Method for testing film expanding performance of UV (ultraviolet) viscosity-reducing film

Abstract

The invention discloses a method for testing the film expansion performance of a UV viscosity-reduced film, and relates to the field of semiconductor manufacturing. Aiming at the problems of one-sided single parameter evaluation, data isolated analysis and insufficient process simulation of the existing test method, the method realizes systematic evaluation through the following steps: firstly preparing a dumbbell-shaped sample and a wafer attachment sample, secondly carrying out multi-dimensional synchronous test and environmental tolerance test, and finally establishing a cross-parameter correlation model. Key parameters are extracted through principal component analysis, a multivariable regression equation is constructed, and a comprehensive performance report is generated in combination with an industry standard threshold value. According to the invention, collaborative testing of material basic performance, film expansion dynamic parameters, chip suitability and environmental tolerance is realized, the one-sidedness problem of a traditional method is solved, the testing precision and efficiency are remarkably improved, and a scientific basis is provided for material selection and process optimization of semiconductor precision manufacturing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor technology, in particular to a test method for the film expansion performance of UV debonding film. BACKGROUND

[0002] In the precision manufacturing process of semiconductor wafer cutting and chip packaging, the film expansion performance of UV debonding film directly determines the chip separation precision and processing yield. However, the existing test method has a core technical bottleneck: it cannot realize the real-time linkage monitoring and correlation analysis of the tension change, chip position movement, material mechanical performance and environmental tolerance in the film expansion process, resulting in isolated data in each dimension, which makes it difficult to accurately evaluate the comprehensive performance of the material under actual working conditions.

[0003] Specifically, the traditional test method only tests single indicators such as tensile strength and adhesion independently, lacks real-time coupling relationship capture of "tension-distance change" in the film expansion dynamic process, and does not establish a correlation model across dimensional parameters (such as mechanical performance and chip adaptability). This makes the test results unable to reflect the real performance of UV debonding film in actual scenarios such as high-speed expansion and high-temperature environment, often leading to problems such as chip cracking and uneven spacing due to improper material selection, which restricts the yield improvement of semiconductor packaging process.

[0004] Therefore, there is an urgent need for a test method that can real-time synchronously collect multi-dimensional data and establish a parameter correlation model to realize systematic and accurate evaluation of the film expansion performance of UV debonding film. SUMMARY

[0005] (I) Technical problems solved In view of the deficiencies of the prior art, the present application provides a test method for the film expansion performance of UV debonding film, which solves the problems of single parameter test, isolated data analysis and process simulation in the existing UV debonding film film expansion performance test.

[0006] (II) Technical solutions To achieve the above purpose, the present application realizes the following technical solutions: a test method for the film expansion performance of UV debonding film, comprising the following steps: Step 1: Prepare a dumbbell-shaped sample and a wafer-attached sample, the edge of the wafer-attached sample exceeds the wafer by 5-10 mm, and the wafer-attached sample is attached to the wafer surface by a vacuum bonding process; Step 2: Perform tensile test on the dumbbell-shaped sample to obtain performance test indicators, including tensile strength, elongation at break and elastic modulus; fix the wafer-attached sample on a full-automatic film expansion machine, real-time collect film expansion tension data through an integrated tension sensor, monitor chip position changes through a visual feedback positioning system, and test the thermal shrinkage rate and dimensional stability of UV debonding film at room temperature in a temperature-controlled environment; Step three: establish a cross-parameter correlation model, link the mechanical property parameters, film stretching tension data, chip spacing uniformity and environmental tolerance data for analysis, and generate a comprehensive performance evaluation report based on the preset industry standard threshold.

[0007] Preferably, in step two, the visual feedback positioning system comprises a high-resolution image acquisition unit, a coordinate calculation module and a data synchronization unit, the high-resolution image acquisition unit is used for real-time acquisition of chip array images, the coordinate calculation module calculates the spacing between adjacent chips through a feature point matching algorithm, and the data synchronization unit associates the spacing change data with the tension data in real time to calculate the tension retention rate and the stress relaxation rate.

[0008] Preferably, the coordinate calculation module of the visual feedback positioning system identifies the chip profile through an edge detection algorithm and calculates the chip spacing change amount in combination with a preset coordinate system. Preferably, in step three, the establishment step of the cross-parameter correlation model comprises: Step A1: extract key parameters of each test dimension, the key parameters of each test dimension including tensile strength, tension retention rate, chip spacing standard deviation, and thermal shrinkage rate; Step A2: determine parameter weights by principal component analysis, construct a multivariate regression equation, and quantify the correlation between parameters. Preferably, the tension sensor of the full-automatic film stretching machine has a resolution of ≤0.01N / cm, and the data is collected synchronously with the visual feedback positioning system. Preferably, before preparing the wafer attached sample, the wafer surface is subjected to plasma cleaning pretreatment, and the automatic visual detection system collects chip spacing data for the wafer edge, center and diagonal line regions respectively during single detection, and the total number of data points is ≥150. Preferably, it further comprises a UV adhesion reduction post-stretching performance verification step: repeating the mechanical property test on the dumbbell-shaped sample after UV irradiation to verify the film strength during peeling.

[0009] (Three) beneficial effects The application provides a test method for the film stretching performance of a UV adhesion reduction film. The present application solves the core problems of the existing test method, such as one-sided evaluation of a single parameter, isolated data analysis, and insufficient process simulation, by standardizing sample preparation, multi-dimensional synchronous testing, and data fusion analysis: through the collaborative testing of dumbbell-shaped samples and wafer-attached samples, covering four dimensions of material mechanical properties, film expansion dynamics, chip adaptability, and environmental tolerance, breaking the limitation of a single index; innovative integration of tension sensors and visual feedback positioning systems to capture the dynamic coupling relationship between "tension-chip spacing" in real time, enabling real-time linkage collection of key parameters in the film expansion process; establishing a cross-parameter correlation model, quantifying parameter weights through principal component analysis and constructing a multivariate regression equation, and generating a comprehensive performance report containing industry standard thresholds, improving material yield prediction accuracy by more than 30%. This method enables UV adhesion-reducing film performance testing to move from isolated indicators to full-process precise evaluation, providing an efficient and reliable technical tool for material selection and process optimization in semiconductor precision manufacturing, significantly improving the processing yield and production efficiency of chip cutting, packaging, and other processes. DETAILED DESCRIPTION

[0010] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0011] The present application provides a technical solution: preparing a dumbbell-shaped sample, using a PET substrate UV adhesion-reducing film, cutting into a dumbbell shape with a gauge length of 50 mm and a parallel section width of 6 mm for basic mechanical property testing to obtain material tensile strength, elongation at break, and elastic modulus. Wafer-attached samples are 12-inch silicon wafers with an edge extending 5-10 mm beyond the wafer. After Ar plasma cleaning for 30 s to improve surface energy, vacuum bonding technology is used to roll press three times with a rubber roller at a pressure of 5-10 N / cm to eliminate bubbles with a diameter >100 μm, ensuring the stability of the edge chip during film expansion, and thus ensuring the close adhesion of the adhesive layer to the wafer surface. A high-precision universal material testing machine is used to stretch the dumbbell-shaped sample at a speed of 50 mm / min, and force-displacement curves are collected simultaneously. The tensile strength (σ=Fmax / (b×t)), elongation at break (δ=(L1-L0) / L0×100%), and elastic modulus (the slope of the initial linear segment of the stress-strain curve) are calculated. The automatic film expansion machine integrates tension sensors and visual feedback positioning systems to realize real-time linkage collection of tension data and chip position changes (collection frequency ≥100 Hz).

[0012] The visual feedback positioning system includes a high-resolution image acquisition unit, which uses a CCD camera to capture chip array images in real time, with a capture accuracy of ±1 μm; a coordinate calculation module, which identifies the chip profile through a Canny operator and calculates the adjacent chip spacing variation in combination with a preset coordinate system (with the wafer center as the origin); and a data synchronization unit, which aligns the spacing variation data and the tension data by timestamp, automatically calculates the tension retention rate (R=Tt / T0x100%) and the stress relaxation rate (S=(T0-Tt) / T0x100% / t). The environmental tolerance test is performed by placing a 100 mm x 100 mm square sample in a 150°C±1°C oven for 1 hour, measuring the diagonal length change by a two-dimensional image measuring instrument, and calculating the shrinkage rate (Sh=(L0-L1) / L0x100%); after the film is expanded, it is left to stand for 24 hours, the chip spacing fluctuation is monitored, and the dimensional stability of the film material at room temperature is evaluated.

[0013] The cross-parameter correlation model extracts key parameters from mechanical properties (tensile strength, elastic modulus), film expansion dynamics (tension retention rate, stress relaxation rate), chip adaptability (chip spacing standard deviation), and environmental tolerance (thermal shrinkage rate), determines the weight of each parameter, constructs a multivariate regression equation (such as Y=0.4X1+0.3X2+0.2X3+0.1X4, where X1 is the chip spacing standard deviation, X2 is the tension retention rate, etc.), and quantifies the correlation between parameters; preset industry standard thresholds are generated to generate a comprehensive performance report containing qualified items and early warning items.

[0014] It should be noted that, in the present text, relational terms such as first and second and the like can only be used to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising", or any other variant thereof are intended to cover non-exclusive inclusions, so that a process, method, article, or apparatus that includes a list of elements does not only include those elements, but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without more limitations, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article, or apparatus that includes the element.

[0015] Although embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made thereto without departing from the principles and spirit of the present application, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A method for testing the film expansion performance of a UV anti-viscosity film, characterized in that: The following steps are involved: Step 1: Prepare a dumbbell-shaped specimen and a wafer-attached sample, wherein the edge of the wafer-attached sample extends 5-10 mm beyond the wafer and is bonded to the wafer surface through a vacuum bonding process; Step 2: Perform a tensile test on a dumbbell-shaped specimen to obtain performance test indicators, including tensile strength, elongation at break, and elastic modulus. The wafer-attached specimen is fixed to a fully automatic film expander. An integrated tension sensor collects film expansion tension data in real time. A visual feedback positioning system is used to monitor chip position changes. The UV anti-viscosity film's thermal shrinkage and room-temperature dimensional stability are tested in a temperature-controlled environment. Step 3: Establish a cross-parameter correlation model to analyze mechanical performance parameters, film expansion tension data, chip spacing uniformity and environmental tolerance data in a coordinated manner, and generate a comprehensive performance evaluation report based on preset industry standard thresholds.

2. The testing method according to claim 1, wherein: In step 2, the visual feedback positioning system includes: a high-resolution image acquisition unit, a coordinate calculation module and a data synchronization unit. The high-resolution image acquisition unit is used to acquire chip array images in real time. The coordinate calculation module calculates the spacing between adjacent chips through a feature point matching algorithm. The data synchronization unit associates the spacing change data with the tension data in real time to calculate the tension retention rate and stress relaxation rate.

3. The testing method according to claim 2, wherein: The coordinate calculation module of the visual feedback positioning system identifies the chip outline through an edge detection algorithm and calculates the chip spacing change in combination with a preset coordinate system.

4. The testing method according to claim 1, wherein: In step 3, the steps of establishing the cross-parameter correlation model include: Step A1: extracting key parameters of each test dimension, wherein the key parameters of each test dimension include tensile strength, tension retention rate, chip spacing standard deviation, and thermal shrinkage rate; Step A2: Use principal component analysis to determine parameter weights, construct a multivariate regression equation, and quantify the correlation between parameters.

5. The testing method according to claim 1, wherein: The tension sensor of the fully automatic film expanding machine has a resolution of ≤0.01N / cm and collects data synchronously with the visual feedback positioning system.

6. The testing method according to claim 1, wherein: Before the wafer attachment sample preparation, the wafer surface is pre-treated by plasma cleaning.

7. The testing method according to claim 1, wherein: During a single inspection, the automated visual inspection system collects chip spacing data for the wafer edge, center, and diagonal areas, respectively, with a total number of data points ≥150.

8. The testing method according to claim 1, wherein: It also includes a step for verifying the tensile properties after UV viscosity reduction: repeating the mechanical property test on the dumbbell-shaped specimen after UV irradiation to verify the strength of the membrane material during peeling.