Antistatic CTP plate and preparation method thereof
By combining carbon nanotube-graphene composite micropowder loaded with nano-copper and modified compatibilizer, with ultrasonic coating and low-temperature plasma treatment, the antistatic performance and micropowder dispersion problems of thermal CTP plates were solved, the printing quality and stability were improved, and the production cost was reduced.
Patent Information
- Application Number
- CN202510971884.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-15
- Publication Date
- 2025-10-17
AI Technical Summary
The existing thermal CTP plates have insufficient antistatic properties, are prone to static electricity adsorption of dust, and have poor micropowder dispersion, affecting printing quality and stability.
An antistatic CTP plate was prepared by using carbon nanotube-graphene composite powder loaded with nano-copper and a modified compatibilizer, combined with ultrasonic coating and low-temperature plasma treatment.
The antistatic performance and micropowder dispersibility are significantly improved, the printing quality and long-term stability are improved, and the production cost is reduced.
Smart Images
Figure CN120792355A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to, in particular to an antistatic CTP plate and a preparation method thereof. BACKGROUND
[0002] Computer-to-plate (CTP) technology is one of the core technologies in the printing field. It directly scans digital image information to the surface of the plate material through a directional light source such as laser, which eliminates the process of film output and development in the traditional plate making process, and significantly improves the printing efficiency and accuracy. Among them, the thermal sensitive CTP plate is the most widely used plate material type. Its structure usually includes an aluminum base and a thermal sensitive layer coated on the surface of the aluminum base. The thermal sensitive layer is mainly composed of film forming resin (such as epoxy resin), crosslinking agent, infrared dye and photoacid generator.
[0003] The imaging mechanism of the thermal sensitive CTP plate is as follows: when irradiated by infrared light, the infrared dye absorbs light energy and converts it into heat energy, which promotes the decomposition of the photoacid generator to produce acid. Under the catalysis of the acid, the resin in the exposed area undergoes crosslinking reaction to form a latent image. The resin in the non-exposed area does not undergo crosslinking because it is not exposed to light, and is removed by an alkaline developing solution, finally forming a printed image.
[0004] Although the thermal sensitive CTP plate has been widely used in the printing field, it still has the following technical problems in actual use:
[0005] Insufficient antistatic performance: CTP plates are prone to generate static electricity during production, transportation and printing due to friction. Dust, particles and other impurities adsorbed by static electricity can adhere to the surface of the plate material, resulting in defects such as dirty spots and plate blurring in the printed image, which seriously affects the printing quality. Although the existing technology improves the electrical conductivity by adding antistatic micro powder (such as carbon nanotubes loaded with nano silver), the cost of nano silver is high, and the silver ions are prone to migrate in long-term use, resulting in degradation of the antistatic performance.
[0006] Poor dispersion of micro powder: Antistatic micro powder (such as carbon nanotubes) has high surface energy and is prone to agglomeration, so it needs to rely on a compatibilizer to achieve uniform dispersion. Traditional compatibilizers improve the dispersion mainly through physical mixing, and have weak interfacial adhesion with the resin. Long-term storage or high temperature environment can cause micro powder agglomeration, resulting in increased local resistivity of the thermal sensitive layer and uneven coating, which affects the quality stability of the plate material.
[0007] Therefore, it is a technical problem to be solved in the field to develop an antistatic CTP plate with excellent antistatic performance, uniform dispersion of micro powder and stable comprehensive performance, and a preparation method thereof. SUMMARY
[0008] The technical problem to be solved by the present application is to provide an antistatic CTP plate and a preparation method thereof, which solve one or more of the above technical problems in the prior art.
[0009] To solve the above technical problems, the application adopts one technical scheme: an antistatic CTP plate, which has the following innovative points: comprising an aluminum base plate and a thermal sensitive layer coated on the aluminum base plate; the thermal sensitive layer is prepared from a coating material comprising the following components: 180-200 g of epoxy resin, 4-5 g of crosslinking agent, 6-8 g of infrared dye, 3 g of photoacid generator, 8-10 g of antistatic composite micro powder, 5 g of modified compatibilizer, 15 mL of butanol, and 1.75 g of ionic liquid 1-hexadecyl-3-methyl imidazole chloride; wherein:
[0010] The antistatic composite micro powder is a carbon nanotube-graphene composite loaded with nano copper.
[0011] The modified compatibilizer is an epoxy group-containing acrylate copolymer.
[0012] In some embodiments, the preparation method of the antistatic composite micro powder comprises the following steps:
[0013] (1) Carbon nanotube pretreatment: disperse the carbon nanotube in anhydrous ethanol, filter and dry after ball milling, to obtain carbon nanotube powder, wherein the rotation speed of ball milling is 3500-4000 r / min, and the time is 1.5-2 h;
[0014] (2) Graphene dispersion: add graphene into deionized water, and ultrasonically disperse to obtain graphene suspension, wherein the power of ultrasonic dispersion is 200-300 W, and the time is 30 min;
[0015] (3) Composite and nano copper loading: mix the carbon nanotube powder and the graphene suspension according to a mass ratio of 3:1, add a 35-40% mass fraction of nitric acid solution to stir for 30-60 min at a stirring speed of 400-600 r / min; then add a 8-10% mass fraction of formaldehyde aqueous solution and a 3.4% mass fraction of copper nitrate solution, ultrasonically disperse, add sodium hydroxide solution dropwise to adjust the pH to 8-9, stir for 30-50 min, and then filter and wash to obtain the carbon nanotube-graphene composite micro powder loaded with nano copper.
[0016] In some embodiments, the preparation method of the modified compatibilizer comprises the following steps:
[0017] (1) Intermediate product synthesis: mix 25 mL of a 28% mass fraction of sodium hydroxide solution, 20 mL of tetrahydrofuran, 3 g of tetrabutylammonium bromide, and 40 g of dodecanethiol, and stir for 20-30 min at a stirring speed of 100-150 r / min, then add 16.1 g of carbon disulfide and continue to stir for 5-10 min; add 32 g of 2-bromopropionic acid, stir at room temperature for 20-24 h, then heat to 55-60 °C and react for 2-3 h, separate the upper liquid layer, add 200 mL of n-hexane, stir for 4-6 h, then filter, recrystallize, and dry to obtain the intermediate product;
[0018] (2) RAFT polymerization: 6 g of the intermediate product, 7 g of methyl acrylate, 2 g of glycidyl methacrylate, and 0.1 g of azobisisobutyronitrile were added to 15 mL of 1,4-dioxane, and refluxed for 6-8 h. The modified compatibilizer containing epoxy groups was obtained after rotary evaporation, concentration, and drying.
[0019] In some embodiments, the heat-sensitive layer coating further comprises 0.5-1 g of silica aerogel to improve the thermal insulation performance of the heat-sensitive layer.
[0020] In some embodiments, the photoacid generator is tert-butylphenyl iodonium salt perfluorooctane sulfonic acid, the cross-linking agent is acrylamide, and the infrared dye is CTP infrared dye.
[0021] A method for preparing an antistatic CTP plate comprises the following steps:
[0022] (1) Preparation of antistatic composite micropowder;
[0023] (2) preparing a modified compatibilizer;
[0024] (3) Preparation of heat-sensitive layer coating: 5 g of modified compatibilizer was dissolved in 15 mL of butanol, 1.75 g of ionic liquid 1-hexadecyl-3-methylimidazole chloride and 8-10 g of antistatic composite micropowder were added, and ultrasonic dispersion was performed for 15-20 min; then 180-200 g of epoxy resin, 4-5 g of crosslinking agent, 6-8 g of infrared dye, 3 g of photoacid generator and 0.5-1 g of silica aerogel were added and mixed uniformly;
[0025] (4) Coating molding: The heat-sensitive layer coating is evenly coated on the aluminum base plate through an ultrasonic-assisted coating process, and an antistatic CTP plate is obtained after drying.
[0026] In some embodiments, after the ultrasound-assisted coating process, the surface of the aluminum substrate is subjected to low-temperature plasma treatment to improve the surface uniformity and antistatic stability of the thermal sensitive layer.
[0027] The beneficial effects of the present invention are: through the synergistic effect of material design (composite micropowder, modified compatibilizer), component optimization (aerogel addition) and process innovation (ultrasonic coating, plasma treatment), the present invention has achieved breakthrough improvements in antistatic performance, dispersion uniformity, imaging quality and long-term stability, and has outstanding substantive characteristics and significant progress compared with the existing technology. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments description will be briefly introduced as follows. Obviously, the drawings in the following description are only some embodiments of the present application, and all other drawings obtained by those of ordinary skill in the art based on these drawings without any creative effort should be within the protection scope of the present application.
[0029] Figure 1 is a flow chart of preparation of the antistatic composite micro powder for the antistatic CTP plate and its preparation method.
[0030] Figure 2 is a flow chart of preparation of the modified compatibilizer for the antistatic CTP plate and its preparation method.
[0031] Figure 3 is a flow chart of the antistatic CTP plate and its preparation method. DETAILED DESCRIPTION
[0032] The technical solutions in the embodiments of the present application will be described clearly and completely as follows. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without any creative effort should be within the protection scope of the present application.
[0033] The embodiments of the present application include:
[0034] As shown in Figure 1 , first of all, preparation of the antistatic composite micro powder (carbon nanotube-graphene composite loaded with nano copper)
[0035] Multi-walled carbon nanotubes (tube diameter 10-20 nm, length 5-10 μm) were added to anhydrous ethanol (carbon nanotubes: anhydrous ethanol = 1:10 mass ratio), transferred to a planetary ball mill (loaded with zirconium beads with a diameter of 0.5 mm), and ball-milled at a rotation speed of 3800 r / min for 1.8 h to cut the carbon nanotubes and reduce the length; after ball-milling, the zirconium beads were removed by filtration with a 300-mesh screen, and the filtrate was dried to constant weight in an oven at 80°C to obtain a short-cut carbon nanotube powder; a few-layer graphene (number of layers ≤5, flake diameter 5-10 μm) was added to deionized water (graphene: deionized water = 1:200 mass ratio), and ultrasonic dispersion was performed for 30 min using an ultrasonic cell disruptor (power 250 W, frequency 40 kHz) to obtain a uniform graphene suspension (concentration 5 mg / mL); the obtained carbon nanotube powder (20 g) was mixed with the graphene suspension (600 mL, containing about 3 g of graphene, carbon nanotube: graphene = 3:1), 100 mL of a 38% by mass nitric acid solution was added, and stirring was performed at a rotation speed of 500 r / min for 45 min to open the closed micropores of the carbon nanotubes and activate the surface; then, 150 mL of a 9% by mass formaldehyde aqueous solution (as a reducing agent) was added, 150 mL of a 3.4% by mass copper nitrate solution (to provide copper ions) was slowly added dropwise, and ultrasonic dispersion (power 200 W) was performed for 10 min; a 25% by mass sodium hydroxide solution was added dropwise to adjust the pH to 8.5, and stirring was performed for 40 min to reduce the copper ions to copper nanoparticles (particle size about 20-50 nm) and load the copper nanoparticles on the surface of the carbon nanotube-graphene composite structure; after suction filtration, washing with deionized water was performed three times, and vacuum drying was performed at 60°C for 12 h to obtain a carbon nanotube-graphene composite powder loaded with copper nanoparticles (referred to as an antistatic composite powder).
[0036] The carbon nanotubes and the graphene are combined to form a three-dimensional conductive network: the one-dimensional linear structure of the carbon nanotubes and the two-dimensional sheet structure of the graphene are mutually lapped, which significantly improves the continuity of the conductive path, and the resistivity of the composite structure is reduced by 20%-30% compared with that of single carbon nanotubes.
[0037] The copper nanoparticles are loaded instead of silver nanoparticles: the electrical conductivity of copper (5.96×10 7 S / m) is close to that of silver (6.30×10 7 S / m), but the cost is only 1 / 10 of that of silver; the copper nanoparticles are deposited on the surface of the carbon nanotube-graphene by formaldehyde reduction, which further enhances the thermal and electrical conductivity, and at the same time avoids the problem of long-term stability decline caused by silver ion migration.
[0038] As shown in Figure 2 , secondly, preparation of a modified compatibilizer (an acrylic ester copolymer containing an epoxy group)
[0039] Synthesis of intermediate product (RAFT agent): 25 mL of 28% mass fraction sodium hydroxide solution, 20 mL of tetrahydrofuran (THF), 3 g of tetrabutylammonium bromide (phase transfer catalyst) and 40 g of dodecanethiol (chain transfer agent precursor) were added into a 250 mL three-necked flask, and magnetically stirred (120 r / min) for 25 min; 16.1 g of carbon disulfide (CS2) was slowly added, and stirring was continued for 8 min; 32 g of 2-bromopropionic acid (initiator) was added, and stirring was continued at room temperature for 22 h, followed by heating to 58 °C for 2.5 h (RAFT agent synthesis reaction); after the reaction was completed, the mixture was allowed to stand for 7 h, and the upper organic phase was transferred to 200 mL of n-hexane, and stirring was continued for 5 h to precipitate the product, which was filtered and recrystallized with methanol for 3 times, and vacuum dried at 50 °C for 24 h to obtain a yellowish solid intermediate product (RAFT agent).
[0040] Synthesis of modified compatibilizer by RAFT polymerization: 6 g of the intermediate product, 7 g of methyl acrylate (MMA), 2 g of glycidyl methacrylate (GMA containing epoxy group), and 0.1 g of azobisisobutyronitrile (AIBN, initiator) were added into 15 mL of 1,4-dioxane (solvent), and nitrogen was introduced to remove oxygen for 30 min; heating was continued to 70 °C for reflux reaction for 7 h (RAFT controlled polymerization), and after the reaction was completed, the solvent was removed by rotary evaporation, and vacuum drying was continued at 60 °C until the weight was constant, to obtain a modified compatibilizer containing epoxy group (molecular weight about 15000, PDI≤1.2).
[0041] Introduction of epoxy group of GMA: the modified compatibilizer is grafted with GMA by RAFT polymerization, and the side chain epoxy group (-O-) can undergo ring-opening reaction with epoxy resin (containing epoxy group) to form chemical bond (such as ether bond), which significantly improves the interfacial compatibility of the compatibilizer and the epoxy resin, and avoids the problem of micro-powder agglomeration or delamination caused by physical mixing.
[0042] Advantages of RAFT controlled polymerization: the polymerization process is controlled by the RAFT agent, which ensures that the molecular weight distribution of the compatibilizer is narrow (PDI≤1.2), the emulsifying performance is stable, the influence on the viscosity of the heat-sensitive layer coating is small (the viscosity change is≤5%), and the coating leveling property is ensured.
[0043] As shown in Figure 3 , the last step is the preparation of the antistatic CTP plate
[0044] Preparation of the heat-sensitive layer coating: 5 g of the modified compatibilizer prepared in Example 2 was added to a 250 mL flask, 15 mL of butanol (solvent) was added, and magnetic stirring (200 r / min) was performed until complete dissolution; 1.75 g of the ionic liquid 1-hexadecyl-3-methylimidazolium chloride (to improve the dispersibility of the fine powder), 9 g of the antistatic composite fine powder prepared in Example 1, and 190 g of the epoxy resin (E-51 type), 4.5 g of acrylamide (crosslinking agent), 7.2 g of CTP infrared dye (absorption wavelength 830 nm), 3 g of t-butyl phenyl iodonium salt perfluorooctane sulfonic acid (photoacid generator), and 0.8 g of silica aerogel (particle size 200-500 nm) were sequentially added, and ultrasonic dispersion (power 300 W) was performed for 18 min to form a uniform emulsion; then, stirring (300 r / min) was continued for 30 min to obtain the heat-sensitive layer coating.
[0045] Ultrasonic-assisted coating and plasma treatment: the pretreated aluminum substrate (electrolytic roughening + anodic oxidation treatment, surface roughness Ra = 0.5 μm) was fixed on the coating machine, and an ultrasonic-assisted coating process was adopted: the coating was uniformly coated by a slot die (coating speed 2.5 m / min), and at the same time, 40 kHz ultrasonic vibration (power 50 W) was applied to further disperse the fine powder and reduce bubbles by using the ultrasonic cavitation effect; after coating, the aluminum substrate was dried in an oven at 80°C for 10 min (solvent evaporation), and then low-temperature plasma treatment (power 60 W, argon atmosphere, treatment time 8 min) was performed on the surface of the aluminum substrate to activate the surface hydroxyl groups (-OH) and enhance the adhesion between the heat-sensitive layer and the aluminum substrate.
[0046] Addition of silica aerogel: the aerogel has a nanoporous structure (specific surface area ≥ 800 m 2 / g), which can effectively block the lateral diffusion of heat in the heat-sensitive layer and improve the localization of infrared light-heat conversion (temperature concentration in the exposed area), thereby improving the imaging resolution.
[0047] Ultrasonic-assisted coating: ultrasonic vibration breaks the agglomerates of the antistatic composite fine powder by cavitation effect, making the fine powder more uniformly dispersed in the coating, and in combination with the chemical bonding effect of the modified compatibilizer, ensures the uniformity of the heat-sensitive layer (surface roughness Ra ≤ 0.2 μm).
[0048] Low-temperature plasma treatment: high-energy particles (such as Ar + ) in the plasma bombard the surface of the aluminum substrate, etching micro-protrusions and introducing hydroxyl groups (-OH), so that the surface energy of the aluminum substrate can be increased from the original 40 mN / m to 60 mN / m, enhancing the interfacial adhesion between the heat-sensitive layer and the aluminum substrate (peeling strength increased from the original 0.8 N / cm to 1.2 N / cm), and no peeling or cracking phenomenon occurs after long-term use (6 months).
[0049] Performance testing and comparison
[0050] The prepared CTP plate (denoted as sample A), CTP plate B on the market (denoted as sample B) and CTP plate C on the market (without compatibilizer, denoted as sample C) are selected for performance comparison, and the test results are as follows:
[0051]
[0052] In summary, the anti-static composite micro-powder of the application is optimized in structure, the chemical bonding of the modified compatibilizer is combined, the heat insulation design of the silica aerogel is combined, and the ultrasonic-plasma synergistic process is combined, which significantly improves the anti-static performance, uniformity, imaging quality and long-term stability of the CTP plate, and has outstanding substantial features and significant progress.
[0053] The technical solution has the advantages that: the technical solution adopts a carbon nanotube-graphene composite structure to replace a single carbon nanotube, a three-dimensional conductive network is formed by using the one-dimensional linear structure of the carbon nanotube and the two-dimensional sheet structure of the graphene, and the continuity of the conductive path is improved by 20%-30%; the nano-copper is loaded to replace nano-silver, the cost is reduced by about 90% while maintaining high conductivity, and long-term performance degradation caused by silver ion migration is avoided, and the surface resistivity only increases by 5% after 6 months.
[0054] Conductive performance data verification: the surface resistivity of sample A is as low as 4.8*10 4 Ω / cm 2 , and the anti-static effect is improved by about 32%.
[0055] Glycidyl methacrylate is introduced by RAFT polymerization, so that the compatibilizer side chain contains an epoxy group, and ring-opening reaction occurs with the epoxy resin to form a chemical bond, and the interfacial bonding force is improved by 50%, avoiding the problem of micro-powder agglomeration or delamination caused by physical mixing.
[0056] The advantage of the RAFT polymerization process is that the molecular weight distribution of the compatibilizer is narrow, the emulsification performance is stable, the influence on the viscosity of the coating is small, and the coating leveling property is ensured.
[0057] Heat insulation and imaging resolution improvement: adding silica aerogel, using its nano-porous structure to block the lateral diffusion of heat, improving the locality of light-heat conversion, the imaging resolution is improved from the original 175lpi to 200lpi, and the image clarity is significantly enhanced.
[0058] Ultrasonic-assisted coating further disperses the micro-powder through cavitation effect, and the surface of the aluminum-based plate is activated by low-temperature plasma treatment, so that the long-term bonding force between the heat-sensitive layer and the aluminum-based plate is improved by 57%, without falling off or cracking.
[0059] Nano-copper replaces nano-silver, the controllability of RAFT polymerization process and the high efficiency of ultrasonic-plasma process, which reduces the production threshold and cost, and improves the process stability, and is more suitable for industrial large-scale production demand.
[0060] The above only describes the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation using the content of the present application specification, or direct or indirect application in other related technical fields, are also included in the patent protection scope of the present application.
Claims
1. An antistatic CTP plate, characterized by: The invention comprises an aluminum substrate and a heat-sensitive layer coated on the aluminum substrate; the heat-sensitive layer is prepared from a coating comprising the following components: 180-200 g of epoxy resin, 4-5 g of a cross-linking agent, 6-8 g of an infrared dye, 3 g of a photoacid generator, 8-10 g of an antistatic composite micropowder, 5 g of a modified compatibilizer, 15 mL of butanol, and 1.75 g of an ionic liquid 1-hexadecyl-3-methylimidazole chloride; wherein: The antistatic composite micropowder is a carbon nanotube-graphene composite loaded with nano-copper; The modified compatibilizer is an acrylate copolymer containing epoxy groups.
2. The antistatic CTP plate according to claim 1, characterized in that: The preparation method of the antistatic composite micropowder comprises the following steps: (1) Carbon nanotube pretreatment: The carbon nanotubes were dispersed in anhydrous ethanol, ball-milled, filtered, and dried to obtain carbon nanotube powder, wherein the ball milling speed was 3500-4000 r / min and the time was 1.5-2 h; (2) Graphene dispersion: Graphene was added to deionized water and ultrasonically dispersed at a power of 200-300 W for 30 min to obtain a graphene suspension; (3) Composite and loaded nano-copper: carbon nanotube powder and graphene suspension are mixed in a mass ratio of 3:1, and a nitric acid solution with a mass fraction of 35-40% is added and stirred for 30-60 minutes at a stirring speed of 400-600 r / min; then, a formaldehyde aqueous solution with a mass fraction of 8-10% and a copper nitrate solution with a mass fraction of 3.4% are added, and after ultrasonic dispersion, sodium hydroxide solution is added dropwise to adjust the pH to 8-9, and the reaction is stirred for 30-50 minutes. After filtration and washing, carbon nanotube-graphene composite micropowder loaded with nano-copper is obtained.
3. The antistatic CTP plate according to claim 1, characterized in that: The preparation method of the modified compatibilizer comprises the following steps: (1) Synthesis of intermediate product: 25 mL of 28% sodium hydroxide solution, 20 mL of tetrahydrofuran, 3 g of tetrabutylammonium bromide, and 40 g of dodecanethiol were mixed and stirred for 20-30 min at a stirring speed of 100-150 r / min, 16.1 g of carbon disulfide was added, and stirring was continued for 5-10 min; 32 g of 2-bromopropionic acid was added, and the mixture was stirred at room temperature for 20-24 h, and then heated to 55-60° C. and reacted for 2-3 h. After separation, the upper layer was taken and added with 200 mL of n-hexane, stirred for 4-6 h, filtered, recrystallized, and dried to obtain the intermediate product; (2) RAFT polymerization: 6 g of the intermediate product, 7 g of methyl acrylate, 2 g of glycidyl methacrylate, and 0.1 g of azobisisobutyronitrile were added to 15 mL of 1,4-dioxane, and refluxed for 6-8 h. The modified compatibilizer containing epoxy groups was obtained after rotary evaporation, concentration, and drying.
4. The antistatic CTP plate according to claim 1, characterized in that: The heat-sensitive layer coating further comprises 0.5-1 g of silica aerogel to improve the heat insulation performance of the heat-sensitive layer.
5. The antistatic CTP plate according to claim 1, characterized in that: The photoacid generator is tert-butylphenyl iodonium salt perfluorooctane sulfonic acid, the cross-linking agent is acrylamide, and the infrared dye is CTP infrared dye.
6. A method for preparing an antistatic CTP plate according to any one of claims 1 to 5, characterized in that: The steps include: (1) Preparation of antistatic composite micropowder; (2) preparing a modified compatibilizer; (3) Preparation of heat-sensitive layer coating: 5 g of modified compatibilizer was dissolved in 15 mL of butanol, 1.75 g of ionic liquid 1-hexadecyl-3-methylimidazole chloride and 8-10 g of antistatic composite micropowder were added, and ultrasonic dispersion was performed for 15-20 min; then 180-200 g of epoxy resin, 4-5 g of crosslinking agent, 6-8 g of infrared dye, 3 g of photoacid generator and 0.5-1 g of silica aerogel were added and mixed uniformly; (4) Coating molding: The heat-sensitive layer coating is evenly coated on the aluminum base plate through an ultrasonic-assisted coating process, and an antistatic CTP plate is obtained after drying.
7. The method according to claim 1, wherein: After the ultrasonic-assisted coating process, the surface of the aluminum substrate is subjected to low-temperature plasma treatment to improve the surface uniformity and antistatic stability of the heat-sensitive layer.