Liquid cooling channel synchronous forming equipment for three-dimensional stacking of heterogeneous chips

Abstract

The invention relates to the technical field of chip manufacturing, in particular to heterogeneous chip three-dimensional stacked liquid cooling channel synchronous forming equipment which comprises a first electric push rod and is characterized in that a rectangular frame is fixedly mounted at the bottom end of a piston rod of the first electric push rod. The rotatable heating assembly is responsible for carrying out thermoforming on the grooves in the transverse part, and the design with clear division of labor can more accurately control the heating position and heat distribution according to the characteristics of the grooves in different directions, so that the thermoforming precision is improved, and the grooves in the heterogeneous chip can reach the shape and size required by the design; for some complex heterogeneous chip structures, the bottom heating assembly can be firstly utilized to perform preliminary shaping on the vertical grooves, and then the rotatable heating assembly is utilized to perform fine shaping on the transverse grooves, or otherwise, the rotatable heating assembly is utilized to perform fine shaping on the transverse grooves. The flexibility is favorable for optimizing the thermoplastic process, the production requirements of different types of heterogeneous chips are met, and the production efficiency and the product consistency are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip manufacturing, in particular to a liquid cooling channel synchronous forming device for heterogeneous chip three-dimensional stacking. BACKGROUND

[0002] The liquid cooling channel synchronous forming device for heterogeneous chip three-dimensional stacking is a key device for manufacturing liquid cooling channels in the three-dimensional stacking structure of heterogeneous chips, and plays an important role in the heat dissipation management of high-density integrated chips. As the integration of chips continues to increase, the heat generated also increases significantly. The liquid cooling channel synchronous forming device can simultaneously manufacture liquid cooling channels that match the structure of the chips during the stacking process of the chips, so that the cooling liquid can flow in the channels to effectively remove the heat generated by the chips, ensuring that the chips operate within the normal operating temperature range and improving the performance and reliability of the chips.

[0003] When manufacturing a three-dimensional stacked heterogeneous chip, corresponding heat dissipation grooves need to be formed on the three-dimensional stacked heterogeneous chip. When forming horizontal grooves and vertical grooves, different components need to be used for formation. Different components may produce different errors during processing. To ensure the accuracy of the horizontal grooves and vertical grooves and the relative position accuracy between the two, each component needs to be accurately adjusted and calibrated, increasing the difficulty of accuracy control. If the accuracy of the two components does not match or the adjustment is not in place, the size deviation, perpendicularity or parallelism of the grooves may not meet the requirements, affecting the performance and quality of the heterogeneous chip. SUMMARY

[0004] The present application aims to provide a liquid cooling channel synchronous forming device for three-dimensional stacked heterogeneous chips to solve the problems raised in the background.

[0005] To achieve the above-mentioned purpose, the present application provides the following technical solution: a liquid cooling channel synchronous forming device for three-dimensional stacked heterogeneous chips, comprising a first electric push rod, a group of rectangular frames is fixedly installed at the bottom end of the piston rod of the first electric push rod, a horizontal positioning frame is movably installed on the group of rectangular frames, and the horizontal positioning frame moves along the axis direction of the rectangular frame; A rectangular square tube is fixedly installed at the center position of the horizontal positioning frame, an inner assembly pipe is arranged in the rectangular square tube, a bottom heating assembly is arranged at the bottom of the inner assembly pipe, and the rectangular square tube, the inner assembly pipe and the bottom heating assembly constitute a structure subjected to the vertical pushing force and pulling force of the first electric push rod; The inner assembly pipe is rotationally connected with a rotatable tooth column, and the rotatable tooth column is rotationally connected with a rotatable heating assembly located in a groove of the inner assembly pipe.

[0006] Preferably, the number of the lateral adjusting frames is two, and the two lateral adjusting frames are symmetrically arranged front and back.

[0007] Preferably, the proximal sides of the two inner assembly pipes are provided with grooves, which leave preset spaces for rotation of the rotatable heating assembly.

[0008] Preferably, the bottom of the bottom heating assembly and the front and back surfaces of the rotatable heating assembly are provided with heating plates.

[0009] Preferably, the top of the rectangular frame is provided with limiting end plates for limiting the movement of the lateral adjusting frame on the rectangular frame.

[0010] Preferably, the front surface of the rectangular frame is provided with a contrast scale, and the lateral adjusting frame is fixedly provided with a positioning scale.

[0011] Preferably, when the rotatable heating assembly is in a horizontal state, the bottom of the rotatable heating assembly is attached to the bottom of the groove of the inner assembly pipe.

[0012] Preferably, the first electric push rod is installed on a structure composed of a mounting base and an auxiliary mounting frame, and the mounting base is further provided with a transmission belt.

[0013] Preferably, the mounting base is fixedly provided with two rectangular buckles, and the two rectangular buckles are arranged on the two sides of the transmission belt. The rectangular buckle is fixedly provided with a first auxiliary mounting plate, the telescopic column is fixedly provided with a second auxiliary mounting plate, the first auxiliary mounting plate is rotationally connected with a positive and negative toothed lead screw, and the positive and negative toothed lead screw is threadedly connected with the second auxiliary mounting plate.

[0014] Preferably, the proximal sides of the two supporting side plates are provided with protective pads.

[0015] Compared with the prior art, the present application has the following advantages: 1、Bottom heating assembly isothermal chip hot plastic, to assist the opening of the vertical direction groove on the isothermal chip, the heating assembly can rotate and rise to the hot plastic of the horizontal groove, the bottom heating assembly is specially designed for the opening of the vertical direction groove on the isothermal chip, and the rotatable heating assembly is responsible for the hot plastic of the horizontal groove. The design of this division of labor can more accurately control the heating position and heat distribution according to the characteristics of grooves in different directions, thereby improving the precision of hot plastic and ensuring that the grooves on the isothermal chip can meet the design requirements of shape and size. For some complex isothermal chip structure, the bottom heating assembly can be used to preliminarily shape the vertical direction groove, and then the rotatable heating assembly can be used to finely shape the horizontal groove, or vice versa. This flexibility helps to optimize the hot plastic process, meet the production needs of different types of isothermal chips, improve production efficiency and product consistency.

[0016] 2、According to the size of the isothermal chip, adjust the position of the supporting side plate and the protective pad, and move the supporting side plate and the protective pad to each other to realize the fixation and limiting of the isothermal chip, to assist the positioning of the isothermal chip. The size of the isothermal chip is various, the supporting side plate and the protective pad can move close to each other, and can be flexibly adjusted according to the size of the specific chip, so that the equipment has good universality and can be applied to isothermal chips of various sizes, improving the use range and economy of the equipment. This adjustment method can realize accurate fixation and limiting of the isothermal chip, ensure that the chip remains in the correct position during the hot plastic process, avoid hot plastic deviation or other process problems caused by chip position deviation, and help to improve product consistency and yield. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a front view structure diagram of the present application.

[0018] Figure 2 It is a side view structure diagram of the present application.

[0019] Figure 3 It is a top view structure diagram of the present application.

[0020] Figure 4 It is a structure diagram of the protective pad corresponding position.

[0021] Figure 5 It is a structure diagram of the positive and negative toothed rod corresponding position.

[0022] Figure 6 It is a structure diagram of the auxiliary rotating wheel corresponding position.

[0023] Figure 7 It is a structure diagram of the second electric push rod corresponding position.

[0024] Figure 8 Structure diagram of corresponding position of the invention.

[0025] Figure 9 Structure diagram of corresponding position of the invention.

[0026] Figure 10 Structure diagram of corresponding position of the invention.

[0027] Figure 11 Structure diagram of corresponding position of the invention.

[0028] Figure 12 Structure diagram of corresponding position of the invention.

[0029] In the figure: 1, first electric push rod; 2, rectangular frame; 3, transverse position adjusting frame; 4, rectangular square tube; 5, inner assembly tube; 6, bottom heating assembly; 7, rotatable tooth column; 8, rotatable heating assembly; 9, second electric push rod; 10, vertical transmission plate; 1001, tooth groove; 11, limiting end plate; 12, contrast ruler; 13, positioning ruler; 14, mounting base; 15, auxiliary mounting frame; 16, transmission belt; 17, rectangular buckle; 18, telescopic column; 19, supporting side plate; 20, first auxiliary mounting plate; 21, second auxiliary mounting plate; 22, positive and negative tooth screw rod; 23, auxiliary rotating wheel; 24, protective pad. DETAILED DESCRIPTION

[0030] To make the purpose, technical scheme and advantages of the present application clearer, the technical scheme in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are some of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0031] Please refer to Figures 1 to 12 The present application provides a technical scheme: a liquid cooling channel synchronous forming device for three-dimensional stacking of heterogeneous chips, comprising a first electric push rod 1, a group of rectangular frames 2 is fixedly installed at the bottom end of the piston rod of the first electric push rod 1, a transverse position adjusting frame 3 is movably installed on the group of rectangular frames 2, and the transverse position adjusting frame 3 moves along the axis direction of the rectangular frame 2; A rectangular square tube 4 is fixedly installed at the center position of the transverse position adjusting frame 3, an inner assembly tube 5 is arranged in the rectangular square tube 4, a bottom heating assembly 6 is arranged at the bottom of the inner assembly tube 5, and the rectangular square tube 4, the inner assembly tube 5 and the bottom heating assembly 6 constitute a structure subjected to the vertical pushing force and pulling force of the first electric push rod 1; The piston rod of the first electric push rod 1 is rigidly connected with the rectangular tube 4 on the transverse positioning frame 3. When the first electric push rod 1 works, the motor drives the screw rod to rotate, and the nut moves along the screw rod in the axial direction, thereby driving the piston rod to perform the extension and contraction movement. Since the piston rod is fixed with the rectangular tube 4, the rectangular tube 4 will produce a corresponding displacement in the vertical direction along with the extension and contraction of the piston rod, which is the power source for the whole structure to move in the vertical direction.

[0032] Guiding and stabilizing: The inner assembly tube 5 in the rectangular tube 4 is connected with the inner wall of the rectangular tube 4 through the guiding device such as the linear bearing. This design allows the inner assembly tube 5 to move linearly in the vertical direction in the rectangular tube 4, while limiting its freedom in other directions, ensuring the accuracy and stability of the movement. When the first electric push rod 1 pushes or pulls the rectangular tube 4, the inner assembly tube 5 can move smoothly in the vertical direction along with the rectangular tube 4 under the action of the guiding device, without shaking or deviating.

[0033] Cooperative work: The bottom heating assembly 6 is fixed at the bottom of the inner assembly tube 5. When the rectangular tube 4 and the inner assembly tube 5 move in the vertical direction under the action of the first electric push rod 1, the bottom heating assembly 6 also moves together. In this way, the bottom heating assembly 6 can approach or move away from the chip to be heated as needed, achieving the heating treatment of the object. At the same time, by controlling the extension and contraction amount of the first electric push rod 1, the distance between the bottom heating assembly 6 and the object to be heated can be accurately adjusted, thereby controlling the intensity and effect of heating.

[0034] The inner assembly tube 5 is rotatably connected with the rotatable tooth column 7, and the rotatable heating assembly 8 located in the groove of the inner assembly tube 5 is rotatably connected with the rotatable tooth column 7. The top of the inner assembly tube 5 is provided with the second electric push rod 9, and the piston rod of the second electric push rod 9 is fixedly connected with the vertical transmission plate 10. The tooth groove 1001 provided on the vertical transmission plate 10 is engaged with the rotatable tooth column 7, and the vertical transmission plate 10 applies a circumferential thrust to the rotatable tooth column 7.

[0035] The top end of the piston rod of the second electric push rod 9 is fixedly connected with the vertical transmission plate 10. Therefore, when the piston rod performs the extension and contraction, the vertical transmission plate 10 moves synchronously in the vertical direction along with the piston rod.

[0036] The vertical transmission plate 10 is provided with the tooth groove 1001, and the rotatable tooth column 7 is engaged with the tooth groove. When the vertical transmission plate 10 moves linearly in the vertical direction under the action of the second electric push rod 9, the tooth groove 1001 interacts with the teeth on the rotatable tooth column 7. According to the gear and rack transmission principle, the linear movement of the vertical transmission plate 10 will be converted into the circular movement of the rotatable tooth column 7, that is, the vertical transmission plate 10 applies a circumferential thrust to the rotatable tooth column 7, so that the rotatable tooth column 7 rotates around its axis.

[0037] Movement of the rotatable heating assembly: The rotatable heating assembly 8 is rotationally connected with the rotatable tooth column 7 and is located in the groove of the inner assembly pipe 5. When the rotatable tooth column 7 rotates under the action of the vertical transmission plate 10, the rotatable heating assembly 8 will rotate with the rotatable tooth column 7. In this way, the rotatable heating assembly 8 can adjust its angle and position to achieve heating operation on a specific area and meet different process requirements.

[0038] By controlling the extension amount, speed and direction of the second electric push rod 9, the movement of the vertical transmission plate 10 can be accurately controlled, and then the rotation angle, speed and direction of the rotatable tooth column 7 can be accurately controlled, and finally the position and angle of the rotatable heating assembly 8 can be accurately adjusted. At the same time, the system can also combine sensors and feedback mechanisms to dynamically adjust the action of the second electric push rod 9 according to actual needs to ensure that the rotatable heating assembly 8 can accurately reach the specified position and complete the heating task.

[0039] The number of the lateral position adjusting frames 3 is two, and the two lateral position adjusting frames 3 are symmetrically arranged front and back.

[0040] The lateral position adjusting frame 3 adopts a double-frame symmetrical layout design, and the two position adjusting frames are symmetrically distributed front and back with the equipment central axis as the reference. This symmetrical structure design effectively improves the mechanical stability of the system. When the first electric push rod 1 drives the rectangular frame 2 and the position adjusting frame to move, the symmetrically distributed lateral position adjusting frames 3 can evenly share the load to avoid equipment deformation or movement deviation caused by unilateral force, The proximal side of the two inner assembly pipes 5 is provided with a groove, which leaves a preset space for the rotation of the rotatable heating assembly 8.

[0041] The opposite inner sides of the two inner assembly pipes 5 are processed by a precise milling process to form an arc-shaped groove structure. The profile of the groove is parameterized designed according to the rotation radius and movement trajectory of the rotatable heating assembly 8 to reserve sufficient space for its movement. The surface of the groove is polished to mirror level smoothness (Ra≤0.2μm) and is coated with a self-lubricating coating to effectively reduce the friction resistance when the rotatable heating assembly 8 rotates, ensuring that it can rotate flexibly by ±180°.

[0042] The edge of the groove is treated by a round corner processing technology to eliminate stress concentration points. Meanwhile, a high-temperature-resistant elastic sealing element is embedded in the groove to prevent impurities such as machining debris and cooling liquid from entering the inner assembly pipe 5 and affecting the transmission accuracy of the rotatable tooth column 7, and to maintain a clean environment inside the groove. When the two rotatable heating assemblies 8 rotate towards each other, this groove design can realize the non-interference connection of their movement trajectories, meet the thermal shaping requirements of complex areas in the horizontal and vertical three-dimensional stacking structure of heterogeneous chips, and significantly improve the adaptability and flexibility of the processing technology.

[0043] The bottom of the bottom heating assembly 6 and the front and back of the rotatable heating assembly 8 are each provided with a heating plate.

[0044] The bottom of the bottom heating assembly 6 and the front and back of the rotatable heating assembly 8 are each provided with a heating plate.

[0045] The heating plate is internally integrated with a high-precision temperature sensor, which can monitor the surface temperature in real time and feed back the data to the intelligent temperature control system. The system uses a PID control algorithm to accurately control the temperature fluctuation range within ±1°C. In addition, the heating plates of the bottom heating assembly 6 and the rotatable heating assembly 8 can independently adjust the temperature, and through the control system, different heating parameters can be set according to different processing technology requirements, ensuring accurate and efficient thermal plastic forming of each part of the heterogeneous chip. At the same time, the surface of the heating plate is treated with special texture to increase the contact area with the chip surface, improve the heat transfer efficiency, and ensure uniform distribution of heat on the chip surface, avoiding local overheating or uneven heating.

[0046] The two sides of the top of the rectangular frame 2 are provided with limit end plates 11 for limiting the movement of the horizontal positioning frame 3 on the rectangular frame 2.

[0047] The limit end plates 11 symmetrically arranged on the top of the rectangular frame 2 are made of high-strength alloy steel and are precisely milled by a numerical control machining center, and are rigidly connected to the frame body by welding or bolt fastening. The inner surface of the limit end plate 11 is ground to ensure accurate positioning of the horizontal positioning frame 3.

[0048] Each limit end plate 11 is integrated with a double-limiting mechanism: physical limiting and electronic sensing limiting. The physical limiting part is provided with an adjustable limiting block, which can be adjusted in height along the vertical direction through a threaded pair structure, suitable for different thicknesses of the horizontal positioning frame 3. When the positioning frame moves to the preset boundary, the limiting block will directly block its further movement to prevent overstroke operation; the electronic sensing limiting is embedded with an infrared opposite sensor or a proximity switch inside the end plate. When the horizontal positioning frame 3 approaches the limit position, the sensor triggers a signal in advance, and the control system immediately starts the deceleration program and stops the positioning frame smoothly within a safe distance to avoid rigid collision.

[0049] The surface of the limiting end plate 11 is coated with a high-damping rubber buffer layer, which has shock absorption and wear resistance. When physical limiting occurs, it effectively absorbs impact energy and reduces damage to the transverse positioning frame 3, while reducing equipment operation noise. This composite limiting design not only ensures the safety and reliability of the transverse positioning frame 3 moving on the rectangular frame 2, but also adapts to different process requirements through parameterized adjustment of stroke control, improving the versatility and operational flexibility of the equipment.

[0050] The front of the rectangular frame 2 is provided with a contrast ruler 12, and the transverse positioning frame 3 is fixedly installed with a positioning ruler 13. The transverse positioning frame 3 and the positioning ruler 13 form a structure set outside the rectangular frame 2, and the positioning ruler 13 is provided with a slot corresponding to the shape of the contrast ruler 12.

[0051] The operator can intuitively obtain real-time position information of the transverse positioning frame 3 by observing the relative position of the specific mark on the positioning ruler 13 and the scale on the contrast ruler 12. This design not only facilitates the operator to accurately adjust and monitor the position of the transverse positioning frame 3, but also improves the visualization and work efficiency of the equipment operation. At the same time, due to the high-precision cooperation of the positioning ruler 13 and the contrast ruler 12, the position deviation caused by human reading error or equipment operation error can be effectively reduced, further ensuring the accuracy and stability of the transverse positioning frame 3 movement, providing reliable position guarantee for the subsequent heterogeneous chip processing technology.

[0052] When the rotatable heating assembly 8 is in a horizontal state, the bottom of the rotatable heating assembly 8 is attached to the bottom of the groove body on the inner assembly pipe 5.

[0053] The first electric push rod 1 is installed on the structure composed of the mounting base 14 and the auxiliary mounting frame 15, and the mounting base 14 is further provided with a transmission belt 16.

[0054] Two rectangular buckles 17 are fixedly installed on the mounting base 14, which are arranged on both sides of the transmission belt 16. A telescopic column 18 is movably installed in the rectangular buckle 17, and a support side plate 19 is arranged on the side close to the telescopic column 18. A first auxiliary mounting plate 20 is fixedly installed on the rectangular buckle 17, and a second auxiliary mounting plate 21 is fixedly installed on the telescopic column 18. A positive and negative toothed rod 22 is rotatably connected to the first auxiliary mounting plate 20, and the positive and negative toothed rod 22 is threadedly connected with the second auxiliary mounting plate 21. An auxiliary rotating wheel 23 is fixedly connected to one end of the positive and negative toothed rod 22.

[0055] The outer side of the rectangular buckle 17 is also fixedly provided with a first auxiliary mounting plate 20, which is made of high-quality alloy steel material, and is subjected to precise machining and surface treatment, and has good strength and wear resistance. The telescopic column 18 is correspondingly provided with a second auxiliary mounting plate 21, and the two are fixedly connected through a specific connection mode. The first auxiliary mounting plate 20 is rotatably connected with a reversible screw rod 22 through a high-precision bearing. The reversible screw rod 22 is subjected to fine grinding and heat treatment, and has a high-precision thread type. The reversible screw rod 22 is tightly connected with the second auxiliary mounting plate 21 through a thread, so that the telescopic column 18 can be driven to extend and retract when rotating. An auxiliary rotating wheel 23 is fixedly connected to one end of the reversible screw rod 22. The surface of the auxiliary rotating wheel 23 is subjected to anti-skid treatment, which facilitates manual rotation by the operator to accurately adjust the position of the telescopic column 18.

[0056] The two support side plates 19 are provided with protective pads 24 close to the sides.

[0057] Working principle: First step: According to the size of the heterogeneous chip, the position of the structure composed of the support side plate 19 and the protective pad 24 is adjusted. The reversible screw rod 22 is driven to rotate by rotating the auxiliary rotating wheel 23. The second auxiliary mounting plate 21 is moved on the reversible screw rod 22 by the rotation of the reversible screw rod 22. The second auxiliary mounting plate 21 drives the telescopic column 18 to move in the rectangular buckle 17 when it moves on the reversible screw rod 22. The support side plate 19 and the protective pad 24 are moved by the movement of the telescopic column 18 in the rectangular buckle 17, so as to drive the support side plate 19 and the protective pad 24 to move close to each other, so as to fix and limit the heterogeneous chip, assist the positioning of the heterogeneous chip, guide and fix the heterogeneous chip, and ensure the stability of the heterogeneous chip during processing.

[0058] Second step: According to the opening position of the vertical installation slot in the heterogeneous chip, the position of the structure composed of the inner assembly pipe 5 and the bottom heating assembly 6 is adjusted. The position of the structure composed of the inner assembly pipe 5 and the bottom heating assembly 6 is changed by moving the horizontal position adjusting frame 3 on the rectangular frame 2, and is fixed by fixing the horizontal position adjusting frame 3 on the rectangular frame 2, so as to realize the opening of the opening on the upper surface of the heterogeneous chip. The opening is used for the entry and discharge of the cooling liquid.

[0059] Third step: the rectangular frame 2 and the transverse positioner 3 are lifted by the piston rod of the first electric push rod 1, when the rectangular frame 2 is lowered, the inner assembly tube 5 and the bottom heating assembly 6 are also lowered, when the inner assembly tube 5 and the bottom heating assembly 6 are lowered, the bottom surface of the bottom heating assembly 6 contacts the heterogeneous chip, the bottom heating assembly 6 is in a heated state, in the heated state, the bottom heating assembly 6 performs thermal shaping on the heterogeneous chip to assist the opening on the heterogeneous chip, then the vertical transmission plate 10 is lowered by the piston rod of the second electric push rod 9, the rotatable tooth column 7 rotates in the inner assembly tube 5 by the lowering of the vertical transmission plate 10, the rotatable heating assembly 8 rotates to perform partial thermal shaping on the heterogeneous chip, then the inner assembly tube 5 and the bottom heating assembly 6 move upward by the piston rod of the first electric push rod 1, the rotatable heating assembly 8 moves upward by the upward movement of the inner assembly tube 5 and the bottom heating assembly 6, the transverse thermal shaping groove is manufactured, the channel for discharging the cooling liquid is formed, and the channel is not opened from top to bottom.

[0060] Finally, it should be noted that: the above examples are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing examples, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing examples, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A liquid cooling channel synchronous molding device for three-dimensional stacking of heterogeneous chips, comprising a first electric push rod, characterized in that: A set of rectangular frames is fixedly mounted on the bottom end of the piston rod of the first electric push rod, and a transverse position adjustment frame is movably mounted on the set of rectangular frames, and the transverse position adjustment frame moves along the axis direction of the rectangular frames; A rectangular square tube is fixedly installed at the center of the horizontal positioning frame, an inner assembly tube is arranged in the rectangular square tube, and a bottom heating component is arranged at the bottom of the inner assembly tube. The structure composed of the rectangular square tube, the inner assembly tube and the bottom heating component is subjected to the thrust and pull of the first electric push rod in the vertical direction; A rotatable gear column is rotatably connected in the inner assembly tube, and a rotatable heating component located in the upper groove of the inner assembly tube is rotatably connected to the rotatable gear column. A second electric push rod is provided on the top of the inner assembly tube, and a vertical transmission plate is fixedly mounted on the piston rod of the second electric push rod. The tooth groove provided on the vertical transmission plate is engaged with the rotatable gear column, and the vertical transmission plate applies a circumferential thrust to the rotatable gear column.

2. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 1 is characterized in that: There are two transverse positioning racks, and the two transverse positioning racks are symmetrically arranged front to back.

3. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 2, characterized in that: The proximal sides of the two inner assembly tubes are each provided with a groove body, which leaves a preset space for the rotation of the rotatable heating component.

4. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 3, characterized in that: The bottom of the bottom heating component and the front and back sides of the rotatable heating component are all provided with heating plates.

5. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 4, characterized in that: Limiting end plates are provided on both sides of the top of the rectangular frame, and the limiting end plates are used for limiting the movement of the transverse positioning frame on the rectangular frame.

6. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 5, characterized in that: A reference ruler is provided on the front of the rectangular frame, a positioning ruler is fixedly mounted on the transverse positioning frame, the transverse positioning frame and the positioning ruler form a structure sleeved outside the rectangular frame, and a groove corresponding to the shape of the reference ruler is opened on the positioning ruler.

7. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 6, characterized in that: When the rotatable heating component is in a horizontal state, the bottom of the rotatable heating component is in contact with the bottom of the upper groove of the inner assembly tube.

8. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 7, characterized in that: The first electric push rod is installed on a structure composed of a mounting base and an auxiliary mounting frame, and a transmission belt is also provided on the mounting base.

9. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 8, characterized in that: Two rectangular clips are fixedly mounted on the mounting base, and the two rectangular clips are arranged on both sides of the transmission belt. A retractable column is movably mounted in the rectangular clips, and the near sides of the two retractable columns are both provided with supporting side plates; A first auxiliary mounting plate is fixedly mounted on the rectangular clip, a second auxiliary mounting plate is fixedly mounted on the retractable column, a forward and reverse screw rod is rotatably connected to the first auxiliary mounting plate, and the forward and reverse screw rod is threadedly connected to the second auxiliary mounting plate, and one end of the forward and reverse screw rod is fixedly connected to an auxiliary rotating wheel.

10. The liquid cooling channel synchronous molding equipment for three-dimensional stacking of heterogeneous chips according to claim 9, characterized in that: The proximal sides of the two supporting side plates are both provided with protective pads.

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