Interconnection device for storage product, storage product and server
By using parallel backplane frames and customized interconnect cable groups in the server to form a heat dissipation architecture with a hollow center, the problem of poor heat dissipation caused by the traditional center-mounted backplane layout is solved, and efficient signal transmission and heat dissipation effects are achieved at the same time, thereby improving the system's reliability and heat dissipation performance.
Patent Information
- Application Number
- CN202511247577.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-02
- Publication Date
- 2025-10-17
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
Under the condition of highly restricted server architecture, the traditional center-mounted backplane layout results in poor heat dissipation and cannot achieve both efficient signal transmission and heat dissipation.
A parallel backplane frame is used to form a heat dissipation structure with a hollow center, combined with customized interconnect cables and connectors to ensure data transmission stability and heat dissipation efficiency. Efficient communication between the hard drive and controller is achieved through the hard drive connector, controller connector and interconnect cable group.
It significantly improves the airflow efficiency inside the chassis, improves the heat dissipation performance, ensures the reliability of the system and the stability of data transmission, and improves the heat dissipation performance by 18%-25%.
Smart Images

Figure CN120803227A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present application relates to the technical field of servers, and in particular to an interconnection device for a storage product, a storage product, and a server. BACKGROUND
[0002] The storage product integrates a controller and a storage medium, is deployed in a device chassis, and realizes data transmission and cable management through a middle backplane and different cables.
[0003] However, in the related art, due to the high restriction of the server architecture, the expansion interface and the cable of the middle backplane layout scheme are arranged in the middle of the chassis, which is convenient for cable management, but is restricted by the vertical space of the chassis. The traditional axial flow fan cannot form an efficient heat dissipation airflow channel in the limited area, resulting in the technical problem of poor heat dissipation effect. SUMMARY
[0004] The present application provides an interconnection device for a storage product, a storage product, and a server to at least solve the problem of poor heat dissipation effect in the related art, which leads to the problem that the efficient signal transmission and heat dissipation effect of the storage product cannot be considered.
[0005] The present application provides an interconnection device for a storage product, comprising:
[0006] a plurality of backplane frames, an interconnection cable group, a hard disk connector, and a controller connector;
[0007] The backplane frames are arranged in parallel with each other and form a middle hollow heat dissipation frame for heat dissipation airflow, and the interconnection cable group is arranged on the backplane frame.
[0008] The interconnection cable group comprises a first interconnection cable, a second interconnection cable, and a third interconnection cable, wherein the two ends of the first interconnection cable are connected with the hard disk connector and the controller connector respectively, and the first interconnection cable is used to realize data transmission between the controller and the hard disk.
[0009] The hard disk connector is installed on the backplane frame and connected with at least one hard disk.
[0010] The controller connector is installed on the backplane frame and connected with the controller, and the controller connectors on the backplane frames are connected through the third interconnection cable.
[0011] The present application also provides a storage product, comprising: a plurality of hard disks, at least one controller, at least one power module, and an interconnection device for a storage product as described above.
[0012] The hard disk, the controller and the power module are electrically connected with the interconnection device for storing products, data transmission is realized between the controller and the hard disk through the interconnection device for storing products, and the power module provides electric energy for the hard disk and the controller through the interconnection device for storing products.
[0013] The application further provides a server, comprising a server main body and the storage product.
[0014] According to the application, the middle hollow heat dissipation frame formed between the parallel arranged back plate frames provides a heat dissipation channel for the heat dissipation airflow generated by the axial flow fan, improves the space for the heat dissipation airflow to flow, and improves the heat dissipation performance, and the interconnection communication between the hard disk and the controller is realized through the hard disk connector and the controller connector and the interconnection cable group, the problem that the high efficient signal transmission and the heat dissipation effect of the storage product cannot be considered is solved, and the technical effects that the airflow passing efficiency inside the case is significantly improved and the heat dissipation performance is improved while the system reliability is ensured are achieved. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the embodiments of the application, the drawings needed in the embodiments will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the application, and other drawings can be obtained by those skilled in the art without creative labor.
[0016] Figure 1 A structure diagram of the interconnection device for storing products provided by the embodiments of the application Figure 1
[0017] Figure 2 A structure diagram of the interconnection device for storing products provided by the embodiments of the application Figure 1
[0018] Figure 3 A structure diagram of the interconnection device for storing products provided by the embodiments of the application Figure 2
[0019] Figure 4 A structure diagram of the storage product provided by the embodiments of the application.
[0020] Reference signs:
[0021] 1-back plate frame; 100-wiring hole
[0022] 2-interconnection cable group; 21-first interconnection cable; 22-second interconnection cable; 23-third interconnection cable; 231-hard disk connection branch
[0023] 3-hard disk connector; 31-hard disk interface
[0024] 4 - Controller connector;
[0025] 5 - Board-to-board interconnect board; 51 - Vent hole; 52 - Vent gap;
[0026] 6 - Power terminal. DETAILED DESCRIPTION
[0027] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0028] It should be noted that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", and the like indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. The terms "mount", "connected", "connected" should be understood broadly, for example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or the communication between two elements inside. The terms "parallel", "perpendicular", "equal" include the described case and the approximate case of the described case, and the approximate case is within an acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurement being discussed and the error related to the measurement of a specific quantity (i.e., the limitation of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, wherein the acceptable deviation range of approximate parallel can be, for example, within 5°; "perpendicular" includes absolute perpendicular and approximate perpendicular, wherein the acceptable deviation range of approximate perpendicular can also be, for example, within 5°. "Equal" includes absolute equality and approximate equality, wherein the acceptable deviation range of approximate equality can be, for example, that the difference between the two equalities is less than or equal to 5% of either. For a person of ordinary skill in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0029] In addition, it should be noted that in the description of the present application, the terms "comprising", "containing" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed, or includes elements inherent to such process, method, article or equipment. The terms "first", "second" and the like in the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence.
[0030] In the standard 2U (88.9mm height) server architecture, due to the limitation of the height of the chassis space 2U, the common mid-backplane layout scheme cannot meet the increasing performance of the processor CPU, that is, the heat dissipation problem of high-power components in the server gradually appears and needs to be solved. In the high-power scenario, although the interconnection scheme of the mid-backplane arranges the expansion interface in the middle of the chassis, although it is convenient for cable management, the axial flow fan is difficult to form an efficient heat dissipation channel in the limited area, resulting in the heat dissipation airflow being blocked by the mid-backplane and the expansion interface, that is, the cable, resulting in local heat conduction effect. Therefore, when the processor power exceeds 250 watts, the temperature of the mid-backplane area for the interconnection of storage products will gradually increase, and therefore, there is an urgent need for a storage product interconnection device that can efficiently and stably transmit signals and has good heat dissipation effect. For this purpose, the present application proposes the following inventive concept:
[0031] By setting parallel customized backplanes, combining customized interconnection cables, and matching hard disk connectors and controller connectors, the interconnection of storage products is realized. Such a setting eliminates the blocking of the backplane body to the heat dissipation airflow, and ensures the stability, efficiency and accuracy of data transmission, while improving the heat dissipation efficiency.
[0032] In order for those skilled in the art to better understand the present application, the present application will be further described in detail below in conjunction with the drawings and specific embodiments.
[0033] Figure 1 A structure diagram of a storage product interconnection device provided by an embodiment of the present application Figure 1 .
[0034] As Figure 1 shown, the storage product interconnection device comprises:
[0035] a plurality of backplane frames 1, an interconnection cable group 2, a hard disk connector 3 and a controller connector 4;
[0036] Wherein the backplane frames 1 are arranged in parallel with each other and form a middle hollow heat dissipation structure for the heat dissipation airflow to pass through, and the interconnection cable group 2 is arranged on the backplane frame 1.
[0037] In this embodiment, the number of backplane frames 1 can be two, the two backplane frames 1 are arranged in parallel to each other, and the spacing between the two backplane frames 1 is less than the vertical space height 2U of the case. The two backplane frames 1 and the middle hollow area between the two backplane frames 1 for the heat dissipation airflow to pass through together form a heat dissipation structure. In this embodiment, the interconnection cable group can be attached to the surface of the backplane frame 1 in the form of wiring, for connecting the hard disk connector 3 and the controller connector 4 on the backplane frame 1.
[0038] In an optional embodiment of the present application, the backplane frame 1 is a printed circuit board with internal signal transmission lines. The backplane frame 1 uses the internal wiring of the printed circuit board to realize the transmission of electrical signals and data, so that the backplane frame 1 uses the internal wiring of the printed circuit board to efficiently and stably complete the data communication and interconnection task between the controller, the backplane frame 1 and the hard disk, and ensures the accuracy, stability, efficiency and timeliness of data transmission.
[0039] Figure 2 For Figure 2 A partial enlarged view of part A.
[0040] As Figure 2 shown, in this embodiment, the interconnection cable group 2 includes a first interconnection cable 21, a second interconnection cable 22 and a third interconnection cable 23, wherein one end of the first interconnection cable 21 is connected with the controller connector 4, the other end of the first interconnection cable 21 is respectively connected with the second interconnection cable 22 and the third interconnection cable 23, and the other end of the third interconnection cable 23 is connected with the hard disk connector 3.
[0041] In this embodiment, the interconnection cable group 2 can be made of a customized cable, which can be a copper core cable. The interconnection cable group 2 can be composed of a plurality of branch cables, wherein one end of the first interconnection cable 21 can be fixedly connected with the controller connector 4 by welding or clamping, and the other end of the first interconnection cable 21 can be fixedly connected with the end of the second interconnection cable 22 and the third interconnection cable 23 by cable adapter, welding or winding connection.
[0042] In this embodiment, the other end of the second interconnection cable 22 and the controller connector 4 on the lower backplane frame 1 can be fixedly connected by welding or clamping. The other end of the third interconnection cable 23 can be fixedly connected with the hard disk connector 3 by welding or clamping.
[0043] In this embodiment, the first interconnection cable 21, the second interconnection cable 22 and the third interconnection cable 23 can all be made of customized cables.
[0044] As Figure 2 shown, the hard disk connector 3 is installed on the backplane frame 1, and the hard disk connector 3 is connected with at least one hard disk.
[0045] In this embodiment, the hard disk connector 3 can be a hard disk expansion interface. The hard disk connector 3 and the hard disk are connected through plugging, and the hard disk is connected with the circuit in the backplane frame 1 through the hard disk connector 3, thereby realizing the interconnection of electrical signals or data. Figure 2 As shown in the figure, the number of hard disks is six. The specific number of hard disks can be configured according to the storage capacity of the storage product.
[0046] The controller connector 4 is installed on the backplane frame 1, and the controller connector 4 is connected with the controller. The controller connectors 4 on each backplane frame 1 realize data transmission through the third interconnection cable 23.
[0047] In this embodiment, the controller connector 4 can be a high-density connector, which has a compact layout and stable and efficient transmission performance, and is a key component to ensure the stable operation of the server. The controller connector 4 can be fixedly installed on the backplane frame 1 in a bolted, welded or bonded manner. The controller connector 4 can realize data connection with the controller through plugging.
[0048] In summary, the interconnection device for the storage product provided by the embodiment of the present application provides a middle hollow heat dissipation structure formed between the parallel backplane frames 1 to provide a heat dissipation channel for the heat dissipation airflow generated by the axial flow fan, improve the space for the heat dissipation airflow to flow, and improve the heat dissipation performance. And the hard disk and the controller are connected through the hard disk connector 3 and the controller connector 4 and the interconnection cable group 2 to realize the interconnection communication between the hard disk and the controller, solve the problem that the high-efficiency signal transmission of the storage product cannot be considered with the heat dissipation effect, and achieve the technical effects of significantly improving the airflow passing efficiency inside the case and improving the heat dissipation performance while ensuring the system reliability.
[0049] On the basis of the above-mentioned embodiment, as an optional embodiment of the present application, the backplane frame 1 is further provided with a power line for supplying power to the hard disk; and the backplane frame 1 is provided with a wire passing hole 100 through which the third interconnection cable 23 passes, at a position close to the controller connector 4.
[0050] In this embodiment, the power line can be a circuit pre-planned and made in the printed circuit board. The power line is responsible for the power supply wiring of the hard disk, and provides stable power support for the normal operation of the hard disk. The wire passing hole 100 provided on the backplane frame 1 can be a rectangular hole, a circular hole or other through hole provided on the printed circuit board for the third interconnection cable 23 to pass through. The controller connector 4 on the lower backplane frame 1 and the controller connector 4 on the upper backplane frame 1 can realize data communication through the third interconnection cable 23.
[0051] In the embodiment, the power line and the wire hole 100 are arranged to avoid the increase of the cable length between the power supply for the hard disk and the hard disk, and to avoid the increase of the cable length in the heat dissipation structure between the back plate frames 1, thereby improving the heat dissipation performance of the interconnection device for the storage product.
[0052] Based on the above embodiment, in an optional embodiment of the present application, the third interconnection cable 23 includes a plurality of hard disk connection sub-cables 231, and the hard disk connector 3 is provided with a plurality of hard disk interfaces 31, and the number of the hard disk connection sub-cables 231 is the same as that of the hard disk interfaces 31.
[0053] In the embodiment, the hard disk connection sub-cable 231 can be a cable made of the same material as the third interconnection cable 23, and the hard disk connection sub-cable 231 corresponds to one hard disk interface 31, and the hard disk connection sub-cable 231 can be connected to the hard disk interface 31 by welding, clamping or plugging. In the embodiment, the number of the hard disk interfaces 31 does not represent the number of the hard disks in the storage product, and the number of the hard disk interfaces 31 is generally greater than or equal to the number of the hard disks, and is intended to provide a hardware basis for the expansion of the storage product. Therefore, the embodiment is not particularly limited here. Through the layout and design of the hard disk connector 3, the hard disk connection sub-cable 231 and the hard disk interface 31, the interconnection device for the storage product provided by the present application can stably support the expansion demand of the hard disk. By increasing the number of the hard disks, the user can easily improve the capacity of the storage system to meet the growing demand for data storage.
[0054] In an optional embodiment of the present application, the hard disk connector 3 and the controller connector 4 are arranged on the two sides of the back plate frame 1 in the width direction.
[0055] As shown in Figure 2 In the embodiment, the hard disk connector 3 and the controller connector 4 are arranged on the two sides of the back plate frame 1, which can reduce the total length of the cables of the interconnection cable group 3 between the hard disk connector 3 and the controller connector 4, thereby reducing the interference of excessive cabling on the heat dissipation airflow and improving the heat dissipation efficiency of the interconnection device for the storage product.
[0056] Based on the above embodiment, in an optional embodiment of the present application, as shown in Figure 3 The first interconnection cable 21, the second interconnection cable 22 and the third interconnection cable 23 are interconnected at the same connection node.
[0057] In the embodiment, the first interconnection cable 21, the second interconnection cable 22 and the third interconnection cable 23 can be fixed together by welding to be interconnected to the same connection node, so that the cable wiring amount in the interconnection cable group 2 can be reduced, the cable material can be saved, the wiring amount on the backboard frame 1 can be reduced, and the heat dissipation effect of the whole interconnection device for the storage product can be further improved.
[0058] Based on the above embodiment, as an optional embodiment of the present application, the number of the interconnection cable group 2, the hard disk connector 3 and the controller connector 4 is multiple, and is dispersedly arranged on the backboard frame 1.
[0059] In the embodiment, the number of the interconnection cable group 2, the hard disk connector 3 and the controller connector 4 can be multiple, wherein each of the interconnection cable group 2, the hard disk connector 3 and the controller connector 4 can be dispersedly mounted on the backboard frame 1 by bolt connection, screw connection, clamping or bonding.
[0060] In the embodiment, by arranging multiple interconnection cable groups 2, hard disk connectors 3 and controller connectors 4, convenience can be provided for subsequent expansion of the number of hard disks of the storage product, and more data interconnection channels can be provided between the controller and the hard disk by increasing the controller connectors 4, so that the data can be quickly and accurately transmitted between the controller and the hard disk, and the demand of the system for efficient data interaction can be met.
[0061] Figure 2 A structure diagram of the interconnection device for the storage product provided by the embodiment of the present application Figure 3 .
[0062] As shown in Figure 3 , based on the above embodiment, the interconnection device for the storage product provided by an optional embodiment of the present application further comprises a board-to-board interconnection board card 5; the board-to-board interconnection board card 5 is perpendicular to the backboard frame 1, and two adjacent controllers are interconnected by the board-to-board interconnection board card 5.
[0063] In the embodiment, the board-to-board interconnection board card 5 can be made of a printed circuit board, the controller is tightly connected to the board-to-board interconnection board card 5 through the controller connector 4, the stable transmission of the interconnection signals between the two controllers is realized by using the wiring inside the board-to-board interconnection board card 5, and the stability and accuracy of the exchange of data and instructions between the controllers can be improved without affecting the heat dissipation effect.
[0064] In an optional embodiment of the present application, a controller connector or other high-density connector is also mounted on the controller, so that the board-to-board interconnection board card 5 can connect the two controllers together to realize the stable transmission of the interconnection signals between the two controllers.
[0065] As shown in Figure 3 In an optional embodiment of the present application, the plate-to-plate interconnection board card 5 is provided with ventilation holes 51 for the heat dissipation airflow to pass through.
[0066] As shown in Figure 3 In the present embodiment, since the plate-to-plate interconnection board card 5 is perpendicular to the backplane frame 1, in order to make the heat dissipation airflow pass through the plate-to-plate interconnection board card 5 faster, the plate-to-plate interconnection board card 5 is provided with ventilation holes 51 for the heat dissipation airflow to pass through.
[0067] In the present embodiment, by providing the plate-to-plate interconnection board card 5 with ventilation holes 51, the heat dissipation efficiency of the entire interconnection device for storing products can be ensured while improving the stability, efficiency and accuracy of signal transmission.
[0068] As shown in Figure 4 Further, in an optional embodiment of the present application, the number of ventilation holes 51 can be multiple, and the multiple ventilation holes 51 are respectively located in the upper, middle and lower three regions of the plate-to-plate interconnection board card 5, and the multiple ventilation holes 51 are arranged at intervals. The top of the plate-to-plate interconnection board card 5 is provided with a ventilation gap 52.
[0069] In the present embodiment, the number of ventilation holes 51 is multiple, and the shapes of the ventilation holes 51 can be the same or different, for example: the shape of the first ventilation hole 51 is square, the shape of the second ventilation hole 51 is rectangular, and the shape of the third ventilation hole 51 can be L-shaped. The number and shape of the ventilation holes 51 can be designed according to the specific circuit structure.
[0070] In the present embodiment, by providing multiple ventilation holes 51 and ventilation gaps 52, the passing amount of the heat dissipation airflow is further increased, thereby improving the heat dissipation efficiency of the entire interconnection device for storing products.
[0071] Based on the above embodiments, in an optional embodiment of the present application, the width of the plate-to-plate interconnection board card 5 is less than or equal to one fourth to one fifth of the length of the backplane frame 1.
[0072] In the embodiment, the height of the chassis is limited, the height of the internal area of the chassis is generally 2U, 1U=44.45mm, and the length of the backplane frame 1 is also limited. In order to increase the flow area of the cooling air flow as much as possible, the width of the board-to-board interconnection board card 5 in the embodiment is any value in the range of one quarter to one fifth of the length of the backplane frame 1. While ensuring the data interaction performance of the board-to-board interconnection board card 5, the heat dissipation efficiency of the board-to-board interconnection board card 5 is improved as much as possible. Therefore, in an optional embodiment of the application, the height of the board-to-board interconnection board card 5 is less than or equal to 88.9mm. Generally, in order to facilitate the installation of the board-to-board interconnection board card 5, the height of the board-to-board interconnection board card 5 is less than 88.9mm, for example, 85mm.
[0073] As shown in Figure 4 Based on the above embodiments, in an optional embodiment of the application, the interconnection device for a storage product provided in the embodiment further comprises at least one power terminal 6, and the power terminal 6 provides power for the hard disk and the controller through the backplane frame 1.
[0074] In the embodiment, the power terminal 6 can be fixedly arranged on the backplane frame 1 by welding or integration. The power terminal 6 is tightly connected with the power module through a dedicated power line, and provides stable and reliable power for the controller, the hard disk and other key modules, thereby ensuring the normal operation of the corresponding modules in the entire storage product.
[0075] A structural schematic diagram of a storage product provided in an embodiment of the application is shown in the figure.
[0076] As shown in The storage product comprises a plurality of hard disks, at least one controller, at least one power module and the interconnection device for a storage product provided in any one of the above embodiments.
[0077] The hard disk, the controller and the power module are electrically connected with the interconnection device for a storage product. The controller and the hard disk realize data transmission through the interconnection device for a storage product. The power module provides power for the hard disk and the controller through the interconnection device for a storage product.
[0078] In the embodiment, the heat dissipation airflow between the hard disk and the controller can quickly pass through the middle hollow heat dissipation frame in the interconnection device for storing products, and the heat dissipation airflow is not disturbed by the heat dissipation frame 1 and the components mounted on the heat dissipation frame 1, thereby avoiding the local heat island effect. Through the cooperation of the backboard frame 1, the interconnection cable group 2, the hard disk connector 3 and the controller connector 4, the transmission performance of the entire storage product is more stable and the transmission speed is faster. In addition, the parallel arrangement of the two backboard frames 1 forms a heat dissipation frame, which eliminates the blocking effect of the physical structure of the backboard frame 1 on the airflow, increases the heat dissipation airflow passing area by more than 300%, and significantly improves the internal heat convection efficiency and the heat dissipation performance of the storage product. It has been verified that the storage product can improve the overall heat dissipation efficiency of the machine by 18%-25%, and can be applied to the heat dissipation optimization demand of high-density storage servers.
[0079] Based on the above embodiment, in an optional embodiment of the present application, the interconnection device for storing products further comprises a board-to-board interconnection board card 5. Correspondingly, the number of controllers is two, and data transmission between the two controllers is realized through the board-to-board interconnection board card.
[0080] In the embodiment, the two controllers in the storage product are interconnected by using the board-to-board interconnection board card 5, which enables the two controllers of the storage product to simultaneously access the same number of hard disks, achieving redundant backup of the hard disk and the controller. The two controllers can exchange data in real time and accurately, ensuring that when any one controller fails, the other controller can serve as a backup control subject to quickly take over the storage work, realize seamless switching, improve the reliability and availability of the entire storage product, and ensure the security of data.
[0081] In an optional embodiment of the present application, the interconnection device for storing products further comprises two power terminals 6, and the number of power modules is two. Each power module is connected with the interconnection device for storing products through the power terminal, and provides power for the hard disk and the controller through the interconnection device for storing products.
[0082] The present application also provides a server comprising a server main body and the storage product provided in the above embodiments.
[0083] The above describes in detail the interconnection device for storage products, the storage products and the server provided by the present application. The principles and implementation manners of the present application are described by using specific examples, and the above description of the embodiments is only used to help understand the method of the present application and the core idea thereof. It should be pointed out that, for those skilled in the art, some improvements and modifications can be made to the present application without departing from the principles of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.
Claims
1. An interconnection device for storing products, characterized in that: include: A plurality of backplane frames (1), interconnection cable sets (2), hard disk connectors (3) and controller connectors (4); The backplane frames (1) are arranged parallel to each other to form a heat dissipation structure with a hollow center for heat dissipation airflow to pass through, and the interconnection cable group (2) is arranged on the backplane frames (1); The interconnection cable group (2) includes a first interconnection cable (21), a second interconnection cable (22) and a third interconnection cable (23), wherein one end of the first interconnection cable (21) is connected to the controller connector (4), the other end of the first interconnection cable (21) is connected to the second interconnection cable (22) and the third interconnection cable (23), respectively, and the other end of the third interconnection cable (23) is connected to the hard disk connector (3); The hard disk connector (3) is mounted on the backplane frame (1); the third interconnection cable (23) includes a plurality of hard disk connection branches (231); a plurality of hard disk interfaces (31) are provided on the hard disk connector (3); the number of the hard disk connection branches (231) is the same as the number of the hard disk interfaces (31); the hard disk interfaces (31) are parallel to each other, and hard disks connected to the hard disk interfaces (31) form a hard disk group heat dissipation channel for heat dissipation airflow to pass through; The controller connector (4) is mounted on the backplane frame (1), and the controller connector (4) is connected to the controller. A wire hole (100) for the third interconnection cable (23) to pass through is provided at a position close to the controller connector (4) on the backplane frame (1). The controller connector (4) on each backplane frame (1) realizes data transmission through the third interconnection cable (23).
2. The interconnection device for storing products according to claim 1, characterized in that: The backplane frame (1) is a printed circuit board with a built-in signal transmission line, and the signal transmission line is used to realize data transmission between the controller, the backplane frame (1) and the hard disk.
3. The interconnection device for storing products according to claim 1, characterized in that: A power line is also provided in the backplane frame (1), and the power line is used to supply power to the hard disk.
4. The interconnection device for storing products according to claim 1, characterized in that: The hard disk connector (3) and the controller connector (4) are arranged at opposite intervals on both sides of the width direction of the backplane frame (1).
5. The interconnection device for storing products according to claim 1, characterized in that: The first interconnection cable (21), the second interconnection cable (22), and the third interconnection cable (23) are interconnected at the same connection node.
6. The interconnection device for storing products according to claim 1, characterized in that: The interconnecting cable group (2), the hard disk connector (3) and the controller connector (4) are all multiple in number and are dispersedly arranged on the backplane frame (1).
7. The interconnection device for storing products according to claim 1, characterized in that: Also included is a board-to-board interconnection board (5); The board-to-board interconnection board (5) is perpendicular to the backplane frame (1), and two adjacent controllers achieve data interconnection through the board-to-board interconnection board (5).
8. The interconnection device for storing products according to claim 8, characterized in that: The board-to-board interconnection board (5) is provided with ventilation holes (51) for heat dissipation airflow to pass through.
9. The interconnection device for storing products according to claim 8, characterized in that: The width of the board-to-board interconnection board (5) is less than or equal to one quarter to one fifth of the length of the backplane frame (1).
10. The interconnection device for storing products according to claim 7, characterized in that: The height of the board-to-board interconnection board (5) is less than or equal to the standard height of the server architecture, 2U, where 2U=88.9 mm.
11. The interconnection device for storing products according to any one of claims 1 to 10, characterized in that: At least one power terminal (6) is also provided on the backplane frame (1), and the power terminal (6) provides electric energy to the hard disk and the controller through the backplane frame (1).
12. A storage product, characterized in that: include: A plurality of hard disks, at least one controller, at least one power module, and an interconnection device for a storage product according to any one of claims 1 to 10; The hard disk, the controller and the power module are all electrically connected to the interconnection device for storing products, data transmission is achieved between the controller and the hard disk through the interconnection device for storing products, and the power module provides power to the hard disk and the controller through the interconnection device for storing products.
13. The storage product according to claim 12, wherein: The interconnection device for storing products further includes a board-to-board interconnection board; there are two controllers, and data transmission between the two controllers is achieved through the board-to-board interconnection board.
14. The storage product according to claim 12, wherein: The interconnection device for storing products also includes two power terminals. There are two power modules, and each power module is connected to the interconnection device for storing products through the power terminals, and provides power to the hard disk and the controller through the interconnection device for storing products.
15. A server, characterized in that: The storage device comprises a server body and the storage product according to any one of claims 12 to 14.
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