High-resistance epoxy heat-conducting pouring sealant and preparation method thereof

Abstract

The invention relates to the technical field of pouring sealants, in particular to a high-resistance epoxy heat-conducting pouring sealant and a preparation method thereof. The high-resistance epoxy heat-conducting pouring sealant comprises a component A and a component B, and the mass ratio of the component A to the component B is 10: (1-4); the component A is prepared from the following components in parts by mass: 80 to 120 parts of epoxy resin, 100 to 200 parts of inorganic heat-conducting filler, 15 to 30 parts of reactive diluent and 1 to 2 parts of defoaming agent; and the component B comprises the following components in parts by mass: 5-10 parts of methylhexahydrophthalic anhydride, 5-15 parts of composite filler and 1-5 parts of methyl tetrahydrophthalic anhydride. According to the invention, the brittleness defect caused by high filler content is obviously overcome, and an epoxy pouring sealant system forms a good heat conduction network to the greatest extent, so that effective heat conduction and insulation are achieved. The invention has the advantages of easily available raw materials, mild preparation conditions, simple process and easy operation, and can be popularized and applied on a large scale.

Description

Technical Field

[0001] The present invention relates to the technical field of potting adhesives, and in particular to a high-resistance epoxy thermally conductive potting adhesive and a preparation method thereof. Background Art

[0002] Epoxy resin, with its excellent bonding strength, low cure shrinkage, and exceptional dielectric properties, has become an irreplaceable foundational material in the electronics packaging industry. Electronic components encapsulated with epoxy potting compounds not only improve shock resistance but also provide waterproofing and moisture resistance, significantly extending their service life.

[0003] High-performance epoxy potting compound prepared with epoxy resin can effectively strengthen the integrity of electronic components, improve resistance to external impact and vibration, maintain the insulation performance of electronic components, and avoid direct exposure of electronic components and circuits, thereby improving the waterproof and moisture-proof capabilities of electronic devices, effectively extending the service life of electronic components, and facilitating the miniaturization and lightweight development of electronic components. Therefore, it has been widely used in the packaging and protection of electronic components and the potting and insulation treatment of motors.

[0004] However, as integrated circuit power density increases, the inherent flaws of traditional epoxy encapsulants are becoming increasingly prominent: pure epoxy resin has low thermal conductivity, and while adding conventional inorganic fillers such as Al2O3 can improve thermal conductivity, excessive filler content can lead to increased brittleness. Current highly filled systems can cause filler sedimentation and interfacial defects, resulting in a sharp drop in volume resistivity.

[0005] Currently, if metal fillers (such as copper powder) are used, insulation properties will be sacrificed; the thermal conductivity coefficient of insulating fillers is low, and an extremely high addition amount is required to achieve thermal conductivity requirements above 1.5W / (m•K). At the same time, they have poor affinity with resins, are unevenly distributed, and are prone to precipitation, which seriously restricts the application of epoxy potting adhesives in high-power electronic devices. Summary of the Invention

[0006] The purpose of the present invention is to solve the shortcomings of the prior art and to propose a high-resistance epoxy thermal conductive potting adhesive and a preparation method thereof.

[0007] A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of component A to component B is 10:1-4; component A comprises, in parts by mass, 80-120 parts of epoxy resin, 100-200 parts of inorganic thermally conductive filler, 15-30 parts of active diluent, and 1-2 parts of defoaming agent; and component B comprises, in parts by mass, 5-10 parts of methylhexahydrophthalic anhydride, 5-15 parts of composite filler, and 1-5 parts of methyltetrahydrophthalic anhydride.

[0008] Preferably, the epoxy resin is epoxy resin E-51.

[0009] Preferably, the particle size of the inorganic thermal conductive filler is 0.1-1 μm, and the inorganic thermal conductive filler includes: zinc oxide and aluminum oxide.

[0010] Preferably, the reactive diluent is at least one of 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether and 1,2-cyclohexanediol diglycidyl ether.

[0011] Preferably, the defoaming agent is polyoxyethylene polyoxypropylene pentaerythritol ether.

[0012] Preferably, the raw materials of the composite filler include, by mass: 1-5 parts of graphene oxide, 1-5 parts of mesoporous silica, 0.01-0.1 parts of silane coupling agent, 1-5 parts of acrylic acid, 0.1-0.5 parts of 2-acrylamide-2-methylpropanesulfonic acid, 0.01-0.02 parts of N,N'-vinylbisacrylamide, and 0.01-0.02 parts of ammonium persulfate.

[0013] More preferably, the silane coupling agent is KH-560 coupling agent.

[0014] More preferably, the composite filler is prepared by the following steps: adding graphene oxide, mesoporous silica, and KH-560 coupling agent to an ethanol aqueous solution and stirring for 10-20 minutes, ultrasonically treating for 1-2 hours, spray drying, adding acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide under nitrogen protection, mixing evenly, adding ammonium persulfate, stirring at 85-90°C for 1-2 hours, and cooling to room temperature.

[0015] Specifically, the ultrasonic frequency is 70-90 kHz.

[0016] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Stir the epoxy resin and reactive diluent for 20-40 minutes, add the defoamer and inorganic thermal conductive filler and continue stirring for 10-20 minutes to obtain component A; S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0017] Beneficial effects: The present invention constructs a three-dimensional thermal conductive network by compounding and filling graphene oxide and mesoporous silica. The high specific surface area of ​​graphene oxide can be evenly dispersed in the resin matrix, while the microporous structure of mesoporous silica can effectively block carrier migration. The dual effects maintain the volume resistivity while increasing the density of the thermal conductive path; the siloxane groups of the silane coupling agent react with the hydroxyl groups on the surface of the filler to form a chemically bonded interface, thereby inhibiting local electric field concentration caused by filler agglomeration.

[0018] The present invention adopts acrylic acid and 2-acrylamide-2-methylpropanesulfonic acid graft modification to absorb curing shrinkage stress. The invention is combined with E-51 epoxy resin to effectively solve the problems in the prior art of epoxy resin being difficult to disperse evenly when highly filled, causing sedimentation, and requiring too much to be used. The product has high thermal conductivity, high dielectric strength, and relatively high mechanical strength while also having stable product quality.

[0019] The present invention utilizes a combination of inorganic thermally conductive fillers and composite fillers, resulting in uniform distribution and resistance to sedimentation. This significantly overcomes the brittleness inherent in high filler content, maximizing the formation of a well-developed thermal network within the epoxy potting system, thereby achieving effective heat conduction and insulation. The present invention utilizes readily available raw materials, mild preparation conditions, a simple process, and easy operation, making it suitable for large-scale application. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 The figure is a comparison of the thermal conductivity and heat deformation temperature of the potting glue obtained in Example 5 and Comparative Examples 1-2.

[0021] Figure 2 The figure is a comparison chart of the tensile strength and impact strength of the potting glue obtained in Example 5 and Comparative Examples 1-2.

[0022] Figure 3 The dielectric strength comparison chart of the potting adhesives obtained in Example 5 and Comparative Examples 1-2 is shown. DETAILED DESCRIPTION

[0023] The present invention will be further explained below with reference to specific embodiments.

[0024] Example 1 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 10:1.

[0025] Component A includes: 80g of epoxy resin E-51, 50g of zinc oxide, 50g of aluminum oxide, 15g of 1,4-butanediol diglycidyl ether, and 1g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0026] Component B includes: 5g of methylhexahydrophthalic anhydride, 5g of composite filler, and 1g of methyltetrahydrophthalic anhydride.

[0027] The raw materials of the composite filler include: 1 g of graphene oxide, 1 g of mesoporous silica, 0.01 g of KH-560 coupling agent, 1 g of acrylic acid, 0.1 g of 2-acrylamide-2-methylpropanesulfonic acid, 0.01 g of N,N'-vinylbisacrylamide, and 0.01 g of ammonium persulfate.

[0028] The composite filler was prepared by the following steps: graphene oxide, mesoporous silica, and KH-560 coupling agent were added to 20 g of 40% ethanol aqueous solution, stirred at a speed of 500 r / min for 10 minutes, ultrasonically treated for 1 hour at an ultrasonic frequency of 70 kHz, spray dried, and acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide were added under nitrogen protection and mixed evenly. Ammonium persulfate was added, stirred at 85°C for 1 hour, and then cooled to room temperature.

[0029] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,4-butanediol diglycidyl ether were placed in a high-speed disperser and stirred for 20 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 10 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0030] Example 2 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 5:2.

[0031] Component A includes: 120g of epoxy resin E-51, 80g of zinc oxide, 120g of aluminum oxide, 30g of 1,6-hexanediol diglycidyl ether, and 2g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0032] Component B includes: 10g of methylhexahydrophthalic anhydride, 15g of composite filler, and 5g of methyltetrahydrophthalic anhydride.

[0033] The raw materials of the composite filler include: 5g of graphene oxide, 5g of mesoporous silica, 0.1g of KH-560 coupling agent, 5g of acrylic acid, 0.5g of 2-acrylamide-2-methylpropanesulfonic acid, 0.02g of N,N'-vinylbisacrylamide, and 0.02g of ammonium persulfate.

[0034] The composite filler was prepared by the following steps: graphene oxide, mesoporous silica, and KH-560 coupling agent were added to 40 g of 60% ethanol aqueous solution, stirred at a speed of 1000 r / min for 20 minutes, ultrasonically treated for 2 hours at an ultrasonic frequency of 90 kHz, spray dried, and acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide were added under nitrogen protection and mixed evenly. Ammonium persulfate was added, stirred at a temperature of 90°C for 2 hours, and then cooled to room temperature.

[0035] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,6-hexanediol diglycidyl ether were placed in a high-speed disperser and stirred for 40 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 20 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0036] Example 3 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 5:1.

[0037] Component A includes: 110 g of epoxy resin E-51, 40 g of zinc oxide, 80 g of aluminum oxide, 26 g of 1,6-hexanediol diglycidyl ether, and 1.5 g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0038] Component B includes: 7g of methylhexahydrophthalic anhydride, 12g of composite filler, and 2g of methyltetrahydrophthalic anhydride.

[0039] The raw materials of the composite filler include: 4 g of graphene oxide, 2 g of mesoporous silica, 0.07 g of KH-560 coupling agent, 2 g of acrylic acid, 0.4 g of 2-acrylamide-2-methylpropanesulfonic acid, 0.012 g of N,N'-vinylbisacrylamide, and 0.017 g of ammonium persulfate.

[0040] The composite filler was prepared by the following steps: graphene oxide, mesoporous silica, and KH-560 coupling agent were added to 25 g of 55% ethanol aqueous solution, stirred at a speed of 700 r / min for 18 minutes, ultrasonically treated for 80 minutes at an ultrasonic frequency of 85 kHz, spray dried, and acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide were added under nitrogen protection and mixed evenly. Ammonium persulfate was added, stirred at 87°C for 100 minutes, and then cooled to room temperature.

[0041] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,6-hexanediol diglycidyl ether were placed in a high-speed disperser and stirred for 25 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 18 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0042] Example 4 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 10:3.

[0043] Component A includes: 90 g of epoxy resin E-51, 80 g of zinc oxide, 100 g of aluminum oxide, 18 g of 1,4-butanediol diglycidyl ether, and 1.5 g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0044] Component B includes: 9g of methylhexahydrophthalic anhydride, 8g of composite filler, and 4g of methyltetrahydrophthalic anhydride.

[0045] The raw materials of the composite filler include: 2 g of graphene oxide, 4 g of mesoporous silica, 0.03 g of KH-560 coupling agent, 4 g of acrylic acid, 0.2 g of 2-acrylamide-2-methylpropanesulfonic acid, 0.018 g of N,N'-vinylbisacrylamide, and 0.013 g of ammonium persulfate.

[0046] The composite filler was prepared by the following steps: graphene oxide, mesoporous silica, and KH-560 coupling agent were added to 35 g of 45% ethanol aqueous solution, stirred at a speed of 900 r / min for 12 minutes, ultrasonically treated for 100 minutes with an ultrasonic frequency of 75 kHz, spray dried, and acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide were added under nitrogen protection and mixed evenly. Ammonium persulfate was added, stirred at a temperature of 89°C for 80 minutes, and then cooled to room temperature.

[0047] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,4-butanediol diglycidyl ether were placed in a high-speed disperser and stirred for 35 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 12 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0048] Example 5 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 4:1.

[0049] Component A includes: 100 g of epoxy resin E-51, 75 g of zinc oxide, 75 g of aluminum oxide, 22 g of 1,2-cyclohexanediol diglycidyl ether, and 1.5 g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0050] Component B includes: 8g of methylhexahydrophthalic anhydride, 10g of composite filler, and 3g of methyltetrahydrophthalic anhydride.

[0051] The raw materials of the composite filler include: 3g of graphene oxide, 3g of mesoporous silica, 0.05g of KH-560 coupling agent, 3g of acrylic acid, 0.3g of 2-acrylamide-2-methylpropanesulfonic acid, 0.015g of N,N'-vinylbisacrylamide, and 0.015g of ammonium persulfate.

[0052] The composite filler was prepared by the following steps: graphene oxide, mesoporous silica, and KH-560 coupling agent were added to 30 g of 50% ethanol aqueous solution, stirred at a speed of 800 r / min for 15 minutes, ultrasonically treated for 90 minutes at an ultrasonic frequency of 80 kHz, spray dried, and acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide were added under nitrogen protection and mixed evenly. Ammonium persulfate was added, stirred at 88°C for 90 minutes, and then cooled to room temperature.

[0053] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,2-cyclohexanediol diglycidyl ether were placed in a high-speed disperser and stirred for 30 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 15 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0054] Comparative Example 1 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 4:1.

[0055] Component A includes: 100 g of epoxy resin E-51, 75 g of zinc oxide, 75 g of aluminum oxide, 22 g of 1,2-cyclohexanediol diglycidyl ether, and 1.5 g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0056] Component B includes: 8g of methylhexahydrophthalic anhydride, 10g of composite filler, and 3g of methyltetrahydrophthalic anhydride.

[0057] The raw materials of the composite filler include: 3 g of graphene oxide, 3 g of mesoporous silica, and 0.05 g of KH-560 coupling agent.

[0058] The composite filler was prepared by the following steps: graphene oxide, mesoporous silica, and KH-560 coupling agent were added to 30 g of 50% ethanol aqueous solution, stirred at a speed of 800 r / min for 15 min, ultrasonically treated for 90 min at an ultrasonic frequency of 80 kHz, and spray-dried.

[0059] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,2-cyclohexanediol diglycidyl ether were placed in a high-speed disperser and stirred for 30 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 15 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0060] Comparative Example 2 A high-resistance epoxy thermally conductive potting adhesive comprises: a component A and a component B, wherein the mass ratio of the component A to the component B is 4:1.

[0061] Component A includes: 100 g of epoxy resin E-51, 75 g of zinc oxide, 75 g of aluminum oxide, 22 g of 1,2-cyclohexanediol diglycidyl ether, and 1.5 g of polyoxyethylene polyoxypropylene pentaerythritol ether.

[0062] Component B includes: 8g of methylhexahydrophthalic anhydride, 10g of composite filler, and 3g of methyltetrahydrophthalic anhydride.

[0063] The raw materials of the composite filler include: 3 g of graphene oxide, 0.05 g of KH-560 coupling agent, 3 g of acrylic acid, 0.3 g of 2-acrylamide-2-methylpropanesulfonic acid, 0.015 g of N,N'-vinylbisacrylamide, and 0.015 g of ammonium persulfate.

[0064] The composite filler was prepared by the following steps: graphene oxide and KH-560 coupling agent were added to 30 g of 50% ethanol aqueous solution, stirred at a speed of 800 r / min for 15 minutes, ultrasonically treated for 90 minutes at an ultrasonic frequency of 80 kHz, spray dried, and acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide were added under nitrogen protection and mixed evenly. Ammonium persulfate was added, stirred at 88°C for 90 minutes, and then cooled to room temperature.

[0065] The preparation method of the above-mentioned high-resistance epoxy thermal conductive potting adhesive comprises the following steps: S1. Epoxy resin E-51 and 1,2-cyclohexanediol diglycidyl ether were placed in a high-speed disperser and stirred for 30 minutes. Polyoxyethylene polyoxypropylene pentaerythritol ether, zinc oxide, and aluminum oxide were added and stirred for 15 minutes to obtain component A. S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

[0066] The potting compound obtained in Example 5 and Comparative Examples 1-2 was poured into a packaging mold and cured in a temperature environment of 80°C. After complete curing, the mold was removed, taken out, and cut into samples that met the test specifications. The following performance tests were performed: (1) The thermal conductivity of each group of samples was measured with reference to GB / T 29313-2012 “Test method for thermal conductivity of electrical insulating materials”; (2) The heat deformation temperature of each group of specimens was measured with reference to GB / T 1634.2-2019 “Plastics — Determination of deflection temperature under load — Part 2: Plastics and hard rubber”; (3) The tensile strength of each group of specimens was measured with reference to GB / T 1040.2-2022 “Determination of tensile properties of plastics Part 2: Test conditions for molded and extruded plastics”, using a 1A dumbbell specimen and setting the tensile speed to 1 mm / min; (4) The impact strength of each group of samples was measured with reference to GB / T 1043.1-2008 “Determination of impact properties of simply supported beams of plastics Part 1: Non-instrumented impact test”; (5) The dielectric strength of each group of samples was measured with reference to ASTM D-149.

[0067] like Figures 1 to 3 As shown, the thermal conductivity, heat deformation temperature, tensile strength, impact strength and dielectric strength of the potting compound obtained in Example 5 are the highest, which are better than those in Comparative Examples 1-2 (P < 0.05).

[0068] The reason for the above results is that the present invention constructs a three-dimensional thermal conductive network by compounding graphene oxide and mesoporous silica for filling. The high specific surface area of ​​graphene oxide allows for uniform dispersion in the resin matrix, while the microporous structure of mesoporous silica effectively blocks carrier migration. This dual effect maintains volume resistivity while increasing the density of the thermal conductive path. The siloxane groups of the silane coupling agent react with the hydroxyl groups on the filler surface to form a chemically bonded interface, inhibiting local electric field concentration caused by filler agglomeration. The present invention uses acrylic acid and 2-acrylamide-2-methylpropanesulfonic acid for grafting modification to absorb curing shrinkage stress. Combined with E-51 epoxy resin, this effectively solves the problems of epoxy resin in the prior art, such as difficulty in uniform dispersion, sedimentation, and excessive usage, when highly filled. The product has high thermal conductivity, high dielectric strength, and relatively high mechanical strength while maintaining stable product quality. The present invention adopts zinc oxide, aluminum oxide and composite fillers to be compounded, which are evenly distributed and not easy to precipitate, significantly overcoming the brittle defect caused by high filler content, and forming a good thermal conductive network in the epoxy potting system to the greatest extent, thereby achieving effective heat conduction and insulation.

[0069] The above description is only a preferred specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any technician familiar with the technical field, within the technical scope disclosed by the present invention, who makes equivalent replacements or changes based on the technical solution and inventive concept of the present invention, should be covered by the scope of protection of the present invention.

Claims

1. A high resistance epoxy thermal conductive potting compound, characterized in that: include: The mass ratio of component A, component B, and component A, component B is 10:1-4; Component A includes, by mass: 80-120 parts of epoxy resin, 100-200 parts of inorganic thermal conductive filler, 15-30 parts of active diluent, and 1-2 parts of defoaming agent; Component B comprises, by mass, 5-10 parts of methylhexahydrophthalic anhydride, 5-15 parts of composite filler, and 1-5 parts of methyltetrahydrophthalic anhydride.

2. The high resistance epoxy thermal conductive potting compound according to claim 1, characterized in that: The epoxy resin is epoxy resin E-51.

3. The high resistance epoxy thermal conductive potting compound according to claim 1, characterized in that: The particle size of the inorganic thermal conductive filler is 0.1-1 μm, and the inorganic thermal conductive filler includes: zinc oxide and aluminum oxide.

4. The high resistance epoxy thermal conductive potting compound according to claim 1, characterized in that: The active diluent is at least one of 1,4-butanediol diglycidyl ether, 1,6-hexanediol diglycidyl ether and 1,2-cyclohexanediol diglycidyl ether.

5. The high resistance epoxy thermal conductive potting compound according to claim 1, characterized in that: The defoaming agent is polyoxyethylene polyoxypropylene pentaerythritol ether.

6. The high resistance epoxy thermal conductive potting compound according to claim 1, characterized in that: The raw materials of the composite filler include, by mass, 1-5 parts of graphene oxide, 1-5 parts of mesoporous silica, 0.01-0.1 parts of silane coupling agent, 1-5 parts of acrylic acid, 0.1-0.5 parts of 2-acrylamide-2-methylpropanesulfonic acid, 0.01-0.02 parts of N,N'-vinylbisacrylamide, and 0.01-0.02 parts of ammonium persulfate.

7. The high resistance epoxy thermal conductive potting compound according to claim 6, characterized in that: The silane coupling agent is KH-560 coupling agent.

8. The high resistance epoxy thermal conductive potting compound according to claim 6, characterized in that: The composite filler is prepared by the following steps: adding graphene oxide, mesoporous silica, and KH-560 coupling agent to an ethanol aqueous solution, stirring for 10-20 minutes, ultrasonically treating for 1-2 hours, spray drying, adding acrylic acid, 2-acrylamide-2-methylpropanesulfonic acid, and N,N'-vinylbisacrylamide under nitrogen protection, mixing evenly, adding ammonium persulfate, stirring at 85-90°C for 1-2 hours, and cooling to room temperature.

9. The high-resistance epoxy thermally conductive potting compound according to claim 8, characterized in that: The ultrasonic frequency is 70-90kHz.

10. A method for preparing the high-resistance epoxy thermally conductive potting compound according to any one of claims 1 to 9, characterized in that: The steps include: S1. Stir the epoxy resin and reactive diluent for 20-40 minutes, add the defoamer and inorganic thermal conductive filler and continue stirring for 10-20 minutes to obtain component A; S2, uniformly mixing methylhexahydrophthalic anhydride, methyltetrahydrophthalic anhydride, and a composite filler to obtain component B; S3. Mix component A and component B evenly and perform vacuum degassing.

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