Automobile door handle accessory manufacturing analysis system of intelligent automobile

Abstract

The invention discloses an intelligent automobile door handle accessory manufacturing analysis system, and relates to the technical field of manufacturing analysis, and the system comprises a driving connection module which is used for embedding a piezoelectric film in an injection mold cavity of an automobile door handle accessory, arranging a resistance wire on the back surface of the injection mold cavity, and connecting the piezoelectric film with a voltage ripple driving circuit, connecting the resistance wire with a resistance wire driving circuit; the time sequence synchronization module is used for taking the voltage ripple component of the bus voltage as a driving source of the voltage ripple driving circuit and carrying out synchronization processing on the thermal excitation control time sequence of the resistance wire driving circuit according to the pulse time sequence of the voltage ripple component; the signal calibration module is used for calculating a real-time amplitude sequence of the piezoelectric film and carrying out time phase calibration on the instantaneous heat flow of the resistance wire according to a pulse time sequence to obtain a synchronous heat flow sequence of the resistance wire; and the correlation calculation module is used for performing cross-correlation calculation on the synchronous heat flow sequence and the real-time amplitude sequence to obtain a correlation value.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of manufacturing analysis technology, in particular to a door handle accessory manufacturing analysis system of a smart car. BACKGROUND

[0002] The smart car gradually evolves towards light weight and personalization, and the door handle, as a high-frequency component of vehicle body interaction, directly affects the overall quality and user tactile experience. The current industry generally uses micro-injection molding process to form the handle accessory, and sets up multiple physical field excitation and sensing units in the mold cavity to complete material filling, micro-texture replication and size locking within a millisecond dynamic window.

[0003] However, the existing injection molding quality control still has the following defects: the traditional process generally separates the mechanical vibration source and the thermal compensation unit, and each relies on an independent driving circuit and a phase locking mechanism, making it difficult to keep the thermal field and the force field in cycle-level synchronization; at the same time, the bus voltage ripple is often filtered out rather than utilized, missing a natural synchronization reference for the system, and causing a coupling mismatch between the piezoelectric amplitude, the local temperature of the mold cavity, and the melt solidification window. When the vibration phase lags or the thermal compensation is advanced, the micro-texture depth deviation and the overall size deviation will be amplified, increasing the scrap rate and delaying the machine adjustment rhythm, which cannot meet the stringent requirements of high-end smart car door handles for sub-micron texture consistency and tolerance closed loop. Therefore, there is an urgent need for a manufacturing analysis system that can synchronize the driving of piezoelectric film and resistance wire with bus voltage ripple and predict deviations in real time during the forming cycle, to eliminate the inherent phase difference of multi-physical field cooperative control and improve the timeliness and accuracy of quality prediction. SUMMARY

[0004] The purpose of the present application is to solve the problem that the prior art cannot meet the stringent requirements of high-end smart car door handles for sub-micron texture consistency and tolerance closed loop, and to provide a door handle accessory manufacturing analysis system of a smart car.

[0005] In order to solve the problems existing in the prior art, the present application adopts the following technical scheme: A door handle accessory manufacturing analysis system of a smart car, comprising: A driving connection module is used to embed a piezoelectric film in the injection molding cavity of the door handle accessory, set a resistance wire on the back of the injection molding cavity, connect the piezoelectric film to a voltage ripple driving circuit, and connect the resistance wire to a resistance wire driving circuit; A timing synchronization module is used to use the voltage ripple component of the bus voltage as the driving source of the voltage ripple driving circuit, and synchronize the thermal excitation control timing of the resistance wire driving circuit according to the pulse timing of the voltage ripple component; A signal calibration module is configured to calculate a real-time amplitude sequence of the piezoelectric film, perform time-phase calibration on the instantaneous heat flow of the resistance wire according to the pulse timing, and obtain a synchronous heat flow sequence of the resistance wire; A correlation calculation module is configured to perform cross-correlation calculation on the synchronous heat flow sequence and the real-time amplitude sequence, and obtain a correlation value; A deviation prediction module is configured to calculate a root mean square value of the voltage ripple component, and calculate a predicted micro-texture depth deviation and a predicted size deviation of the door handle assembly based on the root mean square value and the correlation value; A manufacturing decision module is configured to determine whether to manufacture the door handle assembly according to the predicted micro-texture depth deviation and the predicted size deviation.

[0006] Preferably, the voltage ripple component of the bus voltage is taken as the driving source of the voltage ripple driving circuit, comprising: In a preset time period, the bus voltage is collected at a fixed sampling frequency to obtain a plurality of sample voltage values of the bus voltage; The sample voltage values are summed to obtain a sample voltage sum of the bus voltage, and the sample voltage sum is divided by the total number of sample voltage values to obtain a basic voltage mean value of the bus voltage; The bus voltage is subtracted from the basic voltage mean value to obtain the voltage ripple component of the bus voltage, and the voltage ripple component is taken as the driving source of the voltage ripple driving circuit.

[0007] Preferably, the heat excitation control timing of the resistance wire driving circuit is synchronized according to the pulse timing of the voltage ripple component, comprising: The pulse timing feature is extracted from the voltage ripple component by using fast Fourier transform, wherein the pulse timing feature includes pulse frequency and duty cycle; The pulse frequency is taken as the heat excitation reference frequency of the resistance wire driving circuit; The duty cycle is converted into a pulse width modulation parameter of the resistance wire driving circuit, so that the pulse width modulation parameter controls the energization time of the resistance wire in each cycle.

[0008] Preferably, the real-time amplitude sequence of the piezoelectric film is calculated, comprising: The piezoelectric constant of the piezoelectric film is obtained; According to the linear relationship of the piezoelectric effect, the piezoelectric constant is multiplied by the voltage ripple component to obtain the instantaneous amplitude value at each sampling time; All the instantaneous amplitude values are arranged in time sequence to obtain the real-time amplitude sequence.

[0009] Preferably, the instantaneous heat flow of the resistance wire is time-phase calibrated according to the pulse timing to obtain the synchronous heat flow sequence of the resistance wire, comprising: The instantaneous heat flow of the resistance wire is obtained; According to the pulse timing, the phase offset of the instantaneous heat flow on the time axis is calculated; According to the phase offset, the instantaneous heat flux of the resistance wire is calibrated in time phase by the digital delay method to obtain the synchronous heat flux sequence of the resistance wire.

[0010] Preferably, performing cross-correlation calculation on the synchronized heat flow sequence and the real-time amplitude sequence to obtain a correlation value includes: The cross-correlation coefficient algorithm is used to calculate the cross-correlation coefficient between the synchronous heat flow series and the real-time amplitude series. The calculation formula of the cross-correlation coefficient is as follows: Where, is the mutual correlation coefficient, The first step in the synchronous heat flow sequence Heat flow value, is the mean of all heat flow values ​​in the synchronized heat flow sequence, is the first of the real-time amplitude series The instantaneous amplitude value, is the mean of all instantaneous amplitude values ​​in the real-time amplitude sequence, is the sum of the heat flow value and the instantaneous amplitude value, It is the identifier of heat flow value and instantaneous amplitude value.

[0011] Preferably, calculating the root mean square value of the voltage ripple component includes: Extracting discrete points of the voltage ripple component at fixed time intervals, and determining the discrete points as instantaneous values ​​of the voltage ripple component; Perform a square operation on each instantaneous value to obtain a square value, and sum all the square values ​​to obtain a sum result; Divide the sum by the total number of instantaneous values ​​to obtain the square mean of the voltage ripple component; Take the square root of the square mean to get the RMS value of the voltage ripple component.

[0012] Preferably, calculating the predicted microtexture depth deviation and the predicted size deviation of the door handle accessory based on the root mean square value and the correlation value includes: Set the micro texture depth empirical coefficient and size deviation empirical coefficient; Substitute the micro-texture depth empirical coefficient, root mean square value, and correlation value into the preset depth deviation formula to obtain the predicted micro-texture depth deviation, where the preset depth deviation formula is as follows: Where, is the predicted micro-texture depth deviation, is the empirical coefficient of micro texture depth, is the root mean square value, is the absolute value of the correlation value; The size deviation empirical coefficient, the root mean square value and the correlation value are substituted into a preset size deviation formula to obtain a predicted size deviation, wherein the preset size deviation formula is as follows: In the formula, is the predicted size deviation, is the size deviation empirical coefficient, is the root mean square value, is the absolute value of the correlation value.

[0013] Preferably, judging whether to manufacture the vehicle door handle accessory according to the predicted micro-texture depth deviation and the predicted size deviation comprises: comparing a first difference value of the predicted micro-texture depth deviation and a preset depth deviation threshold value; comparing a second difference value of the predicted size deviation and a preset size deviation threshold value; if the first difference value and the second difference value are within a tolerance range, it is judged that the predicted quality of the vehicle door handle accessory is qualified, and the manufacturing of the vehicle door handle accessory is performed; if the first difference value and the second difference value exceed the tolerance range, it is judged that the predicted quality of the vehicle door handle accessory is unqualified, and the manufacturing process of the vehicle door handle accessory is not performed.

[0014] Compared with the prior art, the present application has the following advantages: 1. In the present application, the voltage ripple signal in the bus of the injection molding machine is simultaneously used as the common driving source and the natural synchronous reference of the piezoelectric film and the resistance wire by embedding the piezoelectric film in the injection molding cavity and applying the resistance wire on the back surface, thereby fundamentally eliminating the phase difference problem caused by the vibration actuator and the thermal compensation unit relying on independent circuits in the traditional process; after extracting the pulse frequency and duty cycle of the voltage ripple by using fast Fourier transform, the piezoelectric vibration frequency and the resistance wire pulse width modulation parameters are directly mapped, so that the force field and the thermal field maintain strict consistent timing in each forming cycle, avoiding the micro-texture distortion and size drift caused by local overcooling or overheating, and realizing the homologous driving and synchronous control of multiple physical fields.

[0015] 2. On the basis of synchronous control, the piezoelectric film amplitude sequence and the calibrated resistance wire heat flow sequence are further collected in real time, the degree of cooperation of the two is quantified by cross-correlation algorithm, and a prediction model is established by combining the root mean square value of the voltage ripple, so as to convert the energy intensity and the cooperation deviation into quantitative estimation of the micro-texture depth deviation and the overall size deviation; the model can complete online calculation only by relying on periodic signals, which obviously shortens the decision delay compared with the traditional method relying on the whole pressure curve or offline large data training, and solves the pain point that the existing technology cannot find micro-scale forming defects in time.

[0016] 3. The system uses a preset depth and size tolerance threshold as the judgment standard, and directly feeds back the prediction result to the manufacturing decision layer: when both deviations are within the allowed range, the product is automatically released, and if the limit is exceeded, the machine is immediately stopped or the parameters are automatically adjusted. Through this closed-loop mechanism, the present application realizes prior quality screening and dynamic compensation within the process before product forming, reduces the scrap rate and machine adjustment time, ensures that the intelligent car door handle assembly still maintains sub-micron texture consistency and assembly precision under high beat production conditions, thereby solving the key problems of force-heat coupling mismatch, quality prediction lag, and long control beat in the background technology. BRIEF DESCRIPTION OF DRAWINGS

[0017] The drawings described herein are used to provide further understanding of the present application, and form a part of the present application. The illustrative embodiments of the present application and their descriptions are used to explain the present application, and do not constitute an improper limitation on the present application. In the drawings: Figure 1 A functional module diagram of a smart car door handle assembly manufacturing analysis system according to an embodiment of the present application. DETAILED DESCRIPTION

[0018] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all the embodiments.

[0019] Embodiment: The present embodiment provides a smart car door handle assembly manufacturing analysis system, referring to Figure 1 , comprising: A driving connection module is used to embed a piezoelectric film in the injection molding cavity of the car door handle assembly, set a resistance wire on the back of the injection molding cavity, connect the piezoelectric film to the voltage ripple driving circuit, and connect the resistance wire to the resistance wire driving circuit. In detail, the piezoelectric film is embedded in the injection molding cavity of the car door handle assembly, the electrical interface of the piezoelectric film is electrically connected to the output end of the voltage ripple driving circuit to form a dual-phase voltage ripple driving structure; when the injection molding cavity of the car door handle assembly is processed, the piezoelectric film is accurately embedded in the specific mounting area of the cavity, the electrical interface of the piezoelectric film is processed, and it is electrically connected to the output end of the voltage ripple driving circuit through an adaptive conductive connection component, ensuring the reliability and stability of the connection, so that the voltage ripple driving circuit can stably output voltage signals to the piezoelectric film, and then use the characteristics of the piezoelectric film to cooperate with the voltage ripple driving circuit to form a dual-phase voltage ripple driving structure.

[0020] In detail, the dual-phase voltage ripple driving structure is a power electronic driving architecture applied to vehicle door handle accessory manufacturing. After embedding the piezoelectric film in the injection molding cavity of the vehicle door handle accessory, two voltage ripple driving units with a specific phase relationship (such as a phase difference of 180°) are constructed, and they are electrically connected with the piezoelectric film to form a synergistic system. By means of the phase difference characteristics of the dual-phase voltage ripple driving unit, the two ripple currents are staggered, part of the electrical signal fluctuation is offset, the piezoelectric film vibration is reduced, and the ripple interference in the heat flow compensation process is reduced, so that the piezoelectric film vibration is more stable, and the heat flow compensation is more uniform. The two driving energy distributions can be adjusted according to the complex working conditions of the vehicle door handle manufacturing.

[0021] In detail, a phase change alloy microchannel is arranged on the back of the injection molding cavity, and a resistance wire is implanted in the phase change alloy microchannel. The two ends of the resistance wire are connected with the control end of the resistance wire driving circuit, and the inlet and outlet of the phase change alloy microchannel are connected with the phase change material circulation system to form a pulse synchronous heat compensation channel. A fine groove structure is milled or etched on the back of the injection molding cavity by a precision machining equipment according to the path and size planned according to the heat compensation requirement of the vehicle door handle forming. Then, the phase change alloy material is placed in the groove by pouring, filling and other methods. After solidification, polishing and other treatments, the alloy is tightly combined with the back of the mold cavity and the surface is smooth, forming a phase change alloy microchannel that can efficiently conduct and store heat. Then, the resistance wire is implanted in the microchannel. During the implantation process, the arrangement of the resistance wire needs to be regular and well fitted with the inner wall of the microchannel to avoid short circuit and poor contact. Then, the two ends of the resistance wire are led out and reliably connected with the control end of the resistance wire driving circuit to ensure stable transmission of the circuit signal and precise control of the heating state of the resistance wire. At the same time, the inlet and outlet of the phase change alloy microchannel are connected with the phase change material circulation system to ensure smooth circulation of the phase change material in the microchannel. Through the heat absorption and release characteristics of the phase change material and the active heating of the resistance wire, a pulse synchronous heat compensation channel is formed. During the injection molding process of the vehicle door handle accessory, heat compensation is accurately applied according to the real-time heat state to ensure the uniformity and stability of the mold cavity temperature field and meet the thermal environment requirements of the accessory forming.

[0022] The timing synchronization module is used for taking the voltage ripple component of the bus voltage as the driving source of the voltage ripple driving circuit, and synchronously processing the heat excitation control timing of the resistance wire driving circuit according to the pulse timing of the voltage ripple component. In the embodiment of the present application, the voltage ripple component of the bus voltage is taken as the driving source of the voltage ripple driving circuit, which comprises: In a preset time period, the bus voltage is collected at a fixed sampling frequency to obtain a plurality of sample voltage values of the bus voltage. The sample voltage values are summed to obtain a sample voltage sum of the bus voltage, and the sample voltage sum is divided by the total number of sample voltage values to obtain a base voltage average of the bus voltage; The bus voltage is subtracted by the base voltage average to obtain a voltage ripple component of the bus voltage, and the voltage ripple component is taken as a driving source of the voltage ripple driving circuit.

[0023] In detail, the bus voltage signal contains a base voltage component for maintaining the basic operation of the system, and a voltage ripple component for realizing precise driving of the piezoelectric film, heat compensation collaborative control and the like. The base voltage average reflects the average level of the bus voltage in a stable operation period, and represents the basic voltage amount required for normal operation of the system. By subtracting the base voltage average calculated in advance from the collected real-time bus voltage, the base stable component in the bus voltage can be removed, and the voltage ripple component reflecting the voltage fluctuation characteristics and used for realizing multi-physical field collaborative control can be separated. The voltage ripple component strips the base stable component in the bus voltage, and accurately retains the signal reflecting the voltage dynamic fluctuation characteristics, which are highly adapted to the driving requirements of the piezoelectric film. The piezoelectric film needs a voltage signal with specific frequency and amplitude change to generate corresponding vibration and realize precise imprint forming of the micro-texture of the door handle. The dynamic characteristics of the voltage ripple component can directly provide a matching driving signal for the piezoelectric film, so that the vibration frequency and amplitude of the piezoelectric film are consistent with the requirements of the micro-texture forming process.

[0024] In the embodiment of the application, the heat excitation control timing of the resistance wire driving circuit is synchronized according to the pulse timing of the voltage ripple component, including: The pulse timing characteristics including pulse frequency and duty cycle are extracted from the voltage ripple component by using fast Fourier transform; Specifically, the discretized voltage ripple component time domain data is taken as input, and fast Fourier transform algorithm is used for frequency spectrum analysis. The fast Fourier transform converts the time domain signal into a frequency domain signal, decomposes the voltage ripple component into the superposition of different frequency components, calculates the amplitude and phase information of each frequency component, determines the pulse frequency of the voltage ripple according to the frequency component with the maximum amplitude in the frequency spectrum, and the frequency corresponds to the number of periodic changes of the voltage ripple. On the basis of obtaining the frequency information, the time domain waveform of the voltage ripple component is combined to count the time length of the voltage value higher than the set threshold in a unit period, and the pulse duty cycle is calculated by comparing it with the whole period, so as to realize the complete extraction of the pulse timing characteristics including pulse frequency and duty cycle from the voltage ripple component.

[0025] The pulse frequency is taken as the heat excitation reference frequency of the resistance wire driving circuit; Specifically, the pulse frequency of the voltage ripple reflects the periodic change rule of the voltage signal, which is closely related to the vibration frequency of the piezoelectric film and determines the rhythm of micro-texture imprinting. The resistance wire, as a key component of thermal compensation, needs to generate a thermal excitation that matches the vibration of the piezoelectric film and the micro-texture forming process. By setting the pulse frequency as the reference frequency of the thermal excitation, the heating and cooling rhythm of the resistance wire can be synchronized with the vibration frequency of the piezoelectric film, ensuring that the resistance wire can provide timely and corresponding thermal compensation during the key stage of micro-texture imprinting of the piezoelectric film on the door handle. This can effectively avoid the problem of local overheating or uneven cooling of the material caused by the asynchronous thermal excitation and mechanical vibration, and reduce the depth deviation and size deviation of the micro-texture.

[0026] The duty cycle is converted into the pulse width modulation parameter of the resistance wire driving circuit, and the pulse width modulation parameter controls the power-on time of the resistance wire in each cycle.

[0027] In detail, the duty cycle represents the proportion of the high-level duration in a cycle in the voltage ripple signal, and directly reflects the intensity and duration characteristics of energy input. The resistance wire driving circuit adjusts the output power through pulse width modulation technology, and the pulse width modulation parameter determines the proportional relationship between the power-on time of the resistance wire and the cycle length. Converting the duty cycle into the pulse width modulation parameter can match the heating power of the resistance wire with the energy characteristics of the voltage ripple, and accurately control the power-on time and power output of the resistance wire according to the energy intensity represented by the duty cycle during the micro-texture imprinting of the piezoelectric film on the door handle, so as to realize on-demand thermal compensation.

[0028] Specifically, the power-on time of the resistance wire in each cycle is controlled through the pulse width modulation parameter, and the core is to realize accurate regulation and control of the thermal output of the resistance wire. The pulse width modulation technology adjusts the average power of the load by changing the high-level duration of the pulse signal, i.e. the pulse width. In the resistance wire driving circuit, the pulse width modulation parameter is directly related to the high-level proportion of the pulse signal, and the parameter value determines the power-on time of the resistance wire in a complete working cycle. When the pulse width modulation parameter increases, the high-level duration of the corresponding pulse signal is extended, the power-on time of the resistance wire is increased, and the heat generated in a unit cycle is increased; on the contrary, when the parameter decreases, the power-on time of the resistance wire is shortened, and the heat output is reduced.

[0029] Overall, the heat excitation control timing of the resistance wire driving circuit is synchronized according to the pulse timing of the voltage ripple component, which can fundamentally eliminate the phase difference problem between the heat compensation unit and the vibration actuator caused by independent driving circuits in the traditional process. The pulse frequency is used as the heat excitation reference frequency of the resistance wire driving circuit, so that the resistance wire heating rhythm is strictly synchronized with the piezoelectric film vibration frequency, and local overheating or uneven cooling of the material is avoided; the duty cycle is converted into a pulse width modulation parameter, and the power-on time of the resistance wire in each cycle is accurately controlled, so that the heat flow output power and the voltage ripple energy characteristics are matched. In this way, the strict timing consistency of the thermal field and the force field in each forming cycle can be realized, the distortion problem caused by the asynchronous heat flow and vibration of the microtexture can be effectively avoided, and the size drift phenomenon caused by local temperature abnormalities can be avoided, the multi-physical field collaborative control precision is improved, and the forming quality of the door handle assembly is guaranteed.

[0030] The signal calibration module is configured to calculate a real-time amplitude sequence of the piezoelectric film, perform time-phase calibration on the instantaneous heat flow of the resistance wire according to the pulse timing, and obtain a synchronous heat flow sequence of the resistance wire. In the embodiment of the present application, the calculation of the real-time amplitude sequence of the piezoelectric film comprises: The piezoelectric constant of the piezoelectric film is obtained. According to the linear relationship of the piezoelectric effect, the piezoelectric constant is multiplied by the voltage ripple component to obtain the instantaneous amplitude value at each sampling time. All the instantaneous amplitude values are arranged in time sequence to obtain the real-time amplitude sequence.

[0031] Specifically, the piezoelectric constant is a property inherent to the piezoelectric film material, reflecting the strength of the piezoelectric effect, which can be obtained through material property testing or by consulting relevant standard parameters; according to the linear relationship of the piezoelectric effect, the piezoelectric constant obtained is operated with the voltage ripple component; since the voltage ripple component contains voltage fluctuation information at different sampling times, the multiplication operation of the piezoelectric constant and the voltage value at each sampling time in the voltage ripple component can obtain the instantaneous amplitude value of the piezoelectric film at each sampling time; finally, all the calculated instantaneous amplitude values are arranged in time sequence to form a real-time amplitude sequence that can reflect the amplitude change of the piezoelectric film in continuous time.

[0032] In the embodiment of the present application, the time-phase calibration is performed on the instantaneous heat flow of the resistance wire according to the pulse timing, and the synchronous heat flow sequence of the resistance wire is obtained, which comprises: The instantaneous heat flow of the resistance wire is obtained. Specifically, the temperature sensor is arranged on the surface of the resistance wire or the surrounding area significantly affected by the thermal radiation of the resistance wire, and the temperature data of the resistance wire and the surrounding area are continuously collected by the temperature sensor. The temperature data, the physical parameters of the resistance wire, and the heat dissipation coefficient of the mold cavity are combined, and the temperature signal is converted into a heat flow signal through the operation of the heat conduction and thermal radiation related physical formula, so that the instantaneous heat flow data of the resistance wire at each time is obtained in real time.

[0033] According to the pulse timing, the phase shift amount of the instantaneous heat flow on the time axis is calculated; Specifically, according to the determined pulse timing, the corresponding relationship between the instantaneous heat flow and the pulse timing signal on the time axis is analyzed, and the phase shift amount of the instantaneous heat flow on the time axis is determined by calculating the differences of the starting time and the period characteristics of the two. The shift amount reflects the time difference between the heat flow output and the pulse timing requirement.

[0034] According to the phase shift amount, the time phase of the instantaneous heat flow of the resistance wire is calibrated by a digital delay method, and a synchronous heat flow sequence of the resistance wire is obtained.

[0035] Specifically, the positive and negative and the numerical value of the phase shift amount are determined. If the fluctuation phase of the instantaneous heat flow is ahead of the phase of the voltage ripple pulse timing, the shift amount is positive, otherwise it is negative. The time length of the delay required according to the phase shift amount is calculated, which is equal to the ratio of the phase shift amount to the pulse period multiplied by the pulse period. The timer or delay module in the digital controller is used to set the delay trigger time t1, and after detecting the trigger signal of the voltage ripple pulse timing, the heat flow output control signal is sent to the resistance wire driving circuit after waiting for t1 time. After the resistance wire driving circuit receives the delayed control signal, the instantaneous heat flow is generated according to the preset heat flow output parameters, so that the calibrated heat flow phase is consistent with the voltage ripple pulse timing phase, and the time phase calibration is completed.

[0036] In general, the real-time amplitude sequence is calculated by using the linear relationship between the piezoelectric constant and the voltage ripple component, which can accurately reflect the vibration state of the piezoelectric film at each sampling time, and provide dynamic force field parameters for multi-physical field collaborative control. On the other hand, the heat flow phase shift amount is calculated by pulse timing and digital delay calibration, which can eliminate the time difference between the resistance wire heat flow output and the voltage ripple pulse timing, so that the heat flow sequence and the amplitude sequence are strictly synchronized on the time axis. This ensures that the heat field and the force field signal cooperate in the micro-texture imprinting process, avoids uneven material solidification or texture replication distortion caused by phase deviation, improves the micro-texture depth consistency and size accuracy of the door handle accessory, and solves the molding quality problem caused by the asynchronization of multi-physical field signals in traditional process.

[0037] The correlation calculation module is used for cross-correlation calculation of the synchronous heat flow sequence and the real-time amplitude sequence to obtain a correlation value. In an embodiment of the present invention, performing cross-correlation calculation on the synchronized heat flow sequence and the real-time amplitude sequence to obtain a correlation value includes: The cross-correlation coefficient algorithm is used to calculate the cross-correlation coefficient between the synchronous heat flow series and the real-time amplitude series. The calculation formula of the cross-correlation coefficient is as follows: Where, is the mutual correlation coefficient, The first step in the synchronous heat flow sequence Heat flow value, is the mean of all heat flow values ​​in the synchronized heat flow sequence, is the first of the real-time amplitude series The instantaneous amplitude value, is the mean of all instantaneous amplitude values ​​in the real-time amplitude sequence, is the sum of the heat flow value and the instantaneous amplitude value, It is the identifier of heat flow value and instantaneous amplitude value.

[0038] In detail, the cross-correlation coefficient algorithm is a mathematical method used to measure the similarity and linear correlation between two signals or data sets. By calculating the normalized results of their covariance and standard deviation at different times or locations, a coefficient between -1 and 1 is obtained, where 1 represents a perfect positive correlation, -1 represents a perfect negative correlation, and 0 represents no linear correlation. It is often used in signal processing, image matching, data analysis and other fields.

[0039] Specifically, the synchronized heat flux sequence reflects the real-time output characteristics of the resistance wire thermal compensation, while the real-time amplitude sequence reflects the dynamic changes in the piezoelectric film's vibration. These two sequences correspond to the key state parameters of the thermal and force fields during the manufacturing process. Cross-correlation calculations accurately measure the linear correlation between the heat flux output rhythm and intensity and the piezoelectric film's amplitude changes. If the correlation value approaches 1, it indicates a high degree of coordination between the heat flux and amplitude in terms of timing and intensity, and a good effect of multi-physics field synchronization control, which helps ensure the precision and dimensional stability of the door handle's micro-texture molding. If the correlation value deviates from the ideal range, it indicates a coordination deviation between the thermal and force fields, requiring timely adjustment of the thermal compensation or vibration drive parameters.

[0040] a deviation prediction module, configured to calculate a root mean square value of the voltage ripple component, and calculate a predicted microtexture depth deviation and a predicted size deviation of the door handle accessory based on the root mean square value and a correlation value; In an embodiment of the present invention, calculating the root mean square value of the voltage ripple component includes: Extracting discrete points of the voltage ripple component at fixed time intervals, and determining the discrete points as instantaneous values ​​of the voltage ripple component; Perform a square operation on each instantaneous value to obtain a square value, and sum all the square values ​​to obtain a sum result; The sum result is divided by the total number of instantaneous values to obtain the square mean value of the voltage ripple component; The square mean value is square rooted to obtain the root mean square value of the voltage ripple component.

[0041] In detail, the root mean square value of the voltage ripple component reflects the intensity characteristics of the driving energy, directly correlates the piezoelectric film vibration amplitude with the basic level of thermal compensation energy output; and the correlation value of the synchronous heat flow sequence and the real-time amplitude sequence quantifies the degree of collaborative matching of the thermal field and the force field, and embodies the effect of multi-physical field synchronous control. When the root mean square value is abnormal, the piezoelectric film vibration amplitude and the heat flow output intensity will deviate from the process requirements, causing changes in micro-texture imprint depth and accessory forming size; poor correlation value means that the thermal field and the force field are deviated in collaboration, resulting in interference in the material solidification and forming process. By constructing a quantitative correlation model of the root mean square value, the correlation value, the micro-texture depth deviation and the size deviation, the changes in energy intensity and collaborative state can be converted into deviation prediction results.

[0042] In the embodiment of the present application, the predicted micro-texture depth deviation and the predicted size deviation of the door handle accessory are calculated based on the root mean square value and the correlation value, comprising: Setting the micro-texture depth empirical coefficient and the size deviation empirical coefficient; Specifically, setting the micro-texture depth empirical coefficient and the size deviation empirical coefficient requires a large number of process tests and historical data, manufacturing tests of different process parameter combinations, collection of micro-texture depth deviation, size deviation and corresponding process parameter data such as voltage ripple, heat flow and amplitude; using data analysis methods to mine the quantitative relationship between deviation and key parameters, and selecting significant influencing factors; according to the influence weight, fitting calculation and iterative optimization are used to determine the empirical coefficient, which is verified and corrected through multiple rounds of tests, so that it can accurately calculate and predict the deviation combined with the root mean square value, the correlation value and other parameters, and assist quality control.

[0043] The micro-texture depth empirical coefficient, the root mean square value and the correlation value are substituted into the preset depth deviation formula to obtain the predicted micro-texture depth deviation, wherein the preset depth deviation formula is as follows: In the formula, is the predicted micro-texture depth deviation, is the micro-texture depth empirical coefficient, is the root mean square value, is the absolute value of the correlation value; The size deviation empirical coefficient, the root mean square value and the correlation value are substituted into the preset size deviation formula to obtain the predicted size deviation, wherein the preset size deviation formula is as follows: In the formula, is a predicted size deviation, is a size deviation empirical coefficient, is a root mean square value, is an absolute value of a correlation value.

[0044] Specifically, from the perspective of the association between physical mechanisms and parameters, the root mean square value reflects the energy intensity of the voltage ripple, directly affecting the vibration amplitude of the piezoelectric film and the basic level of the heat flow output, and the stronger the energy, the easier it is to cause fluctuations in the depth and size of the microtexture; the absolute value of the correlation value reflects the degree of collaborative matching of the heat flow and the amplitude, then the quantitative collaborative deviation is obtained, and the worse the collaboration, the smaller , and the higher the risk of deviation accumulation. The microtexture depth empirical coefficient and the size deviation empirical coefficient are process adaptation coefficients obtained by fitting a large amount of experimental data, and are used to calibrate the influence weight of the energy intensity and the collaborative deviation on the actual deviation. The formula converts the electrical signal characteristics and the multi-field collaborative state into a quantifiable deviation prediction value through the association of “energy intensity x collaborative deviation x process coefficient”, which is consistent with the manufacturing logic of “energy driving, collaborative control and deviation formation” from the mechanism.

[0045] The manufacturing decision module is configured to determine whether to manufacture the door handle accessory according to the predicted microtexture depth deviation and the predicted size deviation.

[0046] In the embodiments of the present application, determining whether to manufacture the door handle accessory according to the predicted microtexture depth deviation and the predicted size deviation comprises: comparing a first difference value between the predicted microtexture depth deviation and a preset depth deviation threshold value; comparing a second difference value between the predicted size deviation and a preset size deviation threshold value; if the first difference value and the second difference value are within a tolerance range, it is determined that the predicted quality of the door handle accessory is qualified, and the manufacturing of the door handle accessory is performed; if the first difference value and the second difference value exceed the tolerance range, it is determined that the predicted quality of the door handle accessory is unqualified, and the manufacturing process of the door handle accessory is not performed.

[0047] In detail, the preset depth deviation threshold value and the size deviation threshold value are determined through a plurality of door handle accessory manufacturing tests and data analysis: an experiment covering different process parameters is designed, and actual deviation data of the microtexture depth and size are collected; combined with the quality standard requirements and the process stability requirements, the maximum allowable deviation that can guarantee the qualified quality of the accessory is selected through statistical fitting, iterative verification, and is used as the depth and size deviation threshold values for quality pre-control before manufacturing.

[0048] Overall, by comparing the prediction deviation with the preset threshold, a pre-manufacturing quality pre-control closed-loop mechanism is constructed. Specifically, first, the first difference value between the predicted micro-texture depth deviation and the preset depth deviation threshold, and the second difference value between the predicted size deviation and the preset size deviation threshold are calculated. If both difference values are within the tolerance range, the quality is determined to be qualified and manufacturing is performed. If it is out of limit, the process is immediately suspended. This way can exclude potential unqualified products before the part is formed, avoiding the generation of waste products caused by micro-texture distortion or size deviation; at the same time, by feeding back the prediction result in real time, parameter adaptive adjustment can be triggered, the machine adjustment time is shortened, and the door handle assembly can maintain sub-micron level texture consistency and assembly accuracy in high beat production, solving the problems of quality prediction lag and high scrap rate in traditional process, improving manufacturing efficiency and product qualification rate.

[0049] The above is only the preferred specific embodiment of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, which should be covered within the protection scope of the present application.

Claims

1. A smart car door handle parts manufacturing analysis system, characterized by: include: A drive connection module is used to embed a piezoelectric film in the injection mold cavity of the door handle accessory, set a resistance wire on the back of the injection mold cavity, connect the piezoelectric film to the voltage ripple drive circuit, and connect the resistance wire to the resistance wire drive circuit; A timing synchronization module is used to use the voltage ripple component of the bus voltage as the driving source of the voltage ripple driving circuit, and synchronize the thermal excitation control timing of the resistance wire driving circuit according to the pulse timing of the voltage ripple component; The signal calibration module is used to calculate the real-time amplitude sequence of the piezoelectric film, perform time phase calibration on the instantaneous heat flow of the resistance wire according to the pulse timing sequence, and obtain the synchronous heat flow sequence of the resistance wire; A correlation calculation module is used to perform cross-correlation calculation on the synchronous heat flow sequence and the real-time amplitude sequence to obtain a correlation value; a deviation prediction module, configured to calculate a root mean square value of the voltage ripple component, and calculate a predicted microtexture depth deviation and a predicted size deviation of the door handle accessory based on the root mean square value and a correlation value; The manufacturing decision module is used to determine whether to manufacture the door handle accessory based on the predicted micro-texture depth deviation and the predicted size deviation.

2. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: The voltage ripple component of the bus voltage is used as a driving source of the voltage ripple driving circuit, including: The bus voltage is collected at a fixed sampling frequency within a preset time period to obtain multiple sample voltage values ​​of the bus voltage; The sample voltage values ​​are summed to obtain a sample voltage sum of the bus voltage, and the sample voltage sum is divided by the total number of sample voltage values ​​to obtain a basic voltage mean of the bus voltage; The bus voltage is subtracted from the basic voltage mean to obtain the voltage ripple component of the bus voltage, and the voltage ripple component is used as the driving source of the voltage ripple driving circuit.

3. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: The thermal excitation control timing of the resistance wire drive circuit is synchronously processed according to the pulse timing of the voltage ripple component, including: Extracting pulse timing features from the voltage ripple component using fast Fourier transform, where the pulse timing features include pulse frequency and duty cycle; The pulse frequency is used as the thermal excitation reference frequency of the resistance wire driving circuit; The duty cycle is converted into a pulse width modulation parameter of the resistor wire driving circuit, and the pulse width modulation parameter controls the power-on time of the resistor wire in each cycle.

4. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: Calculates the real-time amplitude sequence of the piezoelectric film, including: Obtain the piezoelectric constant of the piezoelectric film; According to the linear relationship of the piezoelectric effect, the piezoelectric constant is multiplied by the voltage ripple component to obtain the instantaneous amplitude value at each sampling moment; Arrange all instantaneous amplitude values ​​in time sequence to obtain a real-time amplitude sequence.

5. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: The instantaneous heat flux of the resistance wire is time-phase calibrated according to the pulse timing sequence to obtain the synchronous heat flux sequence of the resistance wire, including: Get the instantaneous heat flow of the resistance wire; According to the pulse timing, the phase offset of the instantaneous heat flow on the time axis is calculated; According to the phase offset, the instantaneous heat flux of the resistance wire is calibrated in time phase by the digital delay method to obtain the synchronous heat flux sequence of the resistance wire.

6. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: Perform cross-correlation calculation on the synchronized heat flow sequence and the real-time amplitude sequence to obtain correlation values, including: The cross-correlation coefficient algorithm is used to calculate the cross-correlation coefficient between the synchronous heat flow series and the real-time amplitude series. The calculation formula of the cross-correlation coefficient is as follows: Where, is the mutual correlation coefficient, The first step in the synchronous heat flow sequence Heat flow value, is the mean of all heat flow values ​​in the synchronized heat flow sequence, is the first of the real-time amplitude series The instantaneous amplitude value, is the mean of all instantaneous amplitude values ​​in the real-time amplitude sequence, is the sum of the heat flow value and the instantaneous amplitude value, It is the identifier of heat flow value and instantaneous amplitude value.

7. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: Calculate the RMS value of the voltage ripple component, including: Extracting discrete points of the voltage ripple component at fixed time intervals, and determining the discrete points as instantaneous values ​​of the voltage ripple component; Perform a square operation on each instantaneous value to obtain a square value, and sum all the square values ​​to obtain a sum result; Divide the sum by the total number of instantaneous values ​​to obtain the square mean of the voltage ripple component; Take the square root of the square mean to get the RMS value of the voltage ripple component.

8. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: The predicted microtexture depth deviation and predicted size deviation of the door handle parts are calculated based on the RMS value and correlation value, including: Set the micro texture depth empirical coefficient and size deviation empirical coefficient; Substitute the micro-texture depth empirical coefficient, root mean square value, and correlation value into the preset depth deviation formula to obtain the predicted micro-texture depth deviation, where the preset depth deviation formula is as follows: Where, is the predicted micro-texture depth deviation, is the empirical coefficient of micro texture depth, is the root mean square value, is the absolute value of the correlation value; Substitute the dimensional deviation empirical coefficient, root mean square value, and related value into the preset dimensional deviation formula to obtain the predicted dimensional deviation. The preset dimensional deviation formula is as follows: Where, is the predicted size deviation, is the empirical coefficient of dimensional deviation, is the root mean square value, is the absolute value of the correlation value.

9. The intelligent car door handle parts manufacturing analysis system according to claim 1, characterized in that: Determine whether to manufacture the door handle component based on the predicted micro-texture depth deviation and the predicted size deviation, including: comparing a first difference between the predicted micro-texture depth deviation and a preset depth deviation threshold; comparing a second difference between the predicted size deviation and a preset size deviation threshold; If the first difference and the second difference are both within the tolerance range, it is determined that the predicted quality of the vehicle door handle assembly is qualified, and the vehicle door handle assembly is manufactured; If the first difference and the second difference exceed the tolerance range, it is determined that the predicted quality of the vehicle door handle assembly is unqualified, and the manufacturing process of the vehicle door handle assembly is not performed.

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