Printing parameter acquisition method and photoresist printing method

Abstract

The invention relates to a printing parameter acquisition method and a photoresist printing method. The printing parameter obtaining method comprises the steps that the first weight of a debugging chip is obtained; obtaining a second weight of the debugging chip after the photoresist is formed, wherein the photoresist is formed on the debugging chip through a screen printing method; comparing a weight difference value between the second weight and the first weight with a target weight variation; and when the absolute value of the weight difference value and the difference value of the target weight variation does not exceed a preset tolerance range, the corresponding printing parameter serves as a target printing parameter. According to the invention, the film thickness of the printed photoresist can be accurately controlled.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of screen printing, in particular to a printing parameter acquisition method and a method for printing photoresist. BACKGROUND

[0002] The photolithography process is widely used in the plating process of semiconductor products such as photovoltaic cells. The stability, reliability and process yield of the photolithography technology have an important influence on the quality, yield and cost of the products. As the first step of the photolithography process, the coating of photoresist directly affects the subsequent process and the quality of the final pattern.

[0003] The screen printing process can uniformly coat photoresist on a large-area substrate by transferring photoresist through a screen plate, and has high production efficiency and low material waste. Compared with other photoresist coating methods, screen printing has a significant cost advantage, especially in large-scale production, and has high adaptability and easy operation.

[0004] However, it is found through production experience that screen printing, as an important method for coating photoresist, faces challenges in controlling the thickness of the photoresist film in actual application. SUMMARY

[0005] Therefore, it is necessary to provide a printing parameter acquisition method and a method for printing photoresist, which can accurately control the thickness of the printed photoresist film.

[0006] A printing parameter acquisition method comprises:

[0007] acquiring a first weight of a debug sheet;

[0008] acquiring a second weight of the debug sheet after forming photoresist on the debug sheet by a screen printing method;

[0009] comparing a weight difference between the second weight and the first weight with a target weight change amount;

[0010] When the absolute value of the difference between the weight difference and the target weight change amount is within a preset tolerance range, the corresponding printing parameter is taken as a target printing parameter.

[0011] In one embodiment, the printing parameter acquisition method further comprises:

[0012] When the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range, the printing parameter is adjusted.

[0013] In one embodiment, the printing parameter comprises at least one of a printing pressure, a printing speed and a squeegee down height.

[0014] In one embodiment, when the difference between the weight difference and the target weight change is less than or equal to a preset tolerance range, adjusting the printing parameters, including:

[0015] When the absolute value of the difference between the weight difference and the target weight change exceeds the preset tolerance range, and the weight difference is greater than the target weight change, increasing the printing pressure and / or increasing the printing speed and / or increasing the squeegee down height;

[0016] When the absolute value of the difference between the weight difference and the target weight change exceeds the preset tolerance range, and the weight difference is less than the target weight change, decreasing the printing pressure and / or decreasing the printing speed and / or decreasing the squeegee down height.

[0017] In one embodiment, before comparing the weight difference between the second weight and the first weight with the target weight change, including:

[0018] Obtaining a corresponding relationship between the weight change and the photoresist film thickness;

[0019] Based on the target film thickness and the corresponding relationship, obtaining the target weight change.

[0020] A method for printing photoresist, including:

[0021] Obtaining the target printing parameters obtained by the printing parameter obtaining method according to any one of the above;

[0022] Based on the target printing parameters, printing the patterned photoresist on the process wafer.

[0023] In one embodiment, based on the target printing parameters, printing the patterned photoresist on the process wafer, including:

[0024] Spraying photoresist thinner above the coating unit of the screen printing equipment;

[0025] Coating photoresist material on the screen plate of the coating unit;

[0026] Starting the screen printing equipment to print the photoresist on the process wafer.

[0027] In one embodiment, according to a preset time interval, spraying photoresist thinner above the coating unit of the screen printing equipment, and printing the photoresist on multiple process wafers within the preset time interval.

[0028] In one embodiment, the screen plate of the screen printing equipment is extended outward by a preset length relative to the process wafer.

[0029] In one of the embodiments, the method further comprises:

[0030] After processing a preset number of the process sheets, the weight change of the process sheet caused by the photoresist is monitored, and the target printing parameter is adjusted according to the monitoring result.

[0031] The printing parameter acquisition method and the method of printing photoresist respectively acquire the weights of the test sheets before and after coating (the first weight and the second weight), and acquire the difference between the two, thereby acquiring the weight change amount of the test sheet. The film thickness of the photoresist is related to the weight, so the weight of the photoresist formed by printing can reflect the film thickness of the photoresist. Then, the weight change amount is compared with the target weight change amount, and when the weight change amount does not exceed the preset tolerance range, the target printing parameter is acquired. Therefore, when subsequent production printing is performed based on the target printing parameter, the photoresist with a weight comparable to that of the test sheet on which the target printing parameter is acquired can be obtained, so that the film thickness of the photoresist obtained by subsequent production printing based on the target printing parameter can be precisely and stably controlled, thereby making the film thickness of the photoresist obtained by subsequent multiple printing processes more uniform, thereby reducing the film thickness fluctuation problem.

[0032] Compared with the traditional method of controlling the film thickness and uniformity by relying on the viscosity adjustment or multiple coating of the photoresist, the present application obtains the target printing parameter by accurately calculating the weight change amount of the test sheet after printing the photoresist and comparing it with the target weight change amount, thereby controlling the film thickness of the printed photoresist, simplifying the process flow, improving the production efficiency, reducing the production cost, and ensuring the film thickness uniformity and the stability of the pattern. BRIEF DESCRIPTION OF DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative labor.

[0034] Figure 1 A flowchart of the printing parameter acquisition method in one embodiment;

[0035] Figure 2 A flowchart of the printing parameter acquisition method in another embodiment;

[0036] Figure 3 A flowchart of the printing parameter acquisition method in another embodiment;

[0037] Figure 4Flowchart of a method of printing photoresist in one embodiment;

[0038] Figure 5 Flowchart of printing a patterned photoresist on a process wafer based on the target printing parameters in one embodiment;

[0039] Figure 6 Schematic diagram of a screen printing apparatus in one embodiment;

[0040] Figure 7 Schematic diagram of a table comparing data of a process and a conventional process in one embodiment;

[0041] Figure 8 Schematic diagram of a curve comparing data of a process and a conventional process in one embodiment.

[0042] Legend: 100-printing machine, 110-workbench, 210-screen, 220-squeegee, 230-ink-returning blade, 240-compressed air cylinder. DETAILED DESCRIPTION

[0043] In order to facilitate the understanding of the present application, the present application will be described in more detail below with reference to the relevant drawings. The drawings show embodiments of the present application. However, the present application can be implemented in many different forms, and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0044] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0045] It can be understood that the terms "first", "second", etc. used in the present application can be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0046] Spatially relative terms, such as "beneath", "below", "lower", "under", "above", "upper" and the like, can be used herein for ease of description to describe one element or feature's relationship to another element(s) or feature(s) as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device is inverted or rotated by 90 degrees, described elements or features that are "below" or "beneath" other elements or features can then be "above" or "over" such other elements or features. Thus, the example term "below" can encompass both an orientation of above and below. The devices can also be oriented in other ways (e.g., rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0047] It is noted that when an element is referred to as being "connected" to another element, it can be directly connected to the other element, or connected to the other element through intervening elements. In addition, "connected" as used in the following embodiments can be "electrically connected", "communicatively connected", or the like, if there is a transmission of electrical signals or data between the connected objects.

[0048] As used herein, the singular forms "a", "an" and "the" include plural referents unless the context clearly dictates otherwise. It will be further understood that the terms "comprises", "comprising", "includes" and / or "including", or the like, when used in this specification, specify the presence of stated features, integers, steps, operations, elements, components, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

[0049] The printing parameter acquisition method and the method for printing photoresist provided by the embodiments of the present application can be applied in, but are not limited to, the electroplating (e.g., copper electroplating) process of a photovoltaic cell.

[0050] In one embodiment, referring to Figure 1 , a printing parameter acquisition method is provided, comprising:

[0051] In step S10, a first weight W1 of a debug wafer is acquired;

[0052] In step S20, a second weight W2 of the debug wafer after forming a photoresist is acquired, the photoresist being formed on the debug wafer by a screen printing method;

[0053] In step S40, the weight difference ΔW2-W1 between the second weight W2 and the first weight W1 is compared with a target weight change amount ΔW 实际 标准 In step S40, the weight difference ΔW2-W1 between the second weight W2 and the first weight W1 is compared with a target weight change amount ΔW ​

[0054] Step S50, when the weight difference ΔW 实际 with the target weight change amount ΔW 标准 of the absolute value does not exceed the preset tolerance range, that is, |ΔW 实际+ -ΔW 标准 |≤Δt, the corresponding printing parameter is taken as the target printing parameter.

[0055] The debugging sheet can be a glue-coated substrate sheet used for printing parameter debugging test. The debugging sheet can include, but is not limited to, a square substrate sheet. In the printing parameter debugging test, the debugging sheet can be prepared first, and then the weight of the debugging sheet is measured by using an electronic scale, denoted as the first weight W1. Then, the debugging sheet is printed with a patterned photoresist under the reference parameters of the screen printing equipment. Then, the weight of the glue-coated debugging sheet is measured again by using the electronic scale, denoted as the second weight.

[0056] Exemplarily, referring to Figure 6 , the screen printing equipment can include a printing machine 100, a glue-coating unit, and a machine control system (not shown).

[0057] Exemplarily, when the screen printing equipment is printing, the printing temperature can be 23℃±2℃, and the humidity can be 70%±10%.

[0058] The printing machine 100 can include a workbench 110 that can rotate 360 degrees.

[0059] The printing machine 100 can be provided with a plurality of workbenches 110, and each workbench 110 can be used to place a substrate sheet. When a substrate sheet is finished printing, the printing machine 100 can be rotated to rotate each workbench 110, so as to transfer the finished printing substrate sheet out of the printing position, and at the same time, another substrate sheet is rotated to the printing position. At the same time, the transmission system can be used to cooperate with the rotation of the workbench 110 to realize the running of the substrate sheet.

[0060] The glue applying unit can print the substrate sheet placed on the worktable 110 at the printing position. The glue applying unit includes a screen plate 210, a doctor blade 220, a squeegee 230, and a compression cylinder 240, etc. The screen plate 210 can be used for applying photoresist. The doctor blade 220 can be located above the working surface of the screen plate 210. Meanwhile, the doctor blade 220 and the squeegee 230 can be fixed to the compression cylinder 240 by bolts, etc. The compression cylinder 240 can move horizontally, thereby driving the doctor blade 220 and the squeegee 230 to move horizontally. Meanwhile, the compression cylinder 240 can be compressed to exert pressure on the doctor blade 220 and the squeegee 230 in the vertical direction. During the printing process, the photoresist for printing can be applied to the screen plate 210 below the doctor blade 220, close to the upper edge of the working mesh area of the screen plate 210. Then the compression cylinder 240 can be moved, and the photoresist can be applied by pressing the doctor blade 220 and the squeegee 230 through the compression cylinder 240.

[0061] The machine control system can include a PLC (Programmable Logic Controller) control system. The machine control system can realize the control and adjustment of the printing parameters, etc. The printing parameters can include at least one of the printing pressure, the printing speed, the screen plate 210 height, and the doctor blade 220 pressing height. Among them, the printing pressure can be realized by adjusting the pressure of the compression cylinder 240, the printing speed can be realized by adjusting the moving speed of the compression cylinder 240 driving the doctor blade 220 to move, the screen plate 210 height can be realized by adjusting the distance between the screen plate 210 and the worktable 110, and the doctor blade 220 pressing height can be realized by adjusting the compression amount of the compression cylinder 240.

[0062] In step S10, the weight of the debug sheet before printing the patterned photoresist on the debug sheet by the screen printing device can be obtained, that is, the first weight W1 is obtained.

[0063] In step S20, the weight of the debug sheet after printing the patterned photoresist on the debug sheet by the screen printing device can be obtained, that is, the second weight W2 is obtained.

[0064] In step S40, the weight difference between the second weight (W2) and the first weight (W1) can be denoted as ΔW 实际 . ΔW 实际 can be calculated by the following formula:

[0065] ΔW 实际 = W2 - W1.

[0066] The target weight change amount can be a standard change amount obtained in advance, which can be used as a reference for ΔW 实际 . The target weight change amount can be denoted as ΔW 标准 .

[0067] The absolute value of the difference between ΔW 实际 and ΔW 标准 can be calculated. The absolute value of the difference between ΔW 实际 and ΔW 标准 is |ΔW 实际 -ΔW 标准 |. The absolute value can represent the weight change amount of the adjustment sheet. Then, the absolute value (the weight change amount of the adjustment sheet) is compared with the preset tolerance range Δt.

[0068] In step S50, the absolute value of the difference between the weight difference (ΔW 实际 ) and the target weight change amount (ΔW 标准 ) is not more than the preset tolerance range, i.e., |ΔW 实际 -ΔW 标准 |≤Δt. At this time, it is indicated that the weight of the photoresist formed on the adjustment sheet by screen printing has reached the requirement. Meanwhile, the film thickness of the photoresist is related to the weight. Therefore, at this time, it can be considered that the film thickness of the photoresist has reached the requirement, thereby indicating that the printing parameter has been adjusted to the appropriate range. Therefore, the process parameter can be determined. At this time, the corresponding printing parameter is taken as the target printing parameter. After that, when subsequent production printing is performed based on the target printing parameter, the thickness of the photoresist obtained by printing can meet the requirement.

[0069] In the embodiment, the weights (the first weight and the second weight) of the adjustment sheet before and after the photoresist is applied are obtained respectively, and the difference between the two weights is obtained, thereby obtaining the weight change amount of the adjustment sheet. The film thickness of the photoresist is related to the weight, so the weight of the photoresist formed by printing can reflect the film thickness of the photoresist. Then, the weight change amount is compared with the target weight change amount, and the target printing parameter is obtained when the weight change amount is not more than the preset tolerance range. Therefore, when subsequent production printing is performed based on the target printing parameter, the photoresist obtained can have a weight similar to that of the photoresist on the adjustment sheet for which the target printing parameter is obtained, so that the film thickness of the photoresist obtained by subsequent production printing based on the target printing parameter can be precisely and stably controlled, thereby making the film thickness of the photoresist obtained by subsequent multiple printing processes more uniform, and thereby reducing the film thickness fluctuation problem.

[0070] Compared with the conventional method of controlling the film thickness and uniformity by relying on the adjustment of the photoresist viscosity or multiple coating, the embodiment obtains the target printing parameter by accurately calculating the weight change amount of the adjustment sheet after the photoresist is printed and comparing the weight change amount with the target weight change amount, thereby controlling the film thickness of the printed photoresist, simplifying the process flow, improving the production efficiency, reducing the production cost, and ensuring the film thickness uniformity and the stability of the pattern.

[0071] In one embodiment, referring to Figure 2 , the printing parameter obtaining method further comprises:

[0072] Step S60, when the weight difference ΔW 实际 and the target weight change amount ΔW 标准 exceeds the preset tolerance range, i.e. |ΔW 实际 -ΔW 标准 | > Δt, the printing parameter is adjusted.

[0073] Exemplarily, the adjusted printing parameter can include at least one of the printing pressure, the printing speed, and the squeegee down height.

[0074] After the printing parameter is adjusted, the printing parameter adjustment test can be performed again on the adjustment sheet based on the adjusted printing parameter. Here, the adjustment sheet can be another adjustment sheet. Alternatively, the test sheet used in the previous printing parameter adjustment test can be removed of the photoresist and used again as the test sheet.

[0075] And when the printing parameter adjustment test is performed again, the photoresist used can be the same as that used in the previous printing parameter adjustment test.

[0076] Then, based on the test data of the printing parameter adjustment test performed again, the steps S10 to S60 and the printing parameter adjustment test based on the adjusted printing parameter can be repeatedly performed until the weight difference ΔW 实际 and the target weight change amount ΔW 标准 does not exceed the preset tolerance range, and the printing parameter adjusted last time is taken as the target printing parameter.

[0077] The printing parameter acquisition method in the embodiments of the present application can be but not limited to controlled and executed by a machine control system (such as a PLC).

[0078] In the embodiment method, the printing parameter can be automatically adjusted by a machine control system, so that the target printing parameter meeting the requirements can be quickly acquired.

[0079] In one embodiment, the step S60 includes:

[0080] Step S61, when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range, and the weight difference is greater than the target weight change amount, the printing pressure is increased and / or the printing speed is increased and / or the squeegee down height is increased.

[0081] Step S62, when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range, and the weight difference is less than the target weight change amount, the printing pressure is reduced and / or the printing speed is reduced and / or the squeegee down height is reduced.

[0082] In step S61, when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range, and the weight difference is greater than the target weight change amount, it indicates that the weight of the photoresist formed on the debug sheet by screen printing in the printing parameter debugging test is too large, and in turn the film thickness of the photoresist is too large. At this time, increasing the printing pressure and / or increasing the printing speed and / or increasing the squeegee down height can reduce the weight and film thickness of the photoresist.

[0083] In step S62, when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range, and the weight difference is less than the target weight change amount, it indicates that the weight of the photoresist formed on the debug sheet by screen printing in the printing parameter debugging test is too small, and in turn the film thickness of the photoresist is too small. At this time, reducing the printing pressure and / or reducing the printing speed and / or reducing the squeegee down height can increase the weight and film thickness of the photoresist.

[0084] In one embodiment, referring to Figure 3 , before step S40, further comprising:

[0085] Step S31, obtaining a correspondence between the weight change amount and the photoresist film thickness;

[0086] Step S32, based on the target film thickness and the correspondence, obtaining the target weight change amount.

[0087] In step S31, the correspondence between the weight change amount and the photoresist film thickness can be a reference correspondence. Illustratively, the correspondence can be determined according to the type, viscosity, etc. of the photoresist. Illustratively, the correspondence can be obtained through simulation results.

[0088] In step S32, based on the target film thickness and the correspondence, a proportional conversion is performed to obtain the target weight change amount.

[0089] The target film thickness is the ideal thickness of the photoresist that is intended to be achieved. Assuming that in the correspondence, the reference photoresist film thickness is D1, the corresponding reference weight change amount is ΔW1, and the target film thickness of the photoresist is D2, then the target weight change amount ΔW 标准 is calculated as follows:

[0090] ΔW 标准 = ΔW1× .

[0091] Illustratively, D1 = 16 μm, ΔW1 = 0.8 g, D2 = 13 μm, then,

[0092] ΔW 标准 = 0.8× = 0.65.

[0093] In the embodiment, by obtaining the correspondence between the weight change amount and the photoresist film thickness, a target weight change amount corresponding to any target film thickness can be obtained, thereby improving the universality of the method of the embodiment.

[0094] In one embodiment, referring to Figure 4 A method for printing photoresist is also provided, comprising:

[0095] In step S100, the target printing parameter obtained by the printing parameter obtaining method according to any of the above is obtained.

[0096] In step S200, based on the target printing parameter, a patterned photoresist is printed on a process wafer.

[0097] The process wafer is a wafer used for normal production. For example, the process wafer can include an ITO film layer, and a seed layer (such as a seed copper layer) can be formed on the surface of the ITO film layer. The patterned photoresist can be printed on the surface of the seed layer by a screen printing device. Then, the patterned photoresist is electroplated with metal (such as copper) in the openings of the patterned photoresist, thereby forming a solar cell electrode.

[0098] For example, the process wafer can be fixed on the workbench of the printing machine. The fixation of the process wafer ensures the stability during the printing process, and avoids the process wafer from shifting or shaking.

[0099] When the patterned photoresist is printed on the process wafer, the photoresist used can be the same as the photoresist used for obtaining the target printing parameter. Specifically, the type and viscosity of the photoresist are the same.

[0100] In the embodiment, based on the target printing parameter obtained by the printing parameter obtaining method, the patterned photoresist is printed on the process wafer. Therefore, the film thickness of the prepared patterned photoresist can more easily reach the required target film thickness, thereby improving the accuracy of the control of the photoresist film thickness, improving the film thickness fluctuation problem, and further improving the stability of the photoresist coating process.

[0101] In one embodiment, referring to Figure 5 Step S200 comprises:

[0102] In step S210, a photoresist diluent is sprayed above the coating unit of the screen printing device.

[0103] In step S220, the photoresist material is coated on the screen plate of the coating unit.

[0104] In step S230, the screen printing device is started, and the photoresist is printed on the process wafer.

[0105] In step S210, the glue applying unit can further include a spray pot. The photoresist diluent can be placed in the spray pot. Then the photoresist diluent can be sprayed to the top of the glue applying unit through the nozzle of the spray pot.

[0106] Exemplarily, a small amount of misty photoresist diluent can be sprayed 15cm to 25cm (e.g. 20cm) above the working surface of the glue applying unit, so as to wet the working environment of the glue applying unit.

[0107] In step S220, the printing photoresist can be applied to the screen plate below the squeegee, so as to ensure that the photoresist is close to the upper edge of the working mesh area.

[0108] In step S230, the screen printing device is started, and then the screen printing device can automatically print the photoresist based on the target printing parameters. During the printing process, the squeegee uniformly applies the photoresist to the surface of the process wafer through the screen plate.

[0109] In this embodiment, before applying the photoresist material to the screen plate of the glue applying unit, the photoresist diluent is first sprayed above the glue applying unit of the screen printing device, so that the printing process is carried out in a wet working environment, thereby effectively reducing the frequency of screen plate adhesion during the printing production process, and improving the production efficiency and yield. Please refer to Figure 7 With Figure 8 In actual production process, compared with the traditional process, the photoresist film thickness uniformity can be effectively improved, and the screen plate adhesion frequency can be effectively reduced.

[0110] In one embodiment, the photoresist diluent is sprayed above the glue applying unit of the screen printing device according to a preset time interval, and the photoresist is printed on a plurality of process wafers within the preset time interval.

[0111] The preset time interval can be set according to actual needs. Exemplarily, the preset time interval can be 3min to 8min (5min).

[0112] At this time, after spraying the photoresist diluent once, steps S220 and S230 can be repeatedly executed, so as to print the photoresist on a plurality of process wafers within the preset time interval, thereby improving the process efficiency.

[0113] In one embodiment, the screen plate of the screen printing device is extended outward by a preset length relative to the process wafer.

[0114] Exemplarily, the screen plate can use a 100 mesh screen plate.

[0115] The preset length can be set according to actual needs. Exemplarily, the preset length can be 0.1mm to 0.3mm (e.g. 0.2mm). Exemplarily, the length and width of the screen plate can be enlarged by 0.2mm relative to the length and width of the process wafer.

[0116] The prior art printing process prevents the photoresist from being printed onto the worktable through the screen plate during the printing process, the printing area of the screen plate is less than or equal to the size of the substrate, however, the photoresist is prone to accumulate at the edge of the process sheet due to the surface tension, the glue flow flatness and the centrifugal force, thereby causing the edge film thickness to be too high, and further affecting the stability of the patterning process and the pattern resolution quality.

[0117] In the embodiment, the screen plate of the screen printing device is extended outward relative to the process sheet by a preset length. Therefore, the printed photoresist at the edge of the process sheet can be truncated by the process sheet, thereby effectively reducing the photoresist accumulation at the edge of the process sheet, and further reducing the poor uniformity of the photoresist film layer caused by the photoresist accumulation at the edge.

[0118] In one embodiment, the method of printing the photoresist further comprises:

[0119] Step S300, monitoring the weight change of the process sheet caused by the photoresist after processing a preset number of process sheets, and adjusting the target printing parameter according to the monitoring result.

[0120] Specifically, the weight change of the photoresist on the debugging sheet can be monitored in a similar manner, and the new target printing parameter can be adjusted based on the weight monitoring data of one or more process sheets, similar to the aforementioned steps S10 to S50. In the subsequent printing process, the photoresist can be printed based on the new target printing parameter, thereby further maintaining the film thickness stability of the printed photoresist.

[0121] It should be understood that, although Figures 1-5 The steps in the flowchart of the method are displayed in sequence according to the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified herein, the execution of these steps is not strictly limited in sequence, and these steps can be executed in other orders. Moreover, Figures 1-5 At least part of the steps in the method can include multiple steps or multiple stages, which are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed alternately or alternately with at least part of other steps or steps or stages in other steps.

[0122] Those skilled in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing relevant hardware through a computer program. The computer program can be stored in a non-volatile computer readable storage medium, and when the computer program is executed, the processes of the above-mentioned embodiments of the methods can be included. Any reference to memory, storage, database or other medium used in each embodiment provided by the present application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration but not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0123] In the description of the present specification, the description referring to the terms "one embodiment" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present specification, the illustrative description of the above terms does not necessarily refer to the same embodiment or example.

[0124] Each technical feature of the above embodiments can be combined arbitrarily, and in order to make the description simple, each technical feature in the above embodiments is not described all possible combinations, however, as long as the combination of technical features does not exist contradictory, it should be considered as the scope of the present application.

[0125] The above embodiments only express several embodiments of the present application, and the description is more specific and detailed, but it should not be understood as a limitation on the scope of the patent. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, a number of variations and improvements can be made, which are within the scope of the present application. Therefore, the scope of protection of the patent of the present application should be subject to the appended claims.

Claims

1. A method of acquiring printing parameters, characterized by, The method comprises: acquiring a first weight of a test piece; acquiring a second weight of the test piece after a photoresist is formed on the test piece by a screen printing method; comparing a weight difference between the first weight and the second weight with a target weight change amount; when an absolute value of a difference between the weight difference and the target weight change amount is within a preset tolerance range, corresponding printing parameters are taken as target printing parameters.

2. The print parameter acquisition method of claim 1, wherein The method further comprises: when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range, adjusting the printing parameters.

3. The print parameter acquisition method according to claim 1 or 2, characterized by, The printing parameters include at least one of a printing pressure, a printing speed and a squeegee down height.

4. The print parameter acquisition method of claim 2, wherein When the difference between the weight difference and the target weight change amount is within the preset tolerance range, the printing parameters are adjusted, including: when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range and the weight difference is greater than the target weight change amount, increasing the printing pressure and / or increasing the printing speed and / or increasing the squeegee down height; when the absolute value of the difference between the weight difference and the target weight change amount exceeds the preset tolerance range and the weight difference is less than the target weight change amount, decreasing the printing pressure and / or decreasing the printing speed and / or decreasing the squeegee down height.

5. The print parameter acquisition method of claim 2, wherein Before the comparison between the weight difference and the target weight change amount, the method comprises: acquiring a corresponding relationship between a weight change amount and a photoresist film thickness; based on a target film thickness and the corresponding relationship, acquiring a target weight change amount.

6. A method of printing a photoresist, characterized by, The method comprises: acquiring target printing parameters obtained by the printing parameter acquisition method according to any one of claims 1-5; based on the target printing parameters, printing a patterned photoresist on a process piece.

7. The method of printing a photoresist according to claim 6, wherein, The printing of the patterned photoresist on the process piece based on the target printing parameters comprises: spraying a photoresist diluent above a coating unit of a screen printing device; coating a photoresist material on a screen plate of the coating unit; starting the screen printing device to print the photoresist on the process piece.

8. The method of printing a photoresist according to claim 6, wherein, According to a preset time interval, spraying a photoresist diluent above a coating unit of a screen printing device, and printing the photoresist on a plurality of process pieces within the preset time interval.

9. The method of printing a photoresist according to claim 6, wherein, A screen plate of the screen printing device is extended outward relative to the process piece by a preset length.

10. The method of printing a photoresist according to claim 6, wherein, The method further comprises: monitoring a weight change of the process piece caused by the photoresist after processing a preset number of the process pieces, and adjusting the target printing parameters according to a monitoring result.

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