Semiconductor laser liquid cooling heat dissipation device of integrated micro-channel structure

Abstract

The invention relates to a semiconductor laser liquid cooling heat dissipation device of an integrated micro-channel structure, which comprises a cover plate and a laser shell which are arranged from top to bottom and are fixedly connected, and is characterized in that the cover plate is connected with a cooling liquid joint so as to realize inflow and outflow of cooling liquid; the side, facing the cover plate, of the laser shell or the side, facing the laser shell, of the cover plate is provided with a micro-channel groove, the side, back to the cover plate, of the laser shell is provided with a first groove, and the first groove is used for installing a laser chip and arranging an optical component. The projection area of the micro-channel groove in the vertical direction at least covers the whole area of the first groove so as to meet the arrangement and heat dissipation requirements of any functional structure in the first groove. Compared with the prior art, efficient liquid cooling heat dissipation of the semiconductor laser can be achieved, and the device is suitable for various laser chip arrangement schemes and has the advantages of being compact in structure, high in heat dissipation efficiency and high in adaptability.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic device thermal management, and in particular to a semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure. Background Art

[0002] Semiconductor lasers are one of the most widely used optoelectronic devices to date. With the continuous advancement of technology and the improvement of device mass production capabilities, they can now be applied to even more fields. Semiconductor lasers are lasers that primarily use semiconductor materials as their working medium. Due to differences in the material structure, the laser light produced will also vary. Semiconductor lasers are characterized by their small size and long lifespan. In addition to the communications field, they are currently widely used in a variety of fields such as laser processing, medical diagnosis, and national defense. As the power of lasers continues to increase and their integration increases, thermal management has become a key factor affecting their performance and lifespan. High-power lasers generate a large amount of heat during operation due to the high light output power of a single chip. If the heat dissipation is not timely, effective, or inefficient, the laser chip temperature will increase, causing the beam wavelength to drift, the output power to decrease, the device to increase thermal stress, and even shorten the device lifespan, seriously affecting its stability and reliability.

[0003] At present, the main heat dissipation methods of lasers are divided into traditional heat dissipation methods and new heat dissipation methods. Traditional heat dissipation methods include: air cooling and liquid cooling, and new heat dissipation methods include: flip-chip cooling and microchannel cooling. Among them, the air cooling system has a simple structure and low cost, but the heat dissipation efficiency is limited, and it is difficult to meet the heat dissipation needs of high-power lasers; although the traditional liquid cooling system can improve the heat dissipation efficiency, it is often difficult to achieve high-density integration with semiconductor lasers due to its complex structure and large size, which restricts the miniaturization and lightweight of the overall system; in the flip-chip heat dissipation method, the flip-chip package still uses the TEC (Thin-Ceramic Package, i.e. thin ceramic package) method. The traditional method of mounting the laser chip and the heat sink is to mount the chip with the front side facing up, and the back cooling surface and the heat sink are connected by solder, but the chip is active. The heat generated in the zone is mainly concentrated in an area of ​​several microns on the upper surface. The distance between the upper surface and the lower surface is generally hundreds of microns. The heat is conducted over such a long distance to the heat sink and then to the TEC cooling, and the heat dissipation effect is limited. In addition, existing microchannel heat dissipation methods, such as Chinese patent CN120357264A, propose to open a microchannel groove on the side of the semiconductor laser housing close to the upper cover plate. However, in this solution, the heat dissipation area is limited to a local area (limited by the position of the front heat source), which cannot adapt to different laser chip layout schemes and is difficult to meet the cooling needs of high-density, highly integrated laser modules. Summary of the Invention

[0004] The purpose of the present invention is to overcome the defects of the above-mentioned prior art and provide a semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure, which can adapt to different laser chip layout schemes.

[0005] The objectives of the present invention can be achieved through the following technical solutions: A semiconductor laser liquid-cooling heat dissipation device with an integrated microchannel structure, comprising a cover plate and a laser housing arranged and fixedly connected from top to bottom, a coolant connector connected to the cover plate to enable the inflow and outflow of coolant, a microchannel groove is provided on the side of the laser housing facing the cover plate or the side of the cover plate facing the laser housing, a first groove is provided on the side of the laser housing facing away from the cover plate, the first groove is used to install a laser chip and arrange optical components, the projection area of ​​the microchannel groove in the vertical direction at least covers the entire area of ​​the first groove to adapt to the arrangement and heat dissipation requirements of any functional structure in the first groove.

[0006] Furthermore, the cover plate and the laser housing are connected by threaded connection, snap connection, riveted connection or welding connection.

[0007] Furthermore, when the cover plate and the laser housing are connected by threaded connection, snap connection or riveted connection, a second groove is provided on the laser housing or the cover plate, and the second groove is located outside the microchannel groove. The second groove accommodates a sealing element, and the sealing element is compressed and clamped between the cover plate and the laser housing to fill the gap and achieve sealing.

[0008] Furthermore, the sealing element is installed inside the second groove and is in close contact with the wall surface of the second groove, and the thickness of the sealing element is greater than the depth of the second groove.

[0009] Furthermore, the cover plate is provided with a first interface and a second interface, which are respectively connected to the coolant connector, and the first interface, the second interface and the coolant connector are connected by threads, clamps, quick plugs, welding or bonding.

[0010] Furthermore, the first interface and the second interface are provided with a gradually expanding drainage structure at the end close to the microchannel groove, so that the inflowing coolant forms a wider flow range to improve fluid distribution, and also allows the outflowing coolant to be smoothly collected.

[0011] Furthermore, the gradually expanding drainage structure is in a conical or curved transition form, so that the end channel cross-sections of the first interface and the second interface gradually expand toward the opening area of ​​the microchannel groove.

[0012] Furthermore, one or more micro-rib structures are provided on the side of the laser housing facing the cover plate, the height of the micro-rib structure is equal to the depth of the micro-channel groove, and multiple micro-channels are formed between adjacent micro-rib structures and between the micro-rib structure and the inner wall of the micro-channel groove. The micro-rib structure, the micro-channel groove and the cover plate or the laser housing together constitute a closed coolant flow channel.

[0013] Furthermore, the micro-rib structure is specifically a rib column or a rib sheet.

[0014] Furthermore, the micro-rib structure is a solid structure, and its surface and / or bottom surface is covered with a capillary structure; the ratio of the thickness h1 of the capillary structure on the surface of the micro-rib structure to the total thickness H of the micro-rib structure ranges from 0% to 100%; the thickness h2 of the capillary structure on the bottom surface of the micro-rib structure is ≥0.

[0015] Furthermore, when the micro-rib structure is a rib, the micro-rib structure is arranged in a sequential, inserted or through-arrangement manner;

[0016] When the micro-rib structure is a rib column, the micro-rib structure is arranged in a sequential or interleaved manner;

[0017] Among them, the sequential arrangement refers to the regular linear arrangement between the micro-rib structures, which is suitable for application scenarios with high flow rate or limited flow channel space;

[0018] The interlaced arrangement refers to the staggered arrangement of the micro-rib structures, which is suitable for areas with dense heat flux or high cooling enhancement requirements;

[0019] The through-type arrangement divides the microchannel groove into multiple microchannels with specific geometric shapes, including parallelograms, trapezoids or S-shapes, to form a partitioned spoiler structure.

[0020] Compared with the prior art, the present invention has the following advantages:

[0021] The present invention designs a cover plate and a laser housing arranged and fixedly connected from top to bottom, wherein a coolant connector is connected to the cover plate to enable the inflow and outflow of coolant. A microchannel groove is provided on the side of the laser housing facing the cover plate or the side of the cover plate facing the laser housing, and a first groove is provided on the side of the laser housing facing away from the cover plate. The first groove is used to install laser chips and arrange optical components, which can adapt to the layout of chips or functional elements of various sizes and shapes, making the entire heat dissipation device more compact and more rationally arranged, helping to reduce system size, improve space utilization, and meet the cooling needs of high-density, highly integrated laser modules. The microchannel groove is designed to have a vertical projection area that covers at least the entire area of ​​the first groove to adapt to the layout and heat dissipation requirements of any functional structure in the first groove. The larger bottom surface area provides more sufficient flow space for the coolant, helping to improve heat exchange efficiency, thereby effectively enhancing the heat dissipation effect of the first groove area.

[0022] In the present invention, the connection method between the laser housing and the cover plate can be selected in a variety of forms according to actual installation requirements, such as threaded connection, snap connection, riveted connection or welding connection, etc., which can be flexibly adapted to different application scenarios and processing techniques; in addition, the first interface, the second interface and the coolant connector on the cover plate can also be selected according to installation requirements. Threads, clamps, quick plugs, welding or bonding methods can be selected, which can adapt to different pipe diameters and pipe layout methods.

[0023] The present invention provides a second groove on the laser housing or cover plate, the second groove being located on the periphery of the microchannel groove, and a sealing element being accommodated in the second groove, wherein the sealing element is compressed and clamped between the cover plate and the laser housing, the sealing element is in close contact with the inner wall surface of the second groove, and the thickness of the sealing element is greater than the depth of the second groove. Therefore, when the cover plate and the laser housing are pressed together by a mechanical connection method, the sealing element undergoes a certain degree of compression deformation under the action of pressure, is clamped between the two to fill the gap, and forms a reliable seal, ensuring that the coolant does not leak while efficiently exchanging heat.

[0024] The present invention provides a gradually expanding drainage structure at the end of the first interface and the second interface on the side close to the microchannel groove. The structure has a slightly conical or curved transition, so that the channel cross-section at the end of the first interface and the second interface is appropriately expanded toward the opening area of ​​the microchannel groove, which helps the inflowing coolant to form a wider flow range, thereby effectively guiding the coolant to cover the entire microchannel groove area, reducing local flow dead corners, and also allowing the outflowing coolant to be smoothly gathered, effectively reducing turbulence and local pressure drop at the outlet end, reducing reflux resistance, and improving heat exchange uniformity and heat exchange efficiency.

[0025] The present invention provides one or more micro-rib structures on the side of the laser housing facing the cover plate. The height of the micro-rib structure is equal to the depth of the microchannel groove. Multiple microchannels are formed between adjacent micro-rib structures and between the micro-rib structure and the inner wall of the microchannel groove. The micro-rib structure, microchannel groove and cover plate or laser housing together constitute a closed coolant flow channel, which can effectively increase the contact area between the coolant and the wall, promote the generation of fluid turbulence, and improve heat exchange efficiency. In addition, the coolant forms a restricted flow area in the microchannel, which improves the flow controllability and heat exchange efficiency, and also facilitates the sealing fit between the laser housing and the cover plate, ensuring the stable operation of the heat dissipation device.

[0026] In the present invention, the micro-rib structure adopts a solid structure, and is designed to be covered with a capillary structure on the surface and / or bottom surface of the micro-rib structure. The capillary structure provides good capillary transmission ability, which can effectively expand the contact area between the coolant and the solid interface and promote the spreading of the liquid in the local area, thereby significantly improving the heat exchange efficiency; in addition, the capillary structure can enhance the capillary driving ability of the coolant in the microchannel, and even under low flow rate conditions, it can maintain the continuous wetting of the liquid on the heat dissipation surface, effectively avoiding local drying and the formation of hot spots, thereby ensuring the thermal stability and working reliability of the semiconductor laser.

[0027] The present invention targets two types of micro-rib structures, rib columns and ribs. In the case of rib columns and ribs, both can be arranged in a row or in an interlaced manner. In the case of ribs, a through-type arrangement can also be adopted. Among them, the in-row arrangement refers to the regular linear arrangement between the micro-rib structures, which has the characteristics of compact structure, simple processing, and low pressure drop. It is suitable for application scenarios with high flow rate or limited flow channel space; the interlaced arrangement refers to the staggered arrangement between the micro-rib structures, which can effectively destroy the boundary layer, induce fluid disturbance, enhance fluid mixing effect, and help to significantly improve local heat transfer performance. It is suitable for areas with dense heat flux or high cooling enhancement requirements; the through-type micro-rib structure divides the microchannel groove into multiple microchannels with specific geometric shapes, including but not limited to parallelograms, trapezoids or S-shapes. This arrangement can effectively limit the local flow path of the coolant, improve the guidance, and help to form a partitioned turbulent flow structure, thereby enhancing the heat exchange effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0029] Figure 2 It is a schematic diagram of the explosion structure of the present invention;

[0030] Figure 3 Schematic diagram of the structure of the back side of the cover plate (i.e., the side of the cover plate facing away from the laser housing) in the present invention;

[0031] Figure 4Schematic diagram of the front side of the cover plate (i.e., the side of the cover plate facing the laser housing) in the present invention;

[0032] Figure 5 Schematic diagram of the structure of the sealing element in the present invention;

[0033] Figure 6 Schematic diagram of the structure of the front side of the laser housing (i.e., the side of the laser housing facing away from the cover plate) in the present invention;

[0034] Figure 7 Schematic diagram of the structure of the back side of the laser housing (i.e., the side of the laser housing facing the cover plate) in the present invention;

[0035] Figure 8 A schematic structural diagram of the second groove and the sealing element in the present invention in a mating state;

[0036] Figure 9 for Figure 8 Schematic diagram of the cross-sectional structure;

[0037] Figure 10 is an optional schematic diagram of the projection shape of the micro-rib structure in the vertical direction in the present invention;

[0038] Figure 11 Schematic diagram of the micro-rib structure covered with a capillary structure in the present invention;

[0039] Figure 12 Schematic diagram of the sequential arrangement of the micro-rib structure in the present invention when it is a rib column;

[0040] Figure 13 Schematic diagram of the arrangement of the micro-rib structure in the present invention when it is a rib;

[0041] Figure 14 This is a schematic diagram of the through-type arrangement of the micro-rib structure in the present invention;

[0042] Figure 15 This is a structural schematic diagram of the laser housing and the cover plate when the microchannel groove of the present invention is provided on the laser housing;

[0043] Figure 16 This is a schematic structural diagram of the laser housing and the cover plate when the microchannel groove of the present invention is provided on the cover plate;

[0044] Explanation of the marks in the figure: 1. Cover plate; 2. Sealing element; 3. Laser housing; 4. Screw; 5. Coolant connector; 11. First interface; 12. Second interface; 13. Cover plate through hole; 31. Housing through hole; 32. Housing threaded hole; 33. Second groove; 34. Microchannel groove; 341. Micro-rib structure; 3411-capillary structure; 342. Microchannel; 35. First groove; h-thickness of capillary structure; H-thickness of micro-rib structure. DETAILED DESCRIPTION

[0045] The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0046] Example

[0047] like Figure 1 and Figure 2 As shown, a semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure includes a laser housing 3, a cover plate 1, and a coolant connector 5. The cover plate 1 is fixedly mounted on the back of the laser housing 3, and the two are connected by screws 4. The back of the laser housing 3 is provided with a microchannel groove structure 34. The cover plate 1 is mounted above the microchannel groove 34 and together with the laser housing 3, forms a coolant flow channel. The sealing element 2 is arranged between the cover plate 1 and the laser housing 3 to achieve effective sealing and prevent coolant leakage. The coolant connector 5 is used for the inlet and outlet of the coolant. It is preferably a right-angle pagoda connector to facilitate pipeline installation and layout. The installation position is set on the back of the cover plate 1. The coolant can flow in from either end, take away the heat generated during the operation of the laser housing 3, and then flow out from the other end, thereby forming a complete cooling path.

[0048] In actual applications, the shape and thickness of the cover plate 1 can be adjusted and optimized according to specific application requirements to adapt to different installation environments and heat dissipation requirements. The materials of the cover plate 1 and the laser housing 3 can be selected separately or together according to the use environment and specific requirements. Preferred materials include metal materials such as copper, aluminum, aluminum alloy, copper-aluminum alloy, titanium alloy, magnesium alloy, stainless steel, as well as ceramic materials such as alumina, aluminum nitride, silicon nitride, silicon carbide, silicon, or polymer materials such as resin, plastic, and glass. By properly selecting materials, multiple performance requirements such as thermal conductivity, corrosion resistance, structural strength, and electrical insulation can be taken into account, thereby meeting the use requirements of the heat dissipation device under different working conditions.

[0049] like Figure 3As shown, the cover plate 1 is provided with a first interface 11, a second interface 12, and a cover plate through hole 13. The cover plate through hole 13 is an unthreaded through hole; the first interface 11 and the second interface 12 are through holes, both of which are used to connect and install the coolant connector 5. The coolant can flow in through either end interface and out through the other end interface, thereby completing the liquid cooling heat dissipation process. In actual applications, the coolant includes but is not limited to one or more mixtures of water, alcohols, oil coolants, molten salt solutions, fluorinated liquids, ammonia, or hydrocarbons; the coolant can be a single-phase fluid, or it can be an evaporative coolant that undergoes phase change during the heat transfer process, or a two-phase flow coolant. Different types of coolants have their own advantages in terms of thermal conductivity, insulation, volatility and environmental adaptability. Among them, phase change coolant can absorb latent heat through liquid vaporization, significantly enhancing heat exchange capacity and being suitable for high heat flux density conditions; while single-phase coolant is more conducive to system structure simplification and stable operation; coolant types can be optimized and selected according to specific application scenarios, heat load requirements and system reliability requirements to improve overall heat dissipation efficiency and operational stability.

[0050] like Figure 4 As shown, the present invention is designed to provide a gradually expanding drainage structure at the first interface 11 and the second interface 12 on the side where the cover plate 1 is attached to the laser housing 5, with a conical or curved transition; this structure helps the coolant to flow more evenly into the internal heat exchange area, reduces flow dead corners, and improves the heat exchange effect. The gradually expanding drainage structure is used to appropriately expand the end channel cross-section of the first interface 11 and the second interface 12 toward the opening area of ​​the microchannel groove 34, which helps the coolant to form a wider flow range when entering the microchannel groove 34, thereby effectively guiding the coolant to cover the entire microchannel groove 34 area, reducing local flow dead corners, and at the same time, the coolant can also be smoothly gathered when flowing out, reducing the local flow velocity difference and pressure drop at the outlet end, further improving the overall flow performance and enhancing the heat exchange effect.

[0051] In actual application, the first interface 11 and the second interface 12 can be set on the back or side of the cover plate 1; if set on the back of the cover plate 1, it is a through-hole structure that penetrates the cover plate 1; if set on the side of the cover plate 1, in order to ensure the flatness of the back of the cover plate and facilitate the stable placement or subsequent fixed installation of the overall heat dissipation device, the cover plate through-hole can preferably be set as a countersunk through-hole so that the screw head can be embedded in the inner surface of the cover plate 1, thereby improving the compactness and installation convenience of the heat dissipation device. The first interface 11 and the second interface 12 can be formed into internal threaded holes or smooth round holes by mechanical processing according to the use requirements; in addition to being able to connect to the coolant connector 5 by means of threads, clamps, quick plugs, welding, etc., the first interface 11 and the second interface 12 can also be bonded and fixed to the first interface 11 and the second interface 12 on the cover plate 1 by structural adhesive for some application scenarios with lower structural strength requirements or easy assembly and disassembly, but its reliability should usually be considered in combination with the sealing performance requirements.

[0052] The type of coolant connector 5 can also be flexibly selected according to system requirements, including pagoda connector, quick-insert connector, quick-tighten connector, flange connector or self-locking connector; its structural form can be straight-through, right-angle, T-type or Y-type structure, etc., to adapt to different spatial layouts and connection strength requirements.

[0053] Preferably, the coolant connector 5 uses a right-angle pagoda connector, which features a simple structure, reliable connection, and strong versatility, suitable for a variety of pipe diameters and flexible hose systems. The right-angle pagoda connector screws directly into the threaded interface hole, and the connector head can rotate freely to accommodate different pipe layouts and space constraints, ensuring a secure connection while facilitating assembly and replacement. Furthermore, to enhance sealing performance, the coolant connector 5 can be used during installation with accessories such as raw tape, thread sealant, sealing gaskets, and O-rings to further improve the sealing effect of the coolant channel and prevent leakage.

[0054] like Figure 5 As shown, the sealing element 2 is annular and is positioned between the cover plate 1 and the laser housing 3 to achieve effective sealing. In practical applications, common materials for the sealing element 2 include silicone rubber, fluorosilicone rubber, fluororubber, EPDM rubber, nitrile rubber, hydrogenated nitrile rubber, polyurethane rubber, polytetrafluoroethylene, polyimide, and flexible graphite. These materials all have excellent heat resistance, chemical corrosion resistance, and sealing properties, adapting to the complex operating environment of the liquid cooling system, effectively preventing coolant leakage, and improving the sealing reliability and service life of the heat sink.

[0055] like Figure 6-7 As shown, the laser housing 3 is provided with a housing through hole 31, a housing threaded hole 32, a second groove 33, a microchannel groove 34, and a first groove 35. The housing through hole 31 is configured as a non-threaded through hole or a threaded through hole to assist in the installation of a heat dissipation device. It can be fixedly connected to an external device, a mounting platform, or a connection structure, thereby achieving a stable integration of the liquid-cooled heat dissipation device proposed in this solution with other devices or systems, improving overall assembly flexibility and system compatibility. The size, number, and distribution of the housing through holes 31 can be flexibly designed based on actual installation requirements, the structural form of the connection components, and the overall layout of the device, so as to adapt to the installation method and connection requirements in different application scenarios.

[0056] The number, size and position of the housing threaded holes 32 correspond to those of the cover plate through holes 13. The screws 2 can pass through the cover plate through holes 13 in sequence and be screwed into the housing threaded holes 32. Specifically, the housing threaded holes 32 at the protruding portion of the edge of the laser housing 3 are set as threaded through holes for the screws 4 to pass through, ensuring a firm connection between the cover plate 1 and the laser housing 3. The remaining positions are set as threaded blind holes to prevent the thread processing from interfering with the internal structure of the front face of the laser housing 3. In other words, the housing threaded holes 32 at the edge or protruding portion of the laser housing 3 can be set as threaded through holes to ensure a firm assembly and accurate positioning between the cover plate 1 and the laser housing 3. The housing threaded holes 32 at the remaining positions can be set as threaded blind holes, with the bottom of the threaded blind holes maintaining a certain distance from the front surface of the laser housing 3, thereby effectively avoiding interference with the internal structure of the semiconductor laser.

[0057] It should be noted that the connection methods between the laser housing 3 and the cover plate 1 include threaded connection, snap connection, riveted connection or welding connection. The threaded connection is suitable for situations where the laser housing 3 can be repeatedly disassembled and assembled, and is convenient for maintenance and replacement; the snap connection has a simple structure and is easy to install, and is suitable for light structures; the riveted connection has good mechanical strength and stability; and the welding connection is suitable for situations where higher sealing requirements and stronger structural stability are required.

[0058] When the laser housing 3 and the cover plate 1 are connected by threaded connection, snap connection or riveting, a second groove 33 is provided on the laser housing 3 or the cover plate 1. The second groove 33 is provided on the periphery of the microchannel groove 34, that is, for accommodating and positioning the sealing element 2.

[0059] When the laser housing 3 and the cover plate 1 are connected by threads, the laser housing 3 is provided with a plurality of housing threaded holes 32, and the cover plate 1 is provided with cover plate through holes 13 corresponding to the housing threaded holes 32 in size, position and number. The screws 4 pass through the cover plate through holes 13 and are screwed into the housing threaded holes 32 to fasten the laser housing 3 to the cover plate 1. The housing threaded holes 32 are set as threaded through holes or threaded blind holes, and the cover plate through holes 13 are set as unthreaded through holes or threaded through holes. The size, position and number of the housing threaded holes 32 and the cover plate through holes 13 can be adjusted according to specific needs during design.

[0060] When the laser housing 3 and the cover plate 1 are connected by a snap-fit ​​connection, the laser housing 3 and the cover plate 1 are respectively provided with a matching slot structure and a snap-fit ​​structure. The snap-fit ​​components are inserted into the corresponding slots to achieve reliable fixation of the laser housing 3 and the cover plate 1. This connection method does not require additional fasteners, facilitates quick assembly and disassembly, can ensure the stability and sealing of the connection, and is suitable for occasions where convenient maintenance or replacement is required.

[0061] When the laser housing 3 and the cover plate 1 are connected by riveting, the laser housing 3 and the cover plate 1 are provided with matching holes for riveting fixation, and the rivets are fixed through these holes, thereby achieving a firm connection between the laser housing 3 and the cover plate 1. The riveting connection method can provide reliable mechanical strength and is suitable for occasions that require long-term fixation and are inconvenient to frequently disassemble.

[0062] When welding is used to connect the laser housing 3 and the cover plate 1, a weldable contact surface is provided between the laser housing 3 and the cover plate 1, and the two are permanently connected by laser welding or other welding techniques; the welding connection method can further improve the sealing and structural strength, and is suitable for liquid-cooled heat dissipation devices with high reliability requirements. In addition, when the laser housing 3 and the cover plate 1 are fixed by welding, structural sealing can usually be achieved by welds, and the second groove 33 and the sealing element 2 may not be provided at this time; however, it does not rule out the auxiliary provision of the second groove 33 and the sealing element 2 when using welding connection between the laser housing 3 and the cover plate 1 to further enhance the sealing performance or meet the requirements for detachability and sealing safety in specific application scenarios.

[0063] The first groove 35 is used to mount laser chips, optical components, and / or other components related to laser operation, enhancing the integration and layout flexibility of the laser chips and components. Furthermore, the vertical projection of the microchannel groove 34 covers at least the entire area of ​​the first groove 35. This means that the bottom area of ​​the microchannel groove 34 is greater than or equal to the bottom area of ​​the first groove 35. This design accommodates the installation and layout requirements of various functional structures within the first groove 35. The larger bottom area provides ample flow space for the coolant, helping to improve heat exchange efficiency and effectively enhance the heat dissipation effect in the area of ​​the first groove 35.

[0064] The inner surface of the microchannel groove 34 can also be strengthened by surface treatment processes such as anodizing, sandblasting, micro-texturing or nickel plating to improve its heat exchange performance and corrosion resistance; surface treatment can not only increase the roughness of the wall surface and promote the formation of turbulence of the coolant, thereby improving the heat transfer efficiency, but also enhance the durability of the material, extend the service life of the heat sink, and further optimize the overall performance of the heat sink.

[0065] Combine Figure 8 The second groove 33 is used to accommodate and position the sealing element 2. The sealing element 2 is in close contact with the inner wall surface of the second groove 33 to prevent the sealing element 2 from being displaced during the assembly process. Figure 9The depth of the second groove 33 is slightly less than the thickness of the sealing element 2, allowing the sealing element 2 to slightly protrude from the surface of the second groove 33 when not pressed, thereby achieving a reliable seal after assembly and stress. The second groove 33 is formed around the periphery of the microchannel groove 34. The sealing element 2 is placed within the second groove 33 during installation. In the unpressed state, the sealing element 2 can be slightly protruded from the surface of the second groove 33. When the cover plate 1 and the laser housing 3 are mechanically pressed together, the sealing element 2 undergoes a certain degree of compression deformation under the action of pressure, being sandwiched between the two to fill the gap and form a reliable seal.

[0066] A plurality of micro-rib structures 341 arranged in an array are provided on the vertical bottom surface of the microchannel groove 34. The height of the micro-rib structure 341 is equal to the depth of the microchannel groove 34, which facilitates the fitting and installation of the cover plate 1. A plurality of micro-channels 342 are formed between adjacent micro-rib structures 341 and between the micro-rib structure 341 and the inner wall of the microchannel groove 34, which are used to increase the contact area between the coolant and the heat exchange wall surface, thereby improving the heat exchange efficiency. The micro-rib structure 341, the microchannel groove 34 and the cover plate 1 together constitute a closed coolant flow channel. The upper end surface of the micro-rib structure 341 is flush with the back surface of the laser housing 3 to form a completely closed flow channel, which helps the coolant to form a restricted flow area in the microchannel 342, improve the flow controllability and heat exchange efficiency, and also facilitate the sealing fit between the laser housing 3 and the cover plate 1, ensuring the stable operation of the heat dissipation device.

[0067] It should be noted that in actual applications, without affecting the structural strength and the functional structure arrangement in the first groove 35, the distance between the bottom surface of the micro-rib structure 341 and the bottom surface of the first groove 35 is minimized as much as possible to further reduce the thermal resistance and improve the overall heat dissipation performance.

[0068] like Figure 10 As shown, the projection shape of the micro-rib structure 341 in the vertical direction may include a rounded rectangle, parallelogram, circle, triangle, S-shape, ellipse, teardrop-like shape or other polygons. Correspondingly, its three-dimensional structure can be a column, cone, prism, hemisphere or umbrella structure, etc., to meet different heat dissipation and turbulence requirements. Among them, the axis of the S-shaped structure is curved, similar to a corrugated or serpentine path, which can enhance the turbulence effect; the umbrella structure is a composite rib column with a large difference in size between the top and bottom. Its head and root can be a combination of the same or different shapes. Typical configurations include columns, cones or prism structures with rectangular, trapezoidal, circular, triangular or elliptical cross-sections.

[0069] like Figure 11As shown, the surface and bottom surfaces of the micro-rib structure 341 are preferably covered with capillary structures 3411. The ratio of the thickness of the capillary structures 3411 covering the surface to the total thickness H of the micro-rib structure 341 ranges from 0 to 100%, while the thickness of the capillary structures 3411 covering the bottom surface is ≥ 0. In particular, when the ratio of the thickness of the capillary structures 3411 to the total thickness of the micro-rib structure 341 is 0, it indicates that the surface and bottom surfaces of the micro-rib structure 341 remain in their initial smooth state; while when the ratio of the thickness of the capillary structures 3411 to the total thickness of the micro-rib structure 341 is 100%, it indicates that the entire micro-rib structure 341 is composed of capillary structures 3411.

[0070] Specifically, the capillary structure 3411 can be formed by mixing and sintering one or more materials such as metal powder, metal wire, metal mesh, or metal foam to create a porous structure with three-dimensional interconnected channels, thereby providing excellent capillary transmission capabilities. By introducing the capillary structure 3411 on the surface or bottom surface of the micro-rib structure 341, the contact area between the coolant and the solid interface can be effectively expanded, promoting the spreading of the liquid in the local area, thereby significantly improving the heat exchange efficiency. In addition, the capillary structure 3411 can enhance the capillary driving ability of the coolant in the microchannel 342, maintaining the continuous wetting of the liquid on the heat dissipation surface even under low flow rate conditions, effectively avoiding local drying and the formation of hot spots, thereby ensuring the thermal stability and operational reliability of the semiconductor laser.

[0071] In practical applications, the micro-rib structure 341 can be a rib column or a rib sheet. The main difference between a rib column and a rib sheet is their length scale. The arrangement of the micro-rib structure 341 includes an in-line arrangement, an interlaced arrangement, or a through-type arrangement along the flow direction of the coolant. Among them, the in-line arrangement or the interlaced arrangement are both applicable to rib columns and rib sheets, and the through-type arrangement is mostly used for rib sheets. Specifically, the in-line arrangement refers to a regular linear arrangement between the micro-rib structures, which has the characteristics of compact structure, simple processing, and low pressure drop. It is suitable for application scenarios with high flow rate or limited flow channel space; the interlaced arrangement refers to a staggered arrangement between the micro-rib structures, which can effectively destroy the boundary layer, induce fluid disturbance, enhance fluid mixing effect, and help to significantly improve local heat transfer performance. It is suitable for areas with dense heat flux or high cooling enhancement requirements; the through-type micro-rib structure can divide the microchannel groove 34 into multiple microchannels with specific geometric shapes, including but not limited to parallelograms, trapezoids or S shapes. This arrangement can effectively limit the local flow path of the coolant, improve the guidance, and help to form a partitioned turbulent flow structure, thereby enhancing the heat exchange effect. The specific shape, arrangement and combination of the micro-rib structure can be flexibly selected according to the structural layout of the heat dissipation device, the flow characteristics of the coolant and the heat dissipation requirements to optimize the overall thermal management performance.

[0072] In this embodiment, the micro-rib structure 341 is in the form of a rib, and its vertical projection shape is a rectangle. Figure 12-14 As shown, the arrow direction is a flow direction of the coolant in the microchannel groove 34. In some embodiments, the coolant may also flow in a countercurrent or oblique direction at a certain angle to the arrow direction.

[0073] like Figure 12 As shown, when the micro-rib structure 341 is a rib column, it is arranged in a sequential manner in the microchannel groove 34, and each rib column 341 is arranged in sequence along the flow direction of the coolant. The rib columns 341 maintain axial alignment and are arranged in a regular and neat pattern, which is convenient for processing and flow channel control; this arrangement can effectively guide the coolant to flow stably in a predetermined direction, and at the same time, while maintaining a low flow resistance, increase the heat exchange contact with the surface of the micro-rib structure 341, which is beneficial to improving the overall cooling efficiency, and is suitable for heat dissipation scenarios with high heat exchange requirements and taking into account flow smoothness.

[0074] like Figure 13 As shown, when the micro-rib structure is 341 ribs, they are arranged in an interlaced manner in the microchannel groove 34, and the two adjacent rows of ribs 341 are staggered along the flow direction of the coolant, and each row of ribs 341 is staggered relative to the previous row of ribs 341, thereby forming a "cross-turbation" arrangement; this arrangement helps to enhance the disturbance and mixing of the coolant in the microchannel 342, destroy the development of the boundary layer, and enhance the convective heat transfer intensity; compared with the sequential arrangement, the interlaced arrangement can further improve the heat exchange efficiency, and is suitable for working scenarios with higher requirements for heat exchange performance.

[0075] like Figure 14 As shown, the micro-rib structure 341 is arranged in a through-type manner in the microchannel groove 34, and each micro-rib structure 341 extends continuously along the mainstream direction of the coolant, running through the entire length of the microchannel groove 34, and a certain distance is maintained between adjacent micro-rib structures 341; this arrangement can divide the microchannel groove 34 into multiple narrow microchannels 342, has a good flow-guiding effect, can achieve better fluid guidance and heat exchange uniformity, and is suitable for application scenarios with high requirements for flow control accuracy and structural consistency.

[0076] like Figure 15 As shown, when the microchannel groove 34 is set on the laser housing 3, a number of micro-rib structures 341 are set inside the microchannel groove 34. The micro-rib structure 341 cooperates with the microchannel groove 34 and the cover plate 1 to form a closed coolant flow channel, thereby realizing the diversion and heat exchange of the coolant in the microchannel 342.

[0077] Preferably, if Figure 16As shown, when the microchannel groove 34 is provided on the cover plate 1, the processing process of the micro-rib structure 341 is more convenient, thereby improving the processing accuracy and production efficiency; accordingly, the laser housing 3 is provided with a plurality of arrayed micro-rib structures 341 in the area opposite to the microchannel groove 34 and within its projection range, and the microchannel groove 34 can completely accommodate the micro-rib structure 341. The micro-rib structure 341 cooperates with the microchannel groove 34 and the laser housing 3 to form a closed coolant flow channel, which can ensure efficient flow and heat exchange of the coolant in the channel.

[0078] In addition, the heat dissipation device proposed in this solution can also be connected to an external cooling system or equipment to realize the circulation of the coolant; and cooperate with the flow regulating device, temperature sensor and control unit to monitor and adjust the flow and temperature of the coolant in real time, ensuring the efficiency and stability of the heat dissipation process, meeting the needs of different application environments, thereby improving the operating safety and reliability of the overall heat dissipation device.

[0079] In summary, this solution provides a microchannel groove structure on the laser housing or cover plate. The cover plate is installed on the laser housing to seal the microchannel groove structure and form a closed cooling channel. A plurality of micro-rib structures arranged in an array are provided on the laser housing to enhance the turbulence effect of the coolant and improve the heat exchange efficiency. A first interface and a second interface are provided on the cover plate. The first interface and the second interface are both used to connect the coolant connector. The coolant can flow in through either end interface and flow out from the other end interface. By designing a microchannel groove structure on the laser housing or the cover plate, efficient liquid cooling of the semiconductor laser can be achieved, effectively reducing the operating temperature and thermal resistance of the device, and improving the thermal management performance and system stability. The heat dissipation device has a compact structure and high integration. It is suitable for the heat dissipation needs of a variety of high-power electronic devices and has good practicality and promotion value.

[0080] By providing a large first groove on the back of the laser housing, it can adapt to the layout of chips or functional components of various sizes and shapes, making the entire heat dissipation device more compact and more rationally arranged, helping to reduce system size, improve space utilization, and meet the cooling needs of high-density, highly integrated laser modules;

[0081] This solution supports multiple connection methods between the cover plate and the laser housing, as well as between the coolant connector and the first and second interfaces on the cover plate, which can be flexibly selected according to the usage scenario and processing technology. At the same time, the coolant connector can also be of various types to adapt to different pipe diameters and routing methods.

[0082] This solution combines the design of the second groove and the sealing gasket, and can use a variety of sealing accessories at multiple connections to effectively prevent coolant leakage, which can improve the stability and safety of device operation;

[0083] This solution can construct microchannels of different sizes and geometries by flexibly setting up a variety of micro-rib structure types and arrangements. It has good customization capabilities and heat dissipation adaptability, and is easy to optimize the structure according to different laser modules, packaging space and thermal management requirements.

[0084] Compared to the limitations of traditional liquid cooling devices with a single connection method, this solution demonstrates significant advantages in ease of assembly, flexibility in maintenance and replacement, and system compatibility, improving the reliability and engineering practicality of the cooling device in complex application environments.

[0085] This solution can also be connected to an external cooling system and combined with temperature control and flow regulation modules to achieve coolant circulation control and optimization of thermal management strategies. It is highly scalable and suitable for different working environments and load cooling requirements.

Claims

1. A semiconductor laser liquid cooling device with an integrated microchannel structure, characterized in that: The invention comprises a cover plate (1) and a laser housing (3) which are arranged from top to bottom and fixedly connected. The cover plate (1) is connected to a coolant joint (5) to enable the inflow and outflow of coolant. A microchannel groove (34) is provided on the side of the laser housing (3) facing the cover plate (1) or on the side of the cover plate (1) facing the laser housing (3). A first groove (35) is provided on the side of the laser housing (3) facing away from the cover plate (1). The first groove (35) is used for mounting a laser chip and arranging optical components. The projection area of ​​the microchannel groove (34) in the vertical direction at least covers the entire area of ​​the first groove (35) to adapt to the arrangement and heat dissipation requirements of any functional structure in the first groove (35).

2. The semiconductor laser liquid cooling device with an integrated microchannel structure according to claim 1, characterized in that: The cover plate (1) and the laser housing (3) are connected by threaded connection, snap connection, riveted connection or welding connection.

3. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 2, characterized in that: When the cover plate (1) and the laser housing (3) are connected by threaded connection, snap connection or riveting, a second groove (33) is provided on the laser housing (3) or the cover plate (1), the second groove (33) is located on the periphery of the microchannel groove (34), and a sealing element (2) is accommodated in the second groove (33). The sealing element (2) is compressed and clamped between the cover plate (1) and the laser housing (3) to fill the gap and achieve sealing.

4. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 3, characterized in that: The sealing element (2) is installed inside the second groove (33) and is in close contact with the wall surface of the second groove (33), and the thickness of the sealing element (2) is greater than the depth of the second groove (33).

5. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 1, characterized in that: The cover plate (1) is provided with a first interface (11) and a second interface (12), the first interface (11) and the second interface (12) being connected to the coolant connector (5) respectively, and the first interface (11), the second interface (12) and the coolant connector (5) being connected by means of threads, clamps, quick plugs, welding or bonding.

6. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 5, characterized in that: The first interface (11) and the second interface (12) are provided with a gradually expanding drainage structure at the end close to the microchannel groove (34), so that the coolant forms a wider flow range when entering the microchannel groove (34); the gradually expanding drainage structure is in a conical or curved transition form, so that the channel cross-sections at the end of the first interface (11) and the second interface (12) gradually expand toward the opening area of ​​the microchannel groove (34).

7. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 1, characterized in that: One or more micro-rib structures (341) are provided on a side of the laser housing (3) facing the cover plate (1); the height of the micro-rib structure (341) is equal to the depth of the micro-channel groove (34); a plurality of micro-channels (342) are formed between adjacent micro-rib structures (341) and between the micro-rib structures (341) and the inner wall of the micro-channel groove (34); the micro-rib structures (341), the micro-channel groove (34) and the cover plate (1) or the laser housing (3) together constitute a closed cooling liquid flow channel.

8. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 7, characterized in that: The micro-rib structure (341) is specifically a rib column or a rib sheet.

9. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 7, characterized in that: The micro-rib structure (341) is a solid structure with a capillary structure (3411) covering the surface and / or bottom surface; the ratio of the thickness of the capillary structure (3411) covering the surface of the micro-rib structure (341) to the thickness of the micro-rib structure (341) is 0% to 100%; The thickness of the capillary structure (3411) covered on the bottom surface of the micro-rib structure (341) is ≥0.

10. The semiconductor laser liquid cooling and heat dissipation device with an integrated microchannel structure according to claim 8, characterized in that: When the micro-rib structure (341) is a rib, the micro-rib structure (341) is arranged in a sequential, inserted, or through-arrangement manner; When the micro-rib structure (341) is a rib column, the micro-rib structure (341) is arranged in a sequential or interleaved manner; Among them, the sequential arrangement refers to the regular linear arrangement between the micro-rib structures (341), which is suitable for application scenarios with high flow rate or limited flow channel space; The interleaved arrangement refers to a staggered arrangement between the micro-rib structures (341), which is suitable for areas with dense heat flux or high cooling enhancement requirements; The through-type arrangement divides the microchannel groove (34) into a plurality of microchannels with specific geometric shapes, including parallelograms, trapezoids or S-shapes, to form a partitioned spoiler structure.

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