Wafer lifting carrying table and wafer transferring device

Abstract

The invention provides a wafer lifting platform deck and a wafer transferring device, and belongs to the semiconductor driving technology, and the wafer lifting platform deck comprises a supporting module, a lifting leveling module and a gravity balance module; the multiple lifting leveling modules and the multiple gravity balance modules are evenly distributed below the supporting module in a staggered mode. The multiple lifting and leveling modules conduct independent lifting driving and horizontal plane leveling on the supporting module from the lower portion. And the gravity balance module adopts a magnetic spring to support the supporting module from the lower part. The wafer lifting platform deck is provided with a plurality of Z-axis lifting units, and overall lifting and leveling are achieved; meanwhile, in order to improve the driving control precision, a gravity balance mechanism is arranged to balance part of gravity of the supporting module and the upper carrying table, driving control is more precise, the whole wafer transferring device is stable and accurate in guiding, the wafer driving efficiency is high, and application and popularization in the fields of semiconductor detection and manufacturing and high-end precise instrument driving are facilitated.

Description

Technical Field

[0001] This invention belongs to semiconductor driving technology, specifically relating to a wafer lifting platform and a wafer transfer device. Background Technology

[0002] In semiconductor wafer inspection and processing equipment, wafers typically need to be supported and positioned by a stage. However, existing stages generally only allow for height adjustment and rotation around the Z-axis, and cannot adjust the tilt angle in the XY plane. Therefore, to improve the high-precision adjustability of wafer support, a high-precision wafer lifting stage with Z-axis lifting and Rx and Ry adjustment needs to be designed. This stage is intended to provide high-precision support for wafers in scenarios such as overlay, defect, CD (critical dimension) quantity inspection, and processing. Summary of the Invention

[0003] In order to overcome the shortcomings of the prior art, the present invention aims to provide a wafer lifting stage and a wafer transfer device that can solve the above-mentioned problems.

[0004] Design principle: Multiple Z-axis lifting units are set up to achieve overall lifting and leveling; at the same time, in order to improve the driving control accuracy, a gravity balancing mechanism is set up to balance part of the weight of the support module and the upper platform.

[0005] A wafer lifting platform includes a support module, a lifting and leveling module, and a gravity balancing module. Multiple lifting and leveling modules and multiple gravity balancing modules are staggered and evenly distributed below the support module. The multiple lifting and leveling modules independently drive the support module to lift and level it from below. The gravity balancing module uses magnetic springs to support the support module from below, achieving gravity balance and improving the driving and leveling accuracy of the lifting and leveling modules.

[0006] Furthermore, the lifting and leveling module includes a lifting driver and a lifting position monitoring component; the bottom of the lifting driver is fixed, and the top of the movable end of the lifting driver is connected to the support module; the lifting position monitoring component is used to monitor the lifting position of the support module in real time.

[0007] Furthermore, the lifting position monitoring component of the lifting and leveling module includes a lifting grating ruler unit, a lifting reading head unit, and a lifting subdivision box; the lifting grating ruler unit and the lifting reading head unit are installed near the lifting drive, and the lifting subdivision box is electrically connected to the reading head of the lifting reading head unit.

[0008] Furthermore, the gravity balance module includes a magnetic spring transition sleeve, a magnetic spring mover, and a magnetic spring stator; the top of the magnetic spring transition sleeve is connected to the bottom surface of the support plate, the bottom of the magnetic spring mover is connected to the lower part of the magnetic spring transition sleeve, the lower part of the magnetic spring mover is non-contactly embedded in the receiving cavity of the magnetic spring stator, and the bottom of the magnetic spring stator is fixed.

[0009] Furthermore, the wafer lifting stage also includes a stage base, the upper surface of which is provided with multiple lifting module mounting countersunk holes and gravity balance module mounting countersunk holes; the multiple lifting module mounting countersunk holes and gravity balance module mounting countersunk holes are distributed in a ring at equal intervals on the upper surface of the stage base; the lifting module mounting countersunk holes are used to install the bottom of the lifting and leveling module, and the gravity balance module mounting countersunk holes are used to install the bottom of the gravity balance module.

[0010] Furthermore, the wafer lifting stage also includes a wafer carrier, which is connected to the support module above and is used to support and hold the wafer. The wafer carrier includes a carrier body, with multiple carrier adsorption lugs radially extended on the outer periphery of the carrier body. Wafer suction blocks are set on the carrier adsorption lugs, and two wafer fork slots are opened on the upper surface of the carrier body.

[0011] The present invention also provides a wafer transfer device, which includes a first Y-axis drive module and a second Y-axis drive module mounted on a vibration damping platform. The two ends of the X-axis drive module are connected and supported by corresponding Y-axis drive modules. The wafer adsorption stage adopts the aforementioned wafer lifting platform and is mounted on the X-axis drive module. The first Y-axis drive module and the second Y-axis drive module are independently driven and controlled and can be calibrated in real time and periodically to eliminate the residual caused by the non-orthogonality between the X-axis drive module and the two Y-axis drive modules.

[0012] Compared with the prior art, the beneficial effects of the present invention are as follows: the wafer lifting stage of this application integrates lifting and leveling functions, and adopts a gravity balance mechanism, which makes the drive control more precise, the wafer transfer device is stable and the guidance is accurate, and the wafer driving efficiency is high, which facilitates its application in the fields of semiconductor testing, manufacturing and high-precision instrument driving. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the wafer stage of the present invention; Figures 2-4 Schematic diagrams of different angles from the wafer lifting stage; Figure 5 This is a schematic diagram of the platform. Figure 6 This is a schematic diagram of a wafer transfer device.

[0014] In the picture: 10. Platform; 11. Platform body; 12. Lifting and mounting countersunk hole; 13. Gravity-balanced mounting countersunk hole; 20. Support module; 21. Support plate; 30. Lifting and leveling module; 31. Lifting driver; 32. Lifting grating ruler unit; 33. Lifting reading head unit; 34. Lifting subdivision box; 35. Lifting limit assembly; 36. Z-axis mounting top plate; 50. Gravity balance module; 51. Magnetic spring transition sleeve; 52. Magnetic spring mover; 53. Magnetic spring stator; 54. Balance top plate; 60. Wafer carrier; 61. Carrier body; 62. Carrier suction lug; 63. Wafer suction block; 64. Wafer fork slot; 100. Vibration damping platform; 200, Y-axis first drive module; 300, Y-axis second drive module; 400, X-axis drive module; 500. Wafer adsorption stage. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0016] Wafer lifting platform See Figures 1-5 The wafer lifting platform includes a support module 20, a lifting and leveling module 30, and a gravity balance module 50.

[0017] Arrangement: Multiple lifting and leveling modules 30 and multiple gravity balancing modules 50 are staggered and evenly distributed below the support module 20. The multiple lifting and leveling modules 30 independently lift and level the support module 20 from below, and the gravity balancing modules 50 use magnetic springs to support the support module 20 from below, thereby achieving gravity balance of the support module 20 and improving the driving and leveling accuracy of the lifting and leveling modules 30.

[0018] The support module 20 includes a support plate 21, on which a lifting drive mounting position and a gravity balance mounting position are provided.

[0019] The lifting and leveling module 30 includes a lifting driver 31 and a lifting position monitoring component; the bottom of the lifting driver 31 is fixed, and the top of the movable end of the lifting driver 31 is connected to the support module 20; the lifting position monitoring component is used to monitor the lifting position of the support module 20 in real time.

[0020] In the illustrated example, the lifting driver 31 uses a lifting voice coil motor. The top of the lifting voice coil motor is mounted to the lifting drive mounting position on the support plate 21. Of course, the lifting driver 31 can also take other forms, such as a high-precision drive slide, a piezoelectric driver, a high-precision linear motor, etc.

[0021] The lifting and leveling module 30 includes a lifting grating ruler unit 32, a lifting reading head unit 33, and a lifting subdivision box 34. The lifting grating ruler unit 32 and the lifting reading head unit 33 are installed near the lifting driver 31, and the lifting subdivision box 34 is electrically connected to the reading head of the lifting reading head unit 33.

[0022] Specifically, the lifting grating ruler unit 32 and the lifting reading head unit 33 are also located at the lifting drive mounting position. The lifting subdivision box 34 can also be installed on the lifting drive mounting position, the outer periphery of the support module 20, or other externally fixed mechanisms.

[0023] Furthermore, the lifting and leveling module 30 also includes a lifting limit component 35, which limits the Z-axis travel of the lifting driver 31 through a dual mode of mechanical and photoelectric limiting.

[0024] Furthermore, the lifting and leveling module 30 also includes a Z-axis mounting top plate 36 for connecting the top of the lifting driver 31 and the top of the lifting position monitoring component to the support plate 21.

[0025] The gravity balance module 50 includes a magnetic spring transition sleeve 51, a magnetic spring mover 52, and a magnetic spring stator 53. The top of the magnetic spring transition sleeve 51 is connected to the bottom surface of the support plate 21, the bottom of the magnetic spring mover 52 is connected to the lower part of the magnetic spring transition sleeve 51, the lower part of the magnetic spring mover 52 is non-contactly embedded in the receiving cavity of the magnetic spring stator 53, and the bottom of the magnetic spring stator 53 is fixed.

[0026] Furthermore, the gravity balance module 50 also includes a balance top plate 54, which is disposed on the bottom surface of the support plate 21, and the top of the magnetic spring transition sleeve 51 is connected to the bottom surface of the balance top plate 54.

[0027] See Figure 1 and Figure 5 The wafer lifting stage also includes a stage base 10. The upper surface of the stage base 11 has multiple lifting module mounting countersunk holes 12 and gravity balance module mounting countersunk holes 13. The multiple lifting module mounting countersunk holes 12 and gravity balance module mounting countersunk holes 13 are distributed in a ring at equal intervals on the upper surface of the stage base 11. The lifting module mounting countersunk holes 12 are used to install the bottom of the lifting and leveling module 30, and the gravity balance module mounting countersunk holes 13 are used to install the bottom of the gravity balance module 50.

[0028] In a specific example, the bottom of the lifting driver 31 and the lifting position monitoring component of the lifting and leveling module 30 are connected to the lifting mounting countersunk hole 12; the bottom of the magnetic spring stator 53 is connected to the gravity balance mounting countersunk hole 13.

[0029] Further, see Figure 1 The wafer lifting stage also includes a wafer carrier 60, which is connected above the support module 20 and is used to support and hold wafers. The wafer carrier 60 includes a carrier body 61, and multiple carrier adsorption lugs 62 are radially extended on the outer periphery of the carrier body 61. Wafer suction blocks 63 are provided on the carrier adsorption lugs 62, and two wafer fork slots 64 are formed on the upper surface of the carrier body 61.

[0030] Of course, in order to rotate the wafer carrier disk 60, a rotation drive module can also be provided and integrated into the support module 20. This application provides specific limitations on this, which will not be elaborated further.

[0031] Wafer transfer device See Figure 6 The wafer transfer device includes a first Y-axis drive module 200 and a second Y-axis drive module 300 mounted on a vibration damping platform 100. The X-axis drive module 400 is connected and supported at both ends by corresponding Y-axis drive modules. The wafer adsorption stage 500 adopts the aforementioned wafer lifting platform and is mounted on the X-axis drive module 400. The first Y-axis drive module 200 and the second Y-axis drive module 300 are independently driven and can be calibrated in real time and periodically to eliminate the residual caused by the non-orthogonality between the X-axis drive module 400 and the two Y-axis drive modules.

[0032] The vibration damping platform 100 and the longitudinal beams of the Y-axis drive module are made of marble or granite, ensuring stability and preventing deformation. The X-axis crossbeam of the X-axis drive module 400 and the wafer carrier 60 are made of silicon carbide, which is lightweight and stable. The air flotation assembly uses an air flotation pad.

[0033] This solution has been used in wafer nanoscale overlay inspection systems and wafer quantity inspection systems with and without images (including bright field and dark field). In the future, it will be extended to processing scenarios such as photolithography, PCB, and IC substrate.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A wafer lifting platform, characterized in that: The wafer lifting platform includes a support module (20), a lifting and leveling module (30), and a gravity balance module (50); multiple lifting and leveling modules (30) and multiple gravity balance modules (50) are evenly distributed below the support module (20); Multiple lifting and leveling modules (30) independently lift and level the support module (20) from below; the gravity balance module (50) uses magnetic springs to support the support module (20) from below, thereby achieving gravity balance of the support module (20) to improve the driving and leveling accuracy of the lifting and leveling module (30).

2. The wafer lifting stage according to claim 1, characterized in that: The support module (20) includes a support plate (21), on which a lifting drive mounting position and a gravity balance mounting position are provided.

3. The wafer lifting stage according to claim 2, characterized in that: The lifting and leveling module (30) includes a lifting driver (31) and a lifting position monitoring component; the bottom of the lifting driver (31) is fixed, and the top of the movable end of the lifting driver (31) is connected to the support module (20). The lifting position monitoring component is used to monitor the lifting position of the support module (20) in real time.

4. The wafer lifting stage according to claim 3, characterized in that: The lifting position monitoring components of the lifting and leveling module (30) include a lifting grating ruler unit (32), a lifting reading head unit (33), and a lifting subdivision box (34); the lifting grating ruler unit (32) and the lifting reading head unit (33) are installed near the lifting drive (31), and the lifting subdivision box (34) is electrically connected to the reading head of the lifting reading head unit (33).

5. The wafer lifting stage according to claim 3, characterized in that: The lifting and leveling module (30) also includes a lifting limit component (35), which limits the Z-axis travel of the lifting driver (31) through a dual mode of mechanical limit and photoelectric limit.

6. The wafer lifting stage according to claim 3, characterized in that: The lifting and leveling module (30) also includes a Z-axis mounting top plate (36) for connecting the top of the lifting drive (31) and the top of the lifting position monitoring component to the support plate (21).

7. The wafer lifting stage according to claim 2, characterized in that: The gravity balance module (50) includes a magnetic spring transition sleeve (51), a magnetic spring mover (52), and a magnetic spring stator (53). The top of the magnetic spring transition sleeve (51) is connected to the bottom surface of the support plate (21), the bottom of the magnetic spring mover (52) is connected to the lower part of the magnetic spring transition sleeve (51), the lower part of the magnetic spring mover (52) is non-contactly embedded in the receiving cavity of the magnetic spring stator (53), and the bottom of the magnetic spring stator (53) is fixed.

8. The wafer lifting stage according to claim 2, characterized in that: The wafer lifting stage also includes a stage base (10), on the upper surface of the stage base body (11) are multiple lifting module mounting countersunk holes (12) and gravity balance module mounting countersunk holes (13); the multiple lifting module mounting countersunk holes (12) and gravity balance module mounting countersunk holes (13) are distributed in a ring at equal intervals on the upper surface of the stage base body (11); The lifting module mounting countersunk hole (12) is used to install the bottom of the lifting and leveling module (30), and the gravity balance mounting countersunk hole (13) is used to install the bottom of the gravity balance module (50).

9. The wafer lifting stage according to claim 2, characterized in that: The wafer lifting stage also includes a wafer carrier (60), which is connected above the support module (20) for supporting and adsorbing wafers. The wafer carrier (60) includes a carrier body (61), and multiple carrier adsorption lugs (62) are radially extended on the outer periphery of the carrier body (61). Wafer suction blocks (63) are provided on the carrier adsorption lugs (62), and two wafer fork slots (64) are opened on the upper surface of the carrier body (61).

10. A wafer transfer device, characterized in that: The wafer transfer device includes a first Y-axis drive module (200) and a second Y-axis drive module (300) mounted on a vibration damping platform (100). The X-axis drive module (400) is connected and supported at both ends by corresponding Y-axis drive modules. The wafer adsorption stage (500) adopts the wafer lifting stage as described in any one of claims 1-9. The wafer adsorption stage (500) is mounted on the X-axis drive module (400). The first Y-axis drive module (200) and the second Y-axis drive module (300) are independently driven and can be calibrated in real time and periodically to eliminate the residual caused by the non-orthogonality between the X-axis drive module (400) and the two Y-axis drive modules.

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