Solar photovoltaic module with high heat dissipation performance

Abstract

The invention relates to a high-heat-dissipation solar photovoltaic module applied to the photovoltaic field, an existing back plate is improved, heat of the photovoltaic module is transferred to a coolant in the back plate through the heat transfer effect, the coolant is cooled through the refrigeration effect of a semiconductor refrigeration module, efficient heat dissipation of the photovoltaic module is achieved, and the service life of the photovoltaic module is prolonged. Heat of the side edge of the photovoltaic module is transferred into the coolant through the heat conduction strip, sealing failure caused by the influence of thermal expansion and cold contraction of the organic silicon sealing strip is effectively avoided, the heat of the photovoltaic module is absorbed through the multiple heat taxis columns distributed in an array mode, and when local high temperature happens to the photovoltaic module, the heat-induced deformation module is triggered by the high temperature to deform, so that the photovoltaic module is prevented from being damaged. When the photovoltaic module generates hot spots, the surrounding heat-sensitive columns gather towards a local high-temperature area, so that the heat transfer area is increased, the heat dissipation effect on the local high-temperature area is effectively enhanced, in addition, after the photovoltaic module generates the hot spots, the gathering effect of the heat-sensitive columns is further enhanced, and the destructive effect of the hot spots on the photovoltaic module is effectively delayed.

Description

TECHNICAL FIELD

[0001] The application relates to a high-heat-dissipation solar photovoltaic module, in particular to a high-heat-dissipation solar photovoltaic module applied to the photovoltaic field. BACKGROUND

[0002] Photovoltaic power generation is a clean energy, and does not generate any greenhouse gas emissions, especially zero carbon dioxide emissions. Compared with traditional thermal power, photovoltaic power generation significantly reduces greenhouse gas emissions. A photovoltaic module is an important component of a photovoltaic system, and high temperature is a main problem faced by the photovoltaic module in the operation process.

[0003] In order to solve the problem of high temperature of a solar photovoltaic panel, in the prior art, a high-heat-dissipation solar cell back plate with a publication number CN103681915B discloses a technology for improving the heat dissipation effect by using the heat conductivity of the material itself, but the heat conductivity of the material itself is also limited, and for the solar photovoltaic module used in a high-temperature area, this is obviously not enough. Therefore, a solar panel phase change liquid cooling composite heat dissipation device with a publication number CN112532178B introduces a device capable of high-efficiency heat dissipation.

[0004] Although the existing technology has a device capable of dissipating heat of the photovoltaic module, the existing heat dissipation device has a relatively complex structure, which increases the weight and production cost of the photovoltaic module, is not conducive to wide promotion and use, and when dust on the photovoltaic module is not cleaned in time, uneven distribution of the dust will cause local high temperature of the photovoltaic module. The existing heat dissipation device cannot make dynamic adjustment, leading to continuous deterioration of the local high temperature and permanent damage to the photovoltaic module. SUMMARY

[0005] In view of the above prior art, the technical problem to be solved by the application is how to make dynamic adjustment according to the local high temperature of the photovoltaic module to improve the heat dissipation effect of the local high temperature.

[0006] In order to solve the above problems, the present invention provides a high-heat dissipation solar photovoltaic module, including solar cells, EVA packaging films respectively bonded to the upper and lower sides of the solar cells, tempered glass bonded to the upper EVA packaging film, an aluminum frame pressed on the top of the tempered glass, a back panel plugged into the aluminum frame, and a junction box installed on the lower side of the back panel, the upper side wall of the back panel is fixedly inlaid with a thermal pad bonded to the EVA packaging film, the upper side of the back panel is provided with a slot matching the aluminum frame, and the lower end of the aluminum frame is fixed in the slot by bolts, and a sealing gasket is fixedly connected between the lower end of the aluminum frame and the slot, the side of the layered structure composed of the solar cells, the EVA packaging film and the tempered glass is also bonded with a silicone sealing strip, and the inner side of the aluminum frame is fixedly connected with an elastic pressure glue bonded to the silicone sealing strip. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device. The heat dissipation device is a heat dissipation device, and the heat dissipation device is a heat dissipation device.

[0007] In the above-mentioned high-heat-dissipating solar photovoltaic modules, by improving the back panel of the existing photovoltaic modules, distributed thermotropic columns are used to dissipate heat, and high temperature is used to trigger the deformation of the thermally deformable modules, so that multiple thermotropic columns gather towards the high-temperature area, thereby effectively improving the heat dissipation effect of the local high-temperature area.

[0008] As a further improvement of the present application, the lower end surface of the thermal pad penetrates into the heat dissipation cavity and is flush with the upper inner wall of the heat dissipation cavity, and the upper and lower ends of the heat-seeking column respectively contact and slide in connection with the lower end surface of the thermal pad and the lower inner wall of the heat dissipation cavity.

[0009] As a further improvement of the present application, the heat-seeking column includes a main heat absorber, a plurality of storage grooves opened on the side walls around the lower end of the main heat absorber, and an auxiliary heat absorber fixedly embedded in the middle of the main heat absorber, and the lower end of the auxiliary heat absorber is higher than the lower end surface of the main heat absorber, and a heat-conducting wire is fixedly connected between the auxiliary heat absorber and the thermally deformable component.

[0010] As a further improvement of the present application, the heat-induced deformation assembly is fixedly connected to the inner wall of the receiving groove, the heat-induced deformation assembly comprises a plurality of alternating fixedly connected shape memory segments and elastic connection segments, a heat transfer wire penetrating through the plurality of shape memory segments and elastic connection segments, and the heat transfer wire is fixedly connected with the heat-conducting wire, and the length of the shape memory segment is 2-3 times the length of the elastic connection segment.

[0011] As a further improvement of the present application, the elastic pressure adhesive tape is made of heat-resistant high-elasticity material, and the inner wall of the elastic pressure adhesive tape is fixedly embedded with a plurality of elastic compensation wires distributed at equal intervals and perpendicular to the organic silicon sealing strip.

[0012] As a further improvement of the present application, the four side walls of the main heat-absorbing body are also provided with mounting grooves, and the inner wall of the mounting groove is fixedly connected with a permanent magnet, the opposite two permanent magnets on the adjacent two main heat-absorbing bodies are attracted to each other, the arc-shaped sliding grooves are arranged on the inner walls of the two sides of the permanent magnet, and the arc-shaped sliding grooves are fixedly connected with a magnetic shielding film inside, the inner end of the magnetic shielding film is fixedly connected with a shape memory alloy wire between the inner wall of the arc-shaped sliding groove, and the end of the shape memory alloy wire away from the magnetic shielding film is fixedly connected with a heat-conducting band between the main heat-absorbing body.

[0013] As a further improvement of the present application, the mounting groove is located above the receiving groove, and the inner wall of the mounting groove and the side wall of the permanent magnet are also fixedly connected with a heat insulation pad.

[0014] As a further improvement of the present application, the lower end side wall of the back plate is also fixedly embedded with a heat dissipation mapping layer, and the heat dissipation mapping layer is a hollow structure, a plurality of follow-up position pads are slidingly connected inside the heat dissipation mapping layer, and the upper end surface of the heat dissipation mapping layer is made of a magnetic conductive material, and the lower end surface of the heat dissipation mapping layer is made of a transparent material, the upper end surface of the heat dissipation mapping layer penetrates into the inside of the heat dissipation cavity and is flush with the lower end inner wall of the heat dissipation cavity.

[0015] As a further improvement of the present application, the upper end surface of the follow-up position pad is magnetically attracted to the lower end surface of the heat-seeking column, and the lower end surface of the follow-up position pad is coated with a colored coating.

[0016] To summarize, by improving the existing backplane, the heat of the photovoltaic module is transferred to the coolant inside the backplane by utilizing the heat transfer effect, and the cooling effect of the semiconductor refrigeration component is used to cool the coolant, thereby achieving efficient heat dissipation of the photovoltaic module, and the heat on the side of the photovoltaic module is transferred to the coolant through the thermal conductive strip, effectively avoiding the silicone sealing strip from being affected by thermal expansion and contraction and causing sealing failure, and utilizing multiple array-distributed thermoplastic columns to absorb the heat of the photovoltaic module. When the photovoltaic module has a local high temperature, the high temperature is used to trigger the deformation of the thermally induced deformation component, causing the surrounding thermoplastic columns to gather toward the local high temperature area, thereby increasing the area of ​​heat transfer, thereby effectively enhancing the heat dissipation effect of the local high temperature area. In addition, when the photovoltaic module produces a hot spot, the gathering effect of multiple thermoplastic columns will be further enhanced, thereby effectively delaying the destructive effect of the hot spot on the photovoltaic module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional exploded view of a photovoltaic module according to the first embodiment of the present application; Figure 2 This is a bottom perspective view of the back panel of the first embodiment of the present application; Figure 3 The front partial cross-sectional views of the photovoltaic modules according to the first and third embodiments of the present application; Figure 4 A top view of the distribution of thermophilic columns according to the first embodiment of the present application; Figure 5 This is a top view of the first embodiment of the present application showing the heat-seeking pillars gathering together under a locally high temperature state of a photovoltaic module; Figure 6 This is a top view of the second embodiment of the present application showing the heat-seeking pillars gathering together when a hot spot is generated in a photovoltaic module; Figure 7 This is a front cross-sectional view of the heat-seeking column according to the first and second embodiments of the present application; Figure 8 A partial cross-sectional view of a thermally deformable component according to the first embodiment of the present application; Figure 9 A three-dimensional diagram of the thermophilic column according to the first and second embodiments of the present application; Figure 10 This is a top cross-sectional view of the magnetic isolation diaphragm of the second embodiment of the present application when it is opened; Figure 11 This is a top cross-sectional view of the magnetic isolation diaphragm of the second embodiment of the present application when closed.

[0018] Description of the numbers in the figure: 1 Solar cell, 2 EVA encapsulation film, 3 tempered glass, 4 aluminum frame, 401 sealing gasket, 5 back panel, 501 heat dissipation cavity, 502 coolant, 6 junction box, 7 thermal pad, 8 silicone sealing strip, 9 elastic pressing strip, 901 elastic compensation wire, 10 thermal strip, 11 heat-seeking column, 1101 main heat absorber, 1102 storage slot, 1103 installation slot, 12 semiconductor refrigeration component, 13 liquid-displacing propeller, 14 thermal deformation component, 1401 shape memory segment, 1402 elastic connecting segment, 1403 heat transfer wire, 15 auxiliary heat absorber, 16 permanent magnet block, 17 thermal insulation pad, 18 magnetic isolation diaphragm, 19 shape memory alloy wire, 20 thermal conductive tape, 21 heat mapping layer, 22 follow-up display pad. DETAILED DESCRIPTION

[0019] The following describes three implementation methods of the present application in detail with reference to the accompanying drawings.

[0020] The first implementation method: like Figure 1 、 2 As shown, a high heat dissipation solar photovoltaic module comprises a solar cell 1, an EVA encapsulating film 2 respectively bonded to the upper and lower sides of the solar cell 1, a tempered glass 3 bonded to the upper EVA encapsulating film 2, an aluminum frame 4 pressed on the tempered glass 3, a back plate 5 plugged into the aluminum frame 4, and a junction box 6 installed on one side below the back plate 5, the upper end side wall of the back plate 5 is fixedly inlaid with a thermal pad 7 bonded to the EVA encapsulating film 2, the thermal pad 7 can absorb the heat of the photovoltaic module and transfer the heat to the inside of the back plate 5, thereby dissipating heat for the photovoltaic module, the upper end side of the back plate 5 is provided with a slot matching the aluminum frame 4, and the lower end of the aluminum frame 4 is fixed in the slot by bolts, and a sealing gasket 401 is fixedly connected between the lower end of the aluminum frame 4 and the slot, and the aluminum frame 4 and the back plate 5 are assembled by plugging, which can improve the compressive strength of the entire photovoltaic module and effectively prevent damage to the photovoltaic module caused by extrusion and excessive tightening of bolts during transportation and installation; like Figure 3As shown, the side of the layered structure composed of the solar cell 1, EVA encapsulation film 2 and tempered glass 3 is also bonded with a silicone sealing strip 8, and the inner side of the aluminum frame 4 is fixedly connected to an elastic pressure-bonded strip 9 bonded to the silicone sealing strip 8. A thermal conductive strip 10 is embedded in the connection between the silicone sealing strip 8 and the elastic pressure-bonded strip 9. The elastic pressure-bonded strip 9 is made of a heat-resistant and highly elastic material (preferably a high-temperature resistant rubber material, and other materials can also be selected according to actual needs), and the inner wall of the elastic pressure-bonded strip 9 is fixedly inlaid with a plurality of elastic compensation wires 901 (preferably a polyurethane elastic material, and other materials can also be selected according to actual needs) distributed at equal intervals and perpendicular to the silicone sealing strip 8. The organic silicon sealing strip 8 is used to seal the sides of the photovoltaic module to prevent moisture and dust from entering the interior and affecting the performance of the photovoltaic module. The elastic pressure-bonding strip 9 forms a protective barrier on the outside of the organic silicon sealing strip 8 to prevent the organic silicon sealing strip 8 from cracking due to thermal expansion and contraction, effectively preventing the penetration of moisture and dust. Moreover, the elastic pressure-bonding strip 9 and the elastic compensation wire 901 rely on their own elasticity to adaptively compensate for the pressing force on the organic silicon sealing strip 8, further effectively preventing the formation of gaps. In addition, the thermal conductive strip 10 transfers the heat of the organic silicon sealing strip 8 to the interior of the back plate 5 for heat dissipation, thereby effectively improving the stability of the organic silicon sealing strip 8 in high-temperature environments. like Figure 3 、 4 As shown, the inner wall of the back plate 5 located just below the thermal pad 7 is provided with a heat dissipation cavity 501, and the lower end of the thermal conductive strip 10 penetrates into the heat dissipation cavity 501, and the heat dissipation cavity 501 is saturated with a coolant 502 (deionized water is preferred, and other coolants can also be selected according to actual needs). Considering that the photovoltaic modules are generally tilted during installation, if the coolant 502 is not fully filled, a gap will be generated in the upper part of the heat dissipation cavity 501, resulting in a vacuum area for the heat dissipation of the photovoltaic modules. Therefore, the coolant 502 must be saturated. In this way, whether the photovoltaic module is installed horizontally or tilted, the heat dissipation effect will not be affected. A plurality of array-type heat-seeking columns 11 are placed inside the heat dissipation cavity 501. The specific distribution density of the heat-seeking columns 11 is set according to the size of the photovoltaic module. When setting it specifically, the photovoltaic module can be divided into a plurality of power generation areas of equal size. Each heat-seeking column 11 is responsible for the heat dissipation of a power generation area. In this embodiment, in order to improve the heat dissipation effect, the distance between two adjacent heat-seeking columns 11 can be set to 1.5-2 times the diameter of the heat-seeking column 11. Figure 4As shown, a thermal deformation component 14 is connected between two adjacent heat-seeking columns 11, and the outermost multiple heat-seeking columns 11 are in contact with the inner wall of the heat dissipation cavity 501. The side wall of the lower end of the back plate 5 is fixedly inlaid with multiple semiconductor refrigeration components 12 distributed along the circumference of the back plate 5 (the specific model is selected according to actual needs and will not be repeated here). The cooling surface of the semiconductor refrigeration component 12 extends into the heat dissipation cavity 501 and is flush with the side inner wall of the heat dissipation cavity 501, and the heat dissipation surface of the semiconductor refrigeration component 12 is flush with the lower end surface of the back plate 5. The side inner wall of the heat dissipation cavity 501 is also fixedly inlaid with multiple groups of equally spaced liquid-driving propellers 13 (driven to rotate by a driving motor, the specific structure is the existing technology and will not be repeated here), and the line connecting the center points of the two opposite liquid-driving propellers 13 in each group is parallel to the ground. When the photovoltaic component is in working condition, as shown in FIG. Figure 3 As shown, first, the thermal pad 7 transfers the heat of the photovoltaic module to the thermal column 11, and the thermal column 11 then transfers the heat to the coolant 502. Multiple semiconductor refrigeration components 12 work simultaneously to cool the coolant 502. In order to allow the cold generated by the semiconductor refrigeration component 12 to be transferred to the middle of the thermal pad 7, the thrust of the liquid propeller 13 is used to make the coolant 502 flow inside the back plate 5. In this way, the cooled coolant 502 can diffuse to the middle of the thermal pad 7 to prevent the middle of the thermal pad 7 from not being able to dissipate heat in time and causing heat accumulation. In addition, most photovoltaic modules are installed at an angle. Therefore, in order to allow the coolant 502 to have a better flow effect, as shown in FIG. Figure 4 As shown, the propeller 13 propels the coolant 502 in a direction parallel to the ground, which can prevent the coolant 502 from losing some thrust due to overcoming gravity. In addition, in order to allow the heat dissipation surface of the semiconductor refrigeration component 12 to achieve a better heat dissipation effect, the heat dissipation surface of the semiconductor refrigeration component 12 should be installed on the back of the back plate 5, so that it can face the shade to achieve a better heat dissipation effect, thereby effectively maintaining the efficient cooling effect of the semiconductor refrigeration component 12. like Figure 3 As shown, the lower end surface of the thermal pad 7 penetrates into the heat dissipation cavity 501 and is flush with the upper inner wall of the heat dissipation cavity 501. The upper and lower ends of the heat-tending column 11 are respectively in contact with the lower end surface of the thermal pad 7 and the lower inner wall of the heat dissipation cavity 501 and are slidably connected. In the prior art, the EVA encapsulation film 2 is directly bonded to the back plate 5, and the heat of the photovoltaic module is exchanged with the outside air through the back plate 5. However, when the external environment is in high temperature weather, the heat dissipation effect of the back plate 5 is limited. In the present application, the EVA encapsulation film 2 is first bonded to the thermal pad 7, and the thermal pad 7 transfers the heat of the photovoltaic module to the coolant 502. The semiconductor refrigeration component 12 is used to cool the coolant 502 to achieve heat dissipation of the photovoltaic module. In this way, it is less affected by the external ambient temperature, thereby effectively improving the heat dissipation effect of the photovoltaic module. like Figure 7As shown, the heat-seeking column 11 includes a main heat absorber 1101, a plurality of storage grooves 1102 opened on the side walls around the lower end of the main heat absorber 1101, and an auxiliary heat absorber 15 fixedly embedded in the middle of the main heat absorber 1101, and the lower end of the auxiliary heat absorber 15 is higher than the lower end surface of the main heat absorber 1101. A thermal wire is fixedly connected between the auxiliary heat absorber 15 and the thermo-deformable component 14. During the heat dissipation of the photovoltaic component, the thermal pad 7 absorbs the heat of the photovoltaic component and transfers it to the main heat absorber 1101 and the auxiliary heat absorber 15. The main heat absorber 1101 continues to transfer the heat to the coolant 502 for heat dissipation, and most of the heat absorbed by the auxiliary heat absorber 15 is transferred to the thermo-deformable component 14, so that the thermo-deformable component 14 can shrink and deform after the heat reaches the deformation temperature. Figure 5 As shown, multiple heat-seeking columns 11 are gathered toward the high-temperature area. In order to enable the thermodeformable component 14 to respond promptly to the heat of the photovoltaic component, a separate auxiliary heat absorber 15 is provided to transfer the real-time heat of the photovoltaic component to the thermodeformable component 14. Moreover, in order to prevent the auxiliary heat absorber 15 from suffering a large amount of heat loss during the heat transfer process, the lower end of the auxiliary heat absorber 15 is wrapped in the main heat absorber 1101 and does not exchange heat with the coolant 502. In addition, the heat is directly transferred to the thermodeformable component 14 through the heat conductive wire, thereby preventing most of the heat from being transferred from the main heat absorber 1101 to the coolant 502, which would cause the thermodeformable component 14 to have a slow thermal deformation response. like Figure 8 As shown, the thermal deformation component 14 is fixedly connected to the inner wall of the storage groove 1102. The thermal deformation component 14 includes a plurality of alternately fixedly connected shape memory segments 1401 (made of shape memory alloy) and elastic connecting segments 1402 (made of silicone rubber, and other materials can also be selected according to actual needs), and a heat transfer wire 1403 that runs through the plurality of shape memory segments 1401 and the elastic connecting segments 1402. The heat transfer wire 1403 is fixedly connected to the heat conductive wire. The length of the shape memory segment 1401 is 2-1 / 2 of the length of the elastic connecting segment 1402. 3 times, since the thermo-deformable component 14 has a certain length, if the thermo-deformable component 14 is made of shape memory material, not only the manufacturing cost is high, but also the shrinkage deformation rate of the shape memory material of the whole is limited, which will limit the gathering effect of the multiple thermo-tendency columns 11. Therefore, the shape memory segment 1401 and the elastic connecting segment 1402 are alternately connected to form the thermo-deformable component 14. This not only reduces the cost, but also when the multiple thermo-tendency columns 11 gather towards the local high temperature area, the thermo-deformable component 14 will not hinder the movement of the thermo-tendency columns 11 in other areas. In addition, if Figure 4 、 5 As shown, the addition of the elastic connecting section 1402 enables the thermally deformable component 14 to have a certain elastic reset ability. After the heat of the photovoltaic module returns to a normal level, the multiple heat-seeking columns 11 can reset themselves and continue to dissipate heat for the entire photovoltaic module. In this embodiment, when the surface of the photovoltaic module is covered with dust, the dust forms an insulating layer on the surface of the photovoltaic module, which, on the one hand, hinders the normal heat dissipation of the module, and on the other hand, the dust accumulation will increase the thermal resistance of the photovoltaic module, resulting in an increase in the operating temperature. Therefore, if the dust is not cleaned in time, the photovoltaic module will generate local high temperature. When the local high temperature occurs, the heat is transferred to the auxiliary heat absorber 15 through the thermal pad 7, and the auxiliary heat absorber 15 then transfers the heat to the heat transfer wire 1403. When the temperature exceeds the deformation temperature of the shape memory segment 1401, it begins to shrink and deform, such as Figure 5 As shown, the surrounding thermophilic columns 11 are gathered to the local high-temperature area. Compared with the existing technology, the gathered thermophilic columns 11 can increase the area of ​​heat transfer in the local high-temperature area, thereby effectively improving the heat exchange efficiency, thereby enhancing the heat dissipation effect in the high-temperature area, avoiding damage to the photovoltaic components due to continuous local high temperature, and playing a protective role in actual use scenarios where dust cannot be cleaned in time. In addition, the setting threshold of the deformation temperature of the shape memory segment 1401 is set according to the temperature of the photovoltaic component when local high temperature occurs, which will not be repeated here.

[0021] Second implementation method: This embodiment further optimizes and improves the gathering effect of the heat-seeking pillars 11 based on the first embodiment, thereby meeting the heat dissipation requirements of the photovoltaic module when a hot spot occurs and avoiding permanent damage to the photovoltaic module. The rest of the parts remain the same as the first embodiment. like Figure 7 、 9 As shown, the side walls around the main heat absorber 1101 are respectively provided with mounting grooves 1103, and the inner walls of the mounting grooves 1103 are fixedly connected with permanent magnet blocks 16. The two permanent magnet blocks 16 located on the two adjacent main heat absorbers 1101 attract each other. The inner walls of the mounting grooves 1103 on both sides of the permanent magnet blocks 16 are provided with arc-shaped sliding grooves, and the inner side of the arc-shaped sliding grooves is sealed and slidably connected with a magnetic isolation diaphragm 18. A shape memory alloy wire 19 is fixedly connected between the inner end of the magnetic isolation diaphragm 18 and the inner wall of the arc-shaped sliding groove, and the end of the shape memory alloy wire 19 away from the magnetic isolation diaphragm 18 is fixedly connected to the auxiliary heat absorber. A conductive tape 20 is fixedly connected between 15. When the photovoltaic module is blocked by unevenly distributed dust, bird droppings, leaves, snow, dirt and other surface foreign matter, the foreign matter forms a shadow area on the surface of the module. The shaded battery cell becomes a load because it cannot generate electricity, consumes the electricity generated by other battery cells and generates heat rapidly. At this time, the further increase in temperature causes the shape memory alloy wire 19 to shrink and deform. The deformation of the shape memory alloy wire 19 pulls the magnetic isolation diaphragm 18 into the interior of the arc-shaped slide groove. The two magnetic isolation diaphragms 18 open to allow the two opposite permanent magnet blocks 16 located on the two adjacent heat-seeking columns 11 to be magnetically attracted, as shown in FIG. Figure 6As shown, the plurality of heat-seeking columns 11 further gather together under the magnetic attraction, thereby effectively enhancing the heat dissipation effect on the hot spot area, which can effectively delay the permanent damage of the hot spot to the photovoltaic module in the case of untimely inspection. In this stage, as shown, Figure 7 、 10 As shown, the auxiliary heat-absorbing body 15 transmits heat to the shape memory alloy wire 19 through the heat-conducting band 20. In the initial state, as shown, Figure 11 As shown, the two magnetic shielding films 18 are combined with each other to shield the permanent magnet block 16, so that there is no magnetic attraction between the two opposite heat-seeking columns 11, as shown, Figure 10 When the temperature reaches the deformation temperature of the shape memory alloy wire 19, the shape memory alloy wire 19 starts to shrink and deform, thereby pulling the magnetic shielding film 18 into the arc-shaped sliding groove, allowing the two opposite permanent magnet blocks 16 to be attracted to each other, so that the adjacent plurality of heat-seeking columns 11 gather together. In addition, the set threshold of the deformation temperature of the shape memory alloy wire 19 is set according to the temperature of the photovoltaic module when the hot spot occurs, which will not be described here; It should be noted that during the gathering of the plurality of heat-seeking columns 11, the redundant space of the receiving groove 1102 can provide space for the heat-induced deformation assembly 14, so as not to hinder the gathering of the two heat-seeking columns 11. In addition, the temperature of the photovoltaic module after the hot spot occurs is higher than that when the local high temperature occurs. Therefore, the heat-induced deformation assembly 14 has deformed before the shape memory alloy wire 19 deforms, so that the heat-induced deformation assembly 14 does not hinder the gathering of the heat-seeking columns 11. The mounting groove 1103 is located above the receiving groove 1102, and the inner wall of the mounting groove 1103 is fixedly connected with the side wall of the permanent magnet block 16 and the heat-insulating pad 17. In order to avoid the weakening of the magnetism of the permanent magnet block 16 due to high temperature, the heat-insulating pad 17 is used to isolate the permanent magnet block 16 from the main heat-absorbing body 1101; The embodiment can make the plurality of heat-seeking columns 11 concentrate below the hot spot area after the photovoltaic module is blocked by surface foreign matter and hot spots occur. Compared with the first embodiment, the heat-seeking columns 11 can be gathered more densely, thereby increasing the number of heat-seeking columns 11 and further enhancing the heat dissipation effect. Compared with the prior art, the damage of the hot spot to the photovoltaic module can be delayed by strengthening the heat dissipation in the case of not detecting the hot spot in time, thereby effectively prolonging the service life of the photovoltaic module. In addition, the total weight of the back plate 5 in the embodiment is heavier than that in the prior art, but it is suitable for use in scenes with strong wind all year round. The increase in the total weight of the back plate 5 increases the stability of the photovoltaic module in strong wind, so that the photovoltaic module does not shake greatly due to wind, thereby effectively avoiding damage to the photovoltaic module.

[0022] Third embodiment: This embodiment optimizes and improves the clustering of the thermophilic columns 11 based on the first and second embodiments, so that maintenance personnel can intuitively check the clustering of the thermophilic columns 11 during inspections and take corresponding solutions. The rest of the embodiments remain the same as the first and second embodiments. like Figure 3 As shown, the lower side wall of the back plate 5 is also fixedly inlaid with a heat dissipation mapping layer 21, and the heat dissipation mapping layer 21 is a hollow structure. The interior of the heat dissipation mapping layer 21 is slidably connected with a plurality of follow-up position indicating pads 22 respectively facing the plurality of heat-seeking columns 11. The upper end surface of the heat dissipation mapping layer 21 is a magnetic conductive material, and the lower end surface of the heat dissipation mapping layer 21 is a transparent material. The upper end surface of the heat dissipation mapping layer 21 penetrates into the heat dissipation cavity 501 and is flush with the lower end inner wall of the heat dissipation cavity 501. The upper end surface of the follow-up position indicating pad 22 is aligned with the lower end wall of the heat-seeking column 11. The end faces are magnetically attracted, and the lower end face of the follow-up position indicating pad 22 is coated with a colored coating. When the heat-seeking columns 11 gather and move, the heat-seeking columns 11 drive the follow-up position indicating pad 22 to move through the magnetic attraction force. The follow-up position indicating pad 22 can directly map the gathering situation of the heat-seeking columns 11. Considering that photovoltaic modules are generally installed at an angle, when maintenance personnel are inspecting, they can know whether the photovoltaic modules have local high temperature or hot spots by checking the distribution of the follow-up position indicating pad 22, so that corresponding measures can be taken in time. Compared with the existing inspection methods using infrared thermal imagers, drones, etc., this implementation allows maintenance personnel to know the working status of photovoltaic modules without the help of any inspection equipment, effectively reducing the investment cost of photovoltaic modules and suitable for large-scale promotion and use.

[0023] In view of current actual needs, the protection scope of the above-mentioned implementation mode adopted in this application is not limited to this. Various changes made within the knowledge scope of technical personnel in this field without departing from the concept of this application still fall within the protection scope of the present invention.

Claims

1. A solar photovoltaic module with high heat dissipation, characterized by: The invention comprises a solar cell (1), an EVA encapsulating film (2) respectively bonded to the upper and lower sides of the solar cell (1), a tempered glass (3) bonded to the upper EVA encapsulating film (2), an aluminum frame (4) pressed on the upper side of the tempered glass (3), a back plate (5) plugged into the aluminum frame (4), and a junction box (6) installed on one side below the back plate (5), wherein the upper side wall of the back plate (5) is fixedly inlaid with a thermal pad (7) bonded to the EVA encapsulating film (2), and the upper side of the back plate (5) is provided with a heat conducting pad (7) bonded to the aluminum frame (4). The lower end of the aluminum frame (4) is fixed in the slot by bolts, a sealing gasket (401) is fixedly connected between the lower end of the aluminum frame (4) and the slot, a silicone sealing strip (8) is bonded to the side of the layered structure composed of the solar cell (1), the EVA packaging film (2) and the tempered glass (3), and an elastic pressure-bonding strip (9) bonded to the silicone sealing strip (8) is fixedly connected to the inner side of the aluminum frame (4), and a heat-conducting strip (10) is embedded in the connection between the silicone sealing strip (8) and the elastic pressure-bonding strip (9); The inner wall of the back plate (5) located directly below the thermal pad (7) is provided with a heat dissipation cavity (501), and the lower end of the thermal conductive strip (10) penetrates into the heat dissipation cavity (501), the heat dissipation cavity (501) is saturated with a coolant (502), a plurality of array-distributed heat-seeking columns (11) are placed inside the heat dissipation cavity (501), and a thermal deformation component (14) is connected between two adjacent heat-seeking columns (11), the outermost plurality of heat-seeking columns (11) are in contact with the inner wall of the heat dissipation cavity (501), and the back plate (5) is provided with a heat-seeking column (11). The side wall of the lower end is fixedly inlaid with a plurality of semiconductor refrigeration components (12) distributed along the circumference of the back plate (5), the refrigeration surface of the semiconductor refrigeration component (12) extends into the heat dissipation cavity (501) and is flush with the side inner wall of the heat dissipation cavity (501), and the heat dissipation surface of the semiconductor refrigeration component (12) is flush with the lower end surface of the back plate (5), and the side inner wall of the heat dissipation cavity (501) is also fixedly inlaid with a plurality of groups of liquid-driving propellers (13) distributed at equal intervals, and the line connecting the center points of the two opposite liquid-driving propellers (13) in each group is parallel to the ground.

2. A high heat dissipation solar photovoltaic module according to claim 1, characterized in that: The lower end surface of the thermal pad (7) penetrates into the heat dissipation cavity (501) and is flush with the upper inner wall of the heat dissipation cavity (501), and the upper and lower ends of the heat-seeking column (11) are in contact with and slidably connected to the lower end surface of the thermal pad (7) and the lower inner wall of the heat dissipation cavity (501), respectively.

3. The high heat dissipation solar photovoltaic module according to claim 1, characterized in that: The heat-seeking column (11) comprises a main heat-absorbing body (1101), a plurality of receiving grooves (1102) provided on the side walls around the lower end of the main heat-absorbing body (1101), and an auxiliary heat-absorbing body (15) fixedly embedded in the middle of the main heat-absorbing body (1101), wherein the lower end of the auxiliary heat-absorbing body (15) is higher than the lower end surface of the main heat-absorbing body (1101), and a heat-conducting wire is fixedly connected between the auxiliary heat-absorbing body (15) and the thermal deformation component (14).

4. The high heat dissipation solar photovoltaic module according to claim 3, characterized in that: The thermally deformable component (14) is fixedly connected to the inner wall of the storage groove (1102), and the thermally deformable component (14) comprises a plurality of shape memory segments (1401) and elastic connecting segments (1402) that are alternately fixedly connected, and a heat transfer wire (1403) that passes through the plurality of shape memory segments (1401) and the elastic connecting segments (1402), wherein the heat transfer wire (1403) is fixedly connected to the heat conducting wire, and the length of the shape memory segment (1401) is 2-3 times the length of the elastic connecting segment (1402).

5. The high heat dissipation solar photovoltaic module according to claim 1, characterized in that: The elastic pressure-bonding strip (9) is made of a heat-resistant and highly elastic material, and the inner wall of the elastic pressure-bonding strip (9) is fixedly inlaid with a plurality of elastic compensation wires (901) distributed at equal intervals and perpendicular to the organic silicon sealing strip (8).

6. The high heat dissipation solar photovoltaic module according to claim 3, characterized in that: The side walls around the main heat absorber (1101) are also respectively provided with mounting grooves (1103), and the inner walls of the mounting grooves (1103) are fixedly connected with permanent magnet blocks (16), and the two opposite permanent magnet blocks (16) located on the two adjacent main heat absorbers (1101) attract each other, and the inner walls of the mounting grooves (1103) on both sides of the permanent magnet blocks (16) are provided with arc-shaped sliding grooves, and the arc-shaped sliding grooves are sealed and slidably connected with magnetic isolation diaphragms (18), and a shape memory alloy wire (19) is fixedly connected between the inner end of the magnetic isolation diaphragm (18) and the inner wall of the arc-shaped sliding groove, and a heat conductive belt (20) is fixedly connected between the end of the shape memory alloy wire (19) away from the magnetic isolation diaphragm (18) and the auxiliary heat absorber (15).

7. The high heat dissipation solar photovoltaic module according to claim 6, characterized in that: The installation groove (1103) is located above the receiving groove (1102), and a heat insulation pad (17) is fixedly connected between the inner wall of the installation groove (1103) and the side wall of the permanent magnet block (16).

8. The high heat dissipation solar photovoltaic module according to claim 1, characterized in that: The lower side wall of the back plate (5) is also fixedly inlaid with a heat dissipation mapping layer (21), and the heat dissipation mapping layer (21) is a hollow structure. The interior of the heat dissipation mapping layer (21) is slidably connected with a plurality of follow-up position display pads (22) respectively facing the plurality of heat-seeking columns (11). The upper end surface of the heat dissipation mapping layer (21) is made of a magnetic conductive material, and the lower end surface of the heat dissipation mapping layer (21) is made of a transparent material. The upper end surface of the heat dissipation mapping layer (21) penetrates into the heat dissipation cavity (501) and is flush with the lower end inner wall of the heat dissipation cavity (501).

9. The high heat dissipation solar photovoltaic module according to claim 8, characterized in that: The upper end surface of the follow-up position display pad (22) is magnetically attracted to the lower end surface of the thermophilic column (11), and the lower end surface of the follow-up position display pad (22) is coated with a colored coating.

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