Heating disc built-in driving mechanism and thin film deposition equipment thereof

Abstract

The invention discloses a heating disc built-in driving mechanism and a thin film deposition device thereof.The heating disc built-in driving mechanism comprises a shell internally provided with a through cavity, a stator arranged in the through cavity, a rotor arranged in the stator and a rotating shaft fixedly connected to the interior of the rotor; the upper gland assembly is connected to the upper end of the shell, the lower gland assembly is connected to the lower end of the shell, the upper end of the rotating shaft penetrates out of the upper gland assembly, the lower end of the rotating shaft is rotationally connected to the lower gland assembly, and the upper end of the rotating shaft is connected to the heating disc. The rotating shaft, the driving unit for driving the rotating shaft and the heating disc are coaxially arranged, so that the vibration of the heating disc is small when the heating disc is driven to rotate, and the deposition uniformity of a wafer film is improved. Meanwhile, the upper pressing outer cover and the lower pressing outer cover are provided with an air exhaust channel and an air blowing channel, powder generated by the sealing ring is rapidly pumped out, meanwhile, external particles are prevented from entering the driving unit, the sealing performance of the driving unit is improved, and the influence of the particles on the cleanliness of a process cavity and the damage of the particles to a bearing are reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor equipment, in particular to a heating disc built-in driving mechanism and a thin film deposition equipment. BACKGROUND

[0002] In a semiconductor process equipment, such as an ALD equipment, when performing a thin film deposition process, a heating disc drives a wafer to rotate at a uniform speed in a process chamber, so that the wafer is uniformly contacted with a process gas to form a film layer with a high consistency in surface thickness. However, in the existing equipment, a driving mechanism for the heating disc generally adopts a motor to drive a belt, and then the belt drives a rotating shaft at the bottom of the heating disc. The heating disc is located in the process chamber, and the rotating shaft extends out of the process chamber. Therefore, the heating disc has a large vibration and a poor end face runout precision during rotation, which cannot meet the requirement of thin film uniformity. SUMMARY

[0003] The present application aims at overcoming the deficiencies of the prior art, and providing a heating disc built-in driving mechanism and a thin film deposition equipment, so as to solve the technical problem of large vibration and poor film deposition uniformity caused by the external driving mechanism of the existing heating disc.

[0004] To achieve the above-mentioned purpose, the present application adopts the following technical scheme:

[0005] In a first aspect, the embodiments of the present application provide a heating disc built-in driving mechanism, which comprises a shell with a through cavity, a stator arranged in the through cavity, a rotor arranged in the stator, a rotating shaft fixedly connected to the rotor, an upper gland assembly connected to the upper end of the shell, and a lower gland assembly connected to the lower end of the shell. The upper end of the rotating shaft is penetrated by the upper gland assembly, and the lower end of the rotating shaft is rotatably connected to the lower gland assembly. The upper end of the rotating shaft is connected to a heating disc. The rotor drives the rotating shaft to rotate synchronously with the heating disc.

[0006] The heating disc is arranged in a process chamber, and the upper gland assembly is sealingly connected to the process chamber through a bellows.

[0007] The upper gland assembly and the shell are further provided with an upper shaft sleeve and an upper bearing embedded in the upper shaft sleeve. The rotating shaft is penetrated by the upper bearing. The top of the upper shaft sleeve is sealingly connected to the upper gland assembly, and the bottom of the upper shaft sleeve is sealingly connected to the shell.

[0008] The lower gland assembly and the shell are further provided with a lower shaft sleeve and a lower bearing embedded in the lower shaft sleeve. The rotating shaft is penetrated by the lower bearing. The top of the lower shaft sleeve is sealingly connected to the shell, and the bottom of the lower shaft sleeve is sealingly connected to the lower gland assembly.

[0009] The bottom end of the lower pressing cover assembly is further provided with an electro-hydraulic conductive ring.

[0010] The upper pressing cover assembly comprises an upper pressing outer cover and an upper pressing inner cover, the upper pressing inner cover is embedded in the upper pressing outer cover, a multi-stage stepped sealing structure is formed at the embedded part of the upper pressing inner cover and the upper pressing outer cover, and a sealing ring is pressed and connected at the embedded part between the upper pressing inner cover and the upper pressing outer cover.

[0011] The upper pressing outer cover is further provided with an air extraction channel in the radial direction, and the inner port of the air extraction channel extends to the multi-stage stepped sealing structure.

[0012] The lower pressing cover assembly comprises a lower pressing outer cover and a lower pressing inner cover embedded in the lower pressing outer cover, and a multi-stage stepped sealing structure is formed at the embedded part between the lower pressing inner cover and the lower pressing outer cover.

[0013] The lower pressing outer cover is further provided with an air blowing channel in the radial direction, and the inner port of the air blowing channel extends to the multi-stage stepped sealing structure.

[0014] In a second aspect, an embodiment of the present application provides a thin film deposition device, which comprises the heating disc built-in driving mechanism according to any one of the above.

[0015] The heating disc built-in driving mechanism and the thin film deposition device thereof have the following advantages: the shaft and the driving unit driving the shaft are coaxial with the heating disc, so that the vibration of the heating disc is small when the heating disc is driven to rotate, the high run-out precision of the disc surface can be maintained, and the uniformity of the thin film deposition of the wafer is improved. Meanwhile, the air extraction channel and the air blowing channel are arranged on the upper pressing outer cover and the lower pressing outer cover, the powder generated by the sealing ring is quickly extracted, at the same time, the external particles are prevented from entering the internal part of the driving unit, the sealing property of the driving unit is improved, and the influence of the particles on the cleanliness of the process chamber and the damage to the bearing are reduced.

[0016] The above description is only a summary of the technical scheme of the present application, in order to more clearly understand the technical means of the present application, the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the present application more obvious and easy to understand, the following preferred embodiments are described in detail as follows. BRIEF DESCRIPTION OF DRAWINGS

[0017] Figure 1 It is a whole three-dimensional structure schematic diagram of the heating disc built-in driving mechanism of the embodiment of the present application.

[0018] Figure 2 It is a structure schematic diagram of the heating disc built-in driving mechanism of the embodiment of the present application without the process chamber.

[0019] Figure 3 It is an explosion view of the heating disc built-in driving mechanism of the embodiment of the present application.

[0020] Figure 4 The schematic diagram of the driving unit part structure of the heating disc built-in driving mechanism of the embodiment of the present application.

[0021] Figure 5 The schematic diagram of the upper pressing outer cover part structure of the heating disc built-in driving mechanism of the embodiment of the present application.

[0022] Figure 6 The schematic diagram of the upper pressing inner cover part structure of the heating disc built-in driving mechanism of the embodiment of the present application.

[0023] Figure 7 The schematic diagram of the lower pressing outer cover part structure of the heating disc built-in driving mechanism of the embodiment of the present application.

[0024] Figure 8 The schematic diagram of the lower pressing inner cover part structure of the heating disc built-in driving mechanism of the embodiment of the present application.

[0025] Figure 9 The side view of the heating disc built-in driving mechanism of the embodiment of the present application.

[0026] Figure 10 The A-A sectional view of the heating disc built-in driving mechanism of the embodiment of the present application. Figure 9

[0027] The B-B sectional view of the heating disc built-in driving mechanism of the embodiment of the present application. Figure 11 The enlarged structure schematic diagram of the part A of the heating disc built-in driving mechanism of the embodiment of the present application. Figure 10 The enlarged structure schematic diagram of the part B of the heating disc built-in driving mechanism of the embodiment of the present application.

[0028] Figure 12 The enlarged structure schematic diagram of the part C of the heating disc built-in driving mechanism of the embodiment of the present application. Figure 10

[0029] Explanation of the reference signs:

[0030] Process chamber 10, driving unit 20, bellows 21, shell 22, motor body 23, upper pressing cover assembly 24, lower pressing cover assembly 25, electro-hydraulic conductive ring 26, sealing ring 27, sealing element 28, heating disc 30, support shaft 31, rotating shaft 231, upper shaft sleeve 232, upper bearing 233, stator 234, lower shaft sleeve 235, lower bearing 236, rotor 237, upper pressing inner cover 241, sealing ring 242, upper pressing outer cover 243, air extraction channel 2431, connecting hole 2432, through hole 2433, inner annular step structure 2434, lower pressing outer cover 251, air blowing channel 2511, through groove 2512, inner annular step structure 2513, lower pressing inner cover 252, recess 2521, outer annular step structure 2522, through cavity 221, shaft connecting hole 2411, outer annular step structure 2412. DETAILED DESCRIPTION

[0031] ​In order to make the objects, technical solutions and advantages of the present application clearer, further specific embodiments of the present application will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the scope of protection of the present application.

[0033] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate the orientation or positional relationship described based on the drawings, and are only for the purpose of facilitating the description of the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0034] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated. Therefore, the features defined with "first", "second" can explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise explicitly specified and limited.

[0035] In the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral molding; it can be mechanical connection, or electrical connection; it can be directly connected, or indirectly connected through intermediate medium, it can be the internal communication of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0036] In the present application, unless otherwise explicitly specified and limited, "on" or "under" of a first feature to a second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, "on", "above" and "over" of a first feature to a second feature includes that the first feature is directly above and obliquely above the second feature, or only means that the first feature is higher than the second feature in horizontal height. "Under", "below" and "underneath" of a first feature to a second feature includes that the first feature is directly below and obliquely below the second feature, or only means that the first feature is lower than the second feature in horizontal height.

[0037] In the description of the specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example", or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the specification, the illustrative description of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0038] In a semiconductor process equipment, for example, an ALD equipment, when carrying out a thin film deposition process, a heating disc drives a wafer to rotate uniformly in a process chamber, so that the wafer is uniformly contacted with a process gas to form a film layer with a high consistency in surface thickness. However, in the existing equipment, the driving of the heating disc generally adopts a motor to drive a belt, and then the belt drives a rotating shaft at the bottom of the heating disc. The heating disc is located in the process chamber, and the rotating shaft extends out of the process chamber. Therefore, the heating disc has a large vibration and a poor end face jumping precision during rotation, which cannot meet the requirement of uniformity of the thin film. In order to solve the above problems, the embodiment discloses a heating disc built-in driving mechanism.

[0039] Please refer to Figures 1 to 12 The embodiment provides a heating disc built-in driving mechanism, which comprises a process chamber 10, a driving unit 20 connected to the process chamber 10, and a heating disc 30 rotating under the control of the driving unit 20, wherein the disc body of the heating disc 30 is located in the process chamber 10.

[0040] The built-in driving mechanism of the heating disc comprises a housing 22 with a through cavity 221, a stator 234 arranged in the through cavity 221, a rotor 237 arranged in the stator 234, a rotating shaft 231 fixedly connected to the rotor 237, an upper gland assembly 24 connected to the upper end of the housing 22, and a lower gland assembly 25 connected to the lower end of the housing 22, the upper end of the rotating shaft 231 passes through the upper gland assembly 24, the lower end of the rotating shaft 231 is rotatably connected to the lower gland assembly 25, the upper end of the rotating shaft 231 is connected to the heating disc 30, the rotor 237 drives the rotating shaft 231, and the heating disc 30 is synchronously driven to rotate.

[0041] In the embodiment, the heating disc 30 is a circular disc, the bottom of the heating disc 30 is provided with a support shaft 31, the support shaft 31 is connected to the center of the heating disc 30, and the lower end of the support shaft 31 is directly connected to the rotating shaft 231 of the driving unit 20. The driving unit 20 is substantially in the structure of a cylinder, so that the rotating shaft 231 of the driving unit 20 is coaxially arranged with the heating disc 30, and the operation of the heating disc 30 driven by the rotating shaft 231 is more stable, the vibration is smaller, the surface runout precision is higher, and the end face runout precision is a geometric tolerance index for describing the axial fluctuation degree of the end face (a plane perpendicular to the axis) of a rotating part relative to a reference axis during rotation in mechanical engineering. It directly affects the assembly precision, motion stability and equipment life of the part, and is particularly important in precision machinery (such as machine tool spindles and bearings). When the wafer is placed on the heating disc 30 and rotates for thin film deposition, the surface of the wafer is more uniform in deposition of the thin film, and the deposition quality is better. Compared with the structure of the existing external power unit connected to the heating disc through a belt, the structure of the driving unit 20 driving the heating disc 30 has higher stability and smaller vibration, so that the rotation of the heating disc is smoother.

[0042] Please refer to Figure 10 , the heating disc 30 is arranged in the process chamber 10, and the upper gland assembly 24 and the process chamber 10 are sealingly connected through the bellows 21. The bellows 21 can be expanded or contracted as needed, and the inside remains sealed during the expansion or contraction process, avoiding external particle pollution of the process chamber. At the same time, the heating disc 30 also needs to perform a lifting action according to the process steps during the wafer transfer process, and the bellows 21 can be used to sealingly connect the driving unit 20 and the process chamber 10. In order to improve the sealing performance, a sealing ring is arranged between the upper end surface of the bellows 21 and the process chamber 10, and a sealing ring is also arranged between the lower end surface of the bellows 21 and the upper gland assembly 24 of the driving unit 20.

[0043] The shell 22, the stator 234 and the rotor 237 embedded in the through cavity 221 of the shell 22 form a rotationally symmetrical motor body 23, which is coaxial with the heating disc 30, thereby reducing the vibration during rotation.

[0044] Please refer to Figure 3 、 Figure 4 and Figure 11 again, the upper shaft sleeve 232 and the upper bearing 233 embedded in the upper shaft sleeve 232 are arranged between the upper gland assembly 24 and the shell 22, the rotating shaft 231 penetrates the upper bearing 233, the top of the upper shaft sleeve 232 is sealingly connected to the upper gland assembly 24, and the bottom of the upper shaft sleeve 232 is sealingly connected to the shell 22. The upper gland assembly 24 is a regular disc structure as a whole, which is coaxially connected with the shell 22.

[0045] Please refer to Figure 3 、 Figure 5 and Figure 11 again, the upper gland assembly 24 includes an upper gland outer cover 243 and an upper gland inner cover 241, the upper gland inner cover 241 is embedded in the upper gland outer cover 243, a multi-stage stepped sealing structure is formed at the embedded part of the upper gland inner cover 241 and the upper gland outer cover 243, and a sealing ring 242 is pressed and connected at the embedded part between the upper gland inner cover 241 and the upper gland outer cover 243.

[0046] As shown in Figure 5 and Figure 6 , the upper gland outer cover 243 is provided with a plurality of connecting holes 2432 in the axial direction, and the upper gland outer cover 243 is fixedly connected to the shell 22 by penetrating the connecting holes 2432 with screws. The middle part of the upper gland outer cover 243 is provided with a through hole 2433, and the upper gland inner cover 241 is embedded in the through hole 2433. The side wall of the through hole 2433 is an inner annular stepped structure 2434.

[0047] The middle part of the upper gland inner cover 241 is provided with a shaft connecting hole 2411, and the rotating shaft 231 penetrates the shaft connecting hole 2411. The outer side wall of the upper gland inner cover 241 is an outer annular stepped structure 2412, which corresponds to the inner annular stepped structure 2434 and is embedded with each other to form a labyrinth structure in cross section, thereby improving the air tightness. The gap width between the upper gland outer cover 243 and the upper gland inner cover 241 is 0.1-0.3mm.

[0048] Further, the upper pressing cover 243 is radially provided with an air extraction channel 2431, the inner port of which extends to the multi-stage stepped sealing structure. During operation, an air extraction pump is used to extract air from the air extraction channel 2431, so that particulate matter generated by the aging of the sealing ring 242 due to long-term use is extracted from the driving unit 20, avoiding its flow into the process chamber 10 along the bellows 21.

[0049] As shown in Figure 4 , the lower pressing cover assembly 25 and the housing 22 are further provided with a lower shaft sleeve 235 and a lower bearing 236 embedded in the lower shaft sleeve 235, the rotating shaft 231 penetrates the lower bearing 236, the top of the lower shaft sleeve 235 is sealingly connected to the housing 22, and the bottom of the lower shaft sleeve 235 is sealingly connected to the lower pressing cover assembly 25.

[0050] Please refer again to Figure 3 , Figure 7 , Figure 8 and Figure 12 , the lower pressing cover assembly 25 comprises a lower pressing outer cover 251 and a lower pressing inner cover 252 embedded in the lower pressing outer cover 251, and the embedded part between the lower pressing inner cover 252 and the lower pressing outer cover 251 forms a multi-stage stepped sealing structure. Similarly, the lower pressing cover assembly 25 is a regular disc structure, which is coaxially connected with the housing 22.

[0051] Specifically, the middle part of the lower pressing outer cover 251 is provided with a through slot 2512, the slot wall of the through slot 2512 is an inner annular stepped structure 2513, and the lower pressing inner cover 252 is embedded in the through slot 2512. The lower pressing inner cover 252 is provided with a groove 2521, and the lower end of the rotating shaft 231 is rotatably inserted into the groove 2521. The outer side wall of the lower pressing inner cover 252 is provided with an outer annular stepped structure 2522, which corresponds to the inner annular stepped structure 2513, and the cross sections of the two form a multi-stage labyrinth structure, improving the air tightness. The embedded part between the two has a spacing range of 0.2-0.5mm.

[0052] Further, the lower pressing outer cover 251 is radially provided with a gas blowing channel 2511, the inner port of which extends to the multi-stage stepped sealing structure. During operation, a gas blowing device is used to blow air outward from the gas blowing channel 2511, preventing external particulate matter from entering the interior of the driving unit 20 through the embedded gap, avoiding damage to the lower bearing 236 and the upper bearing 233, and improving the service life.

[0053] The upper pressing cover assembly 24 is provided with a sealing ring 27 between the upper pressing outer cover 243 and the lower end surface of the bellows 21, which is used to improve the sealing between the two.

[0054] As shown in Figure 12 The lower pressing cover 252 is pressed with a sealing member 28 between the lower end surface of the rotating shaft 213, so as to improve the sealing performance of the joint.

[0055] As shown in Figure 2 The bottom end of the lower pressing cover assembly 25 is further provided with an electro-hydraulic conductive ring 26. The electro-hydraulic conductive ring 26 (also known as an electro-hydraulic slip ring or an electro-hydraulic combined slip ring) is a multifunctional rotary connection device integrating power transmission, signal transmission and hydraulic passage, mainly used to solve the complex needs of transmitting power, signals and cooling liquid (or other fluids) between rotating parts and stationary parts. Its core function is to maintain stable transmission of power, control signals and hydraulic power during continuous rotation of the device, avoiding the problems of line entanglement or medium leakage caused by mechanical movement.

[0056] The embodiment of the present application provides a thin film deposition device, which comprises the heating disc built-in driving mechanism according to any one of the above.

[0057] The heating disc built-in driving mechanism and the thin film deposition device thereof in the embodiment are coaxially arranged with the heating disc through the rotating shaft and the driving unit driving the rotating shaft, so that the vibration of the heating disc is small when the heating disc is driven to rotate, the high runout accuracy of the disc surface can be maintained, and the uniformity of wafer thin film deposition is improved. Meanwhile, the gas extraction and blowing channels are arranged on the upper pressing outer cover and the lower pressing outer cover, the powder generated by the sealing ring is quickly extracted, and at the same time, the external particles are prevented from entering the inside of the driving unit, the sealing performance of the driving unit is improved, and the influence of the particles on the cleanliness of the process chamber and the damage of the bearing are reduced.

[0058] The above only further illustrates the technical content of the present application by way of examples, so as to make the reader easier to understand, but does not represent that the embodiments of the present application are limited to this. Any technical extension or re-creation made according to the present application is protected by the present application. The protection scope of the present application is subject to the claims.

Claims

1. A heating disc built-in driving mechanism, characterized by, The housing comprises a through cavity, a stator arranged in the through cavity, a rotor arranged in the stator, a rotating shaft fixedly connected to the rotor, an upper gland assembly connected to the upper end of the housing, and a lower gland assembly connected to the lower end of the housing, the upper end of the rotating shaft is penetrated by the upper gland assembly, the lower end of the rotating shaft is rotatably connected to the lower gland assembly, the upper end of the rotating shaft is connected to a heating disc, and the rotor, the rotating shaft, the stator, the upper gland assembly, and the lower gland assembly are coaxially arranged with the heating disc.

2. The heating disc built-in driving mechanism according to claim 1, wherein The heating disc is arranged in a process chamber, and the upper gland assembly and the process chamber are sealingly connected through a bellows.

3. The heating disc built-in driving mechanism according to claim 1, wherein An upper shaft sleeve and an upper bearing embedded in the upper shaft sleeve are further arranged between the upper gland assembly and the housing, the rotating shaft is penetrated by the upper bearing, the top of the upper shaft sleeve is sealingly connected to the upper gland assembly, and the bottom of the upper shaft sleeve is sealingly connected to the housing.

4. The heating tray built-in driving mechanism according to claim 1, wherein A lower shaft sleeve and a lower bearing embedded in the lower shaft sleeve are further arranged between the lower gland assembly and the housing, the rotating shaft is penetrated by the lower bearing, the top of the lower shaft sleeve is sealingly connected to the housing, and the bottom of the lower shaft sleeve is sealingly connected to the lower gland assembly.

5. The heating tray built-in driving mechanism according to claim 1, wherein The bottom end of the lower gland assembly is further provided with an electro-hydraulic conductive ring.

6. The heating disc built-in driving mechanism according to any one of claims 1 to 5, characterized in that, The upper gland assembly comprises an upper pressure outer cover and an upper pressure inner cover, the upper pressure inner cover is embedded in the upper pressure outer cover, a multi-stage stepped sealing structure is formed at the embedded part of the upper pressure inner cover and the upper pressure outer cover, and a sealing ring is crimped at the embedded part of the upper pressure inner cover and the upper pressure outer cover.

7. The heating tray built-in driving mechanism according to claim 6, wherein The radial direction of the upper pressure outer cover is further provided with a gas extraction channel, and the inner port of the gas extraction channel extends to the multi-stage stepped sealing structure.

8. The built-in drive mechanism for a heating tray according to any one of claims 1 to 5, characterized in that, The lower gland assembly comprises a lower pressure outer cover and a lower pressure inner cover embedded in the lower pressure outer cover, and a multi-stage stepped sealing structure is formed at the embedded part of the lower pressure inner cover and the lower pressure outer cover.

9. The heating tray built-in driving mechanism according to claim 8, wherein The radial direction of the lower pressure outer cover is further provided with a gas blowing channel, and the inner port of the gas blowing channel extends to the multi-stage stepped sealing structure.

10. A thin film deposition apparatus, characterized by, The thin film deposition device comprises the heating disc built-in driving mechanism according to any one of claims 1 to 9.

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