Wafer clamping mechanism and wafer turnover device
By designing a wafer clamping mechanism composed of multiple clamping parts, the synchronous flipping of multiple wafers is achieved, solving the problem of low efficiency of single-wafer flipping in the existing technology, and improving the flipping efficiency and degree of automation.
Patent Information
- Application Number
- CN202410431169.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-10
- Publication Date
- 2025-10-17
AI Technical Summary
In the prior art, the wafer clamping mechanism can only clamp a single wafer for flipping, resulting in low flipping efficiency and affecting production capacity.
A wafer clamping mechanism is designed, including multiple first clamping members and second clamping members, which are spaced apart along a first direction to form multiple wafer clamping units. The clamping members of each clamping unit move closer to or farther away from each other in a second direction to clamp or release the wafer, and combined with a driving unit to achieve synchronous flipping of multiple wafers.
The efficiency of wafer flipping is improved, and multiple wafers can be flipped at the same time, which improves production efficiency and automation and reduces costs.
Smart Images
Figure CN120809660A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The application belongs to the technical field of semiconductor process equipment, and particularly relates to a wafer clamping mechanism and a wafer turnover device. BACKGROUND
[0002] In some semiconductor processes, the back surface of a wafer needs to be cleaned to remove the contamination on the back surface of the wafer and improve the yield of subsequent processes. In order to complete the back surface cleaning, a semiconductor cleaning device (for example, a single wafer cleaning machine) needs to turn over a wafer placed with the front surface upward, so that the back surface of the wafer is cleaned by spraying cleaning liquid in the subsequent cleaning process.
[0003] Therefore, the wafer needs to be turned over before the back surface cleaning process. The turnover mechanism related to the prior art can only clean a single wafer each time, which results in low turnover efficiency and low production capacity. SUMMARY
[0004] The application discloses a wafer clamping mechanism and a wafer turnover device to solve the problem of low turnover efficiency caused by the wafer clamping mechanism related to the prior art which can only clamp a single wafer for turnover before cleaning.
[0005] To solve the above technical problems, the application provides the following technical solutions:
[0006] In a first aspect, the application discloses a wafer clamping mechanism, which comprises a base, a plurality of first clamping members and a plurality of second clamping members movably arranged on the base,
[0007] The plurality of first clamping members and the plurality of second clamping members are arranged on the base in a spaced manner along a first direction, and the plurality of first clamping members and the plurality of second clamping members can form a plurality of wafer clamping units arranged along the first direction through a plurality of oppositely arranged first clamping members and second clamping members,
[0008] The first clamping member and the second clamping member of each wafer clamping unit are close to or away from each other in a second direction to clamp or release the wafer, the second direction is perpendicular to the first direction, and the plurality of wafer clamping units are used to clamp a plurality of wafers arranged along the first direction.
[0009] In a second aspect, the application discloses a wafer turnover device, which comprises a second driving part and the wafer clamping mechanism described above, the second driving part is connected to the base, the second driving part drives the wafer clamping mechanism to rotate around a preset axis, and the preset axis is parallel to the second direction.
[0010] The technical solution adopted by the present invention can achieve the following technical effects:
[0011] The wafer clamping mechanism disclosed in the embodiment of the present application improves the structure of the wafer clamping mechanism involved in the related art. By arranging multiple first clamping members and multiple second clamping members, all of which are arranged on the base at intervals along the first direction, multiple first clamping members and multiple second clamping members can be arranged through multiple first clamping members and second clamping members arranged opposite to each other to form multiple wafer clamping units distributed along the first direction, and the first clamping member and the second clamping member of each wafer clamping unit are arranged to approach each other in the second direction to clamp the wafer or move away from each other to loosen the wafer, so that the multiple wafer clamping units can clamp multiple wafers distributed along the first direction, thereby enabling the wafer clamping mechanism to clamp multiple wafers, so that multiple wafers can be flipped at the same time during the flipping process, which is beneficial to improving the flipping efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 1 is a schematic structural diagram of a wafer flipping device disclosed in an embodiment of the present invention;
[0013] Figure 2 yes Figure 1 A top view of
[0014] Figure 3 It is a partial structural diagram of the wafer clamping mechanism disclosed in an embodiment of the present invention;
[0015] Figure 4 yes Figure 3 Schematic diagram of the three-dimensional structure;
[0016] Figure 5 It is a partial structural diagram of the wafer clamping mechanism disclosed in an embodiment of the present invention;
[0017] Figure 6 yes Figure 5 A top view of the middle structure;
[0018] Figure 7 and Figure 8 Schematic diagrams of the structure of the connecting rod mechanism disclosed in the embodiment of the present invention at different viewing angles;
[0019] Figure 9 It is a partial structural diagram of the wafer clamping mechanism disclosed in an embodiment of the present invention;
[0020] Figure 10 It is a partial structural diagram of the wafer clamping mechanism disclosed in an embodiment of the present invention;
[0021] Figure 11 and Figure 12are schematic diagrams of the wafer clamping mechanism disclosed by the embodiments of the present application clamping wafers from different perspectives respectively;
[0022] Figure 13 is a partial perspective structure schematic diagram of the wafer clamping mechanism disclosed by the embodiments of the present application, and it should be noted that, Figure 2 , Figure 3 , Figure 6 , Figure 8 , Figure 11 , Figure 12 The straight arrow in the above figure indicates the moving direction of the component.
[0023] Explanation of reference signs:
[0024] 10-base, 01-first guide rail, 02-second guide rail, 03-third guide rail, 04-fourth guide rail, 11-first base, 12-second base, 13-connection part,
[0025] 20-first clamping part, 21-first connecting frame, 22-first clamping body, 23-fifth sliding block,
[0026] 30-second clamping part, 31-second connecting frame, 32-second clamping body, 33-sixth sliding block,
[0027] 40-wafer,
[0028] 50-first driving part, 51-power source, 511-moving end, 52-linkage part, 521-moving rod, 522-linkage mechanism, 501-first sliding block, 502-second sliding block, 503-third sliding block, 504-first linkage rod, 505-fourth sliding block, 506-second linkage rod,
[0029] 60-first supporting part,
[0030] 70-second supporting part,
[0031] 80-second driving part,
[0032] 90-rack. DETAILED DESCRIPTION
[0033] In order to make the purpose, technical solutions and advantages of the present application clearer, the technical solutions of the present application will be described clearly and completely below in combination with specific embodiments of the present application and corresponding drawings. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0034] The terms "first", "second" in the description and claims of the present application can explicitly or implicitly include one or more of the features.
[0035] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connection" should be understood in a broad sense, for example, it can be fixed connection, or detachable connection, or integrally connected; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.
[0036] Please refer to Figures 1 to 13 The disclosed wafer clamping mechanism includes a base 10 and a plurality of first clamping members 20 and a plurality of second clamping members 30 movably arranged on the base 10.
[0037] The base 10 is the basic component of the wafer clamping mechanism, which can provide a mounting base for other components of the wafer clamping mechanism, for example, the plurality of first clamping members 20 and the plurality of second clamping members 30 are arranged on the base 10 based on the base 10. In addition, the base 10 is also used to form some functional space or structure.
[0038] Please refer to Figure 1 And Figure 2 The first clamping member 20 and the second clamping member 30 are the core components of the wafer clamping mechanism for clamping the wafer 40. The plurality of first clamping members 20 and the plurality of second clamping members 30 are spaced apart, and the plurality of first clamping members 20 and the plurality of second clamping members 30 are spaced apart along the first direction on the base 10. The plurality of first clamping members 20 and the plurality of second clamping members 30 can form a plurality of wafer clamping units distributed along the first direction through a plurality of oppositely arranged first clamping members 20 and second clamping members 30, so that the plurality of wafer clamping units can clamp a plurality of wafers 40 distributed along the first direction respectively.
[0039] Of course, each wafer 40 is clamped and fixed between a pair of oppositely arranged first clamping members 20 and second clamping members 30, and the plurality of first clamping members 20 and the plurality of second clamping members 30 are spaced apart along the first direction on the base 10, so that the plurality of wafers 40 are spaced apart, avoiding the mutual contact between adjacent wafers 40, which can easily cause mutual pollution between adjacent wafers 40.
[0040] In the specific working process, please refer to Figure 2, the first clamping part 20 and the second clamping part 30 of each wafer clamping unit are close to each other in the second direction to clamp the wafer 40 or are away from each other to release the corresponding wafer 40, the second direction is perpendicular to the first direction, and the plurality of wafer clamping units are used to clamp a plurality of wafers 40 distributed along the first direction, wherein the second direction can be parallel to the direction indicated by the left and right arrows Figure 2 The first direction can be perpendicular to the second direction and a third direction described below. Specifically, when the plurality of wafers 40 are clamped, each wafer 40 is clamped and fixed between the oppositely arranged first clamping part 20 and the second clamping part 30, wherein the first clamping part 20 and the second clamping part 30 of each wafer clamping unit abut the opposite sides of the corresponding wafer 40, respectively.
[0041] The wafer clamping mechanism disclosed in the embodiments of the present application improves the structure of the wafer clamping mechanism related to the prior art, sets the plurality of first clamping parts 20 and the plurality of second clamping parts 30 on the base 10 along the first direction, sets the plurality of first clamping parts 20 and the plurality of second clamping parts 30 through the plurality of oppositely arranged first clamping parts 20 and second clamping parts 30 to form a plurality of wafer clamping units distributed along the first direction, and sets the first clamping part 20 and the second clamping part 30 of each wafer clamping unit to be close to each other in the second direction to clamp the wafer 40 or to be away from each other to release the wafer 40, so that the plurality of wafer clamping units can correspondingly clamp a plurality of wafers 40 distributed along the first direction, thereby enabling the wafer clamping mechanism to clamp a plurality of wafers 40, enabling the plurality of wafers 40 to be flipped simultaneously in the flipping process, and thereby facilitating to improve the flipping efficiency.
[0042] In one embodiment, the wafer clamping mechanism can be provided with a manual driving part, such as a manual operation key, so that the plurality of first clamping parts 20 and the plurality of second clamping parts 30 can be controlled through the linkage mechanism (such as a connecting rod mechanism) by the manual operation key, so that the first clamping part 20 and the second clamping part 30 of each wafer clamping unit are close to each other in the second direction to clamp the wafer 40 or are away from each other to release the wafer 40.
[0043] In other embodiments, as shown in Figures 1 to 3 The wafer clamping mechanism can further include a first driving part 50, the first driving part 50 can be arranged on the base 10, and the first driving part 50 can be connected to the plurality of first clamping parts 20 and the plurality of second clamping parts 30 respectively to drive the plurality of first clamping parts 20 and the plurality of second clamping parts 30, so that the first driving part 50 can be used to drive the plurality of first clamping parts 20 and the plurality of second clamping parts 30 to be close to or away from each other, thereby enabling the wafer clamping mechanism to automatically clamp or release the wafer 40, and facilitating to improve the automation degree of the wafer clamping mechanism.
[0044] In an optional technical solution, the first driving part 50 can be connected with the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 respectively, so that the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 can be simultaneously driven by one driving part 50, which is beneficial to improve the synchronization performance, thereby reducing the risk that the first clamping piece 20 and the second clamping piece 30 of each wafer clamping unit cannot simultaneously approach or move away from the wafer 40 in the second direction, thereby causing the wafer 40 to be difficult to be normally clamped or released, and this structure only needs the first driving part 50, thereby being beneficial to save costs. Of course, the first driving part 50 can be one, thereby being beneficial to simplify the structure, and the first driving part 50 can also be at least two, so that the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 can be respectively and independently driven by the at least two first driving parts 50, so as to achieve more efficient driving.
[0045] In a further technical solution, please refer to Figures 1 to 3 , the first driving part 50 can include a power source 51 and a linkage 52. Wherein, the power source 51 can be arranged on the base 10, as shown in Figure 1 and 3 , the power source 51 can include a moving end 511 which can move in the second direction, the moving end 511 can be connected with the plurality of first clamping pieces 20, so as to drive the first clamping pieces 20 to move in the second direction through the moving end 511, thereby realizing the movement of the first clamping pieces 20. Specifically, the power source 51 can be a linear motor or a linear cylinder, and the present application does not limit this.
[0046] As shown in Figure 2 , the linkage 52 can include a moving rod 521 and a linkage mechanism 522, the moving rod 521 can be slidably arranged on the base 10, the linkage mechanism 522 can be arranged on the base 10 and can be connected with the plurality of second clamping pieces 30, and the moving end 511 can drive the plurality of first clamping pieces 20 and the moving rod 521 to move in the same direction. Specifically, the moving end 511 can be connected with the moving rod 521, thereby driving the moving rod 521 to move, so that the plurality of first clamping pieces 20 and the moving rod 521 are both driven by the moving end 511 to move in the second direction.
[0047] At the same time, the moving rod 521 can drive the plurality of second clamping pieces 30 to move through the linkage mechanism 522, so that the moving end 511 can simultaneously drive the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 to move, and of course, the moving direction of the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 is opposite, so that when the first clamping piece 20 and the second clamping piece 30 of each wafer clamping unit approach or move away from the wafer 40 between the first clamping piece 20 and the second clamping piece 30 of each wafer clamping unit in the second direction, the wafer 40 can be clamped or released.
[0048] In one possible implementation, as shown in Figure 7 and Figure 8 , the linkage mechanism 522 can include a first slider 501, a second slider 502, a third slider 503, and two first links 504. The first slider 501 and the second slider 502 can be spaced apart and slidingly disposed on the base 10 in a direction parallel to the second direction, such that the first slider 501 and the second slider 502 can slide on the base 10 in the direction parallel to the second direction, and interference between the first slider 501 and the second slider 502 can be avoided to affect the normal sliding of the first slider 501 and the second slider 502.
[0049] The first slider 501 can be connected to the moving end 511 through a moving rod 521, such that the first slider 501 can be indirectly driven by the moving end 511. The second slider 502 can be connected to the plurality of second clamping members 30. The two first links 504 can be located on the same side of the first slider 501 and the second slider 502, for example, as shown in Figure 8 . The two first links 504 can be located on the left side of the slider group composed of the first slider 501 and the second slider 502 in the perspective view, as shown in Figure 8 . The two ends of one of the first links 504 can be rotatably connected to the first slider 501 and the third slider 503, respectively. The two ends of the other first link 504 can be rotatably connected to the second slider 502 and the third slider 503, respectively. The third slider 503 can slide in a third direction, and the third slider 503 is located between the first slider 501 and the second slider 502, such that the first slider 501 can drive the second slider 502 to move through the two first links 504 and the third slider 503, thereby driving the plurality of second clamping members 30 connected to the second slider 502 to move towards the direction opposite to the plurality of first clamping members 20.
[0050] In addition, the third slider 503 can be limited in cooperation with the base 10 in the second direction, so as to avoid the third slider 503 from sliding in the second direction and being difficult to drive the second slider 502 to move in the second direction through the first link 504. The third direction can be perpendicular to the first direction and the second direction, respectively.
[0051] It should be noted that, as shown in Figure 8 , the third direction is parallel to the direction indicated by the arrows of the left-right direction in Figure 8 . The second direction is parallel to the direction indicated by the arrows of the up-down direction in Figure 8 .
[0052] In the specific working process, the mobile terminal 511 drives the plurality of first clamping pieces 20 and the moving rod 521 to move in the same direction along the second direction, the moving rod 521 drives the first sliding block 501 to slide along the same direction as the movement direction of the plurality of first clamping pieces 20, the first sliding block 501 drives the third sliding block 503 to slide along the third direction through the first connecting rod 504 connected with the first sliding block 501 and the third sliding block 503 respectively, the third sliding block 503 drives the second sliding block 502 to slide along the second direction through the first connecting rod 504 connected with the second sliding block 502 and the third sliding block 503 respectively, and the sliding direction of the second sliding block 502 is opposite to that of the first sliding block 501, and the plurality of second clamping pieces 30 are connected with the second sliding block 502 respectively, and the plurality of first clamping pieces 20 have the same movement direction as the first sliding block 501, so that the movement directions of the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 are opposite.
[0053] When the first sliding block 501 moves along the second direction to approach the third sliding block 503, the third sliding block 503 is pushed by the first connecting rod 504 connected with the first sliding block 501 and the third sliding block 503 respectively to move along the third direction away from the first sliding block 501, so as to pull the second sliding block 502 along the second direction to approach the third sliding block 503 through the first connecting rod 504 connected with the second sliding block 502 and the third sliding block 503 respectively, so that the second sliding block 502 and the first sliding block 501 approach each other, the plurality of second clamping pieces 30 are connected with the second sliding block 502 respectively, and the plurality of first clamping pieces 20 have the same movement direction as the first sliding block 501, so that the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 approach each other.
[0054] When the first sliding block 501 moves along the second direction to move away from the third sliding block 503, the third sliding block 503 is pulled by the first connecting rod 504 connected with the first sliding block 501 and the third sliding block 503 respectively to move along the third direction to approach the first sliding block 501, so as to push the second sliding block 502 along the second direction to move away from the third sliding block 503 through the first connecting rod 504 connected with the second sliding block 502 and the third sliding block 503 respectively, so that the second sliding block 502 and the first sliding block 501 move away from each other, the plurality of second clamping pieces 30 are connected with the second sliding block 502 respectively, and the plurality of first clamping pieces 20 have the same movement direction as the first sliding block 501, so that the plurality of first clamping pieces 20 and the plurality of second clamping pieces 30 move away from each other.
[0055] In this structure, the movable end 511 only needs to move in one direction to make the second slider 502 slide in opposite directions to the first slider 501, so that the multiple first clamping members 20 and the multiple second clamping members 30 move in opposite directions, thereby enabling the first clamping member 20 and the second clamping member 30 of each wafer clamping unit to move closer to or away from the wafer 40 in the second direction to achieve clamping or loosening of the wafer 40.
[0056] Of course, the link mechanism 522 may further include a fourth slider 505 and two second links 506. The fourth slider 505 may be slidably disposed on the base 10 and may slide in a direction opposite to that of the third slider 503, so that the third slider 503 and the fourth slider 505 move closer to or further away from each other. The two second links 506 may be located on the same side of the first slider 501 and the second slider 502. For example, see Figure 8 The two second connecting rods 506 can be located in the slider group composed of the first slider 501 and the second slider 502. Figure 8 On the right side of the viewing angle, both ends of a second connecting rod 506 can be rotatably connected to the first slider 501 and the fourth slider 505 respectively, and both ends of another second connecting rod 506 can be rotatably connected to the second slider 502 and the fourth slider 505 respectively.
[0057] In this structure, if Figure 8 As shown, the third slider 503 and the fourth slider 505 are respectively connected to the opposite sides of the first slider 501 and the second slider 502, so that the first slider 501 can transmit the driving force to the second slider 502 in a more balanced manner through the first connecting rod 504 and the second connecting rod 506 respectively connected to the third slider 503 and the fourth slider 505, thereby being able to stably drive multiple second clamping members 30, which is beneficial to improving the stability and reliability of the wafer clamping mechanism.
[0058] During operation, the movable end 511 drives the first clamping members 20 and the movable rod 521 to move in the same direction along the second direction, and the movable rod 521 drives the first slider 501 to slide in the same direction as the movement direction of the first clamping members 20. When the first slider 501 is driven by the movable end 511 to approach the third slider 503 along the second direction, the fourth slider 505 is pushed by the second connecting rod 506 connected to the first slider 501 and the fourth slider 505 respectively and moves away from the first slider 501 along the third direction. The second slider 502 is pulled by the second connecting rod 506 connected to the second slider 502 and the fourth slider 505 respectively and moves toward the third slider 503 along the second direction, so that the second slider 502 and the first slider 501 approach each other and the third slider 503 and the fourth slider 505 move away from each other, thereby bringing the first clamping members 20 and the second clamping members 30 closer to each other.
[0059] When the first slider 501 is driven by the moving end 511 to move away from the third slider 503 along the second direction, the fourth slider 505 is pulled by the second connecting rod 506 connected with the first slider 501 and the fourth slider 505 respectively to move towards the first slider 501 along the third direction, and the second slider 502 is pushed by the second connecting rod 506 connected with the second slider 502 and the fourth slider 505 respectively to move away from the third slider 503 along the second direction, so that the second slider 502 moves away from the first slider 501, and the third slider 503 and the fourth slider 505 move towards each other, so that the plurality of first clamping parts 20 and the plurality of second clamping parts 30 move away from each other.
[0060] Please continue to refer to Figure 7 and Figure 8 In order to improve the stability of the sliding of the first slider 501 and the second slider 502, the base 10 can include a first guide rail 01, and the first slider 501 and the second slider 502 can be respectively in sliding fit with the first guide rail 01, so that the first slider 501 and the second slider 502 can be guided to slide by the first guide rail 01, of course, the extension direction of the first guide rail 01 is parallel to the second direction, so as to avoid the first slider 501 and the second slider 502 deviating from the second direction when sliding, so that the first slider 501 and the second slider 502 can slide more stably, so that the plurality of second clamping parts 30 can be driven more stably, thereby facilitating to improve the stability and reliability of the wafer clamping mechanism.
[0061] In order to improve the stability of the sliding of the third slider 503 and the fourth slider 505, the base 10 can include a second guide rail 02, and the third slider 503 and the fourth slider 505 can be respectively in sliding fit with the second guide rail 02, so that the third slider 503 and the fourth slider 505 can be guided to slide by the second guide rail 02, of course, the extension direction of the second guide rail 02 is parallel to the third direction, so as to avoid the third slider 503 and the fourth slider 505 deviating from the third direction when sliding, so that the third slider 503 and the fourth slider 505 can slide more stably, so that the second clamping part 30 can be driven more stably, thereby facilitating to further improve the stability and reliability of the wafer clamping mechanism.
[0062] In the embodiments of the present application, please refer to Figures 1 to 3, the base 10 can include a first base 11, a second base 12 and a connecting part 13, the first base 11 and the second base 12 can be arranged at intervals, and the first base 11 can be fixedly connected with the second base 12 through the connecting part 13, the arrangement direction of the first base 11 and the second base 12 can be parallel to the second direction, the power source 51 and the plurality of first clamping parts 20 can be arranged on the first base 11, and the plurality of second clamping parts 30 can be arranged on the second base 12, so as to facilitate the mutual approach or separation of the plurality of first clamping parts 20 and the plurality of second clamping parts 30, and to have sufficient space between the first base 11 and the second base 12 for accommodating the wafer 40. The moving rod 521 can be connected between the first base 11 and the second base 12, so as to play a dual-purpose role, so that the moving rod 521 can not only play a transmission role, but also play a role of connecting the first base 11 and the second base 12, thereby being able to fully utilize the moving rod 521.
[0063] In one possible technical solution, referring to Figure 3 and Figure 4 , the first clamping part 20 can include a first connecting frame 21 and a plurality of first clamping bodies 22 which are arranged at intervals and can be fixedly connected with the first connecting frame 21, so as to clamp a plurality of parts of the wafer 40 through the plurality of first clamping bodies 22, and facilitate the constraint of the radial movement of the wafer 40, further fix the wafer 40, and thereby facilitate the improvement of the clamping effect, so that the wafer clamping mechanism is more reliable. Wherein, the first connecting frame 21 is slidably arranged on the base 10 along the second direction to drive the plurality of first clamping bodies 22 to approach or separate from the wafer 40 along the second direction, so as to realize the clamping or loosening of the wafer 40 by cooperating with the second clamping part 30.
[0064] In order to improve the stability of the movement of the first clamping part 20, the base 10 can include a third guide rail 03, and the first connecting frame 21 can be provided with a fifth sliding block 23, the fifth sliding block 23 can be guided in the second direction with the third guide rail 03, that is, the extension direction of the third guide rail 03 can be parallel to the second direction, so as to guide the first connecting frame 21 to slide along the second direction relative to the base 10 through the fifth sliding block 23, and to avoid the swinging of the first connecting frame 21 as much as possible during the sliding process, so as to improve the stability of the sliding of the first connecting frame 21, and thereby to enable the first clamping part 20 to move stably. Of course, the third guide rail 03 and the fifth sliding block 23 can be a plurality of and one-to-one correspondence, so as to further improve the stability of the sliding of the first connecting frame 21, and thereby to further improve the stability of the movement of the first clamping part 20.
[0065] Further, in the embodiment that the wafer clamping mechanism comprises the first driving part 50, the first driving part 50 can be rotatably connected with the first connecting frame 21, and can drive the first connecting frame 21 to move the plurality of first clamping bodies 22 along the second direction. Such a structure can be compatible with the assembly error between the first driving part 50 and the first connecting frame 21, so that the first driving part 50 and the first connecting frame 21 can be rotatably connected. Specifically, as shown in Figure 3 and Figure 4 the moving end 511 of the first driving part 50 can be rotatably connected with the first connecting frame 21, so that the first connecting frame 21 can swing relative to the moving end 511, thereby adjusting the connection angle between the first connecting frame 21 and the moving end 511, avoiding the situation that the first connecting frame 21 is difficult to be normally driven by the moving end 511 of the first driving part 50 due to assembly error, thereby easily causing the first connecting frame 21 to be stuck, and further facilitating to improve the reliability of the wafer clamping mechanism.
[0066] In the embodiments of the present application, please refer to Figure 5 and Figure 6 The second clamping part 30 can comprise a second connecting frame 31 and a plurality of second clamping bodies 32 which are spaced apart and can be fixedly connected with the second connecting frame 31, so that the plurality of second clamping bodies 32 can clamp a plurality of parts of the wafer 40, to facilitate clamping, and such a structure can constrain the radial movement of the wafer 40, and can further fix the wafer 40, thereby facilitating to improve the clamping effect and making the wafer clamping mechanism more reliable. The second connecting frame 31 can be slidably arranged on the base 10 along the second direction, to drive the plurality of second clamping bodies 32 to move closer to or away from the wafer 40 along the second direction, thereby realizing clamping or releasing of the wafer 40 by cooperating with the first clamping part 20.
[0067] In order to improve the stability of the movement of the second clamping part 30, the base 10 can comprise a fourth guide rail 04, and the second connecting frame 31 can be provided with a sixth sliding block 33, and the sixth sliding block 33 and the fourth guide rail 04 can be guided in the second direction, that is, the extension direction of the fourth guide rail 04 can be parallel to the second direction, so that the second connecting frame 31 can be guided to slide relative to the base 10 along the second direction by the sixth sliding block 33, and the situation that the second connecting frame 31 swings during sliding is avoided as much as possible, so as to improve the stability of the sliding of the second connecting frame 31, thereby enabling the second clamping part 30 to move stably. Of course, the fourth guide rail 04 and the sixth sliding block 33 can be a plurality of and one-to-one correspondence, thereby further improving the stability of the sliding of the second connecting frame 31, and further facilitating to further improve the stability of the movement of the second clamping part 30.
[0068] Optionally, in the case that the wafer clamping mechanism comprises the first driving part 50, the first driving part 50 can be rotatably connected with the second connecting frame 31, and can drive the second connecting frame 31 to move the plurality of second clamping bodies 32 along the second direction. This structure can be compatible with the assembly error between the first driving part 50 and the second connecting frame 31, so that the first driving part 50 and the second connecting frame 31 can be connected by rotation. Specifically, as shown in Figure 6 , the linkage 52 of the first driving part 50 can be rotatably connected with the second connecting frame 31, so that the second connecting frame 31 can swing relative to the linkage 52, thereby adjusting the connection angle between the second connecting frame 31 and the linkage 52, avoiding the situation that the second connecting frame 31 is difficult to be normally driven by the linkage 52 of the first driving part 50 due to assembly error, thereby easily leading to the situation that the second connecting frame 31 is stuck, and further facilitating to improve the reliability of the wafer clamping mechanism.
[0069] Please refer to Figures 1 to 5 and Figures 10 to 13 , the wafer clamping mechanism can further comprise a plurality of first support parts 60 and a plurality of second support parts 70, as shown in Figure 4 and Figure 5 , the plurality of first support parts 60 and the plurality of second support parts 70 can be distributed at intervals, and the plurality of first support parts 60 and the plurality of second support parts 70 can be fixed on the base 10 at intervals along the first direction. The oppositely distributed first support parts 60 and second support parts 70 are used to support the wafers 40 clamped by the wafer clamping units adjacent thereto. As shown in Figure 13 , this structure can support a plurality of wafers 40 distributed at intervals along the first direction by the cooperation of each first support part 60 and the corresponding second support part 70.
[0070] As shown in Figure 12 and Figure 13 , the plurality of first clamping parts 20 and the plurality of first support parts 60 can be staggered in the first direction to avoid interference between the plurality of first clamping parts 20 and the plurality of first support parts 60 in the first direction. The plurality of second clamping parts 30 and the plurality of second support parts 70 can be staggered in the first direction to avoid interference between the plurality of second clamping parts 30 and the plurality of second support parts 70 in the first direction, thereby avoiding mutual interference between the plurality of first clamping parts 20 and the plurality of first support parts 60 and between the plurality of second clamping parts 30 and the plurality of second support parts 70.
[0071] Specifically, the plurality of first support parts 60 and the plurality of second support parts 70 can form a plurality of support units distributed at intervals along the first direction through a plurality of oppositely distributed first support parts 60 and second support parts 70, as shown in Figure 13As shown, the plurality of support units are capable of supporting the plurality of wafers 40 distributed along the first direction, so as to avoid the mutual contact of the plurality of wafers 40, and thus the mutual contamination between the adjacent wafers 40. In this structure, the plurality of support units formed by the plurality of first support portions 60 and the plurality of second support portions 70 are used to support the wafers 40 clamped by the wafer clamping units adjacent to each support unit, that is, each wafer 40 is clamped by the corresponding wafer clamping unit while being supported by the corresponding support unit, so that the plurality of wafers 40 distributed along the first direction are supported by the plurality of support units and clamped by the plurality of wafer clamping units, respectively.
[0072] In this structure, when clamping the wafers 40, the first clamping member 20 and the second clamping member 30 of each wafer clamping unit abut against the side of the wafer 40, which leads to the risk of the wafer 40 falling off from the wafer clamping mechanism due to shaking in the case of accidental impact of external force on the wafer clamping mechanism, and thus the wafer 40 is broken. Therefore, the first support portion 60 and the second support portion 70 support the wafer 40 clamped by the wafer clamping units adjacent to the two, and can support the surface perpendicular to the side of the wafer 40 (i.e., the back or front of the wafer 40), so as to avoid the wafer 40 from falling off due to shaking in the case of accidental impact of external force on the wafer clamping mechanism, and thus the clamping effect is improved, which is conducive to further improving the reliability of the wafer clamping mechanism.
[0073] Based on the wafer clamping mechanism disclosed in the present application, the present application further discloses a wafer turnover device. The wafer turnover device disclosed in the present application comprises the second driving portion 80 and the wafer clamping mechanism of any one of the above embodiments. The second driving portion 80 is connected to the base 10, and the second driving portion 80 drives the wafer clamping mechanism to rotate around the preset axis, which is parallel to the second direction.
[0074] In the specific working process, the second driving portion 80 drives the wafer clamping mechanism to rotate around the preset axis through the base 10. Since the wafer clamping mechanism can clamp a plurality of wafers 40 at the same time, the wafer turnover device can perform the turnover operation on the plurality of wafers 40 at the same time, so as to improve the turnover efficiency. In addition, the second driving portion 80 can be a motor or a rotary air cylinder, and the present application does not limit this.
[0075] Of course, the wafer clamping mechanism can also comprise a rack 90, and the second driving portion 80 can be arranged on the rack 90 to facilitate the installation of the second driving portion 80.
[0076] The above embodiments of the present application mainly describe the differences between the embodiments. The different optimization features of the embodiments can be combined to form a more optimal embodiment as long as they are not contradictory. Considering the brevity of the writing, the details are not described here.
[0077] The embodiments of the present application are described above with reference to the accompanying drawings, but the present application is not limited to the above-described specific embodiments, and the above-described specific embodiments are merely illustrative, but not restrictive, and a person of ordinary skill in the art can make many forms under the inspiration of the present application without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection of the present application.
Claims
1. A wafer clamping mechanism, characterized in that: The invention comprises a base (10) and a plurality of first clamping members (20) and a plurality of second clamping members (30) movably arranged on the base (10). The plurality of first clamping members (20) and the plurality of second clamping members (30) are distributed at intervals, and the plurality of first clamping members (20) and the plurality of second clamping members (30) are arranged on the base (10) at intervals along a first direction. The plurality of first clamping members (20) and the plurality of second clamping members (30) can form a plurality of wafer clamping units distributed along the first direction by the plurality of first clamping members (20) and the second clamping members (30) arranged relatively to each other. The first clamping member (20) and the second clamping member (30) of each wafer clamping unit move closer to each other in a second direction to clamp a wafer (40) or move away from each other to release the wafer (40), wherein the second direction is perpendicular to the first direction, and the plurality of wafer clamping units are used for clamping a plurality of wafers (40) distributed along the first direction.
2. The wafer clamping mechanism according to claim 1, wherein: The wafer clamping mechanism further includes a first driving portion (50), which is provided on the base (10), and the first driving portion (50) is respectively connected to the plurality of first clamping members (20) and the plurality of second clamping members (30), and the first driving portion (50) is used to drive the plurality of first clamping members (20) and the plurality of second clamping members (30) to move closer to or away from each other.
3. The wafer clamping mechanism according to claim 2, wherein: The first driving part (50) is connected to the plurality of first clamping members (20) and the plurality of second clamping members (30) respectively. The first driving part (50) includes a power source (51) and a linkage member (52). The power source (51) is arranged on the base (10), and the power source (51) includes a movable end (511) that can move along the second direction, and the movable end (511) is connected to the multiple first clamping members (20). The linkage member (52) includes a movable rod (521) and a connecting rod mechanism (522). The movable rod (521) is slidably arranged on the base (10), and the connecting rod mechanism (522) is arranged on the base (10) and is connected to the multiple second clamping members (30). The movable end (511) drives the multiple first clamping members (20) and the movable rod (521) to move in the same direction, and the movable rod (521) can drive the multiple second clamping members (30) to move through the connecting rod mechanism (522).
4. The wafer clamping mechanism according to claim 3, wherein: The link mechanism (522) includes a first slider (501), a second slider (502), a third slider (503) and two first links (504). The first slider (501) and the second slider (502) are arranged on the base (10) in a sliding manner and spaced apart in a direction parallel to the second direction. The first slider (501) is connected to the movable end (511) via the movable rod (521). The second slider (502) is connected to the plurality of second clamping members (30). The two first connecting rods (504) are located on the same side of the first slider (501) and the second slider (502). The two ends of one first connecting rod (504) are respectively connected to the first slider (501) and the third slider (503) for rotation, and the two ends of another first connecting rod (504) are respectively connected to the second slider (502) and the third slider (503) for rotation. The third slider (503) slides along a third direction and is limitedly engaged with the base (10) in the second direction. The third direction is perpendicular to the first direction and the second direction.
5. The wafer clamping mechanism according to claim 4, wherein: The base (10) comprises a first guide rail (01), and the first slider (501) and the second slider (502) are respectively slidably engaged with the first guide rail (01).
6. The wafer clamping mechanism according to claim 4, wherein: The connecting rod mechanism (522) further includes a fourth slider (505) and two second connecting rods (506). The fourth slider (505) is slidably arranged on the base (10) and has a sliding direction opposite to that of the third slider (503). The two ends of one second connecting rod (506) are respectively connected to the first slider (501) and the fourth slider (505) for rotation, and the two ends of the other second connecting rod (506) are respectively connected to the second slider (502) and the fourth slider (505) for rotation.
7. The wafer clamping mechanism according to claim 6, wherein: The base (10) comprises a second guide rail (02), and the third slider (503) and the fourth slider (505) are respectively slidably matched with the second guide rail (02).
8. The wafer clamping mechanism according to claim 3, wherein: The base (10) includes a first base (11), a second base (12) and a connecting portion (13); the first base (11) and the second base (12) are spaced apart, and the first base (11) is fixedly connected to the second base (12) via the connecting portion (13); the power source (51) and the plurality of first clamping members (20) are both provided on the first base (11); the plurality of second clamping members (30) are provided on the second base (12); and the moving rod (521) is connected between the first base (11) and the second base (12).
9. The wafer clamping mechanism according to claim 1, wherein: The first clamping member (20) comprises a first connecting frame (21) and a plurality of first clamping bodies (22) that are spaced apart and fixedly connected to the first connecting frame (21); the first connecting frame (21) is slidably arranged on the base (10) along the second direction.
10. The wafer clamping mechanism according to claim 9, wherein: The base (10) includes a third guide rail (03), the first connecting frame (21) is provided with a fifth slider (23), the fifth slider (23) and the third guide rail (03) are guided and matched in the second direction, and the wafer clamping mechanism also includes a first driving part (50), the first driving part (50) is rotatably connected to the first connecting frame (21), and drives the first connecting frame (21) to drive the multiple first clamping bodies (22) to move along the second direction.
11. The wafer clamping mechanism according to claim 1, wherein: The second clamping member (30) includes a second connecting frame (31) and a plurality of second clamping bodies (32) that are spaced apart and fixedly connected to the second connecting frame (31). The second connecting frame (31) is slidably arranged on the base (10) along the second direction.
12. The wafer clamping mechanism according to claim 11, wherein: The base (10) includes a fourth guide rail (04), the second connecting frame (31) is provided with a sixth slider (33), the sixth slider (33) and the fourth guide rail (04) are guided and matched in the second direction, and the wafer clamping mechanism also includes a first driving part (50), the first driving part (50) is rotatably connected to the second connecting frame (31), and drives the second connecting frame (31) to drive the plurality of second clamping bodies (32) to move along the second direction.
13. The wafer clamping mechanism according to claim 1, wherein: The wafer clamping mechanism further comprises a plurality of first supporting parts (60) and a plurality of second supporting parts (70), The plurality of first support parts (60) and the plurality of second support parts (70) are distributed at intervals, and the plurality of first support parts (60) and the plurality of second support parts (70) are fixed on the base (10) at intervals along the first direction, the plurality of first clamping members (20) and the plurality of first support parts (60) are staggered in the first direction, and the plurality of second clamping members (30) and the plurality of second support parts (70) are staggered in the second direction, and the relatively distributed first support parts (60) and second support parts (70) are used to support the wafer (40) clamped by the wafer clamping unit adjacent to the first support parts (60) and the second support parts (70).
14. A wafer flipping device, characterized in that: It comprises a second driving part (80) and a wafer clamping mechanism according to any one of claims 1 to 13, wherein the second driving part (80) is connected to the base (10), and the second driving part (80) drives the wafer clamping mechanism to rotate around a preset axis, and the preset axis is parallel to the second direction.