Chip fixing primer based on two-component epoxy

Abstract

The invention discloses a chip fixing primer based on two-component epoxy, and relates to the field of semiconductor packaging materials, and the chip fixing primer comprises the following components: epoxy resin A glue with the viscosity of 20,000 + / -2,000 mPa.s; the viscosity of the epoxy resin B glue is 900 + / -100 mPa.s; a coupling agent; wherein the mass ratio of the epoxy resin adhesive A to the epoxy resin adhesive B ranges from 7.5: 1 to 8.0: 1, and the addition amount of the coupling agent is 0.5%-1% of the total mass of the epoxy resin adhesive A and the epoxy resin adhesive B; according to the chip fixing primer based on the two-component epoxy, a two-component epoxy system is adopted, so that the controllability of curing behaviors is improved, the adjustability of components is optimized, the interface bonding force is enhanced, and the environmental adaptability and durability of a packaging material are remarkably improved; the problem of colloid flowing or stress concentration caused by fluctuation of environment temperature and humidity of single-component glue is effectively avoided, and the stability and consistency of chip packaging are ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor packaging materials, in particular to a chip fixing base glue based on two-component epoxy. BACKGROUND

[0002] The existing chip packaging process mainly uses single-component epoxy glue as a fixing base glue, which forms physical fixation and sealing protection for chips through heating and curing, and is widely used in the fields of bonding of electronic components, chip packaging and potting treatment.

[0003] However, the curing behavior of single-component glue is strictly restricted by the temperature curve, and slow curing type is prone to glue flow (glue spreading) due to environmental temperature and humidity fluctuations, resulting in chip deviation or short circuit, while fast curing type increases the risk of interface delamination due to stress concentration; the chemical composition of the existing commercial single-component glue is unknown, and users cannot optimize the performance, the procurement cost is high, and the reliability of such glue is insufficient under long-term use, and under harsh environments such as heat and cold shock, the chip is prone to fall off, interface delamination and other failures, affecting the service life of the packaged device. SUMMARY

[0004] The purpose of the present application is to provide a chip fixing base glue based on two-component epoxy to solve the problem that the single-component epoxy glue in the prior art is significantly affected by the curing characteristics of the environment temperature and humidity, the composition is not transparent, the performance optimization is difficult, and the long-term reliability is insufficient, which easily causes chip deviation, interface delamination and failure in a humid environment.

[0005] In order to achieve the above purpose, the present application provides a chip fixing base glue based on two-component epoxy, which comprises the following components and proportions:

[0006] Epoxy resin A glue, viscosity 20,000±2,000 mPa·s;

[0007] Epoxy resin B glue, viscosity 900±100 mPa·s;

[0008] Coupling agent;

[0009] The mass ratio of the epoxy resin A glue to the epoxy resin B glue is 7.5:1 to 8.0:1, and the coupling agent is added in an amount of 0.5%-1% of the total mass of the epoxy resin A glue and the epoxy resin B glue.

[0010] Further, the mass ratio of the epoxy resin A glue to the epoxy resin B glue is 7.8:1.

[0011] Further, the viscosity of the epoxy resin A glue is 20,000 mPa·s, and the viscosity of the epoxy resin B glue is 900 mPa·s.

[0012] Further, the coupling agent is selected from at least one of a silane coupling agent, a titanate coupling agent or a zirconate coupling agent.

[0013] Further, the epoxy resin A glue is selected from at least one of a bisphenol F type epoxy resin, a biphenyl type epoxy resin or a silicone modified epoxy resin.

[0014] Further, the epoxy resin B glue is selected from at least one of methyl tetrahydrophthalic anhydride, isophorone diamine or 4,7,10-trioxa-1,13-tridecanediamine.

[0015] Another aspect of the present application provides a preparation method of the above-mentioned two-component epoxy-based chip fixing primer, comprising the following steps:

[0016] S1, preheat the epoxy resin A glue to 35-45 DEG C, constant temperature stirring for 10-20 minutes;

[0017] S2, add epoxy resin B glue, stirring and mixing at 25-30 DEG C;

[0018] S3, add the coupling agent, stir until mixed well, to obtain the mixed glue solution;

[0019] S4, defoam the mixed glue solution under a vacuum degree of ≤0.1 kPa for 10-30 minutes, and store separately.

[0020] Compared with the prior art, the two-component epoxy-based chip fixing primer provided by the present application realizes the improvement of controllability of curing behavior, the optimization of component adjustability and the enhancement of interface bonding force, significantly improves the environmental adaptability and durability of the packaging material, effectively avoids the problems of glue flow or stress concentration caused by environmental temperature and humidity fluctuations of the single-component glue, and ensures the stability and consistency of the chip packaging. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments described in the present application, and other drawings can also be obtained by those skilled in the art according to these drawings.

[0022] Figure 1 The preparation method process flow chart of the two-component epoxy-based chip fixing primer provided by the present application is shown in the following figure. DETAILED DESCRIPTION

[0023] In order to make the above-mentioned purposes, features and advantages of the present application more apparent and easy to understand, the specific embodiments of the present application will be described in detail below.

[0024] In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. However, it will be apparent to one skilled in the art that the present application can be practiced without the specific details set forth in this description. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the present application.

[0025] In addition, the experimental methods used in the following examples are conventional methods, and the materials and reagents used are commercially available unless otherwise specified. The equipment used in the experiments is well known to those skilled in the art unless otherwise specified.

[0026] Example 1

[0027] A two-component epoxy-based chip fixing primer, comprising the following components and proportions:

[0028] Epoxy resin A glue: bisphenol F type epoxy resin is used, and the specific model is EPON862, the viscosity is 20,000 mPa·s, and the test standard refers to ASTM D1084;

[0029] Epoxy resin B glue: methyl tetrahydrophthalic anhydride curing agent is selected, and the specific model is HY-917, and the viscosity is 900 mPa·s;

[0030] Coupling agent: γ-glycidyl ether oxypropyl trimethoxysilane coupling agent is added, and a typical representative is KH-560, and the addition amount is 0.8% of the total mass of epoxy resin A glue and B glue;

[0031] Among them, A glue and B glue are accurately weighed according to the mass ratio of 7.8:1.

[0032] Please refer to Figure 1 A preparation method for preparing the above-mentioned two-component epoxy-based chip fixing primer, comprising the following steps:

[0033] S1, preheat the epoxy resin A glue to 40°C, and stir at constant temperature for 15 minutes;

[0034] S2, add epoxy resin B glue, and stir and mix at 27°C;

[0035] S3, add the coupling agent, stir until mixed well, and obtain the mixed glue solution;

[0036] S4, defoam the mixed glue solution under a vacuum degree of 0.08 kPa for 20 minutes, and store separately.

[0037] Example 2

[0038] A two-component epoxy-based chip fixing primer, comprising the following components and proportions:

[0039] Epoxy resin A glue: biphenyl type epoxy resin YX4000H, viscosity strictly controlled at 20,000 mPa·s;

[0040] Epoxy resin B glue: isophorone diamine curing agent IPDA, viscosity stabilized at 900 mPa·s; coupling agent: titanium coupling agent NDZ-201 is added, the amount is 0.6% of the total mass of AB glue;

[0041] The mass ratio of A glue to B glue is 7.5:1.

[0042] A method for preparing the above-mentioned two-component epoxy-based chip fixing primer: same as example 1.

[0043] Example 3

[0044] A two-component epoxy-based chip fixing primer, comprising the following components and proportions:

[0045] Epoxy resin A glue: silicone-modified epoxy resin, viscosity 22,000 mPa·s;

[0046] Epoxy resin B glue: 4,7,10-trioxy-1,13-tridecanediamine curing agent, viscosity 800 mPa·s;

[0047] Coupling agent: zirconate coupling agent NZ-38, the amount is 1.0%;

[0048] The mass ratio of A glue to B glue is 8.0:1.

[0049] A method for preparing the above-mentioned two-component epoxy-based chip fixing primer: same as example 1.

[0050] In order to verify the effect of the glue under the formula of the application, the following experiments are carried out on the glue prepared in the above examples, as follows:

[0051] 1. Thrust test

[0052] 1.1 Experimental method:

[0053] According to the industry standard JESD22-B117, the chip thrust test is carried out;

[0054] In the environment of 25℃, humidity 60%, after coating and curing, the thrust values at 6H, 12H, 18H, 24H, 30H, 36H, 42H, 48H, 54H time points are tested respectively;

[0055] Each group is repeated 20 times;

[0056] 1.2 Experimental results:

[0057]

[0058] 2. Reliability comparison experiment (two-component glue vs one-component glue)

[0059] 2.1 Experimental method:

[0060] 2.1.1 Test items:

[0061] PCT (pressure cooking test): 121℃, 100% RH, 2atm, 100 hours;

[0062] Cold and hot impact: 200 rounds (120min per round);

[0063] Breathing experiment: 85℃ / 85%RH→25℃ / 60%RH, 3 cycles (24 hours per cycle);

[0064] Long-term storage: 25℃ dry environment, 28 days;

[0065] 2.1.2 Sample grouping:

[0066] Experimental group: P2.5 module (2.5x2.5mm), coated with Example 1 glue;

[0067] Control group: P1.25 module (1.25x1.25mm), coated with commercially available one-component glue;

[0068] 2.1.3 Failure judgment standard:

[0069] Failure judgment standard: R represents resistance failure, i.e. resistance value change >±20%; G represents chip falling off, i.e. chip separation from substrate (A point falling off); B represents line breakage, i.e. wire breakage (D point breakage);

[0070] 2.2 Experimental results:

[0071]

[0072] Note: A point refers to the position of the chip electrode pad; 2B refers to 2 samples with B type failure; 10G refers to 10 samples with G type failure.

[0073] Failure mechanism analysis:

[0074] Two-component glue advantage: coupling agent enhances the interfacial bonding force of epoxy resin and metal pad (A point); no delamination (breathing experiment) proves excellent moisture resistance.

[0075] One-component glue defect: thermal expansion coefficient mismatch leads to chip rotation and falling off (G type failure); weak interface bonding causes silver glue peeling.

[0076] The foregoing merely illustrates some exemplary embodiments of the application, and it will be appreciated that those skilled in the art will be able to devise various modifications without departing from the spirit and scope of the application. The appended drawings and description are illustrative only, and are not intended to be limiting.

Claims

1. A chip fixing primer based on two-component epoxy, characterized in that: Includes the following components and proportions: Epoxy resin A glue, viscosity 20,000±2,000mPa·s; Epoxy resin B glue, viscosity 900±100mPa·s; coupling agent; Among them, the mass ratio of the epoxy resin A glue and the epoxy resin B glue ranges from 7.5:1 to 8.0:1, and the added amount of the coupling agent is 0.5%-1% of the total mass of the epoxy resin A glue and the epoxy resin B glue.

2. The two-component epoxy-based chip fixing primer according to claim 1, characterized in that: The mass ratio of epoxy resin A glue to epoxy resin B glue is 7.8:

1.

3. The two-component epoxy-based chip fixing primer according to claim 1, characterized in that: The viscosity of epoxy resin A glue is 20,000 mPa·s, and the viscosity of epoxy resin B glue is 900 mPa·s.

4. The two-component epoxy-based chip fixing primer according to claim 1, characterized in that: The coupling agent is selected from at least one of a silane coupling agent, a titanate coupling agent or a zirconate coupling agent.

5. The two-component epoxy-based chip fixing primer according to claim 1, characterized in that: The epoxy resin A glue is selected from at least one of bisphenol F epoxy resin, biphenyl epoxy resin or organosilicon modified epoxy resin.

6. The two-component epoxy-based chip mounting primer according to claim 1, characterized in that: The epoxy resin B glue is selected from at least one of methyltetrahydrophthalic anhydride, isophoronediamine or 4,7,10-trioxy-1,13-tridecanediamine.

7. A method for preparing the two-component epoxy-based chip mounting primer according to any one of claims 1 to 6, characterized in that: The following steps are involved: S1. Preheat epoxy resin A to 35-45°C and stir at constant temperature for 10-20 minutes; S2. Add epoxy resin B glue and stir to mix at 25-30°C; S3, adding a coupling agent and stirring until fully mixed to obtain a mixed glue solution; S4. Degas the mixed glue solution at a vacuum degree of ≤0.1kPa for 10-30 minutes, and store it in aliquots.

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