Repair equipment and repair method

Abstract

The invention provides repair equipment and a repair method, and relates to the technical field of Mini LED repair, and the repair equipment comprises a rack which is provided with a first Y-direction cross beam, a second Y-direction cross beam and a first X-direction cross beam; the end, close to the first Y-direction cross beam, of the rack is provided with a feeding end. The defect identification module, the packaging layer removing module, the crystal removing module, the tin dispensing module and the welding module are arranged on one side of the first X-direction cross beam; comprising a material loading assembly arranged on the side, away from the crystal removing module, of the first X-direction cross beam and a material taking and surface mounting assembly arranged on the side, away from the feeding end, of the first X-direction cross beam. The repair platform can be movably arranged on the rack in the X direction and the Y direction and is used for bearing a repair product and conveying the repair product to the operation position of each functional module; and the packaging layer removing module can be selectively started according to the packaging state of the repaired product and is used for removing the packaging layer of the packaged product. Therefore, the method has the advantage of being simultaneously suitable for products after a furnace without a packaging layer and semi-finished products / finished products with packaging layers.

Description

Technical Field

[0001] The present invention relates to the field of Mini LED rework technology, and in particular to a rework device and a rework method. Background Art

[0002] Mini LEDs, a new type of display device, are widely used in high-precision display applications such as consumer electronics, automotive, and commercial displays. Their packaging forms fall into two main categories: the post-reflow product (without a packaging layer) and the packaged semi-finished / finished product (with a packaging layer).

[0003] During the Mini LED manufacturing and testing process, chips may become defective due to various reasons (such as missing chips, tilting, and poor solder joints), requiring replacement using rework equipment. However, existing rework equipment often has poor adaptability to different packaging configurations, specifically falling into two categories: one type of rework equipment is only suitable for post-processing products without a packaging layer. While it can perform chip defect identification, de-crystallization, tinning, material placement, and soldering, it is not suitable for packaged semi-finished or finished products. The other type of rework equipment is specifically designed for rework of semi-finished or finished products containing a packaging layer. However, this type of equipment is complex in structure and lacks versatility, making it unsuitable for post-processing products without a packaging layer.

[0004] Therefore, a repair device and a repair method that can be applied to the repair of both post-process products without a packaging layer and semi-finished products / finished products with a packaging layer need to be designed. Summary of the Invention

[0005] The purpose of the present invention is to provide a rework equipment and a rework method to address the defects and shortcomings of the existing technology, so as to solve at least one of the above technical problems. It has the advantage of being applicable to the rework of post-furnace products without a packaging layer and semi-finished products / finished products with a packaging layer.

[0006] To achieve the above-mentioned object, the present invention provides a rework device, comprising: a frame, on which a first Y-direction crossbeam, a second Y-direction crossbeam, and a first X-direction crossbeam are disposed, and a feeding end is provided at an end thereof close to the first Y-direction crossbeam; A defect recognition module, an encapsulation layer removal module, a decrystalline module, a tinning module, and a welding module are configured on one side of the first X-direction beam; The patch module includes a material loading assembly configured on a side of the first X-axis beam away from the decrystalline module, and a material picking and placement assembly configured on a side away from the feeding end; A rework platform is movably arranged on the frame in the X and Y directions, and is used to carry the reworked products and transport them to the working positions of each functional module; The packaging layer removal module can be selectively enabled according to the packaging status of the repaired product, and is used to remove the packaging layer of the packaged product.

[0007] Optionally, the material loading assembly includes a material loading turntable for carrying the crystal plate; The material picking and placement assembly includes: A chip positioning camera is arranged above the loading turntable and is used to locate and identify the target chip; An ejector pin assembly is disposed below the loading turntable and is used to lift the target chip from the wafer tray; A good product recognition camera is arranged on one side of the material loading turntable; The placement head can be movably arranged on the second Y-axis beam along the Y-axis, and includes a placement nozzle and a rotation drive component that drives the placement nozzle to rotate; it is used to pick up the required chips, send them to the good product recognition camera for quality inspection, and mount the qualified chips on the solder pads after tinning.

[0008] Optionally, a first linear module extending along the Y direction is provided on the second Y-direction crossbeam, and the placement head is mounted on a slide of the first linear module via a Z-axis moving member; The placement head also includes a placement fixing seat, and the placement nozzle is rotatably mounted in the placement fixing seat through a bearing; The rotary drive assembly includes: a first drive motor mounted on the mounting fixed seat, a driving pulley connected to the first drive motor, a driven pulley sleeved on the outer periphery of the mounting nozzle, and a synchronous belt wound around the outer periphery of the driving pulley and the driven pulley.

[0009] Optionally, a waste bin is further configured on one side of the good product recognition camera, and a vertically arranged cleaning brush is further configured in the waste bin.

[0010] Optionally, the material loading assembly further includes: a turntable fixing bracket, on which a second driving motor for driving the loading turntable to rotate is mounted; A turntable XY moving module is arranged on the frame and is used to drive the turntable fixing bracket to move along the X and Y directions; The ejector pin assembly comprises: Adsorption head, used for adsorbing the crystal plate; an ejector pin, disposed in the adsorption head; The adsorption lifting component is connected to the ejector pins and is used to drive the ejector pins to lift the target chip on the wafer disk upward.

[0011] Optionally, the rework platform includes: The rework lifting frame has synchronous belts for moving the reworked products on both sides of its flanges, and a lifting assembly is installed in the middle. The positioning fixture for the post-furnace product or the lighting positioning fixture for the packaged product is installed on the lifting assembly; The rework moving module is arranged on the frame and is used to drive the rework lifting frame to move along the X direction and the Y direction.

[0012] Optionally, the lifting adsorption platform assembly includes: The lifting cylinder is installed on the rework lifting frame, and its piston rod is arranged in the horizontal direction; A limit cover plate is installed on the rework lift frame, covers at least a portion of the piston rod, and has a limit sliding hole inclined upward on one side thereof; A plurality of guide columns are vertically arranged on the repair lifting frame and are provided with vertical guide holes; a slide rod, movably disposed in the guide hole; A lifting block is connected to the piston rod via a connecting column passing through the limiting sliding hole; The jacking assembly plate is installed on the guide column and the upper end surface of the jacking block, is used to install the positioning fixture and the lighting positioning fixture, and realizes up and down movement under the drive of the jacking cylinder.

[0013] Optionally, the rework equipment further comprises a second X-direction beam mounted on the first Y-direction beam and the second Y-direction beam; The defect recognition module includes: a defect recognition bracket, a first lifting assembly mounted on the first X-axis crossbeam and used to drive the defect recognition bracket to move up and down, an identification and positioning module mounted on the defect recognition bracket, and a contact height measurement probe mounted on the defect recognition bracket via a second lifting assembly and located on one side of the identification and positioning module; The encapsulation layer removal module includes: an encapsulation layer removal laser body mounted on the second X-direction crossbeam, an encapsulation layer removal laser head disposed on the encapsulation layer removal laser body and extending toward the first X-direction crossbeam, and an encapsulation layer removal blowing member disposed on one side of the encapsulation layer removal laser head and used to blow away encapsulation layer residues; The de-crystallization module includes: a de-crystallization head, a third lifting assembly for driving the de-crystallization head to move in the Z direction, and pad blowing members arranged on both sides of the de-crystallization head for cleaning pad residues; The tinning module includes: a tinning head mounted on the third lifting assembly via a fourth lifting assembly, and a solder paste tray disposed on one side of the tinning head; The welding module includes a welding head installed on the defect identification bracket.

[0014] Optionally, the rework equipment further includes: a tin scraping mechanism disposed on the first X-direction beam and on the same side as the welding module, for providing a tin point for dipping tin paste after the chip is decrystalline.

[0015] Another aspect of the present invention provides a rework method, which uses the rework device described above and includes the following steps: S1: Use the defect recognition module to identify and measure the height of the returned product to obtain the location and defect type of the defective chip; S2: Based on the identification results, if the defective chip has a packaging medium, the packaging layer is removed by the packaging layer removal module; S3: Remove defective chips through the de-crystallization module and clean the residue on the pad surface; S4: Fill the connection medium required for soldering on the cleaned pads through the tinning module; S5: Use the patch module to take and mount the good chips onto the tinned pads; S6: Complete the welding connection between the new chip and the pad through the welding module.

[0016] Compared with the prior art, the advantages of this application are: Since the rework equipment is equipped with a packaging layer removal module, and the module can be selectively enabled according to the packaging status of the reworked product, it can achieve compatible rework of semi-finished products / finished products with packaging layers and post-furnace products without packaging layers, overcoming the limitation of traditional rework equipment that is only applicable to a single product form, and significantly improving the versatility and rework adaptability of the equipment.

[0017] In addition, this equipment arranges the defect recognition module, packaging layer removal module, decrystalline module, tinning module and welding module on one side of the first X-axis beam, the patch module is set on the other side away from the decrystalline module, and the material picking and placement components are arranged at a position away from the feed end, forming a compact and smooth operation process, avoiding functional interference and repeated handling, and effectively reducing the size of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0019] Figure 1 This is a schematic structural diagram of a rework device according to an embodiment of the present invention; Figure 2 for Figure 1 A partial enlarged view of point A in the middle; Figure 3 A schematic structural diagram of the rework equipment according to another embodiment of the present invention; Figure 4 This is a schematic top view of the structure of the rework equipment according to an embodiment of the present invention; Figure 5 Schematic diagram of the assembly structure of the patch module and the second Y-direction beam according to an embodiment of the present invention; Figure 6 This is a schematic structural diagram of a material loading assembly according to an embodiment of the present invention; Figure 7 This is a structural diagram of a material placement assembly according to an embodiment of the present invention; Figure 8 This is a schematic structural diagram of an ejector pin assembly according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the structure of a good product identification camera and a waste bin according to an embodiment of the present invention; Figure 10 This is a schematic structural diagram of a rework platform according to an embodiment of the present invention, wherein a positioning fixture is mounted on the jacking assembly; Figure 11 This is a schematic diagram of the structure of a rework lift frame according to an embodiment of the present invention, wherein a lighting positioning fixture is installed on the lifting assembly; Figure 12 This is a schematic diagram of the structure of the rework platform according to an embodiment of the present invention, including a positioning fixture and a lighting positioning fixture; Figure 13 This is a schematic structural diagram of a jacking assembly according to an embodiment of the present invention; Figure 14 This is a schematic structural diagram of a defect recognition module and a welding module according to an embodiment of the present invention; Figure 15 This is a schematic structural diagram of an encapsulation layer removal module according to an embodiment of the present invention; Figure 16 This is a schematic structural diagram of a decrystalline module and a tinning module according to an embodiment of the present invention; Figure 17 This is a structural diagram of a tin scraping mechanism according to an embodiment of the present invention; Figure 18 This is a flowchart of the steps of the repair method according to an embodiment of the present invention.

[0020] Description of Reference Numerals 100-Repair equipment; 1-frame; 11-first Y-axis beam; 12-second Y-axis beam; 13-first linear module; 14-first X-axis beam; 15-second X-axis beam; a-feed end; 2-defect recognition module; 21-defect recognition bracket; 22-first lifting assembly; 23-identification and positioning module; 24-contact height measurement probe; 25-second lifting assembly; 3-encapsulation layer removal module; 31-encapsulation layer removal laser body; 32-encapsulation layer removal laser head; 33-encapsulation layer removal blowing piece; 4-decrystalline module; 41-decrystalline head; 42-third lifting assembly; 43-pad blowing part; 5- tinning module; 51- tinning head; 52- fourth lifting component; 6-Patch module; 61-Material loading assembly; 611-Material loading turntable; 612-Turntable fixing bracket; 613-Second drive motor; 614-Turntable XY moving module; 62-Material picking and placement assembly; 621-Chip positioning camera; 622-Camera mounting bracket; 63-Ejector assembly; 631-Adsorption head; 632-Ejector; 633-Adsorption lifting assembly; 64-Good product identification camera; 65-Waste bin; 66-Cleaning brush; 67-Placement head; 671-Placement nozzle; 672-Placement fixing seat; 673-Bearing; 68-Rotation drive assembly; 681-First drive motor; 682-Drive pulley; 683-Driven pulley; 684-Timing belt; 69-Z-axis moving part; 7- welding module; 71- welding head; 8-Rework platform; 81-Rework lifting frame; 811-Rework product moving synchronous belt; 82-Jack assembly; 821-Jack cylinder; 822-Limit cover; o1-Limit slide hole; 823-Guide column; o3-Guide hole; 824-Slide rod; 825-Jack block; 826-Connecting column; 827-Jack assembly plate; 83-Positioning fixture; 831-Lower pressure frame; 832-Upper top seat; 84-Lighting positioning fixture; 841-Lighting interface; 85-Rework moving module; 9- tin scraping mechanism; 91- tin pool; 92- rotating assembly; 93- push rod motor; 200-post-furnace products; 300-crystal disk. DETAILED DESCRIPTION

[0021] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0022] It should be noted that the terms "center," "longitudinal," "lateral," "upper," "lower," "front," "back," "left," "right," "top," "bottom," "inner," "outer," "back," "side," and "circumferential" in the present invention indicate positions or positional relationships based on those shown in the accompanying drawings. These terms are intended only to facilitate the description of the present invention and simplify the description, and are not intended to indicate or imply that the devices or components referred to must have a specific position, be constructed, or operate in a specific position. Therefore, they should not be construed as limiting the present invention. Furthermore, terms such as "first" and "second" are used only to distinguish between multiple components or structures having the same or similar structures, and do not represent any particular limitation on the order of arrangement or connection relationship.

[0023] Please refer to Figures 1 to 18 The present invention provides a rework device 100 suitable for Mini LED products with different package types. The rework device 100 includes a frame 1, a defect recognition module 2, an encapsulation layer removal module 3, a de-crystallization module 4, a soldering module 5, a patch module 6, a soldering module 7, and a rework platform 8.

[0024] The frame 1 serves as the overall supporting structure of the rework equipment 100 and is used to provide installation and operation space for each functional module. The frame 1 is equipped with a first Y-axis crossbeam 11, a second Y-axis crossbeam 12, and a first X-axis crossbeam 14. Specifically, the first Y-axis crossbeam 11 and the second Y-axis crossbeam 12 are gantry frames respectively arranged on both sides of the frame 1; the first X-axis crossbeam 14 laterally connects the two Y-axis crossbeams. Of course, in other embodiments, the structures of the first Y-axis crossbeam 11, the second Y-axis crossbeam 12, and the first X-axis crossbeam 14 can also be arranged according to other methods, which are not specifically limited here.

[0025] In this embodiment, please refer to Figure 1 The extension direction of the first X-axis beam 14 is defined as the X direction, the extension direction of the first Y-axis beam 11 is defined as the Y direction, and the direction perpendicular to the XY plane is defined as the Z direction. A feed port a is provided near one end of the first Y-axis beam 11 for feeding the products to be repaired into the equipment.

[0026] Defect recognition module 2 is used to identify defective spots on the reworked product; encapsulation layer removal module 3 is used to remove the encapsulation layer from the reworked product; de-crystallization module 4 is used to remove defective grains from the reworked product; tinning module 5 is used to apply solder paste to the pads of the reworked product; and welding module 7 is used to solder the mounted new chip to the pads. In this embodiment, defect recognition module 2, encapsulation layer removal module 3, de-crystallization module 4, tinning module 5, and welding module 7 are all located on one side of first X-direction beam 14.

[0027] The patch module 6 comprises a carrier assembly 61 and a pick-and-place assembly 62. The carrier assembly 61 is arranged on the first X-direction beam 14 away from the de-crystal module 4, and is used to hold new chips. The pick-and-place assembly 62 is arranged away from the feeding end a, and is used to pick the new chips from the carrier assembly 61 and mount them on the pads after the tin-pointing.

[0028] The repair platform 8 is movably arranged on the rack 1 along the X-direction and the Y-direction, and is used to carry the repair products and deliver them to the working positions of the functional modules. Specifically, the repair platform 8 can receive the repair products from the feeding end a and deliver them to the working positions of the defect identification module 2, the package layer removal module 3, the de-crystal module 4, the tin-pointing module 5, the patch module 6 and the soldering module 7, so as to work in each module.

[0029] The package layer removal module 3 can be selectively enabled according to the package state of the repair product, and is used to remove the package layer of the package product. That is, when the repair object is the post-furnace product 200 without the package layer, the module is not enabled; when the repair object is the semi-finished product or the finished product containing glue, the package layer removal module 3 is automatically started and performs the glue removal operation.

[0030] Since the repair equipment 100 is provided with the package layer removal module 3, and the module can be selectively enabled according to the package state of the repair product, the compatible repair of the semi-finished product / finished product with the package layer and the post-furnace product 200 without the package layer is realized, the limitation that the traditional repair equipment 100 is only suitable for a single product form is overcome, and the universality and repair adaptability of the equipment are significantly improved.

[0031] In addition, the defect identification module 2, the package layer removal module 3, the de-crystal module 4, the tin-pointing module 5 and the soldering module 7 are arranged on one side of the first X-direction beam 14, the patch module 6 is arranged on the other side away from the de-crystal module 4, and the pick-and-place assembly 62 is arranged away from the feeding end a, so as to form a compact and smooth working process, avoid functional interference and repeated handling, and effectively reduce the equipment size.

[0032] The traditional pick-and-place assembly 62 comprises a pick head for transferring the new chip on the carrier assembly 61 to the transfer table for quality identification, and a mounting head 67 for mounting the chip identified as qualified on the transfer table on the repair product. However, this structure is not only complex, but also needs multiple steps, and has the disadvantage of time-consuming. In order to overcome this disadvantage, please refer to Figures 5 to 9 In this embodiment, the carrier assembly 61 comprises a carrier turntable 611 for carrying the wafer 300. Specifically, the pick-and-place assembly 62 comprises a chip positioning camera 621, a needle assembly 63, a good product identification camera 64 and a mounting head 67.

[0033] A chip positioning camera 621 is positioned above the carrier turntable 611 and is used to locate and identify target chips. Specifically, the chip positioning camera 621 is mounted on the second Y-axis beam 12 via a camera mounting bracket 622. As will be appreciated, the chip positioning camera 621 can identify a replaceable chip that matches the target defective spot based on the defect location information provided by the defect recognition module 2.

[0034] The ejector assembly 63 is disposed below the loading turntable 611 and is used to lift the target chip from the wafer tray 300. Specifically, the identified target chip can be lifted upward from the bottom of the wafer tray 300 to separate it from the wafer tray 300 for subsequent suction.

[0035] The good product recognition camera 64 is installed on the frame 1 and is located on one side of the material loading turntable 611. It is used to perform image recognition and quality inspection on the sucked chips to determine whether they meet the requirements.

[0036] The placement head 67 is movably mounted on the second Y-axis beam 12. It includes a placement nozzle 671 and a rotary drive assembly 68. The rotary drive assembly 68 rotates the placement nozzle 671, enabling multi-angle quality inspection in conjunction with the good product recognition camera 64. The placement nozzle 671 picks up the desired chip and delivers it to the good product recognition camera 64 for quality inspection. If the chip passes inspection, it is then placed on the soldered pad.

[0037] Because this technical solution omits the material removal head and transfer table, the placement head 67 simultaneously performs chip suction, identification, and placement functions, greatly simplifying the equipment structure and reducing the number of chip transfer steps between different stations. This not only reduces mechanical complexity but also improves rework efficiency.

[0038] To ensure stable rotation of the placement nozzle 671 during chip quality assessment, in this embodiment, a first linear module 13 extending in the Y direction is optionally provided on the second Y-axis crossbeam 12. The placement head 67 is mounted on the slide of the first linear module 13 via a Z-axis moving member 69. The placement head 67 also includes a placement fixed seat 672, within which the placement nozzle 671 is rotatably mounted via a bearing 673. The rotation drive assembly 68 includes a first drive motor 681, a driving pulley 682, a driven pulley 683, and a synchronous belt 684.

[0039] The first drive motor 681 is mounted on the mounting fixed seat 672. The driving pulley 682 is connected to the first drive motor 681. Specifically, in the present embodiment, the driving pulley 682 is sleeved on the output shaft of the first drive motor 681. The driven pulley 683 is sleeved on the outer circumference of the mounting nozzle 671. The synchronous belt 684 is wound around the outer circumference of the driving pulley 682 and the driven pulley 683, thereby driving the rotation of the mounting nozzle 671. Specifically, in the present embodiment, the driving pulley 682 and the driven pulley 683 are toothed synchronous pulleys, and the driven pulley 683 is a toothed synchronous belt meshed with the toothed synchronous pulley to further improve the stability of the rotation.

[0040] Alternatively, see Figure 5 and Figure 9 In this embodiment, a waste bin 65 is also provided on one side of the good product recognition camera 64. A vertically arranged cleaning brush 66 is also provided in the waste bin 65. Thus, when the good product recognition camera 64 performs quality inspection, any unqualified products can be transferred to the waste bin 65 to avoid interference with subsequent steps. The cleaning brush 66 in the waste bin 65 can clean the placement nozzle 671 to ensure its suction capacity.

[0041] Alternatively, see Figure 6 In this embodiment, the loading assembly 61 further includes: a turntable fixed bracket 612 and a turntable XY moving module 614. A second drive motor 613 for driving the loading turntable 611 to rotate is installed on the turntable fixed bracket 612. The turntable XY moving module 614 is configured on the frame 1 and is used to drive the turntable fixed bracket 612 to move along the X and Y directions. Specifically, in this embodiment, three crystal disks 300 are arranged along the circumference of the loading turntable 611, and the second drive motor 613 can drive the loading turntable 611 to rotate to select different crystal disks 300 on the loading turntable 611. The turntable XY moving module 614 drives the turntable fixed bracket 612 to move along the X and Y directions, thereby driving the chips at different positions on the crystal disk 300 to be identified by the chip positioning camera 621, and later move to the top of the ejector assembly 63.

[0042] Alternatively, see Figure 7In this embodiment, the ejector pin assembly 63 includes: an adsorption head 631, an ejector pin 632, and an adsorption lifting assembly 633. Among them, the adsorption head 631 is used to adsorb the crystal disk 300. Specifically, the adsorption head 631 is used to adsorb the bottom surface of the crystal disk 300 through negative pressure. The ejector pin 632 is configured in the adsorption head 631. The adsorption lifting assembly 633 is connected to the ejector pin 632, and is used to drive the ejector pin 632 to lift the target chip on the crystal disk 300 upward. Specifically, the adsorption head 631 adsorbs and fixes the film layer of the crystal disk 300, and the ejector pin 632 lifts the chip off the crystal disk film layer. Optionally, the adsorption lifting assembly 633 can be driven by a drive motor to drive the ejector pin 632 up and down through a screw pair, or driven by the piston rod of a cylinder, and there is no specific limitation.

[0043] To fix the Mini LED rework products with different types of packages, please refer to Figures 10 to 13 In this embodiment, the rework platform 8 includes a rework lifting frame 81 and a rework moving module 85 .

[0044] The flanges on both sides of the rework lift 81 are equipped with synchronous belts 811 for moving reworked products. This allows the reworked products to be received from the feed end a and moved to a fixed position. A lifting assembly 82 is installed in the center of the rework lift 81. Mounted on this lifting assembly 82 are positioning fixtures 83 for supporting the post-processing product 200 or lighting positioning fixtures 84 for supporting packaged products. This allows for adaptability to reworked Mini LED products with different package types.

[0045] Specifically, the lighting positioning fixture 84 is plugged into the plug-in slot of the packaged product (not shown in the figure) through the lighting interface 841 thereon, thereby achieving fixed positioning of the packaged product and realizing power-on lighting of the LED chip of the product.

[0046] The positioning fixture 83 fixes and supports the post-furnace product 200 by clamping the lower pressing frame 831 and the upper top seat 832 .

[0047] The rework moving module 85 is arranged on the frame 1 and is used to drive the rework lifting frame 81 to move along the X and Y directions so that the reworked products can be transported to the working positions of each functional module.

[0048] Alternatively, see Figure 12 and Figure 13 In this embodiment, the lifting adsorption platform assembly includes: a lifting cylinder 821, a limiting cover plate 822, four guide columns 823, a sliding rod 824, a lifting block 825 and a lifting assembly plate 827.

[0049] The lifting cylinder 821 is installed on the rework lifting frame 81, and its piston rod is arranged in the horizontal direction.

[0050] The limiting cover plate 822 is installed on the rework lifting frame 81 to cover at least a portion of the piston rod. A limiting sliding hole o1 inclined upward is provided on one side of the limiting cover plate 822 .

[0051] Four guide posts 823 are vertically disposed on the rework frame 81 and are provided with vertical guide holes o3. Specifically, in this embodiment, the four guide posts 823 are arranged in a quadrilateral pattern on either side of the piston rod. Of course, in other embodiments, the number and arrangement of the guide posts 823 may be different and are not specifically limited here.

[0052] The slide bar 824 is disposed in the guide hole o3 so as to be movable up and down.

[0053] The lifting block 825 is connected to the piston rod via a connecting column 826 passing through the limiting sliding hole o1.

[0054] The lifting assembly plate 827 is installed on the upper end surface of the guide column 823 and the lifting block 825, and is used to install the positioning fixture 83 and the lighting positioning fixture 84, and realizes up and down movement under the drive of the lifting cylinder 821.

[0055] In this way, the lifting cylinder 821 pushes the piston rod to move, and the connecting column 826 moves upward along the limiting slide hole o1, thereby driving the lifting block 825 to move, and the lifting assembly plate 827 moves up and down under the limiting action of the guide column 823 and the slide rod 824, thereby driving the positioning fixture 83 and the lighting positioning fixture 84 thereon to move up and down.

[0056] Alternatively, see Figure 2 、 Figure 4 、 Figures 14 to 16 In this embodiment, the rework equipment 100 further includes a second X-direction beam 15 mounted on the first Y-direction beam 11 and the second Y-direction beam 12 .

[0057] The defect recognition module 2 includes: a defect recognition bracket 21 , a first lifting assembly 22 , an identification and positioning module 23 and a contact height measurement probe 24 .

[0058] The first lifting assembly 22 is mounted on the first X-axis beam 14 and is used to drive the defect recognition bracket 21 to move up and down. Specifically, the first lifting assembly 22 is a drive motor that drives the defect recognition bracket 21 to move up and down through a screw-nut pair. Of course, the first lifting assembly 22 can also be a cylinder, which is not specifically limited here.

[0059] The identification and positioning module 23 is mounted on the defect recognition bracket 21 and moves along with the defect recognition bracket 21 to achieve height adjustment. Specifically, the identification and positioning module 23 includes a camera and a lens.

[0060] The contact height measuring probe 24 is mounted on the defect recognition bracket 21 via a second lifting assembly 25 and is located on one side of the recognition and positioning module 23. It can be understood that the second lifting assembly 25 is used for high-precision height adjustment, thereby achieving height measurement of defective points.

[0061] The encapsulation layer removal module 3 includes: an encapsulation layer removal laser body 31 , an encapsulation layer removal laser head 32 and an encapsulation layer removal blowing member 33 .

[0062] The encapsulation layer removal laser body 31 is mounted on the second X-axis beam 15. The encapsulation layer removal laser head 32 is positioned above the encapsulation layer removal laser body 31 and extends toward the first X-axis beam 14. An encapsulation layer removal blower 33 is positioned to one side of the encapsulation layer removal laser head 32 and is used to blow away any remaining encapsulation layer residue.

[0063] The de-crystallization module 4 includes a de-crystallization head 41 , a third lifting assembly 42 and a pad blowing member 43 .

[0064] The third lifting assembly 42 is used to drive the debonding head 41 to move along the Z direction. In this embodiment, the third lifting assembly 42 is a drive motor and a screw nut pair. The pad blowing parts 43 are arranged on both sides of the debonding head 41 to clean the pad residue.

[0065] The tinning module 5 includes a tinning head 51 and a solder paste tray (not shown in the figure).

[0066] The soldering head 51 is mounted on the third lifting assembly 42 via a fourth lifting assembly 52. ​​Specifically, in this embodiment, the fourth lifting assembly 52 is a cylinder with a guide. A solder paste tray is disposed on one side of the soldering head 51 to facilitate soldering of the soldering head 51.

[0067] The welding module 7 includes a welding head 71 mounted on the defect recognition bracket 21 .

[0068] Alternatively, see Figure 17 In this embodiment, the rework equipment 100 further includes a tin scraping mechanism 9 disposed on the first X-axis beam 14 and on the same side as the soldering module 7. The tin scraping mechanism 9 is used to provide a tin point for dipping solder paste after chip de-crystallization. Specifically, the tin scraping mechanism 9 includes a tin reservoir 91, a rotating assembly 92 that drives the tin reservoir 91 to rotate, and a pusher motor 93 that drives the tin reservoir 91 in the Y direction.

[0069] Please refer to Figure 18 Another aspect of the present invention provides a rework method, which uses the rework device described above and includes the following steps: S1: Use the defect recognition module to identify and measure the height of the returned product to obtain the location and defect type of the defective chip; S2: Based on the identification results, if the defective chip has a packaging medium, the packaging layer is removed by the packaging layer removal module; S3: Remove defective chips through the de-crystallization module and clean the residue on the pad surface; S4: Fill the connection medium required for soldering on the cleaned pads through the tinning module; S5: Use the patch module to take and mount the good chips onto the tinned pads; S6: Complete the welding connection between the new chip and the pad through the welding module.

[0070] Since the repair method has all the structures and connection relationships of the repair equipment, it has all the advantages of the repair equipment and will not be described in detail here.

[0071] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A rework device suitable for Mini LED products of different package types, characterized by: include: a frame, on which a first Y-direction crossbeam, a second Y-direction crossbeam, and a first X-direction crossbeam are disposed, and a feeding end is provided at an end of the frame adjacent to the first Y-direction crossbeam; A defect recognition module, an encapsulation layer removal module, a decrystalline module, a tinning module, and a welding module are configured on one side of the first X-direction beam; The patch module includes a material loading assembly configured on a side of the first X-axis beam away from the decrystalline module, and a material picking and placement assembly configured on a side away from the feeding end; A rework platform is movably arranged on the frame in the X and Y directions, and is used to carry the reworked products and transport them to the working positions of each functional module; The packaging layer removal module can be selectively enabled according to the packaging status of the repaired product, and is used to remove the packaging layer of the packaged product.

2. The rework equipment according to claim 1, wherein: The material loading assembly includes a material loading turntable for carrying the crystal plate; The material picking and placement assembly includes: A chip positioning camera is arranged above the loading turntable and is used to locate and identify the target chip; An ejector pin assembly is disposed below the loading turntable and is used to lift the target chip from the wafer tray; A good product recognition camera is arranged on one side of the material loading turntable; The placement head can be movably arranged on the second Y-axis beam along the Y-axis, and includes a placement nozzle and a rotation drive component that drives the placement nozzle to rotate; it is used to pick up the required chips, send them to the good product recognition camera for quality inspection, and mount the qualified chips on the solder pads after tinning.

3. The rework equipment according to claim 2, wherein: A first linear module extending along the Y direction is provided on the second Y-direction crossbeam, and the placement head is mounted on the slide of the first linear module via a Z-axis moving part; The placement head also includes a placement fixing seat, and the placement nozzle is rotatably mounted in the placement fixing seat through a bearing; The rotary drive assembly includes: a first drive motor mounted on the mounting fixed seat, a driving pulley connected to the first drive motor, a driven pulley sleeved on the outer periphery of the mounting nozzle, and a synchronous belt wound around the outer periphery of the driving pulley and the driven pulley.

4. The rework equipment according to claim 3, wherein: A waste bin is also provided on one side of the good product recognition camera, and a vertically arranged cleaning brush is also provided in the waste bin.

5. The rework equipment according to claim 1, wherein: The material loading assembly further comprises: a turntable fixing bracket, on which a second driving motor for driving the loading turntable to rotate is mounted; A turntable XY moving module is arranged on the frame and is used to drive the turntable fixing bracket to move along the X and Y directions; The ejector pin assembly comprises: Adsorption head, used for adsorbing the crystal plate; an ejector pin, disposed in the adsorption head; The adsorption lifting component is connected to the ejector pins and is used to drive the ejector pins to lift the target chip on the wafer disk upward.

6. The rework equipment according to claim 1, wherein: The rework platform includes: The rework lifting frame has synchronous belts for moving the reworked products on both sides of its flanges, and a lifting assembly is installed in the middle. The positioning fixture for the post-furnace product or the lighting positioning fixture for the packaged product is installed on the lifting assembly; The rework moving module is arranged on the frame and is used to drive the rework lifting frame to move along the X direction and the Y direction.

7. The rework equipment according to claim 1, wherein: The lifting adsorption platform assembly includes: The lifting cylinder is installed on the rework lifting frame, and its piston rod is arranged in the horizontal direction; A limit cover plate is installed on the rework lift frame, covers at least a portion of the piston rod, and has a limit sliding hole inclined upward on one side thereof; A plurality of guide columns are vertically arranged on the repair lifting frame and are provided with vertical guide holes; a slide rod, movably disposed in the guide hole; A lifting block is connected to the piston rod via a connecting column passing through the limiting sliding hole; The jacking assembly plate is installed on the guide column and the upper end surface of the jacking block, is used to install the positioning fixture and the lighting positioning fixture, and realizes up and down movement under the drive of the jacking cylinder.

8. The rework equipment according to claim 1, wherein: Also included is a second X-direction crossbeam mounted on the first Y-direction crossbeam and the second Y-direction crossbeam; The defect recognition module includes: a defect recognition bracket, a first lifting assembly mounted on the first X-axis crossbeam and used to drive the defect recognition bracket to move up and down, an identification and positioning module mounted on the defect recognition bracket, and a contact height measurement probe mounted on the defect recognition bracket via a second lifting assembly and located on one side of the identification and positioning module; The encapsulation layer removal module includes: an encapsulation layer removal laser body mounted on the second X-direction crossbeam, an encapsulation layer removal laser head disposed on the encapsulation layer removal laser body and extending toward the first X-direction crossbeam, and an encapsulation layer removal blowing member disposed on one side of the encapsulation layer removal laser head and used to blow away encapsulation layer residues; The de-crystallization module includes: a de-crystallization head, a third lifting assembly for driving the de-crystallization head to move in the Z direction, and pad blowing members arranged on both sides of the de-crystallization head for cleaning pad residues; The tinning module includes: a tinning head mounted on the third lifting assembly via a fourth lifting assembly, and a solder paste tray disposed on one side of the tinning head; The welding module includes a welding head installed on the defect identification bracket.

9. The rework equipment according to claim 1, wherein: Also includes: The tin scraping mechanism is arranged on the first X-direction beam and on the same side as the welding module, and is used to provide tin point dipping tin paste after chip decrystallineing.

10. A rework method, characterized in that: Applying the rework equipment according to any one of claims 1 to 9 comprises the following steps: S1: Use the defect recognition module to identify and measure the height of the returned product to obtain the location and defect type of the defective chip; S2: Based on the identification results, if the defective chip has a packaging medium, the packaging layer is removed by the packaging layer removal module; S3: Remove defective chips through the de-crystallization module and clean the residue on the pad surface; S4: Fill the connection medium required for soldering on the cleaned pads through the tinning module; S5: Use the patch module to take and mount the good chips onto the tinned pads; S6: Complete the welding connection between the new chip and the pad through the welding module.

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