Glue coating and developing method and device, electronic device, storage medium

Abstract

The application relates to the technical field of micro-scale processing, in particular to a gluing and developing method and device, electronic equipment and storage medium. The gluing and developing method provided by the application needs to acquire gluing process input parameters and developing process input parameters; the gluing process input parameters and the developing process input parameters are subjected to compliance screening respectively, and a standard target parameter set is obtained; a preset operation parameter collection column is valued according to the standard target parameter set; wherein the operation parameter collection column comprises a gluing operation parameter column and a developing operation parameter column; a gluing operation is performed on a target sample based on the valued gluing operation parameter column; after the gluing operation is performed, a developing operation is performed on the target sample based on the valued developing operation parameter column. In this way, the convenience and accuracy of the gluing operation and the developing operation can be improved.

Description

Technical Field

[0001] This application relates to the field of microscale processing technology, and in particular to a coating and developing method and apparatus, electronic equipment, and storage medium. Background Technology

[0002] Coating and developing equipment is a key piece of equipment in micro-nano fabrication fields such as semiconductor manufacturing, microelectromechanical systems (MEMS) manufacturing, and flat panel display manufacturing. It is mainly used for the coating and developing processes in photolithography. The coating and developing equipment consists of multiple parts, which may include, but are not limited to, coating units, developing units, hot plate units, cold plate units, rotary coating spinning units, and spraying units.

[0003] Traditional photoresist coating and developing equipment has a relatively cumbersome and complex operating procedure, requiring operators to manually input a series of process parameters. For example, for the photoresist coating function, they must select the process flow, fill in detailed parameters such as sample size, sample type, photoresist type, suction cup speed, suction cup acceleration, and photoresist dosage. Similarly, the developing function also requires selecting the process flow and filling in parameters such as sample size, developer dosage, developing time, suction cup speed, and suction cup acceleration. In this case, the relevant technology cannot fully meet users' needs for ease of operation and user-friendliness. The low degree of automation in software operation leads to inefficient experimental parameter setting and is prone to parameter setting errors. Summary of the Invention

[0004] This application aims to address at least one of the technical problems existing in the related art. To this end, this application proposes a coating and developing method, apparatus, electronic equipment, and storage medium, which can improve the simplicity and accuracy of coating and developing operations.

[0005] The coating and developing method according to the first aspect of this application includes:

[0006] Obtain the input parameters for the coating process and the developing process;

[0007] Compliance screening was performed on the input parameters of the coating process and the input parameters of the developing process to obtain a set of standardized target parameters;

[0008] According to the specified target parameter set, values ​​are assigned to the preset operation parameter collection column; wherein, the operation parameter collection column includes the glue application operation parameter column and the developing operation parameter column;

[0009] The glue application operation is performed on the target sample based on the assigned glue application parameters.

[0010] After the coating operation is performed, the target sample is developed based on the assigned development operation parameters.

[0011] According to some embodiments of this application, the standardized target parameter set includes single-mapping target parameters and multi-mapping target parameters, and the step of assigning values ​​to the preset job parameter collection column according to the standardized target parameter set includes:

[0012] Several parameters to be filled in are determined from the task parameter collection column;

[0013] Iterate through several of the parameter fields to be filled, and determine the single field to be filled for a single assignment type and the combined field to be filled for a combination assignment type.

[0014] Based on each of the single mapping target parameters, an assignment operation is performed on the matching single field to be filled.

[0015] Based on each of the multiple mapping target parameters, a value assignment operation is performed on the matching combination of fields to be filled.

[0016] According to some embodiments of this application, the glue coating process input parameters include glue quantity input parameters, and the developing process input parameters include developing solution spraying time input parameters. The compliance screening of the glue coating process input parameters and the developing process input parameters respectively yields a set of compliant target parameters, including:

[0017] Obtain sample size information that matches the target sample;

[0018] Based on the sample size information, compliance screening is performed on the input parameters of adhesive volume and developer spraying time.

[0019] In the compliance screening, in response to the glue volume input parameter satisfying the glue volume constraint condition preset by the sample size information, the glue volume input parameter is included in the standard target parameter set;

[0020] During compliance screening, in response to the fact that the developer spraying time input parameter meets the spraying constraint conditions preset by the sample size information, the developer spraying time input parameter is included in the standard target parameter set.

[0021] According to some embodiments of this application, the compliance screening of the input parameters for the coating process and the input parameters for the developing process to obtain a set of standardized target parameters includes:

[0022] The process sequence is analyzed based on the input parameters of the coating process and the input parameters of the developing process to obtain the process selection parameters;

[0023] Based on preset process selection conditions, the process selection parameters are screened for compliance.

[0024] In the compliance screening, in response to the process selection parameters satisfying the process selection conditions, a target step sequence option is determined from several candidate step sequence options based on the process selection parameters; wherein, each candidate step sequence option contains a preset step sequence process information;

[0025] The step sequence information corresponding to the target step sequence option is included in the standard target parameter set.

[0026] According to some embodiments of this application, after performing a development operation on the target sample based on the assigned development operation parameter column, the method further includes:

[0027] Acquire the parameter parsing requirements, the actual collected parameters of the adhesive application operation, and the actual collected parameters of the developing operation;

[0028] Based on the parameter analysis requirements, the actual collected parameters for coating and development are analyzed to obtain the required analysis result data.

[0029] According to some embodiments of this application, the step of analyzing the actual collected parameters of the adhesive coating and the actual collected parameters of the developing process based on the parameter analysis requirements to obtain the requirement analysis result data includes:

[0030] In response to the parameter analysis requirement being a consumable cost analysis requirement, the unit price of consumables corresponding to various preset consumable types is obtained; wherein, the preset consumable types include photoresist type, photoresist remover type, developer type, and ultrapure water type;

[0031] Based on the actual collected parameters of the photoresist coating and the actual collected parameters of the development, consumable parameters are extracted to obtain the photoresist spraying flow rate, photoresist spraying time, remover spraying flow rate, remover spraying time, developer spraying flow rate, developer spraying time, ultrapure water spraying flow rate, and ultrapure water spraying time.

[0032] The cost of photoresist consumables is calculated based on the photoresist spraying flow rate, photoresist spraying time, and the unit price of the consumables for the photoresist type.

[0033] The cost of the remover consumables is calculated based on the spray flow rate, spray time, and unit price of the type of remover.

[0034] The cost of developer consumables is calculated based on the developer spraying flow rate, developer spraying time, and the unit price of the consumables of the developer type.

[0035] The cost of ultrapure water consumables is calculated based on the ultrapure water spray flow rate, ultrapure water spray time, and the unit price of the consumables for the ultrapure water type.

[0036] Based on the cost of the photoresist consumables, the cost of the remover consumables, the cost of the imaging solution consumables, and the cost of the ultrapure water consumables, the demand analysis result data matching the demand analysis requirements for the consumables costs is determined.

[0037] According to some embodiments of this application, the method further includes:

[0038] During the execution of the coating or developing operation, a job monitoring operation is performed.

[0039] In response to the capture of a violation operation by the operation monitoring, a matching violation handling operation is determined based on the violation operation type of the violation operation;

[0040] After determining the violation handling operation that matches the violation operation type, the violation handling operation is executed to handle the violation operation.

[0041] According to some embodiments of this application, the method further includes:

[0042] In response to an alarm notification detected by the work monitoring operation, a screen recording operation is performed on the corresponding operation terminals of the glue application operation and the developing operation to obtain alarm response record information;

[0043] Based on the alarm response record information, a compliance analysis is performed to obtain the alarm response analysis results.

[0044] According to some embodiments of this application, the method further includes:

[0045] During the execution of the coating or developing operation, the current operation process is determined in real time.

[0046] Based on the current operation process, a comparison is performed with a preset operation specification benchmark to determine the currently disabled control that matches the current operation process; wherein, the operation specification benchmark records multiple preset operation processes and the type of disabled control that matches each preset operation process;

[0047] On the operating terminal corresponding to the glue application operation or the developing operation, a disable / lock operation is performed on the currently disabled control.

[0048] According to a second aspect embodiment of this application, the coating and developing apparatus includes:

[0049] The input module is used to obtain input parameters for the coating process and the developing process;

[0050] The compliance screening module is used to perform compliance screening on the input parameters of the coating process and the input parameters of the developing process respectively, and obtain a set of standard target parameters;

[0051] The assignment module is used to assign values ​​to the preset operation parameter collection column according to the specified target parameter set; wherein, the operation parameter collection column includes the glue application operation parameter column and the developing operation parameter column;

[0052] The glue application module is used to perform a glue application operation on the target sample based on the assigned glue application operation parameters.

[0053] The developing operation module is used to perform a developing operation on the target sample based on the assigned developing operation parameters after the coating operation is performed.

[0054] Thirdly, embodiments of this application provide an electronic device, including: a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the coating and developing method as described in any one of the embodiments of the first aspect of this application.

[0055] Fourthly, embodiments of this application provide a computer-readable storage medium storing a program that is executed by a processor to implement the coating and developing method as described in any one of the embodiments of the first aspect of this application.

[0056] The coating and developing method, apparatus, electronic device, and storage medium according to the embodiments of this application have at least the following beneficial effects:

[0057] The coating and developing method of this application requires first obtaining coating process input parameters and developing process input parameters; performing compliance screening on the coating process input parameters and the developing process input parameters respectively to obtain a standardized target parameter set; assigning values ​​to a preset operation parameter collection column according to the standardized target parameter set; wherein the operation parameter collection column includes a coating operation parameter column and a developing operation parameter column; performing a coating operation on the target sample based on the assigned coating operation parameter column; and performing a developing operation on the target sample based on the assigned developing operation parameter column after performing the coating operation. This improves the simplicity and accuracy of the coating and developing operations.

[0058] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0059] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0060] Figure 1 A schematic flowchart of a coating and developing method provided in an embodiment of this application;

[0061] Figure 2 This is another schematic flowchart of the coating and developing method provided in the embodiments of this application;

[0062] Figure 3 This is another schematic flowchart of the coating and developing method provided in the embodiments of this application;

[0063] Figure 4 This is another schematic flowchart of the coating and developing method provided in the embodiments of this application;

[0064] Figure 5 This is another schematic flowchart of the coating and developing method provided in the embodiments of this application;

[0065] Figure 6 This is another schematic flowchart of the coating and developing method provided in the embodiments of this application;

[0066] Figure 7 This is another schematic flowchart of the coating and developing method provided in the embodiments of this application;

[0067] Figure 8 This is a schematic diagram of the coating and developing apparatus provided in the embodiments of this application;

[0068] Figure 9 This is a schematic diagram of the hardware structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0069] The embodiments of this application are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0070] In the description of this application, "several" means one or more, "more than" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0071] In the description of this application, it should be understood that the orientation descriptions, such as up, down, left, right, front, and back, are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0072] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0073] In the description of this application, it should be noted that, unless otherwise explicitly defined, terms such as "setting," "installation," and "connection" should be interpreted broadly. Those skilled in the art can reasonably determine the specific meaning of the above terms in this application based on the specific content of the technical solution. Furthermore, the identification of specific steps in the following text does not imply a limitation on the order of steps or execution logic. The execution order and logic between each step should be understood and inferred from the content described in the embodiments.

[0074] The coating and developing equipment is a key piece of equipment in the field of micro-nano processing, such as semiconductor manufacturing, microelectromechanical systems (MEMS) manufacturing, and flat panel display manufacturing. It is mainly used for coating and developing processes in photolithography.

[0075] In semiconductor chip manufacturing, the coating and developing equipment is an indispensable part of the photolithography process. Photolithography is a key step in transferring designed circuit patterns onto silicon wafers, and the performance of the coating and developing equipment directly affects the quality and precision of photolithography, which in turn affects the chip's performance and yield.

[0076] The manufacturing of microelectromechanical devices (MEMS) requires the fabrication of tiny mechanical structures and electrical components on substrates such as silicon wafers. Coating and developing equipment is used to achieve pattern transfer and shaping of these microstructures, such as the manufacturing of microsensors and microactuators.

[0077] Flat panel display manufacturing: In the production process of flat panel displays such as liquid crystal displays (LCDs) and organic light-emitting diode displays (OLEDs), photoresist coating and developing equipment is used to coat photoresist and develop patterns on glass substrates to form fine patterns such as pixel units and thin-film transistors.

[0078] The coating and developing apparatus consists of multiple parts, including but not limited to a coating unit, a developing unit, a hot plate unit, a cold plate unit, a rotary coating unit, and a spraying unit.

[0079] During the photoresist coating process, the coating and developing unit first sprays photoresist evenly onto the surface of a rotating silicon wafer through nozzles. Centrifugal force is used to distribute the photoresist evenly and form a uniform film. After coating, the silicon wafer is baked on a hot plate to remove solvent from the photoresist, improving the adhesion and hardness of the film. During development, depending on the type of photoresist and exposure method, a suitable developer is sprayed onto the silicon wafer surface, dissolving the photoresist in both exposed and unexposed areas to form the desired pattern. After development, the silicon wafer is also treated with a hot or cold plate to stabilize the development result.

[0080] Traditional photoresist coating and developing equipment has a relatively cumbersome and complex operating procedure, requiring operators to manually input a series of process parameters. For example, for the photoresist coating function, they must enter the file name, select the process flow, and fill in detailed parameters such as sample size and photoresist type. Similarly, the developing function also requires entering the file name, selecting the process flow, and filling in parameters such as sample size.

[0081] In traditional manual operation mode, operators face numerous problems. On the one hand, they need to lock the prohibition buttons for each operation procedure to prevent accidental operation from damaging the equipment or causing experimental failure. On the other hand, back-end technicians need to manually judge the validity of the parameters entered by the user, which is not only time-consuming but also prone to errors due to human negligence. In addition, there is no automatic analysis and recording before and after equipment alarms, and there are no warnings for abnormal parameter entries, making problem troubleshooting and resolution inefficient.

[0082] Traditional equipment management also presents challenges. Process data is scattered across multiple folders and exists in binary recipe file format, making parsing difficult. This complicates the extraction and analysis of key parameters, making it difficult to utilize this data for AI process analysis or consumable cost calculation. Consequently, accurate statistics on consumable usage and costs cannot be obtained, increasing the difficulty of equipment management and hindering cost control.

[0083] The existing technologies fail to fully meet users' needs for ease of operation, safety, and management efficiency. Low automation leads to inefficient experimental preparation and a high risk of parameter setting errors. The lack of intelligent monitoring and early warning mechanisms prevents timely response and handling of alarms or abnormal parameters. Furthermore, the complexity of data management limits the possibilities for process optimization and cost control. These problems not only affect equipment utilization efficiency and experimental accuracy but also increase the burden and cost of equipment management.

[0084] In summary, traditional coating and developing equipment has many shortcomings in its operation and management, making it difficult to meet the demands for high efficiency, precision, safety, and intelligence in modern laboratory and production environments. This has led to the development of the coating and developing method and apparatus described in this application, aiming to solve the various problems existing in related technologies and improve the overall performance of the equipment and the user experience.

[0085] This application aims to address at least one of the technical problems existing in the related art. To this end, this application proposes a coating and developing method, apparatus, electronic equipment, and storage medium, which can improve the simplicity and accuracy of coating and developing operations.

[0086] The following explanation is based on the accompanying drawings.

[0087] Reference Figure 1 The coating and developing method according to the embodiments of this application may include:

[0088] Step S101: Obtain the input parameters for the coating process and the input parameters for the developing process;

[0089] Step S102: Perform compliance screening on the input parameters of the coating process and the input parameters of the developing process to obtain a set of standardized target parameters;

[0090] Step S103: Assign values ​​to the preset operation parameter collection column according to the standard target parameter set; wherein, the operation parameter collection column includes the glue application operation parameter column and the developing operation parameter column.

[0091] Step S104: Perform the adhesive application operation on the target sample based on the assigned adhesive application parameters.

[0092] Step S105: After performing the coating operation, perform the development operation on the target sample based on the assigned development operation parameter column.

[0093] In some embodiments, step S101 involves obtaining the coating process input parameters and the developing process input parameters;

[0094] It should be noted that the steps involve obtaining the input parameters for the coating and developing processes. This step collects all process parameters required by the user during coating and developing through a unified interface or system, including detailed information such as file name, process flow selection, sample size, and photoresist type. Unlike traditional manual input methods, this embodiment can employ more efficient input methods, such as template filling, preset parameter selection, or data integration with the upper-level management system, thereby reducing the complexity of user input and the probability of errors.

[0095] In some more specific embodiments, a user interface (UI) can be provided, allowing users to directly input values ​​via the keyboard. This approach provides an intuitive user experience; users simply follow the on-screen prompts to fill in the necessary process parameters for coating and developing, such as file name, process flow selection, sample size, and photoresist type. The UI can use a form-based approach, categorizing and organizing the parameters for coating and developing, making it convenient for users to fill them in one by one. Furthermore, the interface can provide default values ​​for the parameters, helping users complete the input quickly and reducing operation time. In this way, users can quickly and accurately input process parameters, avoiding omissions or errors that may occur during traditional manual input.

[0096] In other more specific embodiments, intelligent voice input can also be used. Users can describe the experiments they need to perform, and the system can automatically identify and extract key parameters. The voice input dialog box can be designed in the form of natural language interaction. Users only need to state the basic requirements of the experiment, such as sample size and photoresist type, and this embodiment will automatically match the corresponding process parameters. If some necessary parameters are found to be missing during the voice recognition process, this embodiment will promptly ask the user through a pop-up window or voice prompt to ensure the completeness of the parameters. At the same time, this embodiment will also perform logical verification on the input parameters. Once parameters that do not conform to the process logic are found, a warning will be issued immediately and the user will be prompted to correct them. After completing the voice input, the user can confirm the completion of parameter input and start the experiment by saying the voice prompt "Experiment record completed, start experiment" or clicking the "Start Experiment" button on the screen. This voice input method is not only convenient and fast, but also effectively reduces errors caused by manual input, and is especially suitable for scenarios that require two-handed operation of equipment or working in a sterile environment.

[0097] In step S102 of some embodiments, compliance screening is performed on the input parameters of the coating process and the input parameters of the developing process to obtain a set of standardized target parameters;

[0098] It should be noted that compliance screening is performed on the acquired input parameters for the coating and developing processes to obtain a set of standardized target parameters. This is one of the key innovations of this application's embodiments. Through preset compliance rules and logical judgments, this application's embodiments automatically check whether the parameters entered by the user meet the process requirements and equipment operating specifications. For example, it checks whether the sample size and adhesive quantity selection match, whether the developer spraying time exceeds the allowable range, whether the hot plate temperature setting is too high, and whether the process flow sequence is correct. For parameters that do not meet the specifications, this application's embodiments will prompt the user to make corrections, thereby avoiding experimental failures or equipment damage caused by parameter errors. This automated compliance screening greatly improves the accuracy and efficiency of parameter settings and reduces the risks caused by manual input errors in traditional operations.

[0099] Reference Figure 2 According to some embodiments of this application, the input parameters for the coating process include the amount of adhesive, and the input parameters for the developing process include the duration of developer spraying. Step S102 performs compliance screening on the input parameters for the coating process and the input parameters for the developing process to obtain a set of compliant target parameters, which may include:

[0100] Step S201: Obtain sample size information matching the target sample;

[0101] Step S202: Based on the sample size information, conduct compliance screening of the input parameters for adhesive volume and developer spraying time.

[0102] Step S203: In the compliance screening, in response to the glue quantity input parameter meeting the glue quantity constraint condition preset by the sample size information, the glue quantity input parameter is included in the standard target parameter set;

[0103] In step S204, during the compliance screening, in response to the fact that the developer spraying time input parameter meets the spraying constraint conditions preset by the sample size information, the developer spraying time input parameter is included in the standard target parameter set.

[0104] In some embodiments of this application, the input parameters for the coating process include the amount of adhesive, while the input parameters for the developing process include the developer spraying time. The purpose of compliance screening for these input parameters is to ensure they meet specific process requirements and equipment operating specifications, thereby improving the accuracy and success rate of the process.

[0105] In some embodiments, step S201 involves obtaining sample size information that matches the target sample;

[0106] It is important to note that obtaining sample size information matching the target sample is necessary. This step is crucial because sample size directly affects multiple parameter settings in the coating and developing processes. For example, larger samples may require more adhesive and a longer developer spraying time. By obtaining accurate sample size information, the embodiments of this application can provide a basis for subsequent parameter screening.

[0107] In some embodiments, steps S202 to S204 involve performing compliance screening on the glue quantity input parameter and the developer spraying time input parameter based on the sample size information. During the compliance screening, if the glue quantity input parameter meets the glue quantity constraint condition preset by the sample size information, the glue quantity input parameter is included in the standard target parameter set. Similarly, if the developer spraying time input parameter meets the spraying constraint condition preset by the sample size information, the developer spraying time input parameter is included in the standard target parameter set.

[0108] It should be noted that, based on the obtained sample size information, this embodiment of the application performs compliance screening on the input parameters of adhesive volume and developer spraying time. This step involves checking whether these input parameters meet preset constraints.

[0109] In some embodiments, the input glue volume parameter can be checked to see if it meets the preset glue volume constraints of the sample size information. For example, if the sample size is 4 inches or a 4-inch fixture, the embodiment of this application will select formulation Rcp1; while if the sample size is 6 inches, formulation Rcp2 will be selected. These formulations contain key parameters such as glue volume, rotation speed, time, and temperature that match the sample size, ensuring the accuracy and consistency of the coating and developing processes. By using preset formulations such as Rcp1 and Rcp2, the equipment can automatically adjust to settings suitable for the current process, thereby reducing operator setting errors and improving production efficiency and process quality. If the input glue volume parameter meets these constraints, the embodiment of this application will include it in the specified target parameter set.

[0110] In other embodiments, it can be checked whether the developer spraying time input parameter meets the spraying constraints preset by the sample size information. For example, for a 4-inch sample, the developer spraying time may not exceed 1.5 seconds; while for a 6-inch sample, this time limit may be 3.5 seconds. If the input developer spraying time meets these conditions, the embodiments of this application will also be included in the specification target parameter set.

[0111] Through the aforementioned compliance screening steps, this embodiment of the application ensures that the input parameters for the coating and developing processes meet process requirements and equipment operating specifications. This not only helps improve the accuracy and success rate of the process but also reduces the risk of experimental failure or equipment damage due to incorrect parameter settings. The formation of a standardized target parameter set is a crucial step in achieving automated and efficient process flows, providing a reliable parameter basis for subsequent coating and developing operations.

[0112] Reference Figure 3 According to some embodiments of this application, step S102 performs compliance screening on the input parameters of the coating process and the input parameters of the developing process to obtain a set of standardized target parameters, which may include:

[0113] Step S301: Analyze the process sequence for the input parameters of the coating process and the developing process to obtain the process selection parameters;

[0114] Step S302: Based on preset process selection conditions, perform compliance screening on process selection parameters;

[0115] In step S303, during compliance screening, in response to the process selection parameters meeting the process selection conditions, a target step sequence option is determined from several candidate step sequence options based on the process selection parameters; wherein, each candidate step sequence option contains a preset step sequence process information.

[0116] Step S304: Incorporate the step sequence information corresponding to the target step sequence option into the standard target parameter set.

[0117] In some embodiments, step S301 involves analyzing the process sequence of the input parameters for the coating process and the developing process to obtain the process selection parameters.

[0118] It should be noted that during the compliance screening of input parameters for the coating and developing processes, the first step involves analyzing these parameters to determine the process selection parameters. This process ensures the rationality and logic of the process steps, as both coating and developing processes require a specific sequence to guarantee the final process quality and accuracy of the results. For example, in the coating process, CA alignment must be performed before HMDS or COT coating operations can be performed; similarly, in the developing process, steps such as spraying developer, developing, and fixing must be performed in a specific order.

[0119] It's important to explain that CA alignment, short for "Chuck Alignment," is a crucial step in the photoresist coating and development process. During operation, the silicon wafer is placed on a chuck, and its position is adjusted to align the center of the wafer with the rotation axis of the equipment. This step ensures that subsequent photoresist coating and development processes are performed uniformly on the wafer, avoiding uneven photoresist coating or incomplete development due to misalignment. If the wafer is not accurately aligned, pattern transfer errors may occur during subsequent photolithography, affecting the performance and yield of the final device.

[0120] It needs to be explained that HMDS (Hexamethyldisilazane) is a chemical used to improve the adhesion of photoresist to the silicon wafer surface. Exposing the silicon wafer to HMDS vapor or solution for a period of time allows HMDS to form a thin film on the wafer surface, enhancing the adhesion between the photoresist and the silicon wafer, and improving the stability and pattern transfer accuracy of the photoresist in subsequent processes. The HMDS time needs to be precisely controlled according to process requirements; the HMDS time refers to the time the silicon wafer undergoes during the HMDS treatment process.

[0121] It's important to clarify that "COT" in COT coating usually refers to "Coater," meaning a photoresist coating machine. COT coating is the process of uniformly applying photoresist to the surface of a silicon wafer. During coating, the silicon wafer is placed on a rotating chuck, and the photoresist is applied to the wafer surface through nozzles or a spin coater. As the wafer rotates at high speed, the photoresist spreads evenly across the entire wafer surface under centrifugal force, forming a uniform film. Coating parameters, such as rotation speed, rotation time, and photoresist flow rate, all affect the thickness and uniformity of the film. Different process requirements may necessitate adjustments to these parameters to achieve the desired coating effect.

[0122] In some embodiments, step S302 involves performing compliance screening on the process selection parameters based on preset process selection conditions.

[0123] It should be noted that compliance screening is performed on the process selection parameters based on preset process selection conditions. This step is to verify whether the process selection parameters meet the requirements of the process flow. For example, in the coating process, if the user selects a specific process flow, such as "CA centering + HMDS + cold plate", this embodiment of the application needs to ensure that these process selection parameters meet preset conditions, such as the correct sequence and necessary steps. Similarly, in the developing process, it is also necessary to check whether the process selection parameters meet the requirements of the developing process, such as whether the order of spraying developer, developing, and fixing is correct.

[0124] It's important to explain that the hot plate is a crucial component of the photoresist coating and developing system, used for heat treatment of silicon wafers coated with photoresist. After coating, the silicon wafer is transferred to the hot plate for baking, a process commonly known as "soft baking." The temperature and baking time of the hot plate are critical parameters, affecting solvent evaporation in the photoresist, the degree of curing of the photoresist film, and its adhesion to the silicon wafer surface. By precisely controlling the temperature and time of the hot plate, a stable and uniform photoresist film can be formed, preparing the wafer for subsequent exposure and development processes. Common hot plate temperatures range from tens to two hundred degrees Celsius, with the specific temperature and time determined based on the characteristics of the photoresist and process requirements.

[0125] It's important to explain that the function of a cold plate corresponds to that of a hot plate, primarily used to cool silicon wafers after certain process steps. For example, after baking on a hot plate, the silicon wafer is placed on a cold plate to rapidly cool it to room temperature or a specific process temperature. The cold plate absorbs heat from the silicon wafer through the circulation of a cooling medium (such as cooling water), achieving rapid cooling. This step helps stabilize the temperature of the silicon wafer, reducing potential stress on the wafer or changes in photoresist performance caused by temperature variations, thereby ensuring the stability and consistency of subsequent processes.

[0126] In step S303 of some embodiments, during compliance screening, in response to the process selection parameters meeting the process selection conditions, a target step sequence option is determined from several candidate step sequence options based on the process selection parameters; wherein, each candidate step sequence option includes a preset step sequence flow information;

[0127] It should be noted that during the compliance screening process, if the process selection parameters meet the process selection conditions, this embodiment will determine the target step sequence option from several candidate step sequence options based on these parameters. Each candidate step sequence option contains a preset step sequence flow information, which defines the specific operation steps and order. For example, for the adhesive coating process, the candidate step sequence options may include different process flows such as "CA centering + HMDS + cold plate" or "CA centering + COT adhesive coating + hot plate + cold plate". This embodiment needs to select the most suitable step sequence flow as the target step sequence option from these candidate options based on user input and the results of the compliance screening.

[0128] In some embodiments, step S304 involves incorporating the step sequence information corresponding to the target step sequence option into the standard target parameter set.

[0129] It should be noted that the step sequence information corresponding to the target step sequence option is included in the standardized target parameter set. This step ensures the completeness and accuracy of the process flow, as the standardized target parameter set contains all validated and screened process parameters and steps. In this way, the embodiments of this application can ensure the smooth execution of the coating and developing processes, while guaranteeing process quality and result reliability.

[0130] Through this compliance screening and parameter set construction process, the embodiments of this application can effectively reduce potential errors by users when inputting process parameters, simplify operating procedures, and improve production efficiency. At the same time, this also ensures the standardization and consistency of the process flow.

[0131] According to some more specific embodiments of this application, compliance screening for the input parameters of the coating process and the developing process may further include the following aspects:

[0132] Limiting the hot plate temperature is a critical safety measure. During the photoresist coating and developing processes, the hot plate temperature is strictly limited to no more than 200°C. This limit is to prevent potential photoresist degradation, equipment damage, or even safety accidents caused by high temperatures. By setting this upper temperature limit in the system, the risks associated with excessively high temperatures can be effectively avoided, ensuring that the process operates within a safe temperature range.

[0133] The limitation on developing speed and the default settings for spin-off parameters are also to protect the equipment and ensure process quality. The developing speed cannot exceed 7 rpm; this rule prevents developer splashing due to excessive speed, which could affect the developing effect and avoid unnecessary wear on the equipment. Furthermore, both the spin-off speed and acceleration are set to 500 rpm by default. This setting ensures effective spin-off while avoiding potential damage to the equipment or samples due to excessive speed. Through these default parameter settings, the embodiments of this application not only improve operational simplicity but also ensure process stability and equipment lifespan.

[0134] The correspondence between photoresist types and PR options in the software interface is crucial for ensuring process compatibility. When users select different photoresist types, the software interface provides corresponding PR1, PR2, and PR3 options. This correspondence ensures a match between the photoresist characteristics and process parameters, thereby achieving optimal lithography results. By restricting users from selecting PR options that are incompatible with the photoresist type, the system avoids process failures caused by incorrect selections, improving process consistency and reliability.

[0135] For parameter settings in non-critical steps, this application provides default settings based on experience. These non-critical steps include rinsing out the developer, back washing, and spin drying. Although they have a relatively small impact on the final process result, their parameter settings are equally important. By providing default parameters, the system reduces the user's setup time for these steps and speeds up the experimental preparation process. Furthermore, these default parameters are derived from extensive experimental data and experience, ensuring the basic requirements of the process and avoiding setup errors that might occur due to user unfamiliarity with these steps.

[0136] Through the above measures, the embodiments of this application not only improve the safety and accuracy of the coating and developing process, but also significantly enhance user experience and operational efficiency through intelligent and automated parameter settings. These detailed optimizations make the entire process smoother and more reliable, providing a more advanced coating and developing solution for the micro-nano fabrication field.

[0137] In step S103 of some embodiments, values ​​are assigned to the preset operation parameter collection column according to the specified target parameter set; wherein, the operation parameter collection column includes the glue application operation parameter column and the developing operation parameter column;

[0138] It should be noted that, based on the specified target parameter set, values ​​are assigned to the preset operation parameter collection columns. These operation parameter collection columns include the adhesive coating operation parameter column and the developing operation parameter column. In this embodiment, the compliant parameters are automatically filled into the corresponding operation parameter collection columns, ensuring that the parameters required for each process step are in the correct positions. This step not only improves the efficiency of parameter management but also avoids parameter misalignment or omissions that may occur in traditional operations, thus fully preparing for subsequent adhesive coating and developing operations.

[0139] Reference Figure 4 According to some embodiments of this application, the standardized target parameter set includes single-mapping target parameters and multi-mapping target parameters. Step S103, which assigns values ​​to the preset job parameter collection column according to the standardized target parameter set, may include:

[0140] Step S401: Determine several parameters to be filled from the operation parameter collection column;

[0141] Step S402: Iterate through several parameter fields to be filled, and determine the single field to be filled for a single assignment type and the combined field to be filled for a combined assignment type.

[0142] Step S403: Based on each single mapping target parameter, perform a value assignment operation for the matching single field to be filled.

[0143] Step S404: Based on each multi-mapping target parameter, perform a value assignment operation for the matching combination of fields to be filled.

[0144] In some embodiments of this application, the construction of the target parameter set considers different mapping types of parameters, namely single-mapping target parameters and multi-mapping target parameters. This design aims to improve the flexibility and accuracy of parameter management, ensuring that each parameter is correctly applied to the job parameter collection column.

[0145] It should be understood that the specification target parameter set includes single-mapped target parameters and multi-mapped target parameters. Single-mapped target parameters refer to those parameters that correspond one-to-one with a single field to be filled in the job parameter collection column within the specification target parameter set. These parameters typically have a clear, singular function or purpose, such as coating speed or developing time. Multi-mapped target parameters, on the other hand, involve combinations of multiple parameters that may need to be applied to multiple combined fields to be filled in the job parameter collection column. These parameters may be composite steps in the process flow or operations that require multiple parameters to define together, such as complex coating or developing processes.

[0146] In some embodiments, step S401 involves determining several parameter fields to be filled from the job parameter collection column;

[0147] It should be noted that the process of assigning values ​​to the preset operation parameter collection column according to the specified target parameter set begins with identifying several parameter fields to be filled in the operation parameter collection column. These parameter fields are the specific locations where values ​​need to be assigned, corresponding to the actual process operation steps or equipment control parameters. The operation parameter collection column may include multiple parts such as the coating operation parameter column and the developing operation parameter column. Each part contains a series of parameter fields to be filled, used to collect and organize the parameters required to perform the coating and developing operations.

[0148] In step S402 of some embodiments, several parameter fields to be filled are traversed to determine single fields to be filled with a single assignment type and combined fields to be filled with a combined assignment type.

[0149] It should be noted that the process involves traversing several parameter fields to identify single-assignment-type fields and combined-assignment-type fields. Single-assignment-type fields require only one parameter value and typically correspond to a single mapping target parameter. Combined-assignment-type fields, on the other hand, may require a combination of multiple parameter values ​​derived from multiple mapping target parameters. Through this traversal and classification, the embodiments of this application can clearly define the assignment requirements for each field, preparing for subsequent assignment operations.

[0150] According to some specific implementations, "single-value type single-entry field" refers to input fields that require only one specific parameter value. For example, for the parameter of developer spraying and sweeping away, the user only needs to select "yes" or "no"; the center position developer spraying time requires the user to input a specific time value, such as 1.5 seconds; similarly, the center position developer spraying speed requires a speed value, such as 500 rpm. Parameters such as developing time, developing speed, fixing time, fixing speed, and fixing sweeping away also belong to the single-value type. Each parameter has a clear physical meaning and independent setting requirements, directly corresponding to a specific operating condition or equipment control parameter in the process. These parameters all have corresponding single-entry fields in the operation parameter collection column, and the user only needs to fill in the corresponding value or option according to the process requirements.

[0151] According to some specific implementations, for the "combined assignment type of combined fill-in field," when the user selects Process One or Process Two, the corresponding process units need to be filled into the orange dotted boxes on the interface in sequence. For example, if the user selects Process One, namely "CA centering + HMDS + cold plate," then these three process units need to be filled into the respective positions of the combined fill-in field in the correct order. Each process unit represents a step or stage in the process flow, and together they constitute a complete process flow. This combined assignment method is suitable for process flows that require multiple steps to work together. By combining multiple steps together, the integrity and correctness of the process flow are ensured. The design of the combined fill-in field takes into account the complexity and diversity of process flows, allowing users to flexibly combine different process units according to actual needs to adapt to different process requirements. This design not only improves operational flexibility but also reduces process problems caused by missing steps or incorrect sequences, improving the accuracy and efficiency of process execution.

[0152] In some embodiments, step S403 involves assigning a value to a single matching field based on each single mapping target parameter.

[0153] It should be noted that, for single-mapped target parameters, this embodiment assigns values ​​to matching single fields based on the characteristics of each parameter. This step ensures that each single parameter is correctly placed in the corresponding position in the job parameter collection column. For example, the glue quantity parameter is assigned to the glue quantity field in the glue application job parameter column, and the developer spraying time is assigned to the corresponding position in the developing job parameter column. This one-to-one assignment method guarantees the accuracy of the parameters and the traceability of the operation.

[0154] In some embodiments, step S404 involves assigning values ​​to the matching combination fields to be filled based on each multiple mapping target parameter.

[0155] It should be noted that for multiple mapping target parameters, this embodiment requires assigning values ​​to the matching combination fields based on the characteristics of each parameter combination. This may involve combining multiple parameters into a composite parameter or applying multiple parameters to multiple related fields. For example, a complex adhesive application process may require combining multiple parameters, such as rotation speed, time, and temperature. These parameters will be combined and assigned to the corresponding combination fields in the adhesive application parameter column. This many-to-many assignment method improves the flexibility of parameter management and can adapt to more complex process requirements.

[0156] Through the above process, the embodiments of this application can effectively and correctly assign the parameters from the standardized target parameter set to the operation parameter collection column, thereby ensuring the smooth execution of the coating and developing processes. This process not only improves the efficiency of parameter management but also enhances the accuracy and reliability of process operations.

[0157] In some embodiments, step S104 involves performing an adhesive application operation on the target sample based on the assigned adhesive application parameter column.

[0158] It should be noted that, based on the assigned parameters in the coating operation column, this embodiment performs the coating operation on the target sample. Since the parameters have undergone compliance screening and been correctly assigned, the coating operation can be accurately executed according to the preset process flow, including steps such as photoresist coating, spin coating, and hot plate baking. This automated coating operation not only improves the consistency of coating quality but also reduces manual intervention, thereby enhancing the overall efficiency and stability of the operation.

[0159] In some embodiments, step S105 involves performing a development operation on the target sample based on the assigned development operation parameter column after the coating operation is performed.

[0160] It should be noted that after the resist coating operation is completed, this embodiment performs the development operation on the target sample based on the assigned development operation parameters. Similarly, the parameters, which have undergone compliance screening, ensure the accuracy and stability of the development process. The development operation includes steps such as spraying the developer, spin development, and fixing. This embodiment precisely controls the time, rotation speed, and temperature of each step according to preset parameters, thereby achieving a high-quality development effect. By automating the parameter setting and execution process of the resist coating and development operations, this method significantly improves the efficiency and reliability of the entire photolithography process, reduces the difficulty of operation and the probability of errors, and meets the user's needs for ease of operation and high efficiency.

[0161] Reference Figure 5 According to some embodiments of this application, after performing a development operation on the target sample based on the assigned development operation parameter column in step S105, the following may also be included:

[0162] Step S501: Obtain the parameter parsing requirements, the actual collected parameters of the coating operation, and the actual collected parameters of the developing operation.

[0163] Step S502: Based on the parameter analysis requirements, analyze the actual collected parameters for coating and development to obtain the required analysis result data.

[0164] In some embodiments of this application, after performing the developing operation, the process further includes obtaining parameter analysis requirements and the actual collected parameters of coating and developing, and analyzing these parameters to generate requirement analysis result data.

[0165] In some embodiments, step S501 involves obtaining parameter parsing requirements, actual glue-coating parameters collected for the glue-coating operation, and actual development parameters collected for the development operation.

[0166] It's important to note that the parameter analysis requirement step is to clarify what specific information needs to be extracted from the coating or developing operations. These requirements may include process quality assessment, equipment performance monitoring, and consumable usage statistics. For example, users may want to know whether the actual amount of photoresist sprayed during coating meets expectations, or whether the developer spraying time during developing is within the allowable range. Next, it's necessary to obtain the actual coating parameters for the coating operation and the actual developing parameters for the developing operation. These parameters are data collected in real-time by equipment sensors, control systems, or other monitoring devices during coating and developing. For example, during coating, the equipment may record parameters such as the actual spraying RRC time, photoresist spraying volume, and spin speed; during developing, it may record parameters such as developer spraying time, developing speed, and fixing time. These parameters reflect the actual process execution and are crucial for evaluating process effectiveness and equipment operating status.

[0167] It's important to note that "RRC" stands for "Resist Remover Chemical." In the photoresist coating and development process, it's sometimes necessary to remove residual photoresist or photoresist coatings from the silicon wafer. This is for example, when a process error requires restarting or during a specific cleaning step. Spraying RRC involves uniformly spraying the photoresist remover onto the silicon wafer surface through a nozzle, combined with a certain rotation and processing time, allowing the photoresist to react chemically with the remover and be dissolved or peeled off. Afterward, a cleaning step is usually required to remove any remaining remover and photoresist residue, ensuring a clean silicon wafer surface. This step is crucial for ensuring the quality of subsequent processes and the reusability of the silicon wafer.

[0168] In step S502 of some embodiments, the actual collected parameters for coating and development are analyzed based on the parameter analysis requirements to obtain the requirement analysis result data.

[0169] It should be noted that after obtaining the parameter analysis requirements and the actual collected parameters, this embodiment will analyze the actual collected parameters for coating and developing based on these requirements. The analysis process may involve data filtering, transformation, calculation, and analysis, with the aim of extracting information that meets user needs from a large amount of raw data. For example, if the user is concerned about consumable usage, this embodiment will extract data related to consumable usage from the actual collected parameters, such as RRC spraying time and photoresist spraying time, and calculate the actual consumable usage based on this data. The analysis results will be organized into requirement analysis result data, which can be presented to the user in the form of reports, charts, or other visualizations to help the user quickly understand the process execution and equipment operating status.

[0170] It should be understood that implementing this process is crucial for improving the transparency and controllability of the process. By collecting and analyzing process parameters in real time, the embodiments of this application can promptly identify anomalies in process execution, providing data support for process optimization and equipment maintenance. Simultaneously, this lays the foundation for automated and intelligent process management, enabling users to manage the coating and developing process more efficiently, ensuring product quality and production efficiency.

[0171] Reference Figure 6 According to some embodiments of this application, the actual collected parameters for coating and developing are analyzed based on parameter analysis requirements to obtain the required analysis result data, which may include:

[0172] Step S601: In response to the parameter analysis requirement for consumable cost analysis, obtain the unit price of consumables corresponding to various preset consumable types; wherein, the preset consumable types include photoresist type, photoresist remover type, developer type and ultrapure water type;

[0173] Step S602: Extract consumable parameters from the actual collected parameters of photoresist coating and development to obtain the photoresist spraying flow rate, photoresist spraying time, remover spraying flow rate, remover spraying time, developer spraying flow rate, developer spraying time, ultrapure water spraying flow rate, and ultrapure water spraying time.

[0174] Step S603: Calculate the cost of photoresist consumables based on the photoresist spraying flow rate, photoresist spraying time, and the unit price of the photoresist type.

[0175] Step S604: Calculate the cost of the remover consumables based on the remover spray flow rate, remover spray time, and the unit price of the remover type.

[0176] Step S605: Calculate the cost of developer consumables based on the developer spray flow rate, developer spray time, and the unit price of the developer type.

[0177] Step S606: Calculate the cost of ultrapure water consumables based on the ultrapure water spray flow rate, ultrapure water spray time, and the unit price of ultrapure water type.

[0178] Step S607: Based on the cost of photoresist consumables, the cost of remover consumables, the cost of image solution consumables, and the cost of ultrapure water consumables, determine the demand analysis result data that matches the consumable cost analysis requirements.

[0179] In some embodiments of this application, the process of analyzing the actual parameters collected for adhesive application and development based on parameter analysis requirements can generate demand analysis result data related to consumable costs. This process involves multiple steps and aims to accurately calculate and summarize the usage costs of various preset consumable types.

[0180] In some embodiments, step S601, in response to the parameter parsing requirement being a consumable cost parsing requirement, obtains the unit price of consumables corresponding to various preset consumable types; wherein, the preset consumable types include photoresist type, photoresist remover type, developer type, and ultrapure water type;

[0181] It should be noted that when the parameter parsing requirement is for consumable cost analysis, this embodiment of the application needs to obtain the unit price of consumables corresponding to various preset consumable types. These preset consumable types include photoresist type, photoresist remover type, developer type, and ultrapure water type. This step ensures the accuracy and reliability of subsequent cost calculations, as the unit price of consumables is a key factor in cost calculation. The system may obtain this unit price information from an internal database or an external price list to ensure its timeliness and accuracy.

[0182] In step S602 of some embodiments, consumable parameters are extracted based on the actual collected parameters of photoresist coating and actual collected parameters of development to obtain photoresist spraying flow rate, photoresist spraying time, remover spraying flow rate, remover spraying time, developer spraying flow rate, developer spraying time, ultrapure water spraying flow rate, and ultrapure water spraying time.

[0183] It should be noted that this application embodiment extracts consumable parameters based on the actual collected parameters during photoresist coating and development. By analyzing these parameters, this application embodiment can obtain key data such as photoresist spraying flow rate, photoresist spraying time, remover spraying flow rate, remover spraying time, developer spraying flow rate, developer spraying time, ultrapure water spraying flow rate, and ultrapure water spraying time. These data reflect the actual usage of various consumables during the photoresist coating and development processes and are the basis for calculating consumable costs.

[0184] In some embodiments, steps S603 to S606 involve calculating the cost of photoresist consumables based on photoresist spraying flow rate, photoresist spraying time, and the unit price of photoresist type consumables; calculating the cost of remover consumables based on remover spraying flow rate, remover spraying time, and the unit price of remover type consumables; calculating the cost of developer consumables based on developer spraying flow rate, developer spraying time, and the unit price of developer type consumables; and calculating the cost of ultrapure water consumables based on ultrapure water spraying flow rate, ultrapure water spraying time, and the unit price of ultrapure water type consumables.

[0185] It should be noted that the cost calculation in this application embodiment is based on the extracted photoresist spraying flow rate, photoresist spraying time, and the unit price of the photoresist type consumable, thus obtaining the cost of photoresist consumables. Similarly, the cost calculation in this application embodiment is based on the spraying flow rate, spraying time, and unit price of the respective types of consumables for the remover, developer, and ultrapure water, respectively, thus obtaining the corresponding costs of remover consumables, developer consumables, and ultrapure water consumables. These calculation steps ensure that the cost of each consumable is calculated and considered separately, avoiding omissions or duplicate calculations.

[0186] In step S607 of some embodiments, the demand analysis result data matching the consumable cost analysis requirements is determined based on the cost of photoresist consumables, the cost of remover consumables, the cost of image solution consumables, and the cost of ultrapure water consumables.

[0187] It should be noted that, in this embodiment of the application, the calculated costs of photoresist consumables, remover consumables, developer consumables, and ultrapure water consumables determine the final demand analysis results data that match the consumable cost analysis requirements. This step summarizes the cost information of all relevant consumables, generating a comprehensive consumable cost report. This report helps users understand the consumable usage costs for each photoresist coating and development operation, providing an important basis for cost control and budget management.

[0188] Through this series of steps, the embodiments of this application can effectively analyze the usage of consumables in the coating and developing operations and accurately calculate the corresponding consumable costs. This not only improves the transparency of process management but also provides users with strong data support in consumable procurement, usage, and cost control.

[0189] Reference Figure 7 According to some embodiments of this application, the coating and developing method of this application may further include:

[0190] Step S701: During the application of adhesive or the development of adhesive, perform a job monitoring operation;

[0191] Step S702: In response to the capture of a violation operation by the operation monitoring, determine the matching violation handling operation based on the violation operation type of the violation operation.

[0192] Step S703: After determining the violation handling operation that matches the violation operation type, execute the violation handling operation to handle the violation operation.

[0193] In some embodiments of this application, the coating and developing method further includes implementing job monitoring operations during the coating and developing processes to ensure operational compliance and equipment safety.

[0194] In some embodiments, step S701 involves performing a job monitoring operation during the application of adhesive or the development of adhesive.

[0195] It should be noted that during the coating or developing process, this embodiment monitors all operations in real time to detect any possible violations. This monitoring mechanism can promptly identify operational anomalies, such as parameter settings exceeding allowable ranges, incorrect operation sequences, or other behaviors that do not conform to preset process specifications.

[0196] In some embodiments, step S702 involves determining a matching violation handling operation based on the violation type of the violation operation when the job monitoring operation detects a violation operation.

[0197] It should be noted that when the operation monitoring system detects a violation, this embodiment will determine the appropriate violation handling action based on the type of violation. For example, if the hot plate temperature exceeds the 200°C limit, this embodiment may immediately trigger an alarm and automatically adjust the temperature or suspend the photoresist coating operation to prevent photoresist denaturation or equipment damage due to high temperature. Similarly, if the developing speed exceeds the 7 rpm limit, this embodiment may reduce the speed to a safe range or suspend the developing operation to avoid equipment damage due to excessive speed.

[0198] In some embodiments, step S703 involves performing a violation handling operation after determining a violation handling operation that matches the violation operation type to handle the violation operation action.

[0199] It should be noted that after determining the violation handling operation matching the type of violation, this embodiment will execute the corresponding violation handling operation to promptly address the violation. This may include issuing an alarm to notify the operator, automatically adjusting equipment parameters, suspending or terminating the ongoing process step, etc. In this way, this embodiment can effectively prevent equipment damage, process failure, or safety hazards that may result from violation operations.

[0200] Furthermore, the operation monitoring system can record detailed information about violations, including the time, type, severity, and corrective actions taken. These records are invaluable for subsequent process analysis, equipment maintenance, and operator training. Analyzing violations allows for further optimization of processes, improved operational standardization, and a reduction in the probability of future violations.

[0201] In summary, by implementing operational monitoring during the coating and developing processes and taking appropriate action to address violations based on their types, the embodiments of this application significantly improve process safety and reliability. This not only helps protect equipment and ensure process quality but also provides a safer working environment for operators and offers data support for continuous process improvement.

[0202] According to some embodiments of this application, the coating and developing method of this application may further include:

[0203] In response to an alarm notification detected by the work monitoring operation, a screen recording operation is performed on the corresponding operation terminal of the glue application and developing operations to obtain alarm response record information;

[0204] Compliance analysis is performed based on alarm response record information to obtain alarm response analysis results.

[0205] In some embodiments of this application, the coating and developing method further expands its functionality to enhance operational transparency and safety. Specifically, when the job monitoring operation detects an alarm, a screen recording operation is performed on the corresponding operating terminals for the coating and developing operations to obtain alarm response record information. This mechanism ensures that critical operational screens and data can be captured in a timely manner when problems occur, providing detailed evidence for subsequent analysis and processing.

[0206] The execution of the screen recording operation means that the embodiments of this application can capture and save the screen on the operating terminal in real time, including the current status of the device, operating parameters, and any abnormal signs. These screen recordings not only help to understand the specific context when a problem occurs, but also provide operators with intuitive operational feedback, helping them to respond quickly and take appropriate measures.

[0207] Based on the acquired alarm response records, embodiments of this application can perform compliance analysis to obtain alarm response analysis results. This analysis process mainly assesses whether the operation complies with preset safety and process specifications. For example, embodiments of this application can check whether operators have taken timely and correct countermeasures when abnormal temperatures or rotational speeds occur, or whether the equipment has automatically executed preset safety protocols. Through this analysis, the appropriateness of the system's response to abnormal situations can be verified, thereby ensuring the reliability and safety of the entire process.

[0208] Furthermore, alarm response analysis results can be used for continuous improvement of process flows and operating procedures. By analyzing multiple alarm events and their responses, potential process bottlenecks or operational risks can be identified, thereby optimizing process parameter settings and operating procedures. This not only helps improve production efficiency but also reduces the risk of equipment damage and process failures due to improper operation.

[0209] As can be seen, by implementing alarm-based video recording and compliance analysis during the coating and developing processes, the embodiments of this application can provide a more comprehensive operation monitoring and problem response mechanism. This not only improves the safety and reliability of the process but also provides valuable data support for continuous process optimization and operator training.

[0210] According to some embodiments of this application, the coating and developing method of this application may further include:

[0211] During the application of adhesive or the development of adhesive, the current operation process is determined in real time.

[0212] Based on the current operation process, a comparison is made with the preset operation specification benchmark to determine the currently disabled controls that match the current operation process; wherein, the operation specification benchmark records multiple preset operation processes and the types of disabled controls that match each preset operation process;

[0213] On the corresponding operating terminal for the glue application or developing operation, disable or lock the currently disabled control.

[0214] In some embodiments of this application, the coating and developing method further improves the safety and standardization of the operation by determining the current operation process in real time during the coating or developing operation and comparing it with the preset operation standard benchmark to identify and lock the disabled controls under the current process.

[0215] Specifically, this application embodiment can track and determine the current stage of the operation process in real time during the photoresist coating or developing operation, such as whether it is in the photoresist coating stage or the developer spraying stage. This real-time monitoring function ensures the accurate grasp of the operation process in this application embodiment, providing a basis for subsequent standard comparison.

[0216] This application embodiment can also perform comparisons based on preset operational guidelines, which comprehensively record multiple preset operational procedures and the types of disabled controls corresponding to each procedure. For example, during photoresist coating, controls related to the developing operation may be disabled to prevent operators from accidentally starting the developing process prematurely. Through this comparison, the system can accurately identify the controls that should be disabled under the current operational procedure.

[0217] After identifying the currently disabled controls, embodiments of this application can perform a disable / lock operation on the corresponding operating terminal for the coating or developing operations. This effectively prevents inappropriate operations from being accidentally triggered at the current process stage, thereby avoiding potential process errors or equipment damage. For example, if a button is locked during the coating process, the operator cannot prematurely end the coating process or start other incompatible operations, ensuring the smooth progress of the process.

[0218] Furthermore, this lock-out disabling mechanism reduces operator confusion and workload in complex processes. Operators don't need to remember the detailed sequence and limitations of all operations; the system automatically handles these specifications and guides them to correctly execute the process steps.

[0219] As can be seen, by determining the operation process in real time, comparing the operation standard benchmark, and disabling and locking incompatible controls, the embodiments of this application greatly enhance the safety and standardization of the coating and developing operation, reduce the risk of operational errors, and improve the reliability and efficiency of the overall process.

[0220] Reference Figure 8 The coating and developing apparatus according to embodiments of this application may include:

[0221] Input module 801 is used to acquire input parameters for the coating process and the developing process;

[0222] The compliance screening module 802 is used to perform compliance screening on the input parameters of the coating process and the input parameters of the developing process respectively, and obtain the set of standard target parameters;

[0223] The assignment module 803 is used to assign values ​​to the preset operation parameter collection column according to the standard target parameter set; wherein, the operation parameter collection column includes the glue application operation parameter column and the developing operation parameter column;

[0224] The adhesive application module 804 is used to perform adhesive application on the target sample based on the assigned adhesive application parameters.

[0225] The developing operation module 805 is used to perform a developing operation on the target sample based on the assigned developing operation parameters after the coating operation is performed.

[0226] It is evident that the contents of the above-described coating and developing method embodiments are all applicable to the embodiments of this coating and developing apparatus. The specific functions implemented by this coating and developing apparatus embodiment are the same as those of the above-described coating and developing method embodiments, and the beneficial effects achieved are also the same as those achieved by the above-described coating and developing method embodiments.

[0227] Reference Figure 9 , Figure 9 This illustration shows the hardware structure of an electronic device according to another embodiment. The electronic device may include:

[0228] The processor 901 can be implemented using a general-purpose CPU (Central Processing Unit), microprocessor, application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of this application.

[0229] The memory 902 can be implemented as a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 902 can store the operating system and other applications. When the technical solutions provided in the embodiments of this specification are implemented through software or firmware, the relevant program code is stored in the memory 902 and is called and executed by the processor 901 using the coating and developing method of the embodiments of this application.

[0230] The input / output interface 903 is used to implement information input and output;

[0231] The communication interface 904 is used to enable communication and interaction between this device and other devices. Communication can be achieved through wired means (such as USB, Ethernet cable, etc.) or wireless means (such as mobile network, WIFI, Bluetooth, etc.).

[0232] Bus 905 transmits information between various components of the device (e.g., processor 901, memory 902, input / output interface 903, and communication interface 904);

[0233] The processor 901, memory 902, input / output interface 903, and communication interface 904 are connected to each other within the device via bus 905.

[0234] This application also provides a computer program product, which includes a computer program. A processor of a computer device reads and executes the computer program, causing the computer device to perform the above-described coating and developing method.

[0235] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in this disclosure and the foregoing drawings are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this disclosure described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “including,” and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that includes a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatuses.

[0236] It should be understood that in this disclosure, "at least one item" means one or more, and "more than one" means two or more. "And / or" is used to describe the relationship between related objects, indicating that three relationships can exist. For example, "A and / or B" can represent three cases: only A exists, only B exists, and both A and B exist simultaneously, where A and B can be singular or plural. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of single or plural items. For example, at least one of a, b, or c can represent: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, and c can be single or multiple.

[0237] It should be understood that in the description of the embodiments of this application, "multiple" (or more) means two or more, "greater than", "less than", "exceeding" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself.

[0238] In the several embodiments provided in this disclosure, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces, indirect coupling or communication connection between apparatuses or units, and may be electrical, mechanical, or other forms.

[0239] The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the units can be selected to achieve the purpose of this embodiment according to actual needs.

[0240] Furthermore, the functional units in the various embodiments of this disclosure can be integrated into one processing unit, or each unit can exist physically separately, or two or more units can be integrated into one unit. The integrated unit can be implemented in hardware or as a software functional unit.

[0241] If the integrated unit is implemented as a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this disclosure, in essence, or the part that contributes to related technologies, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this disclosure. The aforementioned storage medium may include: a USB flash drive, a portable hard drive, a read-only memory (ROM), a random access memory (RAM), a magnetic disk, or an optical disk, and other media capable of storing program code.

[0242] It should also be understood that the various implementation methods provided in this application can be combined arbitrarily to achieve different technical effects.

[0243] The above is a detailed description of the embodiments of this disclosure. However, this disclosure is not limited to the above embodiments. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this disclosure. All such equivalent modifications or substitutions are included within the scope defined by the claims of this disclosure.

Claims

1. A method for developing a coating agent, characterized in that, include: Obtain the input parameters for the coating process and the developing process; Compliance screening is performed on the input parameters of the coating process and the input parameters of the developing process to obtain a set of standardized target parameters; wherein, the set of standardized target parameters includes single-mapping target parameters and multi-mapping target parameters; According to the specified target parameter set, values ​​are assigned to the preset operation parameter collection column; wherein, the operation parameter collection column includes the glue application operation parameter column and the developing operation parameter column; The glue application operation is performed on the target sample based on the assigned glue application parameters. After the coating operation is performed, the development operation is performed on the target sample based on the assigned development operation parameters. The step of assigning values ​​to the preset task parameter collection column according to the specified target parameter set includes: Several parameters to be filled in are determined from the task parameter collection column; Iterate through several of the parameter fields to be filled, and determine the single field to be filled with a single assignment type and the combined field to be filled with a combined assignment type. Based on each of the single mapping target parameters, an assignment operation is performed on the matching single field to be filled. Based on each of the multiple mapping target parameters, a value assignment operation is performed on the matching combination of fields to be filled.

2. The method according to claim 1, characterized in that, The input parameters for the coating process include the amount of adhesive, and the input parameters for the developing process include the duration of developer spraying. Compliance screening is performed on both the coating and developing process input parameters to obtain a set of compliant target parameters, including: Obtain sample size information that matches the target sample; Based on the sample size information, compliance screening is performed on the input parameters of adhesive volume and developer spraying time. In the compliance screening, in response to the glue volume input parameter satisfying the glue volume constraint condition preset by the sample size information, the glue volume input parameter is included in the standard target parameter set; During compliance screening, in response to the fact that the developer spraying time input parameter meets the spraying constraint conditions preset by the sample size information, the developer spraying time input parameter is included in the standard target parameter set.

3. The method according to claim 1, characterized in that, The compliance screening of the input parameters for the coating process and the input parameters for the developing process is performed respectively to obtain a set of standardized target parameters, including: The process sequence is analyzed based on the input parameters of the coating process and the input parameters of the developing process to obtain the process selection parameters; Based on preset process selection conditions, the process selection parameters are screened for compliance. In the compliance screening, in response to the process selection parameters satisfying the process selection conditions, a target step sequence option is determined from several candidate step sequence options based on the process selection parameters; wherein, each candidate step sequence option contains a preset step sequence process information; The step sequence information corresponding to the target step sequence option is included in the standard target parameter set.

4. The method according to claim 1, characterized in that, After performing a development operation on the target sample based on the assigned development operation parameters, the method further includes: Obtain the parameter parsing requirements, the actual collected parameters of the glue application operation, and the actual collected parameters of the development operation; Based on the parameter analysis requirements, the actual collected parameters for coating and development are analyzed to obtain the required analysis result data.

5. The method according to claim 4, characterized in that, The process of analyzing the actual parameters collected for adhesive application and development based on the parameter analysis requirements yields the following analysis result data: In response to the parameter analysis requirement being a consumable cost analysis requirement, the unit price of consumables corresponding to various preset consumable types is obtained; wherein, the preset consumable types include photoresist type, photoresist remover type, developer type, and ultrapure water type; Based on the actual collected parameters of the photoresist coating and the actual collected parameters of the development, consumable parameters are extracted to obtain the photoresist spraying flow rate, photoresist spraying time, remover spraying flow rate, remover spraying time, developer spraying flow rate, developer spraying time, ultrapure water spraying flow rate, and ultrapure water spraying time. The cost of photoresist consumables is calculated based on the photoresist spraying flow rate, photoresist spraying time, and the unit price of the consumables for the photoresist type. The cost of the remover consumables is calculated based on the spray flow rate, spray time, and unit price of the type of remover. The cost of developer consumables is calculated based on the developer spraying flow rate, developer spraying time, and the unit price of the consumables of the developer type. The cost of ultrapure water consumables is calculated based on the ultrapure water spray flow rate, ultrapure water spray time, and the unit price of the consumables for the ultrapure water type. Based on the cost of the photoresist consumables, the cost of the remover consumables, the cost of the imaging solution consumables, and the cost of the ultrapure water consumables, the demand analysis result data matching the demand analysis requirements for the consumables costs is determined.

6. The method according to claim 1, characterized in that, The method further includes: During the execution of the coating or developing operation, a job monitoring operation is performed. In response to the capture of a violation operation by the operation monitoring, a matching violation handling operation is determined based on the violation operation type of the violation operation; After determining the violation handling operation that matches the violation operation type, the violation handling operation is executed to handle the violation operation.

7. The method according to claim 6, characterized in that, The method further includes: In response to an alarm notification detected by the work monitoring operation, a screen recording operation is performed on the corresponding operation terminals of the glue application operation and the developing operation to obtain alarm response record information; Based on the alarm response record information, a compliance analysis is performed to obtain the alarm response analysis results.

8. The method according to claim 1, characterized in that, The method further includes: During the execution of the coating or developing operation, the current operation process is determined in real time. Based on the current operation process, a comparison is performed with a preset operation specification benchmark to determine the currently disabled control that matches the current operation process; wherein, the operation specification benchmark records multiple preset operation processes and the type of disabled control that matches each preset operation process; On the operating terminal corresponding to the glue application operation or the developing operation, a disable / lock operation is performed on the currently disabled control.

9. A coating and developing apparatus, characterized in that, include: The input module is used to obtain input parameters for the coating process and the developing process; The compliance screening module is used to perform compliance screening on the input parameters of the coating process and the input parameters of the developing process respectively, and obtain a set of standardized target parameters; wherein, the set of standardized target parameters includes single-mapping target parameters and multi-mapping target parameters; The assignment module is used to assign values ​​to a preset operation parameter collection column according to the specified target parameter set; wherein the operation parameter collection column includes an adhesive application operation parameter column and a developing operation parameter column; wherein, the step of assigning values ​​to the preset operation parameter collection column according to the specified target parameter set includes: determining a number of parameter fields to be filled from the operation parameter collection column; traversing the number of parameter fields to be filled to determine single fields to be filled of a single assignment type and combined fields to be filled of a combined assignment type; performing an assignment operation on the matching single field to be filled based on each single mapping target parameter; and performing an assignment operation on the matching combined field to be filled based on each multi-mapping target parameter. The glue application module is used to perform a glue application operation on the target sample based on the assigned glue application operation parameters. The developing operation module is used to perform a developing operation on the target sample based on the assigned developing operation parameters after the coating operation is performed.

10. An electronic device, characterized in that, include: The device includes a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to implement the coating and developing method as described in any one of claims 1 to 8.

11. A computer-readable storage medium, characterized in that, The storage medium stores a program that is executed by a processor to implement the coating and developing method as described in any one of claims 1 to 8.

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