Wafer transfer device for a photolithography machine

Abstract

The application provides a wafer conveying device of a photoetching machine, and relates to the technical field of semiconductor material production.The wafer conveying device comprises a docking seat, the docking seat is fixedly connected with a mechanical arm, a supporting frame is connected outside the docking seat, a hollow round seat is fixedly connected outside the supporting frame, six inner rotating blocks are installed around the inside of the hollow round seat, pull rods are connected outside the inner rotating blocks, and the pull rods are located inside the hollow round seat.Six negative pressure suction cups are connected outside the hollow round seat, the inner rotating blocks are connected with the negative pressure suction cups, and the negative pressure suction cups are connected with a negative pressure pump.The interval distance between the six negative pressure suction cups can be accurately changed according to the different specifications of wafer pieces, and the diversified requirements of various wafer pieces in the adsorption conveying process can be better met.The problem that the wafer conveying device configured by the existing photoetching machine has a large application limitation is solved, that is, the wafer conveying device is customized according to a single specification of wafer pieces in the design stage, the structure and size of the wafer conveying device are strictly adapted to the fixed conveying requirements of wafer pieces of a specific specification.

Description

Technical Field

[0001] This invention relates to the field of semiconductor material production technology, and in particular to a wafer transfer device for a lithography machine. Background Technology

[0002] Silicon is a gray, brittle, tetravalent nonmetallic chemical element; it makes up 27.8% of the Earth's crust, second only to oxygen in abundance, making it one of the most abundant elements in nature; silicon wafers, also known as crystal wafers, are made from silicon ingots. Through specialized processes, millions of transistors can be etched onto silicon wafers, which are widely used in the manufacture of integrated circuits; during the wafer production and processing, specialized transfer devices are required for transfer and transportation.

[0003] For example, the wafer transfer arm described in Chinese patent "CN105810620B Wafer Transfer Arm, Wafer Transfer Device and Wafer Holding Mechanism" includes a housing, a linkage mechanism, a movable abutment, and a carrier tray. The linkage mechanism includes a set of links, a set of pivots, and a set of S-shaped belts connected to the links. The linkage mechanism is coupled to the housing through the pivots. The S-shaped belts surround the pivots, allowing the pivots to rotate relative to each other. A protrusion structure is provided on the pivots. The movable abutment includes a stop block and a linkage push rod. The linkage push rod is disposed in the housing through a coupling part, and its first end abuts against the pivot. The stop block is disposed at the second end of the linkage push rod. When the pivot rotates, the protrusion structure abuts against the first end of the linkage push rod, pushing the linkage push rod to a first position, and causing the stop block to contact the wafer on the carrier tray.

[0004] Currently, the wafer transport devices configured in lithography machines are designed and manufactured in a customized manner based on a single specification of wafer. Their structure and size are strictly adapted to the fixed transport requirements of wafers of a specific specification. When it is necessary to produce wafers of other specifications, the existing wafer transport devices are difficult to handle and often need to be customized again. This undoubtedly increases project costs and time cycle, and has a large application limitation. Summary of the Invention

[0005] This invention relates to a wafer transport device for a lithography machine. The device allows for the rotation adjustment of an inner rotating block according to different wafer specifications. When the inner rotating block rotates, it drives the connected negative pressure suction cups to move synchronously, thereby precisely changing the spacing between the six negative pressure suction cups and ensuring that the suction cups are tightly attached to the wafer surface. The negative pressure suction force generated by the suction cups achieves stable fixation of the wafer, thus better meeting the diverse needs of various wafer specifications during the adsorption and transport process.

[0006] In a first aspect, the present invention provides a wafer transfer device for a lithography machine, specifically comprising: a docking seat, a support frame, a hollow circular seat, inner rotating blocks, negative pressure suction cups, a linkage rotating ring, a pull rod, an adjustment outer ring, bolts, and a movable stop sleeve; the docking seat is fixedly connected to a robotic arm, the support frame is externally connected to the docking seat, and the hollow circular seat is fixedly connected externally to the support frame; six inner rotating blocks are mounted around the hollow circular seat, and pull rods are externally connected to the inner rotating blocks, with the pull rods located inside the hollow circular seat; six negative pressure suction cups are externally connected to the hollow circular seat, the inner rotating blocks are connected to the negative pressure suction cups, and the negative pressure suction cups are connected to a negative pressure pump; a linkage rotating ring is internally connected to the hollow circular seat, and the linkage rotating ring is connected to the pull rod; an adjustment outer ring is externally connected to the hollow circular seat, and the adjustment outer ring is connected to the linkage rotating ring, with bolts internally connected to the adjustment outer ring; a movable stop sleeve is fitted externally to the docking seat, and the movable stop sleeve is connected to the support frame.

[0007] Furthermore, the hollow circular seat is provided with arc-shaped sliding holes on both sides, the inner rotating block is rotatably connected to the hollow circular seat, and the inner rotating block is provided with a through hole, the two ends of which are connected to the arc-shaped sliding holes provided in the hollow circular seat.

[0008] Furthermore, a straight tube is provided on the outside of the negative pressure suction cup. The straight tube is connected to the negative pressure pump through a pipeline. The straight tube passes through the through hole provided in the inner rotating block. The end of the straight tube is slidably connected in the arc-shaped sliding hole. The inner rotating block can be rotated and adjusted according to the different specifications of the wafer. The inner rotating block drives the negative pressure suction cup to move and adjust, changing the spacing between the six negative pressure suction cups, so that the negative pressure suction cup can contact the wafer.

[0009] Furthermore, the linkage rotating ring is rotatably connected inside the hollow circular base. One end of the pull rod is rotatably connected to the linkage rotating ring, and the other end of the pull rod is rotatably connected to the inner rotating block. The linkage rotating ring is connected to six inner rotating blocks through the pull rod. By adjusting the outer ring, the linkage rotating ring is driven to rotate. The linkage rotating ring drives the six inner rotating blocks to rotate synchronously through the pull rod.

[0010] Furthermore, the hollow circular seat is provided with a movable side hole on the outside, and a movable connecting block is provided on the outside of the linkage rotating ring. The movable connecting block is slidably connected to the movable side hole provided in the hollow circular seat. The movable connecting block is fixedly connected to the regulating outer ring. The regulating outer ring is provided with a screw hole inside. A bolt is threadedly connected to the screw hole provided in the regulating outer ring. The end of the bolt contacts the hollow circular seat. Tightening the bolt makes the end of the bolt contact the outer wall of the hollow circular seat. The regulating outer ring is fixed by the bolt, preventing the regulating outer ring from rotating.

[0011] Furthermore, the end of the docking seat is inserted into the support frame, and a docking block is arranged around the outside of the docking seat. A docking slot is arranged around the outside of the support frame. The docking slot is L-shaped, and the docking block is connected to the docking slot provided in the support frame. The docking seat and the support frame are connected together by the insertion and rotation locking method, making it easier to assemble and disassemble the support frame and the docking seat.

[0012] Furthermore, the movable stop sleeve is slidably connected to the outside of the docking seat. A guide groove is provided around the outside of the docking seat, and a limit block is provided around the outside of the movable stop sleeve. The limit block is slidably connected to the guide groove provided in the docking seat, and the end of the limit block is inserted into the slot of the docking slot. The limit block and the guide groove slide together to guide the movable stop sleeve and prevent the movable stop sleeve from twisting.

[0013] Furthermore, a spring is fitted on the outside of the docking seat. One end of the spring contacts the docking seat, and the other end contacts the movable stop sleeve. When the docking seat is connected to the support frame, the docking block is at the innermost end of the docking slot. The position of the slot opening is aligned with the position of the limiting plug. The movable stop sleeve moves and resets under the influence of the spring force, so that the end of the limiting plug is inserted into the slot of the docking slot. The movable stop sleeve locks and fixes the support frame, preventing the support frame from rotating in the opposite direction.

[0014] This invention provides a wafer transport device for a lithography machine, which has the following advantages:

[0015] When in use, the inner rotating block can be rotated and adjusted according to the different specifications of the wafers. The inner rotating block drives the negative pressure suction cups to move and adjust, changing the spacing between the six negative pressure suction cups so that the negative pressure suction cups can contact the wafers and adsorb and fix the wafers through the negative pressure suction cups, which is better suited to the adsorption and transportation needs of wafers of different specifications.

[0016] In addition, by adjusting the outer ring, the linkage ring is driven to rotate. The linkage ring drives the six inner rotating blocks to rotate synchronously through the pull rod, ensuring the synchronicity of the movement adjustment of the six negative pressure suction cups. After the negative pressure suction cups are adjusted to the required spacing, the bolts are tightened so that the ends of the bolts contact the outer wall of the hollow round seat. The outer ring is fixed by the bolts to prevent the outer ring from rotating, thus ensuring the stability of the state of the negative pressure suction cups.

[0017] In addition, the docking seat and the support frame are connected by a plug-in and rotating snap-fit ​​method, which makes it easier to disassemble and assemble the support frame and the docking seat. It can be adapted and replaced according to different wafer specifications to meet the needs of wafer transfer of different specifications. The limiting plug and the guide groove slide together to guide the movable stop sleeve, prevent the movable stop sleeve from twisting, and the spring provides an elastic reset effect for the movable stop sleeve.

[0018] Furthermore, when the docking seat and support frame are connected, the docking block is at the innermost end of the docking slot, and the position of the slot opening is aligned with the position of the limiting block. The movable stop sleeve moves and resets under the influence of the spring force, allowing the end of the limiting block to insert into the slot of the docking slot. The movable stop sleeve locks and fixes the support frame, preventing the support frame from rotating in the opposite direction and ensuring the firmness of the connection between the docking seat and the support frame. When it is necessary to adapt and replace according to the wafer specifications, the movable stop sleeve is moved in the opposite direction. The spring is compressed under the influence of the thrust applied by the movable stop sleeve, and the end of the limiting block separates from the slot of the docking slot. The support frame is unlocked, and the support frame can be rotated in the opposite direction to separate the support frame from the docking seat. The appropriate one can then be selected for adaptation and replacement, making the operation simpler and faster.

[0019] Other advantages, objectives and features of the present invention will become apparent in part from the following description, and in part from those skilled in the art through study and practice of the invention. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings of the embodiments will be briefly described below.

[0021] The accompanying drawings described below are only related to some embodiments of the invention and are not intended to limit the invention.

[0022] In the attached diagram:

[0023] Figure 1 A schematic diagram of the overall top-axis structure of this application is shown;

[0024] Figure 2 A schematic diagram of the overall bottom axis structure of this application is shown;

[0025] Figure 3 A schematic diagram of the disassembled structure of the docking seat and support frame of this application is shown;

[0026] Figure 4 This diagram illustrates the disassembled structure of the docking seat and the movable stop sleeve of this application.

[0027] Figure 5 A schematic diagram of the connection structure between the support frame and the hollow circular seat of this application is shown;

[0028] Figure 6 This diagram illustrates the linkage rotation and control outer ring split structure of this application;

[0029] Figure 7 This paper shows a schematic diagram of the disassembled structure of the hollow circular seat and the negative pressure suction cup of this application;

[0030] Figure 8 A schematic diagram of the internal cross-sectional structure of the hollow circular seat of this application is shown.

[0031] Figure label:

[0032] 1. Docking seat; 101. Guide groove; 102. Docking block; 2. Support frame; 201. Docking slot; 3. Hollow round seat; 301. Arc-shaped sliding hole; 302. Movable side hole; 4. Inner rotating block; 401. Through hole; 5. Negative pressure suction cup; 501. Straight tube; 6. Linkage rotating ring; 601. Movable connecting block; 7. Pull rod; 8. Adjustment outer ring; 801. Screw hole; 9. Bolt; 10. Movable stop sleeve; 1001. Limiting insert; 11. Spring. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0034] Please refer to Figures 1 to 8 Example 1:

[0035] This invention proposes a wafer transfer device for a lithography machine, comprising: a docking seat 1, a support frame 2, a hollow circular seat 3, inner rotating blocks 4, negative pressure suction cups 5, a linkage rotating ring 6, a pull rod 7, an adjustment outer ring 8, bolts 9, and a movable stop sleeve 10; the docking seat 1 is fixedly connected to a robotic arm, the support frame 2 is externally connected to the docking seat 1, and the hollow circular seat 3 is fixedly connected externally to the support frame 2; six inner rotating blocks 4 are installed around the inside of the hollow circular seat 3, and pull rods 7 are externally connected to the inner rotating blocks 4, with the pull rods 7 located inside the hollow circular seat 3; six negative pressure suction cups 5 are externally connected to the hollow circular seat 3, the inner rotating blocks 4 are connected to the negative pressure suction cups 5, and the negative pressure suction cups 5 are connected to a negative pressure pump; the linkage rotating ring 6 is internally connected to the hollow circular seat 3, and the linkage rotating ring 6 is connected to the pull rods 7; an adjustment outer ring 8 is externally connected to the hollow circular seat 3, and the adjustment outer ring 8 is connected to the linkage rotating ring 6, with bolts 9 internally connected to the adjustment outer ring 8; the docking seat 1 is externally fitted with... A movable stop sleeve 10 is connected to the support frame 2. A hollow circular base 3 has arc-shaped sliding holes 301 arranged around its opposite sides. An inner rotating block 4 is rotatably connected to the hollow circular base 3. A through hole 401 is provided inside the inner rotating block 4, with both ends of the through hole 401 communicating with the arc-shaped sliding holes 301 provided in the hollow circular base 3. A straight tube 501 is provided outside the negative pressure suction cup 5. The straight tube 501 is connected to the negative pressure pump through a pipeline. The straight tube 501 passes through the through hole 401 provided in the inner rotating block 4, and its end is slidably connected to the arc-shaped sliding hole 301. The inner rotating block 4 can be rotated and adjusted according to the different specifications of the wafers. The inner rotating block 4 drives the negative pressure suction cup 5 to move and adjust, changing the spacing between the six negative pressure suction cups 5, so that the negative pressure suction cups 5 can contact the wafers. The wafers are adsorbed and fixed by the negative pressure suction cups 5, better meeting the adsorption and transfer needs of wafers of different specifications.

[0036] In this embodiment, the linkage rotating ring 6 is rotatably connected to the hollow round seat 3. One end of the pull rod 7 is rotatably connected to the linkage rotating ring 6, and the other end of the pull rod 7 is rotatably connected to the inner rotating block 4. The linkage rotating ring 6 is connected to the six inner rotating blocks 4 through the pull rod 7. The hollow round seat 3 is provided with a movable side hole 302 on the outside. The linkage rotating ring 6 is provided with a movable connecting block 601 on the outside. The movable connecting block 601 is slidably connected to the movable side hole 302 provided in the hollow round seat 3. The movable connecting block 601 is fixedly connected to the regulating outer ring 8. The regulating outer ring 8 is provided with a screw hole 801 inside. The bolt 9 is threadedly connected to the screw hole 801 provided in the regulating outer ring 8. The end of the bolt 9 is in contact with the hollow round seat 3.

[0037] Using the above technical solution, the outer ring 8 is adjusted to drive the linkage ring 6 to rotate. The linkage ring 6 drives the six inner rotating blocks 4 to rotate synchronously through the pull rod 7, ensuring the synchronicity of the movement adjustment of the six negative pressure suction cups 5. After the negative pressure suction cups 5 are adjusted to the required spacing, the bolts 9 are tightened so that the ends of the bolts 9 contact the outer wall of the hollow round seat 3. The outer ring 8 is fixed by the bolts 9 to prevent the outer ring 8 from rotating, thus ensuring the stability of the state of the negative pressure suction cups 5.

[0038] In Embodiment 2, based on Embodiment 1, the end of the docking seat 1 is inserted into the support frame 2. The docking seat 1 is surrounded by a docking block 102, and the support frame 2 is surrounded by a docking groove 201. The docking groove 201 is L-shaped, and the docking block 102 is connected to the docking groove 201 provided in the support frame 2.

[0039] By adopting the above technical solution, the docking seat 1 and the support frame 2 are connected together through a plug-in and rotating snap-fit ​​method, making it easier to disassemble and assemble the support frame 2 and the docking seat 1. It can be adapted and replaced according to different wafer specifications to meet the needs of wafer transfer of different specifications.

[0040] In Example 3, based on Examples 1 and 2, the movable stop sleeve 10 is slidably connected to the outside of the docking seat 1. The docking seat 1 is surrounded by a guide groove 101. The movable stop sleeve 10 is surrounded by a limit block 1001. The limit block 1001 is slidably connected to the guide groove 101 provided in the docking seat 1. The end of the limit block 1001 is inserted into the slot of the docking slot 201. A spring 11 is fitted on the outside of the docking seat 1. One end of the spring 11 contacts the docking seat 1, and the other end of the spring 11 contacts the movable stop sleeve 10.

[0041] Using the above technical solution, the limiting insert 1001 slides with the guide groove 101, guiding the movable stop sleeve 10 and preventing it from twisting. The spring 11 also provides an elastic reset for the movable stop sleeve 10. When the docking seat 1 is connected to the support frame 2, the docking block 102 is at the innermost end of the docking groove 201, and the opening of the docking groove 201 is aligned with the position of the limiting insert 1001. The movable stop sleeve 10 moves and resets under the influence of the spring 11, causing the end of the limiting insert 1001 to insert into the docking groove 201. Inside the slot, the support frame 2 is locked and fixed by the movable stop sleeve 10 to prevent the support frame 2 from rotating in the opposite direction and to ensure the firmness of the connection between the docking seat 1 and the support frame 2. When it is necessary to adapt and replace according to the wafer specifications, the movable stop sleeve 10 is moved in the opposite direction. The spring 11 is compressed under the influence of the thrust applied by the movable stop sleeve 10. The end of the limit plug 1001 separates from the slot of the docking slot 201. The support frame 2 is unlocked, and the support frame 2 can be rotated in the opposite direction to separate the support frame 2 from the docking seat 1. The appropriate one can be selected for adaptation and replacement, making the operation simpler and faster.

[0042] The working principle of this embodiment is as follows: First, according to the different specifications of the wafers, appropriate ones are selected for adaptation, and the docking seat 1 and the support frame 2 are connected together by a plug-in and rotating snap-fit ​​method. The docking block 102 is located at the innermost end of the docking slot 201, and the position of the slot opening of the docking slot 201 is aligned with the position of the limiting plug 1001. The movable stop sleeve 10 moves and resets under the influence of the spring 11, so that the end of the limiting plug 1001 is inserted into the slot opening of the docking slot 201. The movable stop sleeve 10 locks and fixes the support frame 2 to prevent the support frame 2 from rotating in the opposite direction. Next, the outer ring 8 is adjusted to drive the linkage rotating ring 6 to rotate. The linkage rotating ring 6 drives the six inner rotating blocks 4 to rotate synchronously through the pull rod 7. The inner rotating blocks 4 drive the negative pressure suction cups 5 to move and adjust, changing the distance between the six negative pressure suction cups 5. Next, tighten bolt 9 so that the end of bolt 9 contacts the outer wall of hollow round seat 3, and fix the regulating outer ring 8 by bolt 9 to prevent the regulating outer ring 8 from rotating; the negative pressure suction cup 5 can contact the wafer, and the wafer can be attracted and fixed by the negative pressure suction cup 5, so that the wafer can be moved by the robotic arm to achieve the effect of wafer transfer without damage; when it is necessary to produce and transfer wafers of other specifications, the movable stop sleeve 10 is moved in the opposite direction, and the spring 11 is compressed under the influence of the thrust applied by the movable stop sleeve 10, the end of the limit plug 1001 separates from the groove of the docking slot 201, the support frame 2 is unlocked, and the support frame 2 can be rotated in the opposite direction to separate the support frame 2 from the docking seat 1 for adaptation and replacement, making the operation simpler and faster, and enabling faster wafer production and transfer operations.

[0043] The following points should be noted in this article:

[0044] 1. The accompanying drawings of the embodiments of the present invention only involve the structures involved in the embodiments of the present invention; other structures can refer to general designs.

[0045] 2. Where there is no conflict, the embodiments of the present invention and the features thereof can be combined with each other to obtain new embodiments.

[0046] The above are merely specific embodiments of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A wafer handling device for a photolithography machine, comprising: The utility model provides a kind of vacuum adsorption device for mechanical arm, including butt joint seat, support frame, hollow round seat, inner rotating block, negative pressure chuck, linkage rotating ring, pull rod, control outer ring, bolt and movable stop sleeve;Its characterized in that, the butt joint seat is fixedly connected with mechanical arm, and support frame is connected outside butt joint seat, and hollow round seat is fixedly connected outside support frame;Six inner rotating blocks are installed around inside hollow round seat, and pull rod is connected outside inner rotating block, and pull rod is located inside hollow round seat;Six negative pressure chucks are connected outside hollow round seat, and inner rotating block is connected with negative pressure chuck, and negative pressure chuck is connected with negative pressure pump;Linkage rotating ring is connected inside hollow round seat, and linkage rotating ring is connected with pull rod;Control outer ring is connected outside hollow round seat, and control outer ring is connected with linkage rotating ring, and bolt is connected inside control outer ring;Movable stop sleeve is sleeved outside butt joint seat, and movable stop sleeve is connected with support frame.

2. A wafer handling device for a photolithography machine according to claim 1, wherein, Arc-shaped sliding hole is arranged around opposite sides of the hollow round seat, the inner rotating block is rotatably connected with the hollow round seat, a through hole is arranged in the inner rotating block, and the through hole is in communication with the arc-shaped sliding hole arranged on the hollow round seat.

3. A wafer handling device for a photolithography machine as defined in claim 2, wherein A straight pipe is arranged outside the negative pressure chuck, the straight pipe is in communication with the negative pressure pump through a pipeline, the straight pipe penetrates the through hole arranged in the inner rotating block, and the end of the straight pipe is slidably connected in the arc-shaped sliding hole.

4. The wafer handling apparatus of claim 1 wherein, The linkage rotating ring is rotatably connected in the hollow round seat, one end of the pull rod is rotatably connected with the linkage rotating ring, the other end of the pull rod is rotatably connected with the inner rotating block, and the linkage rotating ring is connected with the six inner rotating blocks through the pull rod.

5. The wafer handling apparatus of claim 1 wherein, An active side hole is arranged outside the hollow round seat, an active connecting block is arranged outside the linkage rotating ring, the active connecting block is slidably connected in the active side hole arranged in the hollow round seat, the active connecting block is fixedly connected with the control outer ring, a screw hole is arranged in the control outer ring, the bolt is threadedly connected in the screw hole arranged in the control outer ring, and the end of the bolt is in contact with the hollow round seat.

6. A wafer handling device for a photolithography machine as defined in claim 1, wherein, The end of the butt joint seat is inserted in the support frame, butt joint clamping blocks are arranged around the outside of the butt joint seat, butt joint clamping grooves are arranged around the outside of the support frame, the butt joint clamping grooves are L-shaped, and the butt joint clamping blocks are connected in the butt joint clamping grooves arranged in the support frame.

7. A wafer handling device for a photolithography machine as defined in claim 6, wherein The movable stop sleeve is slidably connected outside the butt joint seat, guide grooves are arranged around the outside of the butt joint seat, limit insertion blocks are arranged around the outside of the movable stop sleeve, the limit insertion blocks are slidably connected in the guide grooves arranged in the butt joint seat, and the end of the limit insertion blocks is inserted in the notch of the butt joint clamping groove.

8. The wafer handling apparatus of claim 1 wherein, A spring is sleeved outside the butt joint seat, one end of the spring is in contact with the butt joint seat, and the other end of the spring is in contact with the movable stop sleeve.

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