Cooperative control method for manufacturing precision between complex thin-wall microsphere shell component forming processes

Abstract

The invention discloses a cooperative control method for manufacturing precision between complex thin-wall microsphere shell component forming processes, and relates to the technical field of microsphere shell component machining. The invention relates to a multi-process forming method for a micro-spherical crown structure on the surface of a complex thin-wall micro-spherical shell component in the prior art. According to an existing manufacturing precision keeping and reference transferring method, due to factors such as low soft and brittle hardness of a workpiece material, high precision requirement and multiple processes, the pose precision and the manufacturing precision of a micro-spherical shell are difficult to keep in multi-process circulation. The device is used for four workpiece circulation processes of material milling removal-laser etching marking-milling quality characterization-laser local modification-surface quality detection corresponding to three processes of milling removal of a micro spherical crown structure on the surface of a thin-wall micro spherical shell component, laser modification and measurement characterization. All the steps cooperate to achieve high-precision forming of the micro-spherical crown structure on the surface of the complex thin-wall micro-spherical shell component. The method is used for forming the complex thin-wall microsphere shell component.

Description

A method for coordinated control of manufacturing precision among molding processes of complex thin-walled microspherical shell components Technical Field

[0001] This invention relates to the field of microsphere shell component processing technology, specifically to a method for coordinated control of manufacturing precision among the forming processes of complex thin-walled microsphere shell components. Background Technology

[0002] With the rapid development of high-end CNC machine tools and basic manufacturing equipment, various small-sized, high-precision, integrated thin-walled spherical shell complex micro-components are widely used in engineering fields such as aerospace, national defense, and biomedicine. These components have spherical diameters ranging from millimeters to sub-millimeters, and their surfaces are typically distributed with dozens to hundreds of multi-scale microgrooves, micro-caps, and other characteristic microstructures. These microstructures are required to achieve nanoscale surface roughness, sub-micrometer surface accuracy, high distribution uniformity, and precision consistency, placing high demands on the forming process and manufacturing precision control methods for these microstructures.

[0003] Complex thin-walled microsphere components are amorphous, soft, and brittle polymers with shell thicknesses of tens of micrometers. The microscopic material removal process exhibits significant viscoelasticity, low hardness, and weak stiffness. To meet the extreme precision requirements of microstructure manufacturing, a multi-process collaborative manufacturing approach is needed. This involves initial material removal via ultra-precision micromilling, followed by femtosecond laser processing to control the microstructure's micro-contact profile, and finally, a high-precision non-contact measurement system to characterize the microstructure's surface quality throughout the entire process. Therefore, ensuring high-precision transfer of workpiece orientation accuracy and microstructure manufacturing precision between processes is crucial for improving the overall machining quality of the microspheres. Current mainstream technical support systems primarily rely on process design optimization (such as unified benchmarks and reduced clamping times) and hardware system support (such as precision commercial fixtures and standardized interfaces), mainly targeting high-stiffness metallic components, machining of single-regular structures, and maintaining and transferring precision-level benchmarks. However, the unique softness, brittleness, and low hardness of microspherical shell components make them unsuitable for commercially standardized clamping systems. Furthermore, the extreme manufacturing precision requirements of microspherical cap structures across various scales limit the simplification of their multi-process forming procedures. Simultaneously, given the fundamental differences in structure and function between milling, laser processing, and measuring devices, a unified positioning interface cannot be designed for them. The aforementioned mainstream precision control technologies cannot meet the high-precision transfer requirements of microspherical shell components between different processes. Therefore, to address the extreme manufacturing precision demands of complex thin-walled microspherical shell components with multi-scale microspherical cap structures, there is an urgent need to develop a collaborative control method for manufacturing precision between microstructure forming processes to meet the application needs of the engineering field. Summary of the Invention

[0004] The purpose of this invention is to solve the problems in the existing technology of maintaining manufacturing accuracy and transferring reference during the multi-process forming of microspherical crown structures on the surface of complex thin-walled microspherical shell components. These problems are caused by factors such as the soft and brittle nature of the workpiece material, low hardness, high precision requirements, and multiple processes, which make it difficult to maintain the positional accuracy of the microspherical shell and the manufacturing accuracy of the microstructure in the multi-process flow. Therefore, this invention provides a method for coordinated control of manufacturing accuracy between the forming processes of complex thin-walled microspherical shell components. This invention addresses the multi-process forming of microspherical shell components, including milling removal of microspherical crown structures on the surface, local contour laser control, and full-process non-contact measurement. It utilizes a vacuum adsorption fixture and a detachable vacuum suction head to achieve stable adsorption and clamping of the microspherical shell components. A high-precision quick-change system, assisted by a quick-release negative pressure supply system, facilitates workpiece transfer between milling removal and laser control processes. Femtosecond laser etching and visual recognition methods, coupled with precision thread coupling, enable workpiece transfer between milling removal and quality characterization, and laser control and quality characterization processes. This effectively solves the problem of maintaining accuracy benchmarks during multi-process transfers in microstructure forming under extreme manufacturing precision constraints, providing technical support for high-precision forming of microspherical crown structures on the surface of complex thin-walled microspherical shell components.

[0005] The technical solution adopted by this invention to solve the above problems is: a method for coordinated control of manufacturing precision between the forming processes of complex thin-walled microspherical shell components. This method is used for four workpiece transfer processes corresponding to three processes: milling removal, laser shaping, and measurement characterization of the microspherical crown structure on the surface of the thin-walled microspherical shell component. These processes include material milling removal, laser etching marking, milling quality characterization, laser local shaping, and surface quality inspection. The above steps work together to achieve high-precision forming of the microspherical crown structure on the surface of the complex thin-walled microspherical shell component. The method for coordinated control of manufacturing precision between the forming processes of complex thin-walled microspherical shell components includes the following steps:

[0006] Step S100: The milled microsphere shell component is transferred to the laser device quick-change base of the laser device with the quick-change fixture for laser etching marking;

[0007] The microsphere shell component is clamped using a vacuum adsorption fixture. The microsphere shell component is connected to the vacuum suction head, which is threadedly connected to the milling laser vacuum cavity. The milling laser vacuum cavity is mounted on a quick-change fixture, which is connected to the milling quick-change system base. Based on ultra-precision micro-milling equipment, the microsphere shell surface microspherical crown structure is initially milled and shaped by multi-axis interpolation motion according to the planned processing path. The program controls the linear motion unit to move to the safe disassembly position. The pneumatic switch of the milling quick-change system base is turned on, and the quick-change fixture is disassembled. The program controls the laser device axis to move to the loading and unloading position. The milled microsphere shell component, along with the vacuum suction head, the milling laser vacuum cavity, and the quick-change fixture, is installed on the laser device quick-change base. The pneumatic switch is turned off to lock the fixture.

[0008] Step S200: The vacuum suction head and microsphere shell component with reference marks are transferred to the measuring vacuum chamber of the measuring device for characterizing the surface quality of the milled surface;

[0009] The laser device's axis system is initialized and homed, and the laser is preheated. The position of the linear axis system is adjusted via the multi-axis motion controller, and the laser B-axis motion unit is rotated so that the generatrix of the vacuum suction head's conical surface is parallel to the horizontal platform. The laser Z-axis motion unit is moved to adjust the distance between the laser focusing component and the vacuum suction head so that the focal point is at the horizontal conical surface of the chuck. The laser is turned on, and the program controls the laser X-axis motion unit to scan 4mm in the positive direction, etching a 4mm reference mark on the vacuum suction head through the laser focusing component. After etching, all axes move in tandem to the disassembly station. Based on the threaded coupling connection, the vacuum suction head and microsphere shell component are disassembled from the milling laser vacuum cavity end of the laser device and installed at the measuring vacuum cavity end of the measuring device.

[0010] Step S300: The microsphere shell component with microstructure contour morphology and manufacturing defect distribution information is transferred and connected to the milling laser vacuum cavity of the laser device along with the vacuum suction head for local contour laser shaping;

[0011] The measurement system performs a zero-return operation. The program controls the rotation of the measurement C-axis motion unit and captures the image of the laser-etched straight line mark through the measurement CCD camera. After grayscale processing, peak-valley separation and edge extraction by the edge detection operator, the pose of the etched mark in the machine tool coordinate system is obtained by the classical Hough transform method and set as the detection zero point.

[0012] A non-contact reciprocating scanning method using a measuring sensor is employed to acquire the surface contour information of the milled microsphere shell component. After data processing and error removal, spatial location information of defects requiring laser shaping, such as micro-dimples and protrusions, is obtained. This location information, based on the machine tool coordinate system, is transformed to the workpiece coordinate system with the center of the microsphere shell component as the origin, providing data support for femtosecond laser local contour control. After measurement, the program controls the axis system to move to the disassembly station. Based on a threaded coupling connection, the vacuum suction head and microsphere shell component are disassembled from the end of the measuring vacuum chamber and installed at the end of the milling laser vacuum chamber of the laser device. This completes the high-precision transfer of the workpiece between milling quality characterization and laser local shaping processes.

[0013] Step S400: The microsphere shell component after laser precise control is transferred and connected to the end of the measuring vacuum cavity of the measuring device along with the vacuum suction head, for surface quality characterization after laser shaping;

[0014] The program adjusts the position of the linear axis system, rotating the laser B-axis motion unit so that the generatrix of the vacuum suction head cone surface is parallel to the horizontal platform surface; the program controls the rotation of the laser C-axis motion unit and captures the image of the laser-etched linear mark through the microscopic vision module; image processing, including grayscale processing, peak-valley segmentation, and edge extraction using edge detection operators, obtains the position of the etched mark in the machine tool coordinate system and sets it as the zero point; based on the position information of the microspherical cap relative to the etched mark constructed by the measurement system, coordinate transformation is performed to obtain the position information of the manufacturing defects on the surface of the microspherical cap to be shaped in the machine tool coordinate system. Based on this, a CNC program is developed, which uses multi-axis linkage to control the laser focusing component to use a grating-type motion mode to trim the surface high points and micro-dimples, thereby improving the manufacturing accuracy of the micro-spherical crown. After the trimming is completed, the program controls the axis system to move to the disassembly station. Based on the threaded coupling connection, the vacuum suction head and micro-spherical shell component are disassembled from the end of the milling laser vacuum cavity of the laser device and installed at the end of the measuring vacuum cavity of the measuring device. The surface morphology of the micro-spherical crown after laser trimming is characterized according to step S300. The high-precision transfer of the workpiece between the laser local trimming and surface quality inspection processes is completed.

[0015] The present invention has the following beneficial technical effects:

[0016] This invention addresses the problem that existing methods for maintaining and transferring manufacturing precision during the multi-process molding of microspherical crown structures on the surface of thin-walled microspherical shell components are difficult to maintain in terms of microspherical shell orientation accuracy and microstructure manufacturing precision due to factors such as the softness and brittleness of the workpiece material, low hardness, high precision requirements, and multiple processes. It proposes a collaborative control method for manufacturing precision, including high-precision quick-change disassembly, femtosecond laser etching marking, and machine vision recognition. This method can achieve the microstructure molding precision requirements of nanoscale surface roughness, submicron-level surface shape accuracy, high distribution uniformity, and precision consistency.

[0017] This invention employs a vacuum adsorption fixture. The vacuum suction head is sealed to the vacuum chamber through a precision threaded coupling principle and is equipped with main / auxiliary gas source interfaces. The negative pressure is adjustable within a range of -77.89 kPa, which can ensure efficient switching of negative pressure and stable clamping of workpieces during transfer. At the same time, the vacuum suction head can adaptively match the spherical shape of microspheres, making it suitable for stable clamping of microsphere components with a diameter of 0.5 mm to 2.5 mm.

[0018] This invention employs a high-precision quick-change clamping system, which is locked by a pneumatic spring. The pneumatic opening pressure is only 0.6MPa, and the repeatability is better than ±0.5μm. It can meet the requirements of efficient and high-precision transfer of workpieces between milling removal and laser control processes.

[0019] This invention addresses the challenges of high measurement accuracy and low radial load on the C-axis of measuring devices by proposing a high-precision method for transferring accuracy references based on femtosecond laser etching marks. It combines a high-resolution CCD camera with a field of view of 6.4mm×4.8mm and 26 million pixels with image processing algorithms such as grayscale processing, peak-valley separation, and edge detection operators to ensure the maintenance and transfer of references between various processes and measuring devices.

[0020] This invention has high versatility. It is not only applicable to the effective maintenance and high-precision transfer of precision benchmarks during the multi-process forming of micro-spherical crown structures on the surface of complex thin-walled spherical micro-components, but also applicable to the field of manufacturing precision control during the multi-process forming of complex micro-parts such as microcavities and microchannels, microlenses, micro-honeycomb and microlattice structures. Attached Figure Description

[0021] Figure 1 is a control flowchart of the present invention;

[0022] Figure 2 is a schematic diagram of the high-precision quick-change clamping system coupled with a precision thread.

[0023] Figure 3 is a schematic diagram of laser etching and visual recognition of markings;

[0024] Figure 4 is a schematic diagram of the structure of the ultra-precision micro-milling equipment;

[0025] Figure 5 is a schematic diagram of the laser device;

[0026] Figure 6 is a schematic diagram of the measuring device;

[0027] In the diagram: 1. Milling X-axis motion unit; 2. Milling Y-axis motion unit; 3. Milling C-axis motion unit; 8. Milling cutter; 9. Milling B-axis motion unit; 10. Milling Z-axis motion unit; 11. Laser Y-axis motion unit; 12. Laser B-axis motion unit; 13. Laser X-axis motion unit; 14. Laser Z-axis motion unit; 15. Microscopic vision module; 16. Laser focusing component; 17. Laser C-axis motion unit; 18. Measurement C-axis motion unit; 19. Measurement CCD camera; 20. Measurement sensor; 21. Measurement B-axis motion unit; 22. Measurement X-axis motion unit; 23. Measurement Z-axis motion unit; 24. Microsphere shell component; 25. Vacuum suction head; 26. Milling laser vacuum cavity; 28. Measurement vacuum cavity; 29. ​​Milling quick-change system base; 30. Laser quick-change system base. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. The specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0029] Specific Implementation Method 1: This implementation method is illustrated in Figures 1 to 6. In this method, the collaborative control method for manufacturing precision between the forming processes of complex thin-walled microsphere shell components is used for four workpiece transfer processes corresponding to three processes: milling removal of the microsphere crown structure on the surface of the thin-walled microsphere shell component, laser shaping, and measurement characterization. These processes include material milling removal, laser etching marking, milling quality characterization, laser local shaping, and surface quality inspection. The above steps work together to achieve high-precision forming of the microsphere crown structure on the surface of the complex thin-walled microsphere shell component. The collaborative control method for manufacturing precision between the forming processes of complex thin-walled microsphere shell components includes the following steps:

[0030] Step S100: The milled microsphere shell component 24 is transferred to the laser device quick-change base 30 of the laser device along with the quick-change fixture for laser etching marking;

[0031] The microsphere shell component 24 is clamped by a vacuum adsorption fixture. The microsphere shell component 24 is connected to the vacuum suction head 25. The vacuum suction head 25 and the milling laser vacuum cavity 26 are precisely threaded together. The milling laser vacuum cavity 26 is mounted on a quick-change fixture. The quick-change fixture is connected to the milling quick-change system base 29. Based on the ultra-precision micro-milling processing equipment, the microsphere shell surface microsphere crown structure is initially milled and formed by multi-axis interpolation motion according to the planned processing path. The program controls the linear motion unit to move to the safe disassembly position. The pneumatic switch of the milling quick-change system base 29 is turned on and the quick-change fixture is disassembled. The program controls the laser device axis to move to the loading and unloading position. The milled microsphere shell component 24, along with the vacuum suction head 25, the milling laser vacuum cavity 26 and the quick-change fixture, is installed on the laser device quick-change base 30. The pneumatic switch is turned off to lock the fixture.

[0032] Step S200: The vacuum suction head 25 with reference marks and the microsphere shell component 24 are transferred to the measuring vacuum chamber 28 of the measuring device for characterizing the surface quality of the milled surface;

[0033] The laser device's axis system is initialized and returned to zero, and the laser is preheated. The position of the linear axis system is adjusted by the multi-axis motion controller, and the laser B-axis motion unit 12 is rotated so that the generatrix of the conical surface of the vacuum suction head 25 is parallel to the horizontal platform. The laser Z-axis motion unit 14 is moved to adjust the distance between the laser focusing component 16 and the vacuum suction head 25 so that the focal point is at the horizontal conical surface of the chuck. The laser is turned on, and the program controls the laser X-axis motion unit 13 to scan 4mm in the positive direction. A 4mm reference mark is etched on the vacuum suction head 25 by the laser focusing component 16. After etching, all axes move in linkage to the disassembly station. Based on the threaded coupling, the vacuum suction head 25 is disassembled from the end of the milling laser vacuum cavity 26 of the laser device and installed at the end of the measuring vacuum cavity 28 of the measuring device.

[0034] Step S300: The microsphere shell component 24 with microstructure contour morphology and manufacturing defect distribution information is transferred and connected to the milling laser vacuum cavity 26 of the laser device along with the vacuum suction head 25 for local contour laser shaping.

[0035] The measurement system performs a zero-return operation. The program controls the rotation of the measurement C-axis motion unit 18 and captures the image of the laser-etched straight line mark through the measurement CCD camera 19. After grayscale processing, peak-valley separation and edge extraction by the edge detection operator, the pose of the etched mark in the machine tool coordinate system is obtained by the classical Hough transform method and set as the detection zero point.

[0036] The surface contour information of the milled micro spherical shell component 24 is acquired by non-contact reciprocating scanning using a measuring sensor 20. After data processing and error elimination, the spatial location information of defects such as micro-dimples and protrusions to be laser-shaped is obtained. The above location information is based on the machine tool coordinate system and is transformed to the workpiece coordinate system with the center of the micro spherical shell component 24 as the origin, providing data support for femtosecond laser local contour control. After the measurement is completed, the program controls the axis system to move to the disassembly station. Based on the threaded coupling, the vacuum suction head 25 is disassembled from the end of the measuring vacuum cavity 28 and installed at the end of the milling laser vacuum cavity 26 of the laser device. This completes the high-precision transfer of the workpiece between the milling quality characterization and laser local shaping processes.

[0037] Step S400: The microsphere shell component 24, after precise laser control, is transferred and connected to the end of the measuring vacuum chamber 28 of the measuring device along with the vacuum suction head 25, for surface quality characterization after laser shaping.

[0038] The program adjusts the position of the linear axis system, rotating the laser B-axis motion unit 12 so that the generatrix of the conical surface of the vacuum suction head 25 is parallel to the horizontal platform surface; the program controls the rotation of the laser C-axis motion unit 17 and captures the image of the laser-etched linear mark through the microscopic vision module 15; after image processing such as grayscale processing, peak-valley segmentation, and edge extraction by edge detection operators, the position of the etched mark in the machine tool coordinate system is obtained and set as the zero point; based on the position information of the microsphere cap relative to the etched mark constructed by the measurement system, the manufacturing defects on the surface of the microsphere cap to be shaped are obtained in the machine tool coordinate system through coordinate transformation. The location information is used to compile a CNC program. The laser focusing component 16 is controlled by multi-axis linkage to use a grating motion mode to trim the surface high points and micro-dimples to improve the manufacturing accuracy of the micro-spherical crown. After the trimming is completed, the program controls the axis system to move to the disassembly station. Based on the threaded coupling, the vacuum suction head 25 is disassembled from the end of the milling laser vacuum cavity 26 of the laser device and installed at the end of the measuring vacuum cavity 28 of the measuring device. The surface morphology of the micro-spherical crown after laser trimming is characterized according to step S300. The high-precision transfer of the workpiece between the laser local trimming and surface quality inspection processes is completed.

[0039] In a preferred embodiment, the quick-change clamp system used in step S100 has an adjustable negative pressure range of 0 to -77.89 kPa, and water-soluble adhesive is applied between the microsphere shell component 24 and the vacuum suction head 25 to ensure airtightness.

[0040] In a preferred embodiment, the quick-change clamping system used in step S100 employs pneumatic spring locking, has a repeatability accuracy range of ±0.5μm, and a pneumatic opening pressure of 0.6MPa.

[0041] In a preferred embodiment, the laser used in step S200 is set with a laser power of 100mW, a quarter-wave plate angle of 45°, and a defocusing amount of -0.1μm. The program controls the laser X-axis motion unit 13 to scan 4mm in the forward direction at a speed of 0.2mm / s.

[0042] In a preferred embodiment, in step S200, a hydrosol is dropped between the microsphere shell component 24 and the vacuum suction head 25, and the microsphere shell component 24 is attached to the vacuum suction head 25 by the adhesive force of the hydrosol.

[0043] In a preferred embodiment, in step S300, the C-axis motion unit 18 is measured to rotate at a speed of 10 rpm, and the CCD camera 19 is measured to be a high-resolution camera with 26 megapixels and a field of view of 6.4 mm × 4.8 mm.

[0044] In a preferred embodiment, in step S300, a hydrosol is dropped between the microsphere shell component 24 and the vacuum suction head 25, and the microsphere shell component 24 is attached to the vacuum suction head 25 by the adhesive force of the hydrosol.

[0045] In a preferred embodiment, in step S400, the laser C-axis motion unit 17 of the laser device rotates at a speed of 10 rpm and captures the image of the laser-etched straight line mark through the microscopic vision module 15.

[0046] In a preferred embodiment, the laser energy density of the laser focusing component 16 of the laser device used in step S400 is 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning interval is 1μm, and the scanning speed is set to 25μm / s.

[0047] In a preferred embodiment, in step S400, a hydrosol is dropped between the microsphere shell component 24 and the vacuum suction head 25, and the microsphere shell component 24 is attached to the vacuum suction head 25 by the adhesive force of the hydrosol.

[0048] In this embodiment, the high-precision forming of the micro-spherical crown structure on the surface of the complex thin-walled micro-spherical shell component adopts an ultra-precision micro-milling machining system, an ultraviolet nanosecond laser shaping device, and a non-contact measurement system. The ultra-precision micro-milling machining system includes a milling X-axis motion unit 1, a milling Y-axis motion unit 2, a milling C-axis motion unit 3, a milling cutter 8, a milling B-axis motion unit 9, and a milling Z-axis motion unit 10. The milling Y-axis motion unit 2 is mounted on the milling X-axis motion unit 1, the milling C-axis motion unit 3 is mounted on the milling Y-axis motion unit 2, and the milling quick-change system base 29 is located at the end of the milling C-axis motion unit 3. The milling B-axis motion unit 9 is mounted on the milling Z-axis motion unit 10, and the milling cutter 8 is located at the end of the milling B-axis motion unit 9. The milling cutter 8 is used for milling and forming the micro-spherical crown structure of the micro-spherical shell component 24.

[0049] The ultraviolet nanosecond laser shaping device includes a laser Y-axis motion unit 11, a laser B-axis motion unit 12, a laser X-axis motion unit 13, a laser Z-axis motion unit 14, a microscopic vision module 15, a laser focusing component 16, a laser C-axis motion unit 17, and a laser quick-change system base 30. The laser B-axis motion unit 12 is mounted on the laser Y-axis motion unit 11, the laser C-axis motion unit 17 is located at the end of the laser B-axis motion unit 12, and the laser quick-change system base 30 is mounted on the laser C-axis motion unit 17. The laser X-axis motion unit 13 is mounted on the laser Z-axis motion unit 14, and both the microscopic vision module 15 and the laser focusing component 16 are mounted on the laser X-axis motion unit 13. The laser focusing component 16 is used for etching straight lines and planarizing the surface of the microspherical cap structure of the microspherical shell component 24, and the microscopic vision module 15 is used to capture the etched marks.

[0050] The non-contact measurement system includes a C-axis motion unit 18, a CCD camera 19, a sensor 20, a B-axis motion unit 21, an X-axis motion unit 22, and a Z-axis motion unit 23. The X-axis motion unit 22 is mounted on the Z-axis motion unit 23, the B-axis motion unit 21 is mounted on the X-axis motion unit 22, and the sensor 20 is located at the end of the B-axis motion unit 21. A vacuum chamber 28 is mounted on the C-axis motion unit 18. The CCD camera 19 is used to capture and identify the microstructure of the microsphere shell component 24 and its surface. The sensor 20 is used to acquire the spatial pose of the surface contour of the microsphere shell component 24 after milling and to identify manufacturing defects such as protrusions and pits on the surface.

[0051] Specific Implementation Method Two: This implementation method is illustrated in conjunction with Figures 1 to 6. Figure 1 shows a schematic diagram of the collaborative control method for manufacturing precision among the forming processes of complex thin-walled microsphere shell components. This collaborative control method for manufacturing precision among the forming processes of complex thin-walled microsphere shell components is a method for maintaining and transferring precision benchmarks during multiple forming processes, including milling removal, laser shaping, and measurement characterization of the microsphere crown structure on the microsphere shell surface. During material milling removal and local contour laser shaping, the microsphere shell component 24 is adsorbed onto the vacuum suction head 25 under negative pressure. The vacuum suction head 25 and the milling laser vacuum cavity 26 are precisely threadedly coupled and bonded with an appropriate amount of water-soluble adhesive to ensure airtightness. The vacuum cavity 26 is connected to the quick-change system base. The vacuum cavity has main / auxiliary gas source ports for connecting to the negative pressure environment to ensure stable and reliable material removal and clamping. The vacuum suction head can adaptively match the size of the microsphere shell, suitable for stable clamping of microsphere shell components with a diameter of 0.5~2.5mm. During the entire non-contact measurement process, considering the structural characteristics such as high measurement accuracy and small radial load of the C-axis, the microsphere shell component 24 is connected to the end of the measurement vacuum chamber 28 by the adhesive force of the water-soluble adhesive. The stable clamping of the microsphere shell during measurement and characterization is achieved by the precision pipe thread coupling connection between the vacuum suction head 25 and the measurement vacuum chamber 28, as shown in Figure 2.

[0052] The other components and connections are the same as in Specific Implementation Method 1.

[0053] Specific Implementation Method 3: This implementation method, illustrated in Figures 1 to 6, addresses the manufacturing precision coordination control method among the forming processes of complex thin-walled spherical shell components. This method involves four workpiece transfer processes corresponding to three processes: milling removal, laser etching marking, milling quality characterization, laser local shaping, and surface quality inspection of the microspherical crown structure on the surface of the thin-walled microspherical shell component. As shown in Figure 1: ① The milled microspherical shell is transferred to the quick-change base of the laser device via a quick-change fixture for laser etching marking; ② A vacuum suction head with reference marks and the microspherical shell are transferred to the vacuum cavity of the measuring device for milling surface quality characterization; ③ A microspherical shell with microstructure contour morphology and manufacturing defect distribution information is transferred to the vacuum cavity of the laser device via the vacuum suction head for local contour laser shaping; ④ The microspherical shell, after precise laser control, is transferred to the end of the vacuum cavity of the measuring device via the vacuum suction head for surface quality characterization after laser shaping. These steps work together to achieve high-precision forming of the microspherical crown structure on the surface of the complex thin-walled microspherical shell component.

[0054] Detailed instructions and operating procedures:

[0055] Step 1: Use a vacuum adsorption fixture to stably clamp the microsphere shell component 24. The negative pressure of the fixture is adjustable from 0 to -77.89 kPa. Apply an appropriate amount of water-soluble adhesive to ensure airtightness. Based on the ultra-precision micro-milling equipment, according to the planned processing path, the microsphere shell surface microspherical crown structure is initially milled by multi-axis interpolation motion. The program controls the linear motion unit to move to the safe disassembly position. Connect the auxiliary gas source port of the vacuum chamber to the negative pressure interface of the laser device, close the main gas source interface of the vacuum chamber, and disassemble the gas pipe through the quick-connect interface. Turn on the pneumatic switch of the milling quick-change system base 29 and disassemble the quick-change fixture. The program controls the laser device axis to move to the loading and unloading position. Install the milled microsphere shell component 24, along with the vacuum suction head 25, the milled laser vacuum chamber 26, and the quick-change fixture, onto the laser device quick-change base 30. Turn off its pneumatic switch to lock the fixture. The quick-change system uses pneumatic spring locking, with a repeatability accuracy better than ±0.5μm and a pneumatic opening pressure of only 0.6MPa, meeting the high-precision assembly and disassembly requirements between milling and laser etching processes.

[0056] Step 2: Initialize and hom the laser device's axis system, and preheat the laser; adjust the position of the linear axis system using the multi-axis motion controller, and rotate the laser B-axis motion unit 12 so that the generatrix of the vacuum suction head 25's conical surface is parallel to the horizontal platform; move the laser Z-axis motion unit 14 to adjust the distance between the laser focusing component 16 and the vacuum suction head 25 so that the focal point is at the horizontal conical surface of the clamp; turn on the laser, set the laser power to 100mW, the 1 / 4 waveplate angle to 45°, and the defocusing amount to -0.1μm, and program-control the laser X-axis motion unit 13 to move at 0.2mm / s along... A 4mm forward scan is performed, causing the laser focusing component 16 to etch a 4mm reference mark on the vacuum suction head 25. After etching, all axes move together to the disassembly station. The secondary gas source interface of the vacuum chamber is closed. Based on the principle of precision thread coupling, the vacuum suction head 25 is disassembled from the end of the milling laser vacuum chamber 26 of the laser device and installed at the end of the measuring vacuum chamber 28 of the measuring device. The microsphere shell component 24 is stably connected to the vacuum suction head 25 by the adhesive force of the water-soluble adhesive, which meets the high-precision assembly and disassembly requirements between the laser etching mark and the milling quality characterization process.

[0057] Step 3: The measurement system performs a zero-homing operation. The program controls the C-axis motion unit 18 to rotate at 10 rpm and captures the image of the laser-etched straight line mark through a high-precision measuring CCD camera 19 with 26 megapixels and a field of view of 6.4mm × 4.8mm. After grayscale processing, peak-valley separation, and edge extraction using an edge detection operator, the pose of the etched mark in the machine tool coordinate system is obtained by the classical Hough transform method and set as the detection zero point. A high-precision measuring sensor 20 is used to acquire the surface contour information of the milled microsphere shell through non-contact reciprocating scanning. After data processing and error removal... The process involves steps such as obtaining spatial location information of micro-dimples, protrusions, and other defects to be laser-shaped and manufactured. This location information is based on the machine tool coordinate system and is transformed into the workpiece coordinate system with the center of the micro-spherical shell component 24 as the origin, providing data support for femtosecond laser local contour control. After measurement, the program controls the axis system to move to the disassembly station. Based on the principle of precision thread coupling, the vacuum suction head 25 is disassembled from the end of the measuring vacuum cavity 28 of the measuring device and installed at the end of the milling laser vacuum cavity 26 of the laser device, realizing high-precision transfer of the workpiece between milling quality characterization and laser local shaping processes.

[0058] Step 4: The program adjusts the position of the linear axis system, rotating the laser B-axis motion unit 12 so that the generatrix of the vacuum suction head 25's conical surface is parallel to the horizontal platform surface; the program controls the laser C-axis motion unit 17 to rotate at 10 rpm and captures the image of the laser-etched linear mark through the microscopic vision module 15; after image processing such as grayscale processing, peak-valley separation, and edge extraction by edge detection operators, the position of the etched mark in the machine tool coordinate system is obtained and set as the zero point; based on the position information of the microspherical crown relative to the etched mark constructed by the measurement system, the position information of the manufacturing defects on the surface of the microspherical crown to be shaped in the machine tool coordinate system is obtained through coordinate transformation, and a CNC program is compiled accordingly. The multi-axis linkage controls the laser focusing component 16 to use a grating-type motion mode to trim the surface high points and micro-dimples to improve the manufacturing accuracy of the microspherical crown; the laser energy density is 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning interval is 1μm, and the scanning speed is set to 25μm / s. After the shaping is completed, the program controls the axis system to move to the disassembly station. Based on the principle of precision thread coupling, the vacuum suction head 25 is disassembled from the end of the laser vacuum cavity 26 of the laser device and installed at the end of the measuring vacuum cavity 28 of the measuring device. The surface morphology of the microspherical crown after laser shaping is characterized according to step three. This realizes the high-precision transfer of workpieces between laser local shaping and surface quality inspection processes, and provides technical support for ensuring the high-precision forming of microspherical crown structures on the surface of complex thin-walled spherical shell micro-components through multiple processes.

[0059] The image processing and coordinate algorithms used in this implementation, including grayscale processing, peak-valley segmentation, edge detection operators, edge extraction, image processing to obtain etching marks, and the classic Hough transform method, are all existing technologies. Image grayscale is the process of converting an RGB three-channel color image into a single-channel luminance image. Its core is to represent pixel brightness using grayscale values ​​from 0 to 255, where 0 is black and 255 is white. This reduces computational complexity and eliminates color interference, serving as a fundamental step for subsequent processing (such as edge detection and feature extraction). Image peak-valley segmentation is a global threshold segmentation algorithm based on grayscale histogram statistics. Its core idea is to use the valley between two major peaks in the histogram as the segmentation threshold to divide the image into foreground and background. Edges are locations in an image where grayscale, color, or texture undergoes drastic changes; they are fundamental features of object contours, region boundaries, and texture structures. Edge detection operators identify these change points by calculating pixel gradients or second derivatives, and are a core foundational technology in computer vision and image processing. The classic Hough transform is a feature extraction technique that uses a voting mechanism to detect targets with specific parameterized shapes (such as lines, circles, ellipses, etc.) in an image. It is particularly suitable for handling edge conditions with noise, occlusion, or breaks.

[0060] The other components and connections are the same as in Specific Implementation Method 1.

[0061] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for coordinated control of manufacturing precision across different molding processes of complex thin-walled microspherical shell components, characterized in that: The method for coordinated control of manufacturing precision between the forming processes of complex thin-walled microsphere shell components is used for the four workpiece transfer processes corresponding to the three processes of milling removal, laser shaping, and measurement characterization of the microsphere crown structure on the surface of the thin-walled microsphere shell component: material milling removal, laser etching marking, milling quality characterization, laser local shaping, and surface quality inspection. Each step works together to achieve high-precision forming of the microsphere crown structure on the surface of the complex thin-walled microsphere shell component. The method for coordinated control of manufacturing precision between the forming processes of complex thin-walled microsphere shell components includes the following steps: Step S100: The milled microsphere shell component (24) is transferred to the laser device quick-change base (30) of the laser device with the quick-change fixture for laser etching marking; a vacuum adsorption fixture is used. The microsphere shell component (24) is clamped and connected to the vacuum suction head (25). The vacuum suction head (25) and the milling laser vacuum cavity (26) are threaded together. The milling laser vacuum cavity (26) is installed on the quick-change fixture. The quick-change fixture is connected to the milling quick-change system base (29). Based on the ultra-precision micro-milling equipment, the microsphere shell surface microsphere crown structure is milled and initially formed by multi-axis interpolation motion according to the planned processing path. The program controls the linear motion unit to move to the safe disassembly position. The pneumatic switch of the milling quick-change system base (29) is turned on and the quick-change fixture is disassembled. The program controls the laser device axis to move to the loading and unloading position. The milled microsphere shell component (24) is then moved along with the vacuum suction head (25). 5) The milling laser vacuum cavity (26) and quick-change fixture are installed on the quick-change base (30) of the laser device, and its pneumatic switch is turned off to lock the fixture; Step S200: The vacuum suction head (25) with reference mark and the micro spherical shell component (24) are transferred to the measuring vacuum cavity (28) of the measuring device for milling surface quality characterization; the laser device axis system is initialized and returned to zero, and the laser is preheated; the linear axis position is adjusted by the multi-axis motion controller, and the laser B-axis motion unit (12) is rotated so that the generatrix of the conical surface of the vacuum suction head (25) is parallel to the horizontal platform surface; the laser Z-axis motion unit (14) is moved to adjust the distance between the laser focusing component (16) and the vacuum suction head (25) so that the focus is at the level of the clamp. Conical surface; turn on the laser, program control the laser X-axis motion unit (13) to scan 4mm in the positive direction, and etch a 4mm reference mark on the vacuum suction head (25) through the laser focusing component (16); after etching, each axis moves in linkage to the disassembly station; based on the threaded coupling connection, the vacuum suction head (25) and the micro spherical shell component (24) are disassembled from the end of the milling laser vacuum cavity (26) of the laser device and installed at the end of the measuring vacuum cavity (28) of the measuring device; step S300: the micro spherical shell component (24) with microstructure contour morphology and manufacturing defect distribution information is transferred and connected to the milling laser vacuum cavity (26) of the laser device along with the vacuum suction head (25) for local contour laser shaping;The measurement system performs a zero-return operation. The program controls the rotation of the measurement C-axis motion unit (18) and captures the image of the laser-etched straight line mark through the measurement CCD camera (19). After grayscale processing, peak-valley separation, and edge extraction by the edge detection operator, the pose of the etched mark in the machine tool coordinate system is obtained by the classical Hough transform method and set as the detection zero point. The measurement sensor (20) is used to obtain the surface contour information of the milled micro spherical shell component (24) through non-contact reciprocating scanning. After data processing and error elimination, the spatial position information of defects such as micro-dimples and protrusions that need to be laser-shaped and manufactured is obtained. The above position information is based on the machine tool coordinate system and is transformed to the workpiece coordinate system with the center of the micro spherical shell component (24) as the origin, providing data support for the local contour control of the femtosecond laser. After the measurement is completed, the program controls the axis system to move to the disassembly station and uses the threaded coupling connection to transfer the vacuum suction. The head (25) and micro spherical shell component (24) are disassembled at the end of the measuring vacuum cavity (28) and installed at the end of the milling laser vacuum cavity (26) of the laser device; the high-precision transfer of the workpiece between the milling quality characterization and laser local shaping process is completed; Step S400: The micro spherical shell component (24) after laser precise control is transferred and connected to the end of the measuring vacuum cavity (28) of the measuring device along with the vacuum suction head (25) for surface quality characterization after laser shaping; the program adjusts the position of the linear axis system and rotates the laser B-axis motion unit (12) so that the generatrix of the cone surface of the vacuum suction head (25) is parallel to the horizontal platform surface; the program controls the rotation of the laser C-axis motion unit (17) and captures the image of the laser-etched linear mark through the microscopic vision module (15); the position of the etched mark in the machine tool coordinate system is obtained through image processing such as grayscale processing, peak-valley separation and edge extraction by edge detection operator and set as zero point; Based on the position information of the micro-spherical crown relative to the etching mark constructed by the measurement system, the position information of the manufacturing defects on the surface of the micro-spherical crown to be repaired in the machine tool coordinate system is obtained through coordinate transformation. Based on this, a CNC program is compiled, and the laser focusing component (16) is controlled by multi-axis linkage to repair the surface high points and micro-dimples in the grating motion mode, thereby improving the manufacturing accuracy of the micro-spherical crown. After the repair is completed, the program controls the axis system to move to the disassembly station. Based on the threaded coupling connection, the vacuum suction head (25) and the micro-spherical shell component (24) are disassembled from the end of the milling laser vacuum cavity (26) of the laser device and installed at the end of the measuring vacuum cavity (28) of the measurement device. The surface morphology of the micro-spherical crown after laser repair is characterized according to step S300. The high-precision transfer of the workpiece between the laser local repair and surface quality inspection processes is completed.

2. The method for coordinated control of manufacturing precision among the forming processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: The quick-change clamp system used in step S100 has an adjustable negative pressure range of -77.89 kPa. Water-soluble adhesive is added between the microsphere shell component (24) and the vacuum suction head (25) to ensure airtightness.

3. The method for coordinated control of manufacturing precision between molding processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: The quick-change fixture system used in step S100 employs pneumatic spring locking, has a repeatability accuracy range of ±0.5μm, and a pneumatic opening pressure of 0.6MPa.

4. The method for coordinated control of manufacturing precision among the forming processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: The laser used in step S200 is set with a laser power of 100mW, a 1 / 4 waveplate angle of 45°, and a defocus amount of -0.1μm. The program controls the laser X-axis motion unit (13) to scan 4mm in the positive direction at a speed of 0.2mm / s.

5. The method for coordinated control of manufacturing precision between molding processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: In step S200, hydrosol is dropped between the microsphere shell component (24) and the vacuum suction head (25), and the microsphere shell component (24) is attached to the vacuum suction head (25) by the adhesive force of the hydrosol.

6. The method for coordinated control of manufacturing precision between molding processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: In step S300, the C-axis motion unit (18) is measured to rotate at a speed of 10 rpm, and the CCD camera (19) is measured to be a high-resolution camera with 26 million pixels and a field of view of 6.4 mm × 4.8 mm.

7. The method for coordinated control of manufacturing precision between molding processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: In step S300, hydrosol is dropped between the microsphere shell component (24) and the vacuum nozzle (25), and the microsphere shell component (24) is attached to the vacuum nozzle (25) by the adhesive force of the hydrosol.

8. The method for coordinated control of manufacturing precision among the forming processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: In step S400, the laser C-axis motion unit (17) of the laser device rotates at a speed of 10 rpm and captures the image of the laser-etched straight line mark through the microscopic vision module (15).

9. The method for coordinated control of manufacturing precision between molding processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: The laser focusing component (16) of the laser device used in step S400 has a laser energy density of 0.02~0.06 J / cm². 2 The focal spot diameter is 3μm, the scanning interval is 1μm, and the scanning speed is set to 25μm / s.

10. The method for coordinated control of manufacturing precision among the forming processes of complex thin-walled microspherical shell components according to claim 1, characterized in that: In step S400, hydrosol is dropped between the microsphere shell component (24) and the vacuum suction head (25), and the microsphere shell component (24) is attached to the vacuum suction head (25) by the adhesive force of the hydrosol.

Images