Stamping manufacturing method of radiators, heat dissipation method, stamping machine, equipment and medium

Abstract

The application discloses a stamping manufacturing method of a radiator, a radiating method, a stamping machine, electronic equipment and a medium, and relates to the technical field of radiating. The method comprises the following steps: placing a material to be stamped in a stamping cavity of a lower die; driving a stamping seat to descend, so that the lower die and an upper die cooperate to stamp the material to be stamped, and a radiating piece is formed; driving the stamping seat to ascend and reset, and making the upper die separate from the radiating piece through a material knocking plate; taking the radiating piece out of the lower die, cutting off the overflowed waste material from the surface of the radiating piece, and obtaining a radiating block; obtaining a plurality of radiating blocks, connecting a radiating plate between any two adjacent radiating blocks, and obtaining a ring-shaped radiator; the inside of the radiating plate is provided with a radiating channel, one end of the radiating channel is communicated with a first radiating groove of one of the radiating blocks, and the other end of the radiating channel is communicated with a second radiating groove of the other radiating block. The method can radiate a plurality of heat generating pieces at the same time, so that the radiating efficiency and the radiating effect are improved.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology, and in particular to a stamping manufacturing method for a heat sink, a heat dissipation method, a stamping machine, electronic equipment, and a medium. Background Technology

[0002] In some complex power systems, there are many high-power electronic components. During operation, these components generate a lot of heat, which may lead to spontaneous combustion if not dissipated in time. Currently, cooling is mainly achieved through coolant circulation systems or air-cooling systems. However, these methods only address the overall system cooling and are not effective in dissipating heat from individual chips that generate significant amounts of heat. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a stamping manufacturing method for a heat sink, a heat dissipation method, a stamping machine, electronic equipment, and a medium, which can effectively dissipate heat from heat-generating devices.

[0004] In a first aspect, a stamping method for manufacturing a radiator according to an embodiment of the present invention is applied to a stamping machine, the stamping machine including a base and a stamping seat located above the base, the base being provided with a lower die, the stamping seat being provided with a blanking plate and an upper die corresponding to the lower die, the lower die being provided with a stamping cavity, and a first step groove and a second step groove being sequentially provided above the stamping cavity, an overflow groove being formed between the first step groove and the second step groove; the method includes:

[0005] The material to be stamped is placed in the lower die;

[0006] The stamping base is driven to descend, so that the lower die and the upper die cooperate to stamp the material to be stamped to form a heat sink; the heat sink includes a first heat sink and a second heat sink that are interconnected, and overflow waste is formed on the surface of the heat sink; the first heat sink and the second heat sink are located in the stamping cavity, and the overflow waste is located at the first step groove, the overflow groove and the second step groove.

[0007] The stamping base is driven to rise and reset, and the upper die is disengaged from the heat sink via the ejector plate;

[0008] The heat sink is removed from the lower mold, and the overflow waste is cut off from the surface of the heat sink to obtain a heat sink block.

[0009] A plurality of heat sinks are obtained, and a heat sink plate is connected between any two adjacent heat sinks to obtain an annular heat sink; the heat sink plate is provided with a heat dissipation channel inside, one end of the heat dissipation channel is connected to the first heat dissipation groove of one of the heat sinks, and the other end of the heat dissipation channel is connected to the second heat dissipation groove of another heat sink.

[0010] According to some embodiments of the present invention, a fixing plate is provided at the bottom of the stamping base, the fixing plate has a first through hole, the upper die passes through the first through hole, the fixing plate is also provided with a limiting hole and a guide post, the ejector plate is fixed at the bottom of the fixing plate through the limiting hole, the ejector plate has a first guide hole corresponding to the guide post, the guide post passes through the first guide hole, the ejector plate also has a second through hole corresponding to the first through hole, and the upper die passes through the second through hole.

[0011] According to some embodiments of the present invention, the bottom of the upper mold is provided with a first stamping post and a second stamping post corresponding to the first heat dissipation groove and the second heat dissipation groove, and the lower mold is provided with a second guide hole corresponding to the guide post;

[0012] The method of driving the stamping base to descend, causing the lower die and the upper die to cooperate in stamping the material to be stamped, forming a heat dissipation component, includes:

[0013] Drive the stamping seat down to the surface of the lower die, so that the guide post enters the second guide hole;

[0014] When the guide post enters the second guide hole, the material to be stamped is stamped by the upper die, the first stamping post and the second stamping post to form the heat dissipation component having the first heat dissipation groove and the second heat dissipation groove;

[0015] During the stamping process, the overflow material generated during stamping is transferred to the surface of the heat sink through the first stepped groove, the overflow groove, and the second stepped groove to form the overflow waste.

[0016] According to some embodiments of the present invention, the base is provided with a liftable top post, and the lower die is provided with a third through hole adapted to the top post, the third through hole communicating with the stamping cavity;

[0017] The step of removing the heat sink from the lower mold includes:

[0018] After the stamping is completed, the pusher column is driven to rise and enter the stamping chamber through the third through hole, pushing the heat sink out of the stamping chamber;

[0019] After the heat sink is removed from the lower mold, the top post is driven to descend and reset.

[0020] Secondly, the heat dissipation method according to an embodiment of the present invention includes the following steps:

[0021] A radiator is obtained, which is manufactured by the stamping method of the radiator as described in the first aspect embodiment;

[0022] A first heating element is attached to the inner wall of each of the heat dissipation plates of the radiator, and a second heating element is attached to the outer wall of each of the heat dissipation plates of the radiator.

[0023] Coolant is introduced into the first heat dissipation groove of each heat dissipation block of the radiator, and the coolant flows out from the second heat dissipation groove of the adjacent heat dissipation block;

[0024] The coolant circulates within the heat dissipation channels of each heat sink to dissipate heat from the first and second heat sink components.

[0025] According to some embodiments of the present invention, the step of introducing coolant into the first heat dissipation groove of each heat dissipation block of the radiator and allowing the coolant to flow out from the second heat dissipation groove of the adjacent heat dissipation block further includes:

[0026] A diversion valve is installed in the heat dissipation channel to divide the heat dissipation channel into a first channel and a second channel. The first channel is close to the inner wall of the heat dissipation plate, and the second channel is close to the outer wall of the heat dissipation plate.

[0027] The first temperature of the first heating element on the inner sidewall of each heat sink and the second temperature of the second heating element on the outer sidewall of each heat sink are obtained.

[0028] The flow rate of coolant in the first channel and the second channel is adjusted by the flow divider valve based on the difference between the first temperature and the second temperature.

[0029] According to some embodiments of the present invention, the step of introducing coolant into the first heat dissipation groove of each heat dissipation block of the radiator and allowing the coolant to flow out from the second heat dissipation groove of the adjacent heat dissipation block further includes:

[0030] The first temperature of the first heating element on the inner sidewall of each heat sink and the second temperature of the second heating element on the outer sidewall of each heat sink are obtained.

[0031] Determine the heat dissipation requirements based on the first temperature and the second temperature;

[0032] Based on the heat dissipation requirements, determine the total flow rate of the coolant in the corresponding heat sink.

[0033] Thirdly, according to an embodiment of the present invention, a stamping machine includes a base and a stamping seat located above the base. The base is provided with a lower die, and the stamping seat is provided with a blanking plate and an upper die corresponding to the lower die. The lower die is provided with a stamping cavity, and a first step groove and a second step groove are sequentially provided above the stamping cavity. An overflow groove is formed between the first step groove and the second step groove. The stamping machine is used to implement the stamping manufacturing method of the radiator as described in the first aspect embodiment.

[0034] Fourthly, an electronic device according to an embodiment of the present invention includes at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, the instructions being executed by the at least one control processor to enable the at least one control processor to perform a stamping method for manufacturing a heat sink as described in the first aspect embodiment or a heat dissipation method as described in the second aspect embodiment.

[0035] Fifthly, according to an embodiment of the present invention, the storage medium stores computer-executable instructions for causing a computer to perform the stamping manufacturing method of the heat sink described in the first aspect embodiment or the heat dissipation method described in the second aspect embodiment.

[0036] The stamping manufacturing method, heat dissipation method, stamping machine, electronic device, and medium of the radiator according to embodiments of the present invention have at least the following beneficial effects: a heat dissipation component is formed by stamping with a stamping machine, and during the stamping process, the shape and structure of the overflow waste are limited by a first step groove, an overflow groove, and a second step groove, which facilitates the final removal of the overflow waste and obtains a heat dissipation block; after obtaining the heat dissipation block, a radiator is formed by connecting multiple heat dissipation blocks and multiple heat dissipation plates, and heat-generating components can be attached to the inner and outer walls of each heat dissipation plate of the radiator at the same time, and coolant is introduced into the radiator through a first heat dissipation groove or a second heat dissipation groove, so that the coolant circulates in the radiator, thereby dissipating heat from multiple heat-generating components at the same time, ensuring direct heat dissipation from the heat-generating components, and improving heat dissipation efficiency and heat dissipation effect.

[0037] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0038] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0039] Figure 1 This is a flowchart illustrating the steps of a stamping method for manufacturing a radiator according to an embodiment of the present invention.

[0040] Figure 2 This is a schematic diagram of the structure of the stamping machine according to an embodiment of the present invention;

[0041] Figure 3 This is an exploded schematic diagram of a stamping machine according to an embodiment of the present invention;

[0042] Figure 4 This is a schematic diagram of the stamping machine according to an embodiment of the present invention, with the lower die removed.

[0043] Figure 5 This is a schematic diagram of the lower mold structure according to an embodiment of the present invention;

[0044] Figure 6 This is a schematic diagram of the heat sink component according to an embodiment of the present invention;

[0045] Figure 7 This is a schematic diagram of the heat sink according to an embodiment of the present invention;

[0046] Figure 8 This is a flowchart illustrating the steps of a heat dissipation method according to an embodiment of the present invention. Detailed Implementation

[0047] The embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. The step numbers in the following embodiments are set only for ease of explanation, and there is no limitation on the order between the steps. The execution order of each step in the embodiments can be adaptively adjusted according to the understanding of those skilled in the art.

[0048] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0049] The terms "first," "second," "third," and "fourth," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0050] In this invention, the reference to "embodiment" means that a specific feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0051] Automotive electronic control systems or other high-power systems may involve numerous heat-generating components. These components generate significant heat, and if not cooled in time, they may spontaneously combust. Currently, cooling is primarily achieved through coolant circulation systems or air-cooling systems. However, these methods address the cooling of the entire system and are ineffective for cooling individual chips that generate substantial heat.

[0052] To address this, embodiments of the present invention provide a method for stamping a radiator, a heat dissipation method, a stamping machine, an electronic device, and a medium. The radiator is formed by stamping using a stamping machine. During the stamping process, a first stepped groove, an overflow groove, and a second stepped groove are used to restrict the shape and structure of the overflow waste, facilitating its removal and obtaining a heat dissipation block. After obtaining the heat dissipation block, multiple heat dissipation components and multiple heat dissipation plates are connected to form a heat dissipation component. Each heat dissipation plate can simultaneously attach heat-generating components to its inner and outer walls. Coolant is introduced into the heat dissipation component through a first or second heat dissipation groove, allowing the coolant to circulate within the component, thereby simultaneously dissipating heat from multiple heat-generating components, ensuring direct heat dissipation, and improving heat dissipation efficiency and effect.

[0053] The following describes in detail, with reference to the accompanying drawings, the stamping manufacturing method of the radiator, the heat dissipation method, the stamping machine, the electronic equipment, and the medium of the present invention.

[0054] On one hand, embodiments of the present invention propose a stamping manufacturing method for a radiator, applied to a stamping machine, such as... Figures 2 to 5 As shown, the stamping machine includes a base 100 and a stamping seat 200 located above the base 100. The base 100 is provided with a lower die 300, and the stamping seat 200 is provided with a blanking plate 400 and an upper die 600 corresponding to the lower die 300. The lower die 300 is provided with a stamping cavity 310, and a first stepped groove 320 and a second stepped groove 340 are sequentially provided above the stamping cavity 310. An overflow groove is formed between the first stepped groove 320 and the second stepped groove 340. Figure 1 As shown, the stamping manufacturing method of the radiator includes, but is not limited to, steps S100 to S500.

[0055] Step S100: Place the material to be stamped into the stamping cavity 310 of the lower die 300;

[0056] Step S200: Drive the stamping base 200 to descend, so that the upper die 600 and the lower die 300 cooperate to stamp the material to be stamped, forming a heat sink 700. The heat sink 700 includes a first heat sink 710 and a second heat sink 720 that are interconnected, and an overflow waste material 800 is formed on the surface of the heat sink 700. The first heat sink 710 and the second heat sink 720 are located in the stamping cavity 310, and the overflow waste material 800 is located at the first step groove 320, the overflow groove 330 and the second step groove 340.

[0057] Step S300: Drive the stamping base 200 to rise and reset, and use the ejector plate 400 to make the upper die 600 detach from the heat sink 700;

[0058] Step S400: Remove the heat sink 700 from the lower mold 300 and cut off the overflow waste material 800 from the surface of the heat sink 700 to obtain the heat sink block 1100;

[0059] Step S500: Obtain multiple heat sinks 1100, connect a heat sink 900 between any two adjacent heat sinks 1100 to obtain an annular heat sink 1000; the heat sink 900 is provided with a heat dissipation channel inside, one end of the heat dissipation channel is connected to the first heat dissipation groove 710 of one of the heat sinks 1100, and the other end of the heat dissipation channel is connected to the second heat dissipation groove 720 of another heat sink 1100.

[0060] It should be noted that, as Figure 2 As shown, the stamping machine includes a base 100 and a stamping seat 200 located above the base 100. The stamping machine is equipped with a drive mechanism for raising and lowering the stamping seat 200. When stamping is required, the drive mechanism drives the stamping seat 200 to descend to the surface of the base 100. After stamping is completed, the drive mechanism drives the stamping seat 200 to rise and return to its original position. Figure 2 and Figure 5As shown, a lower die 300 is provided on the surface of the base 100. The lower die 300 has a stamping cavity 310 corresponding to the shape of the heat sink 700. Before stamping, the material to be stamped is placed in the lower die 300 of the stamping machine. When the stamping seat 200 descends to the surface of the base 100, the upper die 600 at the bottom of the stamping seat 200 stamps the material to be stamped, thereby forming the heat sink 700 in the stamping cavity 310. However, during the stamping process, some of the material to be stamped overflows, forming waste. In traditional stamping machines, the waste generated by stamping is irregular, which causes trouble for the subsequent removal of waste. In this example, to facilitate the removal of waste generated during stamping, a first stepped groove 320 is provided above the stamping cavity 310, and a second stepped groove 340 is provided above the first stepped groove 320. An overflow groove 330 is formed between the first stepped groove 320 and the second stepped groove 340. Thus, the waste generated during stamping overflows along the first stepped groove 320, the overflow groove 330, and the second stepped groove 340, forming overflow waste 800 on the surface of the heat sink 700. The structure of the heat sink 700 and the overflow waste 800 is as follows: Figure 6 As shown, when removing the overflow waste 800, simply cut the overflow waste 800 around its bottom along the bottom formed by the first step groove 320. The remaining part is the required heat sink 1100. This method makes the removal of the overflow waste 800 more convenient and ensures that the resulting heat sink 1100 conforms to the preset structure.

[0061] like Figure 2 , Figure 3 and Figure 4As shown, in some embodiments of this application, the bottom of the stamping base 200 is provided with an upper die 600 and a blanking plate 400 opposite to the lower die 300. The upper die 600 is used to cooperate with the lower die 300 for stamping. When the stamping base 200 descends to the surface of the base 100, the upper die 600 at the bottom of the stamping base 200 stamps the material to be stamped, forming the required heat sink 700. The blanking plate 400 serves to limit and remove material. During stamping, the blanking plate 400 controls the relative position between the upper die 600 and the lower die 300. Limiting the position ensures accurate stamping. After stamping, the stamping base 200 needs to drive the upper die 600 to rise and reset. To prevent the upper die 600 from failing to detach from the heat sink 700 during its ascent, which could lead to deformation or damage, the ejector plate 400 is temporarily blocked by the stamping machine's fixing mechanism during the initial ascent of the upper die 600, remaining relatively stationary. The upper die 600 continues to rise approximately 5-10mm, at which point the ejector plate 400 generates a downward ejection force relative to the upper die 600, forcibly separating the heat sink 700 from the surface of the upper die 600. Subsequently, the stamping machine's fixing mechanism releases the ejector plate 400, allowing both the ejector plate 400 and the upper die 600 to rise and reset together under the action of the stamping base 200. Through the combined effect of stroke delay and reverse ejection, the ejector plate 400 allows the heat sink 700 to detach from the upper die 600 and remain stably within the lower die 300.

[0062] After the stamping seat 200 rises and resets, the heat sink 700 can be removed from the lower die 300, and the overflow waste material 800 can be cut off from the surface of the heat sink 700 to obtain the required heat sink block 1100.

[0063] Then, using multiple heat sinks 700, the final required heat sink 1000 is manufactured. The structure of the heat sink 1000 is as follows: Figure 7As shown, the heat sink 1100 includes a first heat sink 710 and a second heat sink 720. A bent heat sink 900 is disposed on the outer wall of the first heat sink 710, and another bent heat sink 900 is disposed on the outer wall of the second heat sink 720. A heat dissipation channel is provided inside each heat sink 900. One end of the heat dissipation channel communicates with the first heat sink 710 of one of the heat sinks 1100, and the other end communicates with the second heat sink 720 of the other heat sink 1100. It should be noted that connection holes are provided at the connection points between the first heat sink 710, the second heat sink 720, and the heat dissipation channel. Alternatively, a connecting channel can be provided between the first heat sink 710 and the second heat sink 720. Any two heat sinks 1100 can be connected using the heat sink 900 to ultimately form a ring-shaped heat sink 1000. In this example, a ring-shaped heat sink 1000 is formed by three heat sink blocks 1100 and three bent heat sink plates 900. It should be noted that the specific number of heat sink blocks 1100 and heat sink plates 900 can be adjusted according to actual needs and is not limited to this.

[0064] According to the stamping manufacturing method of the heat sink of this application, a heat sink 700 is formed by stamping with a stamping machine. During the stamping process, the shape and structure of the overflow waste 800 are restricted by the first step groove 320, the overflow groove 330 and the second step groove 340, so as to facilitate the final removal of the overflow waste 800 and obtain the heat sink block 1100. After obtaining the heat sink block 1100, multiple heat sink blocks 1100 and multiple heat sink plates 900 are connected to form a heat sink 1000. The inner and outer walls of each heat sink plate 900 of the heat sink 1000 can be simultaneously attached to heat-generating devices, and coolant is introduced into the heat sink block 1100 through the first heat sink groove 710 or the second heat sink groove 720, so that the coolant circulates in the heat sink 1000, thereby dissipating heat from multiple heat-generating devices at the same time, ensuring the direct heat dissipation effect on the heat-generating devices, and improving the heat dissipation efficiency and effect.

[0065] Furthermore, in some embodiments of this application, such as Figure 3 and Figure 4As shown, a fixing plate 500 is provided at the bottom of the stamping base 200. The fixing plate 500 has a first through hole through which the upper die 600 passes. The fixing plate 500 also has a limiting hole and a guide post 510. The ejector plate 400 is fixed to the bottom of the fixing plate 500 through the limiting hole. The ejector plate 400 has a first guide hole corresponding to the guide post 510, through which the guide post 510 passes. The ejector plate 400 also has a second through hole corresponding to the first through hole through which the upper die 600 passes. It should be noted that the limiting hole can be a threaded hole. By providing multiple limiting holes in the fixing plate 500, the installation position of the ejector plate 400 can be limited, thus determining the installation position of the ejector plate 400. At the same time, the ejector plate 400 also has threaded holes at the positions corresponding to the limiting holes. Thus, the ejector plate 400 can be fixed to the bottom of the fixing plate 500 by screwing screws into the threaded holes and the limiting holes. Meanwhile, the ejector plate 400 and the fixing plate 500 are respectively provided with a first through hole and a second through hole for the upper mold 600 to pass through, thereby limiting the upper mold 600.

[0066] Furthermore, in some embodiments of this application, such as Figure 4 As shown, the bottom of the upper mold 600 is provided with a first stamping post 610 and a second stamping post 620 corresponding to the first heat dissipation groove 710 and the second heat dissipation groove 720, and the lower mold 300 is provided with a second guide hole 350 corresponding to the guide post 510.

[0067] Step S200 above: Drive the stamping base 200 to descend, so that the upper die 600 and the lower die 300 cooperate to stamp the material to be stamped, forming the heat sink 700, including the following three sub-steps:

[0068] Step S210: Drive the stamping base 200 down to the surface of the lower die 300, so that the guide post 510 enters the second guide hole 350;

[0069] Step S220: When the guide post 510 enters the second guide hole 350, the material to be stamped is stamped by the upper die 600, the first stamping post 610 and the second stamping post 620 to form a heat sink 700 with the first heat sink 710 and the second heat sink 720.

[0070] Step S230: During the stamping process, the overflow material generated during stamping is transferred to the surface of the heat sink 700 through the first step groove 320, the overflow groove 330 and the second step groove 340 to form overflow waste material 800.

[0071] Specifically, the guide post 510 and the second guide hole 350 cooperate to guide the upper die 600 and ensure accurate stamping position; by setting the first stamping post 610 and the second stamping post 620 at the bottom of the upper die 600, the heat sink 700 forms the first heat sink 710 and the second heat sink 720.

[0072] Furthermore, in some embodiments of this application, such as Figure 4 As shown, the base 100 is provided with a liftable top post 110, and the lower die 300 has a third through hole adapted to the top post 110, which communicates with the stamping cavity 310; the above step S400: removing the heat sink 700 from the lower die 300 includes the following two sub-steps:

[0073] Step S410: After the stamping is completed, the pusher column 110 is driven to rise and enter the stamping chamber 310 through the third through hole, pushing the heat sink 700 and the overflow waste 800 out of the stamping chamber 310.

[0074] Step S420: After removing the heat sink 700 and the overflow waste 800 from the lower mold 300, drive the ejector pin 110 to descend and reset.

[0075] By providing a liftable top post 110 on the base 100, the heat sink 700 and overflow waste 800 can be ejected from the stamping cavity 310 after stamping is completed, making it easy for operators to remove the heat sink 700 and overflow waste 800.

[0076] On the other hand, such as Figure 8 As shown in the embodiments of this application, a heat dissipation method is also proposed, which includes the following steps:

[0077] Step S1000: Obtain radiator 1000, which is manufactured by the above-described radiator stamping method;

[0078] Step S1100: Attach a first heating element to the inner wall of each heat sink 900 of the radiator 1000, and attach a second heating element to the outer wall of each heat sink 900 of the radiator 1000.

[0079] Step S1200: Coolant is introduced into the first heat dissipation groove 710 of each heat dissipation block 1100 of the radiator 1000, and the coolant is allowed to flow out from the second heat dissipation groove 720 of the adjacent heat dissipation block 1100.

[0080] Step S1300: Coolant circulates within the heat dissipation channels of each heat sink 900 to dissipate heat from the heat-generating components and the second heat-generating component.

[0081] According to the heat dissipation method of this application, by attaching a first heating element to the inner wall of each heat sink 900 and a second heating element to the outer wall of each heat sink 900, one heat sink 900 can simultaneously dissipate heat from both the first and second heating elements, thereby achieving simultaneous heat dissipation from multiple heat-generating devices using one heat sink 1000, thus improving heat dissipation efficiency. Furthermore, in this application, the first heat dissipation groove 710 of each heat sink 1100 and the second heat dissipation groove 720 of adjacent heat sink 1100 are connected through the heat sink 900 to form a heat dissipation path. The first heat dissipation groove 710 of each heat sink 1100 serves as an inlet, and the second heat dissipation groove 720 of adjacent heat sink 1100 serves as an outlet. Figure 7 The heat sink 1000 shown can form three heat dissipation paths to dissipate heat from the heat-generating components attached to the inner and outer walls of each heat sink 900. It should be noted that each heat dissipation path is independent of the others, so they can be controlled separately.

[0082] Furthermore, in some embodiments of this application, the above-mentioned step S1200: introducing coolant into the first heat dissipation groove 710 of each heat dissipation block 1100 of the radiator 1000 and allowing the coolant to flow out from the second heat dissipation groove 720 of the adjacent heat dissipation block 1100, further includes the following three steps:

[0083] A diversion valve is installed in the heat dissipation channel to divide the heat dissipation channel into a first channel and a second channel. The first channel is close to the inner wall of the heat dissipation plate 900, and the second channel is close to the outer wall of the heat dissipation plate 900.

[0084] The first temperature of the first heating element on the inner wall of each heat sink 900 and the second temperature of the second heating element on the outer wall of each heat sink 900 are obtained.

[0085] The flow rate of coolant in the first and second channels is adjusted by a flow divider valve based on the difference between the first and second temperatures.

[0086] Specifically, in this example, a first heating element is provided on the inner wall of the heat sink 900, and a second heating element is provided on the outer wall. Since the heating power of the first and second heating elements may differ, resulting in a significant temperature difference, to ensure better performance for the heating element with higher heating power, the flow rate of the coolant in the first and second channels is adjusted using a flow divider valve. If the temperature of the first heating element is higher, the flow rate of the coolant in the first channel is increased to rapidly dissipate heat from the first heating element; similarly, if the temperature of the second heating element is higher, the flow rate of the coolant in the second channel is increased to rapidly dissipate heat from the second heating element. This method allocates different cooling flow rates based on the real-time temperatures of the first and second heating elements, thereby achieving the best heat dissipation effect while maintaining a constant total cooling flow rate.

[0087] Furthermore, in some embodiments of this application, step S1200 above, which involves introducing coolant into the first heat dissipation groove 710 of each heat dissipation block 1100 of the radiator 1000 and allowing the coolant to flow out from the second heat dissipation groove 720 of the adjacent heat dissipation block 1100, further includes:

[0088] The first temperature of the first heating element on the inner wall of each heat sink 900 and the second temperature of the second heating element on the outer wall of each heat sink 900 are obtained.

[0089] Determine the heat dissipation requirements based on the first and second temperatures;

[0090] Determine the total flow rate of coolant within the corresponding heat sink 900 based on the heat dissipation requirements.

[0091] It should be noted that when both the first temperature of the first heating element and the second temperature of the second heating element are high, exceeding the heat dissipation capacity of the coolant, the total coolant flow rate needs to be increased promptly to ensure that the heat dissipation requirements are met. If both the first temperature of the first heating element and the second temperature of the second heating element are low, the coolant flow rate can be reduced to save energy.

[0092] It should be noted that the first heat dissipation slot 710 and the second heat dissipation slot 720 of each heat sink 1100 can also be connected to each other, so that the entire heat sink 1000 forms a heat dissipation path, so that each heat sink 900 and each heat sink 1100 are connected, and heat can be dissipated through a heat dissipation path.

[0093] Thirdly, embodiments of the present invention also provide a stamping machine, such as... Figures 2 to 6 As shown, the stamping machine includes a base 100 and a stamping seat 200 located above the base 100. A lower die 300 is provided on the surface of the base 100. The lower die 300 is provided with a stamping cavity 310 corresponding to the shape of the heat sink 700. A first stepped groove 320 is provided above the stamping cavity 310. A second stepped groove 340 is provided above the first stepped groove 320. An overflow groove 330 is formed between the first stepped groove 320 and the second stepped groove 340. The bottom of the stamping seat 200 is provided with an upper die 600 and a blanking plate 400 opposite to the lower die 300. The stamping machine is used to realize the above-mentioned stamping manufacturing method of the heat sink.

[0094] It should be noted that all the contents of the stamping manufacturing method of the radiator described in the first aspect embodiment are applicable to the stamping machine of this aspect embodiment, and the stamping machine of this aspect embodiment has the same technical effect as the stamping manufacturing method of the radiator described in the first aspect embodiment.

[0095] On the other hand, embodiments of this application also propose an electronic device, including at least one control processor and a memory for communicatively connecting to the at least one control processor; the memory stores instructions executable by the at least one control processor, which, when executed by the at least one control processor, enables the at least one control processor to perform the stamping manufacturing method of the heat sink described in the first aspect embodiment or the heat dissipation method described in the second aspect embodiment.

[0096] Fourthly, embodiments of the present invention also provide a storage medium, which is a computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the stamping manufacturing method of the heat sink described in the first aspect embodiment or the heat dissipation method described in the second aspect embodiment.

[0097] Memory, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs and non-transitory computer-executable programs. Furthermore, memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one disk storage device, flash memory device, or other non-transitory solid-state storage device. In some embodiments, memory may optionally include memory remotely located relative to the processor, and these remote memories can be connected to the processor via a network. Examples of such networks include, but are not limited to, the Internet, intranets, local area networks, mobile communication networks, and combinations thereof. The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separate, and may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0098] Although specific embodiments are described herein, those skilled in the art will recognize that many other modifications or alternative embodiments are also within the scope of this disclosure. For example, any of the functions and / or processing capabilities described in connection with a particular device or component can be performed by any other device or component. Furthermore, while various exemplary embodiments and architectures have been described according to embodiments of this disclosure, those skilled in the art will recognize that many other modifications to the exemplary embodiments and architectures described herein are also within the scope of this disclosure.

[0099] The foregoing description, with reference to block diagrams and flowcharts of systems, methods, systems, and / or computer program products according to exemplary embodiments, has described certain aspects of this disclosure. It should be understood that one or more blocks in the block diagrams and flowcharts, as well as combinations of blocks in the block diagrams and flowcharts, can be implemented by executing computer-executable program instructions, respectively. Similarly, according to some embodiments, some blocks in the block diagrams and flowcharts may not need to be executed in the order shown, or may not all need to be executed. Furthermore, additional components and / or operations beyond those shown in the blocks in the block diagrams and flowcharts may exist in some embodiments.

[0100] Therefore, blocks in block diagrams and flowcharts support combinations of means for performing a specified function, combinations of elements or steps for performing a specified function, and program instruction means for performing a specified function. It should also be understood that each block in a block diagram and flowchart, and combinations of blocks in block diagrams and flowcharts, can be implemented by a dedicated hardware computer system or a combination of dedicated hardware and computer instructions that performs a specific function, element, or step.

[0101] The program modules, applications, etc., described herein may include one or more software components, including, for example, software objects, methods, data structures, etc. Each such software component may include computer-executable instructions that, in response to execution, cause at least a portion of the functionality described herein (e.g., one or more operations of the exemplary methods described herein) to be performed.

[0102] Software components can be coded using any of a variety of programming languages. An exemplary programming language could be a low-level programming language, such as assembly language associated with a specific hardware architecture and / or operating system platform. Software components including assembly language instructions may need to be converted into executable machine code by an assembler before being executed by the hardware architecture and / or platform. Another exemplary programming language could be a higher-level programming language that is portable across multiple architectures. Software components including higher-level programming languages ​​may need to be converted into an intermediate representation by an interpreter or compiler before execution. Other examples of programming languages ​​include, but are not limited to, macro languages, shell or command languages, job control languages, scripting languages, database query or search languages, or report writing languages. In one or more exemplary embodiments, a software component containing instructions from one of the above-described programming language examples can be executed directly by the operating system or other software components without first being converted into another form.

[0103] Software components can be stored as files or other data storage structures. Software components of similar type or related function can be stored together in a specific directory, folder, or library. Software components can be static (e.g., pre-defined or fixed) or dynamic (e.g., created or modified at runtime).

[0104] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of the present invention.

Claims

1. A method of punch making a heat sink, characterized by, The application is applied to a punch press, the punch press comprises a base and a punch seat above the base, the base is provided with a lower die, the punch seat is provided with a material removing plate and an upper die corresponding to the lower die, the lower die is provided with a punch cavity, a first step groove and a second step groove are sequentially arranged above the punch cavity, and an overflow groove is formed between the first step groove and the second step groove; the method comprises the following steps: putting a material to be punched into the punch cavity of the lower die; driving the punch seat to descend, so that the lower die and the upper die cooperate to punch the material to be punched, and a heat dissipation piece is formed; the heat dissipation piece comprises a first heat dissipation groove and a second heat dissipation groove which are communicated with each other, a surface of the heat dissipation piece forms overflow waste, the first heat dissipation groove and the second heat dissipation groove are located in the punch cavity, and the overflow waste is located at the first step groove, the overflow groove and the second step groove; driving the punch seat to ascend and reset, and making the upper die separate from the heat dissipation piece through the material removing plate; taking out the heat dissipation piece from the lower die, and cutting off the overflow waste from the surface of the heat dissipation piece to obtain a heat dissipation block; obtaining a plurality of heat dissipation blocks, connecting a heat dissipation plate between any two adjacent heat dissipation blocks to obtain a ring-shaped heat radiator; an inner part of the heat dissipation plate is provided with a heat dissipation channel, one end of the heat dissipation channel is communicated with the first heat dissipation groove of one of the heat dissipation blocks, and the other end of the heat dissipation channel is communicated with the second heat dissipation groove of another heat dissipation block; a bottom of the punch seat is provided with a fixing plate, the fixing plate is provided with a first through hole, the upper die is arranged in the first through hole, the fixing plate is further provided with a limiting hole and a guide column, the material removing plate is fixed at the bottom of the fixing plate through the limiting hole, the material removing plate is provided with a first guide hole corresponding to the guide column, the guide column is arranged in the first guide hole, and the material removing plate is further provided with a second through hole corresponding to the first through hole, and the upper die is arranged in the second through hole; a bottom of the upper die is provided with a first punch column and a second punch column corresponding to the first heat dissipation groove and the second heat dissipation groove, and the lower die is provided with a second guide hole corresponding to the guide column; the driving the punch seat to descend, so that the lower die and the upper die cooperate to punch the material to be punched, and the heat dissipation piece is formed, comprises the following steps: driving the punch seat to descend to the surface of the lower die, so that the guide column enters the second guide hole; when the guide column enters the second guide hole, the material to be punched is punched through the upper die, the first punch column and the second punch column, and the heat dissipation piece with the first heat dissipation groove and the second heat dissipation groove is formed; in the process of punching, overflow material generated in the process of punching forms the overflow waste on the surface of the heat dissipation piece through the first step groove, the overflow groove and the second step groove.

2. The method of claim 1, wherein the base is provided with a liftable material lifting column, the lower die is provided with a third through hole matched with the material lifting column, and the third through hole is communicated with the punch cavity; the taking out the heat dissipation piece from the lower die comprises the following steps: When the stamping is completed, the ejector post is driven to rise and enter the stamping cavity through the third through hole, and the heat dissipation piece is ejected from the stamping cavity; After the heat dissipation piece is taken out of the lower die, the ejector post is driven to descend and reset.

3. A heat dissipation method characterized by, The method comprises the following steps: A heat dissipation piece is obtained by the heat dissipation piece stamping manufacturing method according to any one of claims 1-2; A first heat generating piece is attached to the inner side wall of each heat dissipation plate of the heat dissipation piece, and a second heat generating piece is attached to the outer side wall of each heat dissipation plate of the heat dissipation piece; Cooling liquid is introduced into the first heat dissipation groove of each heat dissipation block of the heat dissipation piece, and the cooling liquid flows out of the second heat dissipation groove of the adjacent heat dissipation block; The first heat generating piece and the second heat generating piece are cooled by the circulation of the cooling liquid in the heat dissipation channel of each heat dissipation plate.

4. The heat dissipation method according to claim 3, wherein, The method of introducing cooling liquid into the first heat dissipation groove of each heat dissipation block of the heat dissipation piece and making the cooling liquid flow out of the second heat dissipation groove of the adjacent heat dissipation block further comprises: A flow valve is arranged in the heat dissipation channel, and the heat dissipation channel is divided into a first channel and a second channel by the flow valve, the first channel is close to the inner side wall of the heat dissipation plate, and the second channel is close to the outer side wall of the heat dissipation plate; The first temperature of the first heat generating piece of the inner side wall of each heat dissipation plate and the second temperature of the second heat generating piece of the outer side wall of each heat dissipation plate are obtained; According to the difference between the first temperature and the second temperature, the flow of the cooling liquid in the first channel and the second channel is adjusted by the flow valve.

5. The heat dissipation method according to claim 3, wherein, The method of introducing cooling liquid into the first heat dissipation groove of each heat dissipation block of the heat dissipation piece and making the cooling liquid flow out of the second heat dissipation groove of the adjacent heat dissipation block further comprises: The first temperature of the first heat generating piece of the inner side wall of each heat dissipation plate and the second temperature of the second heat generating piece of the outer side wall of each heat dissipation plate are obtained; According to the first temperature and the second temperature, the heat dissipation requirement is determined; According to the heat dissipation requirement, the total flow of the cooling liquid in the corresponding heat dissipation plate is determined.

6. A punch press characterized by comprising: The stamping machine comprises a base and a stamping seat located above the base, the base is provided with a lower die, the stamping seat is provided with a knockout plate and an upper die corresponding to the lower die, the lower die is provided with a stamping cavity, a first step groove and a second step groove are sequentially arranged above the stamping cavity, and an overflow groove is formed between the first step groove and the second step groove; the stamping machine is used to realize the heat dissipation piece stamping manufacturing method according to any one of claims 1-2.

7. An electronic device, comprising: The control processor and the memory connected with the control processor; the memory stores instructions executable by the control processor, and the instructions are executed by the control processor to enable the control processor to execute the heat dissipation piece stamping manufacturing method according to any one of claims 1-2 or the heat dissipation method according to any one of claims 3-5.

8. A storage medium, characterized by The storage medium stores computer executable instructions for causing a computer to execute the stamping manufacturing method of the heat spreader according to any one of claims 1-2 or the heat dissipation method according to any one of claims 3-5.

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