A detection device for circuit board production and manufacture

Abstract

The application relates to the technical field of circuit board detection devices, and discloses a detection device for circuit board production and manufacturing, which comprises a detection table, a support frame fixedly connected to the upper surface of the detection table, a pneumatic cylinder fixedly connected to the upper surface of the support frame, a I-shaped mounting frame fixedly connected to the driving end of the pneumatic cylinder, a probe module fixedly installed on the lower surface of the mounting frame, a bearing assembly installed on the upper surface of the detection table, wherein the mounting frame comprises an upper plate body and a lower plate body, the upper surface of the lower plate body is fixedly connected with a plurality of T-shaped limiting rods, the limiting rods penetrate through the upper plate body, and the surface of the limiting rods is sleeved with elastic pieces one. The pneumatic cylinder is stretched to drive the conductive probe to descend until the bottom end of the conductive probe abuts against the polishing layer, then the polishing layer can polish the bottom end of the conductive probe by sliding the cleaning plate, so that the oxide layer at the needle head of the conductive probe is removed, and the detection effect of the conductive probe can be long-effectively maintained.

Description

Technical Field

[0001] This invention relates to the field of circuit board testing equipment technology, specifically to a testing device for circuit board manufacturing. Background Technology

[0002] PCB, or Printed Circuit Board, is a crucial component in the electronics industry. After production, PCBs need to be inspected. The main reason for this inspection is that during the etching process, the dense lines on the PCB may stick together due to precision limitations of the equipment, leading to short circuits and malfunctions after electronic components are assembled.

[0003] The main principle of existing mass testing devices is to use a large number of pins on the contactor to correspond to the main input and output points distributed on the circuit board to detect whether there is a short circuit between the lines. This testing method greatly improves efficiency. However, due to the long-term use, the contact surface of the pins will have an increased oxide layer, which will cause poor contact during the testing process, resulting in the inability to conduct the circuit and thus causing the problem of false detection.

[0004] A search revealed an automatic circuit board inspection device disclosed in publication number CN118519012B. The device comprises a top frame including a stabilizing frame, a limit frame mounted at the bottom of the stabilizing frame, a synchronizer on the side of the limit frame, a roller mounted on the transmission part of the synchronizer, a rotating arm within the groove of the limit frame, and rollers mounted on both sides of the limit frame. The improved device drives the rollers via the synchronizer to drive the cleaning belt, causing it to reciprocate and polish the surface of the ejector pins. The ejector pins are nested within the gap between the mesh plate and the limit frame. The mesh plate has a perforated structure and a certain thickness to prevent surface damage. To prevent the mesh plate from collapsing, a rotating arm is installed inside the limit frame. The rotation of the rotating arm allows the ejector pins to elastically engage when they penetrate the mesh plate and contact the cleaning belt, preventing damage to the ejector pins and ensuring more even force distribution when pressing the circuit board.

[0005] The aforementioned application states that the grinding process cannot collect the grinding debris, resulting in debris residue that can easily cause poor contact or short circuits. Summary of the Invention

[0006] To address the shortcomings of existing technologies, this invention provides a testing device for circuit board manufacturing, which solves the problem that poor contact occurs during testing due to the accumulation of oxide layers on the contact surfaces of pins over long-term use, leading to the inability to conduct electricity and resulting in erroneous testing.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a testing device for circuit board manufacturing, comprising a testing platform, a support frame fixedly connected to the upper surface of the testing platform, a cylinder fixedly connected to the upper surface of the support frame, an I-shaped mounting bracket fixedly connected to the driving end of the cylinder, a probe module fixedly mounted on the lower surface of the mounting bracket, a bearing assembly mounted on the upper surface of the testing platform, the mounting bracket comprising an upper plate and a lower plate, a plurality of T-shaped limiting rods fixedly connected to the upper surface of the lower plate, the limiting rods penetrating the upper plate, an elastic element sleeved on the surface of the limiting rods, a cleaning assembly mounted below the probe module, the cleaning assembly comprising a cleaning chamber, the bottom end of the cleaning chamber fixedly connected to the upper surface of the testing platform, a cleaning plate penetrating and slidably connected to the side wall of the cleaning chamber, and a polishing layer fixedly provided on the upper surface of the cleaning plate.

[0008] By adopting the above technical solution: the polishing layer uses sandpaper, such as 800-1500 grit wet sandpaper or metallographic sandpaper. The cylinder extends and drives the conductive probe down until its bottom end touches the polishing layer. Then, by pushing the cleaning plate to slide, the polishing layer can polish the bottom end of the conductive probe.

[0009] Preferably, an elastic telescopic rod is fixedly connected to each of the two sides of the cleaning plate. The end of the elastic telescopic rod away from the cleaning plate is fixedly connected to the outer wall of the cleaning chamber. An extrusion protrusion is fixedly provided on the outer wall of the cleaning plate. An extrusion frame is provided above the extrusion protrusion. The top end of the extrusion frame is fixedly connected to the upper plate.

[0010] Preferably, the extrusion protrusion is a semi-circular protrusion, and the extrusion frame includes a frame body, the inner sidewall of which is fixedly connected with a trapezoidal protrusion layer.

[0011] Preferably, the cleaning plate includes an outer layer and an inner layer that are fixedly connected, the polishing layer is made of sandpaper, the inner layer is located inside the cleaning chamber, and the upper surface of the inner layer is provided with a slot.

[0012] Preferably, the inner layer includes a connecting layer and a rotating layer that are rotatably connected. A horizontal support platform is provided below the inner layer. The side wall of the horizontal support platform is fixedly connected to the inner wall of the cleaning chamber. A trapezoidal slope is fixedly provided on the outer wall of the horizontal support platform.

[0013] Preferably, the cleaning assembly further includes two elastic telescopic rods, the bottom end of which is hemispherical, and the top end of which is fixedly connected to the lower plate.

[0014] Preferably, the cleaning assembly further includes an airbag and a chip removal pipe. The airbag is fixedly installed on the upper surface of the lower plate. The surface of the lower plate has several inclined air outlets. The air nozzle of the airbag is fixedly connected to the air outlets. The chip removal pipe is fixedly installed on the lower surface of the cleaning chamber. A one-way valve is fixedly installed on the chip removal pipe, and a filter bag is fixedly installed at the bottom end of the chip removal pipe.

[0015] Preferably, the supporting component includes an electric slide table, which is fixedly installed on the upper surface of the testing table. The slider of the electric slide table is fixedly connected to a mounting base. A fixed platform and a sliding platform are respectively provided on both sides of the mounting base. The fixed platform is fixedly connected to the mounting base, and the sliding platform is slidably connected to the mounting base. A positioning template is fixedly provided on the same side of the fixed platform and the sliding platform. The surface of the positioning template is provided with a positioning groove for positioning the circuit board.

[0016] Preferably, the bearing assembly includes an L-shaped clamping plate and an electric pusher cylinder. The bottom end of the clamping plate is fixedly connected to the upper surface of the testing table. One side of the clamping plate protrudes outward to form an insert block. The electric pusher cylinder is fixedly installed on the lower side wall of the support frame, and the driving end of the electric pusher cylinder is made of ferromagnetic material that penetrates the cleaning chamber.

[0017] Preferably, the side wall of the sliding stage is provided with a slot, the upper surface of the mounting base is fixedly connected to a mounting plate, and the upper surface of the mounting plate is fixedly connected to a detection camera.

[0018] Working principle: The circuit board can be placed in the positioning slot manually or by an industrial robot, or removed after testing. The electric slide moves the mounting base back and forth laterally, causing the two positioning templates to move alternately to the bottom of the probe module. The cylinder extends and lowers the probe module, so that the conductive probes are aligned with the test points of the circuit board under test on the support component for testing. After testing, the positioning templates are removed from the support frame for easy removal and replacement of the circuit board. This allows for the alternating placement, testing, and removal of the circuit board, which helps to improve the testing efficiency of the circuit board.

[0019] This invention provides a testing device for circuit board manufacturing. It has the following advantages:

[0020] 1. This invention uses a cylinder to extend and lower a conductive probe until its bottom end touches the polishing layer. Then, the cleaning plate slides to polish the bottom end of the conductive probe, thereby removing the oxide layer at the probe tip and maintaining its detection effect for a long time.

[0021] 2. In this invention, the protruding layer descends and is squeezed and pushed by the inclined surface at its bottom, causing the squeezing protrusion to drive the cleaning plate to move laterally. The cleaning plate then drives the polishing layer to move and polish the bottom of the conductive probe, thus achieving an automatic polishing effect.

[0022] 3. In this invention, when the raised layer descends and the extrusion protrusion moves from the inclined surface of the raised layer to the vertical surface of its side, the second elastic telescopic rod automatically extends and inserts into the inside of the slot, thereby locking the cleaning plate. This prevents the cleaning plate from sliding under the action of the first elastic telescopic rod when the cylinder retracts after grinding and drives the probe module to rise and return, causing the grinding layer to grind the conductive probe again and resulting in over-grinding.

[0023] 4. When the upper plate of this invention descends, it can compress the airbag, causing the airflow inside the airbag to drive the debris generated by the grinding in the cleaning chamber into the filter bag, thereby achieving the effect of automatic cleaning and debris collection, and avoiding problems such as poor contact or short circuit caused by debris residue. Attached Figure Description

[0024] Figure 1 This is a perspective view of the present invention;

[0025] Figure 2 This is a schematic cross-sectional view of the support frame of the present invention;

[0026] Figure 3 This is a schematic diagram of the cleaning component structure of the present invention;

[0027] Figure 4 This is a schematic cross-sectional view of the cleaning chamber of the present invention;

[0028] Figure 5 This is a schematic diagram of the inner layer structure of the present invention;

[0029] Figure 6 This is a schematic diagram illustrating the use of the rotating layer of the present invention;

[0030] Figure 7 This is a schematic diagram of the air outlet structure of the present invention;

[0031] Figure 8 This is a schematic diagram of the outer layer and cleaning chamber structure of the present invention;

[0032] Figure 9 This is a schematic diagram of the load-bearing component structure of the present invention;

[0033] Figure 10 This is a schematic diagram of the sliding table of the present invention.

[0034] The components include: 1. Inspection table; 2. Support frame; 3. Cylinder; 4. Mounting frame; 41. Upper plate; 42. Lower plate; 43. Limiting rod; 44. Elastic element one; 5. Probe module; 6. Bearing assembly; 601. Electric slide; 602. Mounting base; 603. Fixed platform; 604. Sliding table; 605. Positioning template; 606. Clamping plate; 607. Insert block; 608. Electric push cylinder; 609. Slot; 610. Mounting plate; 611. Inspection camera; 7. Cleaning assembly. Components; 701, Cleaning chamber; 702, Cleaning plate; 703, Grinding layer; 705, Elastic telescopic rod one; 706, Extrusion protrusion; 707, Extrusion frame; 708, Horizontal support platform; 709, Slope; 710, Slot; 711, Elastic telescopic rod two; 712, Airbag; 713, Chip removal pipe; 7021, Outer layer; 7023, Inner layer; 7071, Frame; 7072, Protrusion layer; 70231, Connecting layer; 70232, Rotating layer; 8, Air outlet. Detailed Implementation

[0035] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0036] Please see the appendix Figure 1 -Appendix Figure 3 This invention provides a testing device for circuit board manufacturing, including a testing table 1. A support frame 2 is fixedly connected to the upper surface of the testing table 1, and a cylinder 3 is fixedly connected to the upper surface of the support frame 2. An I-shaped mounting bracket 4 is fixedly connected to the drive end of the cylinder 3. A probe module 5 is detachably mounted on the lower surface of the mounting bracket 4 by bolts. The probe module 5 can be prefabricated and replaced according to different circuit boards. A load-bearing component 6 is mounted on the upper surface of the testing table 1. The mounting bracket 4 includes an upper plate 41 and a lower plate 42. A number of T-shaped limiting rods 43 are fixedly connected to the upper surface of the lower plate 42. The limiting rods 43 penetrate the upper plate 41. An elastic element 44 is sleeved on the surface of the limiting rods 43. A cleaning assembly 7 is installed below the probe module 5. The cleaning assembly 7 includes a cleaning chamber 701. The bottom end of the cleaning chamber 701 is fixedly connected to the upper surface of the detection table 1. An L-shaped cleaning plate 702 is slidably connected through the lower side wall of the cleaning chamber 701. A polishing layer 703 is fixedly provided on the upper surface of the cleaning plate 702 by means of bolts or adhesives.

[0037] Specifically, the probe module 5 includes a probe mounting component and a conductive probe. The carrier component 6 is used to place and transport the circuit board. When the circuit board to be tested moves to the bottom of the probe module 5, the cylinder 3 extends and drives the probe module 5 to descend, so that the conductive probe is aligned with the test point of the circuit board to be tested on the carrier component 6 for detection. The elastic element 44 applies a downward elastic force to the lower plate 42, so that the upper plate 41 and the lower plate 42 slide open. The limiting rod 43 is used to prevent the lower plate 42 from falling off. The elastically telescopic mounting bracket 4 allows the conductive probe to elastically abut against the circuit board, which is suitable for conductive probes that are rigid probes. When the bottom of the conductive probe is oxidized after long-term use and needs to be polished, the cylinder 3 extends and drives the conductive probe to descend until its bottom abuts against the polishing layer 703. Then, by pushing the cleaning plate 702 to slide, the polishing layer 703 can polish the bottom of the conductive probe, thereby removing the oxide layer at the tip of the conductive probe and maintaining its detection effect for a long time.

[0038] Please see the appendix Figure 3 -Appendix Figure 6 The cleaning plate 702 is fixedly connected to two sides of an elastic telescopic rod 705. The end of the elastic telescopic rod 705 away from the cleaning plate 702 is fixedly connected to the outer wall of the cleaning chamber 701. The outer wall of the cleaning plate 702 is fixedly provided with a pressing protrusion 706. A pressing frame 707 is provided above the pressing protrusion 706. The top of the pressing frame 707 is fixedly connected to the upper plate 41. The pressing protrusion 706 is a semi-circular protrusion. The pressing frame 707 includes a frame body 7071. A trapezoidal protrusion layer 7072 is fixedly connected to the inner side wall of the frame body 7071. When the lower plate 42 abuts against the cleaning chamber 701, the bottom end of the conductive probe abuts against the polishing layer 703. A sealing gasket can be provided at the intersection of the cleaning chamber 701 and the lower plate 42 to improve the sealing performance.

[0039] Specifically, the cleaning plate 702 is elastically limited by the elastic telescopic rod 705. When the cylinder 3 extends and drives the mounting frame 4 to descend for polishing, the lower plate 42 is first driven to press tightly against the cleaning chamber 701 under the elastic force of the elastic element 44, thereby blocking the top opening of the cleaning chamber 701 and causing the bottom end of the conductive probe to press against the polishing layer 703. During subsequent extension, the upper plate 41 is pushed down, and the descent of the upper plate 41 drives the extrusion frame 707 to descend, causing the protrusion layer 7072 to descend and press and push the extrusion protrusion 706 through the inclined surface at its bottom end. The extrusion protrusion 706 causes the cleaning plate 702 to move laterally, and the cleaning plate 702 then drives the polishing layer 703 to move to polish the bottom end of the conductive probe, achieving the effect of automatic polishing.

[0040] Please see the appendix Figure 4 -Appendix Figure 6In this embodiment, another structure is provided in the above embodiment: the cleaning plate 702 includes an outer layer 7021 and an inner layer 7023 that are fixedly connected. The inner layer 7023 is located inside the cleaning chamber 701. The upper surface of the inner layer 7023 is provided with a slot 710. The cleaning assembly 7 also includes two elastic telescopic rods 711. The bottom end of the elastic telescopic rod 711 is hemispherical, and the top end of the elastic telescopic rod 711 is fixedly connected to the lower plate 42. The elastic telescopic rod 711 is located on the movement trajectory of the slot 710.

[0041] Specifically, when the lower plate 42 abuts against the cleaning chamber 701, the bottom end of the second elastic telescopic rod 711 abuts against the upper surface of the inner layer 7023, thereby generating elastic contraction. When the raised layer 7072 descends and the pressing protrusion 706 moves from the inclined surface of the raised layer 7072 to the vertical surface of its side, the slot 710 moves to the bottom of the second elastic telescopic rod 711. The second elastic telescopic rod 711 then automatically extends and inserts into the inside of the slot 710, thereby locking the cleaning plate 702. This prevents the cleaning plate 702 from sliding under the action of the first elastic telescopic rod 705 when the cylinder 3 retracts and drives the probe module 5 to rise and return after grinding, thus avoiding the problem of over-grinding. After the lower plate 42 rises and disengages from the cleaning chamber 701, the lower plate 42 drives the second elastic telescopic rod 711 to rise and automatically exit the slot 710, so that the cleaning plate 702 automatically resets under the action of the second elastic telescopic rod 711.

[0042] Please see the appendix Figure 5 -Appendix Figure 7 In this embodiment, another structure is provided in the above embodiment: the inner layer 7023 includes a connecting layer 70231 and a rotating layer 70232 that are rotatably connected. A horizontal support platform 708 is provided below the inner layer 7023. The side wall of the horizontal support platform 708 is fixedly connected to the inner wall of the cleaning chamber 701. A trapezoidal ramp 709 is fixedly provided on the outer side wall of the horizontal support platform 708.

[0043] Specifically, the rotating layer 70232 is supported by the horizontal support platform 708, so that the rotating layer 70232 and the polished layer 703 on its upper surface are kept horizontal, so that the polished layer 703 contacts the tip of the conductive probe. When the raised layer 7072 descends and the pressing protrusion 706 moves from the inclined surface of the raised layer 7072 to the vertical side of its side, the rotating layer 70232 moves from the horizontal support platform 708 to the ramp 709 and rotates downward under the action of gravity, so that the polished layer 703 no longer contacts the tip of the conductive probe, avoiding the presence of debris between the conductive probe and the polished layer 703, which would be inconvenient for subsequent cleaning. The rotating layer 70232 and the elastic telescopic rod 711 can be inserted into the slot 710 at the same time.

[0044] Please see the appendix Figure 6 -Appendix Figure 7 The cleaning assembly 7 also includes an airbag 712 and a chip removal pipe 713. The airbag 712 is fixedly installed on the upper surface of the lower plate 42. Several inclined air outlets 8 are opened on the surface of the lower plate 42. The air nozzle of the airbag 712 is fixedly connected to the air outlets 8. The chip removal pipe 713 is fixedly installed on the lower surface of the cleaning chamber 701. A one-way valve is fixedly installed on the chip removal pipe 713, and a filter bag is fixedly installed at the bottom end of the chip removal pipe 713. The one-way valve is used to control the airflow to flow out of the cleaning chamber 701 through the chip removal pipe 713 in one direction.

[0045] Specifically, when the cleaning plate 702 is pressed tightly against the cleaning chamber 701, it can seal the top opening of the cleaning chamber 701. At this time, when the upper plate 41 descends, it can squeeze the airbag 712, so that the airflow inside the airbag 712 is ejected from the air outlet 8 and enters the cleaning chamber 701. This drives the grinding debris generated in the cleaning chamber 701 to be discharged from the chip discharge pipe 713, and finally filtered and collected by the filter bag, achieving the effect of automatic cleaning and chip collection, avoiding the problem of poor contact or short circuit caused by chip residue.

[0046] Please see the appendix Figure 8 This embodiment provides another structure compared to the above embodiments: the outer layer 7021 consists of a vertical plate and a horizontally arranged rod. The plate is used to install the extrusion protrusion 706, while the rod is used to pass through the cleaning chamber 701 and connect to the inner layer 7023. A sealing ring is provided at the intersection of the cleaning chamber 701 and the rod to seal the intersection. Thus, when the device is idle for a long time, the lower plate 42 can be lowered by the cylinder 3 to block the cleaning chamber 701, thereby forming a relatively closed space inside the cleaning chamber 701, thus protecting the conductive probe as a whole, reducing the contact area with air, reducing the oxidation rate, and avoiding grinding of the conductive probe at this time. The cleaning plate 702 can be pushed into the cleaning chamber 701 in advance. Several limiting protrusions with a length longer than the minimum compression amplitude of the elastic element 44 can be provided on the upper surface of the lower plate 42, which are used to apply stable pressure to the lower plate 42 by resisting the limiting protrusions when the upper plate 41 is lowered.

[0047] Please see the appendix Figure 8 -Appendix Figure 9This embodiment provides another structure compared to the above embodiments: the supporting component 6 includes an electric slide 601, an L-shaped clamping plate 606, and an electric pusher cylinder 608. The electric slide 601 is fixedly installed on the upper surface of the detection table 1. The slider of the electric slide 601 is fixedly connected to the mounting base 602. The mounting base 602 is provided with a fixed platform 603 and a sliding platform 604 on both sides respectively. The fixed platform 603 is fixedly connected to the mounting base 602, and the sliding platform 604 is slidably connected to the mounting base 602. The same side of the fixed platform 603 and the sliding platform 604 are respectively detachably installed with positioning templates 605 by bolts. The positioning templates 605 are made of ferromagnetic material. The positioning templates 605 can be prefabricated and replaced according to different circuit boards. The surface of the positioning templates 605 is provided with positioning grooves for positioning circuit boards. The bottom end of the clamping plate 606 is fixedly connected to the upper surface of the detection table 1.

[0048] Specifically, the sliding stage 604 is limited by the clamping plate 606 to prevent it from sliding along the mounting base 602 during testing. The circuit board can be placed in the positioning slot manually or by an industrial robot, or it can be removed after testing. The mounting base 602 is moved back and forth laterally by the electric sliding stage 601, so that the two positioning templates 605 are moved alternately to the area directly below the probe module 5 for testing. After testing, the positioning templates 605 are removed from the support frame 2 to facilitate the removal and replacement of the circuit board. This allows for the alternating placement, testing, and removal of the circuit board, which helps to improve the testing efficiency of the circuit board.

[0049] Please see the appendix Figure 9 The card plate 606 has an outward protrusion forming an insert 607 on one side. The electric push cylinder 608 is fixedly installed on the lower side wall of the support frame 2, and the drive end of the electric push cylinder 608 is fixedly connected to an electromagnet and passes through the cleaning chamber 701. The side wall of the sliding table 604 has a slot 609.

[0050] Specifically, when the conductive probe needs to be polished, the electric slide 601 moves the positioning template 605 connected to the slide 604 to directly below the probe module 5. Then, the electric slide 601 moves the slide 604 away from the card plate 606, causing the slide 604 to be misaligned with the card plate 606. At this time, the electric push cylinder 608 extends and pushes the positioning template 605, causing the slide 604 to move longitudinally while simultaneously misaligning the positioning template 605 with the probe module 5. When the slide 604 slides to its maximum distance, the insertion block 607 aligns with the slot 609. Then, the electric slide 601 reverses its direction, moving the slide 604 closer to the card plate 606, causing the insertion block 607 to insert into the slot 609, thus allowing the conductive probe to be polished. The sliding stage 604 is temporarily limited to prevent accidental sliding during testing. Then, the electric push cylinder 608 retracts, allowing the conductive probe to descend for polishing. After polishing, the electric slide stage 601 runs again, moving the sliding stage 604 away from the card plate 606, thus misaligning the insert block 607 with the slot 609. Then, the electric push cylinder 608 extends to press against the positioning template 605, and the electromagnet attracts the positioning template 605. The electric push cylinder 608 then retracts, pulling the positioning template 605 and the sliding stage 604 back to their original positions. Finally, the electric slide stage 601 runs again, causing the rear of the sliding stage 604 to press against the inner wall of the card plate 606 for limiting. Then, the electric push cylinder 608 and the electromagnet are closed, achieving the effect of automatically opening the positioning template 605 for polishing.

[0051] Please see the appendix Figure 9 A mounting plate 610 is fixedly connected to the upper surface of the mounting base 602, and a detection camera 611 is fixedly connected to the upper surface of the mounting plate 610.

[0052] Specifically, when the mounting base 602 moves, it drives the detection camera 611 on the mounting plate 610 to move through the probe module 5. The detection camera 611 can detect the tip of the conductive probe. When the tip turns black, i.e., when an oxide layer is formed on the surface of the tip, the operator can watch the detection video of the detection camera 611 to help to detect and polish the tip with the oxide layer in time.

[0053] Workflow: The circuit board can be placed in the positioning slot manually or by an industrial robot, or it can be removed after testing. The electric slide 601 drives the mounting base 602 to move back and forth laterally, so that the two positioning templates 605 move alternately to the bottom of the probe module 5. The cylinder 3 extends and drives the probe module 5 to descend, so that the conductive probes are aligned with the test points of the circuit board under test on the carrier component 6 for testing. After testing, the positioning templates 605 are removed from the support frame 2 to pick up and replace the circuit board. This allows for the alternating placement, testing and removal of the circuit board, which helps to improve the testing efficiency of the circuit board.

[0054] When an oxide layer forms on the bottom of the conductive probe after prolonged use and requires polishing, the cylinder 3 extends, causing the mounting frame 4 to descend for polishing. First, the lower plate 42 is driven to press tightly against the cleaning chamber 701 under the elastic force of the elastic element 44, and the bottom of the conductive probe presses against the polishing layer 703. Then, during subsequent extension, the upper plate 41 is pushed down, and the descent of the upper plate 41 causes the extrusion frame 707 to descend, causing the protrusion layer 7072 to descend and be squeezed and pushed by the inclined surface at its bottom end, thus pushing the extrusion protrusion 706. The extrusion protrusion 706 causes the cleaning plate 702 to move laterally, and the cleaning plate 702 then causes the polishing layer 703 to move to polish the bottom of the conductive probe, achieving the effect of automatic polishing.

[0055] When the raised layer 7072 descends and the pressing protrusion 706 moves from the inclined surface of the raised layer 7072 to the vertical surface of its side, the slot 710 moves to below the second elastic telescopic rod 711. The second elastic telescopic rod 711 then automatically extends and inserts into the inside of the slot 710, thereby locking the cleaning plate 702. This prevents the cleaning plate 702 from sliding under the action of the first elastic telescopic rod 705 when the cylinder 3 retracts and drives the probe module 5 to rise and return after grinding, thus avoiding the problem of over-grinding. After the lower plate 42 rises and disengages from the cleaning chamber 701, the lower plate 42 drives the second elastic telescopic rod 711 to rise and automatically exit the slot 710, so that the cleaning plate 702 automatically resets under the action of the second elastic telescopic rod 711.

[0056] As the raised layer 7072 descends and the pressing protrusion 706 moves from the inclined surface of the raised layer 7072 to the vertical side of its side, the rotating layer 70232 moves from the horizontal support platform 708 to the ramp 709 and rotates downward under the action of gravity, so that the polishing layer 703 no longer contacts the tip of the conductive probe, avoiding the presence of debris between the conductive probe and the polishing layer 703. When the upper plate 41 descends, it can squeeze the airbag 712, causing the airflow inside the airbag 712 to be ejected from the air outlet 8 and enter the cleaning chamber 701, thereby driving the debris generated by polishing in the cleaning chamber 701 to be discharged from the chip discharge pipe 713. Finally, the debris is filtered and collected by the filter bag, achieving the effect of automatic cleaning and debris collection, avoiding the problem of poor contact or short circuit caused by debris residue.

[0057] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A testing device for circuit board manufacturing, comprising a testing table (1), a support frame (2) fixedly connected to the upper surface of the testing table (1), a cylinder (3) fixedly connected to the upper surface of the support frame (2), an I-shaped mounting bracket (4) fixedly connected to the driving end of the cylinder (3), and a probe module (5) fixedly mounted on the lower surface of the mounting bracket (4), characterized in that: The upper surface of the detection table (1) is provided with a bearing assembly (6), the mounting frame (4) comprises an upper plate body (41) and a lower plate body (42), the upper surface of the lower plate body (42) is fixedly connected with a plurality of T-shaped limiting rods (43), the limiting rods (43) penetrate through the upper plate body (41), the surface of the limiting rod (43) is provided with an elastic element one (44), the lower part of the probe module (5) is provided with a cleaning assembly (7), the cleaning assembly (7) comprises a cleaning chamber (701), the bottom end of the cleaning chamber (701) is fixedly connected with the upper surface of the detection table (1), the side wall of the cleaning chamber (701) penetrates and is slidably connected with a cleaning plate (702), the upper surface of the cleaning plate (702) is fixedly provided with a polishing layer (703) on one side inside the cleaning chamber (701), the cleaning plate (702) comprises a fixedly connected outer layer (7021) and an inner layer (7023), the polishing layer (703) is made of sandpaper, the inner layer (7023) is located inside the cleaning chamber (701), the upper surface of the inner layer (7023) is provided with a clamping groove (710), the inner layer (7023) comprises a rotatingly connected connecting layer (70231) and a rotating layer (70232), the lower part of the inner layer (7023) is provided with a horizontal support table (708), the side wall of the horizontal support table (708) is fixedly connected with the inner wall of the cleaning chamber (701), the outer side wall of the horizontal support table (708) is fixedly provided with a trapezoidal inclined slope (709), the cleaning assembly (7) further comprises an air bag (712) and a chip removal pipe (713), the air bag (712) is fixedly installed on the upper surface of the lower plate body (42), a plurality of inclined air outlets (8) are formed in the surface of the lower plate body (42), the air outlet (8) is fixedly connected with the air bag (712), the chip removal pipe (713) is fixedly installed on the lower surface of the cleaning chamber (701), a one-way valve is fixedly arranged on the chip removal pipe (713), and a filter bag is fixedly arranged at the bottom end of the chip removal pipe (713).

2. The detection device for the production of circuit boards according to claim 1, characterized in that The cleaning plate (702) is fixedly connected with two elastic extension rods one (705) on both sides of one side outside the cleaning chamber (701), one end of the elastic extension rod one (705) away from the cleaning plate (702) is fixedly connected with the outer wall of the cleaning chamber (701), the outer side wall of the cleaning plate (702) is fixedly provided with a pressing protrusion (706), the pressing protrusion (706) is provided with a pressing frame (707) above, and the top end of the pressing frame (707) is fixedly connected with the upper plate body (41).

3. The detection device for the production of circuit boards according to claim 2, characterized in that The pressing protrusion (706) is a semicircular protrusion, and the pressing frame (707) comprises a frame body (7071), and the inner side wall of the frame body (7071) is fixedly connected with a trapezoidal protrusion layer (7072).

4. The detection device for the production of circuit boards according to claim 1, characterized in that The cleaning assembly (7) further comprises two elastic extension rods two (711), the bottom end of the elastic extension rod two (711) is hemispherical, and the top end of the elastic extension rod two (711) is fixedly connected with the lower plate body (42).

5. The detection device for the production of circuit boards according to claim 1, characterized in that The bearing assembly (6) includes an electric sliding table (601), the electric sliding table (601) is fixedly installed on the upper surface of the detection table (1), the sliding block of the electric sliding table (601) is fixedly connected with a mounting seat (602), both sides of the mounting seat (602) are respectively provided with a fixed table (603) and a sliding table (604), the fixed table (603) is fixedly connected with the mounting seat (602), the sliding table (604) is slidably connected with the mounting seat (602), the same side of the fixed table (603) and the sliding table (604) is respectively fixedly provided with a positioning template (605), the positioning template (605) is made of ferromagnetic material, the surface of the positioning template (605) is provided with a positioning groove for positioning the circuit board.

6. The detection device for the production of circuit boards according to claim 5, characterized in that The bearing assembly (6) includes an L-shaped clamping plate (606) and an electric push cylinder (608), the bottom end of the clamping plate (606) is fixedly connected with the upper surface of the detection table (1), one side of the clamping plate (606) is outwardly protruded to form an insertion block (607), the electric push cylinder (608) is fixedly installed on the lower side wall of the support frame (2), and the driving end of the electric push cylinder (608) penetrates through the cleaning chamber (701), the side wall of the sliding table (604) is provided with an insertion slot (609), the upper surface of the mounting seat (602) is fixedly connected with a mounting plate (610), and the upper surface of the mounting plate (610) is fixedly connected with a detection camera (611).

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