Heat dissipation device and server

Abstract

The heat dissipation device comprises a cold plate, a heat dissipation mechanism and a cooling medium, the cold plate is used for being in heat transfer connection with a heating element, and the cold plate is provided with a first liquid inlet, a first liquid outlet and a cooling cavity which communicate with one another; the heat dissipation mechanism is provided with a second liquid inlet, a second liquid outlet and a heat dissipation cavity which are communicated, the second liquid inlet is communicated with the first liquid outlet, and the second liquid outlet is communicated with the first liquid inlet; the cooling medium comprises fluid and a phase change body, the fluid can drive the phase change body to circularly flow between the cooling cavity and the heat dissipation cavity, the phase change body located in the cooling cavity can absorb heat and be melted, and the phase change body located in the heat dissipation cavity can dissipate heat and be solidified. Compared with the prior art, according to the heat dissipation device, the phase change body can absorb heat of the fluid in a phase change mode, so that the cooling medium can absorb more heat on the whole, the heat dissipation efficiency of the heat dissipation device is improved, and a server can operate normally.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of server heat dissipation, and in particular to a heat dissipation device and a server. BACKGROUND

[0002] A server is internally integrated with a large number of high-power electronic components, such as a central processing unit (CPU), a graphics processing unit (GPU), a memory module, a hard disk and the like. As the power consumption of the electronic components is higher and higher, the heat generated by the server during operation is also higher and higher. When the temperature inside the server exceeds the tolerance threshold of the electronic components, not only will the operation efficiency of the server be reduced, the operation will be lagged and the like, but also serious irreparable losses such as data loss will be caused.

[0003] In the conventional technology, a liquid cooling method is usually used to dissipate heat from the electronic components inside the server. However, for a high-power server, the heat dissipation effect of the liquid cooling method is limited, thereby affecting the normal operation of the server. SUMMARY

[0004] Therefore, it is necessary to provide a heat dissipation device and a server in order to solve the problem that the heat dissipation effect of the liquid cooling method in the conventional technology is limited, thereby affecting the normal operation of the server.

[0005] The technical scheme is as follows:

[0006] One embodiment provides a heat dissipation device, comprising:

[0007] A cold plate is used to be in heat transfer connection with a heat generating component, and the cold plate is provided with a first liquid inlet, a first liquid outlet and a cooling cavity which are in communication;

[0008] A heat dissipation mechanism is provided with a second liquid inlet, a second liquid outlet and a heat dissipation cavity which are in communication, the second liquid inlet is in communication with the first liquid outlet, and the second liquid outlet is in communication with the first liquid inlet; and

[0009] A cooling medium comprises a fluid and a phase change body, the fluid can drive the phase change body to circulate and flow between the cooling cavity and the heat dissipation cavity, the phase change body in the cooling cavity can absorb heat and melt, and the phase change body in the heat dissipation cavity can dissipate heat and solidify.

[0010] The fluid in the cooling cavity of the cooling plate can absorb the heat generated by the heat generating element, the temperature of the fluid after absorbing heat rises, the phase change body melts, and the phase change body absorbs the heat of the fluid during the melting process, so that the temperature of the fluid remains basically unchanged, and then the cooling medium can maintain a lower temperature for a certain period of time and absorb more heat; then, the fluid drives the phase change body to enter the heat dissipation cavity of the heat dissipation mechanism through the first liquid outlet and the second liquid inlet, the heat dissipation mechanism dissipates heat of the cooling medium in the heat dissipation cavity, the temperature of the fluid decreases during the heat dissipation process, and the temperature of the phase change body decreases during the heat dissipation process and gradually solidifies, the fluid after heat dissipation drives the solidified phase change body to return to the cooling cavity of the cooling plate through the second liquid outlet and the first liquid inlet in turn, so as to absorb the heat generated by the heat generating element, and the cycle is repeated, so as to cool the heat generating element; compared with the traditional technology, the phase change body can absorb heat from the fluid by phase change, so that the cooling medium as a whole can absorb more heat, thereby improving the heat dissipation efficiency of the heat dissipation device, and enabling the server to operate normally.

[0011] In one of the embodiments, the phase change body comprises a phase change material and a heat transfer shell, the phase change material is arranged in the heat transfer shell, and the heat transfer shell can flow with the fluid.

[0012] In one of the embodiments, the heat dissipation mechanism comprises a heat dissipation piece and a heat dissipation fin, the heat dissipation piece is provided with the heat dissipation cavity, and the heat dissipation fin is arranged on the outer wall of the heat dissipation piece.

[0013] In one of the embodiments, the heat dissipation piece is provided with at least two, the at least two heat dissipation pieces are arranged at intervals along a first direction of the heat dissipation mechanism, one of the two adjacent heat dissipation pieces is connected with one end of the heat dissipation fin, and the other of the two adjacent heat dissipation pieces is connected with the other end of the heat dissipation fin.

[0014] In one of the embodiments, the heat dissipation mechanism further comprises a first liquid collecting piece and a second liquid collecting piece, the first liquid collecting piece is provided with a first liquid collecting cavity extending along the first direction, and the second liquid inlet is arranged in the first liquid collecting piece and communicates with the first liquid collecting cavity; the second liquid collecting piece is provided with a second liquid collecting cavity extending along the first direction, the second liquid outlet is arranged in the second liquid collecting piece and communicates with the second liquid collecting cavity, one end of the heat dissipation piece along a second direction is connected with the first liquid collecting piece, the other end of the heat dissipation piece along the second direction is connected with the second liquid collecting piece, so that the first liquid collecting cavity and the second liquid collecting cavity both communicate with the heat dissipation cavity, and the second direction forms an angle with the first direction.

[0015] In one of the embodiments, the heat dissipation mechanism further comprises at least one partition arranged in the heat dissipation cavity and separating the heat dissipation cavity into at least two heat dissipation channels, one end of the heat dissipation channel being in communication with the second liquid inlet, and the other end of the heat dissipation channel being in communication with the second liquid outlet.

[0016] In one of the embodiments, the heat dissipation device further comprises a delivery pump arranged in the cooling cavity, the delivery pump being configured to sequentially pump the cooling medium in the cooling cavity into the heat dissipation cavity through the first liquid outlet and the second liquid inlet, and sequentially pump the cooling medium in the heat dissipation cavity into the cooling cavity through the second liquid outlet and the second liquid inlet.

[0017] In one of the embodiments, the cold plate comprises at least two cold plates, the first liquid outlet of one of the cold plates being in communication with the first liquid inlet of another of the cold plates.

[0018] In one of the embodiments, the heat dissipation device further comprises a first delivery pipe and a second delivery pipe, one end of the first delivery pipe being in communication with the first liquid outlet, the other end of the first delivery pipe being in communication with the second liquid inlet, one end of the second delivery pipe being in communication with the second liquid outlet, and the other end of the second delivery pipe being in communication with the first liquid inlet.

[0019] Another embodiment provides a server, the server comprising a cabinet, a heat generating element, and a heat dissipation device as described above, the heat generating element and the heat dissipation device being arranged in the cabinet.

[0020] In the server described above, the fluid in the cooling cavity of the cold plate can absorb the heat generated by the heat generating element, the temperature of the fluid after absorbing the heat rises, the phase change body melts, and in the melting process, the phase change body absorbs the heat of the fluid, so that the temperature of the fluid remains basically unchanged, thereby enabling the cooling medium to maintain a lower temperature for a certain period of time and absorb more heat; subsequently, the fluid drives the phase change body to enter the heat dissipation cavity of the heat dissipation mechanism through the first liquid outlet and the second liquid inlet, the heat dissipation mechanism dissipates the heat of the cooling medium in the heat dissipation cavity, the temperature of the fluid decreases in the heat dissipation process, the temperature of the phase change body decreases and gradually solidifies in the heat dissipation process, and the fluid after heat dissipation drives the solidified phase change body to return to the cooling cavity of the cold plate through the second liquid outlet and the first liquid inlet in sequence, so as to absorb the heat generated by the heat generating element, and the cycle is repeated, thereby cooling the heat generating element; compared with the traditional technology, in the server described above, the phase change body can absorb the heat of the fluid through phase change, so that the cooling medium as a whole can absorb more heat, thereby improving the heat dissipation efficiency of the heat dissipation device, and enabling the server to operate normally. BRIEF DESCRIPTION OF DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings needed in the embodiment description. Obviously, the drawings in the following description only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained without creative labor under the premise of not departing from the concept of the present application.

[0022] Figure 1 The structure diagram of the heat dissipation device in an embodiment of the present application.

[0023] Figure 2 The structure diagram of the heat dissipation mechanism in an embodiment of the present application.

[0024] Figure 3 The structure diagram of the heat dissipation device in an embodiment of the present application. Figure 2

[0025] Figure 4 The principle diagram of the heat dissipation device in an embodiment of the present application.

[0026] Figure 5 The structure diagram of the heat dissipation mechanism in another embodiment of the present application.

[0027] Figure 6 The diagram of the cooling medium in an embodiment of the present application.

[0028] Figure 7 The temperature change curve diagram of the cooling medium in an embodiment of the present application when absorbing heat.

[0029] The figure caption description:

[0030] 100, cold plate; 110, first liquid inlet; 120, first liquid outlet; 130, cooling cavity; 200, heat dissipation mechanism; 210, second liquid inlet; 220, second liquid outlet; 230, heat dissipation cavity; 231, heat dissipation channel; 240, heat dissipation piece; 250, heat dissipation fin; 260, first liquid collecting piece; 270, second liquid collecting piece; 280, partition piece; 310, fluid; 320, phase change body; 321, phase change material; 322, heat transfer shell; 410, first conveying pipe; 420, second conveying pipe; 430, third conveying pipe; 500, heating element; 600, conveying pump. DETAILED DESCRIPTION

[0031] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application will be described in detail below. In the following description, a lot of specific details are set forth in order to fully understand the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the concept of the present application, therefore the present application is not limited to the specific embodiments disclosed below.​

[0032] In the description of the present application, it should be understood that, if there are terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0033] In addition, if there are terms such as "first", "second" appear, these terms are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined with "first", "second" can include at least one of the features explicitly or implicitly. In the description of the present application, if the term "multiple" appears, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0034] In the present application, unless otherwise explicitly specified and limited, if the terms "mounting", "connecting", "connecting", "fixing" and the like appear, these terms should be interpreted broadly. For example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the internal communication of two elements or the interaction relationship between two elements, unless otherwise explicitly limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] In the present application, unless otherwise explicitly specified and limited, if the first feature appears "on" or "under" the second feature and the like, the meaning can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature "above", "above" and "above" of the second feature can be that the first feature is directly above or obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" of the second feature can be that the first feature is directly below or obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.

[0036] It is to be noted that when an element such as a layer, region or substrate is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element or intervening elements can be present. In addition, it is to be noted that the term "comprising" or "containing" herein means "including". The accompanying drawings are included to provide a further understanding of the application, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present application and, together with the description, serve to explain the principles of the present application.

[0037] Referring to Figure 1 , Figure 4 and Figure 6 , one embodiment of the present application provides a heat dissipation device, comprising a cold plate 100, a heat dissipation mechanism 200 and a cooling medium, the cold plate 100 is used for heat transfer connection with a heat generating element 500, the cold plate 100 is provided with a first liquid inlet 110, a first liquid outlet 120 and a cooling cavity 130 which are communicated; the heat dissipation mechanism 200 is provided with a second liquid inlet 210, a second liquid outlet 220 and a heat dissipation cavity 230 which are communicated, the second liquid inlet 210 is communicated with the first liquid outlet 120, and the second liquid outlet 220 is communicated with the first liquid inlet 110; the cooling medium comprises a fluid 310 and a phase change body 320, the fluid 310 can drive the phase change body 320 to circulate between the cooling cavity 130 and the heat dissipation cavity 230, the phase change body 320 located in the cooling cavity 130 can absorb heat and melt, and the phase change body 320 located in the heat dissipation cavity 230 can dissipate heat and solidify.

[0038] The heat dissipation device described above, the fluid 310 in the cooling cavity 130 of the cold plate 100 can absorb the heat generated by the heat generating element 500, the temperature of the fluid 310 after absorbing heat is increased, the phase change body 320 is melted, in the melting process, the phase change body 320 will absorb the heat of the fluid 310, so that the temperature of the fluid 310 remains basically unchanged, and then the cooling medium can maintain a lower temperature for a certain period of time and absorb more heat; subsequently, the fluid 310 will drive the phase change body 320 to enter the heat dissipation cavity 230 of the heat dissipation mechanism 200 through the first liquid outlet 120 and the second liquid inlet 210, the heat dissipation mechanism 200 dissipates heat of the cooling medium in the heat dissipation cavity 230, the temperature of the fluid 310 is reduced in the heat dissipation process, the temperature of the phase change body 320 is reduced and gradually solidifies in the heat dissipation process, the fluid 310 after heat dissipation drives the solidified phase change body 320 to return to the cooling cavity 130 of the cold plate 100 in turn through the second liquid outlet 220 and the first liquid inlet 110, so as to absorb the heat generated by the heat generating element 500, and the cycle is repeated, so as to cool the heat generating element 500; compared with the prior art, the phase change body 320 can absorb heat of the fluid 310 by phase change, so that the cooling medium as a whole can absorb more heat, and the heat dissipation efficiency of the heat dissipation device is improved, so that the server can operate normally.

[0039] As an auxiliary understanding, the relationship between the heat absorbed by the cooling medium and the temperature of the cooling medium is as shown in the following formula: Figure 7 As shown, during the melting process, the phase change body 320 absorbs the heat of the fluid 310, so that the temperature of the fluid 310 remains basically unchanged, and thus the temperature of the cooling medium can be maintained for a certain period of time to absorb more heat.

[0040] As an example, the heat generating element 500 can be a central processing unit (CPU), a graphics processing unit (GPU), a memory module, a hard disk, etc., which is not limited here.

[0041] Further, since the power consumption and heat dissipation of the CPU are relatively higher than those of other electronic elements, the cold plate 100 in the embodiment is mainly arranged on the CPU of the server to prevent the phenomenon of overheating of the CPU.

[0042] In some embodiments, the heat dissipation mechanism 200 can cool the cooling medium in the heat dissipation cavity 230 by air cooling, water cooling, etc., which can be flexibly selected according to the specific application scenario of the server, which is not limited here.

[0043] Optionally, the fluid 310 can be deionized water, antifreeze, mineral oil or synthetic oil, etc., as long as the fluid 310 itself has a certain heat absorption effect and can drive the phase change body 320 to flow, which is not limited here.

[0044] In one embodiment, the phase change body 320 is a microencapsulated phase change material (MEPCM).

[0045] Please refer to Figure 1 and Figure 4 In one embodiment, the heat dissipation device further comprises a first conveying pipe 410 and a second conveying pipe 420, one end of the first conveying pipe 410 is in communication with the first liquid outlet 120, the other end of the first conveying pipe 410 is in communication with the second liquid inlet 210, one end of the second conveying pipe 420 is in communication with the second liquid outlet 220, and the other end of the second conveying pipe 420 is in communication with the first liquid inlet 110.

[0046] In this way, the fluid 310 in the cooling cavity 130 of the cold plate 100 can drive the phase change body 320 to be conveyed into the heat dissipation cavity 230 of the heat dissipation mechanism 200 through the first conveying pipe 410 and cooled, after cooling, the fluid 310 in the heat dissipation cavity 230 can drive the phase change body 320 to be conveyed into the cooling cavity 130 of the cold plate 100 through the second conveying pipe 420 to cool the heat generating element 500, thereby realizing the reciprocating circulation of the cooling medium.

[0047] Referring to Figure 1 In one embodiment, the plurality of cold plates 100 are provided, and a first outlet 120 of one of the cold plates 100 is in communication with a first inlet 110 of another of the cold plates 100.

[0048] The plurality of cold plates 100 can simultaneously dissipate heat from the plurality of heat generating elements 500, and the first outlet 120 of one of the cold plates 100 is in communication with the first inlet 110 of another of the cold plates 100, so that the cooling medium can flow from one of the cold plates 100 to another of the cold plates 100, and thus the cooling medium can carry away heat from two or more heat generating elements 500 in one circulation, thereby improving the heat dissipation efficiency.

[0049] It can be understood that one heat generating element 500 can correspond to one cold plate 100, or two or more cold plates 100, which is not specifically limited here.

[0050] Referring to Figure 1 In one embodiment, the heat dissipation device further comprises a third conveying pipe 430, one end of the third conveying pipe 430 is in communication with the first outlet 120 of one of the cold plates 100, and the other end of the third conveying pipe 430 is in communication with the first inlet 110 of another of the cold plates 100, so as to realize the conveying of the cooling medium between different cold plates 100.

[0051] In some embodiments, the cooling medium can be pumped to flow by providing a conveying pump 600, for example, the conveying pump 600 can be provided in the first conveying pipe 410, or in the second conveying pipe 420 and / or the third conveying pipe 430, as long as it can provide power for the reciprocating circulation of the cooling medium between the cooling cavity 130 and the heat dissipation cavity 230, which is not specifically limited here.

[0052] Referring to Figure 4 In one embodiment, the conveying pump 600 is arranged in the cooling cavity 130, and the conveying pump 600 is used to pump the cooling medium in the cooling cavity 130 into the heat dissipation cavity 230 through the first outlet 120 and the second inlet 210 in sequence, and pump the cooling medium in the heat dissipation cavity 230 into the cooling cavity 130 through the second outlet 220 and the second inlet 210 in sequence.

[0053] Arranging the conveying pump 600 in the cooling cavity 130 can reduce the space occupancy of the heat dissipation device in the server case, thereby facilitating the compactness and miniaturization of the server.

[0054] Referring to Figure 6In one embodiment, the phase change body 320 comprises a phase change material 321 and a heat transfer shell 322, the phase change material 321 is arranged in the heat transfer shell 322, and the heat transfer shell 322 can flow with the fluid 310.

[0055] When the fluid 310 flows into the cooling cavity 130 of the cold plate 100, the fluid 310 absorbs the heat of the heat generating element 500, the heat is transferred to the phase change material 321 through the heat transfer shell, the phase change material 321 absorbs the heat of the fluid 310 and melts into a liquid state in the heat transfer shell 322, so that the temperature of the fluid 310 can be kept basically unchanged for a certain period of time, and the cooling medium can maintain a lower temperature and absorb more heat for a certain period of time. By arranging the phase change material 321 in the heat transfer shell 322, the melted phase change material 321 can be prevented from polluting the fluid 310, thereby improving the reliability of the heat dissipation device.

[0056] For example, the phase change material 321 is n-hexadecane, and the material of the heat transfer shell 322 is urea-formaldehyde resin.

[0057] For example, the phase change material 321 absorbs the heat of the fluid 310 and melts into a liquid state in the heat transfer shell 322, and in the heat dissipation mechanism 200, the phase change material 321 dissipates heat and solidifies into a solid state in the heat transfer shell 322.

[0058] For example, the phase change material 321 absorbs the heat of the fluid 310 and melts into a liquid state in the heat transfer shell 322, and in the heat dissipation mechanism 200, the phase change material 321 dissipates heat and solidifies into a solid state in the heat transfer shell 322. Figure 2 Figure 3 Figure 5 In one embodiment, the heat dissipation mechanism 200 comprises a heat dissipation member 240 and a heat dissipation fin 250, the heat dissipation member 240 is provided with a heat dissipation cavity 230, and the heat dissipation fin 250 is arranged on the outer wall of the heat dissipation member 240.

[0059] The heat dissipation fin 250 can increase the heat dissipation area of the heat dissipation member 240, thereby improving the heat dissipation efficiency of the phase change body 320 in the heat dissipation cavity 230.

[0060] Further, the heat dissipation fin 250 is arranged on the outer wall of the heat dissipation member 240 in at least two and spaced apart, so as to further increase the heat dissipation area and improve the heat dissipation efficiency of the heat dissipation body.

[0061] Optionally, the shape of the heat dissipation fin 250 can be flat, corrugated, sawtooth or needle-shaped fin, etc., as long as it can increase the heat dissipation area of the heat dissipation member 240, which is not limited here.

[0062] For example, the phase change material 321 absorbs the heat of the fluid 310 and melts into a liquid state in the heat transfer shell 322, and in the heat dissipation mechanism 200, the phase change material 321 dissipates heat and solidifies into a solid state in the heat transfer shell 322. Figure 2 Figure 3 Figure 5 ​​​​In one embodiment, the heat dissipation member 240 is provided with at least two heat dissipation members 240, the at least two heat dissipation members 240 are arranged in the first direction of the heat dissipation mechanism 200, one of the at least two heat dissipation members 240 is connected with one end of the heat dissipation fin 250, and the other of the at least two heat dissipation members 240 is connected with the other end of the heat dissipation fin 250.

[0063] The cooling medium enters the at least two heat dissipation members 240 after absorbing the heat of the heat generating element 500 to achieve heat dissipation, the at least two heat dissipation members 240 can increase the heat dissipation area of the cooling medium, thereby improving the heat dissipation efficiency.

[0064] Further, one of the at least two heat dissipation members 240 is connected with one end of the heat dissipation fin 250, and the other of the at least two heat dissipation members 240 is connected with the other end of the heat dissipation fin 250, so as to fully utilize the heat dissipation fin 250 for heat dissipation, thereby reducing the space utilization rate of the heat dissipation mechanism 200.

[0065] Please refer to Figure 2 , Figure 3 and Figure 5 In one embodiment, the at least two heat dissipation members 240 are arranged in the first direction of the heat dissipation mechanism 200, and the heat dissipation gap is arranged between the at least two heat dissipation members 240, and the heat dissipation fin 250 is arranged in the heat dissipation gap, and the heat dissipation gap is used for the heat dissipation medium to enter, so that the heat dissipation medium can take away the heat of the heat dissipation fin 250.

[0066] Optionally, the heat dissipation medium can be in the form of cooling air to take away the heat of the heat dissipation gap, or in the form of cooling liquid to take away the heat of the heat dissipation gap, which is not limited here.

[0067] Please refer to Figure 2 , Figure 3 and Figure 5 In one embodiment, a plurality of heat dissipation fins 250 are arranged between the at least two heat dissipation members 240 to further increase the heat dissipation area of the cooling medium.

[0068] Please refer to Figure 2 , Figure 3 and Figure 5 In one embodiment, all the heat dissipation members 240 are in the form of plates, and the at least two heat dissipation members 240 are arranged in parallel and spaced apart in the first direction of the heat dissipation mechanism 200, and the heat dissipation fin 250 is arranged between the at least two heat dissipation members 240.

[0069] As an explanation, in the above embodiment, the first direction of the heat dissipation mechanism 200 is the height direction of the heat dissipation mechanism 200, that is, the A direction in Figure 2 and Figure 5 which will not be repeated here.

[0070] Please refer to Figure 1 ,Figure 2 and Figure 5 In one embodiment, the heat dissipation mechanism 200 further comprises a first liquid collecting member 260 and a second liquid collecting member 270. The first liquid collecting member 260 is provided with a first liquid collecting cavity extending along a first direction, and the second liquid inlet 210 is formed in the first liquid collecting member 260 and communicates with the first liquid collecting cavity. The second liquid collecting member 270 is provided with a second liquid collecting cavity extending along the first direction, and the second liquid outlet 220 is formed in the second liquid collecting member 270 and communicates with the second liquid collecting cavity. The heat dissipation member 240 is connected to the first liquid collecting member 260 at one end along a second direction, and is connected to the second liquid collecting member 270 at the other end along the second direction, so that the first liquid collecting cavity and the second liquid collecting cavity both communicate with the heat dissipation cavity 230. The second direction forms an angle with the first direction.

[0071] When the heat dissipation member 240 is provided with at least two, the cooling medium can first enter the first liquid collecting cavity through the second liquid inlet 210, and then enter the heat dissipation cavity 230 of each heat dissipation member 240 through the first liquid collecting cavity, so as to avoid the phenomenon that the flow of the cooling medium in some heat dissipation members 240 is too large, and the flow of the cooling medium in some heat dissipation members 240 is too small due to the flow direction, pressure difference and other factors of the cooling medium. In addition, by providing the first liquid collecting member 260 and the second liquid collecting member 270, the flowing cooling medium can also play a role of "pressure stabilizing and buffering". After the cooling medium enters the first liquid collecting member 260 and the second liquid collecting member 270, it will first release pulse energy in the first liquid collecting cavity and the second liquid collecting cavity, and then enter the heat dissipation member 240 and the second conveying pipe 420 with stable pressure, so as to reduce the resistance of the cooling medium in the flow and improve the operation efficiency of the heat dissipation device.

[0072] Further, the first liquid collecting member 260 is vertically arranged on one side of the heat dissipation member 240 along the second direction, and the projection of all the heat dissipation members 240 along the second direction is located in the projection of the first liquid collecting member 260 along the second direction, so as to facilitate the communication between the first liquid collecting member 260 and all the heat dissipation members 240. The second liquid collecting member 270 is similar to the first liquid collecting member 260, and will not be described here.

[0073] As an explanation, the second direction in the above embodiment is the length direction of the heat dissipation mechanism 200, that is Figure 2 and Figure 5 B direction in the above embodiment, which will not be described here.

[0074] Further, the second direction is perpendicular to the first direction.

[0075] Please refer to Figure 3In one embodiment, the heat dissipation mechanism 200 further comprises at least one partition 280, which is arranged in the heat dissipation cavity 230 and separates the heat dissipation cavity 230 into at least two heat dissipation channels 231, one end of the heat dissipation channel 231 being in communication with the second liquid inlet 210, and the other end of the heat dissipation channel 231 being in communication with the second liquid outlet 220.

[0076] The at least one partition 280 separates the heat dissipation cavity 230 into at least two heat dissipation channels 231, so as to improve the flow uniformity of the cooling medium in the heat dissipation cavity 230, and further improve the heat dissipation efficiency of the cooling medium.

[0077] Further, the partition 280 is in the form of a strip and is arranged in the heat dissipation cavity 230 along the second direction, so as to separate the heat dissipation cavity 230 into at least two heat dissipation channels 231 extending along the second direction.

[0078] In one embodiment, the partition 280 is provided in at least two and is arranged in parallel and at intervals along a third direction of the heat dissipation mechanism 200, so as to separate the heat dissipation cavity 230 into at least three heat dissipation channels 231.

[0079] As an explanation, the third direction is the width direction of the heat dissipation mechanism 200, that is, the C direction in Figure 2 and Figure 5 , which will not be described here again.

[0080] Further, the third direction is perpendicular to the first direction and perpendicular to the second direction.

[0081] As an example, in order to quantify the heat dissipation advantage of the heat dissipation device in the present application compared with a single-phase cooling system which only uses the fluid 310 as a medium for heat dissipation, the convective heat transfer intensities of the two are compared. In order to facilitate comparison, the specific heat capacity C and the thermal conductivity coefficient of the fluid 310 are defined as consistent values for comparison.

[0082] Taking the same heat absorption Q3-Q1 as the basis for comparison, the arithmetic mean temperature of the cooling medium in the heat dissipation device in the present application is:

[0083]

[0084] Wherein, C is the specific heat capacity of the cooling medium, p is the density of the cooling medium, is the mass flow of the cooling medium, T0 represents the temperature of the cooling medium when the heat absorption is Q0, and T2 represents the temperature of the cooling medium when the heat absorption is Q2.

[0085] The temperature of the CPU of the cooling liquid of the heat dissipation device in the present application can be represented as:

[0086] T case,CPU,double-pahse =T avg,double-pahse+ PR case-avg

[0087] Wherein, P is the power consumption of CPU, R case-avg The temperature difference between the temperature of CPU and the average temperature of cooling medium.

[0088] If the same heat Q3-Q1 is absorbed by single-phase fluid, the arithmetic mean temperature is:

[0089]

[0090] T0 represents the temperature of single-phase fluid when the heat absorption is Q0, T1 represents the temperature of single-phase fluid when the heat absorption is Q1, T2 represents the temperature of single-phase fluid when the heat absorption is Q2, and T3 represents the temperature of single-phase fluid when the heat absorption is Q3.

[0091] The temperature of CPU with single-phase fluid as cooling liquid can be expressed as:

[0092] T case,CPU,single-pahse = T avg,single-paahse + PR case-avg

[0093] Based on this, the temperature reduction of CPU is:

[0094]

[0095] Wherein, Δh represents the specific enthalpy value of cooling medium.

[0096] If the flow of cooling medium is taken as 1LPM as reference, the latent heat of cooling medium of the heat dissipation device in the present application is 38.5kj / kg, the specific heat capacity is 3.58kj / kg, and the temperature of CPU is reduced by about 5.4 degrees Celsius.

[0097] Another embodiment provides a server, which comprises a case, a heat generating element 500 and a heat dissipation device as described above, and the heat generating element 500 and the heat dissipation device are both arranged in the case.

[0098] The fluid 310 in the cooling cavity 130 of the cold plate 100 can absorb the heat generated by the heat generating element 500, and the temperature of the fluid 310 after absorbing heat is increased, and the phase change body 320 is melted. During the melting process, the phase change body 320 absorbs the heat of the fluid 310, so that the temperature of the fluid 310 remains basically unchanged, and further enables the cooling medium to maintain a lower temperature for a certain period of time and absorb more heat; then, the fluid 310 drives the phase change body 320 to enter the heat dissipation cavity 230 of the heat dissipation mechanism 200 through the first liquid outlet 120 and the second liquid inlet 210, and the heat dissipation mechanism 200 dissipates heat of the cooling medium in the heat dissipation cavity 230. The temperature of the fluid 310 decreases during the heat dissipation process, and the temperature of the phase change body 320 decreases during the heat dissipation process and gradually solidifies. The fluid 310 after heat dissipation drives the solidified phase change body 320 to pass through the second liquid outlet 220 and the first liquid inlet 110 in turn and return to the cooling cavity 130 of the cold plate 100, so as to absorb the heat generated by the heat generating element 500. The above cycle is repeated, so as to cool the heat generating element 500. Compared with the prior art, the phase change body 320 can absorb heat from the fluid 310 through phase change, so that the cooling medium as a whole can absorb more heat, thereby improving the heat dissipation efficiency of the heat dissipation device, and enabling the server to operate normally.

[0099] The technical features of the above embodiments can be combined in any manner. To make the description concise, all possible combinations of the technical features in the above embodiments are not described, but as long as the combinations of the technical features do not exist contradictory, they should be considered as the scope of the present application.

[0100] The above embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the patent scope of the application. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, some modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the patent protection scope of the present application should be subject to the appended claims.

Claims

1. A heat dissipation device, characterized in that: include: A cold plate, the cold plate being used for heat transfer connection with the heating element, the cold plate being provided with a first liquid inlet, a first liquid outlet and a cooling cavity which are interconnected; a heat dissipation mechanism, the heat dissipation mechanism being provided with a second liquid inlet, a second liquid outlet, and a heat dissipation cavity, the second liquid inlet being in communication with the first liquid outlet, and the second liquid outlet being in communication with the first liquid inlet; as well as A cooling medium includes a fluid and a phase changer, wherein the fluid can drive the phase changer to circulate between the cooling chamber and the heat dissipation chamber, the phase changer located in the cooling chamber can absorb heat and melt, and the phase changer located in the heat dissipation chamber can dissipate heat and solidify.

2. The heat dissipation device according to claim 1, characterized in that: The phase changer includes a phase change material and a heat transfer shell. The phase change material is disposed in the heat transfer shell, and the heat transfer shell can flow with the fluid.

3. The heat dissipation device according to claim 1, wherein: The heat dissipation mechanism includes a heat dissipation element and heat dissipation fins. The heat dissipation element is provided with the heat dissipation cavity. The heat dissipation fins are arranged on the outer wall of the heat dissipation element.

4. The heat dissipation device according to claim 3, characterized in that: There are at least two heat sinks, which are spaced apart along the first direction of the heat dissipation mechanism. Among two adjacent heat sinks, one is connected to one end of the heat dissipation fin, and the other is connected to the other end of the heat dissipation fin.

5. The heat dissipation device according to claim 4, characterized in that: The heat dissipation mechanism also includes a first liquid collecting part and a second liquid collecting part, the first liquid collecting part is provided with a first liquid collecting cavity extending along the first direction, the second liquid inlet is opened in the first liquid collecting part and is connected to the first liquid collecting cavity; the second liquid collecting part is provided with a second liquid collecting cavity extending along the first direction, the second liquid outlet is opened in the second liquid collecting part and is connected to the second liquid collecting cavity, one end of the heat dissipation part along the second direction is connected to the first liquid collecting part, and the other end of the heat dissipation part along the second direction is connected to the second liquid collecting part, so that the first liquid collecting cavity and the second liquid collecting cavity are both connected to the heat dissipation cavity, and the second direction forms an angle with the first direction.

6. The heat dissipation device according to claim 3, characterized in that: The heat dissipation mechanism also includes at least one partition, which is arranged in the heat dissipation cavity and divides the heat dissipation cavity into at least two heat dissipation channels, one end of the heat dissipation channel is connected to the second liquid inlet, and the other end of the heat dissipation channel is connected to the second liquid outlet.

7. The heat dissipation device according to claim 1, wherein: The heat dissipation device also includes a delivery pump, which is arranged in the cooling chamber. The delivery pump is used to pump the cooling medium in the cooling chamber into the heat dissipation chamber through the first liquid outlet and the second liquid inlet in sequence, and pump the cooling medium in the heat dissipation chamber into the cooling chamber through the second liquid outlet and the second liquid inlet in sequence.

8. The heat dissipation device according to claim 1, wherein: At least two cold plates are provided, and the first liquid outlet of one of the cold plates is communicated with the first liquid inlet of another of the cold plates.

9. The heat dissipation device according to claim 1, wherein: The heat dissipation device also includes a first delivery pipe and a second delivery pipe, one end of the first delivery pipe is connected to the first liquid outlet, the other end of the first delivery pipe is connected to the second liquid inlet, one end of the second delivery pipe is connected to the second liquid outlet, and the other end of the second delivery pipe is connected to the first liquid inlet.

10. A server, characterized in that: The server includes a chassis, a heating element, and the heat dissipation device according to any one of claims 1 to 9, wherein the heating element and the heat dissipation device are both arranged in the chassis.

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