Intelligent film pressing device and method for manufacturing integrated circuit chip

Abstract

The invention relates to the technical field of integrated circuit manufacturing, and particularly discloses an intelligent film pressing device and method for integrated circuit chip manufacturing, the intelligent film pressing device comprises a film pressing seat, two sides of the top of the film pressing seat are provided with film roll assemblies, and the middle part of the film pressing seat is slidably connected with a lifting seat. The protection assembly is arranged in the middle of the film pressing base and comprises a lifting ring sliding in the lifting base, the top of the lifting ring is rotationally connected with a protection ring, the protection assembly further comprises a circular groove formed in the lifting base, and a piston plate is movably arranged in the circular groove. When the film is pressed, the edge of the wafer cannot be extruded and damaged, so that the quality of a produced chip is improved, dust at all positions between the film and the wafer can be adsorbed, bubbles at the attaching position caused by dust on the attaching surface of the film and the wafer are reduced, and the film pressing effect is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of integrated circuit manufacturing, in particular to an intelligent film pressing device and method for integrated circuit chip manufacturing. BACKGROUND

[0002] In daily life scenarios, electronic products are ubiquitous, and their core control components are usually integrated circuits. Chips are an important part of integrated circuits. In the overall production process of chips, wafers need to be made first, and the back of the wafer needs to be coated with a film to protect the wafer and ensure the performance, reliability and yield of the chip. Therefore, a film pressing device is needed to press the film onto the surface of the wafer.

[0003] For example, the "wafer film coating platform" with publication number "CN115241116A" places the wafer on the platform, then the film pressing cylinder drives the film pressing bracket and film pressing roller to move downward to press the PE film onto the wafer surface, and then the horizontal driving mechanism drives the film pressing bracket and film pressing roller to move horizontally to cover the entire wafer surface with the PE film, thereby achieving wafer film coating.

[0004] In actual film pressing process, when the film covers the wafer, in order to ensure the effect of film pressing, the film needs to be continuously pressed after contacting the wafer to ensure the adhesion between the film and the wafer. However, this may cause damage to the edges of the wafer, affecting the quality of the produced chip. In addition, dust and impurities may contaminate the film coating process, affecting the adhesion between the film and the wafer, and thus affecting the quality of the film coating. SUMMARY

[0005] The present application aims to provide an intelligent film pressing device and method for integrated circuit chip manufacturing, which can prevent the edges of the wafer from being damaged during film pressing, thereby improving the quality of the produced chip, and can adsorb dust between the film and the wafer, reducing the occurrence of bubbles on the adhesion surface of the film and the wafer, thereby improving the film pressing effect and solving the problems in the background art.

[0006] To achieve the above-mentioned purpose, the present application provides the following technical solution: an intelligent film pressing device for integrated circuit chip manufacturing, comprising a film pressing seat, film roll assemblies are arranged on both sides of the top of the film pressing seat, and a lifting seat is slidably connected to the middle part of the film pressing seat, characterized in that the film pressing device further comprises:

[0007] The protection assembly is arranged in the middle part of the film pressing seat, and comprises a lifting ring sliding in the lifting seat, a protection ring rotatably connected to the top of the lifting ring, a circular groove opened in the lifting seat, a piston plate movably arranged in the circular groove, a bent frame fixed between the piston plate and the lifting ring, straight plates fixed on both sides of the lifting seat, a corrugated bag fixed between the straight plates and the film pressing seat, and a bent pipe fixedly inserted between the top of the circular groove and the corrugated bag.

[0008] The dust removal assembly is arranged in the lifting seat and used for removing impurities on the wafer and the film to be attached.

[0009] Preferably, the dust removal assembly further comprises a guide sliding block fixed in the protection ring, a guide groove opened in the lifting seat corresponding to the guide sliding block, the guide sliding block movably arranged in the guide groove, a first motor fixedly connected to the inside of the protection ring, an output shaft of the first motor fixed to the dust removal cover, the dust removal cover in the shape of a circular arc, and dust suction holes opened at the top and bottom of the dust removal cover.

[0010] Preferably, the dust removal assembly further comprises a collection cover clamped to the outside of the protection ring, an absorption pipe fixedly inserted to the outside of the dust removal cover, the bottom of the absorption pipe extending into the inside of the collection cover, a gas pump mounted in the inside of the absorption pipe, and the top of the absorption pipe made of a flexible material.

[0011] Preferably, the dust removal assembly further comprises a distance sensor fixedly connected to the inside of the lifting seat and located at the bottom of the lifting ring, and first electric telescopic rods fixedly connected to the front and rear ends of the film pressing seat, and output shafts of the first electric telescopic rods fixed to the lifting seat.

[0012] Preferably, the film pressing device further comprises:

[0013] The pressing assembly is arranged above the lifting seat and comprises a fixed plate arranged above the lifting seat, a second motor fixedly connected to the top of the fixed plate, a sliding pipe slidingly connected to an output shaft of the second motor, a rotating disc fixed to the bottom of the sliding pipe, a first spring fixedly connected between the sliding pipe and the second motor, a second electric telescopic rod fixedly connected to the bottom of the fixed plate, and an extrusion assembly arranged at the bottom of the rotating disc.

[0014] Preferably, the extrusion assembly comprises two inclined grooves respectively opened at the front and rear ends of the bottom of the rotating disc, the two inclined grooves are both arranged obliquely, two inclined rods are slidingly connected to the inside of the two inclined grooves, two sliding frames are fixedly connected to the bottom of the two inclined rods, the two sliding frames are slidable relative to each other, and an extrusion bag is fixed to the inside of the two sliding frames.

[0015] Preferably, the bottom right side of the rotating disc is fixedly connected with a third electric telescopic rod, and the third electric telescopic rod is used for driving the two sliding frames to move.

[0016] Preferably, the right side of the sliding frame at the rear end is slidingly connected with a moving seat, a second spring is fixedly connected between the output shaft of the third electric telescopic rod and the moving seat, a cutting knife is slidingly connected in the moving seat, the top of the cutting knife is fixedly connected with a lifting frame, the output shaft of the third electric telescopic rod is fixedly connected with a pressing rod, the left side of the pressing rod is fixedly connected with a pressing plate, the outer wall of the cutting knife is fixedly connected with a square plate, and the bottom of the square plate is fixedly connected with a U-shaped elastic sheet between the moving seat.

[0017] Preferably, the left side of the pressing plate is obliquely arranged, and the top of the lifting frame is rotatably connected with a rotating shaft for reducing friction.

[0018] A film pressing method for integrated circuit chip manufacturing, comprising the following steps:

[0019] S1, placing, the wafer is placed on the top of the lifting seat;

[0020] S2, film covering, the wafer and the film are adhered by the upward movement of the lifting seat with the wafer.

[0021] Compared with the prior art, the film pressing method has the following advantages:

[0022] 1. When the top of the wafer presses the film for film pressing, the top of the protection ring moves downward to be flush with the top surface of the wafer, so that the film does not cause damage to the edge of the wafer when the film presses the wafer during film covering, thereby improving the quality of the produced chip;

[0023] 2. When the protection ring and the lifting ring move downward relative to the lifting seat, the guide sliding block moves in the upper part of the guide groove, so that the protection ring rotates, and the protection ring with the extended dust cover rotates, thereby realizing that the dust cover rotates to different positions between the film and the wafer, thereby adsorbing dust at each position between the film and the wafer, which can ensure the dust absorption effect, thereby reducing the bubbles at the bonding surface of the film and the wafer, and further improving the film pressing effect;

[0024] 3. When film pressing, the output shaft of the third electric telescopic rod gradually extends, so that the positions of the sliding frame and the pressing capsule gradually move to the left side, and the second motor output shaft rotates, so that different positions above the wafer are pressed, thereby improving the bonding effect between the wafer and the film;

[0025] 4. With the output shaft of the third electric telescopic rod extended, the two sliding frames slide away from each other, increasing the width of the extrusion bag in the front-rear direction, and since the inclined rods slide in the inclined grooves, the extrusion blind area can be reduced when extruding and adhering, thereby improving the adhesion effect between the wafer and the film. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings required to be used in the specific embodiments or the prior art description will be briefly introduced below. Obviously, the drawings in the following description are some embodiments of the present application, and other drawings can also be obtained by those skilled in the art without creative labor.

[0027] Figure 1 is a schematic view of the overall structure of the present application;

[0028] Figure 2 is a schematic view of the half-section structure of the present application;

[0029] Figure 3 is a schematic view of the partial structure of the lifting seat of the present application;

[0030] Figure 4 is a schematic view of the partial half-section structure of the film pressing seat of the present application;

[0031] Figure 5 is a schematic view of the half-section structure of the lifting seat of the present application;

[0032] Figure 6 is an enlarged view of A of the present application; Figure 5

[0033] Figure 7 is a schematic view of the bottom half-section structure of the protective ring of the dust removal cover when hidden in the hidden groove of the present application;

[0034] Figure 8 is a schematic view of the bottom half-section structure of the protective ring of the dust removal cover when hidden in the hidden groove of the present application;

[0035] Figure 9 is a schematic view of the half-section structure of the rotating disc of the present application;

[0036] Figure 10 is a schematic view of the half-section structure of the fixed plate of the present application;

[0037] Figure 11 is an enlarged view of B of the present application; Figure 10

[0038] Figure 12 is a schematic view of the bottom structure of the extrusion bag of the present application;

[0039] ​​Figure 13 Fig. 2 is a schematic view of a cross-sectional structure of a rotating disc according to the present application;

[0040] Figure 14 Fig. 3 is a schematic view of a cross-sectional structure of a sliding frame according to the present application.

[0041] Legend of reference signs:

[0042] 1, film pressing seat; 2, film roll assembly; 3, lifting seat; 4, protection assembly; 41, lifting ring; 42, protection ring; 43, circular groove; 44, piston plate; 45, bent frame; 46, straight plate; 47, corrugated bag; 48, bent pipe; 5, dust removal assembly; 51, hidden groove; 52, dust removal cover; 53, guide sliding block; 54, guide groove; 55, first motor; 56, collection cover; 57, absorption pipe; 58, air pump; 59, distance sensor; 6, pressing assembly; 61, fixed plate; 62, second motor; 63, rotating disc; 64, first spring; 65, second electric telescopic rod; 66, sliding pipe; 7, extrusion assembly; 71, inclined groove; 72, inclined rod; 73, sliding frame; 74, extrusion bag; 75, moving seat; 76, second spring; 77, cutting knife; 78, lifting frame; 79, extrusion rod; 710, extrusion plate; 711, square plate; 712, U-shaped elastic sheet; 713, rotating shaft; 8, first electric telescopic rod; 9, third electric telescopic rod. DETAILED DESCRIPTION

[0043] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work fall within the protection scope of the present application.

[0044] Embodiment one: please refer to Figures 1 to 8 The present application provides a technical solution: an intelligent film pressing device for integrated circuit chip manufacturing, comprising a film pressing seat 1, film roll assemblies 2 are arranged on the top of both sides of the film pressing seat 1, a lifting seat 3 is slidably connected to the middle part of the film pressing seat 1, the film roll assembly 2 comprises a spool holder fixed on the top of both sides of the film pressing seat 1, a film roll shaft for winding and conveying the film is installed in the inside of the spool holder, an electric motor can be installed at the rear end of one of the spool holders for driving one of the film roll shafts to rotate to realize the conveying of the film roll, the film roll assembly 2 further comprises a film limiting holder fixed on the top of the film pressing seat 1, a pressing shaft is rotatably arranged in the inside of the film limiting holder for pressing the film close to the top of the lifting seat 3, a clamping groove is formed in the top of the lifting seat 3 for placing a wafer to be covered with the film, the technology of conveying the film by rotating the film roll shaft is a mature prior art and will not be described in detail.

[0045] The film pressing device further comprises a protection assembly 4 arranged in the middle part of the film pressing base 1, the protection assembly 4 comprises a lifting ring 41 sliding in the inner part of the lifting base 3, the top of the lifting ring 41 is rotationally connected with a protection ring 42, the protection assembly 4 further comprises a circular groove 43 opened in the inner part of the lifting base 3, a piston plate 44 movably arranged in the circular groove 43, a bent frame 45 fixed between the lifting ring 41 and the piston plate 44, the protection assembly 4 further comprises a straight plate 46 fixed on both sides of the lifting base 3, a corrugated bag 47 fixed between the straight plate 46 and the film pressing base 1, a bent pipe 48 inserted and fixed between the top of the corrugated bag 47 and the circular groove 43, and the film pressing base 1 is fixedly connected with the first electric telescopic rod 8 at both ends, and the output shaft of the first electric telescopic rod 8 is fixed with the lifting base 3.

[0046] By adopting the above technical scheme, when the film is pressed, the output shaft of the first electric telescopic rod 8 is slightly retracted, so as to facilitate the placement of the wafer to be pressed in the clamping groove, and then the film is transported by the film roll assembly 2, so that the corresponding film is located above the wafer. In the initial state, the top of the protection ring 42 is higher than the top of the lifting base 3. When the film is pressed, the output shaft of the first electric telescopic rod 8 is extended, so that the lifting base 3 moves upward with the wafer, so that the top of the wafer is attached to the film, and the film coating is realized.

[0047] When the lifting base 3 moves upward with the wafer, the straight plate 46 moves upward, so that the straight plate 46 extrudes the corrugated bag 47, so that the medium in the corrugated bag 47 enters the inner part of the circular groove 43. At this time, under the pressure of the medium in the circular groove 43 above the piston plate 44, the piston plate 44 moves downward. At this time, the piston plate 44 moves downward with the bent frame 45, the lifting ring 41 and the protection ring 42 relative to the lifting base 3. In this way, when the lifting base 3 moves upward with the wafer, the protection ring 42 gradually descends relative to the lifting base 3. When the top of the wafer extrudes the film to press the film, the top of the protection ring 42 moves downward to be flush with the top surface of the wafer. Such design makes the film extruding the wafer when coating the film, so as to prevent the edge of the wafer from being extruded and damaged, thereby facilitating the improvement of the quality of the produced chip.

[0048] The film pressing device further comprises a dust removal assembly 5 arranged in the lifting seat 3, which is used for removing impurities on the wafer and the film to be attached. The dust removal assembly 5 comprises a hidden groove 51 formed in the inner side of the protection ring 42, and a dust removal cover 52 for absorbing impurities is arranged in the hidden groove 51. The dust removal assembly 5 further comprises a guide sliding block 53 fixed on the inner side of the protection ring 42. The dust removal assembly 5 further comprises a guide groove 54 formed in the lifting seat 3 corresponding to the guide sliding block 53. The guide sliding block 53 is movable in the guide groove 54. The dust removal assembly 5 further comprises a first motor 55 fixedly connected to the inner side of the protection ring 42. The output shaft of the first motor 55 is fixed to the dust removal cover 52. The dust removal cover 52 is in the shape of a circular arc, and dust suction holes are formed at the top and bottom ends of the dust removal cover 52. The dust removal assembly 5 further comprises a collection cover 56 clamped to the outer side of the protection ring 42. Ventilation holes are formed in the side surface of the collection cover 56. The clamping technology is a mature prior art. The collection cover 56 can be regularly removed to clean the dust inside the collection cover 56. No further description is given. The outer side of the dust removal cover 52 is fixedly connected to an absorption pipe 57. The bottom of the absorption pipe 57 extends into the inner side of the collection cover 56. A gas pump 58 is installed in the inner side of the absorption pipe 57. The top of the absorption pipe 57 is made of flexible material. The design of the flexible material does not affect the rotation of the dust removal cover 52. The dust removal assembly 5 further comprises a distance sensor 59 fixedly connected to the inner side of the lifting seat 3 at the bottom of the lifting ring 41.

[0049] By adopting the above technical scheme, in the initial state, the dust removal cover 52 rotates outside the hidden groove 51, so that the dust removal cover 52 is located between the film and the wafer. The dust suction holes formed at the top and bottom ends of the dust removal cover 52 can clean the dust and impurities on the surface of the film and wafer to be attached.

[0050] The upper part of the guide groove 54 is in the shape of a spiral, and the lower part of the guide groove 54 is in a vertical state. The distance sensor 59 is used for detecting the height of the bottom of the lifting ring 41. When the lifting seat 3 moves upward, the dust removal cover 52 inside is connected to the collection cover 56 through the absorption pipe 57 under the action of the gas pump 58. The dust suction holes of the dust removal cover 52 inhale air to achieve the adsorption of dust and impurities. The collection cover 56 collects dust. This can reduce the bubbles caused by dust on the surface of the film and wafer to be attached, thereby improving the effect of film pressing.

[0051] When the protection ring 42 moves downward relative to the lifting seat 3 with the lifting ring 41, the guide slider 53 moves inside the upper part of the guide groove 54, so that the protection ring 42 rotates, and the dust cover 52 can rotate with the protection ring 42, so that the dust cover 52 rotates to different positions between the film and the wafer, thereby adsorbing dust at each position between the film and the wafer, which can ensure the dust absorption effect, thereby further reducing the bubbles caused by dust on the bonding surface of the film and the wafer, and improving the film pressing effect.

[0052] It should be noted that the pitch of the spiral position of the guide groove 54 is small, and under the action of the spiral position of the guide groove 54, the rotation angle of the protection ring 42 is greater than 180 degrees. When the bottom of the dust cover 52 is close to the wafer, the distance sensor 59 detects the position of the bottom of the lifting ring 41 and transmits a signal to the external controller, so as to control the output shaft of the first motor 55 to rotate, so that the dust cover 52 can rotate and hide in the hidden groove 51, so that when the top surface of the protection ring 42 is lowered to the top surface of the wafer, the dust cover 52 will not affect the movement of the protection ring 42. When the bottom of the dust cover 52 is close to the wafer, the guide slider 53 enters the vertical part of the lower part of the guide groove 54.

[0053] Embodiment two: The technical scheme of the embodiment is different from that of embodiment one, in which Figures 1 to 5 and Figures 9 to 14 The film pressing device further comprises a pressing assembly 6 arranged above the lifting seat 3, the pressing assembly 6 comprising a fixed plate 61 arranged above the lifting seat 3, the fixed plate 61 being fixed on both sides with the film limiting frame, the top of the fixed plate 61 being fixedly connected with a second motor 62, the output shaft of the second motor 62 being slidingly connected with a sliding pipe 66, the bottom of the sliding pipe 66 being fixed with a rotating disc 63, the first spring 64 being fixedly connected between the sliding pipe 66 and the second motor 62, the bottom of the fixed plate 61 being fixedly connected with a second electric telescopic rod 65, the bottom of the rotating disc 63 being arranged with an extrusion assembly 7, and the bottom of the second electric telescopic rod 65 being rotatably connected with a ball for reducing friction.

[0054] By adopting the above technical scheme, under the elastic force of the first spring 64, the bottom of the extrusion assembly 7 is not in contact with the film in the initial state, and after the film covers the top surface of the wafer, the output shaft of the second electric telescopic rod 65 can be extended, so that the rotating disc 63 moves downward with the extrusion assembly 7 to press the film and the wafer, thereby improving the bonding effect of the film, reducing the bubbles between the film and the wafer caused by the uneven surface of the wafer, and further improving the quality of the film pressing.

[0055] The extrusion assembly 7 comprises two inclined grooves 71 respectively formed at the front and rear ends of the bottom of the rotating disc 63, both of the two inclined grooves 71 are inclinedly arranged, both of the two inclined grooves 71 are slidably connected with an inclined rod 72, the bottom of the inclined rod 72 is fixedly connected with a sliding frame 73, the two sliding frames 73 slide relative to each other, the inside of the two sliding frames 73 is fixedly connected with an extrusion capsule 74, the bottom right side of the rotating disc 63 is fixedly connected with a third electric telescopic rod 9, and the third electric telescopic rod 9 is used to drive the movement of the two sliding frames 73.

[0056] By adopting the above technical scheme, when the film is pressed, the output shaft of the third electric telescopic rod 9 gradually extends, so that the positions of the sliding frame 73 and the extrusion capsule 74 gradually move to the left side, and the output shaft of the second motor 62 rotates, so that the different positions above the wafer can be extruded, thereby facilitating the bonding effect between the wafer and the film.

[0057] It should be noted that the second motor 62 is a stepping motor, and each time the film and the wafer are bonded and extruded, the output shaft of the second motor 62 is rotated by a fixed angle, and then the rotation is temporarily stopped. During this process, the output shaft of the second electric telescopic rod 65 extends, so that the sliding frame 73 with the extrusion capsule 74 bonds and extrudes the wafer and the film. When the output shaft of the second motor 62 rotates one turn, the third electric telescopic rod 9 extends by a distance, and the distance is less than the length of the extrusion capsule 74 in the left-right direction.

[0058] The inside of the extrusion capsule 74 is filled with medium, and the extrusion capsule 74 can reduce the damage to the wafer during extrusion and bonding.

[0059] It should be noted that the output shaft of the third electric telescopic rod 9 extends, so that the extrusion capsule 74 extrudes the film from the inside to the outside, thereby reducing the existence of bubbles between the film and the wafer.

[0060] The front and rear ends of the extrusion capsule 74 are fixed to the inside of the sliding frame 73. When the extrusion capsule 74 extrudes the part of the wafer close to the ring side, the area of the wafer on the outside is larger, so the inclined groove 71 and the inclined rod 72 are designed to be inclined. As the output shaft of the third electric telescopic rod 9 extends, the two sliding frames 73 slide away from each other, increasing the width of the extrusion capsule 74 in the front-rear direction. Since the inclined rod 72 slides in the inclined groove 71, the extrusion blind area can be reduced during extrusion and bonding, thereby improving the bonding effect between the wafer and the film.

[0061] The right side sliding connection of the sliding frame 73 at the rear end is provided with a moving seat 75, the output shaft of the third electric telescopic rod 9 is fixedly connected with the moving seat 75, the inside of the moving seat 75 is slidingly connected with a cutting knife 77, the top of the cutting knife 77 is fixedly connected with a lifting frame 78, the output shaft of the third electric telescopic rod 9 is fixedly connected with a pressing rod 79, the left side of the pressing rod 79 is fixedly connected with a pressing plate 710, the outer wall of the cutting knife 77 is fixedly connected with a square plate 711, the bottom of the square plate 711 is fixedly connected with a U-shaped elastic sheet 712 between the moving seat 75, the left side of the pressing plate 710 is arranged in an inclined manner, the top of the lifting frame 78 is rotatably connected with a rotating shaft 713 for reducing friction, and the output shaft of the third electric telescopic rod 9 slides with the moving seat 75.

[0062] By adopting the technical scheme, in the initial state, the bottom of the cutting knife 77 is located above the bottom of the pressing capsule 74, when the inclined rod 72 slides to the leftmost position of the inclined groove 71 and cannot move any more, the bottom of the cutting knife 77 is just aligned with the edge of the wafer, the output shaft of the third electric telescopic rod 9 continues to extend, the second spring 76 is compressed, the pressing rod 79 moves to the left side with the pressing plate 710, the rotating shaft 713 on the lifting frame 78 is pressed, the lifting frame 78 moves downward with the cutting knife 77, in this process, the U-shaped elastic sheet 712 is compressed, at this time, the bottom of the cutting knife 77 is located below the bottom of the pressing capsule 74, then the output shaft of the second electric telescopic rod 65 extends, the rotating disc 63 rotates with the moving seat 75 and the cutting knife 77 to pierce the film, and the output shaft of the second motor 62 rotates one circle to cut the excess film.

[0063] When the output shaft of the third electric telescopic rod 9 is retracted, the pressing rod 79 moves away from the rotating shaft 713 with the pressing plate 710, under the elastic force of the U-shaped elastic sheet 712, the square plate 711 moves upward with the cutting knife 77, so that the bottom of the cutting knife 77 is located above the bottom of the pressing capsule 74.

[0064] It should be noted that the elastic force of the second spring 76 is greater than the sliding resistance of the inclined rod 72 in the inclined groove 71.

[0065] A film pressing method for integrated circuit chip manufacturing, comprising the following steps:

[0066] S1, placing, when pressing the film, the output shaft of the first electric telescopic rod 8 is slightly retracted, so as to facilitate the placement of the wafer to be pressed in the clamping groove, then the film is transported by the film roll assembly 2, so that the corresponding film is located above the wafer;

[0067] S2, film covering, the output shaft of the first electric telescopic rod 8 is extended, so that the lifting seat 3 moves upward with the wafer, so that the top of the wafer is attached to the film, and the film covering is realized.

[0068] Working principle: when the lifting seat 3 with wafer upward movement, straight plate 46 upward movement, so that the straight plate 46 to the corrugated bag 47 extrusion, so that the corrugated bag 47 inside the medium into the inside of the circular groove 43, at this time the circular groove 43 inside the piston plate 44 above the part of the medium under the action of pressure, the piston plate 44 downward movement, at this time the piston plate 44 with the bending frame 45 and lifting ring 41 and the protection ring 42 relative to the lifting seat 3 downward movement, so as to realize when the lifting seat 3 with wafer upward movement, protection ring 42 will gradually relative to the lifting seat 3 down, when the top of the wafer extrusion film pressure film, the top of the protection ring 42 downward movement to the top surface of the wafer flat, such design, so that in the film when the film to the wafer extrusion, will not cause extrusion damage to the edge of the wafer.

[0069] When the protection ring 42 and lifting ring 41 relative to the lifting seat 3 downward movement, the guide block 53 in the upper part of the guide groove 54 inside the position, so that the protection ring 42 rotation, can make the protection ring 42 with the extension of the dust cover 52 rotation, so as to realize the dust cover 52 rotation to the film and wafer between different positions, so as to absorb the dust between the film and wafer each position, so as to ensure the absorption effect of dust, so as to further reduce the film and wafer with dust and lead to the bubble of the fit, when the bottom of the dust cover 52 close to the wafer, distance sensor 59 detection lifting ring 41 bottom position, the signal to the external controller, so as to control the output shaft of the first motor 55 rotation, so as to make the dust cover 52 rotation hidden into the inside of the hidden groove 51, so that the top surface of the protection ring 42 down to the wafer top surface flat state, the dust cover 52 will not affect the movement of the protection ring 42, when the bottom of the dust cover 52 close to the wafer, guide block 53 into the lower part of the guide groove 54 vertical part.

[0070] When the film and wafer are bonded and extruded each time, the output shaft of the second motor 62 is rotated by a fixed angle, and then the rotation is temporarily stopped. During this process, the output shaft of the second electric telescopic rod 65 is extended, so that the slide frame 73 with the extrusion capsule 74 bonds and extrudes the wafer and the film. When the output shaft of the second motor 62 rotates one round, the third electric telescopic rod 9 is extended by a distance, and the extended distance is less than the length of the extrusion capsule 74 in the left-right direction. The front and rear ends of the extrusion capsule 74 are fixed to the inner side of the slide frame 73. When the extrusion capsule 74 extrudes the part of the wafer close to the ring side, the area on the outer side of the wafer is larger, so the design of the inclined slot 71 and the inclined rod 72 is inclined. As the output shaft of the third electric telescopic rod 9 is extended, the two slide frames 73 slide away from each other, increasing the width of the extrusion capsule 74 in the front-rear direction. Since the inclined rod 72 slides inside the inclined slot 71, the extrusion blind area can be reduced during the extrusion bonding, thereby improving the bonding effect between the wafer and the film. When the inclined rod 72 slides to the leftmost position of the inclined slot 71 and cannot move any further, the bottom of the cutting knife 77 is aligned with the edge of the wafer. Since the output shaft of the third electric telescopic rod 9 continues to extend, the second spring 76 is compressed, the extrusion rod 79 with the extrusion plate 710 moves to the left side to extrude the rotating shaft 713 on the lifting frame 78, so that the lifting frame 78 with the cutting knife 77 moves downward. During this process, the U-shaped spring 712 is compressed. At this time, the bottom of the cutting knife 77 is below the bottom of the extrusion capsule 74. Then, the output shaft of the second electric telescopic rod 65 is extended, the rotating disc 63 with the moving seat 75 and the cutting knife 77 pierces the film, and the output shaft of the second motor 62 is rotated one round to cut the excess film.

[0071] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that: it can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. An intelligent lamination device for integrated circuit chip manufacturing, comprising a lamination seat (1), both sides of the top of the lamination seat (1) are provided with a film roll assembly (2), and a lifting seat (3) is slidably connected to the middle part of the lamination seat (1), characterized in that, The film pressing device further comprises: A protection assembly (4) is arranged at the middle portion of the film pressing base (1), the protection assembly (4) comprises a lifting ring (41) sliding in the lifting seat (3), the top of the lifting ring (41) is rotationally connected with a protection ring (42), the protection assembly (4) further comprises a circular groove (43) opened in the lifting seat (3), a piston plate (44) is movably arranged in the circular groove (43), a bent frame (45) is fixed between the lifting ring (41) and the piston plate (44), the protection assembly (4) further comprises straight plates (46) fixed on both sides of the lifting seat (3), the straight plates (46) are fixed with corrugated bags (47) between the straight plates (46) and the film pressing base (1), and a bent pipe (48) is fixedly inserted between the corrugated bags (47) and the top of the circular groove (43). A dust removal assembly (5) is arranged in the lifting seat (3), the dust removal assembly (5) is used for removing impurities on the wafer and the film to be attached, and the dust removal assembly (5) comprises a hidden groove (51) opened in the inner side of the protection ring (42), and a dust removal cover (52) for absorbing impurities is arranged in the hidden groove (51).

2. The smart lamination device for integrated circuit chip manufacturing according to claim 1, characterized in that: The dust removal assembly (5) further comprises a guide sliding block (53) fixed in the inner side of the protection ring (42), the dust removal assembly (5) further comprises a guide groove (54) opened in the lifting seat (3) corresponding to the guide sliding block (53), the guide sliding block (53) is movably arranged in the guide groove (54), the dust removal assembly (5) further comprises a first motor (55) fixedly connected in the inner side of the protection ring (42), the output shaft of the first motor (55) is fixed with the dust removal cover (52), the dust removal cover (52) is in a circular arc shape, and dust suction holes are opened at the top and bottom of the dust removal cover (52).

3. The smart lamination device for integrated circuit chip manufacturing according to claim 2, characterized in that: The dust removal assembly (5) further comprises a collection cover (56) clamped on the outer side of the protection ring (42), the outer side of the dust removal cover (52) is fixedly inserted with an absorption pipe (57), the bottom of the absorption pipe (57) extends into the inner side of the collection cover (56), the inner side of the absorption pipe (57) is provided with an air pump (58), and the top of the absorption pipe (57) is made of a flexible material.

4. The smart lamination device for integrated circuit chip manufacturing according to claim 3, characterized in that: The dust removal assembly (5) further comprises a distance sensor (59) fixedly connected to the inner side of the lifting seat (3) and located at the bottom of the lifting ring (41), and first electric telescopic rods (8) are fixedly connected to the front and rear ends of the film pressing base (1), and the output shafts of the first electric telescopic rods (8) are fixed with the lifting seat (3).

5. The smart lamination device for integrated circuit chip manufacturing according to claim 1, wherein The film pressing device further comprises: A pressing assembly (6) is arranged above the lifting seat (3), the pressing assembly (6) comprises a fixed plate (61) arranged above the lifting seat (3), the top of the fixed plate (61) is fixedly connected with a second motor (62), the output shaft of the second motor (62) is slidingly connected with a sliding pipe (66), the bottom of the sliding pipe (66) is fixed with a rotating disc (63), the sliding pipe (66) and the second motor (62) are fixedly connected with a first spring (64), the bottom of the fixed plate (61) is fixedly connected with a second electric telescopic rod (65), and the bottom of the rotating disc (63) is arranged with an extrusion assembly (7).

6. The smart lamination device for integrated circuit chip manufacturing according to claim 5, characterized in that: The extrusion assembly (7) comprises two inclined grooves (71) respectively formed at the front and rear ends of the bottom of the rotating disc (63), the two inclined grooves (71) are both arranged in an inclined manner, the inner portions of the two inclined grooves (71) are both slidably connected with inclined rods (72), the bottom portions of the two inclined rods (72) are both fixedly connected with sliding frames (73), the two sliding frames (73) are in sliding connection with each other, and the inner portion of each sliding frame (73) is fixedly connected with an extrusion bag (74).

7. The smart lamination device for integrated circuit chip manufacturing according to claim 6, characterized in that: The bottom right side of the rotating disc (63) is fixedly connected with a third electric telescopic rod (9), and the third electric telescopic rod (9) is used for driving the two sliding frames (73) to move.

8. The smart lamination device for integrated circuit chip manufacturing according to claim 7, characterized in that: The right side of the sliding frame (73) at the rear end is slidably connected with a movement seat (75), a second spring (76) is fixedly connected between the output shaft of the third electric telescopic rod (9) and the movement seat (75), a cutting knife (77) is slidably connected in the inner portion of the movement seat (75), the top of the cutting knife (77) is fixedly connected with a lifting frame (78), the output shaft of the third electric telescopic rod (9) is fixedly connected with an extrusion rod (79), the left side of the extrusion rod (79) is fixedly connected with an extrusion plate (710), the outer wall of the cutting knife (77) is fixedly connected with a square plate (711), and the bottom of the square plate (711) and the movement seat (75) are fixedly connected with a U-shaped elastic sheet (712).

9. The smart lamination device for integrated circuit chip manufacturing according to claim 8, characterized in that: The left side of the extrusion plate (710) is arranged in an inclined manner, and the top of the lifting frame (78) is rotatably connected with a rotating shaft (713) for reducing friction.

10. A method of lamination for integrated circuit chip manufacture, characterised in that: The method is suitable for the intelligent film pressing device for integrated circuit chip manufacturing in any one of claims 1-9, and comprises the following steps: S1, placing, the wafer is placed on the top of the lifting seat (3); S2, film covering, the wafer and the film are adhered by the upward movement of the lifting seat (3) with the wafer.

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