Board card repair method and system
Through the board rework method, the number of high-temperature soldering times of BGA packaged chips is reduced, the chip reliability and life issues are solved, and the rework efficiency is improved.
Patent Information
- Application Number
- CN202410431902.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-11
- Publication Date
- 2025-10-21
AI Technical Summary
In the prior art, BGA package chip rework requires three high-temperature soldering steps, which results in high-temperature bubbles and circuit expansion, affecting chip reliability and lifespan, and also reduces rework efficiency.
The board rework method is adopted, including heating treatment to remove the BGA package chip, detinning the pads and welding areas, using solder paste to print and place solder balls, and finally soldering them to the board at one time to reduce the number of heating times.
By reducing the number of high-temperature soldering operations, the life and reliability of the chip are increased, and the repair efficiency is improved.
Smart Images
Figure CN120825880A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of PCB process technology, and in particular to a board repair method and system. Background Art
[0002] A BGA (Ball Grid Array) is a packaging method for integrated circuits using an organic substrate. The chip's soldering surface is on the bottom surface, which is decorated with solder balls arranged in an array. BGA packaging accommodates more pins than other packages such as dual in-line packages or quad flat packages. Pins can be placed on the entire bottom surface of the device, rather than just the periphery. This also allows for shorter average lead lengths than more peripherally limited packages, resulting in better high-speed performance. BGA packaging reduces footprint, increases functionality with a larger number of pins, and self-centers on the PCB during soldering, making it easier to apply solder.
[0003] Currently, the rework and repair of BGA packaged chips in electronic products often requires re-balling and re-soldering the BGA packaged chips. The currently known general process is: first, remove the residual solder balls from the BGA packaged chip, apply a layer of flux to the chip pad surface, place the solder balls using a jig or automatic ball placement machine, and then solder the placed solder balls to the chip pads of the BGA packaged chip. Finally, the BGA packaged chip with solder balls is moved to a dedicated workstation using tweezers or clamping tools for heating and soldering. For BGA packaged chips, the impact of temperature on the chip life and reliability is the most critical core factor, especially the impact of high soldering and operating temperatures. However, in the current board rework process, the BGA is reworked and re-soldered to the board using a straight ball method. This method requires three high-temperature (260°C) soldering processes on the BGA body, which can cause high-temperature bubbles in the BGA and high-temperature expansion of the circuits, affecting the reliability and life of the BGA packaged chip.
[0004] Therefore, how to provide a board repair method to reduce the impact of high temperature on chips, improve chip life and reliability, and greatly improve the efficiency of repair work is a technical problem that needs to be solved urgently by technical personnel in this field. Summary of the Invention
[0005] The object of the present invention is to provide a board repair method and system to reduce the impact of high temperature on chips and improve the life and reliability of chips.
[0006] To achieve the above object, the present invention provides the following technical solutions: A circuit board rework method comprises: S101. heating a circuit board to be repaired to remove a BGA packaged chip on the circuit board to be repaired from the circuit board to be repaired; S102. desoldering a soldering pad of the BGA packaged chip and a welding area of the circuit board to be repaired; S103. printing the soldering pad of the BGA packaged chip and the welding area of the circuit board to be repaired with solder paste; S104. placing a plurality of soldering balls corresponding to the soldering pads on the welding area of the circuit board to be repaired after the printing process; S105. placing the printed BGA packaged chip on the welding area with the soldering balls, and soldering the printed BGA packaged chip and the circuit board to be repaired.
[0007] Preferably, in step S101, the board to be repaired is subjected to a heating treatment by a board repair station to remove the BGA packaged chip on the board to be repaired from the board to be repaired.
[0008] Preferably, in step S102, a detinning device is used to detin the pads of the BGA packaged chip and the soldering areas of the board to be repaired.
[0009] To further achieve the above objectives, the present invention provides the following technical solutions: A board rework system comprises: a board rework station for heating a board to be repaired so as to remove a BGA packaged chip on the board to be repaired from the board to be repaired; a printing device for printing a solder pad of the BGA packaged chip and a soldering area of the board to be repaired with solder paste; and a soldering station for placing the printed BGA packaged chip on the soldering area with a solder ball corresponding to the solder pad, and soldering the printed BGA packaged chip and the board to be repaired.
[0010] Preferably, it also includes a detinning device for detinning the pads of the BGA packaged chip and the welding area of the board to be repaired.
[0011] Compared with the prior art, the beneficial effect of the present invention is that the board repair method and system can reduce the number of times the BGA packaged chip is heated, thereby reducing the impact of high temperature on the chip and improving the chip life and reliability. BRIEF DESCRIPTION OF THE DRAWINGS
[0012] Figure 1 This is a schematic diagram of the board repair system; Figure 2 This is a flow chart of the board repair method. DETAILED DESCRIPTION
[0013] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.
[0014] It should be noted that when an element is referred to as being “fixed on” or “placed on” another element, it may be directly on the other element or indirectly on the other element. When an element is referred to as being “connected to” another element, it may be directly connected to the other element or indirectly connected to the other element.
[0015] It should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as limiting the present invention.
[0016] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature identified as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.
[0017] See Figure 1 The embodiment of the present invention discloses a board repair system 100, which includes a board repair station 101 for heating a board to be repaired so as to remove a BGA package chip on the board to be repaired from the board to be repaired; a printing device 102 for printing a solder paste on a pad of the BGA package chip and a welding area of the board to be repaired; and a welding station 103 for placing the printed BGA package chip on the welding area with a solder ball corresponding to the pad, and welding the printed BGA package chip and the board to be repaired. The board repair system 100 is used for repairing BGA package chips on boards. The repair system can reduce the number of times the BGA package chip is heated, thereby reducing the impact of high temperature on the chip and improving the chip life and reliability.
[0018] Next, the boards to be repaired refer to PCB boards with problems such as poor contact, empty solder joints, and short circuits. In this embodiment, before heating the BGA packaged chips of the boards to be repaired, if there is moisture in the boards or BGA packaged chips, the boards or BGAs can be preheated to remove the moisture, depending on the actual situation. In addition, in the embodiments of the present application, there is no restriction on what device or method is used to heat the BGA packaged chips on the boards to be repaired, as long as the BGA can be removed from the boards to be repaired. For example, the board rework station 101 can be used, or a hot air gun can be used.
[0019] In this embodiment, desoldering is performed on the pads of the BGA packaged chip to remove any residual tin from the BGA packaged chip, making the BGA packaged chip smoother and allowing for more accurate subsequent repair work. Similarly, desoldering the soldered areas of the board to be repaired can make the soldered areas smoother and allow for more accurate subsequent repair work.
[0020] Furthermore, in this embodiment, the solder pads of the BGA packaged chip and the soldering areas of the board to be repaired can be detinned by a detinning device, which can be a soldering iron or other device capable of detinning, without any limitation.
[0021] Next, in this embodiment, solder paste is printed onto the pads of the BGA packaged chip and the soldering areas of the board to be repaired. The purpose of printing solder paste is to reliably connect the BGA packaged chip and the soldering areas of the board to be repaired, achieving electrical continuity. Similarly, the present invention does not impose any restrictions on the device used to print on the BGA packaged chip.
[0022] Furthermore, in the board repair system 100, a plurality of solder balls corresponding to the solder pads are placed on the soldering area of the board to be repaired after the printing process. It should be noted that in the traditional BGA package chip repair, after the printing process of the BGA package chip is completed, the solder balls are usually soldered to the BGA package chip at high temperature, and then the BGA package chip with the solder balls soldered is soldered back to the board. In the board repair system 100 of this embodiment, a plurality of solder balls are first placed in the soldering area by soldering, which effectively replaces the traditional practice of soldering the solder balls to the BGA package chip. After printing, the BGA package chip only needs to be heated once before it can be soldered to the board to be repaired, reducing the number of times the BGA package chip is heated, effectively solving the shortcomings of the background technology, reducing the impact of high temperature on the chip, and improving the chip life and reliability.
[0023] For corresponding reference, see Figure 2The present invention also provides a board repair method for repairing BGA packaged chips. The repair method can reduce the number of times the BGA packaged chip is heated, thereby reducing the impact of high temperature on the chip and improving the chip life and reliability.
[0024] The board rework method includes: step S101: heating the board to be repaired to remove the BGA packaged chip on the board to be repaired from the board to be repaired. Wherein, in step S101, the board to be repaired refers to some PCB boards with problems such as poor contact, empty soldering, short circuit, etc. In this step, before heating the BGA packaged chip of the above-mentioned board to be repaired, if there is moisture in the board or BGA packaged chip, the corresponding board or BGA can be preheated to remove the moisture, according to actual conditions. In addition, in the embodiment of the present application, there is no restriction on what device or method is used to heat the BGA packaged chip on the above-mentioned board to be repaired, as long as the BGA can be removed from the board to be repaired. For example, a board rework station can be used, or a hot air gun can be used.
[0025] Next, the board repair method further includes step S102: desoldering the pads of the BGA packaged chip and the soldering areas of the board to be repaired. In step S102, desoldering the pads of the BGA packaged chip removes any residual tin from the BGA packaged chip, making the BGA packaged chip smoother and facilitating more accurate subsequent repair work. Similarly, desoldering the soldering areas of the board to be repaired also smooths the soldering areas, making subsequent repair work more accurate.
[0026] Furthermore, in step S102, the solder pads of the BGA packaged chip and the soldering area of the board to be repaired can be detinned by a detinning device. The detinning device can be a soldering iron or other device capable of detinning, and no limitation is made here.
[0027] Next, the board rework method further includes step S103: printing solder paste onto the pads of the BGA packaged chip and the soldering areas of the board to be repaired. The purpose of printing solder paste is to reliably connect the BGA packaged chip and the soldering areas of the board to be repaired, achieving electrical continuity. Similarly, the present invention does not impose any restrictions on the device used to print on the BGA packaged chip.
[0028] Next, the board rework method further includes step S104: placing a plurality of solder balls corresponding to the solder pads on the soldering area of the board to be repaired after the printing process. It should be noted that in the traditional BGA package chip rework, after the printing process of the BGA package chip is completed, the solder balls are usually soldered to the BGA package chip at high temperature, and then the BGA package chip with the solder balls is soldered back to the board. In step S104 of this embodiment, a plurality of solder balls are first placed in the soldering area by soldering, which effectively replaces the traditional practice of soldering the solder balls to the BGA package chip. After printing, the BGA package chip only needs to be heated once before it can be soldered to the board to be repaired, reducing the number of times the BGA package chip is heated, effectively solving the shortcomings of the background technology, reducing the impact of high temperature on the chip, and improving the chip life and reliability.
[0029] Furthermore, the board repair method further includes step S105. Placing the printed BGA package chip on the soldering area with the soldering balls, and soldering the printed BGA package chip and the board to be repaired.
[0030] In summary, the board repair method and system can reduce the number of times the BGA packaged chip is heated, thereby reducing the impact of high temperature on the chip and improving the chip life and reliability.
[0031] Based on the disclosure and teachings of the above description, those skilled in the art may also make changes and modifications to the above embodiments. Therefore, the present invention is not limited to the specific embodiments disclosed and described above, and modifications and variations of the present invention should also fall within the scope of protection of the claims of the present invention. In addition, although certain specific terms are used in this description, these terms are only for convenience of description and do not constitute any limitation to the present invention.
Claims
1. A board repair method for a board to be repaired having a BGA packaged chip, characterized in that: include: S101. The board to be repaired is heated to remove the BGA package chip from the board to be repaired; S102. Detinning is performed on a pad of the BGA package chip and a soldering area of the board to be repaired; S103. Printing the solder paste on the pads of the BGA packaged chip and the soldering area of the board to be repaired; S104. Placing solder balls corresponding to the solder pads on the soldering areas of the printed board to be repaired; S105. Place the printed BGA packaged chip on the soldering area with the soldering balls, and perform soldering on the printed BGA packaged chip and the board to be repaired.
2. The board repair method according to claim 1, characterized in that: In step S101, a board repair station is used to heat the board to be repaired so as to remove the BGA packaged chip from the board to be repaired.
3. The board repair method according to claim 1, characterized in that: In step S102, a desoldering device is used to desolder the pads of the BGA packaged chip and the soldering area of the board to be repaired.
4. A board repair system, characterized in that: include: A board rework station is used to heat a board to be repaired so as to remove a BGA packaged chip from the board to be repaired; A printing device, used for printing a solder paste on a pad of the BGA packaged chip and a welding area of the board to be repaired; and The soldering station is used to place the printed BGA package chip on the soldering area with a soldering ball corresponding to the soldering pad, and to solder the printed BGA package chip and the board to be repaired.
5. The board repair device according to claim 4, characterized in that: It also includes a detinning device for detinning the soldering pads of the BGA packaged chip and the soldering areas of the board to be repaired.