first marker points.

[0113] Finally, the laser emitting device is controlled to emit a fourth laser along the second mark point 110. The fourth laser has a second laser divergence and a second unit laser energy. Within a second preset etching time, the fourth laser sequentially etches the substrate 100 at the second mark point 110, ultimately obtaining a complete target circuit board 130 with the target line 120.

[0114] During laser cutting, factors such as temperature, air temperature, air humidity, and air radiation can cause the laser to fail to penetrate the copper layer and / or substrate 100, indicating insufficient laser energy. In this case, the laser energy is linearly increased to cut other non-circuit areas on the substrate 100 until the copper layer or substrate 100 is just penetrated. The laser then returns to the cutting point, and the corresponding laser energy increment is determined. This increment is used to cut the previously uncut points, achieving the effect of just penetrating the copper layer or substrate 100. When cutting other points, the laser energy increment is synchronously increased to achieve the same effect, thus setting the laser energy at this point as the preset laser energy.

[0115] In some optional embodiments, after obtaining the target line 120, the method further includes:

[0116] S551. Obtain the copper layer region 125 between the target lines 120;

[0117] S552. Determine the third unit laser energy of the laser emitting device based on the copper layer thickness information and the third preset etching time;

[0118] S553. Adjust the third laser divergence of the laser emitting device according to the copper layer region 125 so that the laser of the laser emitting device is adapted to the copper layer region 125.

[0119] S554. Control the laser emitting device to emit a fifth laser having the third laser divergence and the third unit laser energy, so that the fifth laser etches the copper layer in the copper layer region 125 within the third preset etching time.

[0120] Specifically, refer to Figure 2 and Figure 3The copper layer region 125 between the target lines 120 is obtained. Copper layer region 125 is the excess copper layer portion outside the target lines 120 that needs to be removed. The third unit laser energy of the laser emitting device is determined based on the copper layer thickness information and the third preset etching time. The third unit laser energy represents the laser energy of the fifth laser per unit area. Since the copper layer between the target lines 120 to be etched has the same thickness as the copper layer where the target lines 120 were previously located, this copper layer thickness information must be combined with the third preset etching time. This ensures that the third unit laser energy can effectively remove the copper layer in this region within the third preset etching time, while avoiding excessive energy that could unnecessarily affect the substrate 100.

[0121] Next, the third laser divergence of the laser emitting device is adjusted according to the copper layer region 125. The third laser divergence determines the etching area of ​​the laser in the copper layer region 125. By adjusting it, the coverage of the laser is adapted to the size and shape of the copper layer region 125, ensuring that the copper layer in the region can be etched accurately and completely without missing any excess parts or damaging the adjacent target lines 120.

[0122] Finally, the laser emitting device is controlled to emit a fifth laser with a third laser divergence and a third unit laser energy. During a third preset etching time, the fifth laser acts on the copper layer region 125, etching the copper layer within that region. After this step, excess copper layers between the target lines 120 are removed, making the structure of the target lines 120 clearer and meeting the requirements for use on the circuit board.

[0123] After the target circuit board 130 is cut, there are corresponding residues. The cleaning device is controlled to clean and remove the residues, thereby avoiding affecting the quality of the target circuit board 130.

[0124] The implementation of this invention provides the following beneficial effects: This invention provides a method for laser cutting circuits, comprising: acquiring circuit pattern information and first pose information of a substrate 100; determining a laser marking pattern based on the circuit pattern information and the first pose information, the laser marking pattern indicating the laser marking positions on the substrate 100; controlling a laser emitting device to perform laser etching on the substrate 100 according to the laser marking pattern to obtain circuit marking points; acquiring copper layer thickness information of the substrate 100; and controlling the laser emitting device to cut on the substrate 100 according to the copper layer thickness information and the circuit marking points to obtain a target circuit board 130 with target circuits 120. By determining the laser marking positions on the substrate 100 based on the specific circuit pattern and substrate pose, laser etching is performed on the substrate 100 to obtain corresponding circuit marking points. Copper layer cutting is then performed sequentially according to the circuit marking points to obtain the target circuits 120. After cutting the substrate 100, the target circuit 120 board is obtained, thereby quickly completing the cutting of circuits and circuit boards, improving the efficiency and accuracy of circuit fabrication for thick copper circuit boards.

[0125] like Figure 4 As shown, in a second aspect, embodiments of the present invention also provide a system for laser cutting circuits, comprising:

[0126] The first acquisition device is used to acquire circuit pattern information and the first pose information of the substrate 100;

[0127] A first processing device is used to determine a laser marking pattern based on the circuit pattern information and the first pose information, wherein the laser marking pattern indicates the position of the laser marking on the substrate 100.

[0128] The second processing device is used to control the laser emitting device to perform laser etching on the substrate 100 according to the laser marking pattern to obtain line marking points.

[0129] The second acquisition device is used to acquire copper layer thickness information of the substrate 100;

[0130] The third processing device is used to control the laser emitting device to cut a target circuit board 130 with target lines 120 on the substrate 100 according to the copper layer thickness information and the line marking points.

[0131] A control device is used to control the first acquisition device, the second acquisition device, the first processing device, the second processing device, and the third processing device to work in a coordinated manner.

[0132] In some alternative embodiments, it also includes components integrated on the same process equipment:

[0133] Video device for acquiring video images of substrate 100;

[0134] An eddy current measuring device is used to emit a first magnetic field with a preset magnetic field strength to a substrate 100 to generate an eddy current magnetic field in a copper layer on the substrate 100, and to measure the thickness information of the copper layer based on the first magnetic field and the eddy current magnetic field.

[0135] A cleaning device for cleaning residues on substrate 100.

[0136] Thirdly, embodiments of the present invention provide a circuit board obtained by the laser cutting method described above.

[0137] It is evident that the content of the above method embodiments is applicable to this system embodiment. The specific functions implemented in this system embodiment are the same as those in the above method embodiments, and the beneficial effects achieved are also the same as those achieved in the above method embodiments.

[0138] It is understood that all or some of the steps and systems in the methods disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital information processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data information such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0139] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A method of laser cutting a circuit, characterized by, The method comprises the following steps: obtaining circuit pattern information and first pose information of a substrate; determining a laser marking map according to the circuit pattern information and the first pose information, the laser marking map indicating laser marking positions on the substrate; the step of determining the laser marking map according to the circuit pattern information and the first pose information comprises the following steps: determining a plurality of first marking points and a plurality of second marking points according to the circuit pattern information and a preset marking rule, the first marking points being arranged on both sides of a line indicated by the circuit pattern information, the second marking points surrounding the line indicated by the circuit pattern information; determining first coordinate positions of the first marking points and second coordinate positions of the second marking points according to the first pose information and a mapping ratio; obtaining the laser marking map by respectively corresponding the first marking points to the first coordinate positions and the second marking points to the second coordinate positions; controlling a laser emitting device to perform laser etching on the substrate according to the laser marking map to obtain line marking points; obtaining copper layer thickness information of the substrate; controlling the laser emitting device to cut the substrate according to the copper layer thickness information and the line marking points to obtain a target circuit board with a target line.

2. The method of laser cutting a circuit according to claim 1, wherein, The step of determining a plurality of first marking points and a plurality of second marking points according to the circuit pattern information and a preset marking rule comprises the following steps: determining a line starting point, a line ending point, a line inflection point and a line segment according to the circuit pattern information; setting a starting marking point according to the line starting point, so that the starting marking point indicates a starting position of the line; setting a road segment marking point according to a line diameter and a line spacing of the line segment, so that the road segment marking point is arranged on both sides of the line segment; setting an inflection marking point according to an inflection angle of the line inflection point, so that the inflection marking point indicates an arrangement direction of the road segment marking point on a next line segment; setting an ending marking point according to the line ending point, so that the ending marking point indicates an ending position of the line, the starting marking point, the road segment marking point, the inflection marking point and the ending marking point all belong to the first marking points; setting a plurality of the second marking points at a periphery of the line indicated by the circuit pattern information, so that the plurality of the second marking points surround the line indicated by the circuit pattern information.

3. The method of laser cutting a circuit according to claim 1, wherein, The step of controlling a laser emitting device to perform laser etching on the substrate according to the laser marking map to obtain line marking points comprises the following steps: controlling the laser emitting device to emit first laser with a first preset laser energy to perform laser etching at the first coordinate positions to obtain the first marking points, a first depth of the first marking points being less than or equal to a copper layer thickness; controlling the laser emitting device to emit second laser with a second preset laser energy to perform laser etching at the second coordinate positions to obtain the second marking points, a second depth of the second marking points being less than or equal to a substrate thickness, the substrate thickness being equal to a board thickness plus the copper layer thickness; the first marking points and the second marking points all belong to the line marking points.

4. The method of laser cutting a circuit according to claim 1, wherein, The step of obtaining copper layer thickness information of the substrate comprises the following steps: emit a first magnetic field with a preset magnetic field intensity to the substrate, so that the copper layer on the substrate generates an eddy current magnetic field; superimpose the first magnetic field and the eddy current magnetic field to obtain a second magnetic field; obtain copper layer thickness information according to the second magnetic field and a preset thickness relationship table, the preset thickness relationship table being used to indicate a corresponding relationship between the second magnetic field and the copper layer thickness.

5. The method of laser cutting a circuit according to claim 1, wherein, controlling the laser emitting device to cut the target circuit board with the target line on the substrate according to the copper layer thickness information and the line mark point, including: determining a first unit laser energy of the laser emitting device according to the copper layer thickness information and a first preset etching time, the first unit laser energy representing laser energy per unit area; configuring a first laser divergence of the laser emitting device according to a first diameter of the first mark point, the first laser divergence representing an etching area of the laser at the first mark point; determining a second unit laser energy of the laser emitting device according to a substrate thickness and a second preset etching time, the second unit laser energy representing laser energy per unit area, the substrate thickness being equal to the board thickness plus the copper layer thickness; configuring a second laser divergence of the laser emitting device according to a second diameter of the second mark point, the second laser divergence representing an etching area of the laser at the second mark point; controlling the laser emitting device to emit third laser with the first laser divergence and the first unit laser energy along the first mark point in sequence, so that the third laser etches the copper layer in the first preset etching time to obtain the target line; controlling the laser emitting device to emit fourth laser with the second laser divergence and the second unit laser energy along the second mark point in sequence, so that the fourth laser etches the substrate in the second preset etching time to obtain the target circuit board.

6. The method of laser cutting a circuit according to claim 5, wherein, after obtaining the target line, the method further includes: obtaining a copper layer region between the target lines; determining a third unit laser energy of the laser emitting device according to the copper layer thickness information and a third preset etching time; adjusting the third laser divergence of the laser emitting device according to the copper layer region, so that the laser of the laser emitting device is adapted to the copper layer region; controlling the laser emitting device to emit fifth laser with the third laser divergence and the third unit laser energy, so that the fifth laser etches the copper layer in the copper layer region in the third preset etching time.

7. A system for laser cutting a circuit, characterized in that including an integrated first acquisition device on the same process machine: the first acquisition device is used to acquire circuit pattern information and first pose information of the substrate; The first processing device is configured to determine a laser marking map according to the circuit pattern information and the first pose information, the laser marking map indicating laser marking positions on the substrate; the determination of the laser marking map according to the circuit pattern information and the first pose information comprises: determining a plurality of first marking points and a plurality of second marking points according to the circuit pattern information and a preset marking rule, the first marking points being arranged on both sides of a line indicated by the circuit pattern information, and the second marking points surrounding the line indicated by the circuit pattern information; determining first coordinate positions of the first marking points and second coordinate positions of the second marking points according to the first pose information and a mapping scale; and obtaining the laser marking map by respectively corresponding the first marking points to the first coordinate positions and the second marking points to the second coordinate positions; The second processing device is configured to control a laser emitting device to perform laser etching on the substrate according to the laser marking map, to obtain line marking points; The second acquisition device is configured to acquire copper layer thickness information of the substrate; The third processing device is configured to control the laser emitting device to perform cutting on the substrate according to the copper layer thickness information and the line marking points, to obtain a target circuit board with a target line; The control device is configured to control the first acquisition device, the second acquisition device, the first processing device, the second processing device and the third processing device to work coordinately.

8. The system of claim 7, wherein, The method further comprises the following devices integrated on the same process machine: The video device is configured to acquire a video image of the substrate; The eddy current measurement device is configured to emit a first magnetic field with a preset magnetic field strength to the substrate, to cause an eddy current magnetic field of a copper layer on the substrate, and to measure the copper layer thickness information according to the first magnetic field and the eddy current magnetic field; The cleaning device is configured to clean residues on the substrate.

9. A circuit board, characterized by The method is cut by the laser cutting line method according to any one of claims 1-6.

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