Efficient cutting device and cutting method for LED wafer

Abstract

The invention discloses an efficient cutting device and method for an LED wafer, and relates to the technical field of wafer machining. The efficient cutting device comprises a machine body, a bearing table, an outer driving component, a supporting component, a mounting shaft, a cutter and an adjusting device; the machine body comprises a machine base and a machine cover. A first telescopic component and a second telescopic component are arranged in the machine cover. An output shaft of the outer driving part is connected with the mounting shaft; one end, far away from the outer driving part, of the mounting shaft is detachably connected with the supporting part; a plurality of cutters are arranged on the mounting shaft at equal intervals; a mounting groove is formed in the mounting shaft in the length direction, and the end, away from the outer driving component, of the mounting shaft is in threaded connection with a sealing cap; an abutting block is arranged on the inner wall of the cutter, and the cutter is arranged on the mounting groove through the abutting block; the adjusting device is arranged on the mounting shaft and is used for adjusting the distance between two adjacent cutters; the technical effects that the wafers do not need to be cut for multiple times in the transverse direction and the vertical direction in the wafer cutting process, and the wafer cutting efficiency is improved are achieved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of wafer processing, in particular to an efficient cutting device and cutting method for LED wafers. BACKGROUND

[0002] Monocrystalline silicon is a relatively active non-metallic element, is an important part of crystal materials, is at the forefront of new material development, and is mainly used as a semiconductor material and for photovoltaic power generation, heat supply and the like by using solar energy. Monocrystalline silicon can be used for the production and deep processing manufacturing of diode-grade, rectifier device-grade, circuit-grade and solar cell-grade monocrystalline products. When monocrystalline silicon is used for LEDs, the monocrystalline silicon needs to be cut into silicon wafers, and the silicon wafers need to be cut into specified sizes for convenient transportation and use. In the prior art, the silicon wafers need to be fixed under a cutting mechanism for cutting.

[0003] The existing wafer cutting methods mainly include three kinds: diamond knife method, laser etching method and diamond grinding wheel method. The diamond grinding wheel method is characterized by high efficiency and low residual stress by high-speed rotation of the diamond grinding wheel. However, the current process only installs one piece of diamond grinding wheel on the grinding wheel, which needs to be drawn many times in the horizontal and vertical directions on the wafer to complete the cutting of one wafer, and the efficiency is low. SUMMARY

[0004] The application provides an efficient cutting device and cutting method for LED wafers, which solves the technical problem of low efficiency in the prior art that the wafer needs to be drawn many times in the horizontal and vertical directions to complete the cutting of one wafer. The technical effect of improving the wafer cutting efficiency is achieved without drawing the wafer many times in the horizontal and vertical directions during the wafer cutting process.

[0005] The utility model provides a high -efficient cutting device for LED wafer, including machine body, bearing station, outer driven part, support part, mounting shaft, cutter and adjusting device, machine body includes machine base and machine cover, and bearing station sets up on machine base, the inside of machine cover is provided with telescopic part no.

[0006] Preferably, the bearing table includes a base plate, a rotating disc, a translation plate, and a placement plate. The base plate is installed on the machine base, and the rotating disc is rotatably arranged on the base plate. The translation plate is slidably arranged on the rotating disc, and the placement plate is slidably arranged on the translation plate. The placement plate translates along the length direction of the translation plate, and the translation plate translates along the width direction of itself on the rotating disc.

[0007] Preferably, the cutter includes two annular clamping pieces and a replaceable blade. The abutting blocks are arranged on the inner circle of the clamping pieces. The blade has a circular opening in the center, and the inner diameter of the clamping piece is the same as the outer diameter of the mounting shaft. The inner diameter of the blade is the same as the inner diameter of the clamping piece. Each clamping piece is provided with an abutting block. When the two clamping pieces clamp the blade, the abutting blocks on the two clamping pieces are oppositely arranged.

[0008] Preferably, the adjusting device includes multiple groups of adjusting pads. Each group of adjusting pads includes multiple adjusting pads. The adjusting pads are annular structures, and are slidably arranged on the mounting shaft. One adjusting pad is arranged between adjacent two cutters.

[0009] Preferably, the adjusting device includes an inner driving part, an adjusting shaft, and multiple adjusting blocks. The inner driving part is arranged inside the mounting shaft away from the closed cap. The output shaft of the inner driving part is coaxially connected with the adjusting shaft. The adjusting shaft is coaxially arranged with the mounting shaft, and the cross-sectional shape of the adjusting shaft is not circular. The adjusting blocks are provided with sliding openings, and the adjusting shaft passes through the adjusting blocks through the sliding openings.

[0010] Preferably, the thickness of the adjusting block is uneven, one side of the adjusting block is an adjusting surface, a plurality of convex ends are uniformly arranged on the adjusting surface, and the thickness of the adjusting block part from any convex end to another convex end in the same rotation direction decreases; the number of convex ends on the adjusting block is the same as that of the abutting blocks on the clamping sheet and corresponds to each other.

[0011] Preferably, the number of mounting grooves is two, and the two mounting grooves are oppositely arranged; two convex ends are symmetrically arranged on the adjusting surface.

[0012] Preferably, the thickness of the adjusting block part from any convex end to another convex end in the same rotation direction on the adjusting surface decreases, which can be stepwise or continuous.

[0013] A high-efficiency cutting method for an LED wafer, which is matched with the high-efficiency cutting device for the LED wafer as described above, comprises the following steps of: The worker unscrews the closing cap from the mounting shaft, and then controls the second telescopic part to move away from the first telescopic part, so that the supporting part is separated from the mounting shaft; The worker installs a proper number of cutters and adjusting devices on the mounting shaft in sequence, places enough cutters and adjusting devices, selects a proper spring, and then controls the second telescopic part to return to the original position, so that the supporting part supports the mounting shaft away from the end of the outer driving part again, and finally the worker screws the closing cap on the mounting shaft again; The worker places the wafer to be cut on the bearing table, and then controls the outer driving part to drive the plurality of cutters on the mounting shaft to rotate; the plurality of cutters cut the wafer synchronously, and the cutting path is controlled by the translation of the bearing table; when the wafer is cut transversely, the bearing table drives the wafer to rotate by 90 degrees, and the wafer is cut again; After the cutting is completed, the cut product is taken out and placed in the next wafer to be cut for cutting.

[0014] The one or more technical solutions provided in the application have at least the following technical effects or advantages: By equidistantly arranging a plurality of cutters on the mounting shaft and adjusting the distance between the cutters through the adjusting device, the plurality of cutters cut the wafer simultaneously, effectively solving the technical problem of low efficiency in the prior art that a wafer needs to be cut many times in the horizontal and vertical directions respectively to complete the cutting of one wafer; and the technical effect of not needing to cut a wafer many times in the horizontal and vertical directions respectively during the cutting of the wafer is achieved, and the cutting efficiency of the wafer is improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 FIG. 1 is a schematic diagram of the body of the high-efficiency cutting device for the LED wafer and the cutting method of the application; Figure 2Positioning diagram of the bearing table of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 3 Structure diagram of the bearing table of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 4 Internal structure diagram of the machine cover of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 5 Structure diagram of the mounting shaft of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 6 Structure diagram of the cutter of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 7 Assembly diagram of the cutter and the mounting shaft of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 8 Diagram of the adjusting pad of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 9 Assembly diagram of the inner driving part and the adjusting shaft of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 10 Diagram of the adjusting block of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 11 Assembly diagram of the adjusting block and the adjusting shaft of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 12 Assembly diagram of the cutter and the adjusting shaft of the high-efficiency cutting device and cutting method for LED wafer of the present application; Figure 13 Assembly diagram of the contact block and the adjusting shaft of the high-efficiency cutting device and cutting method for LED wafer of the present application.

[0016] In the figure: 100, machine body; 110, machine base; 120, machine cover; 121, observation door; 122, telescopic part one; 123, telescopic part two; 200, bearing table; 210, bottom plate; 220, rotating disc; 230, translation plate; 240, placement plate; 300, outer driving part; 400, supporting part; 500, mounting shaft; 510, mounting groove; 520, closing cap; 600, cutter; 610, clamping piece; 611, contact block; 620, blade; 710, adjusting pad; 720, inner driving part; 730, adjusting shaft; 740, adjusting block. DETAILED DESCRIPTION

[0017] For the purpose of promoting an understanding of the application, the application will now be described in greater detail with reference to the figures. The preferred embodiments of the application are illustrated in the figures, which are described in greater detail below. The application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and fully convey the scope of the application to those skilled in the art.

[0018] It should be noted that the terms "vertical", "horizontal", "upper", "lower", "left", "right", and similar terms as used herein are for the purpose of illustration only and are not intended to be limiting.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the use of the terms "and / or" includes a combination of one or more of the associated listed items.

[0020] Embodiment: As shown in the figure, the high-efficiency cutting device for LED wafer of the present application comprises a machine body 100, a bearing table 200, an external driving component 300, a support component 400, a mounting shaft 500, a cutter 600, a power assembly and a control unit. Figures 1 to 13

[0021] The power assembly is used to provide energy for the operation of the cutting device, preferably an alternating current power supply or a battery; the control unit is used to control the coordinated operation of the components of the cutting device, preferably a programmable logic controller; both are prior art and will not be described here.

[0022] The machine body 100 comprises a machine base 110 and a machine cover 120, and the machine cover 120 is installed above the machine base 110.

[0023] The bearing table 200 is arranged on the machine base 110, and the bearing table 200 is located inside the machine cover 120.

[0024] It should be noted that the bearing table 200 is a translation table, and the wafer to be cut is placed on the translation table, and the bearing table 200 can drive the wafer to move in two dimensions.

[0025] Among them, the side wall of the machine cover 120 can be provided with an observation door 121, and the observation door 121 is used to facilitate observation by relevant personnel.

[0026] The inside of the machine cover 120 is provided with a telescopic component one 122 and a telescopic component two 123; the top end of the telescopic component one 122 is fixed on the inner top wall of the machine cover 120, and the bottom of the telescopic component one 122 is connected with the external driving component 300.

[0027] ​The top end of the second telescopic component 123 is slidingly arranged on the inner top wall of the machine cover 120, and the bottom of the first telescopic component 122 is detachably connected with the support component 400.

[0028] The second telescopic component 123 is located on the side close to the observation door 121.

[0029] The output shaft of the outer driving component 300 is connected with the mounting shaft 500, and the end of the mounting shaft 500 away from the outer driving component 300 is detachably connected with the support component 400.

[0030] The mounting shaft 500 is horizontally arranged, and the sliding direction of the second telescopic component 123 is the same as the length direction of the mounting shaft 500.

[0031] The outer driving component 300 can be a driving motor, and the first telescopic component 122 and the second telescopic component 123 can be electric telescopic rods or telescopic cylinders.

[0032] It should be noted that the second telescopic component 123 can be slidingly arranged in the machine cover 120 through a linear module or an electric sliding rail structure.

[0033] A plurality of cutters 600 are equidistantly arranged on the mounting shaft 500.

[0034] Further, in another embodiment of the present application, as shown in Figure 3 The bearing table 200 includes a chassis 210, a rotating disc 220, a translation plate 230 and a placement plate 240.

[0035] The chassis 210 is mounted on the machine base 110, and the rotating disc 220 is rotationally arranged on the chassis 210.

[0036] It should be noted that the chassis 210 is provided with a rotating motor, and the output shaft of the rotating motor is coaxially connected with the rotating disc 220, so that the rotating motor drives the rotating disc 220 to rotate.

[0037] The translation plate 230 is slidingly arranged on the rotating disc 220, and the placement plate 240 is slidingly arranged on the translation plate 230.

[0038] The placement plate 240 translates along the length direction of the translation plate 230, and the translation plate 230 translates on the rotating disc 220 along the width direction of itself.

[0039] It should be noted that the placement plate 240 can be slidingly arranged on the translation plate 230 through a linear module or an electric sliding rail structure, and the translation plate 230 can be slidingly arranged on the rotating disc 220 through a linear module or an electric sliding rail structure.

[0040] It should be noted that the placing plate 240 can limit the wafer to be cut by a fixing clamp (not shown in the figure) or negative pressure adsorption, and such a limiting structure is a common structure in the prior art, which will not be described here.

[0041] The machine base 110 also has a liquid spraying system, a liquid spraying head and its components for spraying cutting liquid during wafer cutting. Such a liquid spraying system, a liquid spraying head and its components are common structures in the prior art, which will not be described here.

[0042] It can be understood that the relevant personnel open the observation door 121, place the wafer to be cut on the placing plate 240, and then control the outer driving part 300 to drive the plurality of cutters 600 on the mounting shaft 500 to rotate; the plurality of cutters 600 synchronously cut the wafer, and the cutting path is controlled by the translation of the placing plate 240 on the translation plate 230 and the translation of the translation plate 230 on the rotating disc 220, and when the wafer is transversely cut, the base plate 210 drives the rotating disc 220 to rotate by 90 degrees to cut the wafer again.

[0043] The cutting depth of the cutter 600 can be controlled by the first telescopic part 122 and the second telescopic part 123.

[0044] In another embodiment of the present application, as shown in Figure 5 The mounting shaft 500 is provided with a mounting groove 510 along the length direction, and a closing cap 520 is threadedly connected to the end of the mounting shaft 500 away from the outer driving part 300.

[0045] It should be noted that the mounting shaft 500 is a circular shaft, the closing cap 520 is a hollow cylinder with an open end, and the inner wall of the closing cap 520 is provided with an internal thread, and the outer wall of the corresponding end of the mounting shaft 500 is provided with an external thread engaged with the internal thread.

[0046] The inner wall of the cutter 600 is provided with an abutting block 611 corresponding to the mounting groove 510, and the cutter 600 is arranged on the mounting groove 510 through the abutting block 611 and can slide on the mounting shaft 500 along the mounting groove 510.

[0047] The cutter 600 includes two annular clamping pieces 610 and a replaceable blade 620, and the abutting block 611 is arranged on the inner circle of the clamping piece 610.

[0048] It should be noted that the blade 620 is provided with a circular opening at the center, the inner diameter of the clamping piece 610 is the same as the outer diameter of the mounting shaft 500, and the inner diameter of the blade 620 is the same as the inner diameter of the clamping piece 610. Such a blade 620 is a common structure in the prior art, which will not be described here.

[0049] It should be noted that each clamping piece 610 is provided with a resistance block 611. When the two clamping pieces 610 clamp the blade 620, the resistance blocks 611 on the two clamping pieces 610 are arranged relative to each other, and the two resistance blocks 611 can be spliced ​​together or there can be a gap. The specific setting method can be selected according to actual needs and will not be described in detail here.

[0050] The mounting shaft 500 is a hollow cylinder with one end open. A spring (not shown) may be placed inside the mounting shaft 500 . One end of the spring contacts the inner wall of the closing cap 520 , while the other end of the spring supports the tool 600 .

[0051] It should be noted that multiple springs of different specifications can be designed, and the lengths and elastic coefficients of the multiple springs can be different. By using springs of different specifications, different numbers and spacings of tools 600 can be matched.

[0052] The present application also includes an adjustment device provided on the mounting shaft 500 for adjusting the distance between two adjacent cutting tools 600 .

[0053] like Figure 8 As shown, in one embodiment of the present application, the adjustment device includes multiple groups of adjustment pads 710 , and each group of adjustment pads 710 includes multiple adjustment pads 710 .

[0054] The adjustment pad 710 is an annular structure. The adjustment pad 710 is slidably sleeved on the mounting shaft 500 , and one adjustment pad 710 is disposed between two adjacent cutting tools 600 .

[0055] In this embodiment, an adjustment pad 710 is provided between the cutter 600 close to the closing cap 520 and the spring.

[0056] It should be noted that the inner circle radius of the adjustment pad 710 is the same as the outer radius of the mounting shaft 500, and the adjustment pad 710 is detachably slidably set on the mounting shaft 500. Multiple groups of adjustment pads 710 are designed into groups of adjustment pads 710 of various specifications. The length of each group of adjustment pads 710 is different. By placing the adjustment pad 710 between the two tools 600, the spacing between the tools 600 can be adjusted.

[0057] It should be noted that, in this embodiment, the support component 400 and the mounting shaft 500 are detachably connected. The support component 400 may be a bearing and its components, which are common structures in the prior art and will not be described in detail here.

[0058] It can be understood that in the embodiment, the relevant personnel can install different numbers of cutters 600 according to actual needs, first unscrew the closing cap 520 from the mounting shaft 500, then control the second telescopic part 123 to move away from the first telescopic part 122, so that the supporting part 400 is separated from the mounting shaft 500; the relevant personnel install a plurality of cutters 600 and a plurality of abutting blocks 611 on the mounting shaft 500 in turn, wherein the abutting blocks 611 of the cutters 600 slide on the mounting shaft 500 along the mounting groove 510, and the abutting blocks 611 are coaxially placed in the mounting shaft 500, so that one abutting block 611 is placed in the adjacent two cutters 600; after placing a sufficient number of cutters 600 and adjusting pads 710, a suitable spring is selected and placed in the mounting shaft 500, then the second telescopic part 123 is controlled to return to the original position, so that the supporting part 400 supports the mounting shaft 500 away from the one end of the outer driving part 300 again, and finally the closing cap 520 is tightened on the mounting shaft 500 again, under the supporting force of the spring, the plurality of cutters 600 and the plurality of adjusting pads 710 are abutted together and it is difficult to shift position; similarly, when the cutters 600 need to be removed, the above steps are repeated to remove the cutters 600 and the adjusting pads 710 one by one.

[0059] By setting the split cutters 600 and the mounting shaft 500, the cutters 600 can be disassembled and replaced, and the appropriate number of cutters 600 can be selected according to actual needs; by setting the adjusting pad 710, the distance between the cutters 600 can be adjusted to adapt to different cutting needs.

[0060] As shown in Figure 5 , Figure 7 , Figures 9 to 13 In another embodiment of the present application, the adjusting device includes an inner driving part 720, an adjusting shaft 730 and a plurality of adjusting blocks 740.

[0061] The inner driving part 720 is arranged inside the mounting shaft 500 away from the closing cap 520, and the output shaft of the inner driving part 720 is coaxially connected with the adjusting shaft 730.

[0062] The inner driving part 720 can be an electric motor.

[0063] It should be noted that the inner driving part 720 can be a small high-torque motor, and has the functions of forward and reverse rotation and self-locking. The middle part is a common structure in the prior art, which will not be described here.

[0064] The adjusting shaft 730 is coaxially arranged with the mounting shaft 500, and the cross-sectional shape of the adjusting shaft 730 is not circular.

[0065] Optionally, the abutting blocks 611 on the cutters 600 in the embodiment can slide and abut on the adjusting shaft 730.

[0066] The adjustment block 740 is disposed between two adjacent cutting tools 600 , and the adjustment block 740 is coaxially disposed on the adjustment shaft 730 .

[0067] In this embodiment, an adjustment block 740 is provided between the cutter 600 close to the closing cap 520 and the spring.

[0068] The adjusting block 740 is provided with a sliding opening, and the adjusting shaft 730 passes through the adjusting block 740 through the sliding opening.

[0069] The shape of the sliding opening corresponds to the cross-sectional shape of the adjustment shaft 730 .

[0070] It should be noted that the cross-sectional shape of the adjustment shaft 730 may be an ellipse (eg Figure 9 As shown in the figure), it can also be a polygon (not shown in the figure), a pentagon (not shown in the figure) or other shapes. The opening opened inside the adjustment block 740 is designed to be a corresponding shape, so that when the adjustment shaft 730 rotates, it can rotate synchronously with the adjustment block 740.

[0071] In this embodiment, there are two mounting slots 510 , and the two mounting slots 510 are arranged opposite to each other.

[0072] like Figure 10 As shown, the thickness of the adjustment block 740 is uneven. One side of the adjustment block 740 is an adjustment surface, and two raised ends are symmetrically arranged on the adjustment surface. The thickness of the adjustment block 740 part from any raised end to the other raised end along the same rotation direction (clockwise or counterclockwise) decreases, so that a "cliff-like" thickness change is formed next to each raised end.

[0073] Specifically, refer to Figure 10 ,by Figure 10 Taking the perspective of the middle surface facing the adjustment surface as an example, the thickness of the adjustment block 740 portion from the upper raised end to the lower raised end can decrease along the clockwise direction, and the thickness of the adjustment block 740 portion from the lower raised end to the upper raised end can decrease along the clockwise direction, and a "cliff-like" thickness change is formed on the left side of the upper raised end, and a "cliff-like" thickness change is formed on the side of the lower raised end.

[0074] Among them, the thickness of the adjustment block 740 part from any protruding end to the other protruding end along the same rotation direction (clockwise or counterclockwise) decreases, and the thickness decreasing process can be a step-by-step decrease (not shown in the figure) or a continuous decrease (the thickness change remains continuous without a jump point).

[0075] When the thickness decreasing process is stepwise decreasing, the thickness difference of each change and the number of decreasing (for example, the number of decreasing is ten times, and the thickness difference of each decreasing is 1mm) can be selected according to actual requirements; when the thickness decreasing process is continuous decreasing, the thickness and position angle change curve function (for example, the change curve function can be a binary linear equation function or a quadratic curve function) can be selected according to actual requirements, which will not be described here.

[0076] It should be noted that the minimum thickness and the thickness difference of the adjusting block 740 can be selected according to actual requirements, which will not be described here.

[0077] In addition, the number of protruding ends on the adjusting block 740 in the present application is not limited to two, and the limitation in the present embodiment is only for better illustrating the structure of the adjusting block 740.

[0078] Therefore, the adjusting surface is uniformly provided with a plurality of protruding ends, and the thickness of the adjusting block 740 part from any protruding end to another protruding end in the same rotation direction decreases, the number of protruding ends on the adjusting block 740 is the same as and corresponds to the number of abutting blocks 611 on the clamping sheet 610, and the plurality of abutting blocks 611 on the clamping sheet 610 are uniformly distributed.

[0079] Specifically, the number of mounting grooves 510 can be multiple, and the plurality of mounting grooves 510 are uniformly arranged on the mounting shaft 500; the number of abutting blocks 611 on the clamping sheet 610 can be multiple, and the plurality of abutting blocks 611 are uniformly arranged on the tool 600.

[0080] For example, when the number of abutting blocks 611 is three, the number of protruding ends on the adjusting surface of the adjusting block 740 is three, so that three "cliff type" thickness change parts are formed on the adjusting surface.

[0081] It should be noted that the adjusting block 740 can be provided with one adjusting surface, or both surfaces can be adjusting surfaces, and a plurality of specifications of adjusting block 740 groups can be provided, and the maximum thickness, minimum thickness and thickness change of the adjusting block 740 in the adjusting block 740 group of different specifications can be different.

[0082] It can be understood that in the present embodiment, the adjusting shaft 730 is driven to rotate by the inner driving part 720, and then drives the adjusting block 740 to rotate, when the adjusting block 740 rotates, the adjacent two abutting blocks 611 abut on the corresponding adjusting block 740, and the thickness of the part of the adjusting block 740 between the adjacent two abutting blocks 611 changes with the rotation of the adjusting block 740, so that the tool 600 moves axially along the mounting shaft 500, the adjusting block 740 moves axially along the mounting shaft 500, and then adjusts the distance of the tool 600, and under the support of the spring, the adjusted tool 600 can be stabilized.

[0083] Through the cooperation of the cutter 600 and the adjusting block 740, the cutter 600 can be adjusted without being disassembled and assembled, but directly through the rotation angle of the adjusting block 740, which is more time-saving and labor-saving.

[0084] It should be noted that the spring in the present application can be replaced by an automatic extension device such as a pneumatic cylinder or an electric telescopic rod and a matching assembly, which can adjust the extrusion force on the cutter 600 during automatic extension, and has better stability.

[0085] For example, two small electric telescopic rods can be symmetrically arranged between the adjusting block 740 and the closure cap 520, which can have a pressure detection function, and the extrusion force on the cutter 600 can be controlled by the extension and retraction of the electric telescopic rod; when the distance between the cutters 600 needs to be adjusted, the electric telescopic rod is first controlled to shorten, so that the pressure between the cutters 600 is reduced, so that the inner driving part 720 can better drive the adjusting block 740 to rotate through the adjusting shaft 730, and after the adjustment is completed, the electric telescopic rod is controlled to extend, so that the extrusion force between the cutter 600 and the adjusting block 740 exceeds a certain threshold, to ensure the stability of the cutter 600 during cutting.

[0086] The present application provides a high-efficiency cutting method for LED wafers, which is suitable for the above-mentioned cutting device, and the cutting method comprises: S1: the worker unscrews the closure cap 520 from the mounting shaft 500, and then controls the second telescopic part 123 to move away from the first telescopic part 122, so that the supporting part 400 is separated from the mounting shaft 500; S2: the worker installs a proper number of cutters 600 and adjusting devices on the mounting shaft 500 in turn, places a sufficient number of cutters 600 and adjusting devices, then selects a suitable spring and puts it into the mounting shaft 500, and then controls the second telescopic part 123 to return to the original position, so that the supporting part 400 supports the mounting shaft 500 away from the one end of the outer driving part 300 again, and finally the closure cap 520 is screwed on the mounting shaft 500 again; S3: the worker places the wafer to be cut on the bearing table 200, and then controls the outer driving part 300 to drive the plurality of cutters 600 on the mounting shaft 500 to rotate; the plurality of cutters 600 synchronously cut the wafer, and the cutting path is controlled by the translation of the bearing table 200; when the wafer is transversely cut, the bearing table 200 drives the wafer to rotate by 90 degrees, and the wafer is cut again; S4: after the cutting is completed, the cut product is taken out and placed in the next wafer to be cut for cutting.

[0087] It should be noted that in the process of cutting the wafer, the cutting can be performed in one direction twice, specifically, the odd-numbered columns of cutting paths (such as the first, third, and fifth columns of cutting paths) can be cut first, and the even-numbered columns of cutting paths (the second, fourth, and sixth columns) can be cut. Alternatively, the cutting can be performed in one direction three times, specifically, the first, fourth, and seventh columns of cutting paths can be cut first, the second, fifth, and eighth columns of cutting paths can be cut second, and the third, sixth, and ninth columns of cutting paths can be cut last. The specific number of times of cutting can be selected according to the total number of paths to be cut for one wafer and the number of cutters 600 on the mounting shaft 500, and the appropriate spacing of the cutters 600 can be selected according to the total number of paths to be cut, the size of the cut chips, and the number of cutters 600 on the mounting shaft 500, which will not be described here.

[0088] The preferred embodiments of the present application have been described above with the aid of drawings and are not intended to limit the present application, and various modifications and changes can be made by those skilled in the art to the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. An efficient cutting device for LED wafers, characterized in that: It includes a machine body, a bearing platform, an external driving component, a supporting component, a mounting shaft, a tool and an adjusting device; The machine body includes a machine base and a machine cover, and the bearing platform is arranged on the machine base; The interior of the hood is provided with a telescopic component 1 and a telescopic component 2; the top of the telescopic component 1 is fixed to the inner top wall of the hood, and the bottom of the telescopic component 1 is connected to the external driving component; The top of the telescopic component 2 is slidably arranged on the inner top wall of the hood, and the bottom of the telescopic component 1 is detachably connected to the supporting component; The output shaft of the external driving component is connected to the installation shaft, and the end of the installation shaft away from the external driving component is detachably connected to the support component; A plurality of cutting tools are arranged at equal distances on the mounting shaft; The mounting shaft is provided with a mounting groove along its length, and a closing cap is threadedly connected to one end of the mounting shaft away from the external driving component; The inner wall of the tool is provided with a resistance block, and the tool is arranged on the mounting groove through the resistance block; The adjusting device is arranged on the mounting shaft and is used to adjust the distance between two adjacent cutting tools; A spring is placed in the mounting shaft, one end of the spring contacts the inner wall of the closing cap, and the other end of the spring supports the cutter.

2. The high-efficiency LED wafer cutting device according to claim 1, wherein: The carrying platform includes a chassis, a rotating plate, a translation plate and a placement plate; The chassis is mounted on the machine base, and the rotating disk is rotatably arranged on the chassis; A translation plate is slidably provided on the rotating disk, and a placement plate is slidably provided on the translation plate; The placement plate translates along the length direction of the translation plate, and the translation plate translates along its own width direction on the rotating disk.

3. The high-efficiency LED wafer cutting device according to claim 1, wherein: The tool comprises two annular clamping pieces and a replaceable blade, and the abutment block is arranged on the inner ring of the clamping piece; A circular opening is opened in the center of the blade, and the inner diameter of the clamping piece is the same as the outer diameter of the mounting shaft, and the inner diameter of the blade is the same as the inner diameter of the clamping piece; Each clamping piece is provided with a resistance block. When the two clamping pieces clamp the blade, the resistance blocks on the two clamping pieces are arranged relative to each other.

4. The high-efficiency LED wafer cutting device according to claim 1, wherein: The adjustment device includes multiple groups of adjustment pads, each group of adjustment pads includes multiple adjustment pads; The adjusting pad is an annular structure, the adjusting pad is slidingly sleeved on the mounting shaft, and an adjusting pad is arranged between two adjacent cutting tools.

5. The high-efficiency LED wafer cutting device according to claim 3, wherein: The adjustment device includes an inner driving component, an adjustment shaft and a plurality of adjustment blocks; The inner driving component is arranged at an end of the mounting shaft away from the closing cap, and the output shaft of the inner driving component is coaxially connected to the adjusting shaft; The adjusting shaft is coaxially arranged with the mounting shaft, and the cross-sectional shape of the adjusting shaft is not circular; The adjusting block is provided with a sliding opening, and the adjusting shaft passes through the adjusting block through the sliding opening.

6. The high-efficiency LED wafer cutting device according to claim 5, wherein: The thickness of the adjustment block is uneven. One side of the adjustment block is an adjustment surface. A plurality of protrusions are evenly arranged on the adjustment surface. The thickness of the adjustment block portion decreases from any protrusion to the other protrusion along the same rotation direction. The number of the raised ends on the adjusting block and the interference blocks on the clamping piece are the same and correspond to each other.

7. The high-efficiency LED wafer cutting device according to claim 6, wherein: There are two mounting slots, which are arranged opposite to each other. Two protruding ends are symmetrically arranged on the adjusting surface.

8. The high-efficiency LED wafer cutting device according to claim 6, wherein: The thickness of the adjustment block portion from any convex end on the adjustment surface to the other convex end along the same rotation direction decreases, and the thickness decreasing process is a step-by-step decrease or a continuous decrease.

9. A high-efficiency cutting method for LED wafers, equipped with the high-efficiency cutting device for LED wafers as claimed in claim 1, characterized in that: The cutting method comprises: The staff unscrews the closing cap from the mounting shaft, and then controls the telescopic component 2 to move away from the telescopic component 1, so that the support component is separated from the mounting shaft; The staff installs the appropriate number of cutting tools and adjusting devices on the installation shaft in sequence. After placing a sufficient number of cutting tools and adjusting devices, they select a suitable spring and put it into the installation shaft. Then they control the telescopic component 2 to return to its original position, so that the support component once again supports the end of the installation shaft away from the external drive component. Finally, they tighten the closing cap on the installation shaft again. The operator places the wafer to be cut on the carrier, then controls the external drive component to rotate multiple cutters on the mounting shaft. The multiple cutters cut the wafer synchronously, and the cutting path is controlled by the translation of the carrier. After the wafer is cut horizontally, the carrier rotates the wafer 90 degrees and cuts the wafer again. After the cutting is completed, the finished product is taken out and the next wafer to be cut is placed in for cutting.

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