Micro-nano processing technology and method, product and photoetching machine
By employing a reverse etching process in a lithography machine to etch patterns on the reverse side of a mirror, the problems of complex and costly lithography equipment have been solved, achieving simpler and lower-cost micro-nano processing effects.
Patent Information
- Application Number
- CN202510043465.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-10
- Publication Date
- 2025-10-21
AI Technical Summary
Existing lithography equipment and processes are complex and costly, especially in the fabrication of micro- and nano-scale optical waveguide textures. Furthermore, essential components such as masks are controlled by a few companies, leading to manufacturing difficulties.
By employing a reverse etching process, patterns are etched onto the reverse side of a mirror, while corresponding protrusions or depressions are created on one side of the mirror. This simplifies the process steps and reduces system complexity, enabling micro- and nano-scale fabrication through etching on the reverse side of the mirror.
It achieves simpler and lower-cost micro-nano fabrication processes, improves etching accuracy and pattern fineness, and reduces system complexity.
Smart Images
Figure CN120821149A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of optical technology, and in particular to micro-nano processing technology, methods, products and photolithography machines. Background Art
[0002] The photolithography machine is the cornerstone of modern civilization, the cornerstone of the chip industry, the cornerstone of the semiconductor industry, and the cornerstone of the micro-nano processing industry. At the same time, the micro-nano processing technology is also the pinnacle of human engineering art. This processing technology and processing equipment are the epitome of current human modern science and engineering technology. Scientists have brought together the most cutting-edge theories, technologies, and processes from all over the world to ASML, and then they assembled various advanced photolithography machines.
[0003] However, the current lithography equipment is complex, the lithography process is complex, and the equipment is complex. This complexity is not only limited to the production of cutting-edge products such as chips, but also in the production of micro-nano-level optical waveguide patterns on optical waveguide sheets, which are the core lenses of VR, AR, MR and other products. It is also extremely complex and costly.
[0004] In principle, the lithography machines used to make chips and the lithography machines used to make optical waveguides are universal, with only the etching precision being different. Their principle is to use the removal method to achieve mirror surface etching or imprinting when a shaped surface is required. The removal method is the core step of etching in the entire process.
[0005] In traditional production methods, necessities such as photoresist and masks are also needed, and these necessities are often only mastered by a few companies.
[0006] The difficulty of the mask lies in high-precision manufacturing... Without further ado, micro-nano processing technology and related machines are very difficult to manufacture. This is common knowledge known to everyone in the world. It is very difficult.
[0007] Amidst these difficulties, the inventors developed a reverse etching process, in which a pattern is etched on the reverse side of the mirror using light. This creates corresponding bumps or depressions on one side of the mirror. Although the etched side is rough, the mirror side is smooth, and the tiny bumps or depressions on the mirror surface demonstrate the technical effects of nano-machining technology.
[0008] The traditional method of making micro-nano protrusions or depressions is to etch on the plane where the mirror is located, while the pioneering method invented by the inventor is to etch on the reverse side of the mirror. Not only is the step simple, but after combining with other micro-nano processing technologies, it can produce simpler, lower-cost, and lower-complexity lithography machines. This is because chips and optical waveguides are generalized light-transmitting mirrors, and mirrors that reflect or refract light to produce artificially preset patterns are all generalized light-transmitting mirrors!
[0009] To this end, micro-nano processing technology, methods, products and lithography machines are proposed. Summary of the Invention
[0010] The purpose of the present invention is to provide a micro-nano processing technology and method and product and a photolithography machine to solve the problems raised in the above background technology.
[0011] To achieve the above objectives, the present invention provides the following technical solution: a micro-nano processing method, characterized in that it mainly includes:
[0012] The method mainly involves etching, stamping or transferring a pattern, line, symbol, pattern, circuit diagram, grating diagram or optical path diagram on the reverse side (2) of the desired forming surface (1).
[0013] The surface of the substrate (0) of the desired molding surface (1) mainly includes a chip substrate, a chip, a semiconductor substrate, a semiconductor, a wafer substrate, a wafer, a crystal substrate, a crystal element substrate, a crystal element, a mirror substrate, a mirror, a lens substrate, a lens, a mirror substrate, a mirror, a grating substrate, a grating, a light waveguide substrate, a light waveguide sheet, a tube, a cone, a nozzle, a window, a glass, a metal plate, a non-metal plate, or a surface of a curved object.
[0014] The composite micro-nano processing method is characterized by mainly comprising:
[0015] The molding surface processed by the micro-nano processing method described in any one of claims 1 or 2 is mainly used to perform optical etching, transfer printing or embossing on the surface of the target object or the desired molding surface (1) described in the micro-nano processing method described in any one of claims 1 or 2.
[0016] A micro-nano processing technology, characterized by mainly comprising:
[0017] It is mainly made by a micro-nano processing method according to claim 1 or 2, or mainly made by a composite micro-nano processing method according to claim 3, or a combination of a disclosed processing method and any one or both of the above two methods.
[0018] A device, characterized by mainly comprising:
[0019] A machine or equipment or processing equipment or device or medium or photolithography machine mainly based on a micro-nano processing method as described in claim 1 or 2, or a composite micro-nano processing method as described in claim 3, or a micro-nano processing process as described in claim 4, and manufactured according to this process.
[0020] A product, characterized by mainly comprising:
[0021] A chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or cover or keel or bracket or lens or display manufactured primarily by a micro-nano processing method according to claim 1 or 2, or primarily by a composite micro-nano processing method according to claim 3, or by a micro-nano processing process according to claim 4, or a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or lens or display manufactured primarily by a device according to claim 5, or a battery or motor or organ or magical instrument or Taoist instrument or nanorobot or microrobot or millimeter robot or gene or chromosome or cell or clock or watch or engine or automobile or appliance or furniture or radar or camera or bearing or track or shaft or blade or turbine.
[0022] A robot, characterized by mainly comprising:
[0023] The invention mainly consists of a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or cover or keel or bracket or lens or display as described in any one of the products of claim 6, or a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or lens or display or CPU or GPU or graphene or battery or motor or organ or magic instrument or Taoist instrument or nanorobot or microrobot or millimeter robot or gene or chromosome or cell or clock or watch or engine or car or appliance or furniture or radar or camera or bearing or track or shaft or turbine or blade produced by a device of claim 5. BRIEF DESCRIPTION OF THE DRAWINGS
[0024] Figure 1 Schematic diagram of the product produced by the method of the present invention Figure 1 , a schematic diagram of a desired forming surface (1);
[0025] Figure 2 Schematic diagram of the product produced by the method of the present invention Figure 2 , a schematic diagram of the reverse side (2) of the desired forming surface (1). DETAILED DESCRIPTION
[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments.
[0027] Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative work shall fall within the scope of protection of the present invention.
[0028] The translucent mirror mentioned in this article is not limited to the understanding of ancient translucent mirrors, but should be understood as a comprehensive understanding of the specific implementation effects of this ancient instrument, that is, an object with a mirror surface, lens surface, or transparent plate surface, which can reflect the pattern on the back of the mirror surface, lens surface, or transparent plate surface. The mirror surface, lens surface, or transparent plate surface of this object is a translucent mirror.
[0029] A generalized light-transmitting mirror is defined as an extension of a light-transmitting mirror. Traditional light-transmitting mirrors are limited to the production of copper and bronze materials. The present invention extends the concept of light-transmitting mirrors and uses multiple conditional constraints to extend this traditional mirror to other types of materials, as well as ordinary window glass and ordinary lenses. In essence, a Fresnel mirror is also a generalized light-transmitting mirror, but the Fresnel mirror has a limit on the polarization angle of its texture. It realizes the refraction of optical fiber, while the light-transmitting mirror realizes diffuse reflection. The generalized light-transmitting mirror diffracts the concept of diffuse reflection and adds the concept of diffuse refraction. The Fresnel mirror can be regarded as a generalized light-transmitting mirror with an image of a point, but here, the inventor further limits the size of the protrusions or depressions, thereby distinguishing it from the ancient technology of the Fresnel mirror. The special technical effect achieved by the present invention is not only limited to the derivation of the material of the light-transmitting mirror and the ingenious etching process, but also extends its technical effect to ordinary lenses such as window glass, so that ordinary glass can show the pattern, line, text or pattern preset on the window in the light and shadow of the dark room under the illumination of the eyes, thereby increasing the artistic sense of the window.
[0030] The “or” mentioned in the text is not limited to a certain type, but also includes its combination with the nouns in the context.
[0031] Common terms mentioned in this document such as “embossing” or “transfer” or “required” or “molding surface” or “etching” or “pattern” or “line” or “circuit diagram” or “grating diagram” or “optical path diagram” or “substrate” or “composite” or “micro-nano” or “product” or “equipment” or “optical etching” or “reflective” or “processing” or “CPU” or “GPU” or “reverse side” or “pattern” are easy to understand by researchers or technicians in this field as well as those outside this field, and are also clearly defined and uncontroversial.
[0032] A micro-nano processing method, characterized by mainly comprising:
[0033] The method mainly etches, embosses or transfers a pattern, line, symbol, pattern, circuit diagram, raster diagram or optical path diagram on the reverse side (2) of the desired molding surface (1). (The traditional method is to etch the desired molding surface (1) in order to obtain a pattern on the desired molding surface (1), while this pioneering method etches on the reverse side of the desired molding surface (1). Etching on the reverse side will affect the surface where the molding surface is located and produce a reverse pattern, thereby obtaining the desired pattern on the desired molding surface (1), and the pattern is more refined and detailed.)
[0034] Furthermore, the surface of the substrate (0) of the desired molding surface (1) mainly includes a chip substrate or a chip or a semiconductor substrate or a semiconductor or a wafer substrate or a wafer or a crystal substrate or a crystal or a mirror substrate or a mirror or a lens substrate or a lens or a mirror substrate or a mirror or a grating substrate or a grating or an optical waveguide substrate or an optical waveguide or a tube or a cone or a nozzle or a window or a glass or a metal plate or a non-metal plate or a surface of a curved object.
[0035] The composite micro-nano processing method is characterized by mainly comprising:
[0036] The molding surface processed by the micro-nano processing method described in any one of claims 1 or 2 is mainly used to perform optical etching, transfer printing or embossing on the surface of the target object or the desired molding surface (1) described in the micro-nano processing method described in any one of claims 1 or 2. (Claim 1 or 2 both describe etching, transfer printing or embossing on the reverse side of the desired molding surface (1), while claim 3 directly molds on the front side, thus forming a composite use of the process and a closed process loop. Example 1: Etch a circuit diagram on the reverse side of a concave mirror, and then place a grating substrate sheet at the focus, so that the pattern on the reverse side of the concave mirror can be scaled and etched onto the surface of the grating substrate sheet. Example 2: After polishing the mold steel into a mirror surface, etch a pattern on its reverse side, and then transfer or emboss it onto glass, acrylic or resin glass, so that a tiny pattern on the glass can be obtained.)
[0037] A micro-nano processing technology, characterized by mainly comprising:
[0038] It is mainly made by a micro-nano processing method according to claim 1 or 2, or mainly made by a composite micro-nano processing method according to claim 3, or a combination of a disclosed processing method and any one or both of the above two methods.
[0039] A device, characterized by mainly comprising:
[0040] A machine or equipment or processing equipment or device or medium or photolithography machine mainly based on a micro-nano processing method as described in claim 1 or 2, or a composite micro-nano processing method as described in claim 3, or a micro-nano processing process as described in claim 4, and manufactured according to this process.
[0041] A product, characterized by mainly comprising:
[0042] A chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or cover or keel or bracket or lens or display manufactured primarily by a micro-nano processing method according to claim 1 or 2, or primarily by a composite micro-nano processing method according to claim 3, or by a micro-nano processing process according to claim 4, or a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or lens or display manufactured primarily by a device according to claim 5, or a battery or motor or organ or magical instrument or Taoist instrument or nanorobot or microrobot or millimeter robot or gene or chromosome or cell or clock or watch or engine or automobile or appliance or furniture or radar or camera or bearing or track or shaft or blade or turbine. (Chips: Chip manufacturing eliminates the need for a mask. Instead, a concave reflector and a "mask" can be combined into one, creating a concave reflector with a circuit pattern etched on the reverse side. Pipes: After polishing the inner wall of a pipe, a spiral pattern is etched onto the outside. This creates micro-nanoscale spiral patterns on the inner wall, creating a rifled "gun barrel" the size of a needle. A needle is essentially a pipe. Tracks: Creating these nanoscale grooves on a track better locks in lubricant, thereby improving track accuracy.)
[0043] A robot, characterized by mainly comprising:
[0044] The invention mainly consists of a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or cover or keel or bracket or lens or display as described in any one of the products of claim 6, or a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or lens or display or CPU or GPU or graphene or battery or motor or organ or magic instrument or Taoist instrument or nanorobot or microrobot or millimeter robot or gene or chromosome or cell or clock or watch or engine or car or appliance or furniture or radar or camera or bearing or track or shaft or turbine or blade produced by a device of claim 5.
Claims
1. A micro-nano processing method, characterized in that Mainly include: The method mainly involves etching, stamping or transferring a pattern, line, symbol, pattern, circuit diagram, grating diagram or optical path diagram on the reverse side (2) of the desired forming surface (1).
2. A micro-nano processing method according to claim 1, characterized in that Mainly include: The surface of the substrate (0) of the desired molding surface (1) mainly includes a chip substrate or a chip or a semiconductor substrate or a semiconductor or a wafer substrate or a wafer or a crystal substrate or a crystal or a mirror substrate or a mirror or a lens substrate or a lens or a mirror substrate or a mirror or a grating substrate or a grating or an optical waveguide plate substrate or an optical waveguide plate or a tube or a cone or a nozzle or a window or a glass or a metal plate or a non-metal plate or a surface of a curved object.
3. Composite micro-nano processing method, characterized in that Mainly include: The molding surface processed by the micro-nano processing method described in any one of claims 1 or 2 is mainly used to perform optical etching, transfer printing or embossing on the surface of the target object or the desired molding surface (1) described in the micro-nano processing method described in any one of claims 1 or 2.
4. A micro-nano processing technology, characterized in that Mainly include: It is mainly made by a micro-nano processing method according to claim 1 or 2, or mainly made by a composite micro-nano processing method according to claim 3, or a combination of a disclosed processing method and any one or both of the above two methods.
5. A device characterized by Mainly include: A machine or equipment or processing equipment or device or medium or photolithography machine mainly based on a micro-nano processing method as described in claim 1 or 2, or a composite micro-nano processing method as described in claim 3, or a micro-nano processing process as described in claim 4, and manufactured according to this process.
6. A product characterized by Mainly include: A chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or cover or keel or bracket or lens or display manufactured primarily by a micro-nano processing method according to claim 1 or 2, or primarily by a composite micro-nano processing method according to claim 3, or by a micro-nano processing process according to claim 4, or a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or lens or display manufactured primarily by a device according to claim 5, or a battery or motor or organ or magical instrument or Taoist instrument or nanorobot or microrobot or millimeter robot or gene or chromosome or cell or clock or watch or engine or automobile or appliance or furniture or radar or camera or bearing or track or shaft or blade or turbine.
7. A robot, characterized in that Mainly include: The invention mainly consists of a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or cover or keel or bracket or lens or display as described in any one of the products of claim 6, or a chip or semiconductor or optical waveguide or light transmittance or broad light transmittance or spiral tube or spiral sheet or tube or window or mirror or lens or display or CPU or GPU or graphene or battery or motor or organ or magic instrument or Taoist instrument or nanorobot or microrobot or millimeter robot or gene or chromosome or cell or clock or watch or engine or car or appliance or furniture or radar or camera or bearing or track or shaft or turbine or blade produced by a device of claim 5.