Electromagnetic shielding device used as heat sink
By integrating the electromagnetic shielding device with the heat sink, the problem of separating electromagnetic shielding and heat dissipation in electronic components is solved, achieving a compact design and efficient thermal management, and meeting electromagnetic compatibility and heat dissipation requirements.
Patent Information
- Application Number
- CN202510485544.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-04-22
- Filing Date
- 2025-04-17
- Publication Date
- 2025-10-24
AI Technical Summary
In existing electronic components, electromagnetic shielding and heat dissipation functions are usually implemented by separate components, resulting in non-compact designs and high costs, making it difficult to simultaneously meet electromagnetic compatibility and thermal management requirements.
The electromagnetic shielding device is designed as a solid structure made of thermally conductive material, which is thermally connected to the heat sink and connected to the circuit board and heat sink through threaded connectors to achieve the integration of electromagnetic shielding and heat dissipation. The gaps are filled with thermally conductive material to improve thermal conductivity and shielding effect.
It integrates electromagnetic compatibility and thermal management, improves the compactness and thermal conductivity of electronic components, reduces connection costs, and meets the dual requirements of electromagnetic compatibility and heat dissipation.
Smart Images
Figure CN120835522A_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The invention relates to an electronic assembly having an electromagnetic shielding device and components and / or a circuit board which require active cooling during operation. BACKGROUND
[0002] In electronic assemblies it is often necessary to have an electromagnetic shielding device which is used to block electromagnetic radiation which is generated during operation of certain electrical components, so that the radiation does not affect other components in the surroundings of the electronic assembly. Furthermore, the electromagnetic shielding device is used to protect the electronic assembly from electromagnetic radiation which comes from outside the electronic assembly. It is also often necessary to actively cool the circuit board, the electrical components and / or other components and / or assemblies which generate excess heat. For this purpose, metal heat sinks are usually used. SUMMARY
[0003] The electromagnetic shielding device in the electronic assembly according to the invention having the features of claim 1 and the controller having the features of claim 8 have the advantage that a plurality of functions are integrated in one component, so that a plurality of technical tasks which were previously carried out by different, separate components are carried out by one component. This makes it possible to design the electronic assembly and the controller more compactly.
[0004] The electronic assembly, which is used in particular in a controller, preferably in a controller for the operation of a compressor, comprises at least one heat sink, a circuit board in which excess heat is generated during operation and / or on which components which generate excess heat during operation are arranged, and an electromagnetic shielding device which is used to ensure that electromagnetic compatibility during operation of the electronic assembly complies with the specifications. Here, according to the invention, the electromagnetic shielding device is broad and solid and made of a thermally conductive material and is in thermally conductive connection with the heat sink. That is to say, it extends over a large area and is solid and made of a thermally conductive material and is in thermally conductive connection with the heat sink. The electromagnetic shielding device has a thermal contact section which is in thermally conductive connection with the circuit board and / or the components arranged on the circuit board, so that the electromagnetic shielding device ensures electromagnetic compatibility of the electronic assembly and conducts heat away from the circuit board and / or the electrical elements located on the circuit board and directs it towards the heat sink. The solid design made of a thermally conductive material ensures high thermal conductivity, which decisively depends on the cross section of the thermal conductor, so that the excess heat which is introduced into the electromagnetic shielding device by the thermal contact section is reliably conducted away. The broad design guarantees a sufficiently large electromagnetic shielding capacity.
[0005] Advantageous refinements of the electronic assembly according to the invention are listed in the dependent claims.
[0006] In a first preferred embodiment of the electronic assembly, the electromagnetic shielding device can lie against the circuit board, in particular in physical contact with the circuit board at multiple locations, with its main extension plane oriented parallel to the circuit board plane. Here, the electromagnetic shielding device can cover the circuit board to be shielded partially, preferably as large an area as possible, more preferably completely, wherein the electromagnetic shielding device and the circuit board can be centered on one another in area. Thus, the electromagnetic shielding device can block electromagnetic radiation generated by the operation of the circuit board and / or prevent electromagnetic radiation from the outside from acting on the circuit board. In other words, the shielding device and the circuit board are placed on top of one another with a largely equal area, so that the electromagnetic shielding device can cover the circuit board, preferably as large as possible. In this case, the circuit board and the shielding device can be roughly rectangular in shape, for example. This achieves in an advantageous manner that heat can be transferred from the circuit board into the shielding device through as large an area as possible.
[0007] In a further preferred embodiment of the electronic assembly, the thermal contact section of the electromagnetic shielding device can be designed, preferably, as broad, i.e. large-area, and can be thermally connected, preferably by means of a thermally conductive material, to the circuit board and / or to the elements located on the circuit board. The broad design of the thermal contact section makes it easy in an advantageous manner to establish a thermally conductive connection to the circuit board and / or to the electrical elements located on the circuit board, since fewer gaps have to be bridged. This is advantageous, since heat is transferred much better by thermal conduction than by thermal radiation. The use of a thermally conductive material is particularly advantageous since it fills possible gaps. Thus, even in combination with circuit boards which, for technical reasons, do not have a flat contact surface that is optimal for thermal conduction, a thermally conductive connection can be permanently ensured.
[0008] In a next preferred embodiment of the electronic assembly, the electromagnetic shielding device can be thermally connected to the heat sink by means of a thermally conductive screw connection, preferably by means of four thermally conductive screw connections. By means of the screw connections, a thermally conductive connection of the electromagnetic shielding device to the heat sink can be established particularly easily. The production of the screw connections is automatable and does not present any technical problems, so that the costs of establishing the connection can be kept very low, wherein automation also enables quality assurance and documentation of the screw connections in a simple manner. Four screw connections, for example arranged in the four corners of the electromagnetic shielding device, enable a particularly good and reliable connection of the electromagnetic shielding device to the heat sink, both in terms of mechanical stability and in terms of thermal conductivity.
[0009] In a further preferred embodiment of the electronic assembly, the electromagnetic shielding device can be connected to the circuit board by means of a threaded connection, preferably by means of a thermally conductive threaded connection, particularly preferably by means of a plurality of thermally conductive threaded connections. By means of the threaded connection, a thermally conductive connection of the electromagnetic shielding device to the circuit board can be established particularly easily, so that heat can also be conducted from the circuit board itself into the electromagnetic shielding device in an advantageous manner. The use of a plurality of threaded connections is particularly advantageous, since the position and the orientation of the electromagnetic shielding device relative to the circuit board are clearly defined in this case and heat can be conducted from the circuit board at a plurality of points and overall more heat can be conducted away by means of the plurality of threaded connections.
[0010] In a further preferred embodiment of the electronic assembly, the electromagnetic shielding device can be made of metal, preferably of a castable metal alloy, particularly preferably of a metal alloy suitable for die casting. A design made of metal is advantageous, since metal is easy to process, has a high degree of blocking of electromagnetic radiation and has a high thermal conductivity, which has particular uses and advantages for use as a combined electromagnetic shielding device and heat sink. A particularly advantageous production of the electromagnetic shielding device, in particular in large quantities, can be achieved by means of metal die casting, so that the electromagnetic shielding device is particularly preferably made of an alloy suitable for die casting. It is therefore also advantageous for the electromagnetic shielding device to be designed in a manner suitable for die casting, wherein, for example, geometries which would interfere with the production process, such as recesses, are avoided.
[0011] In a further preferred embodiment of the electronic assembly, the electronic assembly can comprise at least two circuit boards, a heat sink and an electromagnetic shielding device. Here, the electromagnetic shielding device can be thermally conductively connected to the first circuit board and / or to elements arranged on the first circuit board in a first thermal contact section along the main extension plane at a first side and thermally conductively connected to the second circuit board and / or to elements arranged on the second circuit board in a second thermal contact section along the main extension plane at a second side, preferably by means of thermally conductive material. In other words, the electronic assembly can be designed such that the electromagnetic shielding device is clamped between two circuit boards, wherein the electromagnetic shielding device is thermally conductively connected to the first circuit board at a first side and to the second circuit board at a second side. It is advantageous that both broad face sides of the electromagnetic shielding device are used for absorbing excess heat, so that the electromagnetic shielding device can cool both circuit boards and / or electrical elements arranged on both circuit boards. The electronic assembly can therefore advantageously be arranged in a close-packed manner. For example, a circuit board with a drive circuit for a power electronic bridge circuit can be arranged at the first side of the electromagnetic shielding device and a circuit board with a power electronic bridge circuit can be arranged at the second side of the electromagnetic shielding device.
[0012] Furthermore, the present application also comprises a controller, preferably a controller for the operation of a compressor, which comprises at least a housing and an electronic assembly according to the present application. By using an electronic assembly according to the present application, such a controller can be designed in a compact manner in an advantageous manner, wherein the specifications regarding electromagnetic compatibility are complied with and a reliable cooling of all electrical components and circuit boards is ensured. In particular in vehicles, the available installation space for the various components is very limited, which is the reason why a controller according to the present application is particularly advantageous for use in vehicles. BRIEF DESCRIPTION OF DRAWINGS
[0013] Further advantages, features and details of the present application result from the following description of preferred embodiments of the present application and with reference to the drawings.
[0014] Figure 1 An electronic assembly according to the present application with an electromagnetic shielding device according to the present application is shown in a perspective view; and
[0015] Figure 2 An electronic assembly according to the present application with an electromagnetic shielding device according to the present application is shown in a sectional view. DETAILED DESCRIPTION
[0016] The same elements, more precisely elements having the same function, are shown in the figures with the same reference signs.
[0017] Figure 1 An electronic assembly 1 according to the present application with an electromagnetic shielding device 2 according to the present application is shown in a perspective view. Further components of the electronic assembly 1 are a heat sink 3, a first circuit board 4 and a second circuit board 5. The electromagnetic shielding device 2 and the heat sink 3 are made of metal, which leads to particularly good thermal conductivity and good electromagnetic shielding properties. The electromagnetic shielding device 2 lies broadly against the first circuit board 4 and the second circuit board 5, i.e. the main extension plane H of the electromagnetic shielding device 2, the circuit board plane of the first circuit board 4 and the circuit board plane of the second circuit board 5 are oriented parallel to one another, and the electromagnetic shielding device 2 is located between the two circuit boards 4, 5. The electromagnetic shielding device 2 is in physical contact with the first circuit board 4 at multiple locations on the first side and with the second circuit board 5 at multiple locations on the second side. The electromagnetic shielding device 2 almost completely covers the first circuit board 4, so that electromagnetic radiation generated in the operation of components of the first circuit board does not influence components of the second circuit board 5 and / or other not shown components of the electronic assembly, and / or electromagnetic radiation generated at other locations does not influence components of the first circuit board 4 and thus its functionality.
[0018] The electromagnetic shielding device 2 is in heat-conducting connection with the heat sink via four heat-conducting threaded connections 6, wherein the second circuit board 5 is arranged between the electromagnetic shielding device 2 and the heat sink 3. The heat generated in the operation of the electronic assembly 1 is transferred from the electrical components and the circuit boards 4, 5 to the electromagnetic shielding device 2 and from there via the heat-conducting threaded connections 6 to the heat sink 3.
[0019] Figure 2 An electronic assembly 1 with an electromagnetic shielding device 2 according to the application is shown in a sectional view. Further components of the electronic assembly 1 are a heat sink 3, a first circuit board 4 and a second circuit board 5. The electromagnetic shielding device 2 is in heat-conducting connection with the heat sink via threaded connections 6, wherein the second circuit board 5 is arranged between the electromagnetic shielding device 2 and the heat sink 3. The first circuit board 4 is in heat-conducting connection with the electromagnetic shielding device 2 via heat-conducting threaded connections 7. The electromagnetic shielding device 2 forms a large-area flat first heat contact section 8 on a first side of its main extension plane, which is in heat-conducting connection with the first circuit board 4 via a heat-conducting material. This enables particularly good heat transfer from the first circuit board to the electromagnetic shielding device 2. A second heat contact section 9 is formed on a second side of the electromagnetic shielding device 2, which is in heat-conducting connection with the second circuit board 5. By means of this second heat contact section 9, the heat of the intermediate circuit capacitor 10 arranged on the second circuit board 5, in particular, is dissipated. In interaction with the heat sink 3, the heat of the intermediate circuit capacitor 10 can be advantageously conducted away from both sides of the second circuit board 5 via the electromagnetic shielding device. The heat is conducted from the electromagnetic shielding device 2 to the heat sink 3 via the heat-conducting threaded connections 6 and from the heat sink via a cooling fluid 11 out of the electronic assembly 1. Figure 2 The course of the heat conduction from the heat source 12 through the components to the cooling channel with the cooling fluid 11 is schematically shown with arrows.
Claims
1. Electronic assembly (1), in particular for use in a controller, preferably for use in a controller for the operation of a compressor, comprising at least: - a heat sink (3), - a circuit board (4) in which, in operation, residual heat is generated and / or on which components are arranged which, in operation, generate residual heat, and - an electromagnetic shielding device (2) for ensuring electromagnetic compatibility of the electronic assembly in operation, characterized in that the electromagnetic shielding device (2) is made of a thermally conductive material and is in thermally conductive connection with the heat sink (3) and has a heat contact section (8) in thermally conductive connection with the circuit board (4) and / or the components arranged on the circuit board, such that the electromagnetic shielding device (2) ensures electromagnetic compatibility of the electronic assembly and conducts heat away from the circuit board (4) and / or the electrical elements located on the circuit board to the heat sink (3).
2. Electronic assembly according to claim 1, characterized in that the electromagnetic shielding device (2) is applied to the circuit board (4) along a main extension plane oriented parallel to the circuit board plane of the circuit board (4), in particular in physical contact with the circuit board at multiple locations, wherein the electromagnetic shielding device (2) partially, preferably as large-area as possible, more preferably completely, covers the circuit board (4) to be shielded, wherein the electromagnetic shielding device (2) and the circuit board are centered to each other in the plane, such that the electromagnetic shielding device (2) blocks electromagnetic radiation generated by the operation of the circuit board (4) and / or prevents electromagnetic radiation from the outside from acting on the circuit board (4).
3. Electronic assembly according to claim 1 or 2, characterized in that the heat contact section (8) of the electromagnetic shielding device (2) is preferably designed to be extensive and is in thermally conductive connection with the circuit board (4) and / or the elements located on the circuit board, preferably by means of a thermally conductive material.
4. Electronic assembly according to any of the preceding claims, characterized in that the electromagnetic shielding device (2) is in thermally conductive connection with the heat sink by means of a thermally conductive screw connection (6), preferably by means of four thermally conductive screw connections (6).
5. Electronic assembly according to any of the preceding claims, characterized in that the electromagnetic shielding device (2) is connected to the circuit board (4) by means of a screw connection, preferably in thermally conductive connection with the circuit board (4) by means of a thermally conductive screw connection (7), in particular preferably by means of a plurality of thermally conductive screw connections (7).
6. Electronic assembly according to any of the preceding claims, characterized in that the electromagnetic shielding device (2) is made of metal, preferably of a castable metal alloy, in particular preferably of a metal alloy suitable for die casting.
7. Electronic assembly according to any of the preceding claims, characterized in that The electronic assembly (1) comprises at least two circuit boards (4, 5), a heat sink (3) and an electromagnetic shielding device (2), and the electromagnetic shielding device (2) is in a first thermal contact (8) at a first side along a main extension plane thermally conductively connected, preferably by a thermally conductive material, to a first circuit board (4) and / or to elements located on the first circuit board, and in a second thermal contact (9) at a second side along the main extension plane thermally conductively connected, preferably by a thermally conductive material, to a second circuit board (5) and / or to elements located on the second circuit board.
8. Controller, preferably a controller for the operation of a compressor, comprising at least a housing and an electronic assembly (1) according to any one of claims 1 to 7.