Heat dissipation mechanism, heat dissipation module and antenna device comprising heat dissipation mechanism and heat dissipation module

Abstract

The present invention relates to a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, the heat dissipation mechanism comprising: a heat storage part for collecting heat generated from a heat generating body; and a heat release part which is formed so as to diffuse and exchange the heat collected in the heat storage part, and which is formed so that at least the tip thereof extends to a heat exchange region outside a case main body to which the heating element is provided so as to occupy a part of the heat exchange region, thereby enabling active heat exchange in the heat exchange region. And the heat dissipation surface area is easy to expand, so that the heat dissipation performance can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, and more particularly, to a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which can improve heat dissipation performance of an electronic device including an antenna device that generates a large amount of heat during operation. BACKGROUND

[0002] Wireless communication technology (for example, Multiple Input Multiple Output (MIMO) technology) is a technology that greatly increases data transmission capacity by using multiple antennas, and is a spatial multiplexing technology that transmits different data from each of the transmission antennas in the transmitter and distinguishes the transmitted data through appropriate signal processing in the receiver.

[0003] Therefore, as the number of transceiving antennas is simultaneously increased, the channel capacity is increased, so that more data can be transmitted. For example, if the number of antennas is increased to 10, about 10 times the channel capacity is obtained by using the same frequency band compared to the current single antenna system.

[0004] Up to 8 antennas are used in 4G-advanced Long Term Evolution (LTE-advanced), products installed with 64 or 128 antennas have been developed in the pre-5G stage, and base station equipment with a larger number of antennas is used in 5G, which is called Massive MIMO technology. In contrast to the current Cell operation, which is two-dimensional (2-Dimension), if the Massive MIMO technology is introduced, three-dimensional beamforming (3D-Beamforming) can be achieved, so it is also called Full Dimension Multiple Input Multiple Output technology (FD-MIMO).

[0005] In the Massive MIMO technology, as the number of ANTs increases, the number of transmitters and filters also increases.

[0006] However, considering the rental fee or spatial limitation of the installation site, it is necessary to make the RF components (antennas / filters / power amplifiers / transceivers, etc.) smaller, lighter, and cheaper, and in order to expand the coverage of Massive MIMO, in the case of manufacturing at a high output level of 320W or 640W, the power consumed by the high output components (RF components) and the amount of heat generated act as negative factors in reducing weight and size.

[0007] Thus, recently, in order to adjust the radiation direction of a radiation beam in a site where an antenna device is installed, a lightweight antenna unit serving as an object of tilting or steering operation is separately separated, and a heat generating body is concentratedly disposed in a radio unit (RU) fixed to a fixed structure such as a support pole, and researches for improving heat dissipation performance are actively conducted. SUMMARY

[0008] The present application has been made to solve the above technical problems, and aims to provide a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which effectively release heat generated from an electronic device such as an antenna device, while preventing an increase in weight of an antenna unit requiring directional adjustment, thereby improving on-site operability.

[0009] Also, another object of the present application is to provide a heat dissipation mechanism, a heat dissipation module, and an antenna device including the same, which can overcome a limitation of an increase in heat dissipation surface area due to thermal conductivity of a material itself, and can design a heat dissipation structure of various shapes.

[0010] Technical problems of the present application are not limited to the above-mentioned technical problems, and other technical problems not mentioned above can be clearly understood by those skilled in the art to which the present application pertains, through the following description.

[0011] The heat dissipation mechanism according to an embodiment of the present application includes a heat receiving portion that traps heat generated from a heat generating body, and a heat releasing portion that is formed to diffuse and exchange heat trapped in the heat receiving portion, and at least extends a front end to an outside of a heat exchange region of a housing main body in which the heat generating body is installed, to occupy a portion of the heat exchange region.

[0012] The heat exchange region occupied by the heat releasing portion can correspond to a direct upper portion of the housing main body.

[0013] In addition, the heat receiving portion can be integrally formed with the heat releasing portion.

[0014] In addition, the heat receiving portion can be a heat pipe in which a refrigerant flowing while undergoing a phase change is filled, and the heat releasing portion can be a heat sink fin in which a refrigerant flowing while undergoing a phase change is filled.

[0015] In addition, the heat receiving portion can be a heat pipe in which a refrigerant flowing while undergoing a phase change is filled, and the heat releasing portion can be a heat sink fin in which a refrigerant flowing while undergoing a phase change is filled.

[0016] In addition, the heat receiving portion and the heat releasing portion can form a refrigerant flow space to fill a refrigerant flowing while undergoing a phase change.

[0017] Further, the heat receiving portion can include an evaporation region in which the refrigerant is phase changed into a gaseous state, and the heat releasing portion can include a condensation region in which the refrigerant is phase changed into a liquid state by heat exchange with outside air of the heat exchange region.

[0018] Further, the heat receiving portion and the heat releasing portion can be integrally formed of a predetermined metal material.

[0019] Further, when the heat receiving portion is arranged to overlap in a front-rear direction with respect to a front surface portion or a rear surface portion of the housing body, the heat releasing portion can extend more upward than an upper end of the housing body, and can extend to occupy at least a portion of a heat exchange region corresponding to a straight upward direction in a front-rear thickness direction of the housing body.

[0020] Further, when a plurality of the heat radiation mechanisms are combined with the front surface portion and the rear surface portion of the housing body, a rear end of the heat releasing portion of the heat radiation mechanism provided to the front surface portion of the housing body and a front end of the heat releasing portion of the heat radiation mechanism provided to the rear surface portion of the housing body can be arranged to have a predetermined interval distance in the front-rear direction across the heat exchange region.

[0021] Further, one surface of the heat receiving portion can be surface-thermally contacted to a heat-generating surface of the heat-generating body, and the other surface can be combined with a coupling heat transfer body equipped to mediate coupling to the housing body, thereby transferring heat from the heat-generating body.

[0022] Further, the heat receiving portion can have a thickness and a length inserted into a fixing slot formed in the other surface of the coupling heat transfer body.

[0023] Further, the heat releasing portion can have an edge end portion bent and extended from the heat receiving portion at a predetermined angle in a manner of occupying the heat exchange region.

[0024] A heat radiation module according to an embodiment of the present application includes a heat radiation mechanism including a heat receiving portion that traps heat generated from a heat-generating body and a heat releasing portion formed to diffuse and exchange heat trapped in the heat receiving portion and to extend at least a front end to a heat exchange region outside a housing body equipped with the heat-generating body to occupy a portion of the heat exchange region, and a heat trapping portion including a coupling heat transfer body in which a substrate receiving portion is formed in one surface to receive a PA board, a plurality of fixing slots are formed in the other surface to provide the heat radiation mechanism, and a refrigerant capable of phase change is filled inside.

[0025] The heat trapping portion can further include a shield coupled to the coupling heat transfer body to prevent internal refrigerant leakage while forming one surface of the coupling heat transfer body, and a plurality of support pins disposed between the other surface of the coupling heat transfer body and the shield.

[0026] In addition, one end of the plurality of support pins can be supported on the shield, and the other end can be supported on the other surface of the coupling heat transfer body between the plurality of fixing slots in the other surface.

[0027] In addition, a refrigerant flow space formed inside the coupling heat transfer body and inside the plurality of heat dissipation mechanisms can be formed to be in communication with each other.

[0028] An antenna device according to an embodiment of the present application includes a housing body formed with a disposition space in which an RF filter portion is disposed, and a heat dissipation module coupled to a front surface portion or a rear surface portion of the housing body, wherein the heat dissipation module includes a heat trapping portion trapping heat generated from a heat generating body, and a heat releasing portion formed to diffuse and exchange heat trapped in the heat trapping portion, at least a front end extending to an outside of a heat exchange region of the housing body in which the heat generating body is disposed to occupy a portion of the heat exchange region.

[0029] The housing body can include a center housing formed with the disposition space in which the RF filter portion is disposed, a front heat dissipation housing coupled to a front surface portion of the center housing, and a rear heat dissipation housing coupled to a rear surface portion of the center housing, and the heat dissipation module can include a front heat dissipation module disposed in the front heat dissipation housing, and a rear heat dissipation module disposed in the rear heat dissipation housing, wherein a plurality of module coupling grooves mediating coupling of the front heat dissipation module and the rear heat dissipation module can be formed in the front heat dissipation housing and the rear heat dissipation housing.

[0030] In addition, when the heat trapping portion is disposed to overlap in a front-rear direction with respect to the front surface portion or the rear surface portion of the housing body, the heat releasing portion of the front heat dissipation module and the rear heat dissipation module can extend upward more than an upper end of the housing body, and can extend to occupy at least a portion of a heat exchange region corresponding to a straight upward direction of a front-rear thickness direction of the housing body.

[0031] The heat dissipation mechanism, the heat dissipation module, and the antenna device including the same according to an embodiment of the present application have an effect of effectively releasing heat generated from an electronic device including the antenna device while preventing an increase in weight of the entire product, thereby improving operability in the field.

[0032] Further, the heat dissipation mechanism, the heat dissipation module, and the antenna device including the same according to an embodiment of the present application have the effect of being able to overcome the limitation of the thermal conductivity of the material itself and being able to suppress the expansion of the size of the product when designed in a manner of increasing the surface area of heat dissipation. BRIEF DESCRIPTION OF DRAWINGS

[0033] Figure 1a Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0034] Figure 2 are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application. Figure 1a Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0035] Figure 3 are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application. Figure 1a Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0036] Figure 4a Figure 4b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0037] Figure 5a Figure 5b are exploded perspective views of the back clamping part of Figure 4a Figure 4b are exploded perspective views of the back clamping part of

[0038] Figure 6 are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0039] Figure 7a Figure 7b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application. Figure 1a Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0040] Figure 8 are exploded perspective views of the finger guard assembly in the structure of Figure 1a

[0041] Figure 9 are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0042] Figure 10a Figure 10b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application. Figure 9

[0043] Figure 11 are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application.

[0044] Figure 12 ​​​​​​​​​​​is to remove Figure 8 A perspective view of the state of the finger guard plate assembly in the structure.

[0045] Figure 13a and Figure 13b Is only decomposition Figure 11 1. An exploded perspective view of the front and rear parts of a front heat dissipation module provided on the front surface of the housing body in a structure composed of a heat dissipation mechanism according to an embodiment of the present invention.

[0046] Figure 14 It is along Figure 2 A sectional stereogram taken along line AA.

[0047] Figure 15 As along Figure 2 The cross-sectional view taken along line AA is a cross-sectional view illustrating heat dissipation mechanisms and heat dissipation modules according to various embodiments.

[0048] Figure 16 It is an exploded perspective view showing the installation state of the front heat dissipation housing, the heat dissipation mechanism, and the front heat dissipation module of the center housing in the structure of FIG. 1 .

[0049] Explanation of symbols 1: Radio unit 10: Finger guard assembly 20: Bracket on the back 20h-1: Screw fastening hole 25: Screw through hole 27: Fixing screw 30: Clamping part 30R: Back clamping part 30S: Side surface clamping portion 31: First fixing plate portion 32: Second fixing plate 33: Clamping rod 34: Stud bolt 35: Bolt guide 40: Finger guard assembly 41: Guide slot 50: Heat exchange area 100: Shell body 110C: Center housing 110F: Front heat dissipation housing 10R: Rear heat dissipation housing 120: RF filter unit 121: Filter body 122: Resonator 123: Filter tuning cover 124: Engraving part 130F: Front panel (PSU board) 130R: Rear panel (PBA) 140A: Front panel installation slot 140B: Rear panel installation slot 200: heat dissipation module 200A: front heat dissipation module 200B: Rear heat dissipation module 205: Refrigerant flow space 210: heat dissipation mechanism 210-1: one-side heat conducting plate 210-2: other-side heat conducting plate 210-F1: first refrigerant flow path 210-F2: second refrigerant flow path 210-F3: inclined guide 210-F4: joint portion 211: heat accommodation portion 212: heat release portion 220: heat trapping portion 221: joint heat conducting body 222: shield cover 222b: welding site portion 223: PA plate 230: welding rod 230a: inner-side welding rod 230b: edge welding rod 230c: fixed slot welding rod DETAILED DESCRIPTION

[0050] Hereinafter, a heat dissipation mechanism, a heat dissipation module, and an antenna device including them according to an embodiment of the present application will be described in detail with reference to the accompanying drawings.

[0051] Note that, when affixing reference numerals to constituent elements of each drawing, the same reference numeral is affixed as much as possible even if it is shown on different drawings for the same constituent element. Further, in explaining the present application, detailed description of a related known structure or function is omitted in a case where it is judged that the detailed description hinders the understanding of the embodiment of the present application.

[0052] In explaining the constituent elements of the embodiment of the present application, the terms of first, second, A, B, (a), (b), and the like can be used. These terms are used only to distinguish one constituent element from other constituent elements, and the nature, order, or sequence of the corresponding constituent element is not limited by these terms. Further, unless otherwise defined, all terms used herein including technical terms or scientific terms have the same meaning as commonly understood by one of ordinary skill in the art to which the present application pertains. The terms defined in commonly used dictionaries should be interpreted as having a meaning that is the same as in the context of the relevant art, and should not be interpreted in an idealized or overly formal sense unless expressly so defined in the present application.

[0053] Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 2 are Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 3 are Figure 1a and Figure 1b are front and rear perspective views showing an example of an antenna device including a heat dissipation mechanism and a heat dissipation module according to an embodiment of the present application, Figure 4a andFigure 4b is a front and rear perspective view showing a state in which the back clamping portion is installed, Figure 5a Figure 5b is an exploded perspective view of the back clamping portion of Figure 4a Figure 4b Figure 6 is a perspective view showing a state in which the side surface clamping portion is installed.

[0054] As shown in FIGS. 1 to Figure 6 A heat dissipation mechanism 210 according to an embodiment of the present application is provided in a radio unit 1 in an example of an electronic device, and by being provided inside the radio unit 1 and being operated, can perform a function of receiving heat from a heat generating body (not shown) that generates system heat and dissipating the heat.

[0055] Among them, if the electronic device has an internal configuration similar to the above-mentioned heat generating body, it is a concept including various devices, but hereinafter, in order to facilitate the explanation, an antenna device (or radio unit 1) as an important product in the business operated by the applicant of the present application will be used as an application example and will be explained.

[0056] Especially, before explaining an embodiment of the present application, a combination of a plurality of heat dissipation devices 210 described later is defined as a "heat dissipation module 200", and thus a product provided with a plurality of heat dissipation devices 210 and a plurality of heat dissipation modules 200 is defined as an "antenna device (or radio unit 1)". However, the antenna device 1 among them can be understood as referring only to a radio unit (Radio Unit) other than an antenna unit that is a collection of antenna radiating elements.

[0057] And, as a kind of heat generating body provided inside the electronic device and electrically driven, a semiconductor (Semiconductor) can be exemplified as representative, but is not limited thereto, and does not exclude each internal driving element of an RF part of an antenna device for communication, a display and an energy storage device (ESS: Energy Storage System), artificial intelligence (AI: Artificial Intelligence), and other electrical and electronic devices.

[0058] An electronic device to which the heat dissipation mechanism 210 according to an embodiment of the present application is applied is adopted as a radio unit 1 as one of an antenna device, and as described later, by adopting a heat generating body as a PA element 223a attached to a PA board 223, it is explained.

[0059] ​​​The radio unit 11 to which the heat dissipation mechanism 210 according to an embodiment of the present application is applied is a configuration that functions as a repeater in a base station antenna device, and can substantially separately provide an antenna unit (Antenna Unit) formed of an antenna radiating element that forms and emits an antenna beam, thereby reducing the weight of a single product and improving the operating environment on site.

[0060] Among them, unlike the antenna unit not shown, the radio unit 1 does not need tilting or steering adjustment for setting the direction of the radiated beam, and only needs to stably fix the structure such as the pillar P described later, and from this point of view, it is provided with the advantage of being able to manufacture the antenna unit that requires installation at a higher place to be lightweight.

[0061] As shown in FIG. 1, Figure 1a to Figure 2 As described above, the radio unit 1 can further include a finger guard plate assembly 10 provided to surround the heat dissipation mechanism 210 according to an embodiment of the present application described later, thereby preventing the operator from being burned or the like. The specific configuration and coupling structure of the finger guard plate assembly 10 will be described in more detail later.

[0062] In addition, as shown in FIG. 1 to Figure 6 The radio unit 1 can include an RF filter part 120, a housing main body 100 that mediates the fixation of the RF filter part 120, and a heat dissipation mechanism 210 according to an embodiment of the present application coupled to the housing main body 100.

[0063] Among them, as shown in FIG. 1, Figure 4a to Figure 5b and Figure 6 The radio unit 1 can be stably installed to the pillar P with the mediation of the clamping part 30.

[0064] As shown in FIG. 1, Figure 4a to Figure 5b The clamping part 30 can include a back clamping part 30R provided to the back surface part of the radio unit 1 and installing the radio unit 1 to the pillar P, and a side surface clamping part 30S provided to the side surface part of the radio unit 1 and installing the radio unit 1 to the pillar P.

[0065] Among them, the back surface part of the housing main body 100 is not exposed to the outside by the finger guard plate assembly 10, so that the back clamping part 30R can be further provided with the back surface setting bracket 20 so that the finger guard plate assembly 10 in the housing main body 100 can also mediate the setting of the left and right side surfaces exposed to the outside.

[0066] For reference, the side surface clamping part 30S can be directly coupled to any one of the left and right side surfaces of the housing main body 100 exposed without being hidden by the finger guard plate assembly 10 without the above mediation structure.

[0067] As shown in Figure 5a the rear surface setting bracket 20 can be fixed to the radio unit 1 by the operation of passing the screw passing holes 25 formed in both end portions through the clamp fixing screws 27 and fastening them to the screw fastening holes 117 formed in the left and right side surfaces of the case main body 100.

[0068] In addition, since the rear surface clamping portion 30R and the side surface clamping portion 30S differ only in whether or not the above-described rear surface setting bracket 20 is interposed, and the rest of the structure is the same, the following will be described in detail with reference to Figure 5a and Figure 5b only the rear surface clamping portion 30R, and the description of the side surface clamping portion 30S is replaced by the structure description of the rear surface clamping portion 30R.

[0069] As shown in Figure 5a and Figure 5b the rear surface clamping portion 30R can include a first fixing plate portion 31 fixed to the rear surface setting bracket 20, a second fixing plate portion 32 closely connected to the rear surface portion of the first fixing plate portion 31, and a clamping rod 33 formed in four boss portions 32a of the four corner portions of the rear surface portion of the second fixing plate portion 32, respectively coupled to the left and right pair of boss portions 32a by a pair of stud bolts 34, and provided to surround the pillar rod P.

[0070] The first fixing plate portion 31 is manufactured in a single specification that can be disposed in the rear surface setting bracket 20 provided in the rear surface portion of the radio unit 1 or the side surface portion of the radio unit 1 (for the side surface clamping portion 30S), regardless of the size (diameter, etc.) of the pillar rod P, and the second fixing plate portion 32 manufactured in a plurality of specifications can be generally fixed to the radio unit 1.

[0071] The second fixing plate portion 32, unlike the first fixing plate portion 31 manufactured in a single specification, can be manufactured in a plurality of specifications according to the size (diameter, etc.) of the pillar rod P as a setting object, as described above, and can be selected and coupled to the first fixing plate portion 31 according to the specification of the pillar rod P.

[0072] Among them, at least one pair of screw passing holes 31h-1 is formed in the upper end portion and the lower end portion of the first fixing plate portion 31, and the first fixing plate portion 31 can be fixed to the rear surface setting bracket 20 by the operation of passing a plurality of assembly screws 37s-1 through the screw passing holes 31h-1 and fastening the screw fastening holes 20h-1 pre-formed in the rear surface setting bracket 20.

[0073] In addition, an engagement groove 31a for engaging the engagement rib 32b protruding forward from the second fixing plate portion 32 is formed at the left and right end portions of the rear surface portion of the first fixing plate portion 31, and the second fixing plate portion 32 is firmly fixed with respect to the first fixing plate portion 31 by the plate assembly screw 37s-2 in a state where the engagement rib 32b is engaged in the engagement groove 31b.

[0074] To this end, in the upper end portion of the first fixing plate portion 31, a screw penetration hole 31h-2 through which the plate assembly screw 37s-2 penetrates is formed in the upper portion of the engagement groove 31a, and a screw fastening hole 32h-2 in which the plate assembly screw 37s-2 is fastened is formed in the upper end portion of the engagement rib 32b of the second fixing plate portion 31.

[0075] In this case, when the second fixing plate portion 32 is manufactured in a plurality of specifications according to the size of the pillar rod P, the engagement rib 32b and the engagement groove 31a are also formed in the same specifications, and the first fixing plate portion 31 can be commonly combined with respect to the plurality of specifications of the second fixing plate portion 32.

[0076] In addition, the clamping rod 33 can include an upper clamping rod 30U located on the upper side and a lower clamping rod 30D located on the lower side.

[0077] In this case, the upper clamping rod 30U and the lower clamping rod 30D are formed in a substantially " " shape with one side open, and surround one side of the outer circumferential surface of the pillar rod P, and a stud bolt 34 penetrating both end portions in the front and rear directions can be bolted to a bolt fastening boss 32a formed at each corner end portion of the rear surface portion side of the second fixing plate portion 32 with a bolt guide rod 35 as an intermediary, and the bolt guide rod 35 can be inserted into a connection boss 33a provided at both end portions of the clamping rod 33.

[0078] A clamping gear 36 for clamping the outer surface of the pillar rod P is provided at the upper end portion and the lower end portion of the rear surface portion of the second fixing plate portion 32 and the upper clamping rod 30U and the lower clamping rod 30D, respectively, to adjust the amount of protrusion to the outside.

[0079] The clamping gears 36 are provided in pairs in a manner spaced apart upward and downward, respectively, so that clamping can be performed at four portions of the outer circumferential surface of at least one pillar rod P.

[0080] In addition, as shown in FIG. 6, the side surface clamping portion 30S is fastened to the screw fastening holes 117 formed in the left and right side surfaces of the housing main body 100 by the assembly screws 27 without a direct mediation structure such as the rear surface bracket 20, as described above, and from this point of view, it has been described that the side surface clamping portion 30S is different from the rear surface clamping portion 30R. Figure 6 ​

[0081] Figure 7a and Figure 7b yes Figure 1a and Figure 1b The overall exploded perspective diagram, Figure 8 It is decomposition Figure 1a An exploded perspective view of the finger guard assembly in the structure.

[0082] like Figure 7a and Figure 7b As shown, the shell body 100 may include: a central shell 110C, equipped with a setting space for setting the RF filter unit 120 described later; a front heat dissipation shell 110F, equipped on the front surface of the central shell 110C, and mediating the setting of a front heat dissipation module 200A equipped with a plurality of heat dissipation mechanisms 210 according to an embodiment of the present invention, which is a combination of a plurality of module forms; and a rear heat dissipation shell 110R, equipped on the back of the central shell 110C, and mediating the setting of a rear heat dissipation module 200B equipped with a plurality of heat dissipation mechanisms 210 according to an embodiment of the present invention, which is a combination of a plurality of module forms.

[0083] That is, Figure 7a and Figure 7b As shown, the radio unit 1 includes: a shell body 100; a front heat dissipation module 200A, arranged at the front part of the shell body 100; and a rear heat dissipation module 200B, arranged at the back part of the shell body 100. It can be seen that the front heat dissipation module 200A and the rear heat dissipation module 200B are composed of a plurality of heat dissipation mechanisms 210 according to an embodiment of the present invention combined in a modular form.

[0084] And, as Figure 7a and Figure 7b As shown, the radio unit 1 may further include an RF filter section 120 .

[0085] The RF filter unit 120 may include a plurality of resonators (see Figure 16 122 ) of a cavity filter type filter body (refer to Figure 16 However, the RF filter unit 120 is not necessarily limited to a cavity filter type, and may be a waveguide filter type.

[0086] For reference, as described later Figure 16 As shown, an opening is formed on one side of the filter body 121 where the cavity is formed, and the opening can be shielded by a filter tuning cover 123 , wherein the filter tuning cover 123 is provided with a plurality of engraved portions 124 for micro-frequency tuning.

[0087] The housing main body 100 is formed in a quadrangular frame shape, and can include a center housing 110C formed to be penetrated in the front-rear direction to provide the RF filter section 120, a front heat dissipation housing 110F and a rear heat dissipation housing 110R coupled to the front surface portion and the back surface portion of the center housing 110C, respectively.

[0088] The front heat dissipation housing 110F and the rear heat dissipation housing 110R are coupled to the front surface portion and the back surface portion of the center housing 110C in which the RF filter section 120 is provided, respectively, and a plurality of heat sink fins 115F, 115R for performing external heat dissipation by heat exchange with external air can be integrally formed in the front surface portion of the front heat dissipation housing 110F and the back surface portion of the rear heat dissipation housing 110R, respectively.

[0089] The front heat dissipation housing 110F and the rear heat dissipation housing 110R can be provided in a plate form having substantially the same size as that of the center housing 110C, and can be formed to have a size capable of completely covering the front surface and the back surface of the center housing 110C penetrated in the front-rear direction.

[0090] The plurality of heat sink fins 115F, 115R can be integrally formed in each of the lower end portions of the front surface of the front heat dissipation housing 110F and the back surface of the rear heat dissipation housing 110R.

[0091] The plurality of heat sink fins 115F, 115R formed in the front surface of the front heat dissipation housing 110F and the back surface of the rear heat dissipation housing 110R can be formed to be long in the up-down direction, and can be formed so as not to be interfered with adjacent heat sink fins 115F, 115R to generate flow resistance when an upward airflow is generated by released heat.

[0092] In addition, the plurality of heat sink fins 115F, 115R can include front heat sink fins 115F protruding forward from the front surface of the front heat dissipation housing 110F in the plate form and rear heat sink fins 115F protruding rearward from the back surface of the rear heat dissipation housing 110R in the plate form.

[0093] The front heat dissipation housing 110F and the rear heat dissipation housing 110R are formed of a heat conductive material (metal material) capable of transferring predetermined heat, and the front heat sink fins 115F and the rear heat sink fins 115R are also formed integrally, and thus, it can be seen that they are of a heat conductive material. However, even in the case where the front heat sink fins 115F and the rear heat sink fins 115R are formed of a metal material having good heat conductivity, it is not reasonable to extend infinitely far from a point where a heat generating body is provided in order to increase a surface area for heat dissipation due to the limitation of heat conductivity of the material itself, and thus, the front end position or the rear end position of the front heat dissipation housing 110F and the rear heat dissipation housing 110R and the lower end position should be optimally designed according to the surrounding environment.

[0094] A plurality of module coupling grooves 113A and 113B may be formed in the front heat dissipation housing 110F and the rear heat dissipation housing 110R, which are configured to mediate the coupling of the front heat dissipation module 200A and the rear heat dissipation module 200B in a modular form composed of a plurality of heat dissipation mechanisms 210 according to an embodiment of the present invention.

[0095] like Figure 7a and Figure 7b As shown, the plurality of module coupling grooves 113A, 113B are provided in the upper end portion of the front heat dissipation housing 110F and the rear heat dissipation housing 110R as square through-holes, and the plurality of module coupling grooves 113A, 113B can be formed to be spaced apart in the left-right direction.

[0096] Among them, multiple module coupling grooves 113A and 113B are formed to pass through the front and rear directions of the front heat dissipation shell 110F and the rear heat dissipation shell 110R, but the flip-type cover 114 described later is coupled and shielded along the front and rear directions, so it is given the structural name of "coupling groove" instead of "coupling hole".

[0097] As an example, in the front heat dissipation housing 110F and the rear heat dissipation housing 110R, four front heat dissipation modules 200A and four rear heat dissipation modules 200B are arranged in the form of a combination of multiple heat dissipation mechanisms 210 according to an embodiment of the present invention described later, and are respectively arranged in the front and rear forms to be equipped with multiple module coupling grooves 113A and 113B.

[0098] Furthermore, if the front heat dissipation module 200A and the rear heat dissipation module 200B are completed with the arrangement of the front heat dissipation module 200A and the rear heat dissipation module 200B consisting of a combination of the heat dissipation mechanism 210 according to an embodiment of the present invention, the finger protection plate assembly 10 for preventing the operator or an outsider from being scalded by the high temperature released from the heat dissipation mechanism 210 can be arranged to cover the entire heat dissipation mechanism 210 and the heat dissipation modules 200A, 200B.

[0099] In the finger guard assembly 10 , the plurality of air flow holes 15 may be formed in a grille shape so that air can smoothly flow into or out of the heat exchange region 50 described later.

[0100] like Figure 7a to Figure 8 As shown, the finger guard assembly 10 can be arranged to cover the central shell 110C described later in the structure of the radio unit 1, the heat dissipation mechanism 210 described later according to an embodiment of the present invention provided in each of the front heat dissipation shell 110F and the rear heat dissipation shell 110R, and the entire or upper end portion of the heat dissipation module 200.

[0101] In more detail, the finger guard assembly 10 can include a front finger guard 10A coupled to a front portion of the front heat dissipation case 110F and a rear finger guard 10B coupled to a rear portion of the rear heat dissipation case 110R.

[0102] The front finger guard 10A has a rectangular parallelepiped shape with the back portion and the lower surface portion opened, and the rear finger guard 10B has a rectangular parallelepiped shape with the front surface portion and the lower surface portion opened, and a plurality of air flow holes 15 can be formed in the front finger guard 10A and the rear finger guard 10B to allow external air to exchange heat with the heat dissipation mechanism 210 according to an embodiment of the present application.

[0103] The front finger guard 10A has a rectangular parallelepiped shape with the back portion and the lower surface portion opened, and the rear finger guard 10B has a rectangular parallelepiped shape with the front surface portion and the lower surface portion opened, and a plurality of air flow holes 15 can be formed in the front finger guard 10A and the rear finger guard 10B to allow external air to exchange heat with the heat dissipation mechanism 210 according to an embodiment of the present application.

[0104] To this end, a screw fastening hole 115h for fastening the lower fixing screw 11s-1 can be integrally formed at the upper end portion of at least any one of the plurality of heat sink fins 115F, and a lower screw through hole 11h-1 for passing the lower fixing screw 11s-1 can be formed at a plurality of positions at the lower end portion of the front finger guard 10A.

[0105] Also, a plurality of screw through holes 11h-4 are formed at the upper rear end portion of the front finger guard 10A in a manner of passing through in the up-and-down direction, and a screw fastening hole 40h-4 for fastening the upper fixing screw 11s-4 after passing through the plurality of screw through holes 11h-4 is formed at the upper end portion of the guide plate 40 to be described later, and can be screw-fixed by the plurality of upper fixing screws 11s-4.

[0106] The rear heat dissipation case 110R of the rear finger guard 10B not described and the coupling structure for the guide plate 40 are exactly the same as the above-described front finger guard 10A, and thus the description thereof is replaced.

[0107] In addition, as Figure 7a and Figure 7bAs shown, a front plate 130F (for example, a power supply unit (PSU) board or the like) on which a heat generating body (heat generating element) that generates predetermined drive heat is mounted can be arranged between the front surface portion of the RF filter portion 120 and the front heat sink housing 110F. Heat generated by the heat generating body (for example, a PSU element or the like) mounted on the front plate 130F can be dissipated by the front heat sink fins 115F.

[0108] Further, as shown in Figure 7a and Figure 7b , a rear plate 130R (for example, a printed board assembly (PBA) or the like) on which a heat generating body (for example, an FPGA element or the like) is mounted can be arranged between the back surface portion of the RF filter portion 120 and the rear heat sink housing 110R. Heat generated by the heat generating body mounted on the rear plate 130R can be dissipated by the rear heat sink fins 115R.

[0109] Further, as shown in Figure 7b , a front plate setting groove 140A for stacking the front plate 130F (PSU board) can be formed in the back surface portion of the front heat sink housing 110F. A plurality of PSU elements can be mounted on the front surface portion of the PSU board as the front plate 130F. The heat generating surfaces of the PSU elements are arranged in close contact with the inner surface (front surface) of the front plate setting groove 140A, and heat exchange with the outside air using the front heat sink fins 115F is achieved by thermal contact with the surface of the front heat sink housing 110F, thereby enabling front heat dissipation.

[0110] Further, as shown in Figure 7a , a rear plate setting groove 140B for stacking the rear plate 130R (or PBA) can be formed in the front surface portion of the rear heat sink housing 110R. A plurality of FPGA elements can be mounted on the front surface portion of the PBA as the rear plate 130R. The heat generating surfaces of the FPGA elements are arranged in close contact with the inner surface (back surface) of the rear plate setting groove 140B, and heat exchange with the outside air using the rear heat sink fins 115R is achieved by thermal contact with the surface of the rear heat sink housing 110R, thereby enabling rear heat dissipation.

[0111] Figure 9 are front and rear perspective views showing the arrangement state of the heat dissipation mechanism according to an embodiment of the present application, Figure 10a and Figure 10b are front and rear exploded perspective views of Figure 9 , Figure 11 is a perspective view showing the heat dissipation mechanism according to an embodiment of the present application, Figure 12 is a perspective view of Figure 8a perspective view of a state of a finger guard assembly in a structure, Figure 13a and Figure 13b is only decomposed Figure 11 a front part and a rear part of a front heat dissipation module combined with the heat dissipation mechanism according to an embodiment of the present application provided on the front surface part of the case main body in a structure are disassembled perspective views.

[0112] As shown in Figure 7a and Figure 7b , the heat dissipation mechanism 210 according to an embodiment of the present application can form a plurality of front heat dissipation modules 200A provided on the front surface of the front heat dissipation case 110F and a plurality of rear heat dissipation modules 200B provided on the front surface of the rear heat dissipation case 110R by combining at least two or more.

[0113] Among them, the front heat dissipation module 200A and the rear heat dissipation module 200B only differ in whether the front heat dissipation case 110F or the rear heat dissipation case 110R is provided at the position, and the detailed structure and the combination relationship are the same, so the following will be described mainly with the front heat dissipation module 200A, and the description of the front heat dissipation case 200A will replace the description of the rear heat dissipation case 110R.

[0114] In addition, as shown in Figure 7a and Figure 7b , the antenna device (radio unit) 1 according to an embodiment of the present application can further include a guide plate 40 supporting the upper end part of each heat dissipation mechanism 210 of the front heat dissipation module 200A and the rear heat dissipation module 200B.

[0115] The guide plate 40 is equipped in a substantially rectangular frame shape and is formed in a manner of penetrating in the front-rear direction, thereby forming a heat exchange area 50 described later, and can be screw-assembled at the upper end of the center case 110C using a plurality of plate assembly screws 43.

[0116] Further, screw fastening holes 40h-3 can be formed on the left and right side surface parts of the guide plate 40, which provide fastening positions of the second side part fixing screws 11s-3 screw-assembled through the side surface parts of the front finger guard plate 10A and the rear finger guard plate 10B.

[0117] In addition, the upper end part of the guide plate 40 can be equipped in a lattice form to enable the external air to smoothly ventilate to the heat exchange area 50, and at the front end part and the rear end part of the upper end part, guide slots 41 for inserting the upper end part of each heat dissipation mechanism 210 can be formed when the front heat dissipation module 200A and the rear heat dissipation module 200B are combined to the case main body 100.

[0118] The guide slot 41 of the guide plate 40 at least functions to prevent the upper end portions of the plurality of heat dissipation mechanisms 210, which extend further than the upper end of the center case 110C in the housing main body 100, from shaking (clearance distance) with respect to the left-right direction, thereby functioning to prevent the heat dissipation mechanisms 210 from being damaged.

[0119] In addition, the guide plate 40 can provide a screw assembly site for stably combining the finger guard plate assembly 10.

[0120] As Figure 9 illustrated, the front heat dissipation module 200A can include a bonding heat transfer body 221 and at least two or more heat dissipation mechanisms 210 bonded to the bonding heat transfer body 221.

[0121] The front heat dissipation module 200A configured as described above is combined to the front heat dissipation case 110F with the bonding heat transfer body 221 as a medium by inserting the bonding heat transfer body 221 into the plurality of module combination grooves 113A and 113B formed in the front heat dissipation case 110F (or the rear heat dissipation case 110R), respectively.

[0122] At this time, in the bonding heat transfer body 221, a heat generating body attached to the front plate 130F and a heat generating body (for example, a PA element 223a or the like having a large amount of heat generation among RF components) having a different property from the heat generating body attached to the rear plate 130R can be separated from the front plate 130F and the rear plate 130R, and a substrate housing portion 222h in which a PA board is attached can be formed in a groove shape.

[0123] In particular, the bonding heat transfer body 221 can be internally filled with a refrigerant and can be provided in a vapor chamber shape that transfers heat while phase changing and flowing by heat transferred from a heat generating body.

[0124] In general, the vapor chamber is in a state of being internally filled with a liquid refrigerant, and if heat is transferred from the outside, the refrigerant is evaporated from the liquid refrigerant to a gaseous refrigerant and flows by a wick structure formed in a manner of internally including a plurality of pores, and then is condensed in a region having a low temperature and is phase changed to a liquid refrigerant again, and the above process is repeatedly performed, and accordingly, the vapor chamber is configured as a heat transfer device that functions to mediate heat transfer from one side to the other side.

[0125] However, the bonding heat transfer body 221 does not necessarily have to be provided in a vapor chamber shape. That is, the bonding heat transfer body 221 can also be provided in a plate shape of a simple metal material (heat conductive material) within a limit of being able to transfer heat generated from a heat generating body to the heat dissipation mechanism 210 according to an embodiment of the present application.

[0126] In the left side end portion and the right side end portion of each of the edge end portions of the coupling heat transfer body 221 and the shield cover 222 to be described later, a plurality of screw fastening grooves 225h-1, 225h-2 are provided in a semicircular cut shape. In a state in which a plurality of module assembly screws 225s having a flat head shape are engaged in the plurality of screw fastening grooves 225h-1, 225h-2, the front heat dissipation housing 110F and screw fastening holes (not shown) formed in the edge end portions of the module coupling grooves 113A, 113B corresponding to the rear heat dissipation housing 110R are coupled in a screw-coupled manner, so that the front heat dissipation module 200A and the rear heat dissipation module 200B can be stably fixed to the front heat dissipation housing 110F and the rear heat dissipation housing 110R, respectively.

[0127] In addition, one surface of the coupling heat transfer body 221 is formed to face the heat generating body (i.e., the PA element 223a) of the PA board 223, and a plurality of fixing slots 221a can be formed on the other surface of the coupling heat transfer body 221 to provide the heat dissipation mechanism 210 according to an embodiment of the present application. That is, the heat dissipation mechanism 210 according to an embodiment of the present application can receive heat from the heat generating body via the coupling heat transfer body 221.

[0128] On the other surface of the coupling heat transfer body 221, the heat dissipation mechanism 210 according to an embodiment of the present application can be orthogonally coupled to the other surface of the coupling heat transfer body 221 by at least two or more (six in this embodiment).

[0129] In this case, one surface of the coupling heat transfer body 221 is the front surface portion or the rear surface portion of the RF filter portion 120, and can be arranged to be in surface thermal contact with the heat generating body (PA element 223a) of the PA board 223 arranged to be independently separated from the front board 130F and the rear board 130R, and preferably, as shown in FIGS. 1 and 2, can be in surface thermal contact with the heat generating body (PA element 223a) of the PA board housed in the substrate housing portion 222h. Figure 9 and Figure 10a

[0130] In more detail, a plurality of heat generating bodies can be attached to the front surface of the front board 130F and the rear surface of the rear board 130R, and for the radio unit 1, the front board 130F can be a PSU board, and the rear board 130R can be a PBA type main board, and various heat generating bodies such as digital driving elements such as FPGA elements and analog driving elements such as PA elements 223a can be generally attached to the main board.

[0131] ​In the heat generating body as described above, the PA element 223a operates while consuming a relatively large amount of power, and thus belongs to a heat generating body having a relatively large amount of heat generation. In order to mount only the PA element 223a, each PA plate can be separated from the main plate serving as the rear plate 130R, and thus can be separately manufactured in a manner of being inserted and disposed in the substrate accommodation portion 222h of the base plate of the combined heat transfer body 221 provided in the plurality of front heat dissipation modules 200A and the rear heat dissipation module 200B, and the PA plate 223 can be accommodated and disposed in the substrate accommodation portion 222h of one surface of the combined heat transfer body 221, so that heat generated from the PA element 223a can be directly transferred to the heat dissipation mechanism 210 according to an embodiment of the present application through the combined heat transfer body 221 and dissipated.

[0132] The combined heat transfer body 221 and the substrate accommodation portion 222h can be distinguished by the shield cover 222, and the shield cover 222 can perform the function of transferring heat generated from the heat generating body to the combined heat transfer body 221.

[0133] In addition, on the other surface of the combined heat transfer body 221, a plurality of fixing slots 221a are cut in a left and right spaced apart manner, so that the plurality of heat dissipation mechanisms 210 according to an embodiment of the present application are combined, and thus the rigidity of the other surface of the combined heat transfer body 221 can be reduced.

[0134] In order to prevent the rigidity of the combined heat transfer body 221 as described above from being reduced, a plurality of support pins 226 can be further provided, one end of which is supported on the shield cover 222 and the other end of which is supported between adjacent fixing slots 221a.

[0135] The plurality of support pins 226 function to be pressed by external force transferred from one surface and the other surface side of the combined heat transfer body 221, and can enhance the rigidity thereof, and at the same time, can prevent leakage of the refrigerant filled therein.

[0136] The refrigerant flow space 205 formed in the plurality of heat dissipation mechanisms 210 can be formed to be in communication with each other through the plurality of fixing slots 221a, so that the combined heat transfer body 221 as described above shares the refrigerant in the inside thereof.

[0137] In addition, the PA plate 223 can be shielded by the flip cover 114 covering the substrate accommodation portion 222h of the combined heat transfer body 221, and can block the intrusion and interference of external radio waves.

[0138] In this case, although not shown in the drawings, the flip cover 114 can be combined to the combined heat transfer body 221 to cover the entire PA plate accommodated in the substrate accommodation portion 222h of the combined heat transfer body 221, and thus can block the intrusion and interference of external radio waves. Figure 7a and Figure 7bAs shown, the module may be provided in a state of being coupled to the module coupling grooves 113A and 113B of the front heat dissipation housing 110F and the rear heat dissipation housing 110R.

[0139] As described above, the heat dissipation mechanism 210 according to one embodiment of the present invention is combined with a plurality of PA plates 223 combined with one surface of the combined heat transfer body 221 to manufacture a modular front heat dissipation module 200A or a rear heat dissipation module 200B. According to the variable design environment such as the heat generation of the heating element, after actively changing the design, it has the advantage of being able to easily set up and apply the product.

[0140] Among them, the combined heat transfer body 221, the PA board 223 and the flip-type cover 114 (limited to the case where the flip-type cover 114 is not equipped in a state of being combined with the module combining grooves 113A and 113B of the front heat dissipation shell 110F and the rear heat dissipation shell 110R) can be manufactured in a modular manner and can be defined as a heat collection part 220 corresponding to the heat dissipation mechanism 210 according to an embodiment of the present invention.

[0141] like Figure 9 to Figure 13b As shown, the heat dissipation mechanism 210 according to one embodiment of the present invention may include: a heat receiving portion 211 for collecting heat generated from the heating element (especially the PA element 223a); and a heat releasing portion 212 for diffusing the heat collected in the heat receiving portion 211 and exchanging heat with the outside air, and at least extending the front end to the heat exchange area outside the upper end of the housing body 100 equipped with the heating element (see the heat release portion 212 described later). Figure 15 50 ) to occupy at least a portion of the heat exchange area 50 directly above the shell body 100.

[0142] That is, even in a case where the heat containing portion 211 is arranged to overlap in the front-to-back direction relative to the front surface portion of the front heat dissipation shell 110F or the rear surface portion (back portion) of the rear heat dissipation shell 110R in the shell body 100, the heat dissipation mechanism 210 according to one embodiment of the present invention can also be formed so that the heat release portion 212 extends further upward than the upper end of the shell body 100. At this time, the heat release portion 212 can be arranged so that at least a portion occupies at least a portion of the heat exchange area 50 directly above the front-to-back thickness direction of the shell body 100.

[0143] According to the heat dissipation mechanism 210 of one embodiment of the present invention as described above, even when the heat dissipation area of ​​the heat release portion 212 that performs a substantial heat dissipation function is increased, the heat dissipation area can be increased through the heat exchange area 50 directly above the front-to-back thickness direction of the shell body 100 without extending in the front-to-back thickness direction of the shell body 100, thereby providing an advantage of avoiding the size enlargement design of the product.

[0144] Here, the heat accommodation portion 211 and the heat release portion 212 are distinguished in terms of their functions, but cannot be interpreted as having a physically complete dividing line (point) in a limited manner.

[0145] For example, the heat accommodation portion 211 and the heat release portion 212 can be integrally formed. In this case, the boundary of the heat accommodation portion 211 and the heat release portion 212 is not physically distinguished, but as described above, it is preferable that the heat release portion 212 be interpreted as a portion protruding and extending toward the heat exchange region 50 corresponding to the upper end portion of the case main body 100.

[0146] Here, it is preferable that the heat accommodation portion 211 be formed to have a thickness and a length to be inserted into the fixing slot 221a formed in the other surface of the coupling heat transfer body 221. That is, the thickness and the length of the heat accommodation portion 211 can be understood as being able to be simply fixed to the fixing slot 221a by an interference insertion or a press-in insertion method without going through a separate welding process. However, it should be noted that the coupling means by a welding process is not excluded in the coupling method of the heat accommodation portion 211 with respect to the fixing slot 221a.

[0147] Especially, as shown in FIG. 2, the heat accommodation portion 211 is a lower portion of a virtual boundary point T corresponding to a starting point of the heat release portion 212, and can be inserted into the fixing slot 221a in a manner of inserting a portion thereof, and in the heat accommodation portion 211, an insertion end 211a protruding toward the fixing slot 221a can be formed to have a predetermined length based on a virtual straight line B identical to the end portion of the neck portion 211b. Figure 11

[0148] Here, as shown in FIG. 2, the heat dissipation mechanism 210 according to an embodiment of the present application is equipped to form a refrigerant flow space 205 filled with a refrigerant inside. Figure 11

[0149] In this case, the heat dissipation mechanism 210 can be manufactured by previously preparing a single metal plate member having a predetermined thermal conductivity using a die by a press process, and then forming a sealed refrigerant flow space 205 by bending at least one side and joining the edge end portions, and separately manufacturing two metal plate members having a predetermined thermal conductivity using a press process, and then joining along the edge end portions so that the refrigerant flow space 205 is formed inside in a sealed manner.

[0150] At this time, a portion forming one side surface of the refrigerant flow space 205 is referred to as one side heat conducting plate 210-1, and a portion forming the other side surface of the refrigerant flow space 205 is referred to as the other side heat conducting plate 210-2.

[0151] ​​In a case where the heat dissipation mechanism 210 according to an embodiment of the present invention is arranged vertically in the up and down directions based on the direction of gravity, liquid refrigerant is stored on the side of the heat receiving portion 211 formed by the insertion end 211a inserted and fixed to the fixed slot 221a equivalent to the heat capture portion 220, and the evaporated gaseous refrigerant is diffused at the heat release portion 212 equivalent to the upper portion based on the remaining upper boundary point T, thereby realizing condensation into liquid refrigerant through heat exchange between the heat exchange area 50 and the external air.

[0152] like Figure 11 As shown, although the refrigerant flow space 205 cannot be completely distinguished physically, as a functional classification based on the phase change of the refrigerant, the portion formed by the insertion end 211a of the heat receiving portion 211 close to the heating element is defined as the first refrigerant flow path 210-F1, and the portion that is divided by the inclined guide 210-F3 described later and induces the inclined flow of the liquid refrigerant is defined as the second refrigerant flow path 210-F2.

[0153] If the gaseous refrigerant diffused through the heat containing portion 211 and the heat releasing portion 212 is condensed and changes phase into liquid refrigerant by heat exchange with the external air in the heat exchange area 50, it is distributed in a uniform amount through the second refrigerant flow path 210-F2, which is formed by a plurality of inclined guide members 210-F3 formed downwardly inclined toward the side of the first refrigerant flow path 210-F1. Accordingly, it can be induced to flow toward the side of the first refrigerant flow path 210-F1 to achieve smoother gas-liquid circulation.

[0154] In addition, for the heat dissipation mechanism 210 according to an embodiment of the present invention, a metal plate component made of SUS material with a very thin thickness is manufactured through the above-mentioned stamping process. At this time, the internal pressure change caused by the phase change in the refrigerant flow space 205 may induce shaking (flow), so multiple joints 210-F4 can be simultaneously processed and formed during the stamping process to prevent this phenomenon.

[0155] Multiple joints 210-F4 are formed to protrude a predetermined depth from one side heat conduction plate 210-1 and the other side heat conduction plate 210-2 toward the refrigerant flow space 205 side. When performing a joining process for sealing the refrigerant flow space 205, they are joined to each other by utilizing a joining method including a welding joining method, thereby strengthening the rigidity of one side heat conduction plate 210-1 and the other side heat conduction plate 210-2 themselves.

[0156] As described above, the heat dissipating mechanism 210 according to an embodiment of the present application provides an advantage that can be designed in such a manner that heat exchange in the heat exchange region 50 is also effectively achieved by the heat release portion 212 extending above the upper end of the center case 110C in the case body 100 by the refrigerant capable of being actively phase changed by the heat transferred from the heat generating body, rather than relying on the heat conductivity of the metal material itself for heat exchange.

[0157] In addition, the heat accommodating portion 211 and the heat release portion 212 do not necessarily have to be integrally formed as described above, although not shown, the heat accommodating portion 211 is a heat pipe in which the refrigerant flowing while being phase changed in the inside is filled, and the heat release portion 212 can be a heat sink fin combined in thermal contact with the front end of the heat pipe.

[0158] Here, the heat pipe is provided with a wick structure in the inside as in the above-described vapor chamber, but is provided with a pipe shape in appearance, thereby being able to perform a structure of a heat transfer medium that remotely transfers heat supplied to one end to the other end.

[0159] Further, preferably, a structure that transfers heat using the heat conductivity of the material itself without the aid of a phase change material such as a refrigerant is integrally explained as the above-described heat sink fin.

[0160] Also, in the heat dissipating mechanism 210 according to an embodiment of the present application, the heat accommodating portion 211 can be adopted as a heat pipe in which the refrigerant flowing while being phase changed in the inside is filled, and the heat release portion 212 can also be adopted as a vapor chamber in which the refrigerant flowing while being phase changed in the inside is filled.

[0161] However, the heat dissipating mechanism 210 according to an embodiment of the present application is not necessarily limited to being adopted as a structure that increases the heat transfer rate by the phase change of the refrigerant, and the heat accommodating portion 211 and the heat release portion 212 can be adopted as a general heat sink fin integrally formed of a predetermined metal material.

[0162] Here, in the case where the heat dissipating mechanism 210 according to an embodiment of the present application uses a refrigerant as a heat transfer and heat exchange medium thereof, the heat accommodating portion 211 can include an evaporation region that phase changes the refrigerant into a gaseous refrigerant, and the heat release portion 212 can include a condensation region that phase changes the refrigerant into a liquid refrigerant by heat exchange with the outside air of the heat exchange region 50.

[0163] Figure 14 is a sectional perspective view taken along the line A-A of Figure 2 is a sectional view taken along the line A-A of Figure 15 is a sectional view taken along the line A-A of Figure 2 is a sectional view taken along the line A-A ofFigure 16 is an exploded perspective view showing a setting state of the front heat radiating case, the heat radiating mechanism, and the front heat radiating module for the center case in the structure of FIG. 1.

[0164] Referring to Figure 14 to Figure 16 , the heat releasing portion 212 in the structure of the heat radiating mechanism 210 extends more upward than the upper end 110C-U of the center case 110C in the structure of the case main body 100, at least extending to occupy the heat exchange region 50 corresponding to the upper portion in the front-rear thickness direction of the case main body 100.

[0165] At this time, the outer side end of the heat releasing portion 212 is equipped with a protruding amount matching the outer side end of the plurality of heat sink fins 115F, 115R formed in each of the front heat radiating case 110F and the rear heat radiating case 110R, and the inner side end of the heat releasing portion 212 is extended to increase its area so as to occupy the heat exchange region 50 corresponding to the front-rear thickness direction of the case main body 100 from a portion where the edge end portion 212a described later is formed.

[0166] In addition, the heat exchange region 50 is a region protected from the outside by the finger guard plate assembly 10, and since the flow of external air can be restricted, an external air flow fan (not shown) can be equipped inside the heat exchange region 50. Although not shown, it is preferable that the external air flow fan be provided in the heat exchange region 50 corresponding to the heat releasing portion 212 of the heat radiating mechanism 210 provided between the front heat radiating case 110F and the rear heat radiating case 110R, respectively.

[0167] As described above, when the plurality of heat radiating mechanisms 210 according to an embodiment of the present application are combined as the front heat radiating module 200A and the rear heat radiating module 200B at the front surface portion and the back surface portion of the case main body 100 and combined with a plurality of heat radiating mechanisms 210, the rear end of the heat releasing portion 212 of the heat radiating mechanism 210 provided at the front surface portion of the front heat radiating case 110F and the front end of the heat releasing portion 212 of the heat radiating mechanism 210 provided at the back surface portion of the rear heat radiating case 110R can be arranged to have a predetermined interval distance in the front-rear direction across the heat exchange region 50 (refer to Figure 15 of the reference numerals D1, D2).

[0168] In this case, as Figure 15As shown in (a) and (b), in the housing main body 100 of the heat releasing portion 212, the length of the upward extension from the upper end 110C-U of the central housing 110C is designed differently according to the heat generation amount of the heat generating body, but for example, in the case where the heat generation amount of the heat generating body is relatively small, the extension length can be designed to be reduced by a length corresponding to "L1". That is, the interval distance between the extended front end of the heat releasing portion 212 and the edge end portion of the housing main body 100 can be designed differently according to the amount of heat generated from the heat generating body.

[0169] In addition, as shown in Figure 15 As shown in (c), the inner side ends of the heat releasing portions 212 of the heat dissipation mechanisms 210 respectively provided in the front heat dissipation housing 110F and the rear heat dissipation housing 110R can be designed to further extend from each other by an interval distance from "D1" to "D2".

[0170] To this end, the heat releasing portion 212 can have an edge end portion 212a bent at a predetermined angle from the heat containing portion 211 to occupy the heat exchange region 50.

[0171] As described above, the heat dissipation mechanism 210 according to an embodiment of the present application has the advantage of improving the overall heat dissipation performance by being provided with the heat releasing portion 212 extending to the heat exchange region 50 outside the edge end portion of the housing main body 100 or the combined heat transfer body 221 having the heat generating body as a heat dissipation object, thereby reducing the interference of the upward airflow during heat dissipation and enabling more sufficient heat exchange with the external air in the heat exchange region 50 at the extended portion.

[0172] The advantage provided thereby is that even without changing the radio unit 1 manufactured according to the predetermined size, the size and shape of the heat releasing portion 212 can be changed according to the heat generation amount of the heat generating body or the like, and the corresponding design can be made.

[0173] In addition, the heat releasing portion 212 can be designed and manufactured differently in terms of the outer shape and the extension length according to the heat generation amount of the heat generating body, and the product can be easily applied according to the specifications of the heat generating body by modular manufacturing, so that the design diversity can be improved.

[0174] The heat dissipation mechanism according to an embodiment of the present application has been described in detail above with reference to the accompanying drawings. However, the embodiment of the present application is not limited to the above-described embodiment, and it is obvious to those skilled in the art to which the present application pertains that various modifications can be made and implemented within the equivalent scope. Therefore, the true scope of the present application should be determined by the following claims. Industrial applicability

[0175] The present application provides a heat releasing mechanism, a heat releasing module and an antenna device including them, which effectively release heat generated from electronic devices such as antenna devices, while preventing the weight of antenna units requiring directional adjustment from being increased, thereby improving the field operability, and which can overcome the limitation of the increase of the heat releasing surface area due to the heat conductivity of the material itself and can perform the design of heat releasing structures of various shapes.

Claims

1. A heat dissipation mechanism, comprising: a heat receiving portion for collecting heat generated from the heating element; as well as The heat release portion is formed to diffuse the heat trapped in the heat receiving portion and perform heat exchange, and at least the front end extends to the heat exchange area outside the shell body equipped with the heating element to occupy a part of the heat exchange area.

2. The heat dissipation mechanism according to claim 1, wherein: The heat exchange region occupied by the heat release portion corresponds to a region directly above the housing body.

3. The heat dissipation mechanism according to claim 1, wherein: The heat receiving portion and the heat releasing portion are integrally formed.

4. The heat dissipation mechanism according to claim 1, wherein: The heat receiving portion is a heat pipe filled with a refrigerant that flows while undergoing phase change inside. The heat release portion is a radiator fin that is thermally contacted with the front end of the heat pipe.

5. The heat dissipation mechanism according to claim 1, wherein: The heat receiving portion is a heat pipe filled with a refrigerant that flows while undergoing phase change inside. The heat release portion is a radiator fin filled with refrigerant flowing while undergoing phase change inside.

6. The heat dissipation mechanism according to claim 1, wherein: The heat receiving portion and the heat releasing portion form a refrigerant flow space to be filled with refrigerant that flows while undergoing phase change inside.

7. The heat dissipation mechanism according to claim 6, wherein: The heat receiving portion includes an evaporation region for changing the refrigerant into a gaseous refrigerant. The heat release portion includes a condensation region configured to change the refrigerant into a liquid refrigerant by exchanging heat with the external air of the heat exchange region.

8. The heat dissipation mechanism according to claim 1, wherein: The heat receiving portion and the heat releasing portion are integrally formed from a predetermined metal material.

9. The heat dissipation mechanism according to claim 1, wherein: When the heat receiving portion is arranged to overlap in the front-to-back direction relative to the front surface portion or the rear surface portion of the shell body, the heat release portion extends further upward than the upper end of the shell body, and extends to occupy at least a portion of the heat exchange area directly above the front-to-back thickness direction of the shell body.

10. The heat dissipation mechanism according to claim 9, wherein: When the heat dissipation mechanism is combined with a plurality of heat dissipation mechanisms on the front and back surfaces of the housing body, The rear end of the heat release portion of the heat dissipation mechanism provided on the front surface of the housing body and the front end of the heat release portion of the heat dissipation mechanism provided on the back surface of the housing body are arranged with a predetermined spacing distance in the front-to-rear direction across the heat exchange area.

11. The heat dissipation mechanism according to claim 1, wherein: One surface of the heat receiving portion is in surface thermal contact with the heat generating surface of the heat generating element and is coupled to the other surface of a coupling heat transfer element provided to mediate coupling with the housing body, thereby transferring heat from the heat generating element.

12. The heat dissipation mechanism according to claim 11, wherein: The heat receiving portion has a thickness and a length sufficient to be inserted into a fixing slot formed on the other surface of the coupling heat transfer element.

13. The heat dissipation mechanism according to claim 1, wherein: The heat releasing portion has an edge end portion bent at a predetermined angle and extending from the heat receiving portion so as to occupy the heat exchange region.

14. A heat dissipation module, comprising: a heat dissipation mechanism comprising a heat receiving portion and a heat releasing portion, the heat receiving portion capturing heat generated by the heating element, the heat releasing portion being configured to diffuse the heat captured in the heat receiving portion and perform heat exchange, and having at least a front end extending to a heat exchange region outside a housing body in which the heating element is mounted, thereby occupying a portion of the heat exchange region; and The heat collecting part includes a substrate receiving portion formed on one surface for receiving the PA board, a plurality of fixing slots formed on the other surface for arranging the heat dissipation mechanism, and a heat transfer body filled with a refrigerant capable of phase change.

15. The heat dissipation module according to claim 14, wherein: The heat collection portion further comprises: a shielding cover coupled to the coupling heat transfer body to form a surface of the coupling heat transfer body and prevent leakage of refrigerant therein; and A plurality of support pins are arranged between the other surface of the coupling heat transfer body and the shielding cover.

16. The heat dissipation module according to claim 15, wherein: One ends of the plurality of support pins are supported by the shield cover, and the other ends are supported by the other surface between the plurality of fixing slots in the other surface of the coupling heat transfer body.

17. The heat dissipation module according to claim 14, wherein: The refrigerant flow spaces formed inside the coupling heat transfer element and inside the plurality of heat dissipation mechanisms are formed to communicate with each other.

18. An antenna device comprising: The housing body is formed with a space for arranging the RF filter unit; as well as The heat dissipation module is combined with the front surface or the back surface of the housing body. Wherein, the heat dissipation module includes: a heat receiving portion for collecting heat generated from the heat generating element; and The heat release portion is formed to diffuse the heat collected in the heat storage portion and perform heat exchange, and at least the front end extends to the heat exchange area outside the shell body equipped with the heating element to occupy a part of the heat exchange area.

19. The antenna device according to claim 18, wherein The housing body comprises: A central housing is formed with the installation space for installing the RF filter unit; a front heat dissipation housing, coupled to the front surface of the center housing; and The rear heat dissipation housing is combined with the back portion of the central housing. The heat dissipation module includes: A front heat dissipation module is provided in the front heat dissipation housing; and The rear heat dissipation module is arranged in the rear heat dissipation housing. Wherein, a plurality of module coupling grooves for mediating the coupling of the front heat dissipation module and the rear heat dissipation module are formed in the front heat dissipation housing and the rear heat dissipation housing.

20. The antenna device according to claim 19, wherein When the heat receiving portion is arranged to overlap in the front-to-back direction relative to the front surface portion or the rear surface portion of the shell body, the heat release portions of the front heat dissipation module and the rear heat dissipation module extend further upward than the upper end of the shell body, and extend to occupy at least a portion of the heat exchange area directly above the front-to-back thickness direction of the shell body.

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