Coaxial multi-blade wafer cutting machine

Abstract

The invention relates to the technical field of wafer cutting, in particular to a coaxial multi-blade wafer cutting machine which is characterized in that a cutting mechanism comprises a sliding seat, a cutting power assembly and a self-centering cutter set; the self-centering cutter set comprises a first support, a cutter unit and a centering clamping unit. The centering clamping unit comprises a centering seat, a rotating shaft and a centrifugal block; the plurality of centrifugal blocks are combined to form a variable-diameter centrifugal shaft; first outer conical surfaces are arranged at the two ends of the centrifugal block; a first inner conical surface matched with the first outer conical surface is arranged at the inner end of the push shaft; a first permanent magnet is arranged at the outer end of the push shaft; a spring is arranged between the centering head and the push shaft; a second outer conical surface is arranged at the outer end of the centering head; the cutter unit comprises a cutting blade and a positioning shaft; a second inner conical surface matched with the second outer conical surface is arranged on the periphery of the central hole of the cutting blade; a second permanent magnet is arranged on the outer wall of the positioning shaft in the circumferential direction; and therefore, a single blade can be quickly disassembled and assembled, a plurality of blades do not need to be disassembled and assembled, and the time for disassembling and assembling the blades is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cutting, in particular to a coaxial multi-blade wafer cutting machine. Background Art

[0002] In the semiconductor manufacturing and precision machining fields, multi-blade wafer dicing machines are widely used in the processing of brittle materials such as wafers due to their ability to achieve efficient, batch-processing dicing. The core working components of this type of equipment are the multiple dicing blades, and their installation method directly affects the equipment's operating efficiency, cutting accuracy, and ease of maintenance.

[0003] The blade mounting structure commonly used in multi-blade wafer dicing machines currently features multiple dicing blades coaxially mounted on a single mounting shaft. Specifically, the shaft acts as a load-bearing component, its ends secured to the machine's chassis via connectors such as bearings. The dicing blades are then positioned and locked onto the shaft at predetermined intervals. Nuts, washers, and other fasteners ensure the blades do not shift or wobble during high-speed cutting.

[0004] However, this coaxial installation method based on the mounting shaft has obvious inconveniences in the actual cutting blade disassembly and assembly operations. When it is necessary to replace a worn cutting blade, adjust the blade spacing, or perform equipment maintenance, the operator must first remove the fixed connection parts (such as bearing seats, locking nuts, etc.) at one end of the mounting shaft to make the mounting shaft axially movable. Only then can the cutting blades mounted thereon be removed one by one along the axial direction of the mounting shaft. In this process, if the number of cutting blades is large (for example, in some high-precision batch processing scenarios, in order to improve processing efficiency, it is often necessary to install more than 10 cutting blades), a lot of time is required to disassemble the fixings, pick up and place the blades one by one, and reinstall and position them. This cumbersome disassembly and assembly process will not only significantly extend the downtime of the equipment and reduce production efficiency, but its impact on production progress is even more prominent, especially in large-scale production lines where blades need to be replaced frequently. Summary of the Invention

[0005] The purpose of the present invention is to overcome the above-mentioned shortcomings and provide a coaxial multi-blade wafer cutting machine, so as to facilitate the rapid disassembly and assembly of a single blade without the need to disassemble and assemble multiple blades, saving time for disassembly and assembly of blades and helping to improve production efficiency.

[0006] To achieve the above object, the specific solutions of the present invention are as follows:

[0007] A coaxial multi-blade wafer cutting machine includes a cutting mechanism; the cutting mechanism includes a sliding seat and a cutting power component and a self-centering knife group arranged on the sliding seat;

[0008] The self-centering knife group includes a first bracket, a plurality of cutting knife units and a plurality of centering clamping units; the plurality of centering clamping units are arranged side by side at intervals on the bottom surface of the first bracket;

[0009] Each centering clamping unit includes a centering seat, a rotating shaft rotatably arranged in the centering seat and a plurality of centrifugal blocks movably arranged in the rotating shaft; the plurality of centrifugal blocks are combined to form a centrifugal shaft with a variable diameter; the rotating shaft is transmission-connected to the cutting power assembly; both ends of the centrifugal blocks are provided with a first outer conical surface; both ends of the rotating shaft are provided with a push shaft and a centering head movably arranged along the axial direction; the inner end of the push shaft is provided with a first inner conical surface adapted to the first outer conical surface; the outer end of the push shaft is provided with a first permanent magnet; the centering head is coaxially sleeved on the outer wall of the push shaft, and a spring is provided between its inner end and the push shaft; the outer end of the centering head is provided with a second outer conical surface;

[0010] Each cutter unit includes a cutting blade and a positioning shaft arranged in the center hole of the cutting blade; the cutting blade is provided with a second inner conical surface matching the second outer conical surface at the periphery of its center hole; the outer wall of the positioning shaft is provided with a second permanent magnet along the circumferential direction.

[0011] Furthermore, the outer end surface of the push shaft is provided with a groove; the groove wall of the groove is circumferentially embedded with a first permanent magnet; both ends of the positioning shaft can be inserted into the centering head and then movably extended into the groove.

[0012] The present invention further comprises that the cross section of the groove is polygonal; a first permanent magnet is embedded in the middle of each side of the groove; the cross sections of both ends of the positioning shaft are polygonal; and a second permanent magnet extending parallel to the axial direction is embedded in the middle of multiple sides of the outer wall of the positioning shaft.

[0013] According to the present invention, a coil is provided on one side of the outer wall of the positioning shaft, and a second permanent magnet is embedded in the remaining sides; an RFID component electrically connected to the coil is embedded in the shaft hole of the positioning shaft.

[0014] Furthermore, the present invention provides a guide rod on the outer wall of the centrifugal block; the guide rod is movable and passes through the rotating shaft.

[0015] Furthermore, the present invention is characterized in that a guide groove is provided in the rotating shaft; a guide platform is provided at the inner end of the pushing shaft; and the guide platform is movably embedded in the guide groove.

[0016] Furthermore, the present invention further comprises a second bracket; both ends of the second bracket are connected to the bottom surface of the first bracket; both ends of the second bracket are respectively provided with a centering hole; the second outer conical surface can pass through the centering hole; the second bracket is respectively provided with a cutting hole corresponding to the position of each cutting blade, and the bottom of the cutting blade passes through the cutting hole.

[0017] Furthermore, the present invention provides a third outer conical surface at the middle of both sides of the cutting blade.

[0018] The present invention further comprises a cutting power assembly including a cutting motor, a first synchronous wheel, a second synchronous wheel, a first synchronous belt and a synchronous belt shaft; the first synchronous wheel is connected to the output end of the cutting motor; the synchronous belt shaft is rotatably arranged on a sliding seat; the second synchronous wheel is sleeved on one end of the synchronous belt shaft; the first synchronous belt is wound between the first synchronous wheel and the second synchronous wheel; the rotating shaft of each centering clamping unit is connected to the synchronous belt shaft through a second synchronous belt.

[0019] Furthermore, the present invention includes a cutting machine, a supporting platform, a first slide, a second slide and a third slide; the first slide is arranged on the horizontal arm of the machine; the supporting platform is arranged at the output end of the first slide; the second slide is arranged on the longitudinal arm of the machine; the third slide is arranged at the output end of the second slide; the cutting mechanism is arranged at the output end of the third slide; the supporting platform includes a turntable and a vacuum suction cup arranged on the turntable.

[0020] The beneficial effects of the present invention are as follows: the present invention arranges multiple centering clamping units on the cutting mechanism, thereby utilizing the second outer conical surface of the centering head to cooperate with the second inner conical surface of the cutting blade for preliminary positioning, and then utilizing the centrifugal movement of the centrifugal block to cooperate with the first outer conical surface of the centrifugal block and the first inner conical surface of the push shaft to make the push shaft slide axially, so that the centering head can reliably clamp the cutting blade, and the centering clamping unit centeringly clamps the conical surface of the cutting blade, thereby facilitating the rapid disassembly and assembly of a single blade, without the need to disassemble and assemble multiple blades, saving time for disassembling and assembling the blades, and helping to improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a structural schematic diagram of the coaxial multi-blade wafer cutting machine of the present invention;

[0022] Figure 2 It is a schematic structural diagram of the cutting mechanism of the present invention;

[0023] Figure 3 is a cross-sectional schematic diagram of the cutting mechanism of the present invention;

[0024] Figure 4 It is a structural schematic diagram of the self-centering knife assembly of the present invention;

[0025] Figure 5 is a schematic cross-sectional view of the centering clamping unit of the present invention at the initial stage;

[0026] Figure 6 1 is a cross-sectional schematic diagram of the centering clamping unit of the present invention when centering and clamping the cutting blade;

[0027] Figure 7It is a structural schematic diagram of the cutter unit of the present invention;

[0028] Figure 8 is a schematic cross-sectional view of the cutter unit of the present invention;

[0029] Explanation of reference numerals: 100, machine platform; 200, carrying platform; 300, first slide; 400, second slide; 500, third slide; 600, cutting mechanism; 10, turntable; 20, vacuum suction cup; 30, sliding seat; 40, cutting power assembly; 50, self-centering knife group; 11, cutting motor; 12, first synchronous wheel; 13, second synchronous wheel; 14, first synchronous belt; 15, synchronous belt shaft; 16, second synchronous belt; 21, first bracket; 22, cutter unit; 221, cutting blade; 2211, second inner cone; 2212, third outer conical surface; 222, positioning shaft; 223, second permanent magnet; 224, coil; 225, RFID component; 23, centering clamping unit; 231, centering seat; 232, rotating shaft; 233, centrifugal block; 2331, first outer conical surface; 2332, guide rod; 234, push shaft; 2341, first inner conical surface; 2342, groove; 235, centering head; 2351, second outer conical surface; 236, first permanent magnet; 237, spring; 24, second bracket; 241, centering hole; 242, cutting hole. DETAILED DESCRIPTION

[0030] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments, but the scope of implementation of the present invention is not limited thereto.

[0031] like Figures 1 to 8 As shown, the coaxial multi-blade wafer cutting machine described in this embodiment includes a machine platform 100, a supporting platform 200, a first slide 300, a second slide 400, a third slide 500 and a cutting mechanism 600; the first slide 300 is arranged on the horizontal arm of the machine platform 100; the supporting platform 200 is arranged at the output end of the first slide 300; the second slide 400 is arranged on the longitudinal arm of the machine platform 100; the third slide 500 is arranged at the output end of the second slide 400; the cutting mechanism 600 is arranged at the output end of the third slide 500; the supporting platform 200 includes a turntable 10 and a vacuum suction cup 20 arranged on the turntable 10.

[0032] The cutting mechanism 600 includes a sliding base 30, a cutting power assembly 40 and a self-centering knife assembly 50 disposed on the sliding base 30. The self-centering knife assembly 50 includes a first bracket 21, a plurality of cutting knife units 22, and a plurality of centering clamping units 23. The plurality of centering clamping units 23 are arranged side by side on the bottom surface of the first bracket 21. If there are four centering clamping units 23, there are correspondingly three cutting knife units 22.

[0033] Each centering clamping unit 23 includes a centering seat 231, a rotating shaft 232 rotatably arranged in the centering seat 231 and a plurality of centrifugal blocks 233 movably arranged in the rotating shaft 232; the plurality of centrifugal blocks 233 are combined to form a centrifugal shaft with a variable diameter. For example, if the number of the centrifugal blocks 233 is three, the three centrifugal blocks 233 fit together to form a centrifugal shaft; the rotating shaft 232 is transmission-connected to the cutting power assembly 40; both ends of the centrifugal block 233 are provided with a first outer conical surface 2331; both ends of the rotating shaft 232 are provided with a push shaft 234 and a centering head 235 movably arranged in the axial direction; the inner end of the push shaft 234 is provided with a first inner conical surface 2341 adapted to the first outer conical surface 2331; the outer end of the push shaft 234 is provided with a first permanent magnet 236; the centering head 235 is coaxially sleeved on the outer wall of the push shaft 234, and a spring 237 is provided between its inner end and the push shaft 234; the outer end of the centering head 235 is provided with a second outer conical surface 2351;

[0034] Each cutter unit 22 includes a cutting blade 221 and a positioning shaft 222 arranged in the center hole of the cutting blade 221; the cutting blade 221 is provided with a second inner conical surface 2211 on the periphery of its center hole, which is adapted to the second outer conical surface 2351; the outer wall of the positioning shaft 222 is provided with a second permanent magnet 223 along the circumferential direction.

[0035] The coaxial multi-blade wafer cutting machine described in this embodiment is initially Figure 5 As shown, the centering head 235 extends out of the rotating shaft 232 under the elastic force of the spring 237; the diameter of the centrifugal shaft formed by the combination of multiple centrifugal blocks 233 is the smallest; when installing the cutter unit 22, each cutter unit 22 is placed between two adjacent centering clamping units 23, and then the cutter unit 22 is squeezed between the two adjacent centering clamping units 23. At this time, the two sides of the cutting blade 221 are respectively in contact with the second outer conical surface 2351 of the centering heads 235 of the two adjacent centering clamping units 23, and squeeze the centering heads 235, so that the centering heads 235 compress the spring 237 and retracted until the second inner conical surfaces 2211 on both sides of the cutting blade 221 are aligned with the second outer conical surface 2351 of the centering head 235, the spring 237 pushes the centering head 235 outward, so that the second outer conical surface 2351 of the centering head 235 is stuck in the second inner conical surface 2211 of the cutting blade 221 and comes into contact with the second inner conical surface 2211. At this time, the two adjacent centering heads 235 are respectively clamped and initially positioned on the cutting blade 221 by the cooperation of the second outer conical surface 2351 and the second inner conical surface 2211 under the elastic force of the spring 237;

[0036] After completing the preliminary positioning, the cutting power assembly 40 drives the rotating shaft 232 of each centering clamping unit 23 to rotate, and each centrifugal block 233 of the centrifugal shaft moves radially under the action of centrifugal force, so that the diameter of the centrifugal shaft becomes larger. At this time, the first outer conical surface 2331 of the centrifugal shaft cooperates with the first outer conical surface 2331 of the push shaft 234, so that during the radial movement of the centrifugal block 233, the push shaft 234 is squeezed to slide axially, so that the spring 237 is further compressed, and then the centering head 235 presses the second inner conical surface 2211 of the cutting blade 221, thereby achieving final centering clamping and realizing the installation of the cutting blade 221. Figure 3 and Figure 6 As shown;

[0037] After completing the centering and clamping, the wafer unit is placed on the vacuum suction cup 20, and the vacuum suction cup 20 vacuum-adsorbs and fixes the wafer unit. Then, the first slide 300 drives the carrier platform 200 to move to the bottom of the cutting mechanism 600, and then the second slide 400 and the third slide 500 work to drive the cutting mechanism 600 to move, and the wafer unit is cut by the cutting blade 221 after clamping and positioning; at the same time, the rotation speed of the rotating shaft 232 is increased by the cutting power component 40, so that the push shaft 234 is further extended, so that the positions of the first permanent magnet 236 and the second permanent magnet 223 are spatially overlapped, so that the cutting blade 221 rotates under the action of the magnetic torque; in this way, the rotation speed of the rotating shaft 232 can be controlled to control the spatial overlap rate of the first permanent magnet 236 and the second permanent magnet 223, thereby realizing the control of the transmission torque.

[0038] When the cutting blade 221 needs to be replaced, the cutting power assembly 40 stops driving the rotating shaft 232 to rotate. At this time, the spring 237 pushes the push shaft 234 to reset, thereby reducing the positive pressure between the second outer cone surface 2351 and the second inner cone surface 2211. At this time, the cutter unit 22 can be pulled out from between the two adjacent centering clamping units 23.

[0039] In this embodiment, a plurality of centering clamping units 23 are arranged on the cutting mechanism 600, so that the second outer conical surface 2351 of the centering head 235 cooperates with the second inner conical surface 2211 of the cutting blade 221 for preliminary positioning. Then, the centrifugal movement of the centrifugal block 233 is utilized to cooperate with the first outer conical surface 2331 of the centrifugal block 233 and the first inner conical surface 2341 of the push shaft 234, so that the push shaft 234 slides axially, so that the centering head 235 can reliably clamp the cutting blade 221. The centering clamping unit 23 clamps the conical surface of the cutting blade 221 in a centering manner, thereby facilitating the rapid disassembly and assembly of a single blade without the need to disassemble and assemble multiple blades, saving time for disassembling and assembling blades, and helping to improve production efficiency.

[0040] This embodiment controls the spatial overlap ratio between the first permanent magnet 236 and the second permanent magnet 223 to achieve control of the transmission torque, so as to adapt to different cutting requirements and provide a more flexible structure.

[0041] like Figure 5 and Figure 6 As shown, in the coaxial multi-blade wafer dicing machine described in this embodiment, in some embodiments, both ends of the rotating shaft 232 are rotatably connected to the centering seat 231 through bearings. Through the above arrangement, the stable rotation requirement of the rotating shaft 232 is achieved.

[0042] like Figure 3 、 Figures 5 to 8 As shown, in some embodiments of the coaxial multi-blade wafer cutting machine described in this embodiment, the outer end surface of the push shaft 234 is concavely provided with a groove 2342; the groove wall of the groove 2342 is circumferentially embedded with a first permanent magnet 236; and both ends of the positioning shaft 222 can be inserted into the centering head 235 and then movably extended into the groove 2342. Through the above arrangement, during cutting, by controlling the rotation speed of the rotating shaft 232, the centrifugal block 233 is subjected to different centrifugal forces, thereby controlling the depth of the positioning shaft 222 inserted into the groove 2342, and further controlling the spatial overlap ratio between the first permanent magnet 236 and the second permanent magnet 223. In other words, the greater the depth of the positioning shaft 222 inserted into the groove 2342, the greater the transmission torque between the push shaft 234 and the cutting blade 221, thereby driving the cutting blade 221 to rotate at a high speed more reliably to cut the wafer units.

[0043] like Figures 5 to 8 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, the cross-section of the groove 2342 is polygonal; a first permanent magnet 236 is embedded in the middle of each side of the groove 2342; the cross-sections of both ends of the positioning shaft 222 are polygonal; and a second permanent magnet 223 extending parallel to the axial direction is embedded in the middle of multiple sides of the outer wall of the positioning shaft 222. This arrangement facilitates the positioning and installation of the first permanent magnet 236 and the second permanent magnet 223; the first permanent magnet 236 extends axially parallel to the push shaft 234. This arrangement allows for control of the spatial overlap between the first permanent magnet 236 and the second permanent magnet 223, thereby controlling the magnitude of the transmission torque.

[0044] like Figure 7 and Figure 8As shown, in the coaxial multi-blade wafer cutting machine described in this embodiment, in some embodiments, a coil 224 is provided on one side of the outer wall of the positioning shaft 222, and a second permanent magnet 223 is embedded in the other sides; an RFID component 225 electrically connected to the coil 224 is embedded in the shaft hole of the positioning shaft 222. Through the above arrangement, when the cutting blade 221 is stuck, the resistance torque of the cutting blade 221 exceeds the transmission torque, and there will be a speed difference between the cutting blade 221 and the push shaft 234, so that the coil 224 cuts the magnetic flux lines to generate an induced current. When the induced current is activated, the RFID component 225 transmits a signal to the signal receiving device of the cutting machine. By the presence of the induced current, it can be known whether the resistance torque of the cutting blade 221 exceeds the limit, and by the size of the induced current, the actual speed difference between the centering clamping unit 23 and the cutting blade 221 can be known. The RFID component 225 is an existing RFID unit, such as Figure 8 As shown in the figure, it is only a schematic representation.

[0045] like Figure 5 and Figure 6 As shown, in some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, a guide rod 2332 is provided on the outer wall of the centrifugal block 233; the guide rod 2332 movably extends through the rotating shaft 232. Through this arrangement, the guide rod 2332 provides guidance and positioning for the centrifugal block 233, so that the centrifugal block 233 can reliably move radially under the action of centrifugal force, thereby pushing the push shaft 234 to move axially.

[0046] In some embodiments of the coaxial multi-blade wafer dicing machine described in this embodiment, a guide groove is provided within the rotating shaft 232; a guide platform is provided at the inner end of the push shaft 234; and the guide platform is movably embedded in the guide groove. This arrangement, through the cooperation of the guide groove and the guide platform, limits the rotational freedom of the push shaft 234 relative to the rotating shaft 232, so that the push shaft 234 can only slide axially relative to the rotating shaft 232, thereby providing a more reliable structure. The cooperation of the guide groove and the guide platform provides guidance and positioning for the push shaft 234, allowing the push shaft 234 to slide reliably along the axial direction.

[0047] like Figure 2 and Figure 3As shown, in the coaxial multi-blade wafer cutting machine described in this embodiment, in some embodiments, the self-centering knife group 50 further includes a second bracket 24; the second bracket 24 is U-shaped; the two ends of the second bracket 24 are connected to the bottom surface of the first bracket 21; the two ends of the second bracket 24 are respectively provided with a centering hole 241; the second outer cone 2351 can pass through the centering hole 241; the second bracket 24 is respectively provided with a cutting hole 242 corresponding to the position of each cutting blade 221, and the bottom of the cutting blade 221 passes through the cutting hole 242. By providing the second bracket 24, when the cutter unit 22 is installed, the centering heads 235 of the two outermost centering clamping units 23 can be inserted into the centering hole 241, thereby providing a centering support point for the entire self-centering knife group 50; by providing the cutting hole 242, the cutting blade 221 can pass through the cutting hole 242 to perform a cutting operation on the wafer unit.

[0048] like Figure 7 and Figure 8 As shown, in some embodiments of the coaxial multi-blade wafer saw described in this embodiment, a third outer tapered surface 2212 is provided in the middle of both sides of the cutting blade 221. This arrangement makes it easier to insert the cutting blade 221 between the centering heads 235 of two adjacent centering clamping units 23 by utilizing the third outer tapered surface 2212.

[0049] like Figure 2 and Figure 3 As shown, in some embodiments of the coaxial multi-blade wafer cutting machine described in this embodiment, the cutting power assembly 40 includes a cutting motor 11, a first synchronous wheel 12, a second synchronous wheel 13, a first synchronous belt 14, and a synchronous belt shaft 15; the first synchronous wheel 12 is connected to the output end of the cutting motor 11; the synchronous belt shaft 15 is rotatably mounted on the sliding seat 30; the second synchronous wheel 13 is sleeved on one end of the synchronous belt shaft 15; the first synchronous belt 14 is wound between the first synchronous wheel 12 and the second synchronous wheel 13; the rotating shaft 232 of each centering clamping unit 23 is transmission-connected to the synchronous belt shaft 15 via the second synchronous belt 16. Specifically, the sliding seat 30, the first bracket 21, and each centering seat 231 are provided with a through hole for the second synchronous belt 16 to pass through, so that the second synchronous belt 16 is wound around the rotating shaft 232.

[0050] Specifically, after completing the preliminary positioning, the cutting motor 11 drives the first synchronous wheel 12 to rotate, the first synchronous wheel 12 drives the second synchronous wheel 13 to rotate through the first synchronous belt 14, the second synchronous wheel 13 drives the synchronous belt shaft 15 to rotate, and the synchronous belt shaft 15 drives the rotating shaft 232 of each centering clamping unit 23 to rotate through the second synchronous belt 16. The centrifugal blocks 233 of the centrifugal shaft move radially under the action of centrifugal force, so that the diameter of the centrifugal shaft becomes larger. At this time, the first outer conical surface 2331 of the centrifugal shaft cooperates with the first outer conical surface 2331 of the push shaft 234, so that during the radial movement of the centrifugal block 233, the push shaft 234 is squeezed to slide axially, so that the spring 237 is further compressed, and the centering head 235 presses the second inner conical surface 2211 of the cutting blade 221, thereby realizing the final centering clamping and the installation of the cutting blade 221.

[0051] The above description is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the protection scope of the patent application of the present invention.

Claims

1. A coaxial multi-blade wafer cutting machine, characterized in that: The cutting mechanism includes a sliding seat and a cutting power assembly and a self-centering knife group arranged on the sliding seat; The self-centering knife group includes a first bracket, a plurality of cutting knife units and a plurality of centering clamping units; the plurality of centering clamping units are arranged side by side at intervals on the bottom surface of the first bracket; Each centering clamping unit includes a centering seat, a rotating shaft rotatably arranged in the centering seat and a plurality of centrifugal blocks movably arranged in the rotating shaft; the plurality of centrifugal blocks are combined to form a centrifugal shaft with a variable diameter; the rotating shaft is transmission-connected to the cutting power assembly; both ends of the centrifugal blocks are provided with a first outer conical surface; both ends of the rotating shaft are provided with a push shaft and a centering head movably arranged along the axial direction; the inner end of the push shaft is provided with a first inner conical surface adapted to the first outer conical surface; the outer end of the push shaft is provided with a first permanent magnet; the centering head is coaxially sleeved on the outer wall of the push shaft, and a spring is provided between its inner end and the push shaft; the outer end of the centering head is provided with a second outer conical surface; Each cutter unit includes a cutting blade and a positioning shaft arranged in the center hole of the cutting blade; the cutting blade is provided with a second inner conical surface matching the second outer conical surface at the periphery of its center hole; the outer wall of the positioning shaft is provided with a second permanent magnet along the circumferential direction.

2. The coaxial multi-blade wafer cutting machine according to claim 1, characterized in that: The outer end surface of the push shaft is concavely provided with a groove; the groove wall of the groove is embedded with a first permanent magnet along the circumferential direction; both ends of the positioning shaft can be inserted into the centering head and then movably extended into the groove.

3. The coaxial multi-blade wafer cutting machine according to claim 2, characterized in that: The cross section of the groove is polygonal; a first permanent magnet is embedded in the middle of each side of the groove; the cross sections of both ends of the positioning shaft are polygonal; a second permanent magnet extending parallel to the axial direction is embedded in the middle of multiple sides of the outer wall of the positioning shaft.

4. The coaxial multi-blade wafer cutting machine according to claim 3, characterized in that: A coil is provided on one side of the outer wall of the positioning shaft, and a second permanent magnet is embedded in the other sides; an RFID component electrically connected to the coil is embedded in the shaft hole of the positioning shaft.

5. The coaxial multi-blade wafer cutting machine according to claim 1, characterized in that: A guide rod is provided on the outer wall of the centrifugal block; the guide rod movably passes through the rotating shaft.

6. The coaxial multi-blade wafer cutting machine according to claim 1, characterized in that: A guide groove is provided in the rotating shaft; a guide platform is provided at the inner end of the pushing shaft; and the guide platform is movably embedded in the guide groove.

7. The coaxial multi-blade wafer cutting machine according to claim 1, characterized in that: The self-centering knife group also includes a second bracket; the two ends of the second bracket are connected to the bottom surface of the first bracket; the two ends of the second bracket are respectively provided with a centering hole; the second outer cone surface can pass through the centering hole; the second bracket is respectively provided with a cutting hole corresponding to the position of each cutting blade, and the bottom of the cutting blade passes through the cutting hole.

8. The coaxial multi-blade wafer cutting machine according to claim 1, characterized in that: A third outer conical surface is provided in the middle of both sides of the cutting blade.

9. The coaxial multi-blade wafer cutting machine according to claim 1, characterized in that: The cutting power assembly includes a cutting motor, a first synchronous wheel, a second synchronous wheel, a first synchronous belt and a synchronous belt shaft; the first synchronous wheel is connected to the output end of the cutting motor; the synchronous belt shaft is rotatably arranged on a sliding seat; the second synchronous wheel is sleeved on one end of the synchronous belt shaft; the first synchronous belt is wound between the first synchronous wheel and the second synchronous wheel; the rotating shaft of each centering clamping unit is connected to the synchronous belt shaft through the second synchronous belt.

10. The coaxial multi-blade wafer dicing machine according to any one of claims 1 to 9, characterized in that: The cutting machine also includes a machine platform, a supporting platform, a first slide, a second slide and a third slide; the first slide is arranged on the horizontal arm of the machine platform; the supporting platform is arranged at the output end of the first slide; the second slide is arranged on the longitudinal arm of the machine platform; the third slide is arranged at the output end of the second slide; the cutting mechanism is arranged at the output end of the third slide; the supporting platform includes a turntable and a vacuum suction cup arranged on the turntable.

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