Heating device

Abstract

The invention provides a heating device. The heating device comprises a plurality of fixing supports, a plurality of supporting supports and a heating wire. One side of the heating wire is used for being detachably connected with the base, the multiple fixing supports are located on the base and located between the base and the other side of the heating wire, each fixing support is provided with at least two supporting supports for supporting the other side of the heating wire, and at least one supporting support of each fixing support penetrates through the corresponding fixing support to be detachably connected with the base.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of semiconductor devices, and in particular, to a heating device. BACKGROUND

[0002] Metal Organic Chemical Vaper Deposition (MOCVD) equipment is a common epitaxial material growth equipment. The MOCVD equipment is widely used in manufacturing high-brightness Light Emitting Diode (LED) and semiconductor lasers.

[0003] The heating device is a key component in the MOCVD equipment. The related technology provides a heating device applied in the MOCVD equipment, and the heating module includes a heating wire, which is located on a base.

[0004] In the high-temperature heating process, the heating temperature of the above-mentioned heating device is uneven, the heating wire is stressed and deformed at high temperature, and the service life of the heating device is affected. SUMMARY

[0005] Embodiments of the present disclosure provide a heating device, which can make the heating temperature more uniform and the service life of the heating device longer. The technical solutions are as follows:

[0006] A heating device is provided, which includes a plurality of fixed supports, a plurality of support supports, and a heating wire.

[0007] One side of the heating wire is used for detachable connection with a base, the plurality of fixed supports are located on the base and between the base and the other side of the heating wire, at least two support supports are arranged on each fixed support to support the other side of the heating wire, and at least one support support of each fixed support is detachably connected with the base through the fixed support.

[0008] Optionally, the fixed support includes a first strip part and a second strip part, one end of the first strip part is connected with one end of the second strip part, and an included angle is formed between the first strip part and the second strip part.

[0009] The support support includes a first support, a second support, and a connecting frame, the first support is parallel to the second support, two ends of the connecting frame are connected with one end of the first support and one end of the second support respectively, and the other end of the first support and the other end of the second support are connected with the first strip part of the fixed support or the second strip part of the fixed support.

[0010] The heating wire is placed on the connecting frames of the plurality of support supports.

[0011] Optionally, the first strip part has two first through holes, and the second strip part has two second through holes.

[0012] The first support frame and the second support frame pass through the two first through holes or the two second through holes, respectively.

[0013] Optionally, the first through hole is a circular hole, the diameter of the first through hole is 0.5-1.5 mm, and the distance between the two first through holes is 14-18 mm.

[0014] The second through hole is a circular hole, and the diameter of the two second through holes is 5-6 mm.

[0015] The distance between the two second through holes is 15-20 mm.

[0016] Optionally, the fixed support is a boron nitride support, and the support support is a TZM molybdenum support.

[0017] Optionally, the heating wire is an axisymmetric structure, the axisymmetric structure includes two heating units connected and symmetric, each heating unit includes a plurality of arc structures connected head to tail, and the two heating units have a through hole for the rotation shaft to pass through.

[0018] Optionally, the two fixed supports correspond to the two heating units, respectively.

[0019] Optionally, two support supports are arranged on each fixed support, and the two support supports support two different arc structures of the heating unit, respectively.

[0020] Optionally, the length of the first strip part of the fixed support is 50-60 mm, and the length of the second strip part of the fixed support is 15-30 mm.

[0021] Optionally, the length of the connecting frame of the support support is 14-18 mm, and the length of the first support frame and the second support frame of the support support is 10-14 mm.

[0022] The technical scheme provided by the embodiments of the present disclosure has the following beneficial effects:

[0023] In the embodiment of the present disclosure, one side of the heating wire is detachably connected to the base, so that the heating wire can be fixed on the base; the other side of the heating wire is supported by multiple fixing brackets and multiple supporting brackets, so that the overall force on the heating wire is more uniform, the stress of the heating wire is reduced, the stability of the heating device is improved, and the service life is increased; at least one supporting bracket of each fixing bracket passes through the fixing bracket and is detachably connected to the base, so that the fixing bracket can be fixed on the base, making the heating device more stable; at the same time, a gap is provided between the heating wire and the base, which provides more heat diffusion space for the heating wire, makes the heating temperature more uniform, and improves the quality of epitaxial growth. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without any creative work.

[0025] Figure 1 is a schematic diagram of a heating device provided by an embodiment of the present disclosure;

[0026] Figure 2 is a top view of a fixing bracket provided by an embodiment of the present disclosure;

[0027] Figure 3 is a side view of a fixing bracket provided by an embodiment of the present disclosure;

[0028] Figure 4 is a schematic diagram of a fixed support bracket provided by an embodiment of the present disclosure;

[0029] Figure 5 This is a schematic diagram of a heating wire provided by an embodiment of the present disclosure;

[0030] Figure 6 This is a test comparison chart of the heating device provided by the embodiment of the present disclosure and the heating device provided by the related art;

[0031] Figure 7 Schematic diagram of the wavelength standard deviation of the light-emitting diode prepared by the heating device provided in the embodiment of the present disclosure.

[0032] The reference numerals are as follows:

[0033] 10: Fixed bracket;

[0034] 20: support bracket;

[0035] 30: heating wire;

[0036] 100: mounting hole;

[0037] 101: first strip part;

[0038] 102: second strip part;

[0039] 201: first support frame;

[0040] 202: second support frame;

[0041] 203: connecting frame;

[0042] 300: arc-shaped structure;

[0043] 301: heating unit;

[0044] 1001: first through hole;

[0045] 1002: second through hole;

[0046] 1003: through hole;

[0047] R1: hole diameter of first through hole;

[0048] L1: distance between two first through holes;

[0049] R2: hole diameter of second through hole;

[0050] L2: distance between two second through holes;

[0051] W1: width of first strip part of fixing support;

[0052] S1: length of first strip part of fixing support;

[0053] S2: length of second strip part of fixing support;

[0054] H1: height of fixing support;

[0055] W2: length of connecting frame of supporting support;

[0056] H2: length of first support frame and second support frame of supporting support;

[0057] R3: diameter of supporting support;

[0058] W3: width of arc-shaped structure. DETAILED DESCRIPTION

[0059] In order to make the purpose, technical solutions and advantages of the present disclosure clearer, the embodiments of the present disclosure will be further described in detail below with reference to the drawings.

[0060] The heating device of the current MOCVD equipment uses a graphite disk as a heating filament. During the high-temperature heating process, a thermal decomposition reaction occurs. The thermal expansion coefficient of the heating filament does not match the flow field, and it will deform at high temperatures, affecting the life of the device. This indirectly leads to low heating filament efficiency and low yield of epitaxial wafers.

[0061] Figure 1 This is a schematic diagram of a heating device provided by an embodiment of the present disclosure, see Figure 1 The heating device includes: a plurality of fixing brackets 10, a plurality of supporting brackets 20 and a heating wire 30.

[0062] One side of the heating wire 30 is used to be detachably connected to the base, and multiple fixing brackets 10 are respectively located on the base and between the base and the other side of the heating wire 30. At least two supporting brackets 20 are set on each fixing bracket 10 to support the other side of the heating wire 30. At least one supporting bracket 20 of each fixing bracket 10 passes through the fixing bracket 10 and is detachably connected to the base.

[0063] In the embodiment of the present disclosure, one side of the heating wire is detachably connected to the base, so that the heating wire can be fixed on the base; the other side of the heating wire is supported by multiple fixing brackets and multiple supporting brackets, so that the overall force on the heating wire is more uniform, the stress of the heating wire is reduced, the stability of the heating device is improved, and the service life is increased; at least one supporting bracket of each fixing bracket passes through the fixing bracket and is detachably connected to the base, so that the fixing bracket can be fixed on the base, making the heating device more stable; at the same time, a gap is provided between the heating wire and the base, which provides more heat diffusion space for the heating wire, makes the heating temperature more uniform, and improves the quality of epitaxial growth.

[0064] In the embodiment of the present disclosure, one side of the heating wire 30 is used for detachable connection with the base, which means that a bolt or other connecting component is passed through the mounting hole 100 on one side of the heating wire 30 and then fixed to the base to achieve a fixed connection.

[0065] In the embodiment of the present disclosure, the fixing bracket 10 includes a first strip portion 101 and a second strip portion 102 . One end of the first strip portion 101 is connected to one end of the second strip portion 102 , and an angle is formed between the first strip portion 101 and the second strip portion 102 .

[0066] The supporting bracket 20 includes a first supporting bracket 201, a second supporting bracket 202 and a connecting bracket 203. The first supporting bracket 201 is parallel to the second supporting bracket 202. The two ends of the connecting bracket 203 are respectively connected to one end of the first supporting bracket 201 and one end of the second supporting bracket 202. The other end of the first supporting bracket 201 and the other end of the second supporting bracket 202 are connected to the first strip portion 101 of the fixed bracket 10 or the second strip portion 102 of the fixed bracket 10.

[0067] The heating wire 30 is placed on the connecting frame 203 of the plurality of support brackets 20 .

[0068] In this implementation, the fixed bracket includes a first strip portion and a second strip portion, and the first strip portion and the second strip portion are arranged at an angle. On the one hand, it is more stable when arranged on the base, and on the other hand, it can better dissipate heat in conjunction with the base; the supporting bracket includes a first supporting bracket, a second supporting bracket and a connecting bracket. The first supporting bracket and the second supporting bracket are connected to the first strip portion or the second strip portion of the fixed bracket to connect the supporting bracket with the fixed bracket. The connecting bracket can be used to place the heating wire, which has a better supporting and fixing effect.

[0069] The angle between the first strip portion 101 and the second strip portion 102 means that one end of the first strip portion 101 is connected to one end of the second strip portion 102, and the one end of the first strip portion 101 and the second strip portion 102 are not in a straight line.

[0070] In the embodiment of the present disclosure, the angle between the first strip portion 101 and the second strip portion 102 may be an acute angle or a right angle, and the fixing bracket 10 formed by the combination of the first strip portion 101 and the second strip portion 102 may be 7-shaped or L-shaped.

[0071] In the embodiment of the present disclosure, the support bracket 20 is U-shaped. The first support bracket 201 and the second support bracket 202 of the support bracket 20 are vertically inserted into the fixing bracket 10.

[0072] Figure 2 This is a top view of a fixing bracket provided by an embodiment of the present disclosure, see Figure 2 The first strip portion 101 has two first through holes 1001 , and the second strip portion 102 has two second through holes 1002 .

[0073] The first support frame 201 and the second support frame 202 pass through the two first through holes 1001 or the two second through holes 1002 respectively.

[0074] In this implementation, the first support frame and the second support frame can pass through two first through holes or two second through holes respectively to fix the support frame to the fixed frame, and the first support frame and the second support frame can be connected to the base through the fixed frame, further improving the stability of the heating device.

[0075] In the embodiment of the present disclosure, the first through hole 1001 may be a circular hole, and the aperture R1 of the first through hole 1001 may be 0.5-1.5 mm; the distance L1 between two first through holes 1001 may be 14-18 mm.

[0076] The second through holes 1002 may be circular holes, and the aperture R2 of the two second through holes 1002 may be 5-6 mm.

[0077] The distance L2 between the two second through holes 1002 can be 15-20 mm.

[0078] In this implementation, the first through hole and the second through hole are circular holes, which are convenient for design and manufacture; the diameter of the first through hole is 0.5-1.5 mm, and the diameter of the second through hole is 5-6 mm, which can accommodate the support frame of sufficient size. And the first through hole and the second through hole are different in size, which can realize the effect that one through hole only inserts the support frame, and the other through hole allows the support frame through hole to connect the base.

[0079] Exemplarily, the first through hole 1001 is a circular hole, and the diameter R1 of the first through hole 1001 is 1 mm; the distance L1 between the two first through holes 1001 is 15 mm.

[0080] The second through hole 1002 is a circular hole, and the diameter R2 of the two second through holes 1002 is 5 mm.

[0081] The distance L2 between the two second through holes 1002 is 18 mm.

[0082] In other embodiments, the first through hole 1001 and the second through hole 1002 can also be other shapes, such as rectangular.

[0083] In the embodiments of the present disclosure, the diameter mentioned above is the diameter of the through hole.

[0084] In the embodiments of the present disclosure, the support bracket 20 can be connected with the base through the through hole with a large diameter, and the support bracket 20 can be connected with the fixed bracket 10 through the through hole with a small diameter.

[0085] In the embodiments of the present disclosure, the fixed bracket 10 can be a boron nitride bracket, and the support bracket 20 can be a TZM molybdenum bracket.

[0086] In this implementation, boron nitride is a good insulating material that can prevent the heating wire from being in conduction with the base. The boron nitride bracket has the characteristics of high temperature resistance and corrosion resistance, which can slow down the heat loss of the heating wire. Both boron nitride and TZM molybdenum have a low coefficient of thermal expansion, which can effectively release stress while the heating wire is heating.

[0087] TZM molybdenum is a molybdenum-based alloy mainly composed of molybdenum (Mo) and a small amount of titanium (Ti), zirconium (Zr) and carbon (C).

[0088] In other embodiments, the fixed bracket 10 can also be an alumina bracket.

[0089] In the embodiments of the present disclosure, the width W1 of the first strip-shaped part 101 of the fixed bracket 10 can be 6-10 mm.

[0090] The width refers to the width of the shape of the fixed support 10 projected on the base, and the width is the width in the direction perpendicular to the extension direction of the strip-shaped part.

[0091] In the implementation, the first strip-shaped part of the fixed support adopts the above-mentioned width, which can provide the support for the fixed support without occupying too much space and affecting the heating device.

[0092] Exemplarily, the width W1 of the first strip-shaped part 101 of the fixed support 10 is 8mm.

[0093] In the embodiment of the present disclosure, the length S1 of the first strip-shaped part 101 of the fixed support 10 can be 50-60mm, and the length S2 of the second strip-shaped part 102 of the fixed support 10 can be 15-30mm.

[0094] The length refers to the length of the shape of the fixed support 10 projected on the base, and the length is the length in the extension direction of the strip-shaped part.

[0095] In the implementation, the first strip-shaped part and the second strip-shaped part adopt the above-mentioned length, which can provide the support for the fixed support without occupying too much space and affecting the heating device.

[0096] Exemplarily, the length S1 of the first strip-shaped part 101 of the fixed support 10 is 55mm, and the length S2 of the second strip-shaped part 102 of the fixed support 10 is 20mm.

[0097] Figure 3 The height H1 of the fixed support 10 can be 6-10mm.

[0098] In the implementation, the fixed support adopts the above-mentioned height, which can provide good support and better stability of the fixed support.

[0099] Exemplarily, the height H1 of the fixed support 10 is 8mm.

[0100] Figure 4 The support support 20 is a support support provided by the present disclosure, and a schematic view of the support support is shown in FIG. 6. Figure 4 The length W2 of the connecting frame 203 of the support support 20 can be 14-18mm, and the length H2 of the first support frame 201 and the second support frame 202 of the support support 20 can be 10-14mm.

[0101] In the implementation, the first support frame and the second support frame adopt the above-mentioned length, which is not too long or too short, and can ensure the support effect and the heat dissipation effect; the connecting frame adopts the above-mentioned length, which can be in full contact with the heating wire, provide good support, improve the support area, and reduce the stress of the heating wire.

[0102] Exemplarily, the length W2 of the connecting frame 203 of the supporting frame 20 is 16 mm, and the length H2 of the first supporting frame 201 and the second supporting frame 202 of the supporting frame 20 is 12 mm.

[0103] In the embodiment of the present disclosure, the first support frame 201 , the second support frame 202 and the connecting frame 203 of the support bracket 20 may be cylinders.

[0104] In other embodiments, the first support frame 201 , the second support frame 202 and the connecting frame 203 may also be in other shapes, such as a prism.

[0105] In the embodiment of the present disclosure, the diameter R3 of the support bracket 20 may be 0.5-1.5 mm.

[0106] In this implementation, the supporting bracket adopts the above-mentioned diameter to correspond to the aperture of the second through hole of the fixed bracket, so that the supporting bracket is more stable, making the metal organic chemical vapor deposition equipment more stable and improving the equipment yield. The above-mentioned diameter is smaller than the first through hole, and there is a gap between the supporting bracket and the first through hole, which is convenient for connection with the base, and then other fasteners are filled for fastening.

[0107] Exemplarily, the diameter R3 of the support bracket 20 is 1 mm.

[0108] In the embodiment of the present disclosure, the diameter of the support bracket 20 may be smaller than the aperture of the first through hole 1001 .

[0109] In other embodiments, the diameter of the support bracket 20 may also be equal to the aperture of the first through hole 1001 .

[0110] In the embodiment of the present disclosure, the diameter of the support bracket 20 may be equal to the aperture of the second through hole 1002 .

[0111] In other embodiments, the diameter of the support bracket 20 may also be smaller than the aperture of the second through hole 1002 .

[0112] In the embodiment of the present disclosure, the angle between the supporting bracket 20 and the fixing bracket 10 may be 90 degrees.

[0113] In other embodiments, the angle between the supporting bracket 20 and the fixing bracket 10 may also be greater than or equal to 90 degrees.

[0114] Figure 5 This is a schematic diagram of a heating wire provided by an embodiment of the present disclosure, see Figure 5 The heating wire 30 is an axisymmetric structure, which includes two connected and symmetrical heating units 301. Each heating unit includes a plurality of arc structures 300 connected end to end. There is a through hole 1003 between the two heating units 301 for the rotation shaft to pass through.

[0115] The rotating shaft is used to support the tray carrying the epitaxial structure.

[0116] In the implementation, the heating wire adopts the above structure, ensuring the heating uniformity and being able to pass through the rotating shaft to be suitable for the semiconductor growth equipment.

[0117] The width W3 of the arc structure 300 can be 10-14 mm.

[0118] In the implementation, the arc structure adopts the above width, which is not too wide to cause the gap between the arc structures to be too short, resulting in uneven heat diffusion, or too narrow to cause the heating wire to have too small heating area and the heating device to have too low heat.

[0119] Exemplarily, the width W3 of the arc structure 300 is 12 mm.

[0120] In the embodiment of the present disclosure, two support supports 20 are arranged on each fixed support 10, and the two support supports 20 support two different arc structures 300 of the heating unit 301 respectively.

[0121] In the implementation, the two support supports arranged on the fixed support can form a triangular structure with one side of the heating wire, making the heating device more stable; the two support supports support two different arc structures of the heating unit respectively, which can provide support force for each arc structure, making the heating device more stable.

[0122] In the embodiment of the present disclosure, the heating wire 30 can be a tungsten wire with a purity greater than 95%.

[0123] In the implementation, the tungsten with a purity greater than 95% has good electrical conductivity and thermal conductivity, and a low thermal expansion coefficient, effectively releasing stress.

[0124] Exemplarily, the inner ring heater 30 is a tungsten wire with a purity of 96%.

[0125] Figure 6 is a test comparison diagram of the heating device provided by the embodiment of the present disclosure and the heating device provided by the related art, referring to Figure 6 , the abscissa is the serial number of the heating device, that is, the comparison of 6 sets of experimental data, and the ordinate is the service life of the heating device. The upper fold line corresponds to the data of 6 heating devices provided by the embodiment of the present disclosure, and the lower fold line corresponds to the data of 6 heating devices provided by the related art.

[0126] From Figure 6 It can be seen that the service life of the heating device provided by the embodiment of the present disclosure is significantly improved compared with the heating device provided by the related art, and the use cycle mean is improved by about 50% compared with before.

[0127] Figure 7 is a schematic diagram of wavelength standard deviation of light emitting diodes prepared by the heating device provided in the embodiments of the present disclosure. Referring to Figure 7 , the growth equipment using the heating device provided in the embodiments of the present disclosure is used to prepare light emitting diodes in the same machine, the same disc and the same period. The test results are shown in Figure 7 , the abscissa represents different furnace times, and the ordinate represents wavelength standard deviation.

[0128] As can be seen from Figure 7 , the average wavelength standard deviation of the same machine, the same disc and the same period decreases by 0.07, the preparation yield is improved, and it is more stable.

[0129] The heating wire realizes rapid heating in a high current state in the metal organic chemical vapor deposition equipment. The embodiments of the present disclosure slow down the heat loss of the process gas to the heating wire by increasing two groups of fixed supports made of boron nitride as the main material and the “U”-shaped support supports made of TZM molybdenum, so that the heating wire can effectively release stress while heating. By supporting the heating wire, the temperature is uniformly transmitted to the graphite disc of the carrier, and the heat of the gas in the metal organic chemical vapor deposition equipment is relatively uniform. The temperature field stability of the gas can also be improved, thereby playing a more stable role on the wavelength of the epitaxial wafer. Finally, the temperature field and airflow distribution of the reaction cavity heating wire are effectively improved, and the product yield is improved.

[0130] The above only describes optional embodiments of the present disclosure and does not limit the present disclosure. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. A heating device, characterized in that: The heating device comprises: a plurality of fixing brackets (10), a plurality of supporting brackets (20) and a heating wire (30); One side of the heating wire (30) is used for being detachably connected to the base, and the multiple fixing brackets (10) are respectively located on the base and between the base and the other side of the heating wire (30). At least two supporting brackets (20) are provided on each of the fixing brackets (10) to support the other side of the heating wire (30), and at least one supporting bracket (20) of each of the fixing brackets (10) passes through the fixing bracket (10) and is detachably connected to the base.

2. The heating device according to claim 1, characterized in that The fixing bracket (10) comprises a first strip-shaped portion (101) and a second strip-shaped portion (102), one end of the first strip-shaped portion (101) is connected to one end of the second strip-shaped portion (102), and an angle is formed between the first strip-shaped portion (101) and the second strip-shaped portion (102); The supporting bracket (20) comprises a first supporting bracket (201), a second supporting bracket (202) and a connecting bracket (203); the first supporting bracket (201) is parallel to the second supporting bracket (202); two ends of the connecting bracket (203) are respectively connected to one end of the first supporting bracket (201) and one end of the second supporting bracket (202); the other end of the first supporting bracket (201) and the other end of the second supporting bracket (202) are connected to the first strip portion (101) of the fixing bracket (10) or the second strip portion (102) of the fixing bracket (10); The heating wire (30) is placed on a connecting frame (203) of a plurality of the supporting brackets (20).

3. The heating device according to claim 2, characterized in that The first strip-shaped portion (101) has two first through holes (1001), and the second strip-shaped portion (102) has two second through holes (1002); The first support frame (201) and the second support frame (202) pass through the two first through holes (1001) or the two second through holes (1002), respectively.

4. The heating device according to claim 3, characterized in that The first through hole (1001) is a circular hole, and the aperture (R1) of the first through hole (1001) is 0.5 to 1.5 mm; the distance (L1) between the two first through holes (1001) is 14 to 18 mm; The second through holes (1002) are circular holes, and the diameters (R2) of the two second through holes (1002) are 5 to 6 mm; The distance (L2) between the two second through holes (1002) is 15 to 20 mm.

5. The heating device according to any one of claims 1 to 4, characterized in that The fixing bracket (10) is a boron nitride bracket, and the supporting bracket (20) is a TZM molybdenum bracket.

6. The heating device according to any one of claims 1 to 4, characterized in that The heating wire (30) is an axisymmetric structure, comprising two connected and symmetrical heating units (301), each of the heating units comprising a plurality of arc-shaped structures (300) connected end to end, and a through hole (1003) for a rotating shaft to pass through is provided between the two heating units (301).

7. The heating device according to claim 6, characterized in that The heating device comprises: two fixed supports (10), and the two fixed supports (10) correspond to the two heating units (301) respectively.

8. The heating device according to claim 6, characterized in that Two supporting brackets (20) are provided on each of the fixing brackets (10), and the two supporting brackets (20) respectively support two different arc-shaped structures (300) of the heating unit (301).

9. The heating device according to any one of claims 1 to 4, characterized in that The length (S1) of the first strip-shaped portion (101) of the fixing bracket (10) is 50 to 60 mm, and the length (S2) of the second strip-shaped portion (102) of the fixing bracket (10) is 15 to 30 mm.

10. The heating device according to any one of claims 1 to 4, characterized in that The length (W2) of the connecting frame (203) of the support bracket (20) is 14 to 18 mm, and the length (H2) of the first support bracket (201) and the second support bracket (202) of the support bracket (20) is 10 to 14 mm.

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